CN114384945A - Processor temperature control method, device, storage medium and electronic equipment - Google Patents
Processor temperature control method, device, storage medium and electronic equipment Download PDFInfo
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- CN114384945A CN114384945A CN202011133047.7A CN202011133047A CN114384945A CN 114384945 A CN114384945 A CN 114384945A CN 202011133047 A CN202011133047 A CN 202011133047A CN 114384945 A CN114384945 A CN 114384945A
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Abstract
The embodiment of the application provides a processor temperature control method, a processor temperature control device, a storage medium and electronic equipment, wherein a processor needing temperature control is marked as a first processor, current operation information of the first processor is obtained when the current temperature of the first processor does not reach a preset temperature, and a subsequent heating rate of the first processor is predicted according to the current operation information to obtain a subsequent heating rate, so that the first processor is subjected to temperature control according to the predicted subsequent heating rate, and the temperature of the first processor is prevented from reaching the preset temperature. Compared with the prior art that the temperature control is carried out after the temperature of the processor reaches higher temperature, the temperature control is carried out in advance when the temperature of the processor does not reach higher temperature, and the effective temperature control of the processor can be realized.
Description
Technical Field
The present disclosure relates to the field of processor technologies, and in particular, to a method and an apparatus for controlling a processor temperature, a storage medium, and an electronic device.
Background
In current processor designs, the temperature rise of the processor is an important factor for determining the success or failure of the processor. If the temperature of the processor is too high during the task execution process, many uncertain stability problems may be caused, such as affecting the normal execution of the task, and even affecting the working life of the processor. Therefore, efficient temperature control of the processor is a problem that needs to be solved.
Disclosure of Invention
The embodiment of the application provides a processor temperature control method and device, a storage medium and electronic equipment, which can effectively control the temperature of a processor.
The application discloses a processor temperature control method, which comprises the following steps:
when the current temperature of a first processor does not reach a preset temperature, acquiring current operation information of the first processor;
predicting the subsequent heating rate of the first processor according to the current operation information to obtain the subsequent heating rate;
and controlling the temperature of the first processor according to the subsequent temperature rise rate.
The application also discloses treater temperature control device includes:
the information acquisition module is used for acquiring the current operation information of the first processor when the current temperature of the first processor does not reach the preset temperature;
the rate prediction module is used for predicting the subsequent heating rate of the first processor according to the current operation information to obtain the subsequent heating rate;
and the temperature control module is used for controlling the temperature of the first processor according to the subsequent heating rate.
The present application also discloses a storage medium having stored thereon a computer program which, when loaded by a central processing unit, performs the processor temperature control method provided herein.
The application also discloses an electronic device, which comprises a central processing unit and a memory, wherein the memory stores a computer program, and the central processing unit executes the processor temperature control method provided by the application by loading the computer program.
In the embodiment of the application, a processor needing temperature control is recorded as a first processor, current operation information of the first processor is obtained when the current temperature of the first processor does not reach a preset temperature, and a subsequent heating rate of the first processor is predicted according to the current operation information to obtain a subsequent heating rate, so that the first processor is subjected to temperature control according to the predicted subsequent heating rate, and the temperature of the first processor is prevented from reaching the preset temperature. Compared with the prior art that the temperature control is carried out after the temperature of the processor reaches higher temperature, the temperature control is carried out in advance when the temperature of the processor does not reach higher temperature, and the effective temperature control of the processor can be realized.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly introduced below.
FIG. 1 is a flow chart of a method for controlling processor temperature according to the present disclosure.
Fig. 2 is a schematic diagram of a plurality of temperature sensors built in a processor according to an embodiment of the present application.
FIG. 3 is a graph showing a comparison of temperature rise curves before and after temperature control in the example of the present application.
FIG. 4 is another flowchart illustrating a method for controlling processor temperature according to the present disclosure.
Fig. 5 is a schematic structural diagram of a processor temperature control apparatus provided in the present application.
Fig. 6 is a schematic structural diagram of an electronic device provided in the present application.
Detailed Description
The technical solution provided by the embodiment of the present application can be applied to various scenarios requiring data communication, and the embodiment of the present application is not limited thereto.
Referring to fig. 1, the present application provides a processor temperature control method, a processor temperature control apparatus, a storage medium, and an electronic device. The execution main body of the processor temperature control method may be the processor temperature control device provided in the embodiment of the present application, or an electronic device integrated with the processor temperature control device, where the processor temperature control device may be implemented in a hardware or software manner. The electronic device may be a device with processing capability configured with a processor, such as a smart phone, a tablet computer, a palm computer, a notebook computer, or a desktop computer.
Referring to fig. 1, fig. 1 is a schematic flow chart of a processor temperature control method according to an embodiment of the present disclosure, and a specific flow of the processor temperature control method according to the embodiment of the present disclosure may be as follows:
at 110, when the current temperature of the first processor does not reach the preset temperature, the current operation information of the first processor is obtained.
It should be noted that an electronic device is typically configured with multiple processors, such as a general purpose central processing unit, a dedicated image signal processor, a pre-image signal processor, or a graphics processor, etc. In this embodiment, a processor that needs to perform temperature control is referred to as a first processor, and the first processor may be any processor configured in an electronic device. For example, when the temperature of the central processing unit of the electronic device needs to be controlled, the central processing unit of the electronic device is configured as the first processor.
It will be appreciated that in order to control the temperature of the first processor, it is a prerequisite that the temperature of the first processor is known. Accordingly, in the embodiment of the present application, the electronic device detects the current temperature of the first processor. It should be noted that, at present, a certain time is not specified, but refers to an execution time when the electronic device executes the temperature detection operation.
In this embodiment, no specific limitation is imposed on how the electronic device detects the current temperature of the first processor, and a person skilled in the art can configure the electronic device according to actual needs.
For example, when a temperature sensor is preset in the first processor, the electronic device may directly read a sensed temperature of the temperature sensor, and use the read sensed temperature as the current temperature of the first processor.
When a plurality of temperature sensors are preset at different positions inside the first processor (as shown in fig. 2, three temperature sensors, namely, temperature sensor 1, temperature sensor 2, and temperature sensor 3, are preset at different positions inside the first processor), the electronic device may read the sensed temperatures of the plurality of temperature sensors, and then fit the plurality of sensed temperatures to the current temperature of the first processor. The embodiment of the present application is not particularly limited to how to fit the multiple sensed temperatures to the current temperature of the first processor, and may be configured by a person having ordinary skill in the art according to actual needs. For example, an average temperature of the plurality of sensed temperatures may be directly obtained, and the average temperature may be used as the current temperature of the first processor; for another example, a corresponding weight may be assigned to each temperature sensor according to a different setting position of each temperature sensor, and then a weighted sum may be performed according to the weight corresponding to each sensed temperature, and the obtained weighted sum may be used as the current temperature of the first processor.
It should be noted that different processors have different capabilities to withstand high temperatures, for example, some processors can still work at 75 degrees celsius, and some processors cannot work at 60 degrees celsius. Therefore, in the embodiment of the application, different processors are pre-configured with corresponding preset temperatures, and for a processor, when the temperature of the processor exceeds the corresponding preset temperature of the processor, the processor cannot normally work with a high probability. Wherein, for a processor, the preset temperature of the processor can be empirically obtained by one of ordinary skill in the art. For example, for a processor, if the processor cannot normally operate at a temperature exceeding 75 ℃, the preset temperature corresponding to the processor may be configured to be 75 ℃; for another example, if the processor cannot normally operate at a temperature exceeding 60 degrees celsius with respect to another processor, the preset temperature corresponding to the processor may be configured to be 60 degrees celsius.
As mentioned above, after detecting the current temperature of the first processor, the electronic device further identifies whether the current temperature reaches the preset temperature corresponding to the first processor. And if so, acquiring the current operation information of the first processor.
Wherein, with the temperature rise association with the first processor as a constraint, the operation information required to be obtained can be configured by a person skilled in the art according to actual needs. For example, the current load value, the operating voltage, the operating frequency, and the like of the first processor may be obtained.
At 120, a subsequent heating rate of the first processor is predicted according to the current operating information to obtain a subsequent heating rate.
As described above, in this embodiment of the application, the obtained current operation information of the first processor has a certain correlation with the temperature rise of the first processor, and therefore, the electronic device may predict the subsequent temperature rise rate of the first processor according to the obtained current operation information of the first processor, and record the predicted temperature rise rate as the subsequent temperature rise rate.
Wherein the subsequent ramp rate may be understood colloquially as the ramp rate of the first processor after the current time.
At 130, the first processor is temperature controlled according to the subsequent ramp rate.
After the subsequent temperature rise rate of the first processor is obtained through prediction, the electronic equipment controls the temperature of the first processor according to the subsequent temperature rise rate obtained through prediction so as to prevent the temperature of the first processor from reaching a preset temperature, and therefore the first processor can be ensured to be in a normal working state all the time. For example, referring to fig. 3, temperature rise curves before and after temperature control of the first processor are shown, where the vertical axis T represents temperature, the horizontal axis T represents time, the temperature rise curve 1 is a temperature rise curve before temperature control of the first processor, and the temperature rise curve 2 is a temperature rise curve after temperature control of the first processor. It can be seen that after the temperature control is performed on the first processor, the temperature rise rate of the first processor is significantly suppressed, and the maximum temperature that can be reached by the first processor is also much lower than the maximum temperature that can be reached before the temperature control is performed.
It should be noted that, as to how to control the temperature of the first processor, the embodiment of the present application is not particularly limited, and may be configured by a person having ordinary skill in the art as needed. For example, the operating frequency of the first processor may be reduced, the operating voltage of the first processor may be reduced, and so on.
Therefore, the processor needing temperature control is recorded as the first processor, the current operation information of the first processor is obtained when the current temperature of the first processor does not reach the preset temperature, the subsequent heating rate of the first processor is predicted according to the current operation information, the subsequent heating rate is obtained, and therefore the temperature of the first processor is controlled according to the predicted subsequent heating rate, and the temperature of the first processor is prevented from reaching the preset temperature. Compared with the prior art that the temperature control is carried out after the temperature of the processor reaches higher temperature, the temperature control is carried out in advance when the temperature of the processor does not reach higher temperature, and the effective temperature control of the processor can be realized.
Optionally, in an embodiment, the temperature controlling the first processor according to the subsequent temperature-increasing rate includes:
(1) acquiring a first remaining time length for the first processor to execute a current task;
(2) predicting a second remaining time for the temperature of the first processor to reach the preset temperature according to the current temperature and the subsequent heating rate;
(3) and when the first remaining time length is longer than the second remaining time length, performing temperature control on the first processor.
For example, when the first processor is a central processing unit of the electronic device, the current task executed by the first processor may be each type of application program run in a foreground of the first processor, and when the first processor is a coprocessor of the central processing unit, the current task executed by the first processor may be any cooperative processing task that the central processing unit allocates to the first processor (for example, the first processor is an image signal processor in the electronic device, and when the central processing unit runs a camera application, the image signal processor performs image processing with the central processing unit, and at this time, the current task executed by the image signal processor is an executed image processing task).
The following description will be given by taking the first processor as a central processing unit.
The electronic equipment firstly obtains the remaining time length of the first processor for executing the current task, and records the remaining time length as a first remaining time length.
For example, if the first processor currently runs the video playing application in the foreground, the video playing application is the current task executed by the first processor, and at this time, the electronic device may further obtain the remaining playing time of the video playing application as the first remaining time for the first processor to execute the current task.
For another example, if the first processor currently runs the camera application in the foreground, the camera application is the current task executed by the first processor, at this time, the electronic device may further predict the running duration of the camera application according to the historical running record of the camera application (for example, taking an average value of the historical running durations), and then subtract the running duration of the camera application from the running duration to obtain the remaining running duration of the camera application at this time, which is used as the first remaining duration for the first processor to execute the current task.
For another example, if the first processor currently runs the game application in the foreground, the game application is the current task executed by the first processor, at this time, the electronic device may further predict the running duration of the game application according to the historical running record of the game application (for example, taking an average value of the historical running durations), and then subtract the running duration of the game application from the running duration to obtain the remaining running duration of the game application at this time, which is used as the first remaining duration for the first processor to execute the current task.
As above, after obtaining the first remaining time length for the first processor to execute the current task, the electronic device further predicts, according to the current temperature and the subsequent temperature-increasing rate, a remaining time length for the temperature of the first processor to reach the preset temperature, which is denoted as a second remaining time length, and may be represented as:
t＝(Tp-Tn)/S；
wherein t represents the second remaining time period, Tp represents the preset temperature, Tn represents the current temperature of the first processor, and S represents the predicted subsequent temperature rise rate.
After the first remaining time length for the first processor to execute the current task is acquired and the second remaining time length for the temperature of the first processor to reach the preset temperature is obtained through prediction, the electronic device further identifies whether the first remaining time length is greater than the second remaining time length. Therefore, in order to ensure the normal execution of the current task, in the embodiment of the present application, the electronic device performs temperature control on the first processor when determining that the first remaining time period is longer than the second remaining time period, so as to suppress the increase in the temperature of the first processor in advance.
Optionally, in an embodiment, the temperature controlling the first processor includes:
(1) determining a target temperature control strategy corresponding to the task type of the current task according to a first preset corresponding relation between the temperature control strategy and the task type;
(2) a target temperature control strategy is executed to temperature control the first processor.
It should be noted that, for different types of tasks, the present application is specifically configured with a temperature control policy adapted to each type of task, so as to form a corresponding relationship between the temperature control policy and the task type, which is denoted as a first preset corresponding relationship. For example, assuming that all tasks of the electronic device are classified into four categories, namely, a-category task, B-category task, C-category task, and D-category task, a corresponding temperature control policy 1 may be assigned to the a-category task, a corresponding temperature control policy 2 may be assigned to the B-category task, a corresponding temperature control policy 3 may be assigned to the C-category task, and a corresponding temperature control policy 4 may be assigned to the D-category task.
Correspondingly, in the embodiment of the application, when the electronic device performs temperature control on the first processor, first, according to a first preset corresponding relationship between the temperature control strategy and the task type, the temperature control strategy corresponding to the task type of the current task executed by the first processor is determined and recorded as the target temperature control strategy.
And then, the electronic equipment executes the determined target temperature control strategy to realize the temperature control of the first processor.
The first processor is taken as a central processing unit for illustration. For camera applications, the configured temperature control strategy includes a number of gears:
gear 1: reducing the screen brightness;
gear 2: clearing other applications whose background is not related to the camera application;
gear 3: reducing the screen display resolution;
gear 4: reducing the frame rate of the image sensor;
gear 5: some unnecessary image optimization algorithms, such as a beauty algorithm, etc., are turned off.
Assuming that the current task executed by the first processor is a camera application, when temperature control is performed for the first time, temperature control is performed according to a gear 1, namely, screen brightness is reduced, and if temperature control is still required after the first time control, temperature control is performed again according to a gear 2, namely, other applications of which the background is irrelevant to the camera application are cleared. And in the same way, gradually increasing the gear of temperature control until the remaining time for the first processor to execute the current task is less than or equal to the remaining time for the temperature of the first processor to reach the preset temperature.
Optionally, in an embodiment, the target temperature control strategy is executed independently of the execution of the current task by the first processor.
It should be noted that, in the embodiment of the present application, the configuration of the temperature control strategy may be performed by a person having ordinary skill in the art according to actual needs, with the constraint that the execution of the temperature control strategy does not affect the execution of the current task by the first processor.
Correspondingly, when the electronic device executes the target temperature control strategy, the execution of the target temperature control strategy does not affect the execution of the current task by the first processor, so that the execution of the current task by the first processor is not affected. For example, if the first processor is a central processing unit, the current task executed by the first processor is a game application, and the electronic device does not cause the operation effect of the game application to be deteriorated, such as stuck, when executing the target temperature control policy.
Optionally, in an embodiment, the current operation information includes a current load value, an operating frequency, and an operating voltage of the first processor, and the executing the target temperature control policy to perform temperature control on the first processor includes:
(1) executing a target temperature control strategy to reduce the load value of the first processor;
(2) and reducing the working frequency and/or the working voltage of the first processor according to the reduced load value.
It should be noted that the load value is from the task scheduling point of view, for example, for the first processor, with a time duration of 1 second, if one hundred percent of the first processor is occupied by tasks (i.e., no idle time) within 1 second, the load value is 100%, if only 0.5 second is occupied by tasks within 1 second, and the other 0.5 second is idle, the load value is 50%.
In the embodiment of the present application, the temperature control strategy is configured to reduce the load value of the first processor, and the configuration of the temperature control strategy may be performed by a person skilled in the art according to actual needs. The execution of the temperature control strategy may or may not affect the execution of the current task.
The first processor is taken as a central processing unit for illustration. For gaming applications, the configured temperature control strategy includes a plurality of gears:
gear 1: reducing the screen brightness;
gear 2: clearing other applications of the background which are not related to the game application;
gear 3: reducing the screen display resolution;
gear 4: reducing some effects of game applications, such as reducing plant effects, reducing water effects, and the like.
Gear 5: some special effects of the gaming application are turned off.
When the current task executed by the first processor is a game application, temperature control is performed according to the gear 1 when temperature control is performed for the first time, namely, screen brightness is reduced, and if temperature control is still required after the first time control, temperature control is performed again according to the gear 2, namely, other applications of the background, which are irrelevant to the game application, are eliminated. And in the same way, gradually increasing the gear of temperature control until the remaining time for the first processor to execute the current task is less than or equal to the remaining time for the temperature of the first processor to reach the preset temperature.
In the embodiment of the application, the load value of the first processor is reduced by executing the target temperature control strategy. When the load value of the first processor is reduced, the temperature rise rate of the first processor is correspondingly reduced.
To further enhance the effect of temperature control, after the load value of the first processor is decreased, the electronic device further decreases the operating frequency and/or the operating voltage of the first processor according to the decreased load value, thereby further decreasing the temperature increase rate of the first processor. The electronic device may reduce the operating frequency of the first processor only, or reduce the operating voltage of the first processor only, or reduce the operating frequency and the operating voltage of the first processor at the same time.
For example, a corresponding relationship between the load value and the operating frequency, or a corresponding relationship between the load value and the operating voltage, or a corresponding relationship between the load value, the operating frequency, and the operating voltage may be established in advance according to experience, so that after the load value of the first processor is reduced, the operating frequency and/or the operating voltage of the first processor may be directly reduced to the operating frequency and/or the operating voltage corresponding to the reduced load value according to the corresponding relationship.
Optionally, in an embodiment, the method for controlling a temperature of a processor provided in the present application further includes:
(1) loading a second preset corresponding relation between the operation information and the heating rate into the memory;
predicting the subsequent heating rate of the first processor according to the current operation information to obtain the subsequent heating rate, wherein the method comprises the following steps:
(2) and setting the heating rate corresponding to the current operation information as a subsequent heating rate according to a second preset corresponding relation in the memory.
It should be noted that, in the embodiment of the present application, historical operation information of the first processor and a temperature increase rate corresponding to the historical operation information are collected in advance, so that a correspondence between the operation information of the first processor and the temperature increase rate is counted and recorded as a second preset correspondence.
In the embodiment of the application, the electronic device loads the second preset corresponding relationship between the running information and the heating rate into the memory in advance, so that when the subsequent heating rate of the first processor is predicted according to the current running information of the first processor, the heating rate of the current running information corresponding to the first processor can be set as the subsequent heating rate of the first processor directly according to the second preset corresponding relationship loaded in the memory.
Optionally, in an embodiment, the second predetermined corresponding relationship is stored in a lookup table.
In this embodiment of the application, the second preset corresponding relationship may be stored in a form of a lookup table, for example, please refer to the following table, taking the operation information including the load value, the working voltage, and the working frequency as an example:
| load value | Operating voltage | Frequency of operation | Rate of temperature rise |
| W1 | V1 | P1 | S1 |
| W2 | V2 | P2 | S2 |
| W3 | V3 | P3 | S3 |
| W4 | V4 | P4 | S4 |
For example, when the current operation information of the first processor is obtained, the load value is W1, the operating voltage is V1, and the operating frequency is P1, the subsequent temperature increase rate of the first processor is S1.
Optionally, in an embodiment, predicting a subsequent temperature-increasing rate of the first processor according to the current operation information to obtain a subsequent temperature-increasing rate includes:
(1) sending the current operation information to a second processor, so that the second processor inputs the current operation information into a pre-trained temperature rise prediction model for prediction to obtain a subsequent temperature rise rate;
(2) a subsequent ramp rate back from the second processor is received.
It should be noted that, in the embodiment of the present application, a machine learning method is adopted in advance to train a temperature rise prediction model, and the trained temperature rise prediction model is deployed in the electronic device. Machine Learning (ML) is a multi-domain cross subject, and relates to multiple subjects such as probability theory, statistics, approximation theory, convex analysis and algorithm complexity theory. The special research on how a computer simulates or realizes the learning behavior of human beings so as to acquire new knowledge or skills and reorganize the existing knowledge structure to continuously improve the performance of the computer. Machine learning is the core of artificial intelligence, is the fundamental approach for computers to have intelligence, and is applied to all fields of artificial intelligence. Machine learning and deep learning generally include techniques such as artificial neural networks, belief networks, reinforcement learning, transfer learning, inductive learning, and the like.
Illustratively, training samples are obtained in advance, and labels corresponding to the training samples. For example, the operation information of the electronic device may be collected, the candidate temperature rise rate of the electronic device under the operation information may be obtained through the relevant temperature measuring device, then the operation information therein is used as a training sample, and the temperature rise rate is used as a label corresponding to the training sample. In this manner, a plurality of training samples and corresponding labels may be obtained.
And carrying out supervised model training by using the obtained training sample and the corresponding label, so as to train and obtain a temperature rise prediction model, wherein the temperature rise prediction model can be used for predicting the candidate temperature rise rate of the electronic equipment according to the operation information of the electronic equipment.
It should be noted that, in the embodiment of the present application, in order not to further increase the operation load of the first processor, other processors having corresponding operation capabilities, except the first processor, in the electronic device are used to operate, and the other processors are referred to as second processors.
Correspondingly, when predicting the subsequent heating rate of the first processor according to the current operation information, the electronic device may send the current operation information to the second processor, obtain the subsequent heating rate of the electronic device by inputting the current operation information into the pre-trained temperature rise prediction model for prediction, and receive the subsequent heating rate returned by the second processor for temperature control of the first processor. For how to control the temperature of the first processor according to the subsequent heating rate, reference may be made to the related description in the above embodiments, and details are not repeated here.
FIG. 4 is another flowchart illustrating a method for controlling processor temperature according to an embodiment of the present disclosure. The following description will be given taking as an example a central processing unit in an electronic device, both of an execution body and a control object of the processor temperature control method. As shown in fig. 4, a process of the processor temperature control method provided in the embodiment of the present application may be as follows:
at 210, the central processing unit loads the second predetermined correspondence between the operating information and the heating rate into the memory.
It should be noted that, in the embodiment of the present application, historical operation information of the central processing unit and a temperature increase rate corresponding to the historical operation information are collected in advance, so as to count a corresponding relationship between the operation information of the central processing unit and the temperature increase rate, and record the corresponding relationship as a second preset corresponding relationship.
In the embodiment of the application, the central processing unit loads the second preset corresponding relationship between the operation information and the heating rate into the memory in advance for subsequent prediction of the heating rate.
In 220, when the current temperature does not reach the preset temperature, the central processing unit obtains the current operation information of the central processing unit.
It should be noted that an electronic device is typically configured with multiple processors, such as a general purpose central processing unit, a dedicated image signal processor, a pre-image signal processor, or a graphics processor, etc. In the embodiment of the present application, a central processing unit is taken as an example for explanation of a temperature control object.
It will be appreciated that in order to control the temperature of the cpu, it is a prerequisite that the temperature of the cpu is known. Accordingly, in the embodiment of the present application, the cpu detects the current temperature of the cpu. It should be noted that, at present, a certain time is not specified, but the execution time when the cpu executes the temperature detection operation may be any time.
In the embodiment of the present application, how to detect the current temperature of the cpu is not specifically limited, and a person skilled in the art can configure the temperature sensor according to actual needs.
For example, when a temperature sensor is preset in the central processing unit, the central processing unit may directly read the sensed temperature of the temperature sensor, and use the read sensed temperature as the current temperature of the central processing unit.
When a plurality of temperature sensors are preset at different positions inside the central processing unit (as shown in fig. 2, three temperature sensors, namely, temperature sensor 1, temperature sensor 2, and temperature sensor 3, are preset at different positions inside the central processing unit), the central processing unit can read the sensing temperatures of the plurality of temperature sensors, and then fit the plurality of sensing temperatures to the current temperature of the central processing unit. In the embodiment of the present application, no specific limitation is imposed on how to fit a plurality of sensed temperatures to the current temperature of the cpu, and a person skilled in the art can configure the temperature sensor according to actual needs. For example, the average temperature of the plurality of sensed temperatures may be directly obtained, and the average temperature may be used as the current temperature of the cpu; for another example, a corresponding weight may be assigned to each temperature sensor according to a different setting position of each temperature sensor, and then a weighted sum may be performed according to the weight corresponding to each sensed temperature, and the obtained weighted sum may be used as the current temperature of the central processing unit.
It should be noted that different processors have different capabilities to withstand high temperatures, for example, some processors can still work at 75 degrees celsius, and some processors cannot work at 60 degrees celsius. Therefore, in the embodiment of the application, different processors are pre-configured with corresponding preset temperatures, and for a processor, when the temperature of the processor exceeds the corresponding preset temperature of the processor, the processor cannot normally work with a high probability. Wherein, for a processor, the preset temperature of the processor can be empirically obtained by one of ordinary skill in the art. For example, for a processor, if the processor cannot normally operate at a temperature exceeding 75 ℃, the preset temperature corresponding to the processor may be configured to be 75 ℃; for another example, if the processor cannot normally operate at a temperature exceeding 60 degrees celsius with respect to another processor, the preset temperature corresponding to the processor may be configured to be 60 degrees celsius.
As above, after detecting the current temperature of the cpu, the cpu further identifies whether the current temperature reaches the preset temperature corresponding to the cpu. And if so, acquiring the current operation information of the mobile terminal.
Wherein, the operation information required to be acquired can be configured by a person skilled in the art according to actual needs by taking the temperature rise association with the central processing unit as a constraint. For example, the current load value, the operating voltage, the operating frequency, and the like of the central processing unit may be obtained.
At 230, the cpu sets the heating rate corresponding to the current running information as its subsequent heating rate according to the second preset corresponding relationship in the memory.
After the central processing unit obtains the current operation of the central processing unit, the temperature rise rate of the current operation information corresponding to the central processing unit can be set as the subsequent temperature rise rate of the central processing unit directly according to the second preset corresponding relation loaded in the memory.
For example, the second predetermined corresponding relationship is stored in a lookup table.
For example, referring to the following table, the operation information includes a load value, a working voltage, and a working frequency as an example:
| load value | Operating voltage | Frequency of operation | Rate of temperature rise |
| W1 | V1 | P1 | S1 |
| W2 | V2 | P2 | S2 |
| W3 | V3 | P3 | S3 |
| W4 | V4 | P4 | S4 |
For example, if the load value is W1, the operating voltage is V1, and the operating frequency is P1 in the current operation information of the cpu, the subsequent temperature increase rate of the cpu is S1.
At 240, the central processor obtains a first remaining duration of foreground application operation.
For example, the central processing unit currently runs the video playing application in the foreground, and the central processing unit may further obtain the remaining playing time of the video playing application as a first remaining time for the central processing unit to run the video playing application (i.e., the previous application).
For another example, the central processing unit may further predict the running duration of the camera application according to the historical running record of the camera application (for example, taking an average value of the historical running durations), and then subtract the running duration of the camera application from the running duration to obtain the remaining running duration of the camera application at this time, which is used as the first remaining duration for the central processing unit to run the camera application (i.e., foreground application).
For another example, the central processing unit may further predict the running duration of the game application according to the historical running record of the game application (for example, taking an average value of the historical running durations), and then subtract the running duration of the game application from the running duration to obtain the remaining running duration of the game application at this time, which is used as the first remaining duration for the central processing unit to run the game application (i.e., the foreground application).
At 250, the CPU predicts a second remaining time period for the temperature to reach the preset temperature based on the current temperature and the subsequent ramp rate.
As above, after obtaining the first remaining duration of the cpu running the foreground application, the cpu further predicts, according to the current temperature and the subsequent temperature increase rate, a remaining duration of the cpu when the temperature reaches the preset temperature, and records the remaining duration as a second remaining duration, which may be represented as:
t＝(Tp-Tn)/S；
wherein t represents the second remaining time period, Tp represents the preset temperature, Tn represents the current temperature of the central processing unit, and S represents the predicted subsequent heating rate.
In 260, the central processing unit determines a target temperature control policy corresponding to the application type of the foreground application according to a first preset corresponding relationship between the temperature control policy and the application type when the first remaining duration is longer than the second remaining duration.
After the first remaining time length of the foreground application running by the central processing unit is obtained and the second remaining time length of the temperature of the central processing unit reaching the preset temperature is obtained through prediction, the central processing unit further identifies whether the first remaining time length is greater than the second remaining time length, and according to the above relevant description, it can be understood that if the first remaining time length is greater than the second remaining time length, it indicates that the foreground application is not completely run, the temperature of the central processing unit reaches the preset temperature, and therefore the running of the foreground application is affected. Therefore, in order to ensure the normal operation of foreground application, in the embodiment of the present application, the central processing unit performs temperature control on itself when determining that the first remaining duration is greater than the second remaining duration, so as to suppress the temperature rise of the central processing unit in advance.
At 270, the central processor implements a target temperature control strategy to temperature control itself.
It should be noted that, for different types of applications, the present application is specifically configured with a temperature control policy adapted to each type of application, so as to form a corresponding relationship between the temperature control policy and the application type, which is denoted as a first preset corresponding relationship. For example, assuming that all applications of the central processing unit are classified into four types, which are a type application, a type B application, a type C application, and a type D application, respectively, a corresponding temperature control policy 1 may be assigned to the type a application, a corresponding temperature control policy 2 may be assigned to the type B application, a corresponding temperature control policy 3 may be assigned to the type C application, and a corresponding temperature control policy 4 may be assigned to the type D application.
Correspondingly, in the embodiment of the present application, when the central processing unit performs temperature control on itself, first, according to a first preset corresponding relationship between the temperature control policy and the application type, a temperature control policy corresponding to the application type of the current application executed by the central processing unit is determined and recorded as a target temperature control policy.
And then, the central processing unit executes the determined target temperature control strategy to realize the temperature control of the central processing unit.
For example, for a camera application, the configured temperature control strategy includes a number of gears:
gear 1: reducing the screen brightness;
gear 2: clearing other applications whose background is not related to the camera application;
gear 3: reducing the screen display resolution;
gear 4: reducing the frame rate of the image sensor;
gear 5: some unnecessary image optimization algorithms, such as a beauty algorithm, etc., are turned off.
Supposing that foreground application operated by the central processing unit is camera application, when temperature control is carried out for the first time, temperature control is carried out according to a gear 1, namely, screen brightness is reduced, and if temperature control is still required after the first time, temperature control is carried out again according to a gear 2, namely, other applications of the background, which are irrelevant to the camera application, are eliminated. And by analogy, gradually increasing the gear of temperature control until the remaining time of the CPU running foreground application is less than or equal to the remaining time of the CPU reaching the preset temperature.
Referring to fig. 5, fig. 5 is a schematic structural diagram of a processor temperature control apparatus according to an embodiment of the present disclosure. The processor temperature control device is applied to the electronic equipment provided by the application. As shown in fig. 5, the processor temperature control apparatus may include:
the information obtaining module 310 is configured to obtain current operation information of the first processor when the current temperature of the first processor does not reach a preset temperature;
the rate prediction module 320 is configured to predict a subsequent temperature rise rate of the first processor according to the current operation information, so as to obtain a subsequent temperature rise rate;
and the temperature control module 330 is configured to perform temperature control on the first processor according to the subsequent heating rate.
Optionally, in an embodiment, when the temperature of the first processor is controlled according to the subsequent warming rate, the temperature control module 330 is configured to:
acquiring a first remaining time length for the first processor to execute a current task;
predicting a second remaining time for the temperature of the first processor to reach the preset temperature according to the current temperature and the subsequent heating rate;
and when the first remaining time length is longer than the second remaining time length, performing temperature control on the first processor.
Optionally, in an embodiment, when performing temperature control on the first processor, the temperature control module 330 is configured to:
determining a target temperature control strategy corresponding to the task type of the current task according to a first preset corresponding relation between the temperature control strategy and the task type;
a target temperature control strategy is executed to temperature control the first processor.
Optionally, in an embodiment, the target temperature control strategy is executed independently of the execution of the current task by the first processor.
Optionally, in an embodiment, the current operation information includes a current load value, an operating frequency, and an operating voltage of the first processor, and when the target temperature control policy is executed to perform temperature control on the first processor, the temperature control module 330 is configured to:
executing a target temperature control strategy to reduce the load value of the first processor;
and reducing the working frequency and/or the working voltage of the first processor according to the reduced load value.
Optionally, in an embodiment, the rate prediction module 320 is further configured to:
loading a second preset corresponding relation between the operation information and the heating rate into the memory;
when the subsequent heating rate of the first processor is predicted according to the current operation information to obtain the subsequent heating rate, the rate prediction module 320 is configured to:
and setting the heating rate corresponding to the current operation information as a subsequent heating rate according to a second preset corresponding relation in the memory.
Optionally, in an embodiment, after predicting the subsequent temperature-increasing rate of the first processor according to the current operation information to obtain a subsequent temperature-increasing rate, the rate predicting module 320 is configured to:
sending the current operation information to a second processor, so that the second processor inputs the current operation information into a pre-trained temperature rise prediction model for prediction to obtain a subsequent temperature rise rate;
a subsequent ramp rate back from the second processor is received.
It should be noted that the processor temperature control device provided in the embodiment of the present application and the processor temperature control method in the foregoing embodiment belong to the same concept, and the processor temperature control device may operate any method provided in the processor temperature control method embodiment, and the specific implementation process thereof is described in the foregoing related embodiments, and is not described herein again.
The embodiment of the present application further provides a storage medium, on which a computer program is stored, and when the stored computer program is loaded by a central processing unit of an electronic device, the steps in the processor temperature control method provided in the embodiment of the present application are executed. The storage medium may be a magnetic disk, an optical disk, a Read Only Memory (ROM), a Random Access Memory (RAM), or the like.
Referring to fig. 6, the electronic device includes a central processing unit 410 and a memory 420.
The central processor 410 in the embodiment of the present application is a general-purpose central processor, such as an ARM architecture processor.
It should be noted that the electronic device may include only the central processing unit 410, or may include other processors besides the central processing unit 410, such as a dedicated image signal processor, a pre-image signal processor, or a graphics processor. In this embodiment, a processor that needs to perform temperature control is referred to as a first processor, and the first processor may be any processor in an electronic device. For example, when the temperature control of the central processor 410 of the electronic device is required, the central processor 410 of the electronic device is configured as the first processor.
The memory 420 stores a computer program, which may be a high speed random access memory, and may also be a non-volatile memory, such as at least one magnetic disk storage device, a flash memory device, or other volatile solid state storage device.
In addition, the memory 420 may further include a memory controller to provide the central processor 410 with access to the memory 420, and the central processor 410 may implement the following functions by loading the computer program in the memory 420:
when the current temperature of the first processor does not reach the preset temperature, acquiring the current operation information of the first processor;
predicting the subsequent heating rate of the first processor according to the current operation information to obtain the subsequent heating rate;
and controlling the temperature of the first processor according to the subsequent temperature rise rate.
Optionally, in an embodiment, when the first processor is temperature-controlled according to the subsequent temperature-rising rate, the central processor 410 is configured to perform:
acquiring a first remaining time length for the first processor to execute a current task;
predicting a second remaining time for the temperature of the first processor to reach the preset temperature according to the current temperature and the subsequent heating rate;
and when the first remaining time length is longer than the second remaining time length, performing temperature control on the first processor.
Optionally, in an embodiment, when performing temperature control on the first processor, the central processing unit 410 is configured to perform:
determining a target temperature control strategy corresponding to the task type of the current task according to a first preset corresponding relation between the temperature control strategy and the task type;
a target temperature control strategy is executed to temperature control the first processor.
Optionally, in an embodiment, the target temperature control strategy is executed independently of the execution of the current task by the first processor.
Optionally, in an embodiment, the current operation information includes a current load value, an operating frequency, and an operating voltage of the first processor, and when the target temperature control strategy is executed to perform temperature control on the first processor, the central processing unit 410 is configured to perform:
executing a target temperature control strategy to reduce the load value of the first processor;
and reducing the working frequency and/or the working voltage of the first processor according to the reduced load value.
Optionally, in an embodiment, the central processor 410 is further configured to perform:
loading a second preset corresponding relation between the operation information and the heating rate into the memory;
when the subsequent temperature increase rate of the first processor is predicted according to the current operation information to obtain the subsequent temperature increase rate, the central processing unit 410 is configured to:
and setting the heating rate corresponding to the current operation information as a subsequent heating rate according to a second preset corresponding relation in the memory.
Optionally, in an embodiment, when the subsequent temperature-increasing rate of the first processor is predicted according to the current operation information to obtain the subsequent temperature-increasing rate, the central processing unit 410 is configured to:
sending the current operation information to a second processor, so that the second processor inputs the current operation information into a pre-trained temperature rise prediction model for prediction to obtain a subsequent temperature rise rate;
a subsequent ramp rate back from the second processor is received.
It should be noted that the electronic device provided in the embodiment of the present application and the processor temperature control method in the foregoing embodiment belong to the same concept, and any method provided in the embodiment of the processor temperature control method may be run on the electronic device, and a specific implementation process thereof is described in the foregoing embodiment, and is not described herein again.
The above detailed description is provided for the processor temperature control method, the storage medium, and the electronic device provided in the embodiments of the present application, and specific examples are applied herein to explain the principles and implementations of the present application, and the descriptions of the above embodiments are only used to help understand the method and the core ideas of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. A method for processor temperature control, the method comprising:
when the current temperature of a first processor does not reach a preset temperature, acquiring current operation information of the first processor;
predicting the subsequent heating rate of the first processor according to the current operation information to obtain the subsequent heating rate;
and controlling the temperature of the first processor according to the subsequent temperature rise rate.
2. The processor temperature control method of claim 1, wherein said temperature controlling said first processor in accordance with said subsequent ramp rate comprises:
acquiring a first remaining time length for the first processor to execute a current task;
predicting a second remaining time for the temperature of the first processor to reach the preset temperature according to the current temperature and the subsequent heating rate;
and when the first remaining time length is longer than the second remaining time length, performing temperature control on the first processor.
3. The processor temperature control method of claim 2, wherein said temperature controlling said first processor comprises:
determining a target temperature control strategy corresponding to the task type of the current task according to a first preset corresponding relation between the temperature control strategy and the task type;
executing the target temperature control strategy to perform temperature control on the first processor.
4. The process control method of claim 3, wherein the target temperature control strategy is executed independently of execution of the current task by the first processor.
5. The processor temperature control method of claim 3, wherein the current operating information includes a current load value, an operating frequency, and an operating voltage of the first processor, and wherein executing the target temperature control strategy to temperature control the first processor comprises:
executing the target temperature control strategy to reduce the load value of the first processor;
and reducing the working frequency and/or the working voltage of the first processor according to the reduced load value.
6. The processor temperature control method according to any one of claims 1 to 5, further comprising:
loading a second preset corresponding relation between the operation information and the heating rate into the memory;
predicting the subsequent heating rate of the first processor according to the current operation information to obtain the subsequent heating rate, wherein the predicting comprises the following steps:
and setting the heating rate corresponding to the current operation information as the subsequent heating rate according to the second preset corresponding relation in the memory.
7. The processor temperature control method according to any one of claims 1 to 5, wherein predicting a subsequent temperature rise rate of the first processor based on the current operating information to obtain a subsequent temperature rise rate comprises:
sending the current operation information to a second processor, so that the second processor inputs the current operation information into a pre-trained temperature rise prediction model for prediction to obtain the subsequent temperature rise rate;
receiving the subsequent ramp rate returned by the second processor.
8. A processor temperature control apparatus, comprising:
the information acquisition module is used for acquiring the current operation information of the first processor when the current temperature of the first processor does not reach the preset temperature;
the rate prediction module is used for predicting the subsequent heating rate of the first processor according to the current operation information to obtain the subsequent heating rate;
and the temperature control module is used for controlling the temperature of the first processor according to the subsequent heating rate.
9. A storage medium having stored thereon a computer program for performing the method of processor temperature control according to any of claims 1-7 when the computer program is loaded by a central processing unit.
10. An electronic device comprising a central processing unit and a memory, the memory storing a computer program, wherein the central processing unit executes the processor temperature control method according to any one of claims 1 to 7 by loading the computer program.
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Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0812621A1 (en) * | 1990-11-29 | 1997-12-17 | The Perkin-Elmer Corporation | Automated performance of the polymerase chain reaction |
| US20060156747A1 (en) * | 2005-01-19 | 2006-07-20 | Nec Corporation | Object temperature adjusting system, control unit for adjusting object temperature, method of adjusting temperature of object, and signal-bearing medium embodying program of controller |
| US20120053734A1 (en) * | 2010-09-01 | 2012-03-01 | Fujitsu Limited | Fan control method and medium storing fan control program |
| CN203424926U (en) * | 2013-08-19 | 2014-02-12 | 王大宇 | Cold water reheating tester |
| CN104777854A (en) * | 2015-04-16 | 2015-07-15 | 福州瑞芯微电子有限公司 | Temperature control method for semiconductor device |
| CN107357385A (en) * | 2017-06-09 | 2017-11-17 | 努比亚技术有限公司 | Method, terminal and computer-readable recording medium based on FREQUENCY CONTROL temperature |
| CN109407801A (en) * | 2018-11-01 | 2019-03-01 | 郑州云海信息技术有限公司 | A kind of data center's temperature control method and system |
| CN109684173A (en) * | 2018-12-25 | 2019-04-26 | 上海创功通讯技术有限公司 | A kind of temperature adjusting method of mobile device, electronic equipment and storage medium |
| CN110727561A (en) * | 2019-10-22 | 2020-01-24 | Oppo广东移动通信有限公司 | Abnormal heat dissipation detection method and device, terminal and storage medium |
| CN110865666A (en) * | 2019-12-09 | 2020-03-06 | Oppo广东移动通信有限公司 | Temperature control method, temperature control device, storage medium and electronic equipment |
| CN111026254A (en) * | 2019-12-09 | 2020-04-17 | Oppo广东移动通信有限公司 | Temperature control method, temperature control device, storage medium and electronic equipment |
| CN111026603A (en) * | 2019-10-25 | 2020-04-17 | 南京大学 | On-chip network temperature prediction method and device, equipment and storage medium |
| CN111782476A (en) * | 2020-06-30 | 2020-10-16 | Oppo广东移动通信有限公司 | Temperature control method, temperature control device, storage medium and electronic equipment |
-
2020
- 2020-10-21 CN CN202011133047.7A patent/CN114384945B/en active Active
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0812621A1 (en) * | 1990-11-29 | 1997-12-17 | The Perkin-Elmer Corporation | Automated performance of the polymerase chain reaction |
| US20060156747A1 (en) * | 2005-01-19 | 2006-07-20 | Nec Corporation | Object temperature adjusting system, control unit for adjusting object temperature, method of adjusting temperature of object, and signal-bearing medium embodying program of controller |
| US20120053734A1 (en) * | 2010-09-01 | 2012-03-01 | Fujitsu Limited | Fan control method and medium storing fan control program |
| CN203424926U (en) * | 2013-08-19 | 2014-02-12 | 王大宇 | Cold water reheating tester |
| CN104777854A (en) * | 2015-04-16 | 2015-07-15 | 福州瑞芯微电子有限公司 | Temperature control method for semiconductor device |
| CN107357385A (en) * | 2017-06-09 | 2017-11-17 | 努比亚技术有限公司 | Method, terminal and computer-readable recording medium based on FREQUENCY CONTROL temperature |
| CN109407801A (en) * | 2018-11-01 | 2019-03-01 | 郑州云海信息技术有限公司 | A kind of data center's temperature control method and system |
| CN109684173A (en) * | 2018-12-25 | 2019-04-26 | 上海创功通讯技术有限公司 | A kind of temperature adjusting method of mobile device, electronic equipment and storage medium |
| CN110727561A (en) * | 2019-10-22 | 2020-01-24 | Oppo广东移动通信有限公司 | Abnormal heat dissipation detection method and device, terminal and storage medium |
| CN111026603A (en) * | 2019-10-25 | 2020-04-17 | 南京大学 | On-chip network temperature prediction method and device, equipment and storage medium |
| CN110865666A (en) * | 2019-12-09 | 2020-03-06 | Oppo广东移动通信有限公司 | Temperature control method, temperature control device, storage medium and electronic equipment |
| CN111026254A (en) * | 2019-12-09 | 2020-04-17 | Oppo广东移动通信有限公司 | Temperature control method, temperature control device, storage medium and electronic equipment |
| CN111782476A (en) * | 2020-06-30 | 2020-10-16 | Oppo广东移动通信有限公司 | Temperature control method, temperature control device, storage medium and electronic equipment |
Non-Patent Citations (2)
| Title |
|---|
| H.S. HIPPERT: "Combining neural networks and ARIMA models for hourly temperature forecast", 《PROCEEDINGS OF THE IEEE-INNS-ENNS INTERNATIONAL JOINT CONFERENCE ON NEURAL NETWORKS. IJCNN 2000. NEURAL COMPUTING: NEW CHALLENGES AND PERSPECTIVES FOR THE NEW MILLENNIUM》 * |
| 任延昭 等: "基于微信平台的温室环境监测与温度预测系统", 《农业机械学报》 * |
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