CN114351100B

CN114351100B - Anti-chromatic aberration anti-reflection film coating equipment

Info

Publication number: CN114351100B
Application number: CN202111507057.7A
Authority: CN
Inventors: 杨鹏
Original assignee: Wanjin Industrial Chibi Co Ltd
Current assignee: Wanjin Industrial Chibi Co Ltd
Priority date: 2021-12-10
Filing date: 2021-12-10
Publication date: 2023-11-03
Anticipated expiration: 2041-12-10
Also published as: CN114351100A

Abstract

The application relates to an anti-chromatic aberration and anti-reflection film coating device which comprises a machine body, a sputtering component, a biasing component and a hanging plate, wherein the sputtering component is arranged on the machine body; the housing cavity is arranged in the machine body, and the first magnet is fixedly arranged in the machine body; the sputtering assembly comprises a radio frequency ion source; at least one biasing assembly provided with a second magnet, controllably rotatable relative to the body about a central axis of the body, the biasing assembly being rotatable relative to the first magnet to produce a positive bias; each hanging plate rotates around the central axis of the machine body in a controlled manner relative to the machine body so as to circularly pass through the connecting line of each sputtering component and the central axis of the machine body, and each hanging plate is correspondingly connected with the biasing component one by one, so that when the hanging plate passes through the connecting line of the radio frequency ion source and the central axis of the machine body, the local area of the hanging plate is in a positive bias electric field. In the scheme, the magnetic field is utilized and the magnetic induction lines are cut to form positive bias, and the local area of the hanging plate is positioned in the positive bias electric field, so that the refractive index is increased due to insufficient reaction of the area, the film coating effect is naturally transited, and chromatic aberration is avoided.

Description

Anti-chromatic aberration anti-reflection film coating equipment

Technical Field

The application relates to the technical field of sputter coating, in particular to an anti-chromatic aberration anti-reflection film coating device.

Background

Sputtering is a technique of bombarding the surface of a target material with energetic particles in vacuum to deposit the bombarded particles on a substrate. Generally, low pressure inert gas glow discharge is utilized to generate incident ions. In recent years, an antireflection film is applied to a flat PAD (tablet personal computer) cover plate, but color difference is easy to occur in an ink area of the antireflection film under strong light, because the single-sided reflectivity of the front surface of original glass in the visible light wave band of 400-700nm is approximately 4.2% due to the reduction of the reflectivity of the antireflection film, the reflectivity curve at the moment is a straight line as shown in fig. 1, the reflectivity curve of the glass after the reflection film is coated becomes an uneven curve as shown in fig. 2, and the uneven reflection curve shows obvious color when the glass is irradiated under strong light. When errors occur in the processing of the film, the ink areas on the same cover plate will display different colors, which results in unacceptable consumer.

The prior art improves the reflectivity of a certain color area (such as blue) and improves the processing precision of a film to reduce the chromatic aberration, but the improvement of the reflectivity of the certain color area can lead to the increase of the overall reflectivity, which is contrary to the effect of an anti-reflection film, the prior art can also improve the problems by improving the processing precision of a film plating machine, but the improvement of the processing precision of the film plating machine can increase the investment of cost.

Disclosure of Invention

Based on the above, it is necessary to provide an anti-chromatic aberration anti-reflection film coating device, which aims to solve the problem that the anti-chromatic aberration occurs in the anti-reflection film in the prior art.

The application provides an anti-chromatic aberration anti-reflection film coating device which comprises a machine body, a sputtering component, a biasing component and a hanging plate, wherein the sputtering component is arranged on the machine body; the machine body is internally provided with a containing cavity, and is fixedly provided with a first magnet; at least one sputtering component is fixedly arranged on the inner side wall of the machine body along the circumferential direction of the machine body, and comprises a radio frequency ion source; at least one of the biasing assemblies provided with a second magnet, which is accommodated in the accommodating cavity in a distributed manner along the circumferential direction of the machine body and each of which is controlled to rotate relative to the machine body around the central axis of the machine body, wherein the magnetic pole of the second magnet is opposite to the magnetic pole of the first magnet so that the second magnet generates a magnetic field when facing the first magnet, and the biasing assemblies rotate relative to the first magnet to generate positive bias; at least one hanging plate is used for loading products, each hanging plate is controlled to rotate around the central axis of the machine body relative to the machine body so as to circularly pass through the connecting line of each sputtering component and the central axis of the machine body, and each hanging plate is connected with the biasing components in a one-to-one correspondence mode, so that when the hanging plate passes through the connecting line of the radio frequency ion source and the central axis of the machine body, the local area of the hanging plate is in a positive bias electric field.

According to the technical scheme, the hanging plate is connected with the bias assembly, the first magnet is arranged on the machine body, the first magnet and the second magnet arranged on the bias assembly form a magnetic field, the formed magnetic field is used for cutting a magnetic induction line to form a positive bias electric field, a local area of the hanging plate is positioned in the positive bias electric field, the positive bias electric field is used for inhibiting bombardment of oxygen positive ions or nitrogen positive ions emitted by the radio frequency ion source, so that the refractive index is increased due to insufficient reaction of the area, and the film coating effect is naturally transited by using the natural transition of the strength and the weakness of the electric field, so that chromatic aberration is avoided.

The technical scheme of the application is further described as follows:

in any embodiment, the bias assembly further comprises a magnetic induction wire cutting device, wherein two ends of the magnetic induction wire cutting device are respectively connected with the hanging plate and the ground, and the magnetic induction wire cutting device is at least partially arranged between the first magnet and the second magnet and performs cutting magnetic induction wire movement relative to a magnetic field formed by the first magnet and the second magnet so as to form positive bias.

In any embodiment, the magnetic induction wire cutting device comprises a grounding end, a wire winding and an insulated wire, wherein the grounding end, the wire winding and the insulated wire are connected, the wire winding is wound on the second magnet, and the insulated wire is connected to the hanging plate.

In any embodiment, the wire winding includes a cut end and a connection end connected in series, the cut end being located between the first magnet and the second magnet and performing a cutting induction line movement with respect to a magnetic field formed by the first magnet and the second magnet to form a positive bias voltage, the connection end being located on a side of the second magnet remote from the first magnet and connecting a plurality of the cut ends in series.

In any embodiment, the insulated wire is attached to the surface of the hanging plate such that the area covered by the insulated wire of the hanging plate is in a positive bias electric field.

In any embodiment, the first magnet is located at an outer periphery fixed at one end of the body along the axis of the body and is coplanar with the rf ion source and the central axis.

In any embodiment, the biasing assembly is disposed radially of the body.

In any embodiment, the sputtering assembly further comprises at least one target and at least one molecular pump set.

In any embodiment, the rotary device further comprises a rotary piece, wherein the rotary piece is accommodated in the accommodating cavity and is coaxially arranged with the machine body, the rotary piece is controlled to rotate around the axis of the rotary piece relative to the machine body, and the biasing assembly and the hanging plate are both installed on the peripheral surface of the rotary piece.

In any embodiment, the device further comprises a driving assembly, wherein a mounting hole is formed in one end of the machine body, one end of the driving assembly penetrates through the mounting hole to extend into the accommodating cavity and is connected with one end of the rotating piece in the self axis direction to drive the rotating piece to rotate around the self axis direction.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application, illustrate and explain the application and are not to be construed as limiting the application.

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a reflection curve of a cover plate without an anti-reflection film;

FIG. 2 is a reflection curve of a cover plate after an anti-reflection film is plated;

FIG. 3 is a top view of a coating apparatus according to an embodiment of the present application;

FIG. 4 is a schematic side sectional view of the plating apparatus of FIG. 3;

FIG. 5 is a schematic view of the biasing assembly and hanger plate of FIG. 3;

FIG. 6 is a schematic diagram of the biasing assembly of FIG. 5;

FIG. 7 is a schematic view of the hanger plate of FIG. 5;

fig. 8 is a schematic view of the hanging plate of fig. 7 loaded with product.

Reference numerals illustrate:

100. coating equipment; 110. a body; 111. a receiving chamber; 112. a first magnet; 120. a sputtering assembly; 121. a radio frequency ion source; 122. a target material; 123. a molecular pump group; 130. a biasing assembly; 131. a second magnet; 132. a magnetic induction wire cutting device; 1321. a grounding end; 1322. a wire winding; 13221. cutting the end; 13222. a connection end; 1323. an insulated wire; 140. a hanging plate; 150. a rotating member; 160. a drive assembly;

20. a product; 201. a display area; 202. and (3) an ink area.

Detailed Description

In order that the above objects, features and advantages of the application will be readily understood, a more particular description of the application will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. The application may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit or scope of the application, which is therefore not limited to the specific embodiments disclosed below.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having" and any variations thereof in the description of the application and the claims and the description of the drawings above are intended to cover a non-exclusive inclusion.

In the description of the embodiments of the present application, the term "and/or" is merely an association relationship describing an association object, and means that three relationships may exist, for example, a and/or B may mean: a exists alone, A and B exist together, and B exists alone. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship.

In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.

In the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present application, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.

The preferred embodiments of the present application will be described below with reference to the accompanying drawings.

Referring to fig. 3 to 5, an anti-chromatic aberration-preventing and anti-reflection film coating apparatus 100 according to an embodiment of the present application includes a body 110, at least one sputtering component 120, a biasing component 130, and a hanging plate 140. The housing 111 is disposed in the body 110, and the body 110 is fixedly provided with a first magnet 112. The sputtering assembly 120 is fixedly disposed on an inner sidewall of the body 110 along a circumferential direction of the body 110, and the sputtering assembly 120 includes a rf ion source 121. At least one biasing assembly 130 provided with a second magnet 131 is accommodated in the accommodating cavity 111 in a distributed manner along the circumferential direction of the body 110, and each biasing assembly 130 is controlled to rotate relative to the body 110 around the central axis of the body 110, the magnetic pole of the second magnet 131 is opposite to the magnetic pole of the first magnet 112 so that the second magnet 131 generates a magnetic field when facing the first magnet 112, and the biasing assembly 130 rotates relative to the first magnet 112 to generate a positive bias. At least one hanging plate 140 for carrying the product 20, each hanging plate 140 being controlled to rotate relative to the body 110 about a central axis of the body 110 to circulate through a connection of each sputtering assembly 120 to the central axis of the body 110, each hanging plate 140 being connected to the biasing assembly 130 such that a localized region of the hanging plate 140 is within a forward biasing electric field when the hanging plate 140 passes through the connection of the rf ion source 121 to the central axis of the body 110.

The sputtering component 120 is used for generating energetic particles and bombarding the energetic particles onto the surface of the product 20 to be coated. Optionally, the sputtering assembly 120 comprises a radio frequency ion source 121, and further comprises at least one target 122 and at least one molecular pump group 123, according to some embodiments of the present application. Wherein, argon is introduced into the target 122 to sputter out the elemental atoms, and the rf ion source 121 is responsible for reacting the elemental particles into a compound. Specifically, the target 122 is responsible for sputtering silicon, and the ion source is responsible for ionizing the gas into positive ions, which react with the silicon to silicon nitride or silicon oxide.

In the present embodiment, the number of targets 122 is 3, and the number of rf ion sources 121 is cutting. 2 molecular pump sets 123 are also arranged between the target 122 and the radio frequency ion source 121, and the molecular pump sets 123 are used for avoiding the volatilization of the reaction gas to the surface of the target 122 to participate in the reaction.

The rf ion source 121 ionizes the gas using a high frequency discharge phenomenon in the lean gas to generate low-charge positive ions. In a high frequency electric field, free electrons collide with atoms (or molecules) in the gas and ionize it. As a result of the multiplication of the charged particles, an electrodeless discharge is formed, producing a large amount of plasma. In this embodiment, the rf ion source 121 is supplied with a reactive gas such as oxygen and nitrogen.

The order of the magnetic poles of the first magnet 112 and the second magnet 131 is not particularly limited, and may be N-S pole or S-N pole, as long as the opposite magnetic poles are ensured. When the two magnetic poles are opposite, the two magnetic poles can generate a magnetic field when facing each other, so as to generate a magnetic induction line.

The hanging plate 140 rotates relative to the body 110 and circulates through each sputtering assembly 120, so that the product 20 loaded by the hanging plate 140 can pass through each sputtering assembly 120 and can be bombarded on the surface by different sputtering assemblies 120 to realize the coating effect.

The biasing assembly 130 rotates relative to the first magnet 112 and performs a cutting induction line motion relative to the magnetic fields generated by the first magnet 112 and the second magnet 131 to generate a positive bias. The hanging plate 140 is connected with the biasing assembly 130, so that the positive bias generated by the biasing assembly 130 can affect the production of the hanging plate 140, and at least part of the area of the hanging plate 140 is in the positive bias electric field.

The region of the hanging plate 140 in the positive bias electric field suppresses bombardment of oxygen positive ions or nitrogen positive ions emitted from the rf ion source 121 by the positive bias electric field, thereby causing insufficient reaction of the region to increase the refractive index, thereby causing an increase in the reflection effect thereof, and thus reducing chromatic aberration. The areas not in the positive bias electric field are not affected by the positive bias electric field, and other areas are normally coated. As the strength of the forward bias electric field gradually weakens from the position of the lead to the far, the degree of influence of the forward bias electric field is smaller from the near to the far, the reaction degree is more and more full from the near to the far, the reflectivity of the film coated during the film coating effect is naturally transited, and the chromatic aberration is avoided.

In the above-mentioned scheme, the hanging plate 140 is connected with the biasing assembly 130, the first magnet 112 is disposed on the machine body 110, so that a magnetic field is formed between the hanging plate and the second magnet 131 disposed on the biasing assembly 130, and a positive bias is formed by cutting a magnetic induction line by using the formed magnetic field, so that a local area of the hanging plate 140 is in a positive bias electric field, and the positive bias electric field is used to inhibit bombardment of oxygen positive ions or nitrogen positive ions emitted by the rf ion source 121, thereby causing insufficient reaction in the area to increase the refractive index, and the natural transition of the strength of the electric field is used to cause the natural transition of the coating effect, so as to avoid chromatic aberration.

Referring to fig. 5, according to some embodiments of the present application, the bias assembly 130 further includes a magnetic induction wire cutting device, wherein two ends of the magnetic induction wire cutting device are respectively connected to the hanging plate 140 and the ground, and the magnetic induction wire cutting device is at least partially interposed between the first magnet 112 and the second magnet 131 and performs a cutting magnetic induction wire movement relative to a magnetic field formed by the first magnet 112 and the second magnet 131 to form a positive bias.

Grounding is understood to mean that the neutral point of the electrical system and electrical device, the exposed conductive parts of the electrical equipment and the conductive parts outside the device are connected to ground via conductors. Typically, the voltage at the default ground position is zero.

When the biasing assembly 130 rotates around the central axis of the body 110, the magnetic induction wire cutting device also moves in the magnetic field and cuts the magnetic induction wire, and the cutting of the magnetic induction wire generates a current, which is called an electromagnetic induction phenomenon, and the generated current is called an induced current.

Referring to fig. 6, according to some embodiments of the present application, the magnetic induction wire cutting device 132 may optionally include a ground terminal 1321, a wire winding 1322 and an insulated wire 1323 connected to each other, the wire winding 1322 is wound around the second magnet 131, and the insulated wire 1323 is connected to the hanging plate 140. Wherein, the grounding end 1321 is connected to the body 110 or the rotating member 150, because the body 110 and the rotating member 150 are connected to the ground, the grounding is equal to the grounding on the rotating member 150.

Referring to fig. 6, in accordance with some embodiments of the present application, the wire winding 1322 optionally includes a cutting end 13221 and a connecting end 13222 connected in series, the cutting end 13221 being located between the first magnet 112 and the second magnet 131 and performing a cutting induction line motion with respect to a magnetic field formed by the first magnet 112 and the second magnet 131 to form a positive bias voltage, the connecting end 13222 being located on a side of the second magnet 131 remote from the first magnet 112 and connecting the plurality of cutting ends 13221 in series.

The use of the windings 1322 of the insulated wire 1323 is to increase the voltage generated by the magnetic induction wire cutting device, and the magnitude of the positive bias generated by the bias assembly 130 can be adjusted by controlling the rotation speed of the bias assembly 130 and the number of turns of the windings 1322 of the wire, so as to reach the positive voltage required by the coating process.

As shown in fig. 5 and 6, the insulated wire 1323 is wound around and fixed to the second magnet 131, and the cut end 13221 is located on the insulated wire 1323 above the second magnet 131, and between the first magnet 112 and the second magnet 131, the function is to cut the magnetic induction wire to generate a voltage. The connection end 13222 is located below the second magnet 131, and ignores the voltage generated by the connection end due to weak magnetic field strength, but is connected in series with the voltage generated by the insulated wire 1323 above the second magnet 131, so as to increase the voltage.

Referring to fig. 6, 7 and 8, according to some embodiments of the present application, optionally, insulated conductive wires 1323 are attached to the surface of the hanging plate 140 such that the area covered by the insulated conductive wires 1323 of the hanging plate 140 is in a positive bias electric field. As shown in fig. 8, when it is desired to load the product 20 on the hanging plate 140, it is necessary to dispose the insulated wire 1323 between the product 20 and the hanging plate 140 and locate the insulated wire 1323 with a positive bias in the ink area 202 of the product 20 so that the ink area 202 is located within the electric field of the positive bias, but the influence of the electric field of the positive bias has little influence on the display area 201.

Referring to fig. 4, according to some embodiments of the present application, optionally, the first magnet 112 is located at an outer periphery of one end of the body 110 along its axis and is coplanar with the rf ion source 121 and the central axis. The first magnet 112 may be located at the upper end of the plating apparatus 100 as shown in fig. 4, or may be located at the bottom end of the plating apparatus 100.

Referring to fig. 4, according to some embodiments of the present application, the biasing assembly 130 may be optionally disposed along a radial direction of the body 110. The biasing assembly 130 is disposed along the radial direction of the body 110, such that when the biasing assembly 130 rotates relative to the first magnet 112, the linear magnetic induction cutting device moves vertically relative to the linear magnetic induction of the magnetic field generated by the first magnet 112 and the second magnet 131, so that the generated positive bias is maximized.

Referring to fig. 1 and 2, according to some embodiments of the present application, optionally, the anti-chromatic aberration and anti-reflection film plating apparatus 100 further includes a rotating member 150, where the rotating member 150 is accommodated in the accommodating cavity 111 and is disposed coaxially with the machine body 110, and the rotating member 150 is controlled to rotate around its own axis relative to the machine body 110, and in this embodiment, the rotating member 150 is cylindrical. The biasing assembly 130 and the hanging plate 140 are mounted on the outer circumferential surface of the rotating member 150, and the biasing assembly 130 and the hanging plate 140 are relatively stationary and rotate at the same speed as the rotating member 150.

It is understood that the rotating member 150 may be provided with a plurality of hanging plates 140, in this embodiment, the number of hanging plates 140 is 21, and correspondingly, the number of biasing assemblies 130 is 21, and the hanging plates 140 and the biasing assemblies 130 are in one-to-one correspondence. The rotary member 150 rotates at a high speed, and in the present embodiment, the rotation speed of the rotary member 150 is 75r/min to 100r/min.

The speed of the magnetic induction wire cutting device 132 in the bias assembly 130 is related to the rotation speed of the rotating member 150, and the cutting speed of the magnetic induction wire cutting device 132 can be adjusted by adjusting the rotation speed of the rotating member 150, so as to adjust the magnitude of the positive bias generated by the bias assembly 130.

Referring to fig. 1 and 2, according to some embodiments of the present application, optionally, the anti-chromatic aberration and anti-reflection film coating apparatus 100 further includes a driving component 160, preferably a motor, where a mounting hole is formed at one end of the body 110 along the axis, and one end of the driving component 160 extends into the accommodating cavity 111 through the mounting hole and is connected to one end of the rotating member 150 along the axis direction thereof to drive the rotating member 150 to rotate around the axis direction thereof.

The working steps of the anti-chromatic aberration antireflection film coating apparatus 100 are as follows:

the product 20 is first loaded onto the hanging plate 140 and the hanging plate 140 is loaded onto the rotating member 150. Wherein insulated conductor 1323 is located in ink region 202 of product 20 such that ink region 202 is located within the forward biased electric field, but the forward biased electric field has little effect on display region 201.

The driving assembly 160 then rotates the rotating member 150, and the rotation speed gradually increases until the set rotation speed is reached. During rotation of the rotary member 150, the biasing assembly 130 rotates relative to the first magnet 112 to generate a positive bias. As the rotational speed increases, the positive bias generated by the biasing assembly 130 gradually increases to a desired magnitude.

Finally, the sputtering assembly 120 is opened to begin coating. The target 122 is responsible for sputtering silicon, and the rf ion source 121 is responsible for ionizing the gas into positive ions, which react with silicon to form silicon nitride or silicon oxide, which is insufficiently reacted due to the suppression of the positive electric field in the ink region 202. Wherein 2 molecular pump sets 123 are arranged between the target 122 and the rf ion source 121, and are used for preventing the reaction gas from volatilizing to the surface of the target 122 to participate in the reaction.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and are not limited thereto; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features can be replaced with equivalents; such modifications and substitutions do not depart from the spirit of the application, and are intended to be included within the scope of the claims and description. In particular, the technical features mentioned in the respective embodiments may be combined in any manner as long as there is no structural conflict. It is intended that the application not be limited to the particular embodiments disclosed herein, but that the application will include all embodiments falling within the scope of the appended claims.

Claims

1. An anti-chromatic aberration anti-reflection film coating device, which is characterized by comprising:

the machine body is internally provided with a containing cavity, and is fixedly provided with a first magnet;

the sputtering component is fixedly arranged on the inner side wall of the machine body along the circumferential direction of the machine body and comprises a radio frequency ion source;

at least one biasing assembly provided with a second magnet, which is accommodated in the accommodating cavity in a distributed manner along the circumferential direction of the machine body and each of which is controlled to rotate relative to the machine body around the central axis of the machine body, wherein the magnetic pole of the second magnet is opposite to the magnetic pole of the first magnet so that the second magnet generates a magnetic field when facing the first magnet, and the biasing assembly rotates relative to the first magnet to generate positive bias;

at least one hanger plate for loading a product, each hanger plate being controllably rotated about a central axis of the body relative to the body to cycle through a line connecting each of the sputtering assemblies to the central axis of the body, each hanger plate being connected in one-to-one correspondence to the biasing assemblies such that a localized region of the hanger plate is within a positive bias electric field when the hanger plate passes through the line connecting the rf ion source to the central axis of the body;

and the magnetic induction wire cutting device is at least partially arranged between the first magnet and the second magnet and performs cutting magnetic induction wire movement relative to a magnetic field formed by the first magnet and the second magnet so as to form positive bias.

2. The anti-chromatic aberration and anti-reflection film plating apparatus of claim 1, wherein the sputtering assembly further comprises at least one target and at least one molecular pump set, the molecular pump set being located between the target and the rf ion source.

3. The anti-chromatic aberration and anti-reflection film plating apparatus according to claim 1, wherein the magnetic induction wire cutting device includes a ground terminal, a wire winding and an insulated wire connected to each other, the wire winding being wound around the second magnet, the insulated wire being connected to the hanging plate.

4. The anti-chromatic aberration and anti-reflection film plating apparatus according to claim 3, wherein the wire winding includes a cut end and a connection end connected in series, the cut end being located between the first magnet and the second magnet and performing a cutting induction line movement with respect to a magnetic field formed by the first magnet and the second magnet to form a positive bias voltage, the connection end being located on a side of the second magnet remote from the first magnet and connecting a plurality of the cut ends in series.

5. The anti-chromatic aberration and anti-reflection film plating apparatus according to claim 3, wherein the insulated wire is attached to the surface of the hanging plate such that the area covered by the insulated wire of the hanging plate is in a positive bias electric field.

6. The anti-chromatic aberration and anti-reflection film coating apparatus according to claim 1, wherein the first magnet is located at an outer periphery fixed at one end of the body along the axis thereof and is coplanar with the rf ion source and the central axis.

7. The anti-chromatic aberration and anti-reflection film plating apparatus according to claim 6, wherein the biasing member is disposed along a radial direction of the body.

8. The anti-chromatic aberration and anti-reflection film plating apparatus according to claim 1, wherein the sputtering assembly further comprises at least one target and at least one molecular pump group.

9. The apparatus according to claim 1, further comprising a rotary member accommodated in the accommodation chamber and coaxially disposed with the body, the rotary member being controllably rotated about its own axis relative to the body, the biasing member and the hanging plate being both mounted on an outer peripheral surface of the rotary member.

10. The anti-chromatic aberration and anti-reflection film coating apparatus according to claim 9, further comprising a driving assembly, wherein a mounting hole is provided at one end of the body, and one end of the driving assembly penetrates through the mounting hole to extend into the accommodating cavity and is connected to one end of the rotating member in the self axis direction to drive the rotating member to rotate around the self axis direction.