CN114369361A - Insulating PI membrane material - Google Patents
Insulating PI membrane material Download PDFInfo
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- CN114369361A CN114369361A CN202111675478.0A CN202111675478A CN114369361A CN 114369361 A CN114369361 A CN 114369361A CN 202111675478 A CN202111675478 A CN 202111675478A CN 114369361 A CN114369361 A CN 114369361A
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- polyimide
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- 239000000463 material Substances 0.000 title abstract description 12
- 239000012528 membrane Substances 0.000 title description 5
- 239000002105 nanoparticle Substances 0.000 claims abstract description 29
- 239000002904 solvent Substances 0.000 claims abstract description 20
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 claims abstract description 17
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 claims abstract description 17
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims abstract description 17
- REYJJPSVUYRZGE-UHFFFAOYSA-N Octadecylamine Chemical compound CCCCCCCCCCCCCCCCCCN REYJJPSVUYRZGE-UHFFFAOYSA-N 0.000 claims abstract description 17
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 claims abstract description 16
- JVERADGGGBYHNP-UHFFFAOYSA-N 5-phenylbenzene-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C=2C=CC=CC=2)=C1C(O)=O JVERADGGGBYHNP-UHFFFAOYSA-N 0.000 claims abstract description 16
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims abstract description 16
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000001506 calcium phosphate Substances 0.000 claims abstract description 16
- 229910000389 calcium phosphate Inorganic materials 0.000 claims abstract description 16
- 235000011010 calcium phosphates Nutrition 0.000 claims abstract description 16
- 229920001515 polyalkylene glycol Polymers 0.000 claims abstract description 16
- QORWJWZARLRLPR-UHFFFAOYSA-H tricalcium bis(phosphate) Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QORWJWZARLRLPR-UHFFFAOYSA-H 0.000 claims abstract description 16
- 229920001721 polyimide Polymers 0.000 claims description 35
- 239000004642 Polyimide Substances 0.000 claims description 33
- 239000005543 nano-size silicon particle Substances 0.000 claims description 24
- 238000005266 casting Methods 0.000 claims description 21
- 239000002245 particle Substances 0.000 claims description 21
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 19
- 229910000831 Steel Inorganic materials 0.000 claims description 19
- 239000010959 steel Substances 0.000 claims description 19
- 239000011491 glass wool Substances 0.000 claims description 14
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 12
- 238000007654 immersion Methods 0.000 claims description 12
- 238000005520 cutting process Methods 0.000 claims description 10
- 239000007788 liquid Substances 0.000 claims description 9
- 239000000047 product Substances 0.000 claims description 9
- 238000003860 storage Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- 230000008569 process Effects 0.000 claims description 7
- 239000011265 semifinished product Substances 0.000 claims description 7
- 235000012239 silicon dioxide Nutrition 0.000 claims description 7
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 7
- 238000009413 insulation Methods 0.000 claims description 6
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims description 3
- 239000006185 dispersion Substances 0.000 claims description 3
- 238000009826 distribution Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- FQTCUKQMGGJRCU-UHFFFAOYSA-N n,n-diacetylacetamide Chemical compound CC(=O)N(C(C)=O)C(C)=O FQTCUKQMGGJRCU-UHFFFAOYSA-N 0.000 claims description 3
- 238000004804 winding Methods 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 abstract description 6
- 230000007797 corrosion Effects 0.000 abstract description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 4
- 239000001301 oxygen Substances 0.000 abstract description 4
- 229910052760 oxygen Inorganic materials 0.000 abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 description 9
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 229910052744 lithium Inorganic materials 0.000 description 3
- 238000004064 recycling Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000012784 inorganic fiber Substances 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- 238000003723 Smelting Methods 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001804 emulsifying effect Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 239000006060 molten glass Substances 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
- C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/32—Phosphorus-containing compounds
- C08K2003/321—Phosphates
- C08K2003/325—Calcium, strontium or barium phosphate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/14—Glass
Abstract
The invention relates to the field of PI films, in particular to an insulating PI film material. The composition comprises the following components in parts by weight: 35-65 parts of pyromellitic dianhydride, 30-55 parts of biphenyl tetracarboxylic dianhydride, 15-20 parts of octadecylamine, 15-25 parts of p-phenylenediamine, 8-12 parts of N-methylpyrrolidone, 5-10 parts of diaminodiphenyl ether, 4-7 parts of alumina, 5-8 parts of basic calcium phosphate, 10-15 parts of polyalkylene glycol, 10-14 parts of mixed nanoparticles and 50-80 parts of solvent. The invention has excellent mechanical properties such as insulating property, water and oxygen resistance, high surface energy, corrosion resistance, high temperature resistance, structural strength and the like.
Description
Technical Field
The invention relates to the field of PI films, in particular to an insulating PI film material.
Background
The polyimide film (PI film) has excellent performance, and can be widely applied to electronic and electrical industries such as space technology, motor, insulation of electrical appliances, FPC (flexible printed circuit board), PTC (positive temperature coefficient) electrothermal film, TAB (pressure sensitive tape substrate), aerospace, aviation, computer, electromagnetic wire, transformer, sound equipment, mobile phone, computer, smelting, mining electronic component industry, automobile, transportation, atomic energy industry and the like. In the manufacture of new energy automobile batteries, such as lithium batteries, a PI film is required to protect the lithium batteries.
The PI film needs to have the performances of corrosion resistance, high temperature resistance, insulativity, barrier property and high surface energy so as to adapt to the operation environment of the new energy automobile battery, effectively protect the lithium battery and ensure the normal and stable operation of the new energy automobile battery.
Disclosure of Invention
The invention aims to provide an insulating PI film material with excellent insulating property, water and oxygen resistance, high surface energy, corrosion resistance, high temperature resistance and structural strength aiming at the problems in the background technology.
The technical scheme of the invention is that the insulating PI film material comprises the following components in parts by weight:
35-65 parts of pyromellitic dianhydride, 30-55 parts of biphenyl tetracarboxylic dianhydride, 15-20 parts of octadecylamine, 15-25 parts of p-phenylenediamine, 8-12 parts of N-methylpyrrolidone, 5-10 parts of diaminodiphenyl ether, 4-7 parts of alumina, 5-8 parts of basic calcium phosphate, 10-15 parts of polyalkylene glycol, 10-14 parts of mixed nanoparticles and 50-80 parts of solvent.
Preferably, the mixed nanoparticles include at least one of nano silicon nitride and nano silicon dioxide, and the particle size ranges from 30 to 50 nm.
Preferably, the solvent is at least one of dimethylacetamide and triacetamide.
Preferably, the glass wool also comprises 6 to 10 parts by weight of glass wool.
Preferably, the process for producing the insulating PI film includes the steps of:
s1, mixing the mixed nanoparticles to prepare a dispersion liquid;
s2, adding pyromellitic dianhydride, biphenyl tetracarboxylic dianhydride, octadecylamine, p-phenylenediamine, N-methylpyrrolidone, oxydianiline, alumina, basic calcium phosphate and polyalkylene glycol into a solvent, and uniformly mixing to obtain a polyimide solution;
s3, adding the polyimide solution into a solution storage tank, wherein the bottom end of the solution storage tank is in contact with a casting nozzle of a casting machine;
s4, starting the casting machine, discharging the polyimide solution in the solution storage tank, and guiding the solution to a steel belt of the casting machine through a casting nozzle;
s5, arranging a scraper on the casting machine, wherein the area between the scraper and the steel belt is a polyimide distribution area, and the thickness of polyimide is determined by the distance between the scraper and the steel belt;
s6, heating the polyimide on the steel belt through a heater in the process of conveying the polyimide through the steel belt by a casting machine to shape the polyimide solution into a PI film semi-finished product;
s7, guiding the semi-finished product of the PI film to an imidization furnace through a guide roller, and performing imidization treatment to obtain a finished product of the PI film;
and S8, winding the PI film finished product on a roller.
Preferably, in S8, the roller is coaxially sleeved with a circular cutting board, the edge of the outer contour of the cutting board is provided with a cutting edge, and a plurality of cutting boards are arranged side by side along the axial direction of the roller.
Preferably, the blade used in S5 has a blade portion, and the blade is inclined from the bottom to the top in the direction in which the polyimide solution is fed to the steel belt.
Preferably, the surface of one side of the scraper blade which faces upwards in an inclined mode rotates to be provided with an immersion liquid roller, and an immersion liquid sleeve is sleeved on the immersion liquid roller.
Compared with the prior art, the invention has the following beneficial technical effects:
the PI film produced by the invention has excellent mechanical properties such as insulating property, water and oxygen resistance, high surface energy, corrosion resistance, high temperature resistance, structural strength and the like, can be used for manufacturing a PI film finished product with a thinner thickness, and has the advantages of simple manufacturing method and fully improved comprehensive performance.
Detailed Description
Example one
The invention provides an insulating PI film material which comprises the following components in parts by weight:
35 parts of pyromellitic dianhydride, 30 parts of biphenyl tetracarboxylic dianhydride, 15 parts of octadecylamine, 15 parts of p-phenylenediamine, 8 parts of N-methylpyrrolidone, 5 parts of diaminodiphenyl ether, 7 parts of alumina, 8 parts of basic calcium phosphate, 15 parts of polyalkylene glycol, 10 parts of glass wool, 14 parts of mixed nano particles and 80 parts of solvent. The mixed nano-particles comprise at least one of nano silicon nitride and nano silicon dioxide, and the particle size of the particles is 50 nm. The solvent is at least one of dimethylacetamide and triacetamide.
Example two
Compared with the first embodiment, the insulating PI film provided by the invention is different from the first embodiment in that the insulating PI film comprises the following components in parts by weight:
43 parts of pyromellitic dianhydride, 40 parts of biphenyl tetracarboxylic dianhydride, 18 parts of octadecylamine, 19 parts of p-phenylenediamine, 11 parts of N-methylpyrrolidone, 9 parts of diaminodiphenyl ether, 6 parts of alumina, 7 parts of basic calcium phosphate, 14 parts of polyalkylene glycol, 9 parts of glass wool, 13 parts of mixed nanoparticles and 65 parts of solvent. The mixed nano-particles comprise at least one of nano silicon nitride and nano silicon dioxide, and the particle size of the particles is 38 nm.
EXAMPLE III
Compared with the first embodiment, the insulating PI film provided by the invention is different from the first embodiment in that the insulating PI film comprises the following components in parts by weight:
48 parts of pyromellitic dianhydride, 52 parts of biphenyl tetracarboxylic dianhydride, 18 parts of octadecylamine, 19 parts of p-phenylenediamine, 10 parts of N-methylpyrrolidone, 9 parts of diaminodiphenyl ether, 6 parts of alumina, 6 parts of basic calcium phosphate, 12 parts of polyalkylene glycol, 7 parts of glass wool, 12 parts of mixed nano particles and 54 parts of solvent. The mixed nano-particles comprise at least one of nano-silicon nitride and nano-silicon dioxide, and the particle size range of the particles is 32 nm.
Example four
Compared with the first embodiment, the insulating PI film provided by the invention is different from the first embodiment in that the insulating PI film comprises the following components in parts by weight:
45 parts of pyromellitic dianhydride, 54 parts of biphenyl tetracarboxylic dianhydride, 19 parts of octadecylamine, 19 parts of p-phenylenediamine, 10 parts of N-methylpyrrolidone, 7 parts of diaminodiphenyl ether, 6 parts of alumina, 7 parts of basic calcium phosphate, 12 parts of polyalkylene glycol, 8 parts of glass wool, 13 parts of mixed nano particles and 55 parts of solvent. The mixed nano-particles comprise at least one of nano silicon nitride and nano silicon dioxide, and the particle size of the particles is 36 nm.
EXAMPLE five
Compared with the first embodiment, the insulating PI film provided by the invention is different from the first embodiment in that the insulating PI film comprises the following components in parts by weight:
62 parts of pyromellitic dianhydride, 49 parts of biphenyl tetracarboxylic dianhydride, 18 parts of octadecylamine, 18 parts of p-phenylenediamine, 9 parts of N-methylpyrrolidone, 8 parts of diaminodiphenyl ether, 6 parts of alumina, 7 parts of basic calcium phosphate, 12 parts of polyalkylene glycol, 7 parts of glass wool, 12 parts of mixed nano particles and 65 parts of solvent. The mixed nano-particles comprise at least one of nano-silicon nitride and nano-silicon dioxide, and the particle size range is 42 nm.
EXAMPLE six
Compared with the first embodiment, the insulating PI film provided by the invention is different from the first embodiment in that the insulating PI film comprises the following components in parts by weight:
55 parts of pyromellitic dianhydride, 42 parts of biphenyl tetracarboxylic dianhydride, 19 parts of octadecylamine, 17 parts of p-phenylenediamine, 11 parts of N-methylpyrrolidone, 8 parts of diaminodiphenyl ether, 6 parts of alumina, 7 parts of basic calcium phosphate, 12 parts of polyalkylene glycol, 9 parts of glass wool, 13 parts of mixed nano particles and 58 parts of solvent. The mixed nano-particles comprise at least one of nano silicon nitride and nano silicon dioxide, and the particle size of the particles is in the range of 37 nm.
EXAMPLE seven
Compared with the first embodiment, the insulating PI film provided by the invention is different from the first embodiment in that the insulating PI film comprises the following components in parts by weight:
42 parts of pyromellitic dianhydride, 44 parts of biphenyl tetracarboxylic dianhydride, 18 parts of octadecylamine, 19 parts of p-phenylenediamine, 9 parts of N-methylpyrrolidone, 6 parts of diaminodiphenyl ether, 6 parts of alumina, 7 parts of basic calcium phosphate, 12 parts of polyalkylene glycol, 7 parts of glass wool, 13 parts of mixed nano particles and 75 parts of solvent. The mixed nano-particles comprise at least one of nano-silicon nitride and nano-silicon dioxide, and the particle size range is 42 nm.
Example eight
Compared with the first embodiment, the insulating PI film provided by the invention is different from the first embodiment in that the insulating PI film comprises the following components in parts by weight:
62 parts of pyromellitic dianhydride, 45 parts of biphenyl tetracarboxylic dianhydride, 17 parts of octadecylamine, 18 parts of p-phenylenediamine, 11 parts of N-methylpyrrolidone, 8 parts of diaminodiphenyl ether, 6 parts of alumina, 5 parts of basic calcium phosphate, 12 parts of polyalkylene glycol, 8 parts of glass wool, 12 parts of mixed nano particles and 65 parts of solvent. The mixed nano-particles comprise at least one of nano-silicon nitride and nano-silicon dioxide, and the particle size range of the particles is 35 nm.
Example nine
Compared with the first embodiment, the insulating PI film provided by the invention is different from the first embodiment in that the insulating PI film comprises the following components in parts by weight:
45 parts of pyromellitic dianhydride, 40 parts of biphenyl tetracarboxylic dianhydride, 19 parts of octadecylamine, 17 parts of p-phenylenediamine, 10 parts of N-methylpyrrolidone, 7 parts of diaminodiphenyl ether, 6 parts of alumina, 6 parts of basic calcium phosphate, 12 parts of polyalkylene glycol, 7 parts of glass wool, 11 parts of mixed nano particles and 53 parts of solvent. The mixed nano-particles comprise at least one of nano-silicon nitride and nano-silicon dioxide, and the particle size range of the particles is 32 nm.
Example ten
Compared with the first embodiment, the insulating PI film provided by the invention is different from the first embodiment in that the insulating PI film comprises the following components in parts by weight:
65 parts of pyromellitic dianhydride, 55 parts of biphenyl tetracarboxylic dianhydride, 20 parts of octadecylamine, 25 parts of p-phenylenediamine, 12 parts of N-methylpyrrolidone, 10 parts of diaminodiphenyl ether, 4 parts of alumina, 5 parts of basic calcium phosphate, 10 parts of polyalkylene glycol, 6 parts of glass wool, 10 parts of mixed nano particles and 50 parts of solvent. The mixed nano-particles comprise at least one of nano silicon nitride and nano silicon dioxide, and the particle size of the particles is in the range of 30 nm.
In this example, pyromellitic dianhydride was used as a raw material for polyimide, and can be used for producing a polyimide film and a curing agent. Octadecylamine is used as an auxiliary agent to play a role in emulsifying and thickening. P-phenylenediamine can be used to dye PI films to produce PI films of the corresponding color as desired for production. The N-methyl pyrrolidone is used as a high-grade solvent, and has strong selectivity and good stability. The glass wool belongs to one category of glass fiber, is an artificial inorganic fiber, is a material for fiberizing molten glass to form a cotton shape, is an inorganic fiber, has the characteristics of good forming, small volume density, thermal conductivity , heat preservation and insulation, good sound absorption performance, corrosion resistance and stable chemical performance, and can effectively improve the mechanical performance of a PI film finished product. The mixed nano particles can fully and uniformly disperse other components.
EXAMPLE eleven
The process for producing the insulating PI film material comprises the following steps:
s1, mixing the mixed nanoparticles to prepare a dispersion liquid;
s2, adding pyromellitic dianhydride, biphenyl tetracarboxylic dianhydride, octadecylamine, p-phenylenediamine, N-methylpyrrolidone, oxydianiline, alumina, basic calcium phosphate and polyalkylene glycol into a solvent, and uniformly mixing to obtain a polyimide solution;
s3, adding the polyimide solution into a solution storage tank, wherein the bottom end of the solution storage tank is in contact with a casting nozzle of a casting machine;
s4, starting the casting machine, discharging the polyimide solution in the solution storage tank, and guiding the solution to a steel belt of the casting machine through a casting nozzle to form a belt-shaped polyimide solution layer;
s5, set up the scraper blade on the casting machine, the region between scraper blade and the steel band is polyimide distribution region, the thickness of polyimide is decided to the interval of scraper blade and steel band, the scraper blade has the cutting part, and the scraper blade is inclined to the direction that the steel band carried polyimide solution gradually from bottom to top, the side surface that the scraper blade slope was up rotates and is provided with the immersion fluid roller, the cover is equipped with the immersion fluid cover on the immersion fluid roller, the thickness of PI membrane that produces can be injectd to the scraper blade, the scraper blade is less with the steel band interval, the PI membrane of making is thinner, the height of scraper blade can correspond the setting according to the required thickness PI membrane of production. In addition, the scraper can be set to be in an inclined state, so that polyimide scraped by the scraper can easily flow upwards along the scraper smoothly, and is gradually shaped under the action of the heater, the shaped material can be conveniently taken out subsequently, and then the material is melted and recycled, the method is environment-friendly, the production cost is reduced, the immersion liquid sleeve can be adhered with polyimide solution in the rotating process, the recycling rate of the polyimide is improved, and during recycling, the immersion liquid sleeve only needs to be taken down and then the shaped polyimide material on the immersion liquid sleeve is taken down and heated for recycling;
s6, heating the polyimide on the steel belt through a heater in the process of conveying the polyimide through the steel belt by a casting machine to shape the polyimide solution into a PI film semi-finished product, wherein the PI film semi-finished product has good mechanical properties;
s7, guiding the semi-finished product of the PI film to an imidization furnace through a guide roller, and performing imidization treatment to obtain a finished product of the PI film;
s8, winding the PI film finished product on a roller, coaxially sleeving a circular cutting board on the roller, arranging a plurality of cutting edges on the edge of the outer contour of the cutting board, arranging the cutting boards side by side along the axial direction of the roller, and dividing the PI film into required number.
The PI film produced by the production process has excellent mechanical properties such as insulating property, water and oxygen resistance, high surface energy, corrosion resistance, high temperature resistance, structural strength and the like, can be used for manufacturing a PI film finished product with a thin thickness, is simple in manufacturing method, and fully improves comprehensive performance.
While the embodiments of the present invention have been described in detail, the present invention is not limited thereto, and various changes can be made without departing from the gist of the present invention within the knowledge of those skilled in the art.
Claims (8)
1. An insulating PI film is characterized by comprising the following components in parts by weight:
35-65 parts of pyromellitic dianhydride, 30-55 parts of biphenyl tetracarboxylic dianhydride, 15-20 parts of octadecylamine, 15-25 parts of p-phenylenediamine, 8-12 parts of N-methylpyrrolidone, 5-10 parts of diaminodiphenyl ether, 4-7 parts of alumina, 5-8 parts of basic calcium phosphate, 10-15 parts of polyalkylene glycol, 10-14 parts of mixed nanoparticles and 50-80 parts of solvent.
2. The insulation PI film as claimed in claim 1, wherein the mixed nanoparticles comprise at least one of nano silicon nitride and nano silicon dioxide, and the particle size of the particles is in the range of 30-50 nm.
3. The insulating PI film of claim 1, wherein the solvent is at least one of dimethylacetamide and triacetamide.
4. The insulating PI film of claim 1 further comprising 6-10 parts by weight of glass wool.
5. The insulating PI film as claimed in claim 1, wherein the process for producing the insulating PI film comprises the following steps:
s1, mixing the mixed nanoparticles to prepare a dispersion liquid;
s2, adding pyromellitic dianhydride, biphenyl tetracarboxylic dianhydride, octadecylamine, p-phenylenediamine, N-methylpyrrolidone, oxydianiline, alumina, basic calcium phosphate and polyalkylene glycol into a solvent, and uniformly mixing to obtain a polyimide solution;
s3, adding the polyimide solution into a solution storage tank, wherein the bottom end of the solution storage tank is in contact with a casting nozzle of a casting machine;
s4, starting the casting machine, discharging the polyimide solution in the solution storage tank, and guiding the solution to a steel belt of the casting machine through a casting nozzle;
s5, arranging a scraper on the casting machine, wherein the area between the scraper and the steel belt is a polyimide distribution area, and the thickness of polyimide is determined by the distance between the scraper and the steel belt;
s6, heating the polyimide on the steel belt through a heater in the process of conveying the polyimide through the steel belt by a casting machine to shape the polyimide solution into a PI film semi-finished product;
s7, guiding the semi-finished product of the PI film to an imidization furnace through a guide roller, and performing imidization treatment to obtain a finished product of the PI film;
and S8, winding the PI film finished product on a roller.
6. The insulation PI film as claimed in claim 5, wherein in S8, a plurality of annular knife boards are coaxially sleeved on the roller, the edges of the outer contour of the knife boards are provided with cutting edges, and the knife boards are arranged side by side along the axial direction of the roller.
7. The insulation PI film as claimed in claim 5, wherein the scraper used in S5 has a blade, and the scraper is inclined gradually from bottom to top in a direction of conveying the polyimide solution to the steel strip.
8. The insulation PI film as claimed in claim 7, wherein an immersion roller is rotatably arranged on the surface of the side, which faces upwards and is inclined to the scraper, and an immersion sleeve is sleeved on the immersion roller.
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| CN202111675478.0A CN114369361A (en) | 2021-12-31 | 2021-12-31 | Insulating PI membrane material |
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| CN202111675478.0A CN114369361A (en) | 2021-12-31 | 2021-12-31 | Insulating PI membrane material |
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| CN112812559A (en) * | 2021-01-28 | 2021-05-18 | 苏州泰仑电子材料有限公司 | Insulating PI film and preparation method thereof |
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Application publication date: 20220419 |