CN114346882A

CN114346882A - Gallium arsenide single crystal mechanical polishing equipment

Info

Publication number: CN114346882A
Application number: CN202210166849.0A
Authority: CN
Inventors: 袁永
Original assignee: Suzhou Nuofu Microelectronics Co ltd
Current assignee: Suzhou Nuofu Microelectronics Co ltd
Priority date: 2022-02-23
Filing date: 2022-02-23
Publication date: 2022-04-15

Abstract

The invention discloses gallium arsenide single crystal mechanical polishing equipment in the technical field of wafer polishing, which comprises a supporting mechanism and is characterized in that: the polishing machine also comprises a polishing mechanism, a conversion mechanism and a clamping hand; the clamping hand is slidably arranged at the upper end of the supporting mechanism, the polishing mechanism is arranged in the middle of the supporting mechanism, and the switching mechanism is fixedly arranged on the supporting mechanism and is respectively communicated with the polishing mechanism and the clamping hand; on the premise of ensuring that the wafer can be normally processed, the damage probability of the wafer by clamping force in the processing process is prevented to the maximum extent.

Description

Gallium arsenide single crystal mechanical polishing equipment

Technical Field

The invention relates to the technical field of wafer polishing, in particular to gallium arsenide single crystal mechanical polishing equipment.

Background

The gallium arsenide wafer is made of a gallium arsenide single crystal material which is synthesized and grown by pure arsenic and gallium through the processes of cutting, grinding, polishing, cleaning and the like, wherein the polishing process is a key process for realizing that the gallium arsenide wafer finally meets the surface requirement of ultrahigh precision. At present, the polishing process of gallium arsenide wafers commonly adopted at home and abroad is a Chemical Mechanical Polishing (CMP) process; the chemical mechanical polishing machine mainly comprises a wafer holder, a workbench for bearing a polishing pad and a polishing solution supply device. During chemical mechanical polishing, a wafer holder provided with a wafer to be polished is pressed on a rotary polishing pad under a certain pressure, oxidizing polishing liquid and the surface of the wafer generate chemical reaction to form an oxidation corrosion film which is easy to remove, the oxidation corrosion film formed on the surface of the wafer and the polishing pad are removed through rotary mechanical cutting action, the chemical mechanical polishing of the wafer is completed in the alternate process of chemical film forming and mechanical film removing, and a double-sided processing mode is often used in the prior art for accelerating the production efficiency.

In the process of processing and polishing a wafer, the conventional CMP technology needs to control the cutting amount in a timing mode because the cutting amount is too small, so that all processing parameters need to be kept in a stable state in the processing process to ensure the cutting precision, wherein one important parameter is the relative rotating speed of the wafer and a polishing pad, so that the wafer cannot rotate relative to a wafer holder in the processing process, and the wafer holder is further required to clamp the wafer, so that the wafer holder is required to clamp the wafer with a large force in the whole processing process; when the existing wafer holder is used for wafers with different radiuses, the wafers with different radiuses cannot be held by the most suitable force on the premise of ensuring normal processing, and because the wafers are very fragile, when the holding force is large, the wafers are easy to damage, and when the holding force is small, the wafers with different radiuses are different in magnitude of the torsional force, and the wafers rotate to influence the processing precision; the range of the wafer holder for wafers with different radiuses is limited, and a good protection effect on the wafer cannot be achieved.

Based on the above, the invention designs a gallium arsenide single crystal mechanical polishing device to solve the above problems.

Disclosure of Invention

The invention aims to provide gallium arsenide single crystal mechanical polishing equipment, which aims to solve the problems that when the conventional wafer holder is used for wafers with different radiuses, the wafers with different radiuses cannot be held by the most suitable force on the premise of ensuring normal processing, the wafers are easy to damage due to the fact that the wafers are quite fragile, when the holding force is large, the wafers with different radiuses are different in magnitude due to the fact that the wafers are different in torsional force, and when the holding force is small, the wafers rotate to influence the processing precision; the range of the wafer holder for wafers with different radiuses is limited, and the wafer holder cannot have a good protection effect on the wafers.

In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a gallium arsenide single crystal mechanical polishing equipment, includes supporting mechanism, its characterized in that: the polishing machine also comprises a polishing mechanism, a conversion mechanism and a clamping hand; the clamping hand is slidably arranged at the upper end of the supporting mechanism; the polishing mechanism is arranged in the middle of the supporting mechanism and can feed back the magnitude of torque force borne during working to the conversion mechanism in real time; the conversion mechanism is fixedly arranged on the supporting mechanism and is respectively communicated with the polishing mechanism and the clamping hand, and the conversion mechanism can dynamically regulate and control the clamping force of the clamping hand through the torque force applied by the polishing mechanism.

As a further scheme of the invention, the upper ends of two sides of the supporting mechanism are fixedly provided with slide rails, and the opposite surfaces of the two slide rails are symmetrically provided with clamping hands;

the clamping hand comprises a first sliding rod, the first sliding rod is slidably mounted on the sliding rail, the first sliding rod is slidably connected with a second sliding rod, springs are mounted between the first sliding rod and the second sliding rod, and a threaded pin penetrates through one end, close to the second sliding rod, of the first sliding rod; the second sliding rod is fixedly connected with a clamping mechanism; conventional clamping scheme through direct clamping, for waiting to process the wafer and providing the power of getting it clamp and prevent its pivoted power, this kind of clamping-force is great, easily produces the damage to the wafer, so this scheme sets up the spring and provides the clamp force of a less support to wait to process wafer gravity to the wafer earlier, then through screw pin locking slide bar one and slide bar two, when keeping this clamp force, provide the support for subsequent prevention waits to process wafer pivoted power.

As a further scheme of the invention, an arc-shaped cavity is formed in the clamping mechanism, a fifth pipeline port is fixedly connected to the outside of the clamping mechanism, the fifth pipeline port is communicated with the arc-shaped cavity, a plurality of pressure heads are hermetically and slidably mounted at equal intervals on one side of the clamping mechanism, which is far away from the outer side wall of the second sliding rod, the pressure heads are communicated with the arc-shaped cavity, and a pressure plate is elastically and slidably connected to one side of the arc-shaped cavity, which is far away from the pressure heads; utilize the liquid pressure in the arc intracavity, go to extrude the pressure head, and then provide for the wafer through the pressure head and prevent its pivoted clamping-force, simultaneously, liquid pressure can change in real time along with the moment of torsion power that the wafer received, makes the total clamping-force that the wafer received remain throughout in less scope, and furthest protects the wafer, prevents its damage.

As a further scheme of the invention, a processing groove is arranged in the middle of the supporting mechanism, and the processing groove and the polishing mechanism are in the same horizontal position; make whole course of working material loading and unloading go on respectively in the supporting mechanism left and right sides upper end, make material loading and unloading in-process, because the emergence of unusual phenomena such as misoperation leads to the wafer to break away from the tong, have supporting mechanism as the protection, avoid the wafer directly to drop to ground, lead to the damage.

As a further scheme of the invention, the upper end and the lower end of the supporting mechanism are respectively and symmetrically fixedly provided with a supporting frame, and the end parts of the supporting frames are respectively provided with a polishing mechanism; the polishing mechanism comprises a motor, the motor is fixedly connected with the end part of the support frame, a rotating shaft is rotatably arranged at the end of the motor close to the support mechanism, the rotating shaft is slidably connected with a sliding shaft, and the sliding shaft is rotatably connected with a polishing disc; a pressure mechanism is externally connected between the rotating shaft and the sliding shaft and used for controlling the extrusion force of the sliding shaft in the direction of the polishing disc;

the polishing device is characterized in that a force transmission mechanism is arranged on the polishing mechanism, the force transmission mechanism comprises a fixed rod, the fixed rod is fixedly connected with the side wall of the sliding shaft, the fixed rod is fixedly connected with an arc-shaped cylinder, one end of the arc-shaped cylinder is fixedly provided with a first pipeline opening, the other end of the arc-shaped cylinder is slidably connected with an arc-shaped rod, the end part of the arc-shaped rod is fixedly connected with a fixed block, and the fixed block is fixedly connected with a polishing disc; the force transmission mechanisms on the upper polishing mechanism and the lower polishing mechanism are symmetrical about a vertical plane; the force transmission mechanism drives the polishing disc to rotate, so that the friction force between the polishing disc and the wafer can be fed back to the force transmission mechanism when the polishing disc works, the clamping force applied to the wafer is controlled, the wafer is protected to the greatest extent, and the wafer is prevented from being damaged.

As a further scheme of the invention, the switching mechanism comprises a first hydraulic tank, the first hydraulic tank is fixedly installed at the upper end of the slide rail, two ends of the first hydraulic tank are respectively and fixedly connected and communicated with a second pipeline port and a third pipeline port, a second hydraulic tank is fixedly connected to the side surface of the first hydraulic tank, a first chute penetrates through the connecting wall of the first hydraulic tank and the second hydraulic tank, a second chute is formed in the first chute, a slide plate is slidably connected to the first chute, sealing walls are vertically arranged on two side walls of the slide plate, and the sealing walls are in sealing sliding connection with the second chute; two ends of the sliding plate are respectively connected with the inner walls of the first hydraulic tank and the second hydraulic tank in a sealing and sliding manner;

a third hydraulic tank is fixedly connected to the upper end of the second hydraulic tank, and the third hydraulic tank is communicated with two ends of the second hydraulic tank respectively; the side wall of the third hydraulic tank is vertically connected with a fourth hydraulic tank, and the connection part is communicated in a penetrating way;

a partition plate is fixedly arranged in the middle of the fourth hydraulic tank, extends into the third hydraulic tank and is fixedly connected with the inner wall of the third hydraulic tank; sliding blocks are connected to the two sides of the partition plate in a sliding mode, and telescopic blocks are installed at one end, close to the third hydraulic tank, of each sliding block in a sliding mode; one end of the fourth hydraulic tank, which is far away from the third hydraulic tank, is fixedly connected and communicated with a fourth pipeline port; utilize a plurality of hydraulic pressure jars and sliding block and the cooperation of slide in addition, two upper and lower millstones offset the summary to the frictional force of wafer, and then obtain the final resultant force size of the frictional force that the wafer receives, and then feed back the size of resultant force to the tong through hydraulic pressure, obtain minimum clamping force, obtain a stable efficient real-time feedback mechanism with simple mechanical structure, and then make equipment can stabilize the efficient and exert a minimum clamping force to the wafer, protect the wafer in the at utmost.

As a further scheme of the invention, a first pipeline port on a force transmission mechanism in the upper polishing mechanism and the lower polishing mechanism is respectively communicated with a second pipeline port and a third pipeline port through hoses; the fifth pipeline openings on the two clamping hands are communicated with the fourth pipeline opening together; hydraulic oil is filled in the force transmission mechanism, the conversion mechanism, the clamping hands and the hose for connection; the common and cheap hoses are used for communicating the hydraulic oil in each mechanism, so that the equipment cost is reduced, and the benefit is improved.

Compared with the prior art, the invention has the beneficial effects that:

1. the elastic force generated after the pressure plate moves is converted by the conversion mechanism and is in a mechanical balance with the resultant force exerted on the sliding plate by the upper force transmission mechanism and the lower force transmission mechanism, so that the hydraulic oil in the arc-shaped cavity has pressure intensity increased along with the increase of the resultant force on the sliding plate (the component force exerted on the sliding plate by the upper force transmission mechanism and the lower force transmission mechanism is respectively in a direct proportion relation with the friction force between the corresponding polishing disc and the wafer, further, the resultant force on the sliding plate is in a positive relation with the resultant force of the friction force generated by the polishing disc on the wafer, further, the pressure intensity of the hydraulic oil in the arc-shaped cavity is in a positive relation with the resultant force generated by the wafer during processing, further, the extrusion force of the pressure head is in a positive relation with the torque force of the wafer (the torque force applied to the wafer is the resultant force of the friction force generated by the polishing disc on the wafer), and the clamping force for preventing the wafer from rotating is increased along with the increase of the torque force applied to the wafer, therefore, the total clamping force on the wafer can be always kept in a small range, and the damage probability of the clamping force on the wafer in the processing process is prevented to the maximum extent on the premise of ensuring the normal processing of the wafer; and because the clamping force for preventing the wafer from rotating is increased along with the increase of the torque force borne by the wafer and is not influenced by the radius of the wafer, the equipment can process the wafers with different radii, the application range of the equipment is wider, and the equipment cost is saved.

2. Utilize a plurality of hydraulic pressure jars and sliding block and the cooperation of slide in addition, two upper and lower millstones offset the summary to the frictional force of wafer, and then obtain the final resultant force size of the frictional force that the wafer receives, and then feed back the size of resultant force to the tong through hydraulic pressure, obtain minimum clamping force, obtain a stable efficient real-time feedback mechanism with simple mechanical structure, and then make equipment can stabilize the efficient and exert a minimum clamping force to the wafer, protect the wafer in the at utmost.

3. The force transmission mechanism drives the polishing disc to rotate, so that the friction force between the polishing disc and the wafer can be fed back to the force transmission mechanism when the polishing disc works, the clamping force applied to the wafer is controlled, the wafer is protected to the greatest extent, and the wafer is prevented from being damaged.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a schematic diagram of the overall structure of the present invention;

FIG. 2 is an enlarged view of the point A in FIG. 1;

FIG. 3 is a schematic view of a grinding mechanism;

FIG. 4 is a schematic view of the conversion mechanism;

FIG. 5 is a schematic top view of the first hydraulic tank of FIG. 4;

FIG. 6 is an enlarged view of the point B in FIG. 5;

FIG. 7 is a schematic front cross-sectional view of the third hydraulic tank of FIG. 4;

FIG. 8 is a top view of the third hydraulic tank of FIG. 4;

FIG. 9 is a schematic top view of the gripper 4 and the wafer 5;

fig. 10 is an enlarged view of C in fig. 9.

In the drawings, the components represented by the respective reference numerals are listed below:

the device comprises a supporting mechanism 1, a processing groove 1-1, a supporting frame 1-2, a sliding rail 1-3, a polishing mechanism 2, a motor 2-1, a rotating shaft 2-2, a sliding shaft 2-3, a polishing disc 2-4, a force transmission mechanism 2-5, a fixed block 2-5-1, an arc rod 2-5-2, an arc barrel 2-5-3, a fixed rod 2-5-4, a first pipeline port 2-5-5, a conversion mechanism 3, a first hydraulic tank 3-1, a second pipeline port 3-1-1, a third pipeline port 3-1-2, a first sliding groove 3-1-3, a second sliding groove 3-1-4, a second hydraulic tank 3-2, a third hydraulic tank 3-3, a fourth hydraulic tank 3-4, 3-4-1 parts of a fourth pipeline opening, 3-4-2 parts of a partition plate, 3-5 parts of a sliding plate, 3-5-1 parts of a sealing wall, 3-6 parts of a sliding block, 3-6-1 parts of a telescopic block, 4 parts of a clamping hand, 4-1 parts of a sliding rod I, 4-1 parts of a spring, 4-2 parts of a threaded pin, 4-3 parts of a sliding rod II, 4-4 parts of a clamping mechanism, 4-4-1 parts of an arc-shaped cavity, 4-4-2 parts of a fifth pipeline opening, 4-4-3 parts of a pressure plate, 4-4-5 parts of a pressure head and 5 parts of a wafer.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-10, the present invention provides a technical solution: the utility model provides a gallium arsenide single crystal mechanical polishing equipment, includes supporting mechanism 1, its characterized in that: the polishing machine also comprises a polishing mechanism 2, a conversion mechanism 3 and a clamping hand 4; the clamping hand 4 is slidably arranged at the upper end of the supporting mechanism 1; the grinding mechanism 2 is arranged in the middle of the supporting mechanism 1 and can feed back the magnitude of torque force borne during working to the conversion mechanism 3 in real time; the conversion mechanism 3 is fixedly arranged on the supporting mechanism 1 and is respectively communicated with the polishing mechanism 2 and the clamping hand 4, and the conversion mechanism 3 can dynamically regulate and control the clamping force of the clamping hand 4 through the torque force received by the polishing mechanism 2.

As a further scheme of the invention, the upper ends of two sides of the supporting mechanism 1 are fixedly provided with slide rails 1-3, and the opposite surfaces of the two slide rails 1-3 are symmetrically provided with clamping hands 4;

the clamping hand 4 comprises a first sliding rod 4-1, the first sliding rod 4-1 is slidably mounted on a second sliding rod 4-3, the first sliding rod 4-1 is slidably connected with the second sliding rod 4-3, a spring 4-1-1 is mounted between the first sliding rod 4-1 and the second sliding rod 4-3, and one end, close to the second sliding rod 4-3, of the first sliding rod 4-1 is connected with a threaded pin 4-2 in a penetrating mode; the second sliding rod 4-3 is fixedly connected with a clamping mechanism 4-4; the conventional clamping scheme provides clamping force for the wafer to be processed and force for preventing the wafer from rotating by directly clamping the wafer, the clamping force is large, and the wafer is easy to damage, so that the spring 4-1-1 is arranged in the scheme, a small clamping force for supporting the gravity of the wafer to be processed is provided for the wafer, the slide bar I4-1 and the slide bar II 4-3 are locked by the threaded pin 4-2, and support is provided for subsequent force for preventing the wafer to be processed from rotating while the clamping force is kept.

As a further scheme of the invention, an arc-shaped cavity 4-4-1 is formed in the clamping mechanism 4-4, a fifth pipeline port 4-4-2 is fixedly connected to the outside of the clamping mechanism 4-4, the fifth pipeline port 4-4-2 is communicated with the arc-shaped cavity 4-4-1, a plurality of pressure heads 4-4-5 are hermetically and slidably mounted on one side, away from the outer side wall of the sliding rod II 4-3, of the clamping mechanism 4-4 at equal intervals, the pressure heads 4-4-5 are communicated with the arc-shaped cavity 4-4-1, and a pressure plate 4-4-3 is elastically and slidably connected to one side, away from the pressure heads 4-4-5, of the arc-shaped cavity 4-4-1; the pressure head 4-4-5 is squeezed by utilizing the liquid pressure in the arc-shaped cavity 4-4-1, so that the clamping force for preventing the wafer from rotating is provided for the wafer through the pressure head 4-4-5, and meanwhile, the liquid pressure can be changed in real time along with the torque force received by the wafer, so that the total clamping force received by the wafer is always kept in a small range, and the wafer is protected to the greatest extent to prevent the wafer from being damaged.

As a further scheme of the invention, a processing tank 1-1 is arranged in the middle of the supporting mechanism 1, and the processing tank 1-1 and the grinding mechanism 2 are in the same horizontal position.

As a further scheme of the invention, the upper end and the lower end of the supporting mechanism 1 are respectively and symmetrically fixedly provided with supporting frames 1-2, and the end parts of the supporting frames 1-2 are respectively provided with a polishing mechanism 2; the polishing mechanism 2 comprises a motor 2-1, the motor 2-1 is fixedly connected with the end part of the support frame 1-2, a rotating shaft 2-2 is rotatably installed at the end, close to the support mechanism 1, of the motor 2-1, the rotating shaft 2-2 is slidably connected with a sliding shaft 2-3, and the sliding shaft 2-3 is rotatably connected with a polishing disc 2-4; a pressure mechanism is externally connected between the rotating shaft 2-2 and the sliding shaft 2-3 and used for controlling the extrusion force of the sliding shaft 2-3 to the polishing disc 2-4 direction;

the polishing mechanism 2 is provided with a force transmission mechanism 2-5, the force transmission mechanism 2-5 comprises a fixed rod 2-5-4, the fixed rod 2-5-4 is fixedly connected with the side wall of the sliding shaft 2-3, the fixed rod 2-5-4 is fixedly connected with an arc-shaped cylinder 2-5-3, one end of the arc-shaped cylinder 2-5-3 is fixedly provided with a first pipeline port 2-5-5, the other end of the arc-shaped cylinder is slidably connected with an arc-shaped rod 2-5-2, the end part of the arc-shaped rod 2-5-2 is fixedly connected with a fixed block 2-5-1, and the fixed block 2-5-1 is fixedly connected with a polishing disc 2-4; the force transmission mechanisms 2-5 on the upper and lower grinding mechanisms 2 are symmetrical about a vertical plane; the force transmission mechanism 2-5 drives the polishing disc 2-4 to rotate, so that when the polishing disc 2-4 works, the friction force between the polishing disc and the wafer can be fed back to the force transmission mechanism 2-5, the clamping force on the wafer is further controlled, the wafer is protected to the maximum extent, and the wafer is prevented from being damaged.

As a further scheme of the invention, the switching mechanism 3 comprises a first hydraulic tank 3-1, the first hydraulic tank 3-1 is fixedly installed at the upper end of a sliding rail 1-3, two ends of the first hydraulic tank 3-1 are respectively fixedly connected and communicated with a second pipeline port 3-1-1 and a third pipeline port 3-1-2, the side surface of the first hydraulic tank 3-1 is fixedly connected with a second hydraulic tank 3-2, a first sliding chute 3-1-3 is arranged on the connecting wall of the first hydraulic tank 3-1 and the second hydraulic tank 3-2 in a penetrating manner, a second sliding chute 3-1-4 is arranged on the first sliding chute 3-1-3, a sliding plate 3-5 is connected on the first sliding chute 3-1-3 in a sliding manner, and sealing walls 3-5-1 are vertically arranged on two side walls of the sliding plate 3-5, the sealing wall 3-5-1 is in sealing sliding connection with the second chute 3-1-4; two ends of the sliding plate 3-5 are respectively connected with the inner walls of the first hydraulic tank 3-1 and the second hydraulic tank 3-2 in a sealing and sliding manner;

the upper end of the second hydraulic tank 3-2 is fixedly connected with a third hydraulic tank 3-3, and the third hydraulic tank 3-3 is respectively communicated with two ends of the second hydraulic tank 3-2; the side wall of the third hydraulic tank 3-3 is vertically connected with a fourth hydraulic tank 3-4, and the connection part is communicated in a penetrating way;

a partition plate 3-4-2 is fixedly arranged in the middle of the fourth hydraulic tank 3-4, and the partition plate 3-4-2 extends into the third hydraulic tank 3-3 and is fixedly connected with the inner wall of the third hydraulic tank 3-3; sliding blocks 3-6 are connected to two sides of the partition plate 3-4-2 in a sliding mode, and telescopic blocks 3-6-1 are installed at one ends, close to the third hydraulic tank 3-3, of the sliding blocks 3-6 in a sliding mode; one end of the fourth hydraulic tank 3-4, which is far away from the third hydraulic tank 3-3, is fixedly connected and communicated with a fourth pipeline opening 3-4-1; the friction force of the upper polishing disc 2-4 and the lower polishing disc 2-4 on the wafer is counteracted and summarized by utilizing the matching of the hydraulic tanks, the sliding blocks 3-6 and the sliding plates 3-5, so that the final resultant force of the friction force applied to the wafer is obtained, the resultant force is fed back to the clamping hands 4 through hydraulic pressure, the minimum clamping force is obtained, a stable and efficient real-time feedback mechanism is obtained through a simple mechanical structure, and then equipment can stably and efficiently apply the minimum clamping force to the wafer, and the wafer is protected to the maximum extent.

As a further scheme of the invention, a first pipeline port 2-5-5 on a force transmission mechanism 2-5 in an upper polishing mechanism 2 and a lower polishing mechanism 2 is respectively communicated with a second pipeline port 3-1-1 and a third pipeline port 3-1-2 through hoses; the fifth pipeline openings 4-4-2 on the two clamping hands 4 are communicated with the fourth pipeline opening 3-4-1 together; the force transmission mechanisms 2-5, the conversion mechanism 3, the clamping hands 4 and the connecting hose are filled with hydraulic oil.

The working principle is as follows: when the wafer clamping device works (as shown in fig. 1 and fig. 9), a wafer 5 is placed in the middle of two clamping hands 4, the sliding rod two 4-3 is pushed by the elastic force of the spring 4-1-1, and then the clamping hands 4 are driven to clamp the wafer 5 between the two clamping hands 4 to prevent the wafer 5 from falling off (note that, after the clamping force is enough to support the wafer 5 and not to be separated from the clamping hands 4, the clamping force is continuously increased by a conventional clamping means to prevent the wafer 5 from rotating during processing, and the clamping force provided by the spring 4-1-1 is only used for keeping the wafer 5 not to be separated from the clamping hands 4); then, the threaded pin 4-2 is rotated to lock the second sliding rod 4-3 relative to the first sliding rod 4-1, so that the clamping state of the wafer 5 by the clamping hand 4 is kept, and meanwhile, support is provided for force for subsequently preventing the wafer 5 from rotating;

then, the sliding rod I4-1 slides rightwards relative to the sliding rail 1-3, and then the clamping hand 4 drives the wafer 5 to move to the position of the processing groove 1-1, so that the wafer 5 is positioned in the middle of the upper polishing mechanism 2 and the lower polishing mechanism 2; (as shown in fig. 3), then the polishing mechanism 2 is started, firstly, a pressure mechanism externally connected with the polishing mechanism 2 drives a sliding shaft 2-3 to slide towards the wafer 5, so that the polishing disc 2-4 applies a preset pressure to the end surface of the wafer 5, then a motor 2-1 is started, and drives the sliding shaft 2-3 to rotate through a rotating shaft 2-2, at this time, the sliding shaft 2-3 drives an arc cylinder 2-5-3 to rotate through a fixed rod 2-5-4, so that the arc rod 2-5-2 drives a polishing disc 2-4 to rotate (when the arc cylinder 2-5-3 rotates, hydraulic oil in the arc cylinder can push the arc rod 2-5-2 and further drive the polishing disc 2-4 to rotate, in the process, as the polishing disc 2-4 extrudes the wafer 5 and rotates relative to the wafer 5, the grinding disc 2-4 is subjected to a certain friction force, the friction force can extrude the hydraulic oil in the arc-shaped cylinder 2-5-3 through the arc-shaped rod 2-5-2), and the hydraulic oil in the arc-shaped cylinder 2-5-3 has the tendency of being extruded into the first hydraulic tank 3-1 through the first pipeline port 2-5-5;

at this time, the hydraulic oil in the upper and lower two arc-shaped cylinders 2-5-3 has a tendency of flowing into the first hydraulic tank 3-1 through the second pipeline port 3-1-1 and the third pipeline port 3-1-2 at the two ends of the first hydraulic tank 3-1 respectively by the respective first pipeline ports 2-5-5, and then the two hydraulic oils respectively extrude the two sides of the sliding plate 3-5 located at the middle position of the first hydraulic tank 3-1, and finally the extrusion forces at the two sides of the sliding plate 3-5 are mutually offset, and the sliding plate 3-5 is pushed to slide by the final resultant force, during the sliding process of the sliding plate 3-5, (as shown in fig. 7), the part located in the second hydraulic tank 3-2 pushes the hydraulic oil in the second hydraulic tank 3-2, and then pushes the sliding block 3-6 at the sliding side of the sliding plate 3-5 to advance, meanwhile, the telescopic block 3-6-1 on the sliding block 3-6 on the other side extends (the sliding plate 3-5 is matched with the second hydraulic tank 3-2, the third hydraulic tank 3-3, the fourth hydraulic tank 3-4, the partition plate 3-4-2 and the two sliding blocks 3-6 to jointly form two independent cavities on two sides of the sliding plate 3-5. when the sliding plate 3-5 slides towards the cavity on one side, the cavity on the side reduces in volume, the cavity on the corresponding other side increases in volume, correspondingly, the sliding block 3-6 on one side slides forwards to increase the cavity volume, the telescopic block 3-6-1 on the sliding block 3-6 on the other side extends to reduce the volume, further, the volume change caused by the sliding of the sliding plate 3-5 is counteracted, and attention is needed to be paid to the fact that, when the sliding block 3-6 is located at the initial position, the sliding block 3-6 is also at the limit position of backward sliding, that is, when the volume is changed, the sliding block 3-6 cannot move backward and cannot counteract the volume change in a backward sliding manner), further, the hydraulic oil in the front end part of the sliding block 3-6 in the fourth hydraulic tank 3-4 is squeezed, (with reference to fig. 9) and flows into the arc-shaped cavities 4-4-1 of the two grippers 4 from the fourth pipe port 3-4-1 through the two fifth pipe ports 4-4-2, so as to push the pressure plate 4-4-3, at this time, the elastic member at the connection part of the pressure plate 4-4-3 generates elastic force, and drives the pressure plate 4-4-3 to squeeze the hydraulic oil in the arc-shaped cavities 4-1, so as to generate pressure intensity of the hydraulic oil, the pressure of the hydraulic oil can drive the pressure head 4-4-5 to move towards the outside of the clamping mechanism 4-4, so as to extrude the wafer 5 and generate extrusion force on the side wall of the wafer 5, thereby preventing the wafer 5 from slipping in the processing process; the elastic force generated after the pressure plate 4-4-3 moves is converted by the conversion mechanism 3 and is in mechanical balance with the resultant force exerted on the sliding plate 3-5 by the upper force transmission mechanism 2-5 and the lower force transmission mechanism 2-5, so that the hydraulic oil in the arc-shaped cavity 4-4-1 has the resultant force along with the sliding plate 3-5 (the component force exerted on the sliding plate 3-5 by the upper force transmission mechanism 2-5 and the component force exerted on the sliding plate 3-5 by the lower force transmission mechanism 2-5 are respectively in a positive proportional relation with the frictional force between the corresponding polishing disc 2-4 and the wafer 5, further, the resultant force on the sliding plate 3-5 and the resultant force of the frictional force generated by the polishing disc 2-4 to the wafer 5 are in a positive correlation), and the increased pressure is further increased along with the positive correlation of the pressure of the hydraulic oil in the arc-shaped cavity 4-1 and the resultant force exerted on the wafer 5 during processing, and further, the extrusion force of the pressure head 4-4-5 is in a positive correlation with the torque force of the wafer 5 (the torque exerted on the wafer 5) The moment force is the resultant force of the friction force generated by the polishing discs 2-4 on the wafer 5), so that the clamping force of the wafer 5 for preventing the wafer 5 from rotating is increased along with the increase of the torque force borne by the wafer 5, further, the total clamping force borne by the wafer 5 can be always kept in a small range, and further, on the premise of ensuring that the wafer 5 can be normally processed, the damage probability of the wafer 5 by the clamping force in the processing process is prevented to the maximum extent; and because the clamping force for preventing the wafer 5 from rotating is increased along with the increase of the torque force borne by the wafer 5 and is not influenced by the radius of the wafer 5, the equipment can process the wafers 5 with different radii, the application range of the equipment is wider, and the equipment cost is saved.

Claims

1. A gallium arsenide single crystal mechanical polishing device comprises a supporting mechanism (1), and is characterized in that: the polishing machine also comprises a polishing mechanism (2), a conversion mechanism (3) and a clamping hand (4); the clamping hand (4) is slidably arranged at the upper end of the supporting mechanism (1); the grinding mechanism (2) is arranged in the middle of the supporting mechanism (1) and can feed back the magnitude of torque force borne during working to the conversion mechanism (3) in real time; the conversion mechanism (3) is fixedly installed on the supporting mechanism (1) and is respectively communicated with the polishing mechanism (2) and the clamping hand (4), and the conversion mechanism (3) can dynamically regulate and control the clamping force of the clamping hand (4) through the torque force applied by the polishing mechanism (2).

2. The gallium arsenide single crystal mechanical polishing apparatus of claim 1, wherein: the upper ends of two sides of the supporting mechanism (1) are fixedly provided with sliding rails (1-3), and the opposite surfaces of the two sliding rails (1-3) are symmetrically provided with clamping hands (4);

the clamping hand (4) comprises a first sliding rod (4-1), the first sliding rod (4-1) is slidably mounted on a sliding rail (1-3), the first sliding rod (4-1) is slidably connected with a second sliding rod (4-3), a spring (4-1-1) is mounted between the first sliding rod (4-1) and the second sliding rod (4-3), and one end, close to the second sliding rod (4-3), of the first sliding rod (4-1) is connected with a threaded pin (4-2) in a penetrating mode; the second sliding rod (4-3) is fixedly connected with a clamping mechanism (4-4).

3. The gallium arsenide single crystal mechanical polishing apparatus of claim 2, wherein: an arc-shaped cavity (4-4-1) is formed in the clamping mechanism (4-4), a fifth pipeline port (4-4-2) is fixedly connected to the outside of the clamping mechanism (4-4), the fifth pipeline port (4-4-2) is communicated with the arc-shaped cavity (4-4-1), a plurality of pressure heads (4-4-5) are arranged on one side, away from the outer side wall of the second sliding rod (4-3), of the clamping mechanism (4-4) in an equidistant sealing sliding mode, the pressure heads (4-4-5) are communicated with the arc-shaped cavity (4-4-1), and a pressure plate (4-4-3) is connected to one side, away from the pressure heads (4-4-5), of the arc-shaped cavity (4-4-1) in an elastic sliding mode.

4. The gallium arsenide single crystal mechanical polishing apparatus of claim 3, wherein: a processing tank (1-1) is arranged in the middle of the supporting mechanism (1), and the processing tank (1-1) and the polishing mechanism (2) are located on the same horizontal position.

5. The gallium arsenide single crystal mechanical polishing apparatus of claim 4, wherein: the upper end and the lower end of the supporting mechanism (1) are respectively and symmetrically fixedly provided with a supporting frame (1-2), and the end parts of the supporting frames (1-2) are respectively provided with a polishing mechanism (2); the polishing mechanism (2) comprises a motor (2-1), the motor (2-1) is fixedly connected with the end part of the support frame (1-2), a rotating shaft (2-2) is rotatably installed at the end, close to the support mechanism (1), of the motor (2-1), the rotating shaft (2-2) is connected with a sliding shaft (2-3) in a sliding mode, and the sliding shaft (2-3) is rotatably connected with a polishing disc (2-4); a pressure mechanism is externally connected between the rotating shaft (2-2) and the sliding shaft (2-3) and is used for controlling the extrusion force of the sliding shaft (2-3) towards the direction of the polishing disc (2-4);

the grinding mechanism (2) is provided with a force transmission mechanism (2-5), the force transmission mechanism (2-5) comprises a fixed rod (2-5-4), the fixed rod (2-5-4) is fixedly connected with the side wall of the sliding shaft (2-3), the fixed rod (2-5-4) is fixedly connected with the arc-shaped cylinder (2-5-3), one end of the arc-shaped cylinder (2-5-3) is fixedly provided with a first pipeline port (2-5-5), the other end is connected with an arc-shaped rod (2-5-2) in a sliding way, the end part of the arc-shaped rod (2-5-2) is fixedly connected with a fixed block (2-5-1), and the fixed block (2-5-1) is fixedly connected with a polishing disc (2-4); and the force transmission mechanisms (2-5) on the upper and lower grinding mechanisms (2) are symmetrical about a vertical plane.

6. The gallium arsenide single crystal mechanical polishing apparatus of claim 2, wherein: the switching mechanism (3) comprises a first hydraulic tank (3-1), the first hydraulic tank (3-1) is fixedly installed at the upper end of a sliding rail (1-3), two ends of the first hydraulic tank (3-1) are respectively and fixedly connected and communicated with a second pipeline port (3-1-1) and a third pipeline port (3-1-2), the side surface of the first hydraulic tank (3-1) is fixedly connected with a second hydraulic tank (3-2), a first sliding chute (3-1-3) is formed in the connecting wall of the first hydraulic tank (3-1) and the second hydraulic tank (3-2) in a penetrating mode, a second sliding chute (3-1-4) is formed in the first sliding chute (3-1-3), and a sliding plate (3-5) is connected onto the first sliding chute (3-1-3) in a sliding mode, sealing walls (3-5-1) are vertically arranged on two side walls of the sliding plate (3-5), and the sealing walls (3-5-1) are in sealing sliding connection with the second sliding chutes (3-1-4); two ends of the sliding plate (3-5) are respectively connected with the inner walls of the first hydraulic tank (3-1) and the second hydraulic tank (3-2) in a sealing and sliding manner;

the upper end of the second hydraulic tank (3-2) is fixedly connected with a third hydraulic tank (3-3), and the two ends of the third hydraulic tank (3-3) and the two ends of the second hydraulic tank (3-2) are respectively communicated; the side wall of the third hydraulic tank (3-3) is vertically connected with a fourth hydraulic tank (3-4), and the connection part is communicated in a penetrating way;

a partition plate (3-4-2) is fixedly arranged in the middle of the fourth hydraulic tank (3-4), and the partition plate (3-4-2) extends into the third hydraulic tank (3-3) and is fixedly connected with the inner wall of the third hydraulic tank (3-3); sliding blocks (3-6) are connected to two sides of the partition plate (3-4-2) in a sliding mode, and a telescopic block (3-6-1) is installed at one end, close to the third hydraulic tank (3-3), of each sliding block (3-6); one end, far away from the third hydraulic tank (3-3), of the fourth hydraulic tank (3-4) is fixedly connected and communicated with a fourth pipeline opening (3-4-1).

7. The gallium arsenide single crystal mechanical polishing apparatus of claim 6, wherein: a first pipeline port (2-5-5) on a force transmission mechanism (2-5) in the upper polishing mechanism (2) and the lower polishing mechanism (2) is respectively communicated with a second pipeline port (3-1-1) and a third pipeline port (3-1-2) through hoses; fifth pipeline ports (4-4-2) on the two clamping hands (4) are communicated with a fourth pipeline port (3-4-1) together; and hydraulic oil is filled in the force transmission mechanisms (2-5), the conversion mechanism (3), the clamping hands (4) and the hose for connection.