CN114373729B - Microchannel heat abstractor capable of intelligently adjusting chip temperature - Google Patents
Microchannel heat abstractor capable of intelligently adjusting chip temperature Download PDFInfo
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- CN114373729B CN114373729B CN202111676071.XA CN202111676071A CN114373729B CN 114373729 B CN114373729 B CN 114373729B CN 202111676071 A CN202111676071 A CN 202111676071A CN 114373729 B CN114373729 B CN 114373729B
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- 229910001285 shape-memory alloy Inorganic materials 0.000 claims abstract description 79
- 230000017525 heat dissipation Effects 0.000 claims abstract description 58
- 239000012809 cooling fluid Substances 0.000 claims abstract description 39
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 238000009413 insulation Methods 0.000 claims abstract description 15
- 230000000694 effects Effects 0.000 claims abstract description 13
- 230000008859 change Effects 0.000 claims abstract description 9
- 230000001105 regulatory effect Effects 0.000 claims abstract description 4
- 238000011084 recovery Methods 0.000 claims description 5
- 238000003754 machining Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 description 4
- 239000012530 fluid Substances 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 230000006698 induction Effects 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 229910001000 nickel titanium Inorganic materials 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The application relates to the technical field of micro-channel heat dissipation devices, and provides a micro-channel heat dissipation device capable of intelligently adjusting the temperature of a chip, which is convenient for automatically adjusting different heat dissipation effects according to the uneven distribution of the heat of the chip, and comprises a heat dissipation substrate, a heat insulation wire and a temperature control memory alloy spring, wherein a cooling fluid inlet, a cooling fluid outlet and a plurality of micro-channels are arranged on the heat dissipation substrate; the cooling fluid inlet and the cooling fluid outlet are respectively and oppositely arranged at two ends of the heat dissipation substrate and are respectively communicated with the micro-channels; the temperature control memory alloy spring is accommodated in the micro-channel, and two ends of the temperature control memory alloy spring are fixedly connected with the radiating substrate through the heat insulation wires respectively; the temperature control memory alloy spring is sequentially provided with at least two gradients along the flowing direction of the cooling fluid; the pitch of the temperature control memory alloy spring is changed along with the change of the temperature in the micro-channel, and the flow speed of cooling fluid in the micro-channel is regulated so as to regulate and control the heat dissipation effect of the heat dissipation device.
Description
Technical Field
The application relates to the technical field of micro-channel heat dissipation devices, in particular to a micro-channel heat dissipation device capable of intelligently adjusting the temperature of a chip.
Background
In industry, power and electronic components tend to develop in high power consumption and miniaturization, the number of transistors per unit volume of a chip is increased, and the heat flux density of the chip is increased. Excessive temperatures severely impact the performance and reliability of microelectronic systems and have become one of the major problems facing the electronics industry. A significant part of the thermal failures of electronic systems are due to non-uniform temperature distribution on the chip surface, and the cause of this phenomenon can be attributed to two points: 1. the temperature of the cooling fluid gradually increases along with the flow path, and the cooling capacity of the rear end of the flow path is insufficient; 2. the working environment of the electronic element is greatly changed, local heat is easy to generate, and the local heat flux at the flow path can reach 10 times of the whole heat flux.
The microchannel heat sink has the characteristics of light weight, compact structure, high heat transfer efficiency and the like, and is widely applied to microelectronic systems. However, conventional microchannel heat sinks are often designed to achieve only a single, fixed heat exchange effect. When the working environment of the electronic chip changes, the cooling capacity of the heat dissipating device needs to be changed to ensure the normal operation of the electronic chip, and the traditional micro-channel heat dissipating device cannot be intelligently matched with the change of the heat dissipating requirement.
One possible method is to monitor and feed back the temperature distribution of the electronic chip in real time by installing a sensing device, and then manually apply an additional energy field to adjust the heat dissipation capability. Therefore, the design of the intelligent micro-communication heat dissipation device capable of adaptively adjusting the heat dissipation capacity at different positions according to the degree of uneven distribution of the heat of the chip has great significance.
Disclosure of Invention
In order to improve temperature uniformity and facilitate automatic adjustment of different heat dissipation effects according to uneven distribution of chip heat, the application provides a micro-channel heat dissipation device capable of intelligently adjusting chip temperature. The following technical scheme is adopted:
A micro-channel heat dissipation device capable of intelligently adjusting the temperature of a chip comprises a heat dissipation substrate, a heat insulation wire and a temperature control memory alloy spring, wherein a cooling fluid inlet, a cooling fluid outlet and a plurality of micro-channels are arranged on the heat dissipation substrate;
the cooling fluid inlet and the cooling fluid outlet are respectively and oppositely arranged at two ends of the heat dissipation substrate and are respectively communicated with the micro-channels;
the temperature control memory alloy spring is accommodated in the micro-channel, and two ends of the temperature control memory alloy spring are fixedly connected with the radiating substrate through the heat insulation wires respectively;
the temperature control memory alloy spring is sequentially provided with at least two gradients along the flowing direction of the cooling fluid;
The pitch deformation and recovery capacity of the temperature control memory alloy spring are gradually increased along the gradient;
the pitch of the temperature control memory alloy spring is changed along with the change of the temperature in the micro-channel, and the flow speed of cooling fluid in the micro-channel is regulated so as to regulate and control the heat dissipation effect of the heat dissipation device.
Optionally, the gradient of the temperature control memory alloy spring is a plurality of openings formed by laser or electrochemical machining, and the openings are uniformly arranged along the circumferential direction.
Optionally, the gradient includes providing a first gradient, a second gradient, and a third gradient;
The number of the openings of the first gradient is 5-7, the number of the openings of the second gradient is 2-4, and the number of the openings of the third gradient is 0-1.
Optionally, the plurality of micro-channels are arranged on the heat dissipation substrate at equal intervals;
The temperature control memory alloy spring is coaxially or eccentrically arranged with the micro-channel.
Optionally, the temperature control memory alloy springs in two adjacent micro-channels are connected through a thermal insulation wire.
Optionally, the cross section of the micro-channel is round or rectangular.
Alternatively, the temperature-controlled memory alloy spring cross-sectional shape includes, but is not limited to, circular, rectangular, or triangular.
Optionally, the heat dissipation substrate is provided with a threaded hole, and the heat insulation wire is fixedly connected with the heat dissipation substrate through a screw.
Optionally, the degree of pitch deformation of the temperature-controlled memory alloy spring is proportional to the temperature difference.
In summary, the application has the following beneficial effects:
1. The temperature control memory alloy spring is adopted, the pitch of the temperature control memory alloy spring is changed along with the change of the temperature in the micro-channel, the self-adaptive change of the internal structure of the electronic chip can be realized without a sensor and an external control system, different heat dissipation effects can be automatically adjusted according to the uneven distribution of the heat of the chip, the heat is eliminated, and the temperature uniformity is improved.
2. The temperature control memory alloy spring is provided with a gradient structure, so that the pitch deformation and the recovery capacity of the temperature control memory alloy spring are distributed in a gradient manner, the self-adaptive shape change of the local memory alloy spring and the interaction among the gradient memory alloy springs can cool local heat of the chip, and the temperature uniformity of the chip is improved.
3. When the local heat distributed randomly on the chip or the temperature is too high, the temperature control memory alloy spring in the area of the chip can shrink, so that the pitch is reduced, the turbulence in the area is enhanced, the flow speed of the cooling fluid flowing through the area is increased due to the reduced pitch of the temperature control memory alloy spring, the flow speed of the cooling fluid is increased, the heat dissipation effect is enhanced, and the temperature of the area is reduced.
Drawings
FIG. 1 is a schematic view of the overall structure of the present embodiment;
FIG. 2 is a cross-sectional view at A-A of FIG. 1;
FIG. 3 is a schematic diagram of a temperature-controlled memory alloy spring according to an embodiment of the present invention;
FIG. 4 is a graph showing the time-restoring force of a temperature-controlled memory alloy coil under the same current excitation in an embodiment of the present invention.
Reference numerals illustrate: 1. a heat-dissipating substrate; 2. a screw; 3. a cooling fluid inlet; 4. a microchannel; 5. a temperature control memory alloy spring; 51. a first gradient; 52. a second gradient; 53. a third gradient; 6. a thermally insulating wire; 7. a cooling fluid outlet; 8. an opening.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention; it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments, and that all other embodiments obtained by persons of ordinary skill in the art without making creative efforts based on the embodiments in the present invention are within the protection scope of the present invention.
In the description of the present invention, it should be noted that the positional or positional relationship indicated by the terms such as "upper", "lower", "inner", "outer", "top/bottom", etc. are based on the positional or positional relationship shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, unless explicitly specified and limited otherwise, the terms "mounted," configured to, "" engaged with, "" connected to, "and the like are to be construed broadly, and may be, for example," connected to, "wall-mounted," connected to, removably connected to, or integrally connected to, mechanically connected to, electrically connected to, directly connected to, or indirectly connected to, through an intermediary, and may be in communication with each other between two elements, as will be apparent to those of ordinary skill in the art, in view of the detailed description of the terms herein.
The application is described in further detail below with reference to fig. 1-4.
The embodiment of the application discloses a micro-channel heat dissipation device capable of intelligently adjusting the temperature of a chip, which comprises a heat dissipation substrate 1, a heat insulation wire 6 and a temperature control memory alloy spring 5, wherein a cooling fluid inlet 3, a cooling fluid outlet 7 and a plurality of micro-channels 4 are arranged on the heat dissipation substrate 1, the cooling fluid inlet 3 and the cooling fluid outlet 7 are respectively and oppositely arranged at two ends of the heat dissipation substrate 1 and are respectively communicated with the micro-channels 4, and cooling fluid can circulate in the micro-channels 4 and is used for dissipating heat of the heat dissipation substrate 1.
Preferably, the cooling fluid inlet 3 and the cooling fluid outlet 7 are symmetrically arranged at two ends of the heat dissipation substrate 1 in the length direction and extend along the width direction of the heat dissipation substrate 1, the micro channels 4 are arranged in an array, the micro channels 4 are equidistantly arranged on the heat dissipation substrate 1, and the micro channels 4 are arranged at intervals along the width direction of the heat dissipation substrate 1.
Each micro-channel 4 is internally provided with a temperature control memory alloy spring 5, the temperature control memory alloy springs 5 in two adjacent micro-channels 4 are connected through a thermal insulation wire 6, the temperature control memory alloy springs 5 at the inlets and outlets at the two ends of the micro-channels 4 are fixedly connected with a heat dissipation substrate 1 through the thermal insulation wire 6, the heat dissipation substrate 1 is provided with a threaded hole, and the thermal insulation wire 6 is fixedly connected with the heat dissipation substrate 1 through a screw 2.
Preferably, the temperature control memory alloy spring 5 and the micro-channel 4 can be coaxially or eccentrically installed, the cross-section of the micro-channel 4 is round or rectangular, and the cross-section of the temperature control memory alloy spring 5 includes, but is not limited to, round, rectangular or triangular.
In this embodiment, the temperature control memory alloy spring 5 and the micro-channel 4 are coaxially installed, the micro-channel 4 has a rectangular cross section, and the length, width and height of the micro-channel are 40mm,202mm and 3mm respectively.
The material of the temperature control memory alloy spring 5 is preferably NiTi alloy, the initial deformation temperature is 20 ℃, the section of the temperature control memory alloy spring 5 is round, the wire diameter is 0.15mm, the outer diameter is 1.5mm, the coil length is 12mm, and as simple replacement of the embodiment, the material and the shape of the temperature control memory alloy coil 5 can be different, and the temperature control memory alloy coil 5 can be correspondingly arranged according to actual conditions, so that the best heat dissipation effect is achieved.
In addition to the fact that the degree of restoring force and pitch deformation of the temperature-controlled memory alloy spring 5 is proportional to the temperature, the shape restoring force of the temperature-controlled memory alloy spring 5 is related to the shape of the coil, the finer the wire diameter of the temperature-controlled memory alloy spring 5 of the same material is, the smaller the degree of shape restoring force and pitch deformation is, as shown in fig. 4, the time is on the abscissa, the deformation restoring force is on the ordinate, the Laser processing means the Laser processed temperature-controlled memory alloy spring 5, the Smooth surface means the untreated temperature-controlled memory alloy spring 5 is longer under the same current excitation, the higher the temperature is, the temperature-controlled memory alloy spring 5 starts to deform as the temperature rises, as shown in fig. 4, the untreated temperature-controlled memory alloy spring 5 is strong in temperature induction, the elasticity is high, the deformation restoring force is strong, the Laser processed temperature-controlled memory alloy spring 5 is weak in temperature induction, the elasticity is reduced, and the deformation force is weak.
Therefore, on the same temperature control memory alloy spring 5, changing the wire diameter in the length direction can influence the temperature induction and the self elastic force and deformation restoring force, and the wire diameter in the length direction is in gradient distribution, so that the gradient distribution of the shape restoring force and the degree of pitch deformation can be realized, the pitch change of the temperature control memory alloy spring 5 can influence the flow velocity of cooling fluid, the smaller the pitch, the stronger the turbulence effect and the larger the flow velocity.
The temperature control memory alloy spring 5 is sequentially provided with at least two gradients along the flowing direction of the cooling fluid, the pitch deformation and the recovery capacity of the temperature control memory alloy spring 5 gradually increase along the gradients, the gradients of the temperature control memory alloy spring 5 are a plurality of openings 8 formed by laser or electrochemical machining, and the plurality of openings 8 are uniformly arranged along the circumferential direction.
As shown in fig. 3, preferably, the gradient structure of the temperature-controlled memory alloy spring 5 includes alloy springs sequentially provided with a first gradient 51, a second gradient 52 and a third gradient 53 along the flowing direction of the cooling fluid so as to form multiple sections of different deformation and restoring forces, the number of openings of the first gradient 51 is 5-7, the number of openings of the second gradient 52 is 2-4, the number of openings of the third gradient 53 is 0-1, the first gradient 51, the second gradient 52 and the third gradient 53 can be equidistantly arranged or non-equidistantly arranged, and the first gradient, the second gradient 52 and the third gradient 53 can be correspondingly arranged according to practical situations, so that the best heat dissipation effect is ensured.
In this embodiment, the number of openings of the first gradient 51 is 6, the number of openings of the second gradient 52 is 3, the number of openings of the third gradient 53 is 0, and the pitch deformation and recovery capacities of the temperature-controlled memory alloy spring 5 are gradually increased along the first gradient 51, the second gradient 52 and the third gradient 53, and the first gradient 51, the second gradient 52 and the third gradient 53 are equidistantly arranged, that is, l51=l52=l53=12 mm.
Preferably, the material of the thermal insulation wire 6 is glass fiber, and the wire diameter is 0.1mm, so as to connect the temperature control memory alloy spring 5 and fix the same on the heat dissipation device substrate 4, thereby keeping the total length of the multi-stage temperature control memory alloy spring 5 unchanged, namely keeping l51+l52+l53=36 mm.
In the initial situation, the temperature control memory alloy spring 5 has certain pre-deformation under the pre-stress effect, and as the heat of the chip increases, the temperature of the cooling fluid gradually increases along the flowing direction of the cooling fluid, a certain temperature gradient is formed, and especially the temperature of the cooling fluid at the rear end of the flow path can reach a higher temperature.
Under the action of the temperature gradient, the temperature control memory alloy spring 5 can generate secondary deformation, the pitch is gradually reduced by the first gradient 51, the second gradient 52 and the third gradient 53, the pitch is reduced, the fluid disturbance in the area of the micro-channel 4 is aggravated, the flow velocity is increased, and the flow velocity of cooling fluid in the micro-channel 4 is regulated so as to regulate and control the heat dissipation effect of the heat dissipation device.
The temperature field in the micro-channel 4 changes, so that the temperature of the temperature control memory alloy spring 5 changes, the restoring force of the temperature control memory alloy spring 5 changes, and the balance of forces among the multi-section temperature control memory alloy springs 5 is broken; under the interaction of force, the length of the temperature control memory alloy spring 5 is changed, the temperature control memory alloy spring 5 with higher temperature is contracted, and the temperature control memory alloy spring 5 with lower temperature is stretched; as the length of the temperature control memory alloy spring 5 changes, the temperature of the spring itself will also change until a new equilibrium is reached.
The working process is as follows: when the random distribution of local heat occurs on the chip, the pitch of the temperature control memory alloy springs 5 in the local heat area is reduced, the fluid disturbance in the area is aggravated, the flow speed of cooling fluid is increased, and the heat dissipation capacity is enhanced, so that the temperature of the local heat is reduced; meanwhile, as the total length of the multi-section temperature control memory alloy springs 5 in the micro-channel 4 is a constant value, when the pitch of the temperature control memory alloy springs 5 in the area with high heat quantity is reduced and the length is shortened, the pitch of the temperature control memory alloy springs 5 in the area without high heat quantity is increased, the fluid disturbance is weakened, the flow speed of the cooling fluid is reduced, and the heat dissipation capacity is reduced.
The above embodiments are not intended to limit the scope of the present application, so: all equivalent changes in structure, shape and principle of the application should be covered in the scope of protection of the application.
Claims (6)
1. Micro-channel heat abstractor capable of intelligently adjusting chip temperature is characterized in that: the heat dissipation device comprises a heat dissipation substrate, a heat insulation wire and a temperature control memory alloy spring, wherein a cooling fluid inlet, a cooling fluid outlet and a plurality of micro channels are arranged on the heat dissipation substrate; the cooling fluid inlet and the cooling fluid outlet are respectively and oppositely arranged at two ends of the heat dissipation substrate and are respectively communicated with the micro-channels; the temperature control memory alloy spring is accommodated in the micro-channel, and two ends of the temperature control memory alloy spring are fixedly connected with the radiating substrate through the heat insulation wires respectively; the temperature control memory alloy spring is sequentially provided with at least two gradients along the flowing direction of the cooling fluid; the pitch deformation and recovery capacity of the temperature control memory alloy spring are gradually increased along the gradient; the pitch of the temperature control memory alloy spring is changed along with the change of the temperature in the micro-channel, and the flow speed of cooling fluid in the micro-channel is regulated so as to regulate and control the heat dissipation effect of the heat dissipation device; the gradient of the temperature control memory alloy spring is a plurality of openings formed by laser or electrochemical machining, and the openings are uniformly arranged along the circumferential direction; the gradient comprises a first gradient, a second gradient and a third gradient; the number of the openings of the first gradient is 5-7, the number of the openings of the second gradient is 2-4, and the number of the openings of the third gradient is 0-1; the pitch deformation degree of the temperature control memory alloy spring is proportional to the temperature difference.
2. The micro-channel heat dissipation device capable of intelligently adjusting the temperature of a chip according to claim 1, wherein: the micro-channels are arranged on the heat dissipation substrate at equal intervals; the temperature control memory alloy spring is coaxially or eccentrically arranged with the micro-channel.
3. The micro-channel heat dissipation device capable of intelligently adjusting the temperature of a chip according to claim 2, wherein: and the temperature control memory alloy springs in two adjacent micro-channels are connected through a thermal insulation wire.
4. A microchannel heat sink capable of intelligently adjusting the temperature of a chip according to claim 3, wherein: the section of the micro-channel is round or rectangular.
5. The micro-channel heat dissipation device capable of intelligently adjusting the temperature of a chip according to claim 4, wherein: the temperature control memory alloy spring cross-sectional shape includes, but is not limited to, circular, rectangular, or triangular.
6. The micro-channel heat dissipation device capable of intelligently adjusting the temperature of a chip according to claim 1, wherein: the heat dissipation substrate is provided with a threaded hole, and the heat insulation wire is fixedly connected with the heat dissipation substrate through a screw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111676071.XA CN114373729B (en) | 2021-12-31 | 2021-12-31 | Microchannel heat abstractor capable of intelligently adjusting chip temperature |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111676071.XA CN114373729B (en) | 2021-12-31 | 2021-12-31 | Microchannel heat abstractor capable of intelligently adjusting chip temperature |
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| CN114373729A CN114373729A (en) | 2022-04-19 |
| CN114373729B true CN114373729B (en) | 2024-06-25 |
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Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2260193A (en) * | 1991-10-04 | 1993-04-07 | Memory Metals Limited | Shaped memory devices |
| WO2012020453A1 (en) * | 2010-08-10 | 2012-02-16 | Empire Technology Development Llc | Improved fluid cooling |
| US20120213969A1 (en) * | 2011-02-18 | 2012-08-23 | Syracuse University | Functionally Graded Shape Memory Polymer |
| CA2906160C (en) * | 2013-03-15 | 2021-10-19 | Vecarius, Inc. | Thermoelectric device |
| CN111664727A (en) * | 2020-05-14 | 2020-09-15 | 厦门大学 | Micro-channel heat exchanger capable of actively enhancing heat exchange without external energy field effect |
| CN112151478B (en) * | 2020-08-31 | 2022-11-11 | 中国石油大学(华东) | Micro-channel radiator and preparation method and application thereof |
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- 2021-12-31 CN CN202111676071.XA patent/CN114373729B/en active Active
Non-Patent Citations (2)
| Title |
|---|
| 基于流体管道冷却的SMA柔性驱动器设计与实验;苏夏;董二宝;许旻;杨杰;;机电一体化;20160915(09);全文 * |
| 弹热制冷技术的发展现状与展望;钱苏昕;袁丽芬;晏刚;鱼剑琳;;制冷学报;20180129(01);全文 * |
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