CN114361113A - High-voltage-resistance Schottky chip - Google Patents

High-voltage-resistance Schottky chip Download PDF

Info

Publication number
CN114361113A
CN114361113A CN202210052888.8A CN202210052888A CN114361113A CN 114361113 A CN114361113 A CN 114361113A CN 202210052888 A CN202210052888 A CN 202210052888A CN 114361113 A CN114361113 A CN 114361113A
Authority
CN
China
Prior art keywords
chip
main body
chip main
protective sleeve
inflation gasbag
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202210052888.8A
Other languages
Chinese (zh)
Other versions
CN114361113B (en
Inventor
黄昌民
李学会
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuxi Thunder Microelectronics Co ltd
Original Assignee
Wuxi Thunder Microelectronics Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuxi Thunder Microelectronics Co ltd filed Critical Wuxi Thunder Microelectronics Co ltd
Priority to CN202210052888.8A priority Critical patent/CN114361113B/en
Publication of CN114361113A publication Critical patent/CN114361113A/en
Application granted granted Critical
Publication of CN114361113B publication Critical patent/CN114361113B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Buffer Packaging (AREA)

Abstract

The invention discloses a high-voltage-resistance Schottky chip which comprises a chip main body and a protective sleeve, wherein the protective sleeve is movably sleeved on the chip main body, welding pins are arranged on the chip main body, teeth are arranged on two side walls of the chip main body, a plurality of pin protection slots matched with the welding pins are arranged in the protective sleeve, elastic sponge is annularly arranged on the inner walls of the pin protection slots, a chip protection cavity is arranged in the protective sleeve, and an expansion air bag strip is arranged on the inner wall of the chip protection cavity. According to the invention, by arranging the protective sleeve, the protective sleeve can be sleeved on the chip main body in the packaging and transporting processes, so that the chip main body and the welding pins can be protected, and meanwhile, when the chip main body is inserted into the protective sleeve, the expansion airbag strip and the annular expansion airbag can be expanded to extrude and fix the chip main body, so that the chip main body is effectively protected, the pressure resistance of the chip main body is improved, and the chip main body is convenient to use.

Description

High-voltage-resistance Schottky chip
Technical Field
The invention relates to the relevant field of chips, in particular to a high-voltage-resistance Schottky chip.
Background
The schottky diode is named by the inventor schottky doctor, is manufactured by utilizing the principle of a metal-semiconductor junction formed by contacting metal and a semiconductor, is a hot carrier diode, and is widely applied to circuits such as a switching power supply, a frequency converter, a driver and the like.
Present schottky chip is in the packing transportation, mostly place the chip wholly and transport inside the box body, because do not carry out effective resistance to compression protection to the chip is whole, lead to the chip in the transportation, lead to damaged or pin cracked phenomenon because of external pressure easily, and then influence the holistic use of chip, and present chip is whole when the welding, rosin joint or the phenomenon of unsoldering appear easily, influence the use, when the chip uses simultaneously, the heat gives off the effect not good, the heat gathering influences the life of chip easily, need improve.
Disclosure of Invention
The present invention is directed to a high withstand voltage schottky chip to solve the above-mentioned problems.
In order to solve the technical problems, the invention adopts the following technical scheme:
the utility model provides a high withstand voltage schottky chip, includes chip main part and protective sheath, protective sheath activity cover is established in the chip main part, be equipped with the welding pin in the chip main part, all be equipped with tooth on the chip main part both sides wall, the inside pin protection slot that matches with the welding pin that is equipped with of protective sheath, pin protection slot inner wall is fitted with a contraceptive ring and is equipped with elastic sponge, the inside chip protection chamber that is equipped with of protective sheath, be equipped with the inflation gasbag strip on the chip protection intracavity wall, the inside activity chamber that is equipped with of protective sheath, the inside gas storage bag that is equipped with of activity chamber, gas storage bag and the inside intercommunication of inflation gasbag strip, activity intracavity portion is equipped with elevating system, elevating system is located the gas storage bag upper end.
As further preferable in the present technical solution: the chip main part has seted up a plurality of radiating grooves on the surface, and is a plurality of the radiating groove interval sets up, and is a plurality of radiating fin inside all is equipped with a plurality of radiating fin, and is a plurality of radiating fin and chip main part surface are located same water flat line.
As further preferable in the present technical solution: one end, far away from the chip main part, of each welding pin is provided with a plurality of tooth grooves, and the tooth grooves are arranged on two side walls of the welding pins.
As further preferable in the present technical solution: the inside relative both sides of core activity chamber all rotate and install dwang, two the dwang mid-mounting has a running gear, running gear and dwang fixed connection, and running gear one side extend to chip protection intracavity portion and with the tooth meshing.
As further preferable in the present technical solution: the two ends of the rotating rod are fixedly connected with driving bevel gears, and the driving bevel gears are located at four corners of the inner portion of the core movable cavity respectively.
As further preferable in the present technical solution: the lifting mechanism comprises four transmission screw rods, the four transmission screw rods are respectively rotatably installed at four corners inside the movable cavity, driven bevel gears are fixedly connected to the top ends of the four transmission screw rods, and the four driven bevel gears are respectively in meshed connection with the four driving bevel gears.
As further preferable in the present technical solution: four all be equipped with screw-nut on the transmission lead screw, the cover is equipped with the traveling sleeve on the screw-nut, four all be equipped with the slider on the traveling sleeve, set up the spout that matches with the slider on the inner wall of activity chamber one side.
As further preferable in the present technical solution: the gas storage bag is equipped with four, four the gas storage bag is located activity intracavity portion respectively all around, gas storage bag upper end fixedly connected with lifter plate, four the traveling barrel bottom all is connected with lifter plate upper surface fixed.
As further preferable in the present technical solution: the expansion airbag strip is equipped with a plurality ofly, and is a plurality of the expansion airbag strip is circumference evenly distributed on chip protection intracavity wall, and is a plurality of the expansion airbag strip respectively with four inside intercommunications of gas storage bag, it is a plurality of the expansion airbag strip all with chip main part lateral wall butt.
As further preferable in the present technical solution: the chip protects intracavity portion upper end and is equipped with annular inflation gasbag, annular inflation gasbag is located chip protection intracavity portion port department, and annular inflation gasbag fixed mounting is on chip protection intracavity wall, annular inflation gasbag and a plurality of inflation gasbag strip pass through the gas-supply pipe intercommunication.
The invention has the beneficial effects that:
1. according to the invention, by arranging the protective sleeve, the protective sleeve can be sleeved on the chip main body in the packaging and transporting process, so that the chip main body and the welding pins can be protected, and meanwhile, when the chip main body is inserted into the protective sleeve, teeth can be meshed with the gear, so that the driving bevel gear can be driven to rotate and meshed with the driven bevel gear to rotate, the four transmission screw rods can be driven to rotate, the movable sleeve can move downwards and extrude the gas storage bag, the gas in the gas storage bag is filled into the expansion gas bag strip and the annular expansion gas bag, so that the expansion gas bag strip and the annular expansion gas bag expand to extrude and fix the chip main body, the chip main body is effectively protected, the pressure resistance of the chip main body is improved, and the chip main body is convenient to use.
2. According to the invention, the pin protection slot is arranged, so that the welding pin can be inserted into the pin protection slot, and the elastic sponge is arranged in the pin protection slot, so that the pin can be effectively protected, and the pin is prevented from being broken.
3. According to the invention, the plurality of tooth grooves are arranged on the welding pin, so that the contact area of the welding flux and the welding pin can be increased during welding, the welding stability can be increased, the phenomenon of desoldering or insufficient welding can be avoided, and the packaging chip is stable to use.
4. According to the invention, the plurality of radiating grooves are formed in the chip main body, so that the heat of each part of the chip can be prevented from being radiated outwards when the chip works, and the radiating fins are arranged in the radiating grooves, so that the heat in the radiating grooves can be absorbed and radiated by the radiating fins, the good radiating effect is ensured, and the use is avoided.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic diagram of a chip main structure according to the present invention;
FIG. 3 is a side view of the chip body of the present invention;
FIG. 4 is a schematic view of the overall internal structure of the protective case of the present invention;
FIG. 5 is a schematic top view of the interior of the protective sheath of the present invention;
FIG. 6 is a schematic view of the left side view of the interior of the protective sleeve of the present invention;
FIG. 7 is a schematic view of the structure of part A of FIG. 1 according to the present invention;
FIG. 8 is a schematic structural view of portion B of FIG. 2 according to the present invention;
reference numerals: 1. a chip body; 2. a protective sleeve; 3. a heat sink; 4. a heat sink; 5. teeth; 6. welding pins; 7. a pin protection slot; 8. inflating the airbag strip; 9. a gas storage bag; 10. a movable cavity; 11. a rotating gear; 12. an annular inflatable bladder; 13. a transmission screw rod; 14. a feed screw nut; 15. moving the sleeve; 16. a lifting plate; 17. an elastic sponge; 18. a driven bevel gear; 19. a drive bevel gear; 20. rotating the rod; 21. a tooth socket; 22. a lifting mechanism; 23. a chip protection cavity; 24. a slider; 25. a chute.
Detailed Description
In order to make the technical means, the original characteristics, the achieved purposes and the effects of the invention easily understood, the invention is further described below with reference to the specific embodiments and the attached drawings, but the following embodiments are only the preferred embodiments of the invention, and not all embodiments. Based on the embodiments in the implementation, other embodiments obtained by those skilled in the art without any creative efforts belong to the protection scope of the present invention.
Specific embodiments of the present invention are described below with reference to the accompanying drawings.
As shown in fig. 1-8, the high withstand voltage schottky chip of this embodiment, including chip main part 1 and protective sheath 2, protective sheath 2 activity cover is established on chip main part 1, be equipped with welding pin 6 on the chip main part 1, all be equipped with tooth 5 on the wall of chip main part 1 both sides, protective sheath 2 is inside to be equipped with a plurality of pin protection slots 7 that match with welding pin 6, pin protection slot 7 inner wall is fitted with a contraceptive ring and is equipped with elastic sponge 17, protective sheath 2 is inside to be equipped with chip protection chamber 23, be equipped with inflation gasbag strip 8 on the chip protection chamber 23 inner wall, the inside activity chamber 10 that is equipped with of protective sheath 2, the inside gas storage bag 9 that is equipped with in activity chamber 10, gas storage bag 9 and the inside intercommunication of inflation gasbag strip 8, the inside elevating system 22 that is equipped with in activity chamber 10, elevating system 22 is located gas storage bag 9 upper end.
In this embodiment, specifically: chip main part 1 has seted up a plurality of radiating grooves 3 on the surface, 3 intervals of a plurality of radiating grooves set up, and 3 inside a plurality of radiating grooves all are equipped with a plurality of fin 4, a plurality of fin 4 and 1 surface level of chip main part are on same water flat line, through setting up a plurality of radiating grooves 3, can reduce the thickness of 1 part casing of chip main part, thereby the temperature of 1 inside of chip main part of can being convenient for is effluvium, the setting of a plurality of fin 4 simultaneously, can be convenient for adsorb and give off the heat in the radiating groove 3, increase the radiating effect.
In this embodiment, specifically: welding pin 6 keeps away from the one end of chip main part 1 and is equipped with tooth's socket 21, tooth's socket 21 is equipped with a plurality ofly, a plurality of tooth's sockets 21 are arranged and are set up on 6 both sides walls of welding pin, through be equipped with a plurality of tooth's sockets 21 on welding pin 6, can be when the welding, make the solder flux enter into inside the tooth's socket 21, thereby can increase the area of contact with welding pin 6 when welding, increase welded stability, the phenomenon that rosin joint or desoldering appear when avoiding the welding of chip main part 1, increase the stability of use.
In this embodiment, specifically: the inside relative both sides in activity chamber 10 are all rotated and are installed dwang 20, and two dwang 20 mid-mounting have a rotating gear 11, rotating gear 11 and dwang 20 fixed connection, and rotating gear 11 one side extend to chip protection chamber 23 inside and with tooth 5 meshing, when chip main part 1 inserted chip protection chamber 23 inside, can be so that tooth 5 and gear engagement to can make gear revolve and drive dwang 20 and rotate.
In this embodiment, specifically: the equal fixedly connected with in dwang 20 both ends drives bevel gear 19, and four drive bevel gears 19 are located four inside edges and corners in core activity chamber 10 respectively, can drive four and drive bevel gear 19 synchronous rotations when dwang 20 pivoted.
In this embodiment, specifically: the lifting mechanism 22 comprises four transmission screw rods 13, the four transmission screw rods 13 are respectively rotatably installed at four corners inside the movable cavity 10, driven bevel gears 18 are fixedly connected to the top ends of the four transmission screw rods 13, the four driven bevel gears 18 are respectively meshed with the four driving bevel gears 19, the four driving bevel gears 19 can be utilized to rotate and respectively rotate with the four driven bevel gears 18, and then the four transmission screw rods 13 can be enabled to rotate.
In this embodiment, specifically: all be equipped with screw-nut 14 on four transmission lead screws 13, the cover is equipped with traveling sleeve 15 on the screw-nut 14, all be equipped with slider 24 on four traveling sleeve 15, set up the spout 25 that matches with slider 24 on the inner wall of activity chamber 10 one side, four transmission lead screws 13 pivoted can drive four screw-nut 14 removal simultaneously, and then can drive four traveling sleeve 15 with 14 fixed connection of screw-nut and move up or move down, and when traveling sleeve 15 removed, can remove along spout 25 through slider 24, increase the stability of removal.
In this embodiment, specifically: the four air storage bags 9 are arranged, the four air storage bags 9 are respectively located around the inner portion of the movable cavity 10, the lifting plate 16 is fixedly connected to the upper end of each air storage bag 9, the bottom ends of the four movable sleeves 15 are fixedly connected with the upper surface of the lifting plate 16, when the movable sleeves 15 move upwards or downwards, the lifting plates 16 can be driven to synchronously move upwards or downwards, and the air storage bags 9 can be stretched or extruded.
In this embodiment, specifically: inflation gasbag strip 8 is equipped with a plurality ofly, a plurality of inflation gasbag strips 8 are circumference evenly distributed on chip protection cavity 23 inner wall, and a plurality of inflation gasbag strips 8 respectively with the inside intercommunication of four gas storage bags 9, a plurality of inflation gasbag strips 8 all with 1 lateral wall butt of chip main part, when four gas storage bags 9 receive the extrusion, can make the inside gas of gas storage bag 9 enter into a plurality of inflation gasbag strips 8, thereby can make a plurality of inflation gasbag strips 8 inflation and with 1 lateral wall butt of chip main part, thereby can carry out the flexible extrusion protection to chip main part 1, and when protective sheath 2 received the striking, can utilize inflation gasbag strip 8 to cushion protection chip main part 1, improve the resistance to pressure of chip main part 1.
In this embodiment, specifically: chip protection chamber 23 inside upper end is equipped with annular inflation gasbag 12, annular inflation gasbag 12 is located chip protection chamber 23 inside port department, and annular inflation gasbag 12 fixed mounting is on chip protection chamber 23 inner wall, annular inflation gasbag 12 passes through the gas-supply pipe intercommunication with a plurality of inflation gasbag strips 8, when a plurality of inflation gasbag strips 8 expand, can make the inside unnecessary gas of a plurality of inflation gasbag strips enter into annular inflation gasbag 12 inside, thereby can make annular inflation gasbag 12 and 1 lateral wall butt of chip main part, the annular inflation gasbag 12 of inflation can seal the port department of chip protection chamber 23 simultaneously, avoid the dust to get into, guarantee that the protection to chip main part 1 is effectual.
It should be noted that, when the high voltage resistant schottky chip works, when the chip main body 1 needs to be packaged and transported, the chip main body 1 can be inserted into the chip protection cavity 23, at this time, the teeth 5 can be meshed with the rotating gears 11, so that the gears can rotate and drive the rotating rods 20 to rotate, when the two rotating rods 20 rotate, the four driving bevel gears 19 can be driven to synchronously rotate, at this time, the four driving bevel gears 19 are respectively meshed with the four driven bevel gears 18, the four driven bevel gears 18 can drive the four transmission lead screws 13 to rotate while rotating, so that the four lead screw nuts 14 can move downwards, and the four lead screw nuts 14 can drive the moving sleeve 15 to move downwards while moving downwards, and when the moving sleeve 15 moves downwards, the sliding block 24 can move along the sliding groove 25, so as to increase the stability of movement, the moving sleeve 15 moves downwards and pushes the lifting plate 16 to move downwards to extrude the four air storage bags 9, can extrude the gas in the four gas storage bags 9 and send the gas into the expansion airbag strips 8, thereby expanding the expansion airbag strips 8 and abutting against the side wall of the chip main body 1, thereby performing flexible extrusion protection on the chip main body 1, and when the protective sleeve 2 is impacted, the expansion airbag strips 8 can be used for buffering protection on the chip main body 1, the pressure resistance of the chip main body 1 is improved, when the expansion airbag strips 8 expand, redundant gas in the expansion airbag strips 8 can enter the annular expansion airbag 12, thereby abutting against the side wall of the chip main body 1, meanwhile, the expanded annular expansion airbag 12 can seal the port of the chip protection cavity 23, thereby avoiding dust from entering, ensuring good protection effect on the chip main body 1, and when the chip main body 1 is inserted into the chip protection cavity 23, the welding pins 6 can be correspondingly inserted into the pin protection slots 7, and the elastic sponge 17 is arranged in the pin protection slots 7, so that the pins can be effectively protected, and the pins are prevented from being broken; by arranging the plurality of tooth grooves 21 on the welding pin 6, the welding flux can enter the tooth grooves 21 during welding, so that the contact area between the welding pin 6 and the welding flux during welding can be increased, the welding stability is increased, the phenomenon of insufficient welding or desoldering during welding of the chip main body 1 is avoided, and the use stability is increased; chip main part 1 is in the use, through set up a plurality of radiating grooves 3 on chip main part 1, can reduce the thickness of 1 partial casings of chip main part to the temperature of 1 inside of chip main part of can being convenient for is dispelled, and the setting of a plurality of fin 4 can be convenient for adsorb the heat in radiating groove 3 and give off simultaneously, increases the radiating effect, prolongs chip main part 1's life.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and the preferred embodiments of the present invention are described in the above embodiments and the description, and are not intended to limit the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (10)

1. The high-voltage-withstanding Schottky chip is characterized by comprising a chip main body (1) and a protective sleeve (2), wherein the protective sleeve (2) is movably sleeved on the chip main body (1), a welding pin (6) is arranged on the chip main body (1), teeth (5) are arranged on two side walls of the chip main body (1), a plurality of pin protection slots (7) matched with the welding pin (6) are arranged inside the protective sleeve (2), elastic sponge (17) is annularly arranged on the inner wall of each pin protection slot (7), a chip protection cavity (23) is arranged inside the protective sleeve (2), an expansion air bag strip (8) is arranged on the inner wall of the chip protection cavity (23), a movable cavity (10) is arranged inside the protective sleeve (2), an air storage bag (9) is arranged inside the movable cavity (10), and the air storage bag (9) is communicated with the expansion air bag strip (8), the lifting mechanism (22) is arranged in the movable cavity (10), and the lifting mechanism (22) is located at the upper end of the air storage bag (9).
2. A high withstand voltage schottky chip according to claim 1, wherein: chip main part (1) has seted up a plurality of radiating grooves (3) on the surface, and is a plurality of radiating grooves (3) interval sets up, and is a plurality of radiating groove (3) inside all is equipped with a plurality of fin (4), and is a plurality of fin (4) and chip main part (1) surface are located same water flat line.
3. A high withstand voltage schottky chip according to claim 2, wherein: one end, far away from chip main part (1), of welding pin (6) is equipped with tooth's socket (21), tooth's socket (21) are equipped with a plurality ofly, and are a plurality of tooth's socket (21) are arranged and are set up on welding pin (6) both sides wall.
4. A high withstand voltage schottky chip according to claim 1, wherein: activity chamber (10) inside relative both sides all rotate and install dwang (20), two dwang (20) mid-mounting has rotating gear (11), rotating gear (11) and dwang (20) fixed connection, and rotating gear (11) one side extend to chip protection chamber (23) inside and with tooth (5) meshing.
5. The high withstand voltage schottky chip according to claim 4, wherein: the two ends of the rotating rod (20) are fixedly connected with driving bevel gears (19), and the driving bevel gears (19) are respectively located at four corners inside the core movable cavity (10).
6. A high withstand voltage schottky chip according to claim 5, wherein: the lifting mechanism (22) comprises four transmission screw rods (13), the four transmission screw rods (13) are respectively rotatably installed at four corners inside the movable cavity (10), the four top ends of the transmission screw rods (13) are respectively and fixedly connected with driven bevel gears (18), and the four driven bevel gears (18) are respectively meshed with four driving bevel gears (19).
7. A high withstand voltage schottky chip according to claim 6, wherein: four all be equipped with feed screw nut (14) on transmission lead screw (13), the cover is equipped with traveling sleeve (15) on feed screw nut (14), four all be equipped with slider (24) on traveling sleeve (15), offer spout (25) with slider (24) matching on the inner wall of activity chamber (10) one side.
8. A high withstand voltage schottky chip according to claim 7, wherein: the gas storage bags (9) are four, four the gas storage bags (9) are located inside the movable cavity (10) and around the movable cavity respectively, a lifting plate (16) is fixedly connected to the upper end of each gas storage bag (9), and the bottom ends of the movable sleeves (15) are fixedly connected with the upper surface of the lifting plate (16).
9. A high withstand voltage schottky chip according to claim 8, wherein: inflation gasbag strip (8) are equipped with a plurality ofly, and are a plurality of inflation gasbag strip (8) are circumference evenly distributed on chip protection chamber (23) inner wall, and are a plurality of inflation gasbag strip (8) respectively with four gas storage bag (9) inside intercommunication, it is a plurality of inflation gasbag strip (8) all with chip main part (1) lateral wall butt.
10. A high withstand voltage schottky chip according to claim 9, wherein: chip protection chamber (23) inside upper end is equipped with annular inflation gasbag (12), annular inflation gasbag (12) are located chip protection chamber (23) inside port department, and annular inflation gasbag (12) fixed mounting on chip protection chamber (23) inner wall, annular inflation gasbag (12) and a plurality of inflation gasbag strip (8) are through the gas-supply pipe intercommunication.
CN202210052888.8A 2022-01-18 2022-01-18 High-voltage-resistance Schottky chip Active CN114361113B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210052888.8A CN114361113B (en) 2022-01-18 2022-01-18 High-voltage-resistance Schottky chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210052888.8A CN114361113B (en) 2022-01-18 2022-01-18 High-voltage-resistance Schottky chip

Publications (2)

Publication Number Publication Date
CN114361113A true CN114361113A (en) 2022-04-15
CN114361113B CN114361113B (en) 2022-11-15

Family

ID=81091024

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210052888.8A Active CN114361113B (en) 2022-01-18 2022-01-18 High-voltage-resistance Schottky chip

Country Status (1)

Country Link
CN (1) CN114361113B (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08316264A (en) * 1996-04-05 1996-11-29 Hitachi Ltd Semiconductor device and its manufacture
CN110666287A (en) * 2019-10-23 2020-01-10 张静 Fixing device for welding LED lamp light source module
CN210073866U (en) * 2019-07-24 2020-02-14 同辉电子科技股份有限公司 Schottky diode structure
CN213340359U (en) * 2020-10-15 2021-06-01 深圳市和芯电子有限公司 Schottky diode with protector
CN213755237U (en) * 2020-11-17 2021-07-20 滕岚彪 Electrical element with heat dissipation electrical protection cover
CN214898406U (en) * 2021-07-06 2021-11-26 沈阳飞达电子有限公司 Switching transistor chip

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08316264A (en) * 1996-04-05 1996-11-29 Hitachi Ltd Semiconductor device and its manufacture
CN210073866U (en) * 2019-07-24 2020-02-14 同辉电子科技股份有限公司 Schottky diode structure
CN110666287A (en) * 2019-10-23 2020-01-10 张静 Fixing device for welding LED lamp light source module
CN112496621A (en) * 2019-10-23 2021-03-16 张静 Fixing device for welding LED lamp light source module
CN213340359U (en) * 2020-10-15 2021-06-01 深圳市和芯电子有限公司 Schottky diode with protector
CN213755237U (en) * 2020-11-17 2021-07-20 滕岚彪 Electrical element with heat dissipation electrical protection cover
CN214898406U (en) * 2021-07-06 2021-11-26 沈阳飞达电子有限公司 Switching transistor chip

Also Published As

Publication number Publication date
CN114361113B (en) 2022-11-15

Similar Documents

Publication Publication Date Title
CN114361113B (en) High-voltage-resistance Schottky chip
CN112097165A (en) Explosion-proof type industry LED lamp
CN108012504A (en) A kind of communication base station with heat dissipation and water-proof function based on Internet of Things
CN111599775A (en) Chip overheating water-cooling heat dissipation equipment
CN115647715A (en) Transformer oil tank border weldment work platform
CN214256103U (en) Power supply device for preventing output short circuit
CN113556088A (en) Photovoltaic power generation board of low defective rate
CN207968305U (en) A kind of novel frequency conversion power source device
CN210075852U (en) Waterproof and moistureproof high-voltage frequency converter cabinet
CN110290679B (en) Water-cooling display module
CN209834850U (en) Engine cylinder lid multistage production line shifts structure
CN209293716U (en) A kind of pneumatic mud saver
CN210135550U (en) Water-cooled LED driving power supply
CN219616915U (en) Battery ultrasonic welding conveyor
CN111852997A (en) Cooling underlying type heat energy power generation integrated hydraulic pump station
CN220051957U (en) Automatic sealing strip cutting device
CN212019691U (en) Copper strips welding set
CN220691216U (en) Liquid crystal display production hot pressing mechanism
CN216384111U (en) LED lamp pearl fast dispels heat
CN210381702U (en) Tooth sheet structure filled with refrigerant
CN212126536U (en) Efficient conveying equipment for diode processing
CN213746636U (en) Sealed dustproof LED aluminum substrate
CN212161880U (en) Novel automobile battery
CN211700239U (en) Packaging device for integrated circuit
CN216017291U (en) Conveying device for processing flexible circuit board

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant