CN114384862B - Compensation method and system in high-speed movement of semiconductor wire bonding machine - Google Patents

Compensation method and system in high-speed movement of semiconductor wire bonding machine Download PDF

Info

Publication number
CN114384862B
CN114384862B CN202111632898.0A CN202111632898A CN114384862B CN 114384862 B CN114384862 B CN 114384862B CN 202111632898 A CN202111632898 A CN 202111632898A CN 114384862 B CN114384862 B CN 114384862B
Authority
CN
China
Prior art keywords
information
shafts
compensated
movement
data information
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202111632898.0A
Other languages
Chinese (zh)
Other versions
CN114384862A (en
Inventor
林洛
李焕然
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lingbo Weibu Semiconductor Equipment Changshu Co ltd
Original Assignee
Lingbo Weibu Semiconductor Equipment Changshu Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lingbo Weibu Semiconductor Equipment Changshu Co ltd filed Critical Lingbo Weibu Semiconductor Equipment Changshu Co ltd
Priority to CN202111632898.0A priority Critical patent/CN114384862B/en
Publication of CN114384862A publication Critical patent/CN114384862A/en
Application granted granted Critical
Publication of CN114384862B publication Critical patent/CN114384862B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/404—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by control arrangements for compensation, e.g. for backlash, overshoot, tool offset, tool wear, temperature, machine construction errors, load, inertia
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/31—From computer integrated manufacturing till monitoring
    • G05B2219/31258—Compensate control in case of missing message
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/78001—Calibration means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Abstract

The invention provides a compensation method and a system in high-speed movement of a semiconductor wire bonding machine, wherein the method comprises the following steps: variable information during the movement of the first shaft is acquired; determining data information to be compensated of other shafts according to the variable information when the first shaft moves; generating compensated setting information according to the data information to be compensated of the other shafts; and compensating other shafts according to the compensated setting information to obtain result information of the other shafts. According to the invention, the trend is calculated by calculating the corresponding relation between one shaft and other shafts when the shaft moves, and the other shafts are compensated, so that the purpose of reducing influence factors is realized, and the effect of improving the welding efficiency and accuracy is achieved.

Description

Compensation method and system in high-speed movement of semiconductor wire bonding machine
Technical Field
The invention relates to the field of semiconductors, in particular to a compensation method and a compensation system in high-speed movement of a semiconductor wire bonding machine.
Background
In the operation of the present semiconductor wire Bonding machine, the determination of the Bonding position is generally performed by adopting an image recognition method, which requires that the position offset of the image lens and the welding nozzle be acquired and determined in advance, so that the Bonding head is accurately bonded on the correct position. However, the wire Bonding machine is affected by the joint movement of the multiple shafts during the actual movement process, so that the moved position and the actual image identification position have errors, and the position accuracy of final Bonding of the Bonding head is affected.
In the existing design scheme, manufacturers mostly move in advance in the debugging stage, and record corresponding offset in corresponding positions to correct. The method is pre-compensation, once the machine hardware is replaced or damaged, the external environment changes, the offset of each position needs to be recorded again for correction, the operation is troublesome, the welding precision level can only reach +/-2 mu m@3sigama, the deviation is directly compensated before movement, the requirement on the environment is very high, the factors influencing the compensation are complex, and therefore, the compensation operation is complicated, and the welding precision is low and cannot meet the requirement.
Accordingly, the prior art is still in need of improvement and development.
Disclosure of Invention
In view of the above-mentioned shortcomings of the prior art, the present invention aims to provide a compensation method and system for a semiconductor wire bonding machine in high-speed motion, which aims to solve the problems of complicated compensation operation and lower welding precision of the existing wire bonding machine.
The technical scheme of the invention is as follows:
a method of compensating for high speed motion of a semiconductor wire bonding machine, comprising:
variable information during the movement of the first shaft is acquired;
determining data information to be compensated of other shafts according to the variable information when the first shaft moves;
generating compensated setting information according to the data information to be compensated of the other shafts;
and compensating other shafts according to the compensated setting information to obtain result information of the other shafts.
The compensation method in the high-speed motion of the semiconductor wire bonding machine, wherein the step of acquiring the variable information in the first axis motion comprises the following steps:
acquiring setting information of all shafts in static state;
and modifying the setting information in the static state when the first shaft moves to obtain variable information in the first shaft movement.
The compensation method in the high-speed motion of the semiconductor wire bonding machine, wherein the step of determining the data information to be compensated of other axes according to the variable information in the motion of the first axis comprises the following steps:
when the first shaft moves, obtaining data information of other shaft movements according to the variable information of the first shaft movement;
and processing the data information during the movement of the other shafts to obtain the data information to be compensated of the other shafts.
The compensation method in the high-speed motion of the semiconductor wire bonding machine comprises the steps that the setting information in the static state comprises initial data information in the static state of other shafts; the step of generating compensated setting information according to the data information to be compensated of the other axes comprises the following steps:
and generating compensated data information according to the data information to be compensated of other axes and the initial data information when the other axes are static.
The compensation method in the high-speed motion of the semiconductor wire bonding machine comprises the step of optimizing inverse equivalence of variable information in the motion of a first axis to a mathematical model of a controlled object through the structure and parameters of a feedforward controller.
The method for compensating the semiconductor wire bonding machine in high-speed movement, wherein after the step of compensating other axes according to the compensated setting information to obtain result information of the other axes, further comprises the following steps:
and verifying the result information of the other axes to obtain the compensated deviation information.
The compensation method in the high-speed movement of the semiconductor wire bonding machine comprises the steps that variable information during the movement of a first axis comprises acceleration change information and distance change information; the data information to be compensated of the other shafts comprises position change information and current change information;
obtaining data information of other axes in motion according to the acceleration change information and the distance change information;
and processing the data information during the movement of the other shafts to obtain the position change information and the current change information of the other shafts.
A compensation system in high speed motion of a semiconductor wire bonding machine, comprising:
the information acquisition module is used for acquiring variable information during the movement of the first shaft;
the information calculation module is used for determining data information to be compensated of other shafts according to the variable information when the first shaft moves;
the information generation module is used for generating compensated setting information according to the data information to be compensated of the other shafts;
and the information compensation module is used for compensating other axes according to the compensated setting information to obtain result information of the other axes.
An electronic device comprising a memory and a processor, the memory storing a computer program, wherein the processor, when executing the computer program, performs the steps of the compensation method in high speed motion of the semiconductor wire bonding machine.
A computer storage medium having a computer program stored thereon, wherein the computer program when executed by a processor performs the steps of a method of compensating for high speed movement of the semiconductor wire bonding machine
The beneficial effects are that: the invention provides a compensation method and a system in high-speed movement of a semiconductor wire bonding machine, wherein the method comprises the following steps: variable information during the movement of the first shaft is acquired; determining data information to be compensated of other shafts according to the variable information when the first shaft moves; generating compensated setting information according to the data information to be compensated of the other shafts; and compensating other shafts according to the compensated setting information to obtain result information of the other shafts. According to the invention, the trend is calculated by calculating the corresponding relation between one shaft and other shafts when the shaft moves, and the other shafts are compensated, so that the purpose of reducing influence factors is realized, and the effect of improving the welding efficiency and accuracy is achieved.
Drawings
Fig. 1 is a flow chart of a method of compensating for the high speed motion of a semiconductor wire bonding machine in accordance with the present invention.
FIG. 2 is a plan view of a design of a feedforward controller of the present invention.
FIG. 3 is a diagram of the compensation process of the feedforward controller of the present invention.
Fig. 4 is a schematic diagram of Y-axis jitter amplitude during Z-axis motion according to the present invention.
Fig. 5 is a block diagram of a compensation system in high speed motion of a semiconductor wire bonding machine in accordance with the present invention.
Detailed Description
The invention provides a compensation method and a compensation system in high-speed movement of a semiconductor wire bonding machine, which are used for making the purposes, the technical scheme and the effects of the invention clearer and more definite, and are further described in detail below. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It should also be noted that in the drawings of the embodiments of the present invention, the same or similar reference numerals correspond to the same or similar components; in the description of the present invention, it should be understood that, if there is an azimuth or positional relationship indicated by terms such as "upper", "lower", "left", "right", etc., based on the azimuth or positional relationship shown in the drawings, it is only for convenience of describing the present invention and simplifying the description, but it is not indicated or implied that the apparatus or element referred to must have a specific azimuth, be constructed and operated in a specific azimuth, and thus, terms describing the positional relationship in the drawings are merely for exemplary illustration and are not to be construed as limitations of the present patent, and specific meanings of the terms described above may be understood by those skilled in the art according to specific circumstances.
In the existing design scheme, manufacturers mostly move in advance in the debugging stage, and record corresponding offset in corresponding positions to correct. The method is pre-compensation, once the hardware of the machine is replaced or damaged, the external environment changes, the offset of each position needs to be recorded again for correction, the operation is troublesome, the welding precision level can only reach +/-2 mu m@3sigama, the compensation operation is complicated, and the welding precision is lower and cannot meet the requirements.
In order to solve the above problems, the present invention provides a compensation method in high-speed motion of a semiconductor wire bonding machine, in which a trend is calculated by calculating a correspondence between one axis and other axes, and the other axes are compensated, so as to improve compensation efficiency and improve bonding accuracy, as shown in fig. 1, the method includes:
step S100, variable information during the first axis movement is acquired.
The method specifically comprises the following steps:
step S110, acquiring setting information of all shafts in static state;
and step 120, modifying the setting information in the stationary state when the first shaft moves to obtain the variable information in the first shaft movement.
Further, setting information of three axes (namely, an X axis, a Y axis and a Z axis) is collected when the X-axis is stationary, the setting information comprises initial acceleration, distance, position data and current data of the three axes, the acceleration and the distance of the X axis are modified when the X axis moves, so that variable information when the X axis moves is obtained, and the variable information when the X axis moves comprises the acceleration and the distance after the X axis is modified.
And step 200, determining data information to be compensated of other axes according to the variable information when the first axis moves.
The method specifically comprises the following steps:
step S210, obtaining data information of other axes in motion according to variable information of the first axis in motion;
and step 220, processing the data information during the movement of the other shafts to obtain the data information to be compensated of the other shafts.
Further, capturing the change conditions of the position data and the current data of the Y axis and the Z axis when the X axis moves to obtain data information of the Y axis and the Z axis, wherein the data information comprises the position change data and the current change data of the Y axis and the Z axis; and simulating a compensation trend after processing the position change data and the current change data to obtain data information to be compensated in the Y axis and the Z axis.
And step S300, generating compensated setting information according to the data information to be compensated of the other shafts.
Specifically, the setting information at rest includes initial data information at rest of the other shaft.
The method specifically comprises the following steps: and generating compensated data information according to the data information to be compensated of other axes and the initial data information when the other axes are static.
Further, compensated data information is generated according to the data information to be compensated in the Y-axis and the Z-axis, and the initial position data and the current data.
And step 400, compensating other axes according to the compensated setting information to obtain result information of the other axes.
And after the step of compensating other axes according to the compensated setting information to obtain the result information of the other axes, the method further comprises the following steps:
and verifying the result information of the other axes to obtain the compensated deviation information.
In this embodiment, the variable information at the time of the first axis movement includes acceleration change information and distance change information; the data information to be compensated for by the other axes includes position change information and current change information.
Specifically, data information during movement of other axes is obtained according to the acceleration change information and the distance change information; and processing the data information during the movement of the other shafts to obtain the position change information and the current change information of the other shafts.
When a single shaft moves, the change conditions of data such as the position, the current and the like of other shafts are grabbed by modifying the acceleration, the distance and the like, the compensation trend is simulated after the data is processed, and when the shaft moves according to the compensation trend, the position, the current and the like of the other shafts are compensated, so that the position accuracy level of welding reaches +/-1 mu m@3sigama; in the prior art, when a single shaft moves, the data of other shafts have 3-4 mu m of jitter, and the jitter of the other shafts can be reduced to +/-1 mu m after the data information to be compensated is introduced, so that the ball welded by the wire bonding machine can be accurately welded at a position to be welded; 3sigama represents that the accuracy rate can reach 99.73 percent.
Feedforward compensation decoupling design
Feedforward decoupling link: n (N)
According to the principle of invariance:
U1(s)G21(s)+U1(s)N21(s)G22(s)＝0
U2(s)G12(s)+U2(s)N12(s)G11(s)＝0
pushing out: n21(s) =g21 (s)/G22(s)
N12(s)＝-G12(s)/G11(s)
Note that N represents a sign of feedforward decoupling.
In the preferred embodiment of the invention, the above technical scheme is adopted, so that the trend is calculated by calculating the corresponding relation between one shaft and other shafts when the shaft moves, and the other shafts are compensated, thereby realizing the purpose of reducing influencing factors and further achieving the effect of improving the welding efficiency and accuracy.
And the feedforward compensation decoupling design calculates the trend of the motion of one axis and the corresponding relation between other axes by calculating the corresponding relation between the motion of the axis and the other axes, compensates the other axes and ensures the welding position accuracy level of +/-1 mu m@3sigama.
In this embodiment, the inverse equivalent of the mathematical model of the controlled object is optimized by the structure and parameters of the feedforward controller.
It should be noted that, as shown in fig. 2, the design of the feedforward controller mainly includes structural design and parameter optimization of the feedforward controller, and the core is to implement inverse equivalence of the mathematical model of the controlled object by using the structural and parameter optimization of the feedforward controller. By employing a feedforward controller F based on a continuous instruction track,
F(s)＝[1s s 2 ...s n ] T
wherein: f(s) is a feedforward controller structure; s is the differentiation of the command trajectory; n is the order of the commanded trajectory derivative. The feedforward controller output ufo is
u fo ＝F(a)F(s)＝[a 0 a 1 a 2 …a n ][1s s 2 …s n ] T
Wherein: elements a0, a1, a2, …, an in F (a) are corresponding parameter configurations of the feedforward controller.
It should be noted that, the feedforward controller structure refers to that after the control instruction performs the track motion, the structure outputs a feedforward value; the parameter optimization refers to optimizing on the original control coefficient, and slight differences exist among different machines; inverse equivalent, e.g. when the mathematical model being controlled deviates by 2um in motion, an equivalent amount of inverse 2um is output by the feedforward controller and parameter optimization, thereby ensuring the accuracy of the mathematical model motion
The compensation quantity of the feedforward controller can be determined according to the parameters and the instruction track of the feedforward controller, and the compensation quantity and the output of the system controller are used for determining the control rate output together, so that the XYZ control and regulation effect is realized. The feedforward decoupling link is organically combined with the whole control system, and the effect of decoupling can be intuitively seen through equivalent change.
And collecting Z-axis change distance and acceleration, simulating a formula of Y-axis required compensation trend corresponding to the change data of Y-axis distance, wherein the compensation value Sy= aSz + bAz, a and b are coefficients in the formula, and the formula is calculated according to the calculated trend.
Figure BDA0003440738920000081
Figure BDA0003440738920000091
The motor may act after feedback of speed, position, current, etc., as shown in fig. 3.
As shown in FIG. 4, during the Z-axis motion, the Y-axis is not originally in a straight line, but the force caused by the Z-axis motion influences the Y-axis to have a jitter amplitude of 3.8um, and the jitter amplitude can improve the precision from original + -1 μm to + -3 μm and + -4 μm.
The trend of compensation when each axis moves is calculated, so that the compensation is in software, and the influence of the environment change is avoided, the influence of the compensation is reduced, and the welding precision is improved.
The present invention is further illustrated by the following examples:
k100, starting a wire bonding machine;
k200, testing the position and current change caused by the motion of each shaft;
k210, collecting acceleration, distance, position and current when the triaxial is static;
k220, modifying the acceleration and the distance of the Z-axis motion only, and grabbing the position and current change data of the X-axis and the Y-axis to obtain the position and current change caused by the Z-axis motion;
k230, similarly, obtaining the position and current change caused by X-axis or Y-axis movement when only X-axis or Y-axis movement is performed;
k300, calculating compensation trends of positions, currents and the like;
k400, software input position, current, etc.;
and K500, verifying the position deviation after compensation.
In other embodiments, the weld requirements are met by grouping control, i.e., using a first set of parameters during normal use, and using a second set of parameters at the affected location to reduce the impact to an acceptable range.
Based on the above embodiments, the present invention provides a compensation system in high-speed motion of a semiconductor wire bonding machine, which includes:
the information acquisition module is used for acquiring variable information during the movement of the first shaft, and the function of the information acquisition module is as described in step 100;
the information calculation module is used for determining compensation information required by other shafts according to the variable information to obtain data information to be compensated of the other shafts, and the functions of the information calculation module are as described in step 300;
the information generating module is used for generating compensated setting information according to the data information to be compensated when the first shaft moves, and the function of the information generating module is as described in step 300;
and the information compensation module is used for compensating other shafts according to the compensated setting information when the first shaft moves, and the function of the information compensation module is as described in step 400.
In this embodiment, as shown in fig. 5, the machine is constructed (i.e. the system) such that the substrate 20 supports the X-axis 21, the Y-axis 22 and the Z-axis 23, wherein the Z-axis structure is supported by the Y-axis structure, so that the centripetal force of the Z-axis during movement changes the stable state of the Y-axis, and the Y-axis is taken away from the original position; similarly, the force generated during the Y-axis movement can change the stable state of the Z axis, and the Z axis is brought away from the original position.
In one embodiment, the present invention further provides an electronic device, including a memory and a processor, where the memory stores a computer program, and where the processor, when executing the computer program, implements the steps of the compensation method in high-speed motion of the semiconductor wire bonding machine.
In one embodiment, the present invention also provides a computer storage medium having a computer program stored thereon, wherein the computer program when executed by a processor performs the steps of the compensation method in high speed motion of the semiconductor wire bonding machine.
In summary, the present invention provides a compensation method and system for high-speed motion of a semiconductor wire bonding machine, wherein the method comprises: variable information during the movement of the first shaft is acquired; determining data information to be compensated of other shafts according to the variable information when the first shaft moves; generating compensated setting information according to the data information to be compensated of the other shafts; and compensating other shafts according to the compensated setting information to obtain result information of the other shafts. According to the invention, the trend is calculated by calculating the corresponding relation between one shaft and other shafts when the shaft moves, and the other shafts are compensated, so that the purpose of reducing influence factors is realized, and the effect of improving the welding efficiency and accuracy is achieved.
It is to be understood that the invention is not limited in its application to the examples described above, but is capable of modification and variation in light of the above teachings by those skilled in the art, and that all such modifications and variations are intended to be included within the scope of the appended claims.

Claims (7)

1. A method of compensating for high speed movement of a semiconductor wire bonding machine, comprising:
variable information during the movement of the first shaft is acquired;
determining data information to be compensated of other shafts according to the variable information when the first shaft moves;
generating compensated setting information according to the data information to be compensated of the other shafts;
compensating other shafts according to the compensated setting information to obtain result information of the other shafts;
the step of determining the data information to be compensated of other shafts according to the variable information when the first shaft moves comprises the following steps:
when the first shaft moves, obtaining data information of other shaft movements according to the variable information of the first shaft movement;
processing the data information during the movement of the other shafts to obtain the data information to be compensated of the other shafts;
the variable information during the first axis movement comprises acceleration change information and distance change information; the data information to be compensated of the other shafts comprises position change information and current change information;
obtaining data information of other axes in motion according to the acceleration change information and the distance change information;
processing the data information during the movement of the other shafts to obtain the position change information and the current change information of the other shafts;
the variable information during the first axis movement is inversely equivalent to the mathematical model of the controlled object through the structure and parameter optimization of the feedforward controller;
and determining the compensation quantity of the feedforward controller according to the parameters and the instruction track of the feedforward controller, and completing the coordinated control of the first shaft and other shafts according to the compensation quantity of the feedforward controller.
2. The method of claim 1, wherein the step of obtaining variable information during the first axis motion comprises:
acquiring setting information of all shafts in static state;
and modifying the setting information in the static state when the first shaft moves to obtain variable information in the first shaft movement.
3. The method of compensating for high speed motion of a semiconductor wire bonding machine of claim 2 wherein the at rest configuration information includes initial data information for other axes at rest; the step of generating compensated setting information according to the data information to be compensated of the other axes comprises the following steps:
and generating compensated data information according to the data information to be compensated of other axes and the initial data information when the other axes are static.
4. The method for compensating for high-speed motion of a semiconductor wire bonding machine according to claim 1 wherein after the step of compensating for other axes according to the compensated setting information to obtain result information of the other axes, further comprising:
and verifying the result information of the other axes to obtain the compensated deviation information.
5. A compensation system in high speed motion of a semiconductor wire bonding machine, comprising:
the information acquisition module is used for acquiring variable information during the movement of the first shaft;
the information calculation module is used for determining data information to be compensated of other shafts according to the variable information when the first shaft moves;
the information calculation module is further configured to: when the first shaft moves, obtaining data information of other shaft movements according to the variable information of the first shaft movement;
processing the data information during the movement of the other shafts to obtain the data information to be compensated of the other shafts;
the variable information during the first axis movement comprises acceleration change information and distance change information; the data information to be compensated of the other shafts comprises position change information and current change information;
obtaining data information of other axes in motion according to the acceleration change information and the distance change information;
processing the data information during the movement of the other shafts to obtain the position change information and the current change information of the other shafts;
the variable information during the first axis movement is inversely equivalent to the mathematical model of the controlled object through the structure and parameter optimization of the feedforward controller; determining the compensation quantity of the feedforward controller according to the parameters and the instruction track of the feedforward controller, and completing the coordination control of the first shaft and other shafts according to the compensation quantity of the feedforward controller;
the information generation module is used for generating compensated setting information according to the data information to be compensated of the other shafts;
and the information compensation module is used for compensating other axes according to the compensated setting information to obtain result information of the other axes.
6. An electronic device comprising a memory and a processor, the memory storing a computer program, wherein the processor, when executing the computer program, performs the steps of the method of compensating for high speed movement of the semiconductor wire bonding machine of any of claims 1-4.
7. A computer storage medium having stored thereon a computer program which, when executed by a processor, implements the steps of the compensation method in the high speed motion of a semiconductor wire bonding machine as claimed in any one of claims 1 to 4.
CN202111632898.0A 2021-12-28 2021-12-28 Compensation method and system in high-speed movement of semiconductor wire bonding machine Active CN114384862B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111632898.0A CN114384862B (en) 2021-12-28 2021-12-28 Compensation method and system in high-speed movement of semiconductor wire bonding machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111632898.0A CN114384862B (en) 2021-12-28 2021-12-28 Compensation method and system in high-speed movement of semiconductor wire bonding machine

Publications (2)

Publication Number Publication Date
CN114384862A CN114384862A (en) 2022-04-22
CN114384862B true CN114384862B (en) 2023-07-04

Family

ID=81200340

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111632898.0A Active CN114384862B (en) 2021-12-28 2021-12-28 Compensation method and system in high-speed movement of semiconductor wire bonding machine

Country Status (1)

Country Link
CN (1) CN114384862B (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100429039C (en) * 2006-04-18 2008-10-29 上海富安工厂自动化有限公司 Space compensation method for numerical control tool shaft
CN102785245A (en) * 2012-08-09 2012-11-21 中国科学技术大学 Dynamics coordinated control system for parallel robot
DE102014119654A1 (en) * 2014-12-29 2016-06-30 Brötje-Automation GmbH Method for compensating for a deviation of a working point
CN111077847B (en) * 2019-12-31 2021-04-09 武汉华中数控股份有限公司 Tool vector error compensation method generated by linear axis rolling angle error of multi-axis machine tool
CN112083687B (en) * 2020-09-11 2021-06-11 苏州浩智工业控制技术有限公司 Over-quadrant compensation method and device based on speed feedforward of field bus

Also Published As

Publication number Publication date
CN114384862A (en) 2022-04-22

Similar Documents

Publication Publication Date Title
US7136256B2 (en) Head positioning control method for a storage device and head positioning control device
CN108363301B (en) Contour error cross-coupling control method based on interference observation sliding mode variable structure
US9772619B2 (en) Motor control device
JP2000046541A (en) Method for reducing measurement error and measurement device using it
US20020099475A1 (en) Method and device for vibration control
US20190275667A1 (en) Control device, control method, and recording medium
CN114384862B (en) Compensation method and system in high-speed movement of semiconductor wire bonding machine
CN103988134B (en) Positioner and PLC system
US11507885B2 (en) Machine learning device, control device, and machine learning search range setting method
KR100987853B1 (en) Twin synchronization control method
CN104375458A (en) Plane profile trajectory tracking control method
Chen et al. Friction modeling and compensation of servomechanical systems with dual-relay feedback approach
US8537485B2 (en) Compensation for vibration in a data storage system
CN104471643A (en) Vibration disturbance estimation and control
CN110682287A (en) Robot and control device
CN114415597A (en) Linkage machining method, system, equipment and device for platform galvanometer and industrial personal computer
US5777871A (en) Method and apparatus for compensation for operator in a closed-loop control system
US20240033909A1 (en) Control device, robot control device, and control method
Zhou Enhancing the Path Accuracy of an Industrial Robot with Visual Servoing and Reinforcement Learning
CN104503227B (en) A kind of face profile track disturbance rejection tracking and controlling method
JP2521939B2 (en) Processing equipment
JP7392590B2 (en) Robot control system, control program and control method
CN116512237B (en) Industrial robot vision servo method, device, electronic equipment and storage medium
CN114976802B (en) Radio frequency connector self-adaptive assembly method and system
CN220187722U (en) Real-time control compensation device for turntable

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant