CN114386286B - Main insulation heat conductivity coefficient calculation method and system based on high heat conductivity mica tape manufacturing - Google Patents
Main insulation heat conductivity coefficient calculation method and system based on high heat conductivity mica tape manufacturing Download PDFInfo
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- 239000010445 mica Substances 0.000 title claims abstract description 246
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- 239000004744 fabric Substances 0.000 claims description 31
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- 238000010276 construction Methods 0.000 claims description 6
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- 238000005470 impregnation Methods 0.000 claims description 4
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- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
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- 239000012774 insulation material Substances 0.000 description 2
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- 229910052582 BN Inorganic materials 0.000 description 1
- 201000004569 Blindness Diseases 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
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Abstract
The invention relates to a main insulation heat conductivity coefficient calculation method and a system based on mica tape manufacturing containing a heat conducting coating, wherein S1: establishing an equivalent thermal path model of the mica tape based on the microstructure of the mica tape, and calculating the volume fraction of each component in the model; s2: and calculating the heat conductivity coefficient of the heat-conducting coating based on the heat-conducting filler characteristics, and calculating the heat conductivity coefficient of the mica tape by adopting an equivalent thermal path method. S3: establishing an equivalent thermal path model of the impregnated mica tape to obtain a heat conductivity coefficient equation of the impregnated mica tape; s4: and calculating the heat conductivity coefficient of the impregnated mica paper layer, and calculating the heat conductivity coefficient of the impregnated mica tape by adopting an equivalent thermal circuit method to approximately obtain the heat conductivity coefficient of the main insulation. The invention has the advantages that: the thermal path model of the mica tape is determined through microstructure analysis of the mica tape, so that the thermal conductivity of the high-thermal-conductivity mica tape and the wrapping main insulation of the high-thermal-conductivity mica tape can be reliably predicted, and the development period of the high-thermal-conductivity insulation technology of the stator bar of the large-scale generator is greatly shortened.
Description
Technical Field
The invention relates to the technical field of heat conduction and insulation, in particular to a main insulation heat conduction coefficient calculation method and system based on mica tape manufacturing containing a heat conduction coating.
Background
With the continuous increase of the voltage level and the single-machine capacity of large-scale generators, the main insulation system of the generator faces new challenges. On the premise that the main insulation structure is kept unchanged, the capacity is increased to bring about larger temperature rise, so that the performance of the generator is reduced, the insulation material is aged, and the service life is shortened. In order to conduct away the heat generated by the copper wire better, it is a necessary and effective measure to improve the heat conducting properties of the main insulation.
Mica tapes are basic materials for preparing main insulation, and the structure and the heat conductivity of the mica tapes are key factors influencing the heat conducting performance of the main insulation. Currently, a series of mica tape products with high heat conductivity exist abroad, and the mica tape products have the structure comprising mica paper, bonding resin, glass cloth and a heat conducting coating, wherein the mica paper and the glass cloth are bonded through the bonding resin, and the heat conducting coating is coated on the outer side of the glass cloth. However, the microstructure and the heat conduction performance of the high-heat-conduction mica tapes are different to a certain extent, so that certain blindness is brought to the type selection of the main insulating material. Because the verification test period is very long, including insulation structure design and process research, wire rod and simulation winding heat conduction performance test, etc., a great deal of time, manpower and material resources are consumed. Therefore, in the early stage of research and development, it is necessary to predict the heat-conducting property of the mica tape and the wrapping main insulation thereof according to the composition data of the high heat-conducting mica tape product so as to primarily screen the main insulation material.
At present, the calculation research on the heat conduction performance of the mica tape containing the heat conduction coating is reported, and finite element analysis is one of available methods, but finite element software is complex in operation, and accurate simulation on a microscopic scale is difficult to realize.
Disclosure of Invention
The invention aims to solve the technical problem of providing a main insulation heat conductivity coefficient calculation method based on mica tape manufacturing containing a heat conductive coating aiming at the defects in the prior art.
The technical scheme adopted for solving the technical problems is as follows: a method for calculating the heat conductivity coefficient of main insulation based on mica tape containing heat conducting coating comprises,
s1: establishing an equivalent thermal path model of the mica tape based on the microstructure of the mica tape, and calculating the volume fraction of each component in the model according to the component content of the mica tape;
s2: calculating the heat conductivity coefficient of the heat-conducting coating based on the volume fraction of the heat-conducting filler in the heat-conducting coating, and calculating the heat conductivity coefficient of the mica tape based on an equivalent thermal path model;
s3: according to a mica tape heat conduction coefficient equation, an equivalent heat path model of the relation between the heat conduction coefficient of the mica tape after reaction impregnation and the heat conduction coefficient of the impregnated mica paper is established, the content of the impregnated resin in the mica paper layer is calculated, and the volume fraction of the impregnated resin layer in the model is calculated according to the difference value between the content of the main insulating impregnated resin and the content of the impregnated resin in the gaps of the mica tape;
s4: and (3) calculating the heat conductivity coefficient of the impregnated mica paper layer according to the distribution model of the impregnated mica paper layer, and calculating the heat conductivity coefficient of the impregnated mica tape based on the equivalent thermal circuit model in the step S3, so as to approximately obtain the heat conductivity coefficient of the main insulation.
Preferably, if the glass cloth gaps in the microstructure of the mica tape are not filled with the heat conducting resin, constructing a serial channel heat conducting model of the mica tape,
wherein ,λt Is the coefficient of heat conductivity of the mica tape,λ p the volume fraction and the heat conductivity coefficient of the mica paper layer are respectively +.>λ b The volume fraction and the heat conductivity of the bonding resin layer are respectively +.>λ g The volume fraction and the heat conductivity of the glass cloth layer are respectively +.>λ c The volume fraction and the heat conductivity coefficient of the heat conducting coating are respectively;
if part of the heat-conducting resin in the heat-conducting coating enters the glass cloth layer and fills the gaps, simplifying the heat-conducting channel of the glass cloth layer into a parallel channel of glass fiber and heat-conducting resin, constructing a series-parallel channel heat-conducting model of the mica tape,
wherein ,λgf The thermal conductivity of the glass fiber is shown, and n is the void ratio of the glass cloth.
Preferably, the method for calculating the heat conductivity coefficient of the heat conductive coating is that,
if the heat-conducting coating is a spherical heat-conducting filler filled composite material system, the heat-conducting coefficient equation of the heat-conducting coating is that,
wherein ,λm Is the heat conductivity coefficient lambda of matrix resin f Is the heat conductivity coefficient of the heat conductive filler,r is a correction coefficient related to interface thermal resistance and has 0, which is the volume fraction of the heat-conducting filler in the heat-conducting coating<R<1；
If the heat-conducting coating is a composite material system filled with flaky heat-conducting filler, the heat-conducting coefficient equation of the heat-conducting coating is that,
wherein, gamma is the thickness-to-diameter ratio of the flaky heat conducting filler; substituting the calculated heat conduction coating into a heat conduction model of the mica tape to obtain the heat conduction coefficient of the mica tape.
Preferably, the calculation formula of the content of the impregnating resin in the mica paper layer is as follows,
wherein ,the volume content of the impregnating resin in the mica paper layer, ρ p Density, ρ, of mica paper mf Is the density of the mica sheet.
Preferably, if the glass cloth gaps in the microstructure of the mica tape are not filled with heat conducting resin, simplifying the heat conducting channels of the glass cloth layer into parallel channels of glass fibers and impregnating resin, constructing a series-parallel heat conducting model for impregnating the mica tape, wherein the heat conducting coefficient equation of the impregnated mica tape is that,
wherein ,λit To impregnate mica tape with coefficient of thermal conductivity lambda ip To impregnate the coefficient of heat conductivity, lambda of mica paper i In order to impregnate the thermal conductivity of the resin,the volume fraction of the main insulation impregnating resin;
if the gaps of the glass cloth layer in the microstructure of the mica tape are filled with heat conducting resin, a series-parallel channel heat conducting model for impregnating the mica tape is constructed, the heat conducting coefficient equation of the impregnated mica tape is that,
the heat conductivity coefficient equation of the impregnated mica tape is the approximate value of the insulation heat conductivity coefficient of the main insulation.
Preferably, the method for calculating the heat conductivity coefficient of the impregnated mica paper layer is as follows,
simplifying the impregnated mica paper layer into mica sheets to be randomly filled in the impregnated resin matrix composite material, and then the heat conductivity coefficient equation of the impregnated mica paper is as follows,
wherein ,λmf The heat conductivity coefficient of the mica sheet is gamma' and the thickness-diameter ratio of the mica sheet; substituting the calculated heat conductivity coefficient equation of the impregnated mica paper into a heat conductivity model of the impregnated mica tape, and calculating to obtain the heat conductivity coefficient of the impregnated mica tape.
The invention also discloses a main insulation heat conductivity coefficient calculating system based on the mica tape containing the heat conductive coating, which comprises,
the mica tape equivalent thermal path model construction module is used for establishing an equivalent thermal path model of the mica tape based on the microstructure of the mica tape and calculating the volume fraction of each component in the model according to the component content of the mica tape;
the mica tape heat conductivity coefficient calculation module is used for calculating the heat conductivity coefficient of the heat conducting coating based on the volume fraction of the heat conducting filler in the heat conducting coating and calculating the heat conductivity coefficient of the mica tape based on the equivalent thermal path model;
the equivalent thermal circuit model construction module of the impregnated mica tape establishes an equivalent thermal circuit model of the relation between the heat conductivity coefficient of the mica tape after reaction and the heat conductivity coefficient of the impregnated mica paper according to a heat conductivity coefficient equation of the mica tape, calculates the content of the impregnated resin in the mica paper layer, and calculates the volume fraction of the impregnated resin layer in the model according to the difference value between the content of the main insulating impregnated resin and the content of the impregnated resin in the gaps of the mica tape;
and the impregnated mica tape heat conductivity coefficient calculation module calculates the heat conductivity coefficient of the impregnated mica paper layer according to a distribution model of the impregnated mica paper layer, calculates the heat conductivity coefficient of the impregnated mica tape based on an equivalent thermal circuit model of the impregnated mica tape, and approximately obtains the heat conductivity coefficient of the main insulation.
The beneficial effects of the invention are as follows:
1. the test period of the high heat conduction mica tape wrapping main insulation heat conduction performance verification is long, and a large amount of time, manpower and material resources can be saved by using the invention;
2. the finite element software is used for calculating the heat conductivity coefficients of the mica tape and the main insulation, the operation is complicated, and accurate simulation on the microscopic scale is difficult to realize;
3. the invention provides a theoretical basis for the selection of the high heat conduction mica tape and the prediction of the main insulation heat conduction performance, is used for the development of the high heat conduction insulation technology of the stator bar of the large-scale generator, and has the advantages of scientific method, strong practicability, less time consumption, low cost and the like.
Drawings
The invention will be further described with reference to the accompanying drawings and examples.
FIG. 1 is a schematic diagram of a method for calculating a main insulation heat conductivity coefficient based on a mica tape containing a heat conductive coating according to an embodiment of the present invention;
FIG. 2 is an SEM image of a mica tape glass cloth layer provided by an embodiment of the present invention;
FIG. 3 is a series-parallel channel heat conduction model of a mica tape provided by an embodiment of the invention;
fig. 4 is a schematic diagram of a heat conduction model of a series-parallel channel of an impregnated mica tape according to an embodiment of the invention;
fig. 5 is a schematic diagram of a main insulation thermal conductivity calculation system based on a mica tape containing a thermal conductive coating according to an embodiment of the present invention.
Detailed Description
The present invention will be described in detail with reference to specific examples. The following examples will assist those skilled in the art in further understanding the present invention, but are not intended to limit the invention in any way. It should be noted that variations and modifications could be made by those skilled in the art without departing from the inventive concept. These are all within the scope of the present invention.
The terms "first," "second," "third," "fourth" and the like in the description and in the claims and in the above drawings, if any, are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the invention described herein may be implemented, for example, in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The technical scheme of the invention is described in detail below by specific examples. The following embodiments may be combined with each other, and some embodiments may not be repeated for the same or similar concepts or processes.
As shown in fig. 1, the present embodiment provides a method for calculating a main insulation heat conductivity coefficient based on a mica tape containing a heat conductive coating, including,
s1: establishing an equivalent thermal path model of the mica tape based on the microstructure of the mica tape, and calculating the volume fraction of each component in the model according to the component content of the mica tape;
s2: calculating the heat conductivity coefficient of the heat-conducting coating based on the volume fraction of the heat-conducting filler in the heat-conducting coating, and calculating the heat conductivity coefficient of the mica tape based on an equivalent thermal path model;
s3: according to a mica tape heat conduction coefficient equation, an equivalent heat path model of the relation between the heat conduction coefficient of the mica tape after reaction impregnation and the heat conduction coefficient of the impregnated mica paper is established, the content of the impregnated resin in the mica paper layer is calculated, and the volume fraction of the impregnated resin layer in the model is calculated according to the difference value between the content of the main insulating impregnated resin and the content of the impregnated resin in the gaps of the mica tape;
s4: and (3) calculating the heat conductivity coefficient of the impregnated mica paper layer according to the distribution model of the impregnated mica paper layer, and calculating the heat conductivity coefficient of the impregnated mica tape based on the equivalent thermal circuit model in the step S3, so as to approximately obtain the heat conductivity coefficient of the main insulation.
According to the embodiment, the thermal path model of the mica tape is determined through microstructure analysis of the mica tape, the heat conductivity coefficient of the mica tape is calculated rapidly and accurately according to the component content of the mica tape, a large number of analysis experiments are not needed, and time and cost are saved. And improving the mica paper layer and adding the impregnating resin layer on the mica tape heat conduction model to obtain an equivalent heat conduction model of the main insulation, and predicting the heat conduction performance of the main insulation by calculating the heat conduction coefficient of the impregnated mica tape. The unique method is adopted in calculating the heat conductivity coefficient of the heat conducting coating and the impregnated mica paper layer, and the factors such as the heat conductivity coefficient, shape, size, orientation and the like of the heat conducting filler are considered. By adopting the embodiment, the heat conduction performance of the high heat conduction mica tape and the wrapping main insulation can be reliably predicted, and the development period of the high heat conduction insulation technology of the stator bar of the large-scale generator is greatly shortened.
Specifically, in this embodiment, the analysis is performed by taking the bonding resin made of the epoxy resin-based conforming material filled with the boron nitride micro powder and the mica tape made of the heat conductive coating as examples, and the heat conductivity coefficient of the mica tape is calculated first,
s1: establishing an equivalent thermal path model of the mica tape based on the microstructure of the mica tape, and calculating the volume fraction of each component in the model according to the component content of the mica tape;
if the glass cloth gaps in the microstructure of the mica tape are not filled with heat conducting resin, a serial channel heat conducting model of the mica tape is constructed, and a heat conducting coefficient equation is that,
wherein ,λt Is the coefficient of heat conductivity of the mica tape,λ p the volume fraction and the heat conductivity coefficient of the mica paper layer are respectively +.>λ b The volume fraction and the heat conductivity of the bonding resin layer are respectively +.>λ g The volume fraction and the heat conductivity of the glass cloth layer are respectively +.>λ c The volume fraction and the heat conductivity coefficient of the heat conducting coating are respectively;
if part of the heat conducting resin in the heat conducting coating enters the glass cloth layer and fills the gaps, simplifying the heat conducting channel of the glass cloth layer into a parallel channel of glass fiber and heat conducting resin, constructing a serial-parallel channel heat conducting model of the mica tape, wherein the heat conducting coefficient equation of the mica tape is that,
wherein ,λgf The thermal conductivity of the glass fiber is shown, and n is the void ratio of the glass cloth.
The microstructure of the mica tape to be tested is analyzed through SEM, as shown in figure 2, the gap of the glass cloth is filled with heat conducting resin, the heat conducting channel of the glass cloth layer is simplified into a parallel channel of glass fiber and heat conducting resin, the serial-parallel channel heat conducting model of the mica tape is constructed as shown in figure 3, the heat conducting coefficient equation of the mica tape is that,
the volume fractions of the components in the model are calculated according to the content of the mica tape components: n=18.8, λ is also known p ＝0.37W/m·K，λ gf ＝0.99W/m·K，λ b ＝λ c Solving the coefficient of heat conductivity lambda of the heat-conducting coating c And obtaining the heat conductivity coefficient of the mica tape.
S2: calculating the heat conductivity coefficient of the heat-conducting coating based on the volume fraction of the heat-conducting filler in the heat-conducting coating, and calculating the heat conductivity coefficient of the mica tape based on an equivalent thermal path model;
if the heat-conducting coating is a spherical heat-conducting filler filled composite material system, the heat-conducting coefficient equation of the heat-conducting coating is that,
wherein ,λm Is the heat conductivity coefficient lambda of matrix resin f Is the heat conductivity coefficient of the heat conductive filler,the volume fraction of the heat conducting filler in the heat conducting coating is that R is a correction coefficient related to interface thermal resistance and R is more than 0 and less than 1;
if the heat-conducting coating is a composite material system filled with flaky heat-conducting filler, the heat-conducting coefficient equation of the heat-conducting coating is that,
wherein, gamma is the thickness-to-diameter ratio of the flaky heat conducting filler.
Boron nitride is a sheet material, so that the equation of the heat conductivity coefficient is,
wherein ,λm ＝0.2W/m·K，λ f ＝30～300W/m·K，Gamma=11.9%, and ignoring the influence of interface thermal resistance to obtain R=1, and calculating to obtain lambda c =2.2 to 2.5W/m.K, substituting the coefficient of thermal conductivity of the mica tape into the equation to obtain lambda t ＝0.585～0.592W/m·K。
S3: according to a mica tape heat conduction coefficient equation, an equivalent heat path model of the relation between the heat conduction coefficient of the mica tape after reaction impregnation and the heat conduction coefficient of the impregnated mica paper is established, the content of the impregnated resin in the mica paper layer is calculated, and the volume fraction of the impregnated resin layer in the model is calculated according to the difference value between the content of the main insulating impregnated resin and the content of the impregnated resin in the gaps of the mica tape;
the calculation formula of the content of the impregnating resin in the mica paper layer is as follows,
wherein ,the volume content of the impregnating resin in the mica paper layer, ρ p Density, ρ, of mica paper mf Is the density of mica sheets;
in the present embodiment ρ p ＝1.6g/cm3，ρ mf =2.81 g/cm3, calculated
If the glass cloth gaps in the microstructure of the mica tape are not filled with heat conducting resin, simplifying the heat conducting channels of the glass cloth layer into parallel channels of glass fibers and impregnating resin, constructing a series-parallel heat conducting model for impregnating the mica tape, wherein the heat conducting coefficient equation of the impregnated mica tape is as follows,
wherein ,λit To impregnate mica tape with coefficient of thermal conductivity lambda ip To impregnate the coefficient of heat conductivity, lambda of mica paper i In order to impregnate the thermal conductivity of the resin,the volume fraction of the main insulation impregnating resin;
if the gaps of the glass cloth layer in the microstructure of the mica tape are filled with heat conducting resin, a series-parallel channel heat conducting model for impregnating the mica tape is constructed, the heat conducting coefficient equation of the impregnated mica tape is that,
the heat conductivity coefficient equation of the impregnated mica tape is the approximate value of the insulation heat conductivity coefficient of the main insulation.
In this embodiment, the gaps of the glass cloth are filled with heat-conducting resin, and the constructed heat-conducting model of the series-parallel channels of the impregnated mica tape is shown in fig. 4, and the heat conductivity coefficient equation of the impregnated mica tape is that,
wherein ,λi =0.2W/m·k, the volume fraction of impregnating resin calculated from the mass fraction of the main insulating impregnating resinFrom the above, it can be seen that the thermal conductivity coefficient lambda of the impregnated mica paper is calculated ip The heat conductivity coefficient lambda of the impregnated mica tape can be obtained it 。
S4: and (3) calculating the heat conductivity coefficient of the impregnated mica paper layer according to the distribution model of the impregnated mica paper layer, and calculating the heat conductivity coefficient of the impregnated mica tape based on the equivalent thermal circuit model in the step S3, so as to approximately obtain the heat conductivity coefficient of the main insulation.
Simplifying the impregnated mica paper layer into mica sheets to be randomly filled in the impregnated resin matrix composite material, and then the heat conductivity coefficient equation of the impregnated mica paper is as follows,
wherein ,λmf The heat conductivity coefficient of the mica sheet is gamma' and the thickness-diameter ratio of the mica sheet;
in the present embodiment, lambda mf =0.51W/m·k, γ' =1% -2%, r=1; calculating to obtain lambda ip =0.307W/m·k, substituting into the equation of heat conductivity coefficient of the impregnated mica tape to obtain λ it =0.367 to 0.369W/m·k, i.e. an approximation of the main insulation thermal conductivity.
The mica tape calculated by the method of the embodiment has a heat conductivity coefficient lambda t =0.585 to 0.592W/m.k, the main insulation heat conductivity coefficient is lambda it =0.367 to 0.369W/m·k; through testing, the mica tape used in the embodiment has a heat conductivity of lambda t =0.57W/m·k, the thermal conductivity of the wrap-around main insulation is λ it The predicted outcome of this example matches the actual outcome, compounding the predicted requirement, =0.364W/m·k.
Referring to fig. 5, the present embodiment also provides a main insulation thermal conductivity calculation system based on a mica tape comprising a thermally conductive coating, comprising,
the mica tape equivalent thermal path model construction module is used for establishing an equivalent thermal path model of the mica tape based on the microstructure of the mica tape and calculating the volume fraction of each component in the model according to the component content of the mica tape;
the mica tape heat conductivity coefficient calculation module is used for calculating the heat conductivity coefficient of the heat conducting coating based on the volume fraction of the heat conducting filler in the heat conducting coating and calculating the heat conductivity coefficient of the mica tape based on the equivalent thermal path model;
the equivalent thermal circuit model construction module of the impregnated mica tape establishes an equivalent thermal circuit model of the relation between the heat conductivity coefficient of the mica tape after reaction and the heat conductivity coefficient of the impregnated mica paper according to a heat conductivity coefficient equation of the mica tape, calculates the content of the impregnated resin in the mica paper layer, and calculates the volume fraction of the impregnated resin layer in the model according to the difference value between the content of the main insulating impregnated resin and the content of the impregnated resin in the gaps of the mica tape;
and the impregnated mica tape heat conductivity coefficient calculation module calculates the heat conductivity coefficient of the impregnated mica paper layer according to a distribution model of the impregnated mica paper layer, calculates the heat conductivity coefficient of the impregnated mica tape based on an equivalent thermal circuit model of the impregnated mica tape, and approximately obtains the heat conductivity coefficient of the main insulation.
It will be appreciated by those skilled in the art that embodiments of the present invention may be provided as a method, apparatus (system) or computer program product. Accordingly, the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present invention may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.
In the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other. The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
The foregoing describes specific embodiments of the present invention. It is to be understood that the invention is not limited to the particular embodiments described above, and that various changes and modifications may be made by one skilled in the art within the scope of the claims without affecting the spirit of the invention.
Claims (2)
1. A main insulation heat conductivity coefficient calculating method based on mica tape manufacturing containing a heat conducting coating is characterized by comprising the following steps of: comprising the steps of (a) a step of,
s1: establishing an equivalent thermal path model of the mica tape based on the microstructure of the mica tape, and calculating the volume fraction of each component in the model according to the component content of the mica tape;
s2: calculating the heat conductivity coefficient of the heat-conducting coating based on the volume fraction of the heat-conducting filler in the heat-conducting coating, and calculating the heat conductivity coefficient of the mica tape based on an equivalent thermal path model;
s3: according to a mica tape heat conduction coefficient equation, an equivalent heat path model of the relation between the heat conduction coefficient of the mica tape after reaction impregnation and the heat conduction coefficient of the impregnated mica paper is established, the content of the impregnated resin in the mica paper layer is calculated, and the volume fraction of the impregnated resin layer in the model is calculated according to the difference value between the content of the main insulating impregnated resin and the content of the impregnated resin in the gaps of the mica tape;
s4: calculating the heat conductivity coefficient of the impregnated mica paper layer according to the distribution model of the impregnated mica paper layer, and calculating the heat conductivity coefficient of the impregnated mica tape based on the equivalent thermal circuit model in S3 so as to approximately obtain the heat conductivity coefficient of the main insulation;
if the glass cloth gaps in the microstructure of the mica tape are not filled with heat conducting resin, constructing a serial channel heat conducting model of the mica tape,
wherein ,λt Is the coefficient of heat conductivity of the mica tape,λ p the volume fraction and the heat conductivity coefficient of the mica paper layer are respectively +.>λ b The volume fraction and the heat conductivity of the bonding resin layer are respectively +.>λ g The volume fraction and the heat conductivity of the glass cloth layer are respectively +.>λ c The volume fraction and the heat conductivity coefficient of the heat conducting coating are respectively;
if part of the heat-conducting resin in the heat-conducting coating enters the glass cloth layer and fills the gaps, simplifying the heat-conducting channel of the glass cloth layer into a parallel channel of glass fiber and heat-conducting resin, constructing a series-parallel channel heat-conducting model of the mica tape,
wherein ,λgf The thermal conductivity of the glass fiber is shown, and n is the void ratio of the glass cloth;
the method for calculating the heat conductivity coefficient of the heat conductive coating comprises the following steps of,
if the heat-conducting coating is a spherical heat-conducting filler filled composite material system, the heat-conducting coefficient equation of the heat-conducting coating is that,
wherein ,λm Is the heat conductivity coefficient lambda of matrix resin f Is the heat conductivity coefficient of the heat conductive filler,r is a correction coefficient related to interface thermal resistance and has 0, which is the volume fraction of the heat-conducting filler in the heat-conducting coating<R<1；
If the heat-conducting coating is a composite material system filled with flaky heat-conducting filler, the heat-conducting coefficient equation of the heat-conducting coating is that,
wherein, gamma is the thickness-to-diameter ratio of the flaky heat conducting filler; substituting the calculated heat conduction coating into a heat conduction model of the mica tape to obtain the heat conduction coefficient of the mica tape;
the calculation formula of the content of the impregnating resin in the mica paper layer is as follows,
wherein ,the volume content of the impregnating resin in the mica paper layer, ρ p Density, ρ, of mica paper mf Is the density of mica sheets;
if the glass cloth gaps in the microstructure of the mica tape are not filled with heat conducting resin, simplifying the heat conducting channels of the glass cloth layer into parallel channels of glass fibers and impregnating resin, constructing a series-parallel heat conducting model for impregnating the mica tape, wherein the heat conducting coefficient equation of the impregnated mica tape is as follows,
wherein ,λit To impregnate mica tape with coefficient of thermal conductivity lambda ip To impregnate the coefficient of heat conductivity, lambda of mica paper i In order to impregnate the thermal conductivity of the resin,the volume fraction of the main insulation impregnating resin;
if the gaps of the glass cloth layer in the microstructure of the mica tape are filled with heat conducting resin, a series-parallel channel heat conducting model for impregnating the mica tape is constructed, the heat conducting coefficient equation of the impregnated mica tape is that,
the heat conductivity coefficient equation of the impregnated mica tape is the approximate value of the insulation heat conductivity coefficient of the main insulation;
the method for calculating the heat conductivity coefficient of the impregnated mica paper layer comprises the following steps of,
simplifying the impregnated mica paper layer into an impregnated resin matrix composite material with mica sheets randomly distributed in the surface, wherein the heat conductivity coefficient equation of the impregnated mica paper is as follows,
wherein ,λmf The heat conductivity coefficient of the mica sheet is gamma' and the thickness-diameter ratio of the mica sheet; substituting the calculated heat conductivity coefficient equation of the impregnated mica paper into a heat conductivity model of the impregnated mica tape, and calculating to obtain the heat conductivity coefficient of the impregnated mica tape.
2. A main insulation heat conductivity coefficient calculation system based on a mica tape containing a heat conductive coating, characterized in that the main insulation heat conductivity coefficient calculation method based on a mica tape containing a heat conductive coating according to claim 1 is adopted, comprising:
the mica tape equivalent thermal path model construction module is used for establishing an equivalent thermal path model of the mica tape based on the microstructure of the mica tape and calculating the volume fraction of each component in the model according to the component content of the mica tape;
the mica tape heat conductivity coefficient calculation module is used for calculating the heat conductivity coefficient of the heat conducting coating based on the volume fraction of the heat conducting filler in the heat conducting coating and calculating the heat conductivity coefficient of the mica tape based on the equivalent thermal path model;
the equivalent thermal circuit model construction module of the impregnated mica tape establishes an equivalent thermal circuit model of the relation between the heat conductivity coefficient of the mica tape after reaction and the heat conductivity coefficient of the impregnated mica paper according to a heat conductivity coefficient equation of the mica tape, calculates the content of the impregnated resin in the mica paper layer, and calculates the volume fraction of the impregnated resin layer in the model according to the difference value between the content of the main insulating impregnated resin and the content of the impregnated resin in the gaps of the mica tape;
and the impregnated mica tape heat conductivity coefficient calculation module calculates the heat conductivity coefficient of the impregnated mica paper layer according to a distribution model of the impregnated mica paper layer, calculates the heat conductivity coefficient of the impregnated mica tape based on an equivalent thermal circuit model of the impregnated mica tape, and approximately obtains the heat conductivity coefficient of the main insulation.
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