CN114379880A - Device and method for testing S parameter of radio frequency chip type load band - Google Patents

Abstract

The invention discloses a device and a method for testing S parameters of a radio frequency chip type load band, which comprises the following steps: a work table; the feeding tray is arranged on the workbench and used for feeding the radio frequency chip type load to be detected; the turret detection mechanism is arranged on the workbench, receives the feeding of the feeding disc and determines the polarity identification and S parameter of the radio frequency chip type load; the industrial personal computer is arranged on the workbench and is electrically controlled and connected with the feeding disc and the turret detection mechanism; the turret detection mechanism comprises a rotating and turret module, a first positioning module, a second positioning module, a reversing module, a third positioning module, a shaping and reversing module, a testing module and a fourth positioning module which are arranged on a workbench in sequence along the rotating direction of the rotating and turret module, a downward-looking CCD module which is arranged in one-to-one correspondence with the first positioning module, the second positioning module and the reversing module, and a material blowing module which is arranged on the workbench and is arranged in one-to-one correspondence with the second positioning module and the third positioning module.

Description

Device and method for testing S parameter of radio frequency chip type load band

Technical Field

The invention relates to the technical field of radio frequency chip type load detection, in particular to a device and a method for testing S parameters of a radio frequency chip type load band.

Background

The radio frequency chip type load is used as a special product in a chip resistor and is mainly used in the fields of radars, communication, radio frequency modules and the like. With the development of scientific information technology, 5G communication technology is comprehensively spread, the miniaturization requirements in the fields of aerospace communication and the like are improved, and the requirements of radio frequency chip type loads are increased more and more. The difference between the radio frequency chip type load and the conventional chip resistor is as follows: the bottom electrode of the radio frequency chip type load is of an asymmetric structure and is provided with a polar component, and the bottom electrode of the radio frequency chip type load needs to correspond to the front polarity identification. And the conventional chip resistor testing and packaging technology does not have the function of identifying the corresponding relationship.

In addition, because no special test equipment exists in the prior art, most domestic radio-frequency chip type load manufacturers adopt a conventional chip type resistor automatic test packaging technology, only positive polarity identification is recognized, and meanwhile, in the previous process, a network analyzer is used for manually testing S parameters in a sampling mode to test packages. The method has the risk of incorrect polarity identification, simultaneously, the S parameter is used as the core technical index of the radio frequency chip type load, 100 percent of test is needed, the high reliability of the index is ensured, and the requirement of the high-end manufacturing field can not be met by the method only through sampling test and manufacturing process.

Therefore, it is urgently needed to provide a device and a method for testing the S parameter of the rf chip type load tape, which are simple in structure, efficient and reliable.

Disclosure of Invention

In view of the above problems, the present invention aims to provide a device and a method for testing S parameters of a radio frequency chip type load tape, and the technical scheme adopted by the present invention is as follows:

a first part:

a kind of radio frequency chip type load carries the testing device of the S parameter, used in the chip type load detection of the radio frequency, it includes:

a work table; a working table surface is arranged on the working table;

the feeding tray is arranged on the workbench and used for feeding the radio frequency chip type load to be detected;

the turret detection mechanism is arranged on the workbench, receives the feeding of the feeding disc and determines the polarity identification and S parameter of the radio frequency chip type load;

the industrial personal computer is arranged on the workbench, is electrically controlled and connected with the feeding disc and the turret detection mechanism, and acquires data measured and transmitted by the turret detection mechanism;

the turret detection mechanism comprises a rotating and turret module, a first positioning module, a second positioning module, a reversing module, a third positioning module, a shaping and reversing module, a testing module and a fourth positioning module, a downward-looking CCD module and a blowing module, wherein the rotating and turret module is installed on a workbench and used for providing station switching transmission of a radio frequency chip type load to be detected, the first positioning module, the second positioning module, the reversing module, the third positioning module, the shaping and reversing module, the testing module and the fourth positioning module are sequentially arranged on the workbench in the rotating direction of the rotating and turret module, the downward-looking CCD module is arranged in one-to-one correspondence with the first positioning module, the second positioning module and the reversing module, and the blowing module is arranged on the workbench and in one-to-one correspondence with the second positioning module and the third positioning module.

Further, the device for testing the S parameter of the radio frequency chip type load tape further comprises:

and the packaging mechanism is arranged on the workbench, receives the blanking of the turret detection mechanism and packages the blanking.

A second part: a method for testing S parameters of a radio frequency chip type load tape comprises the following steps:

feeding by using a feeding disc;

the method comprises the following steps that a first motor and a high-speed lifting cam divider are utilized to drive a rotating tower disc to rotate, a suction nozzle module is utilized to adsorb a radio frequency chip type load to be detected to sequentially enter a first positioning module, a second positioning module, a reversing module, a third positioning module, a shaping and reversing module, a testing module and a fourth positioning module, and polarity identification and S parameter determination are carried out on the radio frequency chip type load to be detected;

and transmitting the detected radio frequency chip type load to a carrier tape mechanism, and carrying out material tape packaging and receiving.

Compared with the prior art, the invention has the following beneficial effects:

(1) the invention skillfully adopts rotation and turret module for transmission, and is provided with the high-speed lifting cam divider to drive the suction nozzle module to rotate and lift the radio-frequency chip type load at the same time so as to realize reliable transposition; the invention adopts a suspended turntable component type structure, utilizes the multi-station characteristic of the structure of the suspended idle tower tray, not only contains the advantages and functions of the original test packaging system of the conventional chip resistor, but also increases enough space for the design of a polarity identification system and an S parameter test system;

(2) the invention ingeniously arranges a plurality of positioning modules and shaping and reversing modules so as to realize that the radio frequency chip type load in each station is in the best position and ensure the stable adsorption and the accuracy of product data during testing;

(3) the invention skillfully arranges a plurality of CCD identification systems, and transmits the polarity information of the front surface and the bottom surface to the system for polarity judgment while checking the appearance.

(4) The invention realizes the detection guarantee of the assembly line by the continuous matching of the feeding disc, the turret detection mechanism and the packaging mechanism so as to improve the production and processing efficiency;

in conclusion, the invention has the advantages of simple structure, high detection efficiency, reliability and the like, and has very high practical value and popularization value in the technical field of radio frequency chip type load detection.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope of protection, and it is obvious for those skilled in the art that other related drawings can be obtained according to these drawings without inventive efforts.

FIG. 1 is a schematic structural diagram of the present invention.

Fig. 2 is a schematic structural diagram (one) of a turret detection mechanism and a packaging mechanism of the invention.

Fig. 3 is a schematic structural view (two) of the turret detection mechanism and the packaging mechanism of the present invention.

Fig. 4 is a schematic structural view of the rotating and turret module of the present invention.

FIG. 5 is a schematic structural diagram of the turret detection mechanism (de-rotation and turret module) of the present invention.

Fig. 6 is a schematic structural diagram of a first positioning module according to the present invention.

FIG. 7 is a diagram of the corrective drive deployment state of the present invention.

Fig. 8 is a schematic structural diagram of the calibration pawl module of the present invention.

Fig. 9 is a schematic structural diagram of the commutation module of the present invention.

Fig. 10 is a schematic structural diagram of the shaping and commutating module of the present invention.

Fig. 11 is a schematic structural diagram of the blowing module of the present invention.

FIG. 12 is a schematic structural diagram of a test module according to the present invention.

Fig. 13 is a schematic structural diagram (one) of the packaging mechanism of the present invention.

Fig. 14 is a schematic structural view of the packaging mechanism of the present invention (ii).

Fig. 15 is a schematic structural view (iii) of the packaging mechanism of the present invention.

Fig. 16 is a schematic structural view of a carrier tape mechanism of the present invention.

In the drawings, the names of the parts corresponding to the reference numerals are as follows:

1. a work table; 2. feeding a material plate; 3. a turret detection mechanism; 4. a packaging mechanism; 5. an industrial personal computer; 30. a work table; 31. a blowing module; 33. a first positioning module; 34. a second positioning module; 35. a commutation module; 36. a third positioning module; 37. a shaping and reversing module; 38. a test module; 39. a fourth positioning module; 300. a downward-looking CCD module; 311. blowing the material mounting rack; 312. blowing a material pipe; 321. a first motor mount; 322. a first motor; 323. a high-speed lifting cam divider; 324. rotating the tower shaft; 325. rotating the tower tray; 326. a suction nozzle module; 327. an encoder seat; 328. an encoder; 331. a first mounting seat; 332. a second motor; 333. a correction position bottom plate; 334. correcting the guide seat; 335. mounting plates for equal-height columns; 336. a correcting claw module; 337. a sensor mounting seat; 338. an optical fiber sensor; 3321. a connecting shaft; 3322. correcting a tension wheel; 3361. correcting the claw seat; 3362. a bearing; 3363. correcting the jack catch; 351. a second mounting seat; 352. a third motor; 353. a reversing seat; 354. testing the clamp; 371. a third mounting seat; 372. a fourth motor; 373. a drive pulley; 374. a driven pulley; 375. a belt; 376. a support base plate; 377. a rotary positioning module; 381. a fourth mounting seat; 382. rotating the sliding table; 383. an XY axis sliding table; 384. a reversing seat; 385. testing the circuit board; 41. a carrier tape mechanism; 42. a tape sealing assembly; 43. placing the membrane assembly; 44. a film collecting component; 45. a material belt; 411. a fifth mounting seat; 412. a carrier tape main transmission bearing seat; 413. the carrier tape is driven by the transmission bearing seat; 414. a fifth motor; 415. a first carrier tape drive pinwheel; 416. a second carrier tape transmission pinwheel; 417. a belt transport module; 418. carrying a track; 421. a seal tape mounting seat; 422. a sealing belt material tray; 441. a sixth mounting seat; 442. a sixth motor; 443. and (7) receiving a material tray.

Detailed Description

To further clarify the objects, technical solutions and advantages of the present application, the present invention will be further described with reference to the accompanying drawings and examples, and embodiments of the present invention include, but are not limited to, the following examples. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Examples

As shown in fig. 1 to 16, the present embodiment provides an apparatus and a method for testing S-parameters of an rf chip type carrier tape. First, the terms "first", "second", and the like in the present embodiment are used only for distinguishing the same kind of components, and are not to be construed as specifically limiting the scope of protection. In the present embodiment, the terms of orientation such as "bottom", "top", "peripheral edge", "center", and the like are explained based on the drawings.

In this embodiment, the apparatus for testing S-parameters of an rf chip type load tape includes: the device comprises a workbench 1, a feeding tray 2, a turret detection mechanism 3 and a packaging mechanism 4. Wherein, a working table surface 30 is arranged on the working table 1.

As shown in fig. 1 to 12, the turret detection mechanism 3 of the present embodiment includes a rotation and turret module installed on the workbench 1 and used for providing station switching transmission of the rf sheet type load to be detected, a first positioning module 33, a second positioning module 34, a reversing module 35, a third positioning module 36, a shaping and reversing module 37, a testing module 38, and a fourth positioning module 39 that are sequentially arranged on the workbench 1 along the rotation direction of the rotation and turret module, a downward-looking CCD module 300 that is arranged in one-to-one correspondence with the first positioning module 33, the second positioning module 34, and the reversing module 35, and a blowing module 31 that is arranged on the workbench 1 and is arranged in one-to-one correspondence with the second positioning module 34 and the third positioning module 36. In this embodiment, the nozzle module on the rotating and turret module is used to suck the material on the material loading tray 2, and the material passes through the first positioning module 33, the second positioning module 34, the reversing module 35, the third positioning module 36, the shaping and reversing module 37, the testing module 38, and the fourth positioning module 39 in sequence. The blowing module 31 includes a blowing mounting frame 311 and a blowing pipe 312.

In this embodiment, the CCD located in the first positioning module 33 performs positioning image detection and judgment on the rf chip load, the CCD located in the second positioning module 34 performs rf chip load bottom image detection, and judges whether the image is poor from the standard image, if the image is normal, the image is directly transferred to the reversing module 35 for rf test; if the difference is a bottom pattern defect, the radio frequency sheet type load is removed and discharged through the material blowing module 31, if the difference is judged to be the pattern reversal, the radio frequency sheet type load is transferred to the reversing module 35 to be subjected to reversing correction, image detection is carried out again through a CCD corresponding to the reversing module 35, radio frequency test is carried out on the reversing module 35, if the difference is judged to be normal, the radio frequency sheet type load can be directly transferred to the shaping and reversing module 37, and if the image detection is abnormal or the radio frequency test is unqualified, the radio frequency sheet type load is transferred to the third positioning module 36 to be subjected to waste material discharge.

The rotating and turret module of the present embodiment includes a first motor mounting seat 321 and a high-speed cam divider 323 fixed to the bottom of the work table 30, a first motor 322 fixed to the first motor mounting seat 321 and connected to the high-speed cam divider 323, a turret shaft 324 fixed to the work table 30 in the longitudinal direction and connected to the high-speed cam divider 323, a turret disc 325 disposed on the turret shaft 324, and a plurality of nozzle modules 326 annularly and uniformly spaced at the peripheral edge of the turret disc 325. For detection, an encoder base 327 is provided at the bottom of the work table 30, and an encoder 328 connected to the high-speed lifting cam divider 323 is provided on the encoder base 327. In this embodiment, the high speed lifting cam divider 323 can also lift during rotation, i.e. the following actions are achieved during rotation: after the suction nozzle module descends for adsorption, the high-speed lifting cam divider drives the suction nozzle module to ascend and leave the current station, and when the suction nozzle module reaches the next station, the suction nozzle module descends and the radio-frequency chip type load is unloaded.

In this embodiment, the first positioning module 33, the second positioning module 34, the third positioning module 36 and the fourth positioning module 39 have the same structure, and are all used for adjusting the position of the rf chip load, so as to ensure that the rf chip load is at the optimal position when the suction nozzle sucks the rf chip load, thereby ensuring that the later detection is more accurate.

In the present embodiment, taking the first positioning module 33 as an example, it includes a first mounting seat 331 fixed on the working platform 30, a calibration base plate 333 disposed on the first mounting seat 331, a second motor 332 fixed on the bottom of the calibration base plate 333 and having a top penetrating through the calibration base plate 333, a calibration guide seat 334 disposed on the calibration base plate 333, four chutes which are uniformly arranged on the correcting guide seat 334 in an annular shape by taking the center of the correcting guide seat 334 as a starting point, equal-height column mounting plates 335 arranged on the correcting guide seat 334, correcting claw modules 336 which are arranged in the chutes in a one-to-one correspondence manner and are rotationally matched with the second motor 332, a sensor mounting seat 337 fixedly connected to the first mounting seat 331, a probe provided on the sensor mounting seat 337 and actuated by the calibration jaw module 336, and a fiber sensor 338 fixed to the first mount 331 and connected to the probe. Wherein, the rf chip type load is squeezed between the calibration pawl modules 336; the calibration pawl module 336 is in a tightened state (with a contracting spring, not shown, in a conventional manner) without actuation of the second motor 332.

In this embodiment, a connecting shaft 3321 is disposed in the calibration guide 334; the bottom of the connecting shaft 3321 is connected with the second motor 332; a correcting tension wheel 3322 is arranged at the top of the connecting shaft 3321; the correcting tension wheel 3322 is square in shape when viewed from the bottom. The tension correcting wheel 3322 of the embodiment rotates to press the bearing 3362 and presses the correcting claws 3363 to spread, so that the rf chip load can be put in, and after the rf chip load is put in, the rf chip load is pushed to the central position by the recovery action of the rf chip load. In this embodiment, the calibration jaw module 336 includes a calibration jaw seat 3361 slidably disposed in the sliding slot, a bearing 3362 disposed in the calibration jaw seat 3361 and slidably press-fitted with the calibration tension wheel 3322, and a calibration jaw 3363 connected to the calibration jaw seat 3361 and disposed on the equal-height column mounting plate 335 for press-clamping the rf chip load.

As shown in fig. 9, the reversing module 35 of the present embodiment includes a second mounting base 351 fixed on the working platform 30, a reversing base 353 disposed on the second mounting base 351, a third motor 352 disposed on the second mounting base 351 and driving the reversing base 353 to rotate, and a test fixture 354 disposed on the reversing base 353 and used for clamping the rf chip type load. In this embodiment, the third motor 352 is used to drive the commutator 353 to rotate, and the test fixture 354 is driven to rotate.

As shown in fig. 10, the shaping and reversing module 37 of the present embodiment includes a third mounting seat 371 fixed on the working platform 30, a fourth motor 372 fixed on the third mounting seat 371, a driving pulley 373 connected with the fourth motor 372, a driven pulley 374 disposed on the third mounting seat 371, a belt 375 connected between the driving pulley 373 and the driven pulley 374, a supporting base plate 376 disposed on top of the driven pulley 374, and a rotation positioning module 377 disposed on the supporting base plate 376. The structure of the upper portion of the rotational positioning module 377 is the same as that of the first positioning module 33, and will not be described herein.

As shown in fig. 12, the test module 38 of the present embodiment includes a fourth mounting base 381 fixed on the working table 30, and a rotary sliding table 382, an XY axis sliding table 383, a reversing base 384 and a test circuit board 385 which are connected in sequence from bottom to top; the rotary sliding table 382 is mounted on the fourth mounting seat 381; the radio frequency chip type load to be detected is placed in the flowing water on the test circuit board 385.

As shown in fig. 13 to 16, in the present embodiment, the detected rf sheet loads need to be packaged, and a packaging mechanism 4 is provided, and the packaging mechanism 4 is provided on the workbench 1, receives the blanking of the turret detection mechanism 3, and packages the blanking.

Specifically, the packaging mechanism 4 of the present embodiment includes a carrier tape mechanism 41, a tape sealing assembly 42 and a film collecting assembly 44 which are mounted on the work table 30 and sequentially arranged along the packaging flowing direction, and a film releasing assembly 43 disposed on the tape sealing assembly 42; the tape loading mechanism 41 transports a tape on which a radio frequency chip type load is placed, and presses the packaged film onto the tape by using the film laying assembly 43.

As shown in fig. 16, the carrier tape mechanism 41 of the present embodiment includes a fifth mount 411 mounted on the table top 30, a carrier tape drive carrier 412 and a carrier tape drive carrier 413 mounted at ends of the fifth mount 411, a fifth motor 414 fixed to the carrier tape drive carrier 412, a carrier tape track 418 provided between the carrier tape drive carrier 412 and the carrier tape drive carrier 413, a first carrier tape drive pin 415 provided on the carrier tape drive carrier 412, a second carrier tape drive pin 416 provided on the carrier tape drive carrier 413, and a belt transfer module 417 provided between the first carrier tape drive pin 415 and the second carrier tape drive pin 416; the first carrier tape driving pinwheel 415 is connected with a fifth motor 414. In this embodiment, the rf chip type load is placed in an empty tape, enters the tape track 418 from the second tape driving pin wheel 416, and is packaged by the tape sealing component 42 and the film releasing component 43, and finally is wound up by the film winding component 44. Therefore, the film collecting assembly 44 of the present embodiment includes a sixth mounting seat 441 mounted on the working platform 30, a sixth motor 442 disposed on the sixth mounting seat 441, and a collecting tray 443 connected to the sixth motor 442 for collecting the film. In this embodiment, a tape sealing tray 422 is disposed on the tape sealing mounting seat 421.

The working principle of the present embodiment is briefly explained as follows:

feeding by using the feeding plate 2;

the rotating tray 325 is driven to rotate by the first motor 322 and the high-speed lifting cam divider 323, the suction nozzle module 326 is used for adsorbing the radio-frequency sheet type load to be detected to sequentially enter the first positioning module 33, the second positioning module 34, the reversing module 35, the third positioning module 36, the shaping and reversing module 37, the testing module 38 and the fourth positioning module 39, and polarity identification and S parameter measurement are carried out on the radio-frequency sheet type load to be detected;

and transmitting the detected radio frequency chip type load to a carrier tape mechanism 41, and packaging and receiving the material by a material belt 45.

The above-mentioned embodiments are only preferred embodiments of the present invention, and do not limit the scope of the present invention, but all the modifications made by the principles of the present invention and the non-inventive efforts based on the above-mentioned embodiments shall fall within the scope of the present invention.

Claims (10)

1. A kind of radio frequency chip type load carries the testing device of the S parameter, used in the chip type load detection of the radio frequency, characterized by that, including:

a table (1); a working table top (30) is arranged on the working table (1);

the feeding tray (2) is arranged on the workbench (1) and used for feeding the radio frequency chip type load to be detected;

the turret detection mechanism (3) is arranged on the workbench (1) and used for receiving the feeding of the feeding disc (2) and measuring the polarity identification and S parameter of the radio frequency chip type load;

the industrial personal computer (5) is arranged on the workbench (1), is electrically controlled and connected with the feeding disc (2) and the turret detection mechanism (3), and acquires data measured and transmitted by the turret detection mechanism (3);

the turret detection mechanism (3) comprises a rotating and turret module, a first positioning module (33), a second positioning module (34), a reversing module (35), a third positioning module (36), a shaping and reversing module (37), a testing module (38) and a fourth positioning module (39), wherein the rotating and turret module is arranged on a workbench (1) and used for providing station switching transmission of a radio frequency chip type load to be detected, the first positioning module (33), the second positioning module (34), the reversing module (35), the third positioning module (36), the shaping and reversing module (37), the testing module (38) and the fourth positioning module (39) are sequentially arranged in the rotating direction of the rotating and turret module, a downward-looking CCD module (300) is arranged in one-to-one correspondence with the first positioning module (33), the second positioning module (34) and the reversing module (35), and a blowing module (31) is arranged on the workbench (1) and is arranged in one-to-one correspondence with the second positioning module (34) and the third positioning module (36).

2. The apparatus for testing S-parameters of an RF chip carrier tape according to claim 1, further comprising:

and the packaging mechanism (4) is arranged on the workbench (1), receives the blanking of the turret detection mechanism (3), and packages the blanking.

3. The device for testing the S parameters of the radio frequency chip type load carrier tape according to claim 1, wherein the rotating and turret module comprises a first motor mounting seat (321) and a high-speed cam divider (323) fixed at the bottom of the working platform (30), a first motor (322) fixed on the first motor mounting seat (321) and connected with the high-speed cam divider (323), a turret shaft (324) fixed on the working platform (30) along the longitudinal direction and connected with the high-speed cam divider (323), a turret disc (325) arranged on the turret shaft (324), and a plurality of nozzle modules (326) uniformly arranged at the periphery of the turret disc (325) in a ring shape at intervals.

4. The device for testing the S parameter of the RF chip type load carrier tape according to claim 1, wherein the first positioning module (33), the second positioning module (34), the third positioning module (36) and the fourth positioning module (39) have the same structure, and the first positioning module (33) comprises a first mounting base (331) fixed on the working table (30), a calibration base plate (333) arranged on the first mounting base (331), a second motor (332) fixed at the bottom of the calibration base plate (333) and having the top penetrating through the calibration base plate (333), a calibration guide base (334) arranged on the calibration base plate (333), four sliding grooves annularly and uniformly arranged on the calibration guide base (334) with the center of the calibration guide base (334) as the starting point, and a contour column mounting plate (335) arranged on the calibration guide base (334), the correcting claw modules (336) are arranged in the sliding grooves in a one-to-one correspondence manner and are rotationally matched with the second motor (332); the radio frequency chip type load is extruded between the correcting claw modules (336); the correcting claw module (336) is in a tightening state without the driving action of the second motor (332).

5. The device for testing the S parameters of the RF chip carrier tape according to claim 4, wherein a connection shaft (3321) is disposed in the calibration guide seat (334); the bottom of the connecting shaft (3321) is connected with a second motor (332); a tension correcting wheel (3322) is arranged at the top of the connecting shaft (3321); the correcting tension wheel (3322) is square in upward view;

the correcting claw module (336) comprises a correcting claw seat (3361) which is arranged in the sliding groove in a sliding mode, a bearing (3362) which is arranged in the correcting claw seat (3361) and matched with the correcting tension wheel (3322) in an extruding and sliding mode, and a correcting claw (3363) which is connected with the correcting claw seat (3361), arranged on the equal-height column mounting plate (335) and used for extruding and clamping the radio frequency chip type load.

6. The device for testing the S parameters of the radio frequency chip type load carrier tape according to claim 4, further comprising a sensor mounting seat (337) fixedly connected with the first mounting seat (331), a probe arranged on the sensor mounting seat (337) and activated by the action of the calibration claw module (336), and an optical fiber sensor (338) fixed on the first mounting seat (331) and connected with the probe.

7. The device for testing the S parameter of the radio frequency chip type load carrier tape according to claim 1 or 2, wherein the reversing module (35) comprises a second mounting seat (351) fixed on the working platform (30), a reversing seat (353) arranged on the second mounting seat (351), a third motor (352) arranged on the second mounting seat (351) and driving the reversing seat (353) to rotate, and a test fixture (354) arranged on the reversing seat (353) and used for clamping the radio frequency chip type load.

8. The device for testing the S parameter of the radio frequency chip type load carrier tape according to claim 1 or 2, wherein the shaping and reversing module (37) comprises a third mounting seat (371) fixed on the working platform (30), a fourth motor (372) fixed on the third mounting seat (371), a driving pulley (373) connected with the fourth motor (372), a driven pulley (374) arranged on the third mounting seat (371), a belt (375) connected between the driving pulley (373) and the driven pulley (374), a support base plate (376) arranged on the top of the driven pulley (374), and a rotary positioning module (377) arranged on the support base plate (376).

9. The device for testing the S parameters of the radio frequency chip type load carrier tape according to claim 1 or 2, wherein the test module (38) comprises a fourth mounting seat (381) fixed on the working table surface (30), and a rotary sliding table (382), an XY axis sliding table (383), a reversing seat (384) and a test circuit board (385) which are connected in sequence from bottom to top; the rotary sliding table (382) is arranged on a fourth mounting seat (381); and the radio frequency chip type load to be detected is placed in the flowing water on the test circuit board (385).

10. A method for testing S parameters of a radio frequency chip type load band is characterized in that a device for testing the S parameters of the radio frequency chip type load band according to any one of claims 1 to 14 is adopted, and the method comprises the following steps:

feeding by using a feeding disc;

the method comprises the following steps that a first motor and a high-speed lifting cam divider are utilized to drive a rotating tower disc to rotate, a suction nozzle module is utilized to adsorb a radio frequency chip type load to be detected to sequentially enter a first positioning module, a second positioning module, a reversing module, a third positioning module, a shaping and reversing module, a testing module and a fourth positioning module, and polarity identification and S parameter determination are carried out on the radio frequency chip type load to be detected;

and transmitting the detected radio frequency chip type load to a carrier tape mechanism, and carrying out material tape packaging and receiving.

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