CN114373876A - Display panel, preparation method of display panel and display device - Google Patents
Display panel, preparation method of display panel and display device Download PDFInfo
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- CN114373876A CN114373876A CN202111662559.7A CN202111662559A CN114373876A CN 114373876 A CN114373876 A CN 114373876A CN 202111662559 A CN202111662559 A CN 202111662559A CN 114373876 A CN114373876 A CN 114373876A
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- 238000002360 preparation method Methods 0.000 title claims abstract description 6
- 239000000758 substrate Substances 0.000 claims abstract description 230
- 239000000872 buffer Substances 0.000 claims abstract description 128
- 239000010410 layer Substances 0.000 claims description 81
- 238000000034 method Methods 0.000 claims description 12
- 239000002346 layers by function Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 239000004642 Polyimide Substances 0.000 claims description 2
- 230000005525 hole transport Effects 0.000 claims description 2
- 229920000058 polyacrylate Polymers 0.000 claims description 2
- 229920001721 polyimide Polymers 0.000 claims description 2
- 230000003139 buffering effect Effects 0.000 description 14
- 239000000463 material Substances 0.000 description 6
- 238000000059 patterning Methods 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 238000002372 labelling Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Electroluminescent Light Sources (AREA)
Abstract
The application provides a display panel, a preparation method of the display panel and a display device. The pixel limiting layer is arranged on one side of the first substrate, the supporting pieces are arranged on one side, away from the first substrate, of the pixel limiting layer, the supporting pieces are arranged at intervals, and at least one side, away from the pixel limiting layer, of each supporting piece is covered with the buffer structure. The second substrate is arranged on one side of the buffer structure, which is far away from the first substrate, and the surface of the second substrate, which faces the first substrate, is attached to the buffer structure. When the display panel is impacted, the buffer structure can absorb and diffuse the stress accumulated at the support. Therefore, the stress transmitted to the supporting part through the buffer structure can be reduced, the probability that the film layer covering the supporting part and positioned beside the supporting part is damaged can be reduced, and the problem of poor display of the display panel is further reduced.
Description
Technical Field
The present disclosure relates to the field of display technologies, and in particular, to a display panel, a method for manufacturing the display panel, and a display device.
Background
After an Organic Light Emitting Diode (OLED) Display panel is manufactured, a series of reliability tests are usually performed. In the testing process and the actual use process, the display panel is pressed to extrude the inside of the display panel, the display panel mainly comprises an upper substrate, a lower substrate, a support piece positioned between the two substrates and the like, and the support piece plays a supporting role to maintain the distance between the two substrates. Therefore, when display panel received the impact, support piece can receive the extrusion under the effect of pressure, if display panel dispersion that can not be timely and absorption because of the stress that the impact produced, lead to easily setting up in the rete of support piece side and take place the damage because of the stress is too big to display panel appearance appears and destroys or shows badly scheduling problem.
Disclosure of Invention
The application provides a display panel, a preparation method of the display panel and a display device, which can absorb partial stress so as to reduce damage to a film layer beside a support when the display panel is under the action of external pressure.
In a first aspect, the present application provides a display panel, comprising:
a first substrate;
a pixel defining layer disposed at one side of the first substrate;
the supporting pieces are arranged on one side, away from the first substrate, of the pixel limiting layer and are arranged at intervals, and at least one side, away from the pixel limiting layer, of at least part of the supporting pieces is covered with a buffer structure;
the second substrate is arranged on one side of the buffer structure, which is deviated from the first substrate, and the surface of the second substrate, which faces the first substrate, is attached to the buffer structure.
In a second aspect, the present application provides a method for manufacturing a display panel, including:
providing a first substrate, and forming a pixel defining layer on the surface of the first substrate;
forming a support on a surface of the pixel defining layer facing away from the first substrate;
providing a second substrate, and covering a buffer structure on the surface of the second substrate;
and butting the first substrate and the second substrate so as to enable the buffer structure to be attached to at least part of the support.
In a third aspect, the present application provides a method for manufacturing a display panel, comprising
Providing a first substrate, and forming a pixel defining layer on the surface of the first substrate;
forming a support on the pixel defining layer facing away from the first substrate surface;
forming a buffer structure on the surface of the support part, which faces away from the first substrate;
and providing a second substrate, and butting the first substrate and the second substrate so as to attach the buffer structure and the second substrate.
The application provides a display device comprising the display panel.
The display panel, the preparation method of the display panel and the display device provided by the application have the following beneficial effects: when the display panel is impacted, the buffer structure can absorb and diffuse the stress accumulated at the support. The stress transmitted to the supporting part through the buffer structure can be reduced, the probability that the film layer covering the supporting part and positioned beside the supporting part is damaged due to overlarge stress on the supporting part can be reduced, and the problem that the display panel has poor display is further reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments of the present application will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present application, and it is obvious for a person skilled in the art to obtain other drawings based on the drawings without any creative effort.
Fig. 1 is a cross-sectional view of a display panel according to an embodiment of the present application;
FIG. 2 is a cross-sectional view of a display panel according to an embodiment of the present application;
FIG. 3 is a cross-sectional view of a display panel according to an embodiment of the present application;
FIG. 4 is a cross-sectional view of a display panel according to an embodiment of the present application;
FIG. 5 is a cross-sectional view of a display panel according to an embodiment of the present application;
FIG. 6 is a cross-sectional view of a display panel including support posts of different heights according to an embodiment of the present application;
FIG. 7 is a cross-sectional view of a display panel including support posts of different heights according to another embodiment of the present application;
FIG. 8 is a cross-sectional view of a display panel of another embodiment of the present application;
FIG. 9 is a top view of a display panel according to another embodiment of the present application;
FIG. 10 is a top view of a display panel according to another embodiment of the present application;
fig. 11 is a cross-sectional view of a display panel of another embodiment of the present application;
fig. 12 is a top view of a display device according to an embodiment of the present application.
In the drawings, the drawings are not necessarily drawn to scale.
Description of the labeling:
10. a display panel; 11. a first substrate; 12. a pixel defining layer; 13. a support member; 131. a first support column; 132. a second support column; 14. a buffer structure; 141. a first buffer member; 142. a second buffer member; 143. a third buffer member; 144. a fourth buffer member; 15. a second substrate; 16. a functional layer; 100. a display device.
Detailed Description
Embodiments of the present application will be described in further detail below with reference to the drawings and examples. The following detailed description of the embodiments and the accompanying drawings are provided to illustrate the principles of the application and are not intended to limit the scope of the application, i.e., the application is not limited to the described embodiments.
In the description of the present application, it is to be noted that, unless otherwise specified, "a plurality" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," and the like, indicate an orientation or positional relationship that is merely for convenience in describing the application and to simplify the description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the application. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. "vertical" is not strictly vertical, but is within the tolerance of the error. "parallel" is not strictly parallel but within the tolerance of the error.
Reference in the specification to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the specification. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
The following description is given with the directional terms as they are used in the drawings and not intended to limit the specific structure of the present application. In the description of the present application, it is also to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present application can be understood as appropriate by one of ordinary skill in the art.
The present embodiment provides a display panel 10, as shown in fig. 1, the display panel 10 includes a first substrate 11, a pixel defining layer 12, a plurality of supporting members 13, and a second substrate 15. The pixel defining layer 12 is disposed on one side of the first substrate 11, the plurality of supporting members 13 are disposed on one side of the pixel defining layer 12 facing away from the first substrate 11, the plurality of supporting members 13 are disposed in an interval arrangement manner, and at least a portion of one side of the supporting members 13 facing away from the pixel defining layer 12 is covered with the buffer structure 14. And the second substrate 15 is arranged on one side of the buffer structure 14, which is far away from the first substrate 11, and the surface of the second substrate 15, which faces the first substrate 11, is attached to the buffer structure 14.
The display panel 10 is described below with reference to a specific embodiment.
In the embodiment shown in fig. 1, the display panel 10 includes a first substrate 11, a pixel defining layer 12, a support 13, and a second substrate 15 disposed from a thickness direction of the panel (from bottom to top). The pixel defining layer 12 may be disposed at intervals on a side of the first substrate 11 facing the second substrate 15, the number of the supporting members 13 is plural, the plural supporting members 13 are disposed on a side of the pixel defining layer 12 facing away from the first substrate 11, and a side of each supporting member 13 facing away from the pixel defining layer 12 may be covered with the buffer structure 14. The side of the buffer structure 14 facing away from the support 13 may be attached to a second substrate 15. That is, the first substrate 11 and the second substrate 15 are supported by the supports 13 by providing a plurality of supports 13 arranged at intervals between the first substrate 11 and the second substrate 15 to maintain the interval between the first substrate 11 and the second substrate 15.
When the display panel 10 is impacted, for example, by applying pressure to the second substrate 15, the supporting member 13 disposed between the first substrate 11 and the second substrate 15 is compressed, and because the supporting member 13 supports the first substrate 11 and the second substrate 15, the stress applied around the supporting member 13 is relatively greater than that applied to the remaining region. In this way, the films beside the supporting member 13 are also easily stressed, so that the films are damaged by the stress, and the display panel 10 is further affected. The buffer structure 14 disposed on the side of the support 13 facing the second substrate 15 can absorb and diffuse the stress accumulated at the support 13 through the buffer structure 14, so that the stress is transmitted to the support 13 after passing through the buffer structure 14, and the stress transmitted to the support 13 is smaller than the initial stress. Because the stress transmitted to the film layer near the support 13 is reduced, the influence of the stress on the film layer can be reduced, and the film layer is prevented from being damaged due to overlarge stress, so that the display panel has the problem of poor display. In addition, the supporting member 13 can be protected, so that the probability that the supporting member 13 is pressed down or crushed due to the excessive stress on the supporting member 13 and the problem that the appearance of the display panel 10 is damaged can be reduced.
It should be noted that the embodiment shown in fig. 1 only shows that a buffer structure 14 is provided on a side of each support 13 facing the second substrate 15. In some embodiments, it is also possible to provide the buffer structure 14 only on the side of the part of the support 13 facing the second substrate 15. That is, on the basis of not affecting the connection stability between the first substrate 11 and the second substrate 15, the probability of the indirect contact between the support 13 and the second substrate 15 is reduced, so that the probability of the film layer arranged on the support 13 and close to the second substrate 15 being pressed is reduced, and the film layer can be further protected.
The buffer structure 14 provided in the embodiment of the present application may be made of an organic polymer material such as polyacrylate or polyimide. The material hardness of the cured cushioning structure 14 is less than the material hardness of the support 13.
That is, the material of the support 13 and the material of the buffer structure 14 are made different. The supporting member 13 can be used for supporting the substrate and resisting the stress suddenly increased when the substrate is under pressure, and the buffer structure 14 can assist the supporting member 13 to absorb and diffuse the stress gathered on the supporting member 13, so that the buffer structure 14 prepared by adopting the above materials can play a better buffer effect and further reduce the stress, so that the stress borne by the film layer arranged at the supporting member 13 is smaller, namely the damage to the film layer arranged at the supporting member 13 is further reduced.
Of course, in some embodiments, the cushioning structure 14 and the support 13 may be made of the same material. Since the hardness of the supporting member 13 is less than that of the substrate and the supporting member 13 itself has a certain elasticity and plasticity, the buffer structure 14 having the same hardness as that of the supporting member 13 can reduce the damage of the stress to the film layer disposed at the supporting member 13.
As shown in fig. 2, in some embodiments, the buffer structure 14 is disposed in a full layer on the surface of the second substrate 15 facing the first substrate 11. In this embodiment, a side of the first substrate 11 is provided with a pixel defining layer 12, a side of the pixel defining layer 12 facing away from the first substrate 11 is provided with a plurality of supporting members 13 arranged at intervals, and a side of the supporting members 13 facing away from the first substrate 11 is provided with a second substrate 15. The surface of the second substrate 15 facing the first substrate 11 may cover the buffer structure 14 in a whole layer, that is, the buffer structure 14 may be attached to the support 13.
When the second substrate 15 is impacted, the stress generated by the buffer structure 14 can be rapidly diffused to reduce the pressure transmitted to the supporting member 13, so as to protect the supporting member 13 and the film layer covering the supporting member 13. In addition, the buffer structure 14 is provided only in the region of the second substrate 15 corresponding to the support 13, and the buffer structure 14 is entirely covered on the surface of the second substrate 15 facing the first substrate 11, so that the probability of the buffer structure 14 falling off from the support 13 can be reduced.
It will be appreciated that instead of providing the entire layer of buffer structure 14 on the surface of the second substrate 15, the buffer structure 14 may be provided in an entire layer on the surface of the first substrate 11 facing the second substrate 15.
By way of example, the embodiment shown in fig. 3 shows that the buffer structure 14 is provided in a full layer on the surface of the first substrate 11 facing the second substrate 15. In this embodiment, a side of the second substrate 15 is provided with a plurality of supporting members 13 arranged at intervals, a side of the plurality of supporting members 13 facing away from the second substrate 15 is provided with the first substrate 11, and a whole surface of the first substrate 11 facing the second substrate 15 is covered with the buffer structure 14.
When the first substrate 11 is under pressure, the buffer structure 14 can rapidly diffuse the pressure to reduce the pressure transmitted to the supporting member 13, so as to protect the supporting member 13 and the film layer covering the supporting member 13. Furthermore, the buffer structure 14 is entirely covered on the surface of the first substrate 11, so that the probability that the buffer structure 14 falls off from the support 13 can be reduced. In addition, when the surface of the support 13 facing the second substrate 15 is provided with a film layer such as an electrode layer, the side of the electrode layer away from the support 13 is covered with the buffer structure 14, so that the film layer such as a motor layer can be protected, and the probability of damage of the film layer under the action of stress is reduced.
It should be noted that, in an ideal state, the space formed by the first substrate 11, the second substrate 15 and the support 13 may be a vacuum. Of course, the vacuum region may be filled with the buffer structure 14. The embodiment shown in fig. 4 shows that the space formed by the first substrate 11, the second substrate 15 and the support 13 is completely filled with the buffer structure 14.
In order to reduce the influence of the buffer structure 14 on the transmittance of light, the buffer structure 14 may be modified.
Illustratively, in the embodiment shown in fig. 5, the display panel 10 includes a first substrate 11, a pixel defining layer 12 is disposed on one side of the first substrate 11, a plurality of supporting members 13 are disposed at intervals on one side of the pixel defining layer 12 facing away from the first substrate 11, and a second substrate 15 is disposed on one side of the supporting members 13 facing away from the first substrate 11. The surface of the second substrate 15 facing the first substrate 11 is provided with a buffer structure 14, and the buffer structure 14 is disposed in a region corresponding to the support 13, i.e. the buffer structure 14 and the support 13 may be in a one-to-one correspondence relationship.
Wherein the projection of the support 13 on the first substrate 11 is located within the projection of the buffer structure 14 on the first substrate 11. That is, the projected area of the buffer structure 14 on the first substrate 11 is larger than the projected area of the support 13 on the first substrate 11.
The buffer structure 14 is arranged in the area of the second substrate 15 corresponding to the support member 13, and the projection area of the buffer structure 14 is larger than that of the support member 13, so that not only the film layer covering the support member 13 can be prevented from directly contacting with the second substrate 15, but also the projection area of the buffer structure 14 is smaller than that of the support member 13, and the stress can be rapidly diffused. In addition, patterning the buffer structure 14 is facilitated to improve the light transmittance of the buffer structure 14 and reduce the light loss of the buffer structure 14.
In some embodiments, the height of the supporting member 13 may be adjusted to reduce stress on the supporting member 13 and the film covering the supporting member 13.
Illustratively, in the embodiment shown in fig. 6. The display panel 10 includes a first substrate 11, a pixel defining layer 12 is disposed on one side of the first substrate 11, and a plurality of supporting members 13 are disposed on one side of the pixel defining layer 12 facing away from the first substrate 11. The plurality of supporting members 13 may include a first supporting column 131 and a second supporting column 132, a height of the first supporting column 131 in a thickness direction of the display panel 10 is greater than a height of the second supporting column 132, the buffer structure 14 is disposed on a side of the first supporting column 131 departing from the first substrate 11, and a side of the buffer structure 14 departing from the first substrate 11 is further provided with a second substrate 15.
In this embodiment, the surface of the second substrate 15 facing the first substrate 11 and the buffer structure 14 are attached, and since the height of the first support column 131 is higher than that of the second support column 132, the first substrate 11 and the second substrate 15 are mainly supported by the first support column 131 having a higher height. The buffer structure 14 is disposed on a side of the first support column 131 facing the second substrate 15, so that when the second substrate 15 is impacted, the buffer structure 14 can absorb part of the stress, thereby reducing the stress on the film layer covering the first support column 131 facing the second substrate 15.
When the pressure to which the display panel 10 is subjected is small, the distance between the first substrate 11 and the second substrate 15 may be maintained mainly by the first support. When the pressure applied to the display panel 10 is large, the second supporting columns 132 also serve to support the first substrate 11 and the second substrate 15 as the first supporting columns 131.
In addition, there is a space between the second supporting columns 132 and the second substrate 15, that is, a certain distance between the second supporting columns 132 and the second substrate 15. Compared with the method that all the supporting columns are in contact with the second substrate 15 through the buffer structure 14, the number of the supporting columns in contact with the second substrate 15 can be reduced, so that the stress can be prevented from being directly transmitted to the second supporting columns 132 through the buffer structure 14, and the probability that the film layers covering the second supporting columns 132 are damaged under the action of the stress is reduced.
Of course, in some embodiments, the buffer structure 14 may also be disposed on the side of the second supporting pillar 132 facing the second substrate 15.
For example, in the embodiment shown in fig. 7. The buffering structure 14 includes a first buffering member 141 and a second buffering member 142, the first buffering member 141 is located on a side of the first supporting column 131 facing the second substrate 15, and the second buffering member 142 is located on a side of the second supporting column 132 facing the second substrate 15.
The first and second buffers 141 and 142 are respectively disposed on the sides of the first and second support pillars 131 and 132 facing the second substrate 15, and the sum of the heights of the first and second buffers 141 and 131 is equal to the sum of the heights of the second and second buffers 142 and 132. The connection stability between the first substrate 11 and the second substrate 15 is improved with respect to the case where the second cushion 142 is not provided between the second supporting columns 132 and the second substrate 15.
In addition, the second buffer 142 is disposed on the side of the second supporting pillar 132 facing the second substrate 15, so that the stress transmitted from the second substrate 15 to the second supporting pillar 132 can be buffered, and the second supporting pillar 132 and the film layer covering the second supporting pillar 132 and facing the second substrate 15 can be protected.
The arrangement of the second supporting columns 132 and the first supporting columns 131 can be determined according to actual conditions.
In some embodiments, the second supporting pillars 132 may be distributed mainly on the periphery of the display panel 10. It is understood that, the second supporting pillars 132 may be mainly distributed in the frame region of the display panel 10 by dividing the display panel 10 into the display region and the frame region. Because the pressure applied to the frame region of the display panel 10 is relatively small, and the frame region is further provided with frame sealing glue, the frame sealing glue and the second supporting pillars 132 can support the first substrate 11 and the second substrate 15 together. The first supporting pillars 131 may be mainly distributed in the display region of the display panel 10, i.e., the middle portion of the display panel 10, for bearing a larger pressure. With this arrangement, the probability of deformation of the substrate of the display panel 10 can be reduced.
Of course, the first support column 131 and the second support column 132 may be arranged in other manners. For example, a row of first support columns 131 is provided on the first substrate 11, a row of second support sections is provided, and so on. Alternatively, a plurality of rows of the supporting columns may be disposed on the first substrate 11, each row may be disposed in a manner that the first supporting columns 131 and the second supporting columns 132 are arranged in a crossing manner, and so on, which is not illustrated herein.
Furthermore, a buffer structure 14 may be used to replace a part of the supporting member 13, so as to reduce the pressure applied to the supporting member 13.
In the embodiment shown in fig. 8, the cushioning structure 14 includes a third dampener 143 and a fourth dampener 144. A pixel limiting layer 12 is arranged on one side of the first substrate 11, a plurality of supporting pieces 13 arranged at intervals are arranged on one side, facing the second substrate 15, of the pixel limiting layer 12, the third buffering piece 143 is located on one side, facing away from the first substrate 11, of the supporting pieces 13, one side of the fourth buffering piece 144 is attached to the pixel limiting layer 12, the other side of the fourth buffering piece 144 is attached to the second substrate 15, and the height of the fourth buffering piece 144 is equal to the sum of the heights of the third buffering piece 143 and the supporting pieces 13.
The fourth cushion member 144 is disposed between the first substrate 11 and the second substrate 15, and a portion of the supporting member 13 is replaced with the fourth cushion member 144. The number of the supporting members 13 can be reduced without affecting the stability of the connection between the first substrate 11 and the second substrate 15, so that the influence of stress on the supporting members 13 can be reduced, and the supporting members 13 can be protected.
The fourth buffer member 144 is also configured to protect the film layer beside the fourth buffer member 144, that is, the fourth buffer member 144 buffers the stress generated when the substrate is impacted, so as to reduce the influence of the stress on the film layer beside the fourth buffer member 144.
There may be various arrangements of the fourth cushion 144 and the supporter 13.
For example, referring to fig. 8 and 9, in some embodiments, the surface of the first substrate 11 is provided with a plurality of supporting members 13 and a plurality of fourth buffering members 144 arranged at intervals along a first direction, the plurality of supporting members 13 and the plurality of fourth buffering members 144 are arranged in a staggered manner along a second direction, and the first direction and the second direction intersect each other.
The fourth cushion member 144 is made of a soft material, and has a bearing capacity smaller than that of the first substrate 11 and the second substrate 15. Therefore, the supporting members 13 and the fourth cushion members 144 are arranged in a cross-offset manner, so that the density of the supporting members 13 can be further reduced on the basis of not affecting the connection stability between the first substrate 11 and the second substrate 15, and the risk of crushing the film covering the supporting members 13 is reduced.
It is understood that fig. 9 only shows one arrangement of the supporting member 13 and the fourth buffering member 144, and the supporting member 13 and the fourth buffering member 144 may be arranged in other ways as long as the connection stability between the first substrate 11 and the second substrate 15 is not affected, and is not particularly limited herein.
As shown in fig. 10, in some embodiments, the density of the support members 13 disposed around the contour of the first substrate 11 is greater than the density of the support members 13 disposed in the middle of the first substrate 11. That is, more support members 13 may be disposed on the periphery of the first substrate 11, and the support members 13 may be arranged more densely. Fewer supports 13 are provided in the middle of the first substrate 11 with respect to the periphery of the first substrate 11, and the arrangement of the supports 13 in the middle of the first substrate 11 is made sparse. In this way, the number of the supporting members 13 can be reduced without affecting the stability of the connection between the first substrate 11 and the second substrate 15, thereby reducing the risk of the film covering the supporting members 13 being crushed.
When the density of the supporting members 13 is set, the density of the supporting members 13, that is, the number of the supporting members 13 may be adjusted according to whether the fourth cushion member 144 is provided or not. The density of the supporting members 13 may be 1/50-1/5. In this way, the number of the supporting members 13 can be further reduced, thereby reducing the possibility of damage to the supporting members 13.
As shown in fig. 11, in some embodiments, a functional layer 16 is further disposed between the support 13 and the buffer structure 14, and the functional layer 16 may include an electron transport layer, a hole transport layer, an electrode layer, and the like along the thickness direction of the display panel 10. It should be noted that the functional layer 16 is not limited to the film layer included in this embodiment. In the embodiment shown in fig. 11, the supporting member 13 is disposed on a side of the first substrate 11 facing the second substrate 15, and then a film layer such as an electrode layer is disposed on a side of the supporting member 13 facing away from the first substrate 11. The supporting piece 13 is arranged firstly, and then the electrode layers and other films are arranged, so that the electrode layers and other films can be effectively prevented from being scratched in the process. And set up buffer structure 14 in one side that the electrode layer deviates from support piece 13, usable buffer structure 14 absorbs and spreads the stress that produces when receiving the impact to the panel, avoids a large amount of stresses to transmit retes such as electrode layer to cause the damage to these retes.
The embodiment of the present application further provides a method for manufacturing a display panel 10, including providing a first substrate 11, and forming a pixel defining layer 12 on a surface of the first substrate 11; forming a support 13 on a surface of the pixel defining layer 12 facing away from the first substrate 11; providing a second substrate 15, and covering a buffer structure 14 on the surface of the second substrate 15; finally, the first substrate 11 and the second substrate 15 are abutted to make the buffer structure 14 and at least part of the support 13 attached.
The buffer structure 14 can be covered on the whole surface of the second substrate 15 by the buffer structure 14 through an inkjet printing mode, so that the buffer structure 14 can be more uniformly covered on the second substrate 15, light passing through the second substrate 15 can be more uniformly emitted, and patterning processing of the buffer structure 14 is not needed.
The embodiment of the present application further provides another method for manufacturing a display panel 10, including providing a first substrate 11, and forming a pixel defining layer 12 on a surface of the first substrate 11; forming a support 13 on a surface of the pixel defining layer 12 facing away from the first substrate 11; forming a buffer structure 14 on a surface of the support 13 facing away from the first substrate 11; a second substrate 15 is provided, and the first substrate 11 and the second substrate 15 are butted to bond the buffer structure 14 and the second substrate 15.
The buffer structure 14 may be covered on the surface of the corresponding support 13 by an exposure and development process, so as to perform a patterning process on the buffer structure 14, thereby improving the light transmittance of the buffer structure 14.
In addition, an embodiment of the present application further provides a display device 100, as shown in fig. 12, the display device 100 includes the above-mentioned display panel 10. The above embodiments can be referred to with respect to the specific structure of the display panel 10 of the display device 100. Since the display device 100 adopts all technical solutions of all the embodiments, at least all the advantages brought by the technical solutions of the embodiments are achieved, and no further description is provided herein.
While the present application has been described with reference to preferred embodiments, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the present application, and in particular, features shown in the various embodiments may be combined in any manner as long as there is no structural conflict. The present application is not intended to be limited to the particular embodiments disclosed herein but is to cover all embodiments that may fall within the scope of the appended claims.
Claims (15)
1. A display panel, comprising:
a first substrate;
a pixel defining layer disposed at one side of the first substrate;
the supporting pieces are arranged on one side, away from the first substrate, of the pixel limiting layer and are arranged at intervals, and at least one side, away from the pixel limiting layer, of at least part of the supporting pieces is covered with a buffer structure;
the second substrate is arranged on one side of the buffer structure, which is deviated from the first substrate, and the surface of the second substrate, which faces the first substrate, is attached to the buffer structure.
2. The display panel according to claim 1, wherein the buffer structure is disposed in a whole layer on a surface of the second substrate facing the first substrate.
3. The display panel according to claim 1, wherein the buffer structure is disposed in a whole layer on a surface of the first substrate facing the second substrate.
4. The display panel according to claim 1, wherein the buffer structure is located on a surface of the second substrate facing the first substrate in a region corresponding to the support, and a projection of the support on the first substrate is located within a projection of the buffer structure on the first substrate.
5. The display panel according to claim 1, wherein the plurality of supporting members comprise a first supporting column and a second supporting column, a height of the first supporting column in a thickness direction of the display panel is greater than a height of the second supporting column, and the buffer structure is disposed on a side of the first supporting column facing the second substrate.
6. The display panel according to claim 5, wherein the buffer structure comprises a first buffer member and a second buffer member, the first buffer member is located on a side of the first support column facing the second substrate, the second buffer member is located on a side of the second support column facing the second substrate, and a sum of heights of the first buffer member and the first support column is equal to a sum of heights of the second buffer member and the second support column.
7. The display panel of claim 1, wherein the buffer structure comprises a third buffer member and a fourth buffer member, the third buffer member is located on a side of the supporting member away from the first substrate, a side of the fourth buffer member is attached to the pixel defining layer, another side of the fourth buffer member is attached to the second substrate, and a height of the fourth buffer member is equal to a sum of heights of the third buffer member and the supporting member.
8. The display panel according to claim 7, wherein the surface of the first substrate is provided with a plurality of the supporting members and a plurality of the fourth buffer members arranged at intervals along a first direction, the plurality of the supporting members and the plurality of the fourth buffer members are arranged in a staggered manner along a second direction, and the first direction intersects with the second direction.
9. The display panel according to claim 1, wherein the support members are disposed around the contour of the first substrate at a density greater than that of the support members disposed in the middle of the first substrate.
10. The display panel of claim 1, wherein the density of the support members is in the range of 1/50-1/5.
11. The display panel according to claim 1, wherein the buffer structure is made of polyacrylate or polyimide.
12. The display panel according to claim 1, wherein a functional layer is further disposed between the supporting member and the buffer structure, and the functional layer includes an electron transport layer, a hole transport layer, and an electrode layer in a thickness direction of the display panel.
13. A method for manufacturing a display panel, comprising:
providing a first substrate, and forming a pixel defining layer on the surface of the first substrate;
forming a support on a surface of the pixel defining layer facing away from the first substrate;
providing a second substrate, and covering a buffer structure on the surface of the second substrate;
and butting the first substrate and the second substrate so as to enable the buffer structure to be attached to at least part of the support.
14. The preparation method of the display panel is characterized by comprising the following steps
Providing a first substrate, and forming a pixel defining layer on the surface of the first substrate;
forming a support on the pixel defining layer facing away from the first substrate surface;
forming a buffer structure on the surface of the support part, which faces away from the first substrate;
and providing a second substrate, and butting the first substrate and the second substrate so as to attach the buffer structure and the second substrate.
15. A display device, comprising: a display panel as claimed in any one of claims 1 to 12.
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