CN114381689B - Gradient nano coating for cutter, preparation equipment and method - Google Patents
Gradient nano coating for cutter, preparation equipment and method Download PDFInfo
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- CN114381689B CN114381689B CN202210020692.0A CN202210020692A CN114381689B CN 114381689 B CN114381689 B CN 114381689B CN 202210020692 A CN202210020692 A CN 202210020692A CN 114381689 B CN114381689 B CN 114381689B
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- 239000002103 nanocoating Substances 0.000 title claims abstract description 30
- 238000000034 method Methods 0.000 title claims abstract description 15
- 238000002360 preparation method Methods 0.000 title claims abstract description 15
- 238000000151 deposition Methods 0.000 claims abstract description 88
- 230000008021 deposition Effects 0.000 claims abstract description 65
- 230000007704 transition Effects 0.000 claims abstract description 29
- 238000004140 cleaning Methods 0.000 claims abstract description 22
- 239000002114 nanocomposite Substances 0.000 claims abstract description 20
- 238000009434 installation Methods 0.000 claims abstract description 6
- 239000013077 target material Substances 0.000 claims abstract description 6
- 230000004913 activation Effects 0.000 claims abstract description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 68
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 49
- 229910052786 argon Inorganic materials 0.000 claims description 34
- 229910052757 nitrogen Inorganic materials 0.000 claims description 21
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 21
- 239000007789 gas Substances 0.000 claims description 18
- 230000003213 activating effect Effects 0.000 claims description 12
- 238000005057 refrigeration Methods 0.000 claims description 12
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 10
- 238000001816 cooling Methods 0.000 claims description 7
- 229910001873 dinitrogen Inorganic materials 0.000 claims description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 5
- 239000008367 deionised water Substances 0.000 claims description 5
- 229910021641 deionized water Inorganic materials 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 5
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 5
- 239000000498 cooling water Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 abstract description 29
- 238000000576 coating method Methods 0.000 abstract description 29
- 239000000463 material Substances 0.000 abstract description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 5
- 238000005516 engineering process Methods 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 abstract description 3
- 230000002787 reinforcement Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 50
- 238000005520 cutting process Methods 0.000 description 10
- 210000002381 plasma Anatomy 0.000 description 9
- 238000001755 magnetron sputter deposition Methods 0.000 description 8
- 238000012545 processing Methods 0.000 description 5
- 238000001514 detection method Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000007373 indentation Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000001878 scanning electron micrograph Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000005546 reactive sputtering Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0641—Nitrides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
- C23C14/0036—Reactive sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
- C23C14/025—Metallic sublayers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
- C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3435—Applying energy to the substrate during sputtering
- C23C14/345—Applying energy to the substrate during sputtering using substrate bias
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Cutting Tools, Boring Holders, And Turrets (AREA)
Abstract
The invention discloses a gradient nano coating for a cutter, a preparation device and a method thereof, which relate to the field of cutter surface reinforcement and comprise a binding force layer, a transition layer and a nano composite layer, wherein the binding force layer, the transition layer and the nano composite layer are sequentially deposited on the surface of a cutter substrate; the bonding layer material is Ti, the transition layer material is TiN, and the nanocomposite layer material is TiAlSiN; the deposition method comprises the following steps: cutter pre-cleaning, cutter sample loading, target material installation, vacuumizing, cutter ion cleaning, cutter surface activation, binding force layer preparation, transition layer preparation and nano composite layer preparation. The invention has the advantages that: the tool gradient coating is structurally designed into a binding force layer, a transition layer and a superhard and tough nano coating, and the deposition technology capable of realizing high-efficiency preparation of the superhard and tough nano coating for the tool is provided based on the coating, and is high in deposition rate, simple and convenient to operate and low in cost.
Description
Technical Field
The invention relates to the field of cutter surface strengthening, in particular to a gradient nano coating for a cutter, and preparation equipment and a method thereof.
Background
A cutter is a tool used for cutting machining in machine manufacturing, also called a cutting tool. Most knives are mechanical but also hand-held. Since tools used in machine manufacture are basically used for cutting metal materials, the term "tool" is generally understood to mean a metal cutting tool, and the coating of the tool is a great transformation on the way of the machining industry, which is to coat a substrate with relatively high toughness with one, two or even more thin layers of a material with high hardness, high wear resistance and high temperature resistance.
The surface coating material has high hardness, high wear resistance and high temperature resistance. The coated tool allows for a higher cutting speed than an uncoated tool, thereby improving the cutting efficiency; or can improve the service life of the cutter at the same cutting speed. The cutting force of the coated tool is less than that of the uncoated tool due to the lower coefficient of friction between the coating material and the material being machined. The processed surface quality of the part is better by using a coated cutter for processing. The improvement of the binding force of the coating on the surface of the cutter and the strength and hardness of the coating are key to the improvement of the cutter performance, and based on the background, we propose a gradient nano coating for the cutter, a preparation device and a method.
Disclosure of Invention
In order to solve the technical problems, the technical scheme provides a gradient nano coating for a cutter, a preparation device and a method, the gradient nano coating for the cutter is structurally designed into a binding force layer, a transition layer and a superhard and tough nano coating, and a deposition technology capable of realizing high-efficiency preparation of the superhard and tough nano coating for the cutter is provided on the basis of the coating, and the deposition technology is fast in deposition rate, simple and convenient to operate and low in cost.
In order to achieve the above purpose, the invention adopts the following technical scheme:
the gradient nano coating for the cutter is characterized by comprising a binding force layer, a transition layer and a nano composite layer, wherein the binding force layer, the transition layer and the nano composite layer are sequentially deposited on the surface of a cutter substrate;
the bonding layer material is Ti, the transition layer material is TiN, and the nanocomposite layer material is TiAlSiN.
Preferably, the thickness of the binding force layer is 50-500 nm, the thickness of the transition layer is 100-500 nm, and the thickness of the nano composite layer is 1-5 mu m.
Further, a gradient nano coating deposition device for a cutter is provided, the device comprises a deposition cavity, a rotary workbench rotating around the axis of the rotary workbench is arranged in the middle of the interior of the deposition cavity, a plurality of cutter tables rotating around the axis of the rotary workbench are arranged on the rotary workbench, targets are arranged at the edge positions of the interior of the deposition cavity in a cross direction, a vacuum port, a nitrogen interface and an argon interface are arranged on the peripheral surface of the deposition cavity, the vacuum port is externally connected with a vacuum system, the nitrogen interface is externally connected with a nitrogen gas source, the argon interface is externally connected with an argon gas source, and a plurality of targets are respectively connected with corresponding magnetic control power supplies.
Optionally, the target is a cylindrical target.
Optionally, the external cooling circulation system in target position, cooling circulation system comprises refrigeration cycle water machine and temperature monitor, refrigeration cycle water machine is connected with the target and is cooled off the target, the temperature monitor is connected with refrigeration cycle water machine for detect the cooling water temperature of refrigeration cycle water machine output.
Still further, a method for depositing a gradient nano coating for a cutter is provided, comprising the following steps:
pre-cleaning a cutter: sequentially immersing the cutter in an acetone solution, absolute ethyl alcohol and deionized water, respectively carrying out ultrasonic cleaning for 15-30min, drying by using nitrogen, and standing for later use;
sample loading of a cutter: setting the cutter after pre-cleaning on a cutter table;
and (3) target material installation: sequentially and alternately mounting a pure Ti target and a TiAlSi target on a target position;
vacuumizing: vacuumizing the deposition cavity for 20-30 min by a vacuum system, and keeping the vacuum degree in the deposition cavity to reach 5 multiplied by 10 -3 Pa；
Ion cleaning of a cutter: starting a rotary workbench to rotate at a rotating speed of 1-5 rpm, starting a cutter table to rotate at the same time, introducing argon with the purity of 99.999% into a deposition cavity through an argon interface at a flow of 10-200 sccm, keeping the argon pressure at 0.5-3 Pa, applying negative bias voltage of-100 to-500 to the cutter table to generate glow discharge, and performing discharge cleaning on the surface of the cutter;
activating the surface of a cutter: applying an activating pulse voltage to a pure Ti target, and applying an activating negative bias to a cutter table to generate Ti plasma with high beam density and low energy, wherein the Ti plasma bombards and activates the cutter surface for 15-20 min with low energy;
and (3) preparing a binding force layer: applying bonding layer deposition pulse voltage to the pure Ti target, applying bonding layer deposition negative bias to the tool table, and performing bonding layer deposition on the surface of the tool;
preparing a transition layer: introducing nitrogen into the deposition cavity through a nitrogen interface, applying transition layer deposition pulse voltage to a pure Ti target, applying transition layer deposition negative bias to a cutter table, and performing transition layer deposition on the surface of the cutter;
preparing a nano composite layer: nitrogen is introduced into the deposition cavity at a flow rate of 10-150 sccm, pulse voltage with a frequency of 10-100 kHz and a power of 100-1000W is applied to the pure Ti target, pulse voltage with a frequency of 10-100 kHz and a power of 400-20000W is applied to the TiAlSi target, and simultaneously, negative bias voltage with a voltage of 0-100V is applied to the tool table, the deposition time is 10-30min, and the TiAlSiN nano composite layer is prepared.
Carefully chosen, specific parameters of the surface activation of the cutter are as follows: argon gas is introduced into the cutter table at a flow rate of 10-200 sccm and a gas pressure of 0.5-3 Pa, pulse voltage with a frequency of 10-100 kHz and a power of 100-20000W is applied to the pure Ti target, and a negative bias voltage of 0-200V is applied to the cutter table.
The specific parameters of the preparation of the binding force layer are selected as follows: argon gas is introduced into the cutter table at a flow rate of 10-200 sccm and a gas pressure of 0.5-3 Pa, pulse voltage with a frequency of 10-100 kHz and a power of 100-20000W is applied to the pure Ti target, and a negative bias voltage of 0-100V is applied to the cutter table.
The specific parameters of the preparation of the transition layer are selected as follows: the nitrogen gas is introduced into the cutter table at a flow rate of 10-100 sccm and a gas pressure of 0.75-2Pa, pulse voltage with a frequency of 10-100 kHz and a power of 300-15000W is applied to the pure Ti target, and a negative bias voltage of 0-100V is applied to the cutter table.
Carefully selecting the content of Ti element in the TiAlSi target: content of Al element: the content of Si element is 70-80:20-25:5-10.
Compared with the prior art, the invention provides the tool gradient coating with the structural design of the binding force layer, the transition layer and the super-hard and tough nano coating, the binding force between the coating and the tool is effectively improved through the design of the binding force layer and the transition layer, the cutting edge of the coated tool is not broken and less in abrasion after high-speed dry cutting, and meanwhile, the TiAlSiN nano composite layer on the surface layer has a smooth surface and a compact structure, so that the roughness of the processing surface can be effectively reduced.
According to the invention, four cylindrical targets are adopted to form a closed field unbalanced magnetron sputtering system, in the closed field unbalanced magnetic field system, the cylindrical targets can bear a load with higher power than the traditional planar targets, and a large amount of ionized target particles can be generated, so that the density of plasma is remarkably improved, the deposition speed of a coating is effectively improved, and the coating processing efficiency is improved.
Drawings
FIG. 1 is a schematic structural view of a deposition apparatus for a gradient nano-coating for a tool according to the present invention;
FIG. 2 is a schematic diagram of the internal magnetic field of the gradient nano-coating deposition device for a tool according to the present invention;
FIG. 3 is an SEM image of a coating prepared according to the present invention after bonding force test;
FIG. 4 is an SEM image of a coating made in accordance with the present invention after indentation;
FIG. 5 is a SEM of a tool;
FIG. 6 is a graph of nano hardness versus depth profile prepared in accordance with the present invention;
fig. 7 is a flowchart of a deposition method of the gradient nano coating for the tool according to the present invention.
Detailed Description
The following description is presented to enable one of ordinary skill in the art to make and use the invention. The preferred embodiments in the following description are by way of example only and other obvious variations will occur to those skilled in the art.
Referring to FIG. 1, a gradient nano-coating deposition device for a cutter is characterized by comprising a deposition cavity, wherein a rotary workbench rotating around the axis of the deposition cavity is arranged in the middle of the interior of the deposition cavity, a plurality of cutter tables rotating around the axis of the rotation workbench are arranged on the rotary workbench, targets are arranged at the edge positions of the interior of the deposition cavity in a cross direction, the targets are cylindrical targets, four cylindrical targets form a closed field unbalanced magnetron sputtering system, in the closed field unbalanced magnetic field system, a vacuum port, a nitrogen interface and an argon interface are arranged on the peripheral surface of the deposition cavity, the vacuum port is externally connected with a vacuum system, the nitrogen interface is externally connected with a nitrogen source, the argon interface is externally connected with an argon source, and a plurality of targets are respectively connected with corresponding magnetron power sources, the magnetron power supply can be any one of a pulse direct current magnetron sputtering power supply, a radio frequency magnetron sputtering power supply, a high-power pulse magnetron sputtering power supply, a modulation pulse magnetron sputtering power supply and a deep oscillation magnetron sputtering power supply, pulse voltage is applied to the cylindrical magnetron target in a specific pulse mode, so that stable and high-density plasmas can be generated on the surface of the cylindrical target in a reactive sputtering mode, meanwhile, the cylindrical target still has a good cooling state in a high-power discharging mode, the phenomena of overheat cracking and the like are avoided, the cylindrical target can bear a load with higher power than the traditional planar target, a large amount of ionized target particles can be generated, the density of plasmas is remarkably improved, the target is externally connected with a cooling circulation system, the cooling circulation system consists of a refrigeration circulating water machine and a water temperature monitor, the refrigeration circulating water machine is connected with the target to cool the target, the water temperature monitor is connected with the refrigeration circulating water machine, and the device is used for detecting the cooling water temperature output by the refrigeration cycle water machine.
Furthermore, the invention also provides a preparation process of the gradient nano coating for the cutter, which comprises the following steps:
embodiment one:
the deposition method of the gradient nano coating for the cutter is characterized by comprising the following steps of:
pre-cleaning a cutter: sequentially immersing the cutter in an acetone solution, absolute ethyl alcohol and deionized water, respectively carrying out ultrasonic cleaning for 15-30min, drying by using nitrogen, and standing for later use;
sample loading of a cutter: setting the cutter after pre-cleaning on a cutter table;
and (3) target material installation: sequentially and alternately mounting a pure Ti target and a TiAlSi target on a target position;
vacuumizing: vacuumizing the deposition cavity for 20-30 min by a vacuum system, and keeping the vacuum degree in the deposition cavity to reach 5 multiplied by 10 -3 Pa；
Ion cleaning of a cutter: starting a rotary workbench to rotate at a rotating speed of 1-5 rpm, starting a cutter table to rotate at the same time, introducing argon with the purity of 99.999% into a deposition cavity through an argon interface at a flow of 10-200 sccm, keeping the argon pressure at 0.5-3 Pa, applying negative bias voltage of-100 to-500 to the cutter table to generate glow discharge, and performing discharge cleaning on the surface of the cutter;
activating the surface of a cutter: maintaining the argon gas inflow rate at 10-200 sccm and the air pressure at 0.5-3 Pa, applying pulse voltage with the frequency of 10-100 kHz and the power of 100-20000W to a pure Ti target, and simultaneously applying negative bias voltage of 0-200V to a tool table to generate Ti plasma with high beam density and low energy, and bombarding and activating the surface of the tool for 15-20 min;
and (3) preparing a binding force layer: maintaining the argon gas inflow rate at 10-200 sccm and the air pressure at 0.5-3 Pa, applying pulse voltage with the frequency of 10-100 kHz and the power of 100-20000W to a pure Ti target, simultaneously applying negative bias voltage of 0-minus 100V to a cutter table, depositing for 1min, and depositing a Ti bonding layer on the surface of the cutter;
preparing a transition layer: maintaining the nitrogen gas inlet flow of 10-100 sccm and the air pressure of 0.75-2Pa, applying pulse voltage with the frequency of 10-100 kHz and the power of 300-15000W to a pure Ti target, simultaneously applying negative bias voltage of 0-100V to a tool table, depositing for 2min, and depositing a TiN transition layer on the surface of the tool;
preparing a nano composite layer: nitrogen is introduced into the deposition cavity at a flow rate of 10-150 sccm, pulse voltage with a frequency of 10-100 kHz and a power of 100-1000W is applied to the pure Ti target, pulse voltage with a frequency of 10-100 kHz and a power of 400-20000W is applied to the TiAlSi target, and meanwhile, negative bias voltage with a voltage of 0-100V is applied to the tool table, the deposition time is 10min, and the TiAlSiN nano composite layer is prepared.
Embodiment two:
the deposition method of the gradient nano coating for the cutter is characterized by comprising the following steps of:
pre-cleaning a cutter: sequentially immersing the cutter in an acetone solution, absolute ethyl alcohol and deionized water, respectively carrying out ultrasonic cleaning for 15-30min, drying by using nitrogen, and standing for later use;
sample loading of a cutter: setting the cutter after pre-cleaning on a cutter table;
and (3) target material installation: sequentially and alternately mounting a pure Ti target and a TiAlSi target on a target position;
vacuumizing: vacuumizing the deposition cavity for 20-30 min by a vacuum system, and keeping the vacuum degree in the deposition cavity to reach 5 multiplied by 10 -3 Pa；
Ion cleaning of a cutter: starting a rotary workbench to rotate at a rotating speed of 1-5 rpm, starting a cutter table to rotate at the same time, introducing argon with the purity of 99.999% into a deposition cavity through an argon interface at a flow of 10-200 sccm, keeping the argon pressure at 0.5-3 Pa, applying negative bias voltage of-100 to-500 to the cutter table to generate glow discharge, and performing discharge cleaning on the surface of the cutter;
activating the surface of a cutter: maintaining the argon gas inflow rate at 10-200 sccm and the air pressure at 0.5-3 Pa, applying pulse voltage with the frequency of 10-100 kHz and the power of 100-20000W to a pure Ti target, and simultaneously applying negative bias voltage of 0-200V to a tool table to generate Ti plasma with high beam density and low energy, and bombarding and activating the surface of the tool for 15-20 min;
and (3) preparing a binding force layer: maintaining the argon gas inflow rate at 10-200 sccm and the air pressure at 0.5-3 Pa, applying pulse voltage with the frequency of 10-100 kHz and the power of 100-20000W to a pure Ti target, simultaneously applying negative bias voltage of 0-minus 100V to a cutter table, depositing for 6min, and depositing a Ti bonding force layer on the surface of the cutter;
preparing a transition layer: maintaining the nitrogen gas inlet flow of 10-100 sccm and the air pressure of 0.75-2Pa, applying pulse voltage with the frequency of 10-100 kHz and the power of 300-15000W to a pure Ti target, simultaneously applying negative bias voltage of 0-100V to a tool table, depositing for 6min, and depositing a TiN transition layer on the surface of the tool;
preparing a nano composite layer: nitrogen is introduced into the deposition cavity at a flow rate of 10-150 sccm, pulse voltage with a frequency of 10-100 kHz and a power of 100-1000W is applied to the pure Ti target, pulse voltage with a frequency of 10-100 kHz and a power of 400-20000W is applied to the TiAlSi target, and meanwhile, negative bias voltage with a voltage of 0-100V is applied to the tool table, the deposition time is 30min, and the TiAlSiN nano composite layer is prepared.
Embodiment III:
the deposition method of the gradient nano coating for the cutter is characterized by comprising the following steps of:
pre-cleaning a cutter: sequentially immersing the cutter in an acetone solution, absolute ethyl alcohol and deionized water, respectively carrying out ultrasonic cleaning for 15-30min, drying by using nitrogen, and standing for later use;
sample loading of a cutter: setting the cutter after pre-cleaning on a cutter table;
and (3) target material installation: sequentially and alternately mounting a pure Ti target and a TiAlSi target on a target position;
vacuumizing: evacuating a deposition chamber by a vacuum systemVacuum is carried out for 20-30 min, and the vacuum degree in the deposition cavity is kept to be 5 multiplied by 10 -3 a；
Ion cleaning of a cutter: starting a rotary workbench to rotate at a rotating speed of 1-5 rpm, starting a cutter table to rotate at the same time, introducing argon with the purity of 99.999% into a deposition cavity through an argon interface at a flow of 10-200 sccm, keeping the argon pressure at 0.5-3 Pa, applying negative bias voltage of-100 to-500 to the cutter table to generate glow discharge, and performing discharge cleaning on the surface of the cutter;
activating the surface of a cutter: maintaining the argon gas inflow rate at 10-200 sccm and the air pressure at 0.5-3 Pa, applying pulse voltage with the frequency of 10-100 kHz and the power of 100-20000W to a pure Ti target, and simultaneously applying negative bias voltage of 0-200V to a tool table to generate Ti plasma with high beam density and low energy, and bombarding and activating the surface of the tool for 15-20 min;
and (3) preparing a binding force layer: maintaining the argon gas inflow rate at 10-200 sccm and the air pressure at 0.5-3 Pa, applying pulse voltage with the frequency of 10-100 kHz and the power of 100-20000W to a pure Ti target, simultaneously applying negative bias voltage of 0-minus 100V to a cutter table, depositing for 2min, and depositing a Ti bonding force layer on the surface of the cutter;
preparing a transition layer: maintaining the nitrogen gas inlet flow of 10-100 sccm and the air pressure of 0.75-2Pa, applying pulse voltage with the frequency of 10-100 kHz and the power of 300-15000W to a pure Ti target, simultaneously applying negative bias voltage of 0-100V to a tool table, depositing for 3min, and depositing a TiN transition layer on the surface of the tool;
preparing a nano composite layer: nitrogen is introduced into the deposition cavity at a flow rate of 10-150 sccm, pulse voltage with a frequency of 10-100 kHz and a power of 100-1000W is applied to the pure Ti target, pulse voltage with a frequency of 10-100 kHz and a power of 400-20000W is applied to the TiAlSi target, and meanwhile, negative bias voltage with a voltage of 0-100V is applied to the tool table, the deposition time is 20min, and the TiAlSiN nano composite layer is prepared.
Performing hardness detection, coating thickness detection and fracture toughness detection on the cutter coating prepared in the first embodiment, the second embodiment and the third embodiment;
the coating thickness detection adopts an ultrasonic coating thickness gauge to detect, and the nanometer hardness indentation instrument is used for detecting hardness and fracture toughness by adopting an indentation method, so that the following results are obtained:
as can be seen from the data in the table above, the hardness of the cutter coating prepared by the invention reaches 45GPa, and the fracture toughness reaches 3 MPa.m 1/2 The invention adopts four cylindrical targets to form a closed field unbalanced magnetron sputtering system, in the closed field unbalanced magnetic field system, the cylindrical targets can bear larger power load than the traditional planar targets, and a large amount of ionized target particles can be generated, thereby obviously improving the density of plasmas, enabling the deposition speed of a coating to reach 100nm/min, greatly improving the deposition speed of the coating and effectively improving the efficiency of coating processing.
The HRA method is adopted to test the adhesive force of the surface of the coating, and the coating is observed through an electron microscope, and the result is shown in figure 3, and the observation result of figure 3 shows that the adhesive force level of the coating reaches more than HF1, and the coating has ultrahigh adhesive force with a cutter, so that the coating is effectively prevented from falling off in the use process of the cutter, and the processing property of the cutter is improved.
The analysis of the nano hardness distribution with depth of the coating is carried out, and the result is shown in figure 6, and the result of figure 6 shows that the nano hardness in the coating prepared by the invention can reach 55GPa.
The foregoing has shown and described the basic principles, principal features and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present invention, and various changes and modifications may be made therein without departing from the spirit and scope of the invention, which is defined by the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (8)
1. The deposition method of the gradient nano coating for the cutter is characterized by comprising the following steps of:
pre-cleaning a cutter: sequentially immersing the cutter in an acetone solution, absolute ethyl alcohol and deionized water, respectively carrying out ultrasonic cleaning for 15-30min, drying by using nitrogen, and standing for later use;
sample loading of a cutter: setting the cutter after pre-cleaning on a cutter table;
and (3) target material installation: sequentially and alternately mounting a pure Ti target and a TiAlSi target on a target position;
vacuumizing: vacuumizing the deposition cavity for 20-30 min through a vacuum system, and keeping the vacuum degree in the deposition cavity to reach 5 multiplied by 10 < -3 > Pa;
ion cleaning of a cutter: starting a rotary workbench to rotate at a rotating speed of 1-5 rpm, starting a cutter table to rotate at the same time, introducing argon with the purity of 99.999% into a deposition cavity through an argon interface at a flow of 10-200 sccm, keeping the argon pressure at 0.5-3 Pa, applying negative bias voltage of-100 to-500 to the cutter table to generate glow discharge, and performing discharge cleaning on the surface of the cutter;
activating the surface of a cutter: applying an activating pulse voltage to a pure Ti target, and applying an activating negative bias to a cutter table to generate Ti plasma with high beam density and low energy, wherein the Ti plasma bombards and activates the cutter surface for 15-20 min with low energy;
and (3) preparing a binding force layer: applying bonding layer deposition pulse voltage to the pure Ti target, applying bonding layer deposition negative bias to the tool table, and performing bonding layer deposition on the surface of the tool;
preparing a transition layer: introducing nitrogen into the deposition cavity through a nitrogen interface, applying transition layer deposition pulse voltage to a pure Ti target, applying transition layer deposition negative bias to a cutter table, and performing transition layer deposition on the surface of the cutter;
preparing a nano composite layer: introducing nitrogen into the deposition cavity at a flow of 10-150 sccm, applying pulse voltage with a frequency of 10-100 kHz and a power of 100-1000W to a pure Ti target, applying pulse voltage with a frequency of 10-100 kHz and a power of 400-20000W to a TiAlSi target, simultaneously applying negative bias voltage with a voltage of 0-100V to a cutter table, and performing preparation of a TiAlSiN nano composite layer for 10-30 min;
wherein the thickness of the binding force layer is 50-500 nm, the thickness of the transition layer is 100-500 nm, and the thickness of the nano composite layer is 1-5 mu m.
2. The method for depositing a gradient nano-coating for a cutter according to claim 1, wherein specific parameters of the surface activation of the cutter are as follows: argon gas is introduced into the cutter table at a flow rate of 10-200 sccm and a gas pressure of 0.5-3 Pa, pulse voltage with a frequency of 10-100 kHz and a power of 100-20000W is applied to the pure Ti target, and a negative bias voltage of 0-200V is applied to the cutter table.
3. The method for depositing a gradient nano-coating for a tool according to claim 1, wherein specific parameters for preparing the binding force layer are as follows: argon gas is introduced into the cutter table at a flow rate of 10-200 sccm and a gas pressure of 0.5-3 Pa, pulse voltage with a frequency of 10-100 kHz and a power of 100-20000W is applied to the pure Ti target, and a negative bias voltage of 0-100V is applied to the cutter table.
4. The method for depositing a gradient nano-coating for a cutter according to claim 1, wherein specific parameters for preparing the transition layer are as follows: the nitrogen gas is introduced into the cutter table at a flow rate of 10-100 sccm and a gas pressure of 0.75-2Pa, pulse voltage with a frequency of 10-100 kHz and a power of 300-15000W is applied to the pure Ti target, and a negative bias voltage of 0-100V is applied to the cutter table.
5. The method for depositing a gradient nano-coating for a cutter according to claim 1, wherein the content of Ti element in the TiAlSi target is: content of Al element: the content of Si element is 70-80:20-25:5-10.
6. The method is characterized by comprising a deposition cavity, wherein a rotary workbench rotating around an axis is arranged in the middle of the interior of the deposition cavity, a plurality of tool tables rotating around the axis are arranged on the rotary workbench, targets are arranged at the edge positions of the interior of the deposition cavity in a cross direction, a vacuum port, a nitrogen interface and an argon interface are arranged on the circumferential surface of the deposition cavity, the vacuum port is externally connected with a vacuum system, the nitrogen interface is externally connected with a nitrogen gas source, the argon interface is externally connected with an argon gas source, and a plurality of targets are respectively connected with a corresponding magnetic control power supply.
7. The tool gradient nano-coating deposition device of claim 6, wherein the target is a cylindrical target.
8. The tool gradient nano coating deposition device according to claim 6, wherein the target is externally connected with a cooling circulation system, the cooling circulation system comprises a refrigeration circulation water machine and a water temperature monitor, the refrigeration circulation water machine is connected with the target to cool the target, and the water temperature monitor is connected with the refrigeration circulation water machine and is used for detecting the cooling water temperature output by the refrigeration circulation water machine.
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| BG1464U1 (en) * | 2011-04-08 | 2011-07-29 | "Гбф Консултинг" Оод | A multylayer nano-composite coating on metal cutting tools |
| CN113529080A (en) * | 2021-07-19 | 2021-10-22 | 厦门鸿鹭联创工具有限公司 | Coating for PCB micro milling cutter |
| CN113774347A (en) * | 2021-09-14 | 2021-12-10 | 北京市辐射中心 | Superhard and tough nano composite coating, preparation method and use equipment |
| CN113832440A (en) * | 2021-09-17 | 2021-12-24 | 苏帕斯达(苏州)纳米科技有限公司 | TiSiCN nano composite coating, deposition device, preparation method and application thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ATE441737T1 (en) * | 2000-12-28 | 2009-09-15 | Kobe Steel Ltd | TARGET FOR FORMING A HARD LAYER |
| JP5005262B2 (en) * | 2006-05-26 | 2012-08-22 | 三菱マテリアル株式会社 | Cutting tool made of surface-coated cubic boron nitride-based ultra-high pressure sintered material that exhibits excellent surface finish accuracy over a long period of time in high-speed cutting of hardened steel |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BG1464U1 (en) * | 2011-04-08 | 2011-07-29 | "Гбф Консултинг" Оод | A multylayer nano-composite coating on metal cutting tools |
| CN113529080A (en) * | 2021-07-19 | 2021-10-22 | 厦门鸿鹭联创工具有限公司 | Coating for PCB micro milling cutter |
| CN113774347A (en) * | 2021-09-14 | 2021-12-10 | 北京市辐射中心 | Superhard and tough nano composite coating, preparation method and use equipment |
| CN113832440A (en) * | 2021-09-17 | 2021-12-24 | 苏帕斯达(苏州)纳米科技有限公司 | TiSiCN nano composite coating, deposition device, preparation method and application thereof |
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