CN114386286B - Main insulation heat conductivity coefficient calculation method and system based on high heat conductivity mica tape manufacturing - Google Patents
Main insulation heat conductivity coefficient calculation method and system based on high heat conductivity mica tape manufacturing Download PDFInfo
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- 239000010445 mica Substances 0.000 title claims abstract description 246
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- 238000005470 impregnation Methods 0.000 claims description 8
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- 229910052582 BN Inorganic materials 0.000 description 1
- 201000004569 Blindness Diseases 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
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- 239000003822 epoxy resin Substances 0.000 description 1
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- 238000004804 winding Methods 0.000 description 1
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Abstract
Description
技术领域technical field
本发明涉及导热绝缘技术领域，尤其涉及一种基于含导热涂层的云母带制作的主绝缘导热系数计算方法及系统。The invention relates to the technical field of heat conduction and insulation, in particular to a method and system for calculating the thermal conductivity of main insulation based on mica tape containing a heat conduction coating.
背景技术Background technique
随着大型发电机电压等级与单机容量的不断提高，发电机的主绝缘体系面临着新的挑战。在主绝缘结构保持不变的前提下，提高容量必然带来更大的温升，从而降低发电机性能，引起绝缘材料老化并导致寿命缩短。为了将铜线的发热更好地传导出去，提高主绝缘的导热性能是必要且有效的措施。With the continuous increase of voltage level and unit capacity of large generators, the main insulation system of generators is facing new challenges. Under the premise that the main insulation structure remains unchanged, increasing the capacity will inevitably bring about a greater temperature rise, thereby reducing the performance of the generator, causing the aging of the insulating material and shortening the life. In order to conduct the heat of the copper wire better, improving the thermal conductivity of the main insulation is a necessary and effective measure.
云母带是制备主绝缘的基础材料，其结构与热导率是影响主绝缘导热性能的关键因素。当前，国外已有系列高导热云母带产品出现，其结构包括云母纸、粘结树脂、玻璃布与导热涂层，其中云母纸与玻璃布通过粘结树脂粘合，导热涂层则涂敷在玻璃布的外侧。然而这些高导热云母带的微观结构与导热性能均存在一定差异，这给主绝缘材料的选型带来了一定的盲目性。由于验证试验周期非常长，包括绝缘结构设计与工艺研究、线棒以及模拟绕组导热性能试验等，需要耗费大量时间、人力和物力。因此有必要在研发的早期阶段，根据高导热云母带产品的成分数据，对云母带及其绕包主绝缘的导热性能进行预测，来初步筛选主绝缘材料。Mica tape is the basic material for preparing the main insulation, and its structure and thermal conductivity are the key factors affecting the thermal conductivity of the main insulation. At present, a series of high thermal conductivity mica tape products have appeared abroad. Its structure includes mica paper, bonding resin, glass cloth and thermal conductive coating. The outside of the glass cloth. However, there are certain differences in the microstructure and thermal conductivity of these high thermal conductivity mica tapes, which brings certain blindness to the selection of the main insulating material. Due to the very long verification test cycle, including insulation structure design and process research, wire rod and simulated winding thermal conductivity tests, etc., it takes a lot of time, manpower and material resources. Therefore, it is necessary to predict the thermal conductivity of mica tape and its wrapped main insulation in the early stage of research and development based on the composition data of high thermal conductivity mica tape products, so as to preliminarily screen the main insulation material.
目前针对这类含导热涂层云母带导热性能的计算研究鲜见报道，采用有限元分析是可用方法之一，但有限元软件操作繁琐，并且难以实现微观尺度上的准确模拟。At present, there are few reports on the calculation and research on the thermal conductivity of mica tape with thermal conductive coating. Finite element analysis is one of the available methods, but the finite element software is cumbersome to operate and it is difficult to achieve accurate simulation on the microscopic scale.
发明内容Contents of the invention
本发明要解决的技术问题在于针对现有技术中的缺陷，提供一种基于含导热涂层的云母带制作的主绝缘的导热系数计算方法。The technical problem to be solved by the present invention is to provide a method for calculating the thermal conductivity of the main insulation based on the mica tape containing the thermal conductive coating for the defects in the prior art.
本发明解决其技术问题所采用的技术方案是：一种基于含导热涂层的云母带制作的主绝缘导热系数计算方法，包括，The technical solution adopted by the present invention to solve the technical problem is: a method for calculating the thermal conductivity of the main insulation based on mica tape containing a thermally conductive coating, comprising:
S1：基于云母带的微观结构，建立云母带的等效热路模型，并根据云母带成分含量计算模型中各组分的体积分数；S1: Based on the microstructure of the mica tape, the equivalent thermal path model of the mica tape is established, and the volume fraction of each component in the model is calculated according to the content of the mica tape;
S2：基于导热填料在导热涂层中的体积分数计算导热涂层导热系数，基于等效热路模型计算云母带导热系数；S2: Calculate the thermal conductivity of the thermally conductive coating based on the volume fraction of the thermally conductive filler in the thermally conductive coating, and calculate the thermal conductivity of the mica tape based on the equivalent thermal path model;
S3：根据云母带导热系数方程，建立反应浸渍后云母带导热系数与浸渍云母纸导热系数关系的等效热路模型，并计算云母纸层中浸渍树脂含量，根据主绝缘浸渍树脂含量与云母带空隙中浸渍树脂含量的差值计算模型中浸渍树脂层的体积分数；S3: According to the thermal conductivity equation of the mica tape, establish the equivalent thermal path model of the relationship between the thermal conductivity of the impregnated mica tape and the impregnated mica paper, and calculate the impregnated resin content in the mica paper layer. According to the main insulation impregnated resin content and the mica tape The volume fraction of the impregnated resin layer in the calculation model for the difference in the impregnated resin content in the void;
S4：根据浸渍后云母纸层的分布模型计算浸渍后云母纸层的导热系数，基于S3中的等效热路模型计算浸渍后云母带的导热系数，近似获得主绝缘的导热系数。S4: Calculate the thermal conductivity of the impregnated mica paper layer according to the distribution model of the impregnated mica paper layer, calculate the thermal conductivity of the impregnated mica tape based on the equivalent thermal path model in S3, and approximate the thermal conductivity of the main insulation.
优选的，如果云母带微观结构中玻璃布空隙中未填充导热树脂，则构建云母带的串联通道导热模型，Preferably, if the thermally conductive resin is not filled in the glass cloth void in the microstructure of the mica tape, then the serial channel thermal conduction model of the mica tape is constructed,
其中，λt为云母带导热系数，λp分别为云母纸层体积分数与导热系数，/>λb分别为粘结树脂层体积分数与导热系数，/>λg分别为玻璃布层体积分数与导热系数，/>λc分别为导热涂层体积分数与导热系数；Among them, λt is the thermal conductivity of mica tape, λ p is the volume fraction and thermal conductivity of the mica paper layer, respectively, /> λ b is the volume fraction and thermal conductivity of the bonding resin layer, respectively, /> λ g is the volume fraction and thermal conductivity of the glass cloth layer, respectively, /> λc is the volume fraction and thermal conductivity of the thermally conductive coating, respectively;
如果导热涂层中的部分导热树脂进入玻璃布层并填满空隙，则将玻璃布层导热通道简化为玻璃纤维和导热树脂的并联通道，构建云母带的串并联通道导热模型，If part of the thermally conductive resin in the thermally conductive coating enters the glass cloth layer and fills up the gaps, the thermally conductive channel of the glass cloth layer is simplified to a parallel channel of glass fiber and thermally conductive resin, and a serial-parallel channel thermal conduction model of the mica tape is constructed.
其中，λgf为玻璃纤维导热系数，n为玻璃布的空隙率。Among them, λgf is the thermal conductivity of the glass fiber, and n is the porosity of the glass cloth.
优选的，所述计算导热涂层导热系数的方法为，Preferably, the method for calculating the thermal conductivity of the thermally conductive coating is,
如果导热涂层为球状导热填料填充复合材料体系，则导热涂层导热系数方程为，If the thermally conductive coating is a composite material system filled with spherical thermally conductive fillers, the thermal conductivity equation of the thermally conductive coating is,
其中，λm为基体树脂导热系数，λf为导热填料导热系数，为导热填料在导热涂层中的体积分数，R为与界面热阻相关的修正系数且有0<R<1；Among them, λm is the thermal conductivity of the matrix resin, λf is the thermal conductivity of the thermally conductive filler, is the volume fraction of thermally conductive filler in the thermally conductive coating, R is the correction coefficient related to the interface thermal resistance and has 0<R<1;
如果导热涂层为片状导热填料填充的复合材料体系，则导热涂层导热系数方程为，If the thermally conductive coating is a composite material system filled with sheet-like thermally conductive fillers, the thermal conductivity equation of the thermally conductive coating is,
其中，γ为片状导热填料的厚径比；将计算得到的导热涂层代入到云母带的导热模型中得到云母带导热系数。Among them, γ is the thickness-to-diameter ratio of the sheet-like thermally conductive filler; the calculated thermally conductive coating is substituted into the thermal conductivity model of the mica tape to obtain the thermal conductivity of the mica tape.
优选的，所述云母纸层中浸渍树脂含量的计算公式为，Preferably, the formula for calculating the impregnated resin content in the mica paper layer is,
其中，云母纸层中浸渍树脂的体积含量，ρp为云母纸的密度，ρmf为云母片的密度。in, The volume content of the impregnated resin in the mica paper layer, ρp is the density of the mica paper, and ρmf is the density of the mica sheet.
优选的，如果云母带微观结构中玻璃布空隙中未填充导热树脂，则将玻璃布层导热通道简化为玻璃纤维和浸渍树脂的并联通道，构建浸渍云母带的串并联导热模型，浸渍云母带的导热系数方程为，Preferably, if the thermal conductive resin is not filled in the glass cloth gap in the microstructure of the mica tape, the glass cloth layer thermal conduction channel is simplified as a parallel channel of glass fiber and impregnated resin, and the series-parallel thermal conduction model of the impregnated mica tape is constructed, and the impregnated mica tape The thermal conductivity equation is,
其中，λit为浸渍云母带导热系数，λip为浸渍云母纸导热系数，λi为浸渍树脂导热系数，为主绝缘浸渍树脂体积分数；Among them, λit is the thermal conductivity of impregnated mica tape, λip is the thermal conductivity of impregnated mica paper, λi is the thermal conductivity of impregnated resin, Volume fraction of impregnated resin for main insulation;
如果云母带微观结构中玻璃布层空隙被导热树脂填满，则构建浸渍云母带的串并联通道导热模型，浸渍云母带的导热系数方程为，If the gaps in the glass cloth layer in the microstructure of the mica tape are filled with thermally conductive resin, then the series-parallel channel heat conduction model of the impregnated mica tape is constructed, and the thermal conductivity equation of the impregnated mica tape is,
所述浸渍云母带的导热系数方程即为主绝缘的绝缘导热系数近似值。The thermal conductivity equation of the impregnated mica tape is the approximate value of the insulation thermal conductivity of the main insulation.
优选的，所述计算浸渍后云母纸层的导热系数的方法为，Preferably, the method for calculating the thermal conductivity of the impregnated mica paper layer is,
将浸渍后的云母纸层简化为云母片随机填充在浸渍树脂基复合材料内，则浸渍云母纸导热系数方程为，The impregnated mica paper layer is simplified as mica flakes randomly filled in the impregnated resin-based composite material, then the thermal conductivity equation of the impregnated mica paper is,
其中，λmf为云母片的导热系数，γ′为云母片的厚径比；将计算得到的浸渍云母纸导热系数方程代入到所述浸渍云母带的导热模型中，计算得到所述浸渍后云母带的导热系数。Wherein, λ mf is the thermal conductivity coefficient of mica sheet, and γ ' is the thickness-to-diameter ratio of mica sheet; Substituting the calculated impregnated mica paper thermal conductivity equation into the thermal conductivity model of the impregnated mica tape, the mica after the impregnation is calculated The thermal conductivity of the belt.
发明还公开了一种基于含导热涂层的云母带制作的主绝缘导热系数计算系统，包括，The invention also discloses a main insulation thermal conductivity calculation system based on the mica tape containing a thermal conductive coating, including:
云母带等效热路模型构建模块，基于云母带的微观结构，建立云母带的等效热路模型，并根据云母带成分含量计算模型中各组分的体积分数；The equivalent thermal path model building block of mica tape, based on the microstructure of mica tape, establishes the equivalent thermal path model of mica tape, and calculates the volume fraction of each component in the model according to the composition content of mica tape;
云母带导热系数计算模块，基于导热填料在导热涂层中的体积分数计算导热涂层导热系数，基于等效热路模型计算云母带导热系数；The thermal conductivity calculation module of the mica tape calculates the thermal conductivity of the thermally conductive coating based on the volume fraction of the thermally conductive filler in the thermally conductive coating, and calculates the thermal conductivity of the mica tape based on the equivalent thermal path model;
浸渍云母带等效热路模型构建模块，根据云母带导热系数方程，建立反应浸渍后云母带导热系数与浸渍云母纸导热系数关系的等效热路模型，并计算云母纸层中浸渍树脂含量，根据主绝缘浸渍树脂含量与云母带空隙中浸渍树脂含量的差值计算模型中浸渍树脂层的体积分数；The equivalent thermal path model building block of impregnated mica tape, according to the thermal conductivity equation of mica tape, establishes the equivalent thermal path model of the relationship between the thermal conductivity of mica tape after impregnation and the thermal conductivity of impregnated mica paper, and calculates the impregnated resin content in the mica paper layer, Calculate the volume fraction of the impregnated resin layer in the model according to the difference between the impregnated resin content of the main insulation and the impregnated resin content in the voids of the mica tape;
浸渍云母带导热系数计算模块，根据浸渍后云母纸层的分布模型计算浸渍后云母纸层的导热系数，基于所述浸渍云母带的等效热路模型计算浸渍后云母带的导热系数，近似获得主绝缘的导热系数。The thermal conductivity calculation module of the impregnated mica tape calculates the thermal conductivity of the impregnated mica paper layer according to the distribution model of the mica paper layer after impregnation, and calculates the thermal conductivity of the impregnated mica tape based on the equivalent thermal path model of the impregnated mica tape, and obtains approximately Thermal conductivity of the main insulation.
本发明的有益效果是：The beneficial effects of the present invention are:
1、高导热云母带绕包主绝缘导热性能验证试验周期很长，利用本发明可节省大量时间、人力和物力；1. The heat conduction performance verification test period of the main insulation wrapped with high thermal conductivity mica tape is very long, and the invention can save a lot of time, manpower and material resources;
2、有限元软件计算云母带及主绝缘导热系数操作繁琐，且难以实现微观尺度上的准确模拟，本发明计算方法考虑了云母带的微观结构，导热涂层中导热填料以及浸渍云母层中云母片的导热系数、形状、尺寸、取向等因素的影响，可对高导热云母带及其绕包主绝缘的导热性能进行预测，且结果与实验相吻合；2. The calculation of the mica tape and the thermal conductivity of the main insulation by finite element software is cumbersome, and it is difficult to achieve accurate simulation on the microscopic scale. The calculation method of the present invention takes into account the microstructure of the mica tape, the heat-conducting filler in the heat-conducting coating, and the mica in the impregnated mica layer Influenced by factors such as thermal conductivity, shape, size, and orientation of the sheet, the thermal conductivity of the high thermal conductivity mica tape and its wrapped main insulation can be predicted, and the results are consistent with the experiments;
3、本发明为高导热云母带的选型以及主绝缘导热性能的预测提供了理论基础，用于大型发电机定子线棒高导热绝缘技术的开发，具有方法科学，实用性强，耗时少，成本低等优点。3. The invention provides a theoretical basis for the type selection of high thermal conductivity mica tape and the prediction of the thermal conductivity of the main insulation. It is used for the development of high thermal conductivity insulation technology for large generator stator bars. It has scientific methods, strong practicability, and less time-consuming , low cost and other advantages.
附图说明Description of drawings
下面将结合附图及实例对本发明作进一步说明。The present invention will be further described below in conjunction with accompanying drawings and examples.
图1是本发明实施例提供的基于含导热涂层的云母带制作的主绝缘导热系数计算方法的示意图；Fig. 1 is the schematic diagram of the method for calculating the thermal conductivity of the main insulation based on the mica tape containing the thermally conductive coating provided by the embodiment of the present invention;
图2为本发明实施例提供的云母带玻璃布层SEM图像；Fig. 2 is the mica tape glass cloth layer SEM image that the embodiment of the present invention provides;
图3为本发明实施例提供的云母带的串并联通道导热模型；Fig. 3 is the series-parallel channel heat conduction model of the mica tape that the embodiment of the present invention provides;
图4为本发明实施例提供的浸渍云母带串并联通道导热模型；Fig. 4 is the heat conduction model of the impregnated mica tape series-parallel channel that the embodiment of the present invention provides;
图5是本发明实施例提供的基于含导热涂层的云母带制作的主绝缘导热系数计算系统的示意图。Fig. 5 is a schematic diagram of a main insulation thermal conductivity calculation system based on a mica tape with a thermal conductive coating provided by an embodiment of the present invention.
具体实施方式Detailed ways
下面结合具体实施例对本发明进行详细说明。以下实施例将有助于本领域的技术人员进一步理解本发明，但不以任何形式限制本发明。应当指出的是，对本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进。这些都属于本发明的保护范围。The present invention will be described in detail below in conjunction with specific embodiments. The following examples will help those skilled in the art to further understand the present invention, but do not limit the present invention in any form. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention. These all belong to the protection scope of the present invention.
本发明的说明书和权利要求书及上述附图中的术语“第一”、“第二”、“第三”、“第四”等(如果存在)是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便这里描述的本发明的实施例，例如能够以除了在这里图示或描述的那些以外的顺序实施。此外，术语“包括”和“具有”以及他们的任何变形，意图在于覆盖不排他的包含，例如，包含了一系列步骤或单元的过程、方法、系统、产品或设备不必限于清楚地列出的那些步骤或单元，而是可包括没有清楚地列出的或对于这些过程、方法、产品或设备固有的其它步骤或单元。The terms "first", "second", "third", "fourth", etc. (if any) in the description and claims of the present invention and the above drawings are used to distinguish similar objects, and not necessarily Used to describe a specific sequence or sequence. It is to be understood that the data so used are interchangeable under appropriate circumstances such that the embodiments of the invention described herein, for example, can be practiced in sequences other than those illustrated or described herein. Furthermore, the terms "comprising" and "having", as well as any variations thereof, are intended to cover a non-exclusive inclusion, for example, a process, method, system, product or device comprising a sequence of steps or elements is not necessarily limited to the expressly listed instead, may include other steps or elements not explicitly listed or inherent to the process, method, product or apparatus.
下面以具体地实施例对本发明的技术方案进行详细说明。下面这几个具体的实施例可以相互结合，对于相同或相似的概念或过程可能在某些实施例不再赘述。The technical solution of the present invention will be described in detail below with specific embodiments. The following specific embodiments may be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments.
如图1所示，本实施例提供了一种基于含导热涂层的云母带制作的主绝缘导热系数计算方法，包括，As shown in Figure 1, this embodiment provides a method for calculating the thermal conductivity of the main insulation based on mica tape containing a thermally conductive coating, including:
S1：基于云母带的微观结构，建立云母带的等效热路模型，并根据云母带成分含量计算模型中各组分的体积分数；S1: Based on the microstructure of the mica tape, the equivalent thermal path model of the mica tape is established, and the volume fraction of each component in the model is calculated according to the content of the mica tape;
S2：基于导热填料在导热涂层中的体积分数计算导热涂层导热系数，基于等效热路模型计算云母带导热系数；S2: Calculate the thermal conductivity of the thermally conductive coating based on the volume fraction of the thermally conductive filler in the thermally conductive coating, and calculate the thermal conductivity of the mica tape based on the equivalent thermal path model;
S3：根据云母带导热系数方程，建立反应浸渍后云母带导热系数与浸渍云母纸导热系数关系的等效热路模型，并计算云母纸层中浸渍树脂含量，根据主绝缘浸渍树脂含量与云母带空隙中浸渍树脂含量的差值计算模型中浸渍树脂层的体积分数；S3: According to the thermal conductivity equation of the mica tape, establish the equivalent thermal path model of the relationship between the thermal conductivity of the impregnated mica tape and the impregnated mica paper, and calculate the impregnated resin content in the mica paper layer. According to the main insulation impregnated resin content and the mica tape The volume fraction of the impregnated resin layer in the calculation model for the difference in the impregnated resin content in the void;
S4：根据浸渍后云母纸层的分布模型计算浸渍后云母纸层的导热系数，基于S3中的等效热路模型计算浸渍后云母带的导热系数，近似获得主绝缘的导热系数。S4: Calculate the thermal conductivity of the impregnated mica paper layer according to the distribution model of the impregnated mica paper layer, calculate the thermal conductivity of the impregnated mica tape based on the equivalent thermal path model in S3, and approximate the thermal conductivity of the main insulation.
本实施例通过云母带的微观结构分析，确定云母带的热路模型，并根据云母带的组分含量快速准确的计算出云母带的导热系数，不需要进行大量的分析实验，节省时间和成本。在云母带导热模型上改进云母纸层和增加浸渍树脂层得到主绝缘的等效导热模型，通过计算浸渍云母带的导热系数来预测主绝缘的导热性能。在计算导热涂层和浸渍云母纸层导热系数时也采用了独到的方法，考虑了导热填料导热系数、形状、尺寸、取向等因素。采用本实施例可对高导热云母带及其绕包主绝缘的导热性能进行可靠预测，大大缩短大型发电机定子线棒高导热绝缘技术的开发周期。In this embodiment, the thermal path model of the mica tape is determined by analyzing the microstructure of the mica tape, and the thermal conductivity of the mica tape is quickly and accurately calculated according to the component content of the mica tape, without the need for a large number of analysis experiments, saving time and cost . The equivalent thermal conductivity model of the main insulation is obtained by improving the mica paper layer and adding the impregnated resin layer on the mica tape thermal conductivity model, and predicting the thermal conductivity of the main insulation by calculating the thermal conductivity of the impregnated mica tape. A unique method is also adopted when calculating the thermal conductivity of the thermally conductive coating and the impregnated mica paper layer, taking into account factors such as the thermal conductivity, shape, size, and orientation of the thermally conductive filler. This embodiment can reliably predict the thermal conductivity of the high thermal conductivity mica tape and its wrapping main insulation, and greatly shorten the development period of the high thermal conductivity insulation technology for the stator bar of a large generator.
具体的，本实施例以氮化硼微粉填充的环氧树脂基符合材料制作的粘结树脂和导热涂层制作的云母带为例进行分析，首先计算云母带的导热系数，方法为，Concretely, the present embodiment takes boron nitride micropowder-filled epoxy resin-based composite materials to make the bonding resin and the mica tape made of thermally conductive coating as an example to analyze, first calculate the thermal conductivity of the mica tape, the method is,
S1：基于云母带的微观结构，建立云母带的等效热路模型，并根据云母带成分含量计算模型中各组分的体积分数；S1: Based on the microstructure of the mica tape, the equivalent thermal path model of the mica tape is established, and the volume fraction of each component in the model is calculated according to the content of the mica tape;
如果云母带微观结构中玻璃布空隙中未填充导热树脂，则构建云母带的串联通道导热模型，导热系数方程为，If the voids of the glass cloth in the microstructure of the mica tape are not filled with thermally conductive resin, then the serial channel heat conduction model of the mica tape is constructed, and the thermal conductivity equation is,
其中，λt为云母带导热系数，λp分别为云母纸层体积分数与导热系数，/>λb分别为粘结树脂层体积分数与导热系数，/>λg分别为玻璃布层体积分数与导热系数，/>λc分别为导热涂层体积分数与导热系数；Among them, λt is the thermal conductivity of mica tape, λ p is the volume fraction and thermal conductivity of the mica paper layer, respectively, /> λ b is the volume fraction and thermal conductivity of the bonding resin layer, respectively, /> λ g is the volume fraction and thermal conductivity of the glass cloth layer, respectively, /> λc is the volume fraction and thermal conductivity of the thermally conductive coating, respectively;
如果导热涂层中的部分导热树脂进入玻璃布层并填满空隙，则将玻璃布层导热通道简化为玻璃纤维和导热树脂的并联通道，构建云母带的串并联通道导热模型，云母带的导热系数方程为，If part of the heat-conducting resin in the heat-conducting coating enters the glass cloth layer and fills the gap, the heat-conducting channel of the glass cloth layer is simplified as a parallel channel of glass fiber and heat-conducting resin, and the heat conduction model of the series-parallel channel of the mica tape is constructed, and the heat conduction of the mica tape The coefficient equation is,
其中，λgf为玻璃纤维导热系数，n为玻璃布的空隙率。Among them, λgf is the thermal conductivity of the glass fiber, and n is the porosity of the glass cloth.
通过SEM分析待测云母带的微观结构，如图2所示，其玻璃布空隙被导热树脂填满，将玻璃布层导热通道简化为玻璃纤维和导热树脂的并联通道，构建的云母带的串并联通道导热模型如图3所示，云母带导热系数方程为，The microstructure of the mica tape to be tested is analyzed by SEM. As shown in Figure 2, the gaps of the glass cloth are filled with thermally conductive resin, and the thermal conduction channel of the glass cloth layer is simplified as a parallel channel of glass fiber and thermally conductive resin. The serial mica tape constructed The heat conduction model of the parallel channel is shown in Fig. 3, and the heat conduction coefficient equation of the mica tape is,
根据云母带成分含量计算得到模型中各组分的体积分数为： 另外已知n＝18.8％，λp＝0.37W/m·K，λgf＝0.99W/m·K，λb＝λc，求解出导热涂层的导热系数λc即可的得到云母带的导热系数。The volume fraction of each component in the model is calculated according to the content of the mica tape as follows: In addition, it is known that n = 18.8%, λ p = 0.37W/m·K, λ gf = 0.99W/m·K, λ b = λ c , and the mica tape can be obtained by solving the thermal conductivity λ c of the thermally conductive coating of thermal conductivity.
S2：基于导热填料在导热涂层中的体积分数计算导热涂层导热系数，基于等效热路模型计算云母带导热系数；S2: Calculate the thermal conductivity of the thermally conductive coating based on the volume fraction of the thermally conductive filler in the thermally conductive coating, and calculate the thermal conductivity of the mica tape based on the equivalent thermal path model;
如果导热涂层为球状导热填料填充复合材料体系，则导热涂层导热系数方程为，If the thermally conductive coating is a composite material system filled with spherical thermally conductive fillers, the thermal conductivity equation of the thermally conductive coating is,
其中，λm为基体树脂导热系数，λf为导热填料导热系数，为导热填料在导热涂层中的体积分数，R为与界面热阻相关的修正系数且有0＜R＜1；Among them, λm is the thermal conductivity of the matrix resin, λf is the thermal conductivity of the thermally conductive filler, is the volume fraction of the thermally conductive filler in the thermally conductive coating, R is the correction coefficient related to the interface thermal resistance and 0<R<1;
如果导热涂层为片状导热填料填充的复合材料体系，则导热涂层导热系数方程为，If the thermally conductive coating is a composite material system filled with sheet-like thermally conductive fillers, the thermal conductivity equation of the thermally conductive coating is,
其中，γ为片状导热填料的厚径比。Wherein, γ is the thickness-to-diameter ratio of the sheet-like thermally conductive filler.
氮化硼为片状材料，因此其导热系数方程为，Boron nitride is a sheet material, so its thermal conductivity equation is,
其中，λm＝0.2W/m·K，λf＝30～300W/m·K，γ＝11.9％，忽略界面热阻的影响取R＝1，则计算得到λc＝2.2～2.5W/m·K，代入云母带导热系数方程，得到λt＝0.585～0.592W/m·K。Among them, λ m =0.2W/m·K, λ f =30～300W/m·K, γ = 11.9%, ignoring the influence of interface thermal resistance and taking R = 1, then calculate λ c = 2.2 ~ 2.5W/m K, and substitute it into the mica tape thermal conductivity equation, get λ t = 0.585 ~ 0.592W/m K .
S3：根据云母带导热系数方程，建立反应浸渍后云母带导热系数与浸渍云母纸导热系数关系的等效热路模型，并计算云母纸层中浸渍树脂含量，根据主绝缘浸渍树脂含量与云母带空隙中浸渍树脂含量的差值计算模型中浸渍树脂层的体积分数；S3: According to the thermal conductivity equation of the mica tape, establish the equivalent thermal path model of the relationship between the thermal conductivity of the impregnated mica tape and the impregnated mica paper, and calculate the impregnated resin content in the mica paper layer. According to the main insulation impregnated resin content and the mica tape The volume fraction of the impregnated resin layer in the calculation model for the difference in the impregnated resin content in the void;
所述云母纸层中浸渍树脂含量的计算公式为，The calculation formula of impregnating resin content in the described mica paper layer is,
其中，云母纸层中浸渍树脂的体积含量，ρp为云母纸的密度，ρmf为云母片的密度；in, The volume content of impregnated resin in the mica paper layer, ρ p is the density of mica paper, ρ mf is the density of mica sheet;
本实施中，ρp＝1.6g/cm3，ρmf＝2.81g/cm3，计算得到 In this implementation, ρ p =1.6g/cm3, ρ mf =2.81g/cm3, calculated
如果云母带微观结构中玻璃布空隙中未填充导热树脂，则将玻璃布层导热通道简化为玻璃纤维和浸渍树脂的并联通道，构建浸渍云母带的串并联导热模型，浸渍云母带的导热系数方程为，If the gaps of the glass cloth in the microstructure of the mica tape are not filled with thermally conductive resin, then the thermal conduction channel of the glass cloth layer is simplified as a parallel channel of glass fiber and impregnated resin, and the series-parallel thermal conduction model of the impregnated mica tape is constructed, and the thermal conductivity equation of the impregnated mica tape for,
其中，λit为浸渍云母带导热系数，λip为浸渍云母纸导热系数，λi为浸渍树脂导热系数，为主绝缘浸渍树脂体积分数；Among them, λit is the thermal conductivity of impregnated mica tape, λip is the thermal conductivity of impregnated mica paper, λi is the thermal conductivity of impregnated resin, Volume fraction of impregnated resin for main insulation;
如果云母带微观结构中玻璃布层空隙被导热树脂填满，则构建浸渍云母带的串并联通道导热模型，浸渍云母带的导热系数方程为，If the gaps in the glass cloth layer in the microstructure of the mica tape are filled with thermally conductive resin, then the series-parallel channel heat conduction model of the impregnated mica tape is constructed, and the thermal conductivity equation of the impregnated mica tape is,
所述浸渍云母带的导热系数方程即为主绝缘的绝缘导热系数近似值。The thermal conductivity equation of the impregnated mica tape is the approximate value of the insulation thermal conductivity of the main insulation.
本实施例中玻璃布空隙被导热树脂填满，构建的浸渍云母带的串并联通道导热模型如图4所示，则浸渍云母带的导热系数方程为，In this embodiment, the gaps of the glass cloth are filled with thermally conductive resin, and the series-parallel channel heat conduction model of the impregnated mica tape is constructed as shown in Figure 4, then the thermal conductivity equation of the impregnated mica tape is,
其中，λi＝0.2W/m·K，根据主绝缘浸渍树脂质量分数计算得到的浸渍树脂体积分数根据上式可知，计算出浸渍云母纸导热系数λip即可求出浸渍云母带的导热系数λit。Where, λ i =0.2W/m·K, the impregnated resin volume fraction calculated according to the mass fraction of the main insulation impregnated resin According to the above formula, the thermal conductivity λ it of the impregnated mica tape can be obtained by calculating the thermal conductivity λ ip of the impregnated mica paper.
S4：根据浸渍后云母纸层的分布模型计算浸渍后云母纸层的导热系数，基于S3中的等效热路模型计算浸渍后云母带的导热系数，近似获得主绝缘的导热系数。S4: Calculate the thermal conductivity of the impregnated mica paper layer according to the distribution model of the impregnated mica paper layer, calculate the thermal conductivity of the impregnated mica tape based on the equivalent thermal path model in S3, and approximate the thermal conductivity of the main insulation.
将浸渍后的云母纸层简化为云母片随机填充在浸渍树脂基复合材料内，则浸渍云母纸导热系数方程为，The impregnated mica paper layer is simplified as mica flakes randomly filled in the impregnated resin-based composite material, then the thermal conductivity equation of the impregnated mica paper is,
其中，λmf为云母片的导热系数，γ′为云母片的厚径比；Among them, λmf is the thermal conductivity of the mica sheet, and γ' is the thickness-to-diameter ratio of the mica sheet;
在本实施例中，λmf＝0.51W/m·K，γ′＝1％～2％，R＝1；计算得到λip＝0.307W/m·K，代入浸渍云母带导热系数方程，得到λit＝0.367～0.369W/m·K，即主绝缘导热系数的近似值。In this example, λ mf =0.51W/m·K, γ′=1%～2%, R=1; the calculated λ ip =0.307W/m·K, which is substituted into the thermal conductivity equation of the impregnated mica tape, is obtained λ it =0.367～0.369W/m·K, which is the approximate value of the thermal conductivity of the main insulation.
通过本实施例的方法计算得到的云母带导热系数为λt＝0.585～0.592W/m·K，主绝缘导热系数为λit＝0.367～0.369W/m·K；通过测试，本实施例使用的云母带的导热系数为λt＝0.57W/m·K，绕包主绝缘的导热系数为λit＝0.364W/m·K，本实施例的预测结果与实际结果相吻合，复合预测要求。The mica tape thermal conductivity calculated by the method of this embodiment is λ t = 0.585 ~ 0.592W/m K, and the main insulation thermal conductivity is λ it = 0.367 ~ 0.369W/m K; through testing, this embodiment uses The thermal conductivity of the mica tape is λ t = 0.57W/m·K, and the thermal conductivity of the wrapped main insulation is λ it = 0.364W/m·K. The predicted results of this embodiment are consistent with the actual results, and the composite predicted requirements .
参考图5，本实施例还提供了一种基于含导热涂层的云母带制作的主绝缘导热系数计算系统，包括，Referring to Fig. 5, the present embodiment also provides a main insulation thermal conductivity calculation system based on mica tape containing a thermally conductive coating, including,
云母带等效热路模型构建模块，基于云母带的微观结构，建立云母带的等效热路模型，并根据云母带成分含量计算模型中各组分的体积分数；The equivalent thermal path model building block of mica tape, based on the microstructure of mica tape, establishes the equivalent thermal path model of mica tape, and calculates the volume fraction of each component in the model according to the composition content of mica tape;
云母带导热系数计算模块，基于导热填料在导热涂层中的体积分数计算导热涂层导热系数，基于等效热路模型计算云母带导热系数；The thermal conductivity calculation module of the mica tape calculates the thermal conductivity of the thermally conductive coating based on the volume fraction of the thermally conductive filler in the thermally conductive coating, and calculates the thermal conductivity of the mica tape based on the equivalent thermal path model;
浸渍云母带等效热路模型构建模块，根据云母带导热系数方程，建立反应浸渍后云母带导热系数与浸渍云母纸导热系数关系的等效热路模型，并计算云母纸层中浸渍树脂含量，根据主绝缘浸渍树脂含量与云母带空隙中浸渍树脂含量的差值计算模型中浸渍树脂层的体积分数；The equivalent thermal path model building block of impregnated mica tape, according to the thermal conductivity equation of mica tape, establishes the equivalent thermal path model of the relationship between the thermal conductivity of mica tape after impregnation and the thermal conductivity of impregnated mica paper, and calculates the impregnated resin content in the mica paper layer, Calculate the volume fraction of the impregnated resin layer in the model according to the difference between the impregnated resin content of the main insulation and the impregnated resin content in the voids of the mica tape;
浸渍云母带导热系数计算模块，根据浸渍后云母纸层的分布模型计算浸渍后云母纸层的导热系数，基于所述浸渍云母带的等效热路模型计算浸渍后云母带的导热系数，近似获得主绝缘的导热系数。The thermal conductivity calculation module of the impregnated mica tape calculates the thermal conductivity of the impregnated mica paper layer according to the distribution model of the mica paper layer after impregnation, and calculates the thermal conductivity of the impregnated mica tape based on the equivalent thermal path model of the impregnated mica tape, and obtains approximately Thermal conductivity of the main insulation.
本领域内的技术人员应明白，本发明的实施例可提供为方法、设备(系统)或计算机程序产品。因此，本发明可采用完全硬件实施例、完全软件实施例、或结合软件和硬件方面的实施例的形式。而且，本发明可采用在一个或多个其中包含有计算机可用程序代码的计算机可用存储介质(包括但不限于磁盘存储器、CD-ROM、光学存储器等)上实施的计算机程序产品的形式。Those skilled in the art should understand that the embodiments of the present invention may be provided as methods, devices (systems) or computer program products. Accordingly, the present invention can take the form of an entirely hardware embodiment, an entirely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, the present invention may take the form of a computer program product embodied on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) having computer-usable program code embodied therein.
本说明书中各个实施例采用递进的方式描述，每个实施例重点说明的都是与其他实施例的不同之处，各个实施例之间相同相似部分互相参见即可。对所公开的实施例的上述说明，使本领域专业技术人员能够实现或使用本发明。对这些实施例的多种修改对本领域的专业技术人员来说将是显而易见的，本文中所定义的一般原理可以在不脱离本发明的精神或范围的情况下，在其它实施例中实现。因此，本发明将不会被限制于本文所示的这些实施例，而是要符合与本文所公开的原理和新颖特点相一致的最宽的范围。Each embodiment in this specification is described in a progressive manner, each embodiment focuses on the difference from other embodiments, and the same and similar parts of each embodiment can be referred to each other. The above description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the present invention will not be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
以上对本发明的具体实施例进行了描述。需要理解的是，本发明并不局限于上述特定实施方式，本领域技术人员可以在权利要求的范围内做出各种变形或修改，这并不影响本发明的实质内容。Specific embodiments of the present invention have been described above. It should be understood that the present invention is not limited to the specific embodiments described above, and those skilled in the art may make various changes or modifications within the scope of the claims, which do not affect the essence of the present invention.
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