CN114355521A

CN114355521A - Packaging method of light receiving assembly and light receiving assembly

Info

Publication number: CN114355521A
Application number: CN202210037044.6A
Authority: CN
Inventors: 黄钊; 李振东
Original assignee: SHENZHEN GIGALIGHT TECHNOLOGY CO LTD
Current assignee: SHENZHEN GIGALIGHT TECHNOLOGY CO LTD
Priority date: 2022-01-13
Filing date: 2022-01-13
Publication date: 2022-04-15

Abstract

The invention relates to a packaging method of a light receiving component and the light receiving component, the packaging method comprises the following steps: fixing the photoelectric signal conversion assembly on a first base; fixing the optical fiber adapter assembly on the first base; and after the lens assembly is placed on the light path between the optical fiber adapting assembly and the photoelectric signal conversion assembly, the lens assembly is fixed on the first target position. The packaging method of the light receiving component and the packaging efficiency of the light receiving component are high.

Description

Packaging method of light receiving assembly and light receiving assembly

Technical Field

The present invention relates to the field of optical devices, and in particular, to a method for packaging a light receiving module and a light receiving module.

Background

With the development of optical device technology, optical receiving devices are widely applied to various optical application occasions such as laser radars, optical communication and the like. Among them, a Receiver Optical System (ROSA) having multiple receiving channels is increasingly used, and a problem of packaging the ROSA has been a problem of intensive research.

In the related art, the light receiving device usually adopts an AWG array waveguide grating chip, the AWG array waveguide grating chip realizes multiple receiving channels by demultiplexing an array waveguide fiber, and the AWG array waveguide grating chip requires a chip flow process for manufacturing.

However, the encapsulation efficiency is low due to the long chip flow process period of the AWG arrayed waveguide grating chip.

Disclosure of Invention

In view of the above, it is desirable to provide a method of packaging a light receiving module and a light receiving module capable of improving packaging efficiency.

In a first aspect, the present invention provides a method for packaging an optical receiving module, where the optical receiving module includes a first base, an optical fiber adapter module, a lens module, and an optical-to-electrical signal conversion module, where the optical-to-electrical signal conversion module includes a plurality of optical receiving channels, the method includes:

fixing a photoelectric signal conversion assembly on the first base;

fixing a fiber optic adapter assembly on the first base;

after a lens assembly is placed on an optical path between the optical fiber adapting assembly and the photoelectric signal conversion assembly, the lens assembly is fixed on a first target position; the lens assembly is used for coupling a plurality of incident light beams formed by splitting the light composite signal from the optical fiber adaptation assembly to a plurality of light receiving channels of the photoelectric signal conversion assembly.

In one embodiment, the optical receiving assembly further comprises a circuit board, and the photoelectric signal conversion assembly comprises a laser receiving array and a signal conversion circuit assembly;

the step of fixing the photoelectric signal conversion assembly on the first base includes:

respectively fixing the laser receiving array and the signal conversion circuit assembly on the first base;

the method further comprises the following steps:

and carrying out gold wire bonding on the signal conversion circuit assembly and the laser receiving array and the circuit board respectively.

In one embodiment, the laser receiving array comprises a plurality of laser receiving units and an array substrate, wherein the plurality of laser receiving units and the plurality of light receiving channels are arranged in a one-to-one correspondence manner;

the method further comprises the following steps:

fixing the laser receiving units on the array substrate respectively;

the step of fixing the laser receiving array on the first base includes:

bonding the array substrate to the first base;

and the step of carrying out gold wire bonding on the signal conversion circuit component, the laser receiving array and the circuit board respectively comprises the following steps:

and carrying out gold wire bonding on the plurality of laser receiving units and the signal conversion circuit component respectively.

In one embodiment, the optical-to-electrical signal conversion assembly comprises a laser receiving array comprising a plurality of sub-receiving arrays, each sub-receiving array comprising a plurality of light receiving channels, and the lens assembly comprises an optical splitting prism assembly, a plurality of optical demultiplexers, and a plurality of collimating lens arrays;

the method further comprises the following steps:

the optical splitting prism assembly, the plurality of optical demultiplexers and the plurality of collimating lens arrays are sequentially arranged on an incident light path facing the laser receiving array along the optical fiber adaptation assembly; the plurality of optical demultiplexers are respectively arranged in one-to-one correspondence with the plurality of collimating lens arrays, and the plurality of collimating lens arrays are respectively arranged in one-to-one correspondence with the plurality of sub-receiving arrays;

the step of fixing the lens assembly at the first target position comprises:

adjusting a position of at least one of the beam splitting prism assembly, the optical demultiplexer, and the collimating lens array to adjust the lens assembly to the first target position.

In one embodiment, the step of adjusting the position of at least one of the beam splitting prism assembly, the optical demultiplexer and the collimating lens array to adjust the lens assembly to the first target position comprises:

adjusting the beam splitting prism assembly to a second target position; the second target position is a position where the optical splitting prism assembly splits the optical composite signal from the optical fiber adapter assembly into a plurality of first incident light beams and couples the plurality of first incident light beams into the plurality of optical demultiplexers respectively; and/or the presence of a gas in the gas,

adjusting each optical demultiplexer to a third target position; each of the third target positions is a position where a plurality of second incident beams formed by splitting the first incident beams by each of the optical demultiplexers are coupled with the corresponding collimating lens array; and/or the presence of a gas in the gas,

adjusting each collimating lens array to a fourth target position respectively; the fourth target position is a position where each of the collimating lens arrays couples the plurality of second incident beams into the corresponding sub-receiving array.

In one embodiment, the beam splitting prism assembly comprises a filter and a reflector;

adjusting the beam splitting prism assembly to a second target position, comprising:

placing the optical filter on an incident light path of the optical fiber adapter assembly; the optical filter can transmit and reflect the optical composite signal from the optical fiber adapting component, and then split the light to form a plurality of first incident light beams incident along different incident light paths;

placing the reflector on a reflected light path of the optical filter;

adjusting the position of the optical filter and/or the reflector;

when the position of the optical filter and/or the reflecting mirror is adjusted to couple the plurality of first incident beams to the plurality of light demultiplexers, respectively, the beam splitting prism assembly is in the second target position.

In one embodiment, the fiber optic adapter assembly includes a second base and a collimating adapter, the second base;

the step of securing a fiber optic adapter assembly to the first base includes:

fixing the second base on the first base;

fixing the collimation adapter on a fifth target position of the second base; wherein the fifth target position is a position at which the light intensity of the optical composite signal coupled into the first base by the collimation adapter reaches a maximum value.

In the packaging method of the optical receiving assembly, the lens assembly is fixed on the first target position after being placed on the light path between the optical fiber adapting assembly and the photoelectric signal conversion assembly, at the moment, the lens assembly can couple a plurality of incident light beams formed after light composite signals from the optical fiber adapting assembly are split to a plurality of light receiving channels of the photoelectric signal conversion assembly respectively, so that the packaging of the optical receiving assembly with the plurality of receiving channels is realized.

In a second aspect, the present invention further provides a light receiving module, which is packaged by the packaging method of the light receiving module, and the light receiving module includes:

the optical fiber adapter assembly is used for receiving the optical composite signal;

the lens assembly is used for splitting the light composite signal from the optical fiber adapting assembly to form a plurality of incident light beams;

the photoelectric signal conversion assembly comprises a plurality of light receiving channels and is used for receiving a plurality of incident light beams from the lens assembly through the plurality of light receiving channels respectively and converting the plurality of incident light beams into a plurality of paths of electric input signals.

In one embodiment, the optical-to-electrical signal conversion assembly includes a laser receiving array, the laser receiving array includes a plurality of sub receiving arrays, each sub receiving array includes a plurality of light receiving channels, the lens assembly includes an optical splitter assembly and a plurality of optical demultiplexers, the optical demultiplexers are arranged in one-to-one correspondence with the sub receiving arrays, wherein:

the optical splitting prism assembly is used for splitting the optical composite signal from the optical fiber adapting assembly into a plurality of first incident beams, and then respectively injecting the plurality of first incident beams into the plurality of optical demultiplexers;

each optical demultiplexer is configured to split the first incident beam into a plurality of second incident beams, and then inject the plurality of second incident beams into the plurality of light receiving channels corresponding to the plurality of second incident beams, respectively;

the photoelectric signal conversion assembly is used for converting the plurality of second incident light beams into a plurality of paths of electric input signals.

In one embodiment, the beam splitting prism assembly comprises a filter and a reflector; wherein:

the optical filter is used for transmitting and reflecting the optical composite signal from the optical fiber adapting component, and then splitting the light to form a plurality of first incident light beams incident along different incident light paths;

the reflecting mirror is used for reflecting the first incident beam on the reflecting light path of the optical filter;

a portion of the plurality of optical demultiplexers is configured to receive the first incident beam transmitted from the optical filter, and another portion is configured to receive the first incident beam reflected from the optical filter and reflected by the reflecting mirror.

In the light receiving assembly, the light receiving assembly with multiple receiving channels is manufactured by packaging through the packaging method of the light receiving assembly, so that the packaging efficiency of the light receiving assembly is high, and the packaging cost of the light receiving assembly is greatly reduced.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments or the conventional technologies of the present application, the drawings used in the descriptions of the embodiments or the conventional technologies will be briefly introduced below, it is obvious that the drawings in the following descriptions are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a flow chart illustrating a method for packaging a light receiving module according to an embodiment;

FIG. 2 is a schematic flow chart of a gold wire bonding step according to one embodiment;

FIG. 3 is a schematic flow chart illustrating the loading steps of a laser receive array according to one embodiment;

FIG. 4 is a schematic flow chart of the position adjustment step of the lens assembly of one embodiment;

FIG. 5 is a schematic flow chart illustrating the steps for adjusting the position of the beam splitting prism assembly, the optical demultiplexer and the collimating lens array according to one embodiment;

FIG. 6 is a schematic flow chart illustrating the steps for adjusting the position of the beam splitting prism assembly, the optical demultiplexer and the collimating lens array according to one embodiment;

FIG. 7 is a flow chart illustrating the loading steps of one embodiment of a fiber optic adapter assembly;

FIG. 8 is a schematic structural diagram of a light receiving module according to one embodiment;

FIG. 9 is a schematic diagram of a partial structure of a beam splitting prism assembly according to one embodiment;

FIG. 10 is a schematic diagram of a photoelectric signal conversion module according to an embodiment;

FIG. 11 is a schematic structural diagram of an optical fiber adapter assembly, a lens assembly and an optical-to-electrical signal conversion assembly according to an embodiment after being assembled;

FIG. 12 is a schematic diagram of an optical fiber adapter assembly, a lens assembly, and an optical-to-electrical signal conversion assembly according to an embodiment;

FIG. 13 is a schematic diagram of a portion of the structure of a lens assembly and an optical-to-electrical signal conversion assembly according to one embodiment;

fig. 14 is a schematic structural view of the light receiving module according to the embodiment after being covered.

DETAILED DESCRIPTION OF EMBODIMENT (S) OF INVENTION

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

In the description of the present invention, it is to be understood that the terms "first", "second" and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means one or more, and "a plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise, wherein the meaning of "a plurality of groups", "a plurality of paths", and "a plurality of beams" is the same, and thus the description thereof is not repeated one by one.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

When the bonding is performed by means of glue bonding, the glue includes, but is not limited to, at least one of ultraviolet glue (such as AB glue), black glue, and silver glue; when the glue is ultraviolet glue, the ultraviolet glue can be applied between two objects to be bonded, the ultraviolet glue is pre-cured by an ultraviolet lamp, and then the pre-cured ultraviolet glue is baked at a preset temperature, so that the two objects to be bonded are fixedly bonded; when the glue is black glue or silver glue, the black glue or the silver glue can be firstly beaten between the two objects to be bonded, and then the black glue or the silver glue is baked at a preset temperature so as to realize the fixed bonding of the two objects to be bonded.

Referring to fig. 1, the present invention provides a method for packaging an optical receiving device, where the optical receiving device includes a first base, an optical fiber adapter, a lens assembly, and an optical-to-electrical signal conversion device, where the optical-to-electrical signal conversion device includes a plurality of optical receiving channels. The packaging method comprises the following steps:

step 102, fixing the photoelectric signal conversion assembly on a first base.

In step 102, the manner of fixing the photoelectric signal conversion assembly on the first base is not limited. For example, in some embodiments, the laser receiving array is fixed on the first base by means of glue bonding.

And 104, fixing the optical fiber adapter assembly on the first base.

In step 104, the optical fiber adapter module is fixedly disposed on the first base in an unlimited manner, and the optical fiber adapter module is fixed on the first base by, but not limited to, laser welding, glue bonding, clamping, riveting, or other mechanical fixing connection.

And 106, after the lens assembly is placed on the light path between the optical fiber adapting assembly and the photoelectric signal conversion assembly, fixing the lens assembly on the first target position.

In step 106, the lens assembly is used to couple a plurality of incident light beams formed by splitting the optical composite signal from the optical fiber adapter assembly to a plurality of light receiving channels of the optical-to-electrical signal conversion assembly.

It should be noted that the way of fixedly disposing the lens assembly on the first base is not limited, for example, in some embodiments, the lens assembly is fixedly disposed on the first base by means of glue bonding. Specifically, before step 106, ultraviolet glue is applied between the lens assembly and the first base, and in step 106, the ultraviolet glue is irradiated by an ultraviolet lamp to realize pre-curing treatment, and then is baked and fixed at a preset temperature of 110 ℃ to realize fixed adhesion between the lens assembly and the first base.

Preferably, when the lens assembly is fixed by bonding with the ultraviolet glue, since the ultraviolet glue needs to be irradiated with ultraviolet light, in order to avoid damage to the first base during the ultraviolet light irradiation, in some embodiments, the support pad may be bonded to the first base by non-ultraviolet glue (including but not limited to black glue or silver glue) before step 106, and in step 106, the lens assembly is placed on the support pad, and the lens assembly and the support pad are fixedly bonded by the ultraviolet glue, so as to fix the lens assembly on the first base.

As shown in fig. 2, in some embodiments, the light receiving assembly further includes a circuit board, and the optical-to-electrical signal conversion assembly includes a laser receiving array and a signal conversion circuit assembly.

Specifically, the laser receiving array includes a plurality of laser receiving units, each of which includes but is not limited to a photodiode, one photodiode serves as one light receiving channel, and the laser receiving array receives light signals through the plurality of light receiving channels and converts the light signals into electrical signals; the signal conversion circuit component is provided with a transimpedance amplifier, a capacitor and a resistor, the transimpedance amplifier amplifies the electric signals input by the laser receiving units and inputs the amplified electric signals into the circuit board.

The packaging method further comprises the following steps:

step 202, bonding the circuit board on the first base.

In step 202, the circuit board is bonded to the first base through the black adhesive, specifically, the black adhesive is firstly applied between the circuit board and the first base, and then the black adhesive is baked for 60-120 minutes at the baking temperature of 120 ℃, or the black adhesive is baked for 45-60 minutes at the baking temperature of 150 ℃.

and step 204, respectively fixing the laser receiving array and the signal conversion circuit assembly on the first base.

In step 204, the laser receiving array and the signal conversion circuit module may be bonded to the first base by glue, and specifically, the silver paste is applied between the first base and the laser receiving array and the signal conversion circuit module, respectively, and then the silver paste is baked at a baking temperature of 150 ℃ for 60 minutes.

The packaging method further comprises the following steps:

and step 206, carrying out gold wire bonding on the signal conversion circuit assembly and the laser receiving array and the circuit board respectively.

In step 206, when the signal conversion circuit assembly and the laser receiving array are subjected to gold wire bonding, two times of ultrasonic welding are required to be performed at a temperature of 110 ℃ respectively, so that the plurality of laser receiving units are connected to the input end of the transimpedance amplifier, the ultrasonic power in the first ultrasonic welding process is 160-170, the ultrasonic time is 30ms, the ultrasonic pressure is 18-22 g, and the ultrasonic pressure in the second ultrasonic welding process is 160-180, the ultrasonic time is 30ms, and the ultrasonic pressure is 18-22 g; the signal conversion circuit component and the circuit board are subjected to gold wire bonding so as to connect the output end of the transimpedance amplifier to the circuit board, the ultrasonic welding process of the gold wire bonding is basically the same as the ultrasonic welding process of the signal conversion circuit component and the laser receiving array during the gold wire bonding, and the difference is that the ultrasonic power in the first ultrasonic welding process is 160-180, and the ultrasonic power in the second ultrasonic welding process is 200-220.

It should be noted that, the step 202 may be specifically set according to the actual packaging situation, and the circuit board may be embedded in the first base, so that the circuit board may be fixed in the first base through the step 202, and no other fixture is needed for assistance when performing gold wire bonding, thereby reducing the execution difficulty of the step 206, and improving the reliability of gold wire bonding, thereby ensuring that reliable electrical connection between the laser carrier and the circuit board can be achieved, and further improving the yield of packaged products.

Further, as shown in fig. 3, in some embodiments, the laser receiving array further includes an array substrate. The packaging method further comprises the following steps:

step 302, fixing a plurality of laser receiving units on the array substrate respectively.

In step 302, the fixing manner between the laser receiving units and the array substrate is not limited, for example, in some embodiments, the silver paste may be applied between the laser receiving units and the array substrate by silver paste baking for 60 minutes at a baking temperature of 150 ℃.

The step of fixing the laser receiving array on the first base includes:

step 304, bonding the array substrate on the first base.

In step 304, a silver paste is applied between the array substrate and the first base, and then the silver paste is baked at 150 ℃ for 60 minutes to bond the two.

The method comprises the following steps of carrying out gold wire bonding on a signal conversion circuit component, a laser receiving array and a circuit board respectively, wherein the steps comprise:

and step 306, performing gold wire bonding on the plurality of laser receiving units and the signal conversion circuit component respectively.

It should be noted that the signal conversion circuit component may also be an integrated structure directly integrated on the first base, or may be a modular structure, and when the signal conversion circuit component is a modular structure, the signal conversion circuit component further includes a component substrate, the component substrate includes but is not limited to a ceramic substrate, the capacitor, the resistor, and the transimpedance amplifier are respectively bonded to the ceramic substrate through silver paste to form a modular signal conversion circuit component, and the modular signal conversion circuit component is fixed on the first base through a glue bonding manner.

It should be noted that, through the step 302 and the step 306 or the step of fixing the modular signal conversion circuit assembly, the laser receiving array and the signal conversion circuit assembly can be modularly arranged, and the modularized structure is easily installed on the first base, which is beneficial to simplifying the fixing process of the laser receiving array and the signal conversion circuit assembly and improving the packaging efficiency.

In some embodiments, the laser receiving array comprises a plurality of sub-receiving arrays, each sub-receiving array comprising a plurality of lasers, each laser having a structure including, but not limited to, a laser emitting chip, wherein each laser serves as a light emitting channel; the lens assembly comprises a plurality of collimating lenses, a plurality of optical demultiplexers and a light splitting prism assembly, the structural form of the optical demultiplexer comprises but is not limited to a Z-block optical demultiplexing structure, a plurality of optical filters are attached to each optical demultiplexer, and the plurality of optical filters of the same optical demultiplexer are respectively arranged in one-to-one correspondence with the plurality of collimating lenses corresponding to the optical demultiplexer.

It should be noted that the number of the sub-receiving arrays and the number of the lasers in each sub-receiving array are not limited, and the number of the optical demultiplexers matches the number of the sub-generating arrays, and the number of the collimating lenses matches the number of the lasers.

As shown in fig. 4, the step of placing the lens assembly on the optical path between the laser receiving array and the optical fiber adapter assembly and adjusting the lens assembly to the target position includes:

step 402, a beam splitting prism assembly, a plurality of optical demultiplexers and a plurality of collimating lens arrays are sequentially arranged on an incident light path facing the laser receiving array along the optical fiber adapting assembly.

In step 402, the plurality of optical demultiplexers are respectively disposed in one-to-one correspondence with the plurality of collimator lens arrays, and the plurality of collimator lens arrays are respectively disposed in one-to-one correspondence with the plurality of sub-receiving arrays.

The step of securing the lens assembly at the first target position comprises:

at step 404, a position of at least one of the optical prism assembly, the optical demultiplexer, and the collimating lens array is adjusted to adjust the lens assembly to the first target position.

In step 404, adaptive adjustment is performed according to actual positions of the optical demultiplexer, the optical splitting prism assembly, and the collimating lens array, for example, positions of all the optical demultiplexer, the optical splitting prism assembly, and the collimating lens array may be adjusted cooperatively at the same time, or positions of only some optical devices in the optical demultiplexer, the collimating lens array, and the optical splitting prism assembly may be adjusted cooperatively.

Through the arrangement of the

steps

402 and 404, the reliability of optical signal transmission of the optical receiving component can be effectively ensured, which is beneficial to ensuring the good product rate of optical receiving component packaging.

Preferably, before step 402, each collimating lens array includes a plurality of collimating lenses, the plurality of collimating lenses are respectively disposed in one-to-one correspondence with the plurality of laser receiving units, and the plurality of collimating lenses can be bonded to the lens array cover plate to form a collimating lens array.

Further, as shown in fig. 5, in some embodiments, the step of adjusting the position of at least one of the prism assembly, the optical demultiplexer and the collimating lens array to adjust the lens assembly to the first target position comprises:

step 502, adjusting the beam splitting prism assembly to a second target position.

In step 502, the second target position is a position where the optical splitting prism assembly couples the plurality of first incident beams formed by splitting the optical composite signal from the optical fiber adapter assembly into the plurality of optical demultiplexers, respectively; and adjusting the position of the optical splitting prism assembly, and when the optical splitting prism assembly is adjusted to be capable of coupling a plurality of first incident beams formed by splitting the optical composite signal from the optical fiber adaptation assembly into a plurality of optical demultiplexers respectively, determining that the optical splitting prism assembly is in a second target position.

In step 504, each optical demultiplexer is adjusted to a third target position.

In step 504, each third target position is a position where a plurality of second incident beams formed by splitting the first incident beam by each optical demultiplexer are coupled to the corresponding collimating lens array; specifically, the position of each optical demultiplexer is adjusted, and when the optical demultiplexer is adjusted to couple the plurality of second incident beams formed by splitting the first incident beam into the plurality of second incident beams corresponding to the plurality of second incident beams, the optical demultiplexer is considered to be at the third target position.

Step 506, adjust each collimating lens array to a fourth target position.

In step 506, the fourth target position is that each collimating lens array couples the plurality of second incident light beams into the corresponding sub-receiving array; specifically, the position of the collimating lens array is adjusted, and when the collimating lens array is adjusted to be capable of coupling the plurality of second incident light beams into the corresponding sub-receiving arrays respectively, the collimating lens array is considered to be at the fourth target position.

Step 508, when the optical splitting prism assembly is adjusted to the second target position, each optical demultiplexer is adjusted to the third target position, and each collimating lens array is adjusted to the fourth target position, it is determined that the lens assembly has been adjusted to the first target position; subsequent steps may then be performed to adhesively secure the beam splitting prism assembly, the optical demultiplexer, and the array of collimating lenses to the first base, respectively.

Step 502 and step 506 above may be selectively performed according to actual adjustment requirements, for example, in some embodiments, after performing step 502 and step 504, the collimating lens array is already at the second target position on the premise that the collimating lens array does not need to be subjected to position adjustment, where the execution condition of step 508 is also satisfied, and then step 506 does not need to be performed; in other embodiments, it is also feasible to perform only two of the steps 502-506, and the implementation principle thereof is not described herein again.

Further, as shown in fig. 6, in some embodiments, the beam splitting prism assembly includes a filter and a mirror.

step 602, a filter is placed on an incident light path of the optical fiber adapter assembly.

In step 602, after the optical filter transmits and reflects the optical composite signal from the optical fiber adapter, the optical composite signal is split into a plurality of first incident beams incident along different incident optical paths;

step 604, placing a reflector on a reflection light path of the optical filter.

Step 606, position adjustment is performed on the filter and/or the reflector.

In step 608, when the positions of the optical filter and/or the mirror are adjusted to couple the first incident light beams to the optical demultiplexers, respectively, the prism assembly is in the second target position.

Further, as shown in FIG. 7, the fiber optic adapter assembly includes a second base and a collimating adapter, the second base.

The step of securing the fiber optic adapter assembly to the first base includes:

step 702, fixing the second base on the first base.

In step 702, the second base fixes the optical fiber adapter module on the first base by laser welding, glue bonding, clamping, riveting or other mechanical fixing connection.

And step 704, fixing the collimation adapter on a fifth target position of the second base.

Wherein, in step 704, the fifth target position is a position at which the light intensity of the optical composite signal coupled into the first base by the collimating adapter reaches a maximum value; here, after the collimation adapter is clamped by using the coupling clamp to be adjusted to the fifth target position, the collimation adapter and the second base are fixed in a mode of ultraviolet glue bonding.

It should be understood that although the various steps in the flow charts of fig. 1-7 are shown in order as indicated by the arrows, the steps are not necessarily performed in order as indicated by the arrows. The steps are not performed in the exact order shown and described, and may be performed in other orders, unless explicitly stated otherwise. Moreover, at least some of the steps in fig. 1-7 may include multiple steps or multiple stages, which are not necessarily performed at the same time, but may be performed at different times, which are not necessarily performed in sequence, but may be performed in turn or alternately with other steps or at least some of the other steps.

For the convenience of understanding of the above packaging method, the following description will be made based on an embodiment in which the laser receiving array includes two sub receiving arrays, the first sub receiving array includes four first lasers, and the second sub receiving array includes four second lasers, and the above packaging method includes, but is not limited to, the following examples, please refer to fig. 9-14 in particular:

step 1, the circuit board 406 is adhered to the first base 402 by black glue.

Step 2, adhering the first sub receiving array 302 and the first sub receiving array 311 to the first array substrate 301 and the second array substrate 310 respectively through silver glue; the capacitor 303, the resistor 305, the capacitor 306, the capacitor 308 and the transimpedance amplifier 307 are bonded to the ceramic substrate 304 through silver paste to form a first signal conversion circuit component; the capacitor 312, the resistor 309, the capacitor 316, the capacitor 315 and the transimpedance amplifier 314 are bonded to the ceramic substrate 313 by silver paste to form a second signal conversion circuit component.

And 3, adhering the adhered assembly in the step 2 in the first base 402 by using silver glue.

And 4, connecting the components in the step 3 to the circuit board 406 through gold wire bonding.

Step 5, bonding the first collimating lens array on the first lens cover plate 404 by using ultraviolet glue, bonding the second collimating lens array on the second array cover plate 408 by using ultraviolet glue, bonding the first reflector 201 and the optical filter 202 on the 203_ silk screen carrier by using ultraviolet glue, bonding the 203_ silk screen carrier in the first base 402 by using black glue, and bonding the third reflector plate 405 and the fifth reflector plate 407 in the first base 402 by using ultraviolet glue.

And 6, bonding the rhombic prism 103 on the prism cushion block 102 by using ultraviolet glue, and bonding the prism cushion block 102 on the light seat bottom plate 703 by using the ultraviolet glue.

And 7, welding the prism cushion block 102, the rhombic prism 103 and the optical seat bottom plate 703 assembly on the second base 104 by using laser, and then welding the second base 104 on the optical port 401 by using laser.

Step 8, welding the collimation adapter 101 to the second base 104 by using laser; in the example, the collimation adapter 101 is held by a coupling jig, and laser welding is performed after the collimation adapter 101 is coupled to a position (i.e., a fifth target position) at which the light intensity reaches the maximum value by monitoring through coupling software by adjusting the direction and the angle of the coupling jig.

Step 9, the first light demultiplexer 403, the first collimating lens array, and the first lens cover 404 are bonded to the first base 402 by using uv glue, and the second demultiplexer 409, the second collimating lens array 502, the second array cover 408, and the second mirror 410 are bonded to the first base 402 by using uv glue.

Specifically, the optical demultiplexer and the collimating lens array are clamped by the coupling clamp, the direction and the angle of the optical demultiplexer and the collimating lens array are monitored and adjusted by coupling software to achieve the optimal optical position, namely, the optical demultiplexer is adjusted to the third target position, and when the collimating lens array is adjusted to the fourth target position, the ultraviolet glue is used for curing.

Step 10, the first cover plate 701 is adhered to the first base 402 by using black glue, and the light seat cover plate 702 is adhered to the second base 104 by using black glue.

As shown in fig. 8, the present invention further provides an optical receiving assembly 800 packaged by the above packaging method, which includes the optical fiber adapter assembly 100, the lens assembly 200, and the optical-to-electrical signal conversion assembly 300, wherein:

an optical fiber adapter assembly 100 for receiving the optical composite signal; the lens assembly 200 is used for splitting the light composite signal from the optical fiber adapter assembly 100 to form a plurality of incident light beams; the optical-to-electrical signal conversion module 300 includes a plurality of light receiving channels, and is configured to receive a plurality of incident light beams from the lens module 200 through the plurality of light receiving channels, respectively, and convert the plurality of incident light beams into a plurality of electrical input signals.

In some embodiments, the optical-to-electrical signal conversion assembly 300 includes a laser receiving array and a signal conversion circuit assembly 320, the laser receiving array includes a plurality of sub-receiving arrays 310, each sub-receiving array 310 includes a plurality of light receiving channels, the lens assembly 200 includes an optical splitter assembly 210 and a plurality of optical demultiplexers 220, the plurality of optical demultiplexers 220 are arranged in a one-to-one correspondence with the plurality of sub-receiving arrays 310, wherein:

the optical splitting prism assembly 210 is configured to split the optical composite signal from the optical fiber adapter assembly into a plurality of first incident beams, and then inject the plurality of first incident beams into the plurality of optical demultiplexers 220, respectively;

each optical demultiplexer 220 is configured to split the first incident beam into a plurality of second incident beams, and then inject the plurality of second incident beams into the plurality of corresponding optical receiving channels respectively;

the optical-to-electrical signal conversion module 230 is configured to convert the plurality of second incident light beams into a plurality of electrical input signals.

More preferably, in some embodiments, the lens assembly 200 further includes a plurality of collimating lens arrays 230, the plurality of collimating lens arrays 230 are disposed in one-to-one correspondence with the plurality of optical demultiplexers 220, and the collimating lens arrays 230 are configured to converge the optical signals to the sub-receiving arrays 310.

In some embodiments, the beam splitting prism assembly 300 includes a filter and a mirror; wherein:

the optical filter is used for splitting light to form a plurality of first incident light beams incident along different incident light paths after transmitting and reflecting the optical composite signal from the optical fiber adapter assembly;

a portion of the plurality of optical demultiplexers 220 is configured to receive the first incident beam transmitted from the optical filter, and another portion is configured to receive the first incident beam reflected from the optical filter and reflected by the mirror.

Furthermore, for convenience of understanding, the following description will be given by referring to an example, but the technical solution of the present invention is not limited to the following example, and specifically:

as shown in fig. 9-14, in some embodiments, a WDM8 optical signal (i.e., an optical composite signal) enters the collimating adapter 101 through an external LC fiber jump, and the optical composite signal is collimated into parallel light, passes through the rhombic prism 103, is translated to the position of the optical port 401, and enters the inside of the first base 402; the optical composite signal enters the first pedestal 402 and is transmitted and reflected by the optical filter 202.

A first incident beam with a part of wavelength is transmitted from the optical filter 202 to enter the first optical demultiplexer 403, the first incident beam entering the first optical demultiplexer 403 is divided into four parallel beams (i.e., a second incident beam) to enter the first collimating lens array, the four parallel beams passing through the first collimating lens array are focused respectively and then reflected by the third reflector 405 to enter the first sub-receiving array 302, the first sub-receiving array 302 converts the four optical signals into four electrical signals, the four electrical signals enter the first transimpedance amplifier 307 through gold wires, the first transimpedance amplifier 307 is connected to the circuit board 406 through gold wires, and a voltage signal output by the first transimpedance amplifier 307 passes through the circuit board 406 and then transmits the four electrical signals to a hardware circuit at the rear end of the optical module.

The other part of the wavelength of the first incident beam is reflected from the optical filter 202, and then enters the second demultiplexer 409 through the reflection of the first reflector 201 and the second reflector 410, the second demultiplexer 409 divides the first incident beam into four paths of parallel light (i.e., a second incident beam) and enters the second collimating lens array 502, the four paths of parallel light are focused and amplified by the second collimating lens array 502 and then enter the second sub-transmitting array 311 through the fifth reflector 407, the second sub-transmitting array 311 converts the four paths of optical signals into four paths of electrical signals and enters the second transimpedance amplifier 314 through gold wires, the second transimpedance amplifier 314 amplifies the four paths of electrical signals and enters the circuit board 406 through gold wire connection, and the circuit board 406 transmits the four paths of electrical signals to the rear-end hardware circuit of the optical module.

In the description herein, references to the description of "some embodiments," "other embodiments," "desired embodiments," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, a schematic description of the above terminology may not necessarily refer to the same embodiment or example.

The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express a few embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A method for packaging an optical receiving module, wherein the optical receiving module includes a first base, an optical fiber adapter module, a lens module, and an optical-to-electrical signal conversion module, and the optical-to-electrical signal conversion module includes a plurality of optical receiving channels, the method comprising:

fixing a photoelectric signal conversion assembly on the first base;

fixing a fiber optic adapter assembly on the first base;

2. The method of claim 1, wherein the light receiving assembly further comprises a circuit board, the optical-to-electrical signal conversion assembly comprises a laser receiving array and a signal conversion circuit assembly;

the method further comprises the following steps:

3. The method of claim 2, wherein the laser receiving array comprises a plurality of laser receiving units and an array substrate, and the plurality of laser receiving units and the plurality of light receiving channels are arranged in a one-to-one correspondence;

the method further comprises the following steps:

fixing the laser receiving units on the array substrate respectively;

the step of fixing the laser receiving array on the first base includes:

bonding the array substrate to the first base;

4. The method of claim 1, wherein the optical-to-electrical signal conversion assembly comprises a laser receiving array comprising a plurality of sub-receiving arrays, each sub-receiving array comprising a plurality of light receiving channels, and the lens assembly comprises an optical splitting prism assembly, a plurality of optical demultiplexers, and a plurality of collimating lens arrays;

the method further comprises the following steps:

the step of fixing the lens assembly at the first target position comprises:

5. The method of claim 4, wherein adjusting the position of at least one of the beam splitting prism assembly, the optical demultiplexer, and the collimating lens array to adjust the lens assembly to the first target position comprises:

6. The method of claim 4, wherein the beam splitting prism assembly comprises a filter and a mirror;

placing the reflector on a reflected light path of the optical filter;

adjusting the position of the optical filter and/or the reflector;

7. The method of any of claims 1-6, wherein the fiber optic adapter assembly includes a second base and a collimating adapter, the second base;

the step of securing a fiber optic adapter assembly to the first base includes:

fixing the second base on the first base;

8. A light receiving module packaged by the packaging method of the light receiving module according to any one of claims 1 to 7, the light receiving module comprising:

9. The optical receiving module of claim 8, wherein the optical-to-electrical signal conversion module comprises a laser receiving array, the laser receiving array comprises a plurality of sub receiving arrays, each sub receiving array comprises a plurality of optical receiving channels, the lens assembly comprises an optical splitter prism assembly and a plurality of optical demultiplexers, the plurality of optical demultiplexers are arranged in one-to-one correspondence with the plurality of sub receiving arrays, and wherein:

10. The light receiving assembly of claim 9, wherein the beam splitting prism assembly comprises a filter and a mirror; wherein: