CN114325967B - Optical device sealing structure and sealing method - Google Patents
Optical device sealing structure and sealing method Download PDFInfo
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- CN114325967B CN114325967B CN202111664643.2A CN202111664643A CN114325967B CN 114325967 B CN114325967 B CN 114325967B CN 202111664643 A CN202111664643 A CN 202111664643A CN 114325967 B CN114325967 B CN 114325967B
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- plated metal
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- 238000007789 sealing Methods 0.000 title claims abstract description 71
- 230000003287 optical effect Effects 0.000 title claims abstract description 62
- 238000000034 method Methods 0.000 title claims abstract description 14
- 239000011521 glass Substances 0.000 claims abstract description 141
- 239000002184 metal Substances 0.000 claims abstract description 73
- 229910052751 metal Inorganic materials 0.000 claims abstract description 73
- 239000000835 fiber Substances 0.000 claims abstract description 67
- 239000013307 optical fiber Substances 0.000 claims abstract description 57
- 239000010410 layer Substances 0.000 claims abstract description 52
- 239000003292 glue Substances 0.000 claims abstract description 39
- 238000003466 welding Methods 0.000 claims abstract description 31
- 239000012790 adhesive layer Substances 0.000 claims abstract description 18
- 229910000679 solder Inorganic materials 0.000 claims description 59
- 239000003822 epoxy resin Substances 0.000 claims description 18
- 229920000647 polyepoxide Polymers 0.000 claims description 18
- 238000010438 heat treatment Methods 0.000 claims description 12
- 239000011148 porous material Substances 0.000 claims description 12
- 230000001681 protective effect Effects 0.000 claims description 10
- 238000002844 melting Methods 0.000 claims description 8
- 230000008018 melting Effects 0.000 claims description 8
- 230000000694 effects Effects 0.000 claims description 6
- 230000005674 electromagnetic induction Effects 0.000 claims description 5
- 229910000833 kovar Inorganic materials 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 238000002955 isolation Methods 0.000 claims description 3
- 239000000155 melt Substances 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 abstract description 6
- 229910000562 Gilding metal Inorganic materials 0.000 abstract description 4
- 229920006335 epoxy glue Polymers 0.000 abstract description 3
- 239000004593 Epoxy Substances 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000005253 cladding Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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- Light Guides In General And Applications Therefor (AREA)
Abstract
The invention relates to the technical field of optical device packaging, in particular to an optical device sealing structure and a sealing method, wherein the optical device sealing structure comprises the following components: the optical device comprises an optical device base, a gold-plated metal tail pipe, an optical fiber, a glass welding layer, a glass sleeve, a first adhesive layer and a second adhesive layer; one end of the bare fiber section of the optical fiber passes through the gold-plated metal tail pipe and enters the inner cavity. The glass welding layer is arranged between the bare fiber section and the gold-plated metal tail pipe; the glass sleeve is arranged between the optical fiber and the gold-plated metal tail pipe; the first adhesive layer is arranged between the glass sleeve and the gold-plated metal tail pipe; the second adhesive layer is arranged between the optical fiber and the glass sleeve; through increasing a glass sleeve pipe between gilding metal tail pipe and optic fibre, can be with filling the epoxy glue between optic fibre and gilding metal tail pipe and separate into first glue film, second glue film, wherein glass sleeve pipe's coefficient of expansion is lower, can effectually reduce the influence of epoxy to optic fibre, improves structural stability, improves the product yield.
Description
Technical Field
The invention relates to the technical field of optical device packaging, in particular to an optical device sealing structure and a sealing method.
Background
In the field of optical communication, sealing between a semiconductor optical device and an optical fiber can be directly carried out by adopting glass welding and glue for connection sealing; the specific processing mode is that the tail pipe of the semiconductor optical device and the bare fiber of the optical fiber are connected through glass solder, and then the gap between the tail pipe and the optical fiber is filled through glue.
However, if the optical fiber is packaged by adopting the structure, the reliability of the structure is poor, and the product yield is low.
Accordingly, the prior art is still in need of improvement and development.
Disclosure of Invention
In view of the shortcomings of the prior art, the embodiment of the invention provides an optical device sealing structure and a sealing method, which are used for solving the technical problems of poor structural reliability and low product yield caused by directly packaging a semiconductor optical device and an optical fiber through glass welding and glue.
The technical scheme of the invention is as follows:
The invention provides an optical device sealing structure, comprising:
the optical device base is provided with an inner cavity and a side opening communicated with the inner cavity;
The gold-plated metal tail pipe is arranged on one side of the optical device base and is communicated with the inner cavity through the side opening;
An optical fiber comprising a bare fiber segment and a coated segment; one end of the bare fiber section passes through the gold-plated metal tail pipe and enters the inner cavity;
The glass welding layer is arranged between the bare fiber section and the gold-plated metal tail pipe;
The glass sleeve is arranged between the optical fiber and the gold-plated metal tail pipe, and one end of the glass sleeve is abutted against the glass welding layer;
the first adhesive layer is arranged between the glass sleeve and the gold-plated metal tail pipe;
The second adhesive layer is arranged between the optical fiber and the glass sleeve;
Wherein the bare fiber segment is partially positioned in the glass sleeve; the coated segment is partially located within the glass sleeve.
Still further preferred embodiments of the present invention are: the optical device sealing structure further comprises a third connecting adhesive layer which is arranged at the other end of the glass sleeve and used for connecting the end part of the glass sleeve and the optical fiber.
Still further preferred embodiments of the present invention are: the gold-plated metal tail pipe comprises a tail pipe main body, a gold-plated layer arranged on the outer side of the tail pipe main body, a bare fiber hole, a glass solder hole and a glass sleeve hole which are sequentially arranged in the tail pipe main body; the glass welding layer is arranged between the glass solder hole and the bare fiber section; the pore diameters of the glass sleeve pore, the glass solder pore and the bare fiber pore are sequentially reduced; the aperture of the bare fiber hole is adapted to the aperture of the bare fiber section; the outer diameter of the glass sleeve is between the aperture of the glass solder hole and the aperture of the glass sleeve hole.
Still further preferred embodiments of the present invention are: the gold-plated metal tail pipe further comprises a sealing conical hole arranged between the glass solder hole and the bare fiber hole, and the aperture of the sealing conical hole gradually reduces from the glass solder hole to the bare fiber hole.
Still further preferred embodiments of the present invention are: the tail pipe main body is made of kovar material, and the depth of the sealing conical hole is 1.6+/-0.3 mm; the depth of the glass sleeve hole is 1+/-0.2 mm.
Still further preferred embodiments of the present invention are: one end of the glass sleeve is protruded out of the gold-plated metal tail pipe; the length of the part of the glass sleeve protruding out of the gold-plated metal tail pipe is between 0.6mm and 2mm.
Still further preferred embodiments of the present invention are: the optical device sealing structure also comprises a protective rubber cap sleeved on the outer sides of the gold-plated metal tail pipe, the glass sleeve and part of the optical fibers; the inner wall of the protective rubber cap is attached to the outer sides of the gold-plated metal tail pipe, the glass sleeve and the optical fiber.
The embodiment of the invention also provides a sealing method of the optical device, which comprises the following steps:
the bare fiber section of the optical fiber passes through the gold-plated metal tail pipe and enters the inner cavity of the optical device base;
Adjusting the position of the base of the optical device to enable the gold-plated metal tail pipe to face upwards;
adding low-temperature glass solder among the glass solder hole, the sealing conical hole and the bare fiber section, heating to enable the glass solder to be melted to form a glass welding layer, and connecting the bare fiber section and the gold-plated metal tail pipe;
filling epoxy resin glue in the position above the glass welding layer in the gold-plated metal tail pipe, and inserting a glass sleeve to enable one end of the glass sleeve to be abutted against the glass welding layer; the epoxy resin glue forms a first glue layer and a second glue layer under the isolation effect of the glass sleeve.
Still further preferred embodiments of the present invention are: the optical device sealing method further comprises the steps of:
Epoxy resin glue is arranged at one end point of the glass sleeve protruding out of the gold-plated metal tail pipe, so that a third glue layer is formed between the end part of the glass sleeve and the optical fiber by the epoxy resin glue;
and a protective rubber cap is sleeved outside the gold-plated metal tail pipe and the glass sleeve.
Still further preferred embodiments of the present invention are: the glass solder is low-temperature glass with a melting point of 280+/-10 ℃; the heating melts the glass solder in the step of: the gold-plated metal tail pipe is heated by electromagnetic induction, so that the glass solder in the gold-plated metal tail pipe is melted.
Compared with the prior art, the sealing structure and the sealing method for the optical device have the advantages that at least the following steps are achieved:
According to the optical device sealing structure, the glass sleeve is additionally arranged between the gold-plated metal tail pipe and the optical fiber, the epoxy resin glue filled between the optical fiber and the gold-plated metal tail pipe can be separated into the first glue layer and the second glue layer, the expansion coefficient of the glass sleeve is low, the influence of epoxy resin on the optical fiber can be effectively reduced, the structural stability is improved, and the product yield is improved.
Drawings
FIG. 1 is a schematic structural view of an optical device sealing structure according to an embodiment of the present invention;
FIG. 2 is an exploded schematic view of an optical device sealing structure according to an embodiment of the present invention;
FIG. 3 is a cross-sectional view of an optical device sealing structure according to an embodiment of the present invention;
FIG. 4 is an enlarged schematic view of portion A of FIG. 3;
FIG. 5 is a cross-sectional view of a gold plated metal tail pipe according to an embodiment of the present invention;
fig. 6 is a flow chart of an optical device sealing method according to an embodiment of the present invention.
Detailed Description
The invention provides an optical device sealing structure and a sealing method, which are used for making the purposes, technical schemes and effects of the invention clearer and more definite, and the invention is further described in detail below by referring to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
Referring to fig. 1 to 5, the sealing structure of an optical device provided in the embodiment of the present invention includes: the optical device comprises an optical device base 1, a gold-plated metal tail pipe 2, an optical fiber 3, a glass welding layer 4, a glass sleeve 5, a first adhesive layer 61 and a second adhesive layer 62; wherein the light device base 1 is provided with an inner cavity 11, and a side opening (not shown in the figure) communicating with the inner cavity 11; the gold-plated metal tail pipe 2 is arranged on one side of the optical device base 1 and is communicated with the inner cavity 11 through a side opening; the optical fiber 3 comprises a bare fiber segment 31 and a coating segment 32, wherein one end of the bare fiber segment 31 penetrates through the gold-plated metal tail pipe 2 and enters the inner cavity 11. The glass welding layer 4 is arranged between the bare fiber section 31 and the gold-plated metal tail pipe 2; the glass sleeve 5 is arranged between the optical fiber 3 and the gold-plated metal tail pipe 2, and one end of the glass sleeve is abutted against the glass welding layer 4; the first adhesive layer 61 is arranged between the glass sleeve 5 and the gold-plated metal tail pipe 2; the second adhesive layer 62 is arranged between the optical fiber 3 and the glass sleeve 5; wherein the bare fiber segment 31 is partially located within the glass sleeve 5; the coated segment 32 is located partially within the glass sleeve 5.
Wherein the bare fiber segment 31 includes a core (not shown) and a cladding (not shown); the coated segment 32 includes a core, a cladding, and a coating layer (not shown).
Referring to fig. 4, the boundary portions of the bare fiber segment 31 and the coating segment 32 are located at the glass sleeve 5, so that the boundary portion of the optical fiber 3 can be protected by the glass sleeve 5, and the stability of the sealing structure is improved.
The first adhesive layer 61 and the second adhesive layer 62 are both formed after curing with epoxy glue.
Through increasing a glass sleeve 5 between gilding metal tail pipe 2 and optic fibre 3, can be with filling the epoxy glue between optic fibre 3 and gilding metal tail pipe 2 and separate into first glue film 61, second glue film 62, wherein the coefficient of expansion of glass sleeve 5 is lower, can effectually reduce the influence of epoxy to optic fibre 3, improves structural stability, improves the product yield.
In this embodiment, two side openings are provided, and the gold-plated metal tail pipe 2, the optical fiber 3, the glass welding layer 4, the glass sleeve 5, the first adhesive layer 61 and the second adhesive layer 62 are provided with two groups, which can be applied to sealing of a dual-core pump source optical device.
Referring to fig. 1 to 4, the optical device sealing structure further includes a third connection adhesive layer 63 disposed at the other end of the glass sleeve 5 and used for connecting the end of the glass sleeve 5 and the optical fiber 1. The third connection glue 63 is added between the end part of the glass sleeve 5 and the optical fiber 1, so that the position of the optical fiber 1 can be limited, the optical fiber 1 is prevented from being damaged due to collision with the side wall of the inner hole of the glass sleeve 5 when the optical fiber 1 is bent to the side surface, and the side pulling performance of the optical fiber 1 is improved.
Referring to fig. 3 to 5, the gold-plated metal tail pipe 2 includes a tail pipe body 21, a gold plating layer (not shown) disposed outside the tail pipe body 21, a bare fiber hole 22, a glass solder hole 23, and a glass sleeve hole 24 sequentially disposed in the tail pipe body 21; the pore diameters of the glass sleeve pore 24, the glass solder pore 23 and the bare fiber pore 22 are sequentially reduced; the glass soldering layer 4 is arranged between the glass solder holes 23 and the bare fiber section 31; the aperture of the bare fiber hole 22 is matched with the aperture of the bare fiber section 31; the outer diameter of the glass sleeve 5 is between the aperture of the glass solder hole 23 and the aperture of the glass sleeve hole 24. The bare fiber segment 31 sequentially passes through the glass sleeve hole 24, the glass solder hole 23 and the bare fiber hole 22 to enter the inner cavity 11 of the optical device base 1.
The bare fiber hole 22 is used for positioning the optical fiber 3, so that the whole optical fiber 3 can be limited in the central area (axial core) of the gold-plated metal tail pipe 2, and the problems of optical fiber interference damage and glass solder wall hanging caused by the eccentricity of the subsequent optical fiber 3 are avoided. The glass solder holes 23 are used for positioning the positions of the glass welding layers 4, and the thickness of the glass welding layers 4 is determined through the depth of the glass solder holes 23, so that the stability of the structure of a welding part is ensured; the glass sleeve hole 24 can be used to determine the thickness of the first glue layer 61, the second glue layer 62, and can be used to mount the glass sleeve 5. A bare fiber hole 22, a glass solder hole 23 and a glass sleeve hole 24 are arranged in the gold-plated metal tail pipe 2; the production efficiency or the installation efficiency of each part connected with the gold-plated metal tail pipe 2 can be improved, and the production efficiency of the sealing structure of the optical device can be improved.
Referring to fig. 3 to 5, a sealing tapered hole 231 is disposed at an end of the glass solder hole 23 near the bare fiber hole 22, and the aperture of the sealing tapered hole 231 gradually decreases from the glass solder hole 23 to the bare fiber hole 22. Wherein, the aperture of one end of the sealing taper hole 231 is the same as the aperture of the glass solder hole 23, and the aperture of the other end of the sealing taper hole 231 is the same as the aperture of the bare fiber hole 22. In this embodiment, by disposing the sealing taper hole 231 at one end of the glass solder hole 23, the filling speed of the glass solder can be accelerated when the glass solder is melted to form the glass solder layer 4, the risk of glass solder wall hanging is reduced, and the sealing and connecting effects of the glass solder layer 4 are ensured.
Wherein the inner wall of the sealing tapered hole 231 is inclined at an angle of 25 to 75 degrees.
Wherein, the tail pipe main body 21 is made of kovar material; the depth of the sealing tapered hole 231 is 1.6 + -0.3 mm; the depth of the glass sleeve hole 24 is 1+ -0.2 mm. Wherein, the depth of the sealing tapered hole 231 refers to the distance from the end of the sealing tapered hole 231 near the bare fiber hole 22 to the end of the tail pipe main body 21; the depth of the glass sleeve hole 24 refers to the distance from the end of the glass sleeve hole 24 near the glass solder hole 23 to the end of the tailpipe body 21.
By setting the tail pipe main body 21 as a kovar material, the glass welding layer 4 can be formed by heating the tail pipe main body 21 and melting glass solder in cooperation with electromagnetic induction, so that the production difficulty of the glass welding layer 4 is reduced, and the production efficiency is improved. Wherein, through high-frequency electromagnetic induction heating, the depth of the inner hole of the tail pipe main body 21 is specifically required, when the depth of the inner hole is too large, the heating efficiency is affected, and the heating and melting of the glass solder are affected; the depth range of the sealing conical hole 231 obtained through a large number of creative tests in the embodiment is 1.6+/-0.3 mm, so that the normal operation of heating can be ensured, the normal formation of the glass welding layer 4 can be realized, and the production efficiency is ensured. The glass sleeve hole 24 is used for installing the glass sleeve 5, and the depth of the glass sleeve hole 24 is limited to be 1+/-0.2 mm, so that the installation stability of the glass sleeve 5 can be ensured, the thickness of the glass welding layer 4 is ensured, and the sealing performance, namely the structural stability of the sealing structure of the whole optical device, is ensured.
Referring to fig. 1 to 4, one end of the glass sleeve 5 protrudes from the gold-plated metal tail pipe 2; the length of the part of the glass sleeve 2 protruding out of the gold-plated metal tail pipe 5 is between 0.6mm and 2 mm. In order to ensure proper formation of the glass solder layer4, it is necessary to define the depth of the sealing tapered bore 231, i.e. also the depth of the glass sleeve bore 24. First, the depth of the glass sleeve hole 24 is smaller than the depth of the sealing tapered hole 231, while the depth of the glass sleeve hole 24 cannot be excessively large because it affects the thickness of the glass-welded layer 4. In order to better protect the boundary between the bare fiber section 31 and the coating section 32 of the optical fiber, the length of the glass sleeve 2 can be increased, so that the glass sleeve 2 protrudes out of the gold-plated metal tail pipe 5, the optical fiber 3 can be better protected on the premise of not influencing heating, and the stability of the structure is improved.
Further, as shown in fig. 1 and fig. 2, the optical device sealing structure further includes a protective rubber cap 7 sleeved on the outer sides of the gold-plated metal tail pipe 2, the glass sleeve 5 and a part of the optical fiber 3; the inner wall of the protective rubber cap 7 is attached to the outer sides of the gold-plated metal tail pipe 2, the glass sleeve 5 and the optical fiber 3. The protection rubber cap 7 is additionally arranged to prevent the sealing structure of the optical device from directly colliding with the outside, so that the structural stability is improved. Meanwhile, the inner wall of the protective rubber cap 7 is attached to the outer sides of the gold-plated metal tail pipe 2, the glass sleeve 5 and the optical fiber 3, so that external impurity dust can be effectively prevented from entering the optical device sealing structure, and the normal use of the optical device sealing structure is ensured.
The embodiment of the invention also provides a sealing method of the optical device, as shown in fig. 1 and 2, comprising the following steps:
S100, enabling a bare fiber section of an optical fiber to pass through a gold-plated metal tail pipe and enter an inner cavity of a base of an optical device;
s200, adjusting the position of the base of the optical device to enable the gold-plated metal tail pipe to face upwards;
s300, adding low-temperature glass solder between the glass solder hole, the sealing conical hole and the bare fiber section, heating to enable the glass solder to be melted to form a glass welding layer, and connecting the bare fiber section and the gold-plated metal tail pipe;
s400, filling epoxy resin glue in the position above the glass welding layer in the gold-plated metal tail pipe, and inserting a glass sleeve to enable one end of the glass sleeve to be abutted against the glass welding layer; the epoxy resin glue forms a first glue layer and a second glue layer under the isolation effect of the glass sleeve.
Before packaging the optical device, the optical fiber is inserted into the optical device base, so that the relative position between the optical fiber and the optical device base during packaging can be positioned; then, the position of the base of the optical device is adjusted to enable the direction of the gold-plated metal tail pipe to be upward, so that when the low-temperature glass solder is melted, the low-temperature flow is guided by gravity to fill the sealing conical hole, the filling efficiency is improved, meanwhile, the filling effect is ensured, and the formed glass welding layer has good sealing performance and connection strength; after the epoxy resin glue is filled, the epoxy resin in the gold-plated metal tail pipe is separated into a first glue layer and a second glue layer by adding the glass sleeve, so that the influence of the epoxy resin with a high expansion coefficient on the optical fiber can be effectively reduced, and meanwhile, the bare fiber section and the coated section optical fiber in the glass sleeve can be protected by the glass sleeve, and the stability of the packaging structure is improved.
Specifically, the optical device sealing method further comprises the steps of:
s500, epoxy resin glue is formed at one end point of the glass sleeve protruding out of the gold-plated metal tail pipe, so that a third glue layer is formed between the end part of the glass sleeve and the optical fiber by the epoxy resin glue;
s600, sleeving a protective rubber cap on the outer sides of the gold-plated metal tail pipe and the glass sleeve.
Through the epoxy resin glue between glass sleeve tip and optic fibre, make it form the third connection glue film, can be used for restricting the position of optic fibre, prevent that optic fibre from taking place to collide with the optic fibre damage that leads to with the lateral wall of glass sleeve hole when optic fibre is crooked to the side, improve the side of optic fibre and draw the performance. The protection rubber cap is additionally arranged, so that the sealing structure of the optical device is prevented from being directly collided with the outside, and the structural stability is improved.
Further, as shown in fig. 1 to 3, the glass solder is low-temperature glass with a melting point of 200+ -10 ℃; the heating melts the glass solder in the step of: the gold-plated metal tail pipe is heated by electromagnetic induction, so that the glass solder in the gold-plated metal tail pipe is melted. In the embodiment, the glass solder is low-temperature glass solder, the melting point is about 280+/-10 ℃, the glass solder layer is formed by normally melting the glass solder, the cladding of the optical fiber is not damaged, and the normal use of the optical fiber is ensured.
It is to be understood that the invention is not limited in its application to the examples described above and that modifications and variations may be made by those skilled in the art in light of the above teachings which are intended to be within the purview of the appended claims.
Claims (5)
1. An optical device sealing structure, comprising:
the optical device base is provided with an inner cavity and a side opening communicated with the inner cavity;
The gold-plated metal tail pipe is arranged on one side of the optical device base and is communicated with the inner cavity through the side opening;
An optical fiber comprising a bare fiber segment and a coated segment; one end of the bare fiber section passes through the gold-plated metal tail pipe and enters the inner cavity;
The glass welding layer is arranged between the bare fiber section and the gold-plated metal tail pipe;
The glass sleeve is arranged between the optical fiber and the gold-plated metal tail pipe, and one end of the glass sleeve is abutted against the glass welding layer;
the first adhesive layer is arranged between the glass sleeve and the gold-plated metal tail pipe;
The second adhesive layer is arranged between the optical fiber and the glass sleeve;
wherein the bare fiber segment is partially positioned in the glass sleeve; the coated segment is partially positioned within the glass sleeve;
the optical device sealing structure also comprises a protective rubber cap sleeved on the outer sides of the gold-plated metal tail pipe, the glass sleeve and part of the optical fibers; the inner wall of the protective rubber cap is attached to the outer sides of the gold-plated metal tail pipe, the glass sleeve and the optical fiber;
The gold-plated metal tail pipe comprises a tail pipe main body, a gold-plated layer arranged on the outer side of the tail pipe main body, a bare fiber hole, a glass solder hole and a glass sleeve hole which are sequentially arranged in the tail pipe main body; the pore diameters of the glass sleeve pore, the glass solder pore and the bare fiber pore are sequentially reduced; the glass welding layer is arranged between the glass solder hole and the bare fiber section; the aperture of the bare fiber hole is adapted to the aperture of the bare fiber section; the outer diameter of the glass sleeve is between the aperture of the glass solder hole and the aperture of the glass sleeve hole;
the gold-plated metal tail pipe also comprises a sealing conical hole arranged between the glass solder hole and the bare fiber hole, wherein the aperture of the sealing conical hole gradually reduces from the glass solder hole to the bare fiber hole;
the tail pipe main body is made of kovar material, and the depth of the sealing conical hole is 1.6+/-0.3 mm; the depth of the glass sleeve hole is 1+/-0.2 mm.
2. The optical device sealing structure of claim 1, further comprising a third bond paste layer disposed at the other end of the glass ferrule for bonding the end of the glass ferrule to the optical fiber.
3. The optical device sealing structure according to claim 1, wherein one end of the glass sleeve is protruded from the gold-plated metal tail pipe; the length of the part of the glass sleeve protruding out of the gold-plated metal tail pipe is 0.6 mm-2 mm.
4. An optical device sealing method, comprising the steps of:
the bare fiber section of the optical fiber passes through the gold-plated metal tail pipe and enters the inner cavity of the optical device base;
Adjusting the position of the base of the optical device to enable the gold-plated metal tail pipe to face upwards;
adding low-temperature glass solder among the glass solder hole, the sealing conical hole and the bare fiber section, heating to enable the glass solder to be melted to form a glass welding layer, and connecting the bare fiber section and the gold-plated metal tail pipe;
Filling epoxy resin glue in the position above the glass welding layer in the gold-plated metal tail pipe, and inserting a glass sleeve to enable one end of the glass sleeve to be abutted against the glass welding layer; the epoxy resin glue forms a first glue layer and a second glue layer under the isolation effect of the glass sleeve;
Epoxy resin glue is arranged at one end point of the glass sleeve protruding out of the gold-plated metal tail pipe, so that a third glue layer is formed between the end part of the glass sleeve and the optical fiber by the epoxy resin glue;
a protective rubber cap is sleeved outside the gold-plated metal tail pipe and the glass sleeve;
wherein the low-temperature glass solder is low-temperature glass with a melting point of 280+/-10 ℃.
5. The method of sealing an optical device according to claim 4, wherein the glass solder is low temperature glass having a melting point of 280±10 degrees; the heating melts the glass solder in the step of: the gold-plated metal tail pipe is heated by electromagnetic induction, so that the glass solder in the gold-plated metal tail pipe is melted.
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| CN202111664643.2A CN114325967B (en) | 2021-12-30 | 2021-12-30 | Optical device sealing structure and sealing method |
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| CN201845110U (en) * | 2010-10-26 | 2011-05-25 | 武汉高晟知光科技有限公司 | End part structure of optical fiber for transmitting high-power laser |
| CN102436045A (en) * | 2011-12-29 | 2012-05-02 | 武汉电信器件有限公司 | Installation and fixation structure of light-guide fiber of photoelectronic device |
| CN112525237A (en) * | 2019-09-17 | 2021-03-19 | 武汉理工大学 | EFPI-FBG composite pressure and temperature sensor based on epoxy resin packaging and measuring method |
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