CN114318235B - Vapor deposition method and vapor deposition system - Google Patents
Vapor deposition method and vapor deposition system Download PDFInfo
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- CN114318235B CN114318235B CN202111452593.1A CN202111452593A CN114318235B CN 114318235 B CN114318235 B CN 114318235B CN 202111452593 A CN202111452593 A CN 202111452593A CN 114318235 B CN114318235 B CN 114318235B
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- 238000007740 vapor deposition Methods 0.000 title claims description 201
- 238000000034 method Methods 0.000 title claims description 34
- 238000001704 evaporation Methods 0.000 claims abstract description 265
- 230000008020 evaporation Effects 0.000 claims abstract description 228
- 239000000758 substrate Substances 0.000 claims abstract description 180
- 238000012360 testing method Methods 0.000 claims abstract description 31
- 238000010586 diagram Methods 0.000 description 17
- 238000004519 manufacturing process Methods 0.000 description 13
- 239000000463 material Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
Abstract
The embodiment of the application relates to the field of display, and provides an evaporation method and an evaporation system, wherein the evaporation method comprises the following steps: testing and obtaining the total deviation of the pixel positions of the mask plate and the substrate in one evaporation period; the evaporation period comprises at least two continuous evaporation periods, and sub-deviation values of pixel positions of the mask plate and the substrate in each evaporation period are obtained through testing; acquiring a compensation amount of the position of the pixel opening of the substrate corresponding to each evaporation time based on the sub-deviation amount and the total deviation amount; the same mask plate is adopted for actual evaporation, pixels are respectively evaporated in the pixel openings of the substrate with compensation quantity corresponding to the evaporation period in different evaporation periods of the mask plate, at least the matching problem between the mask plate and the substrate in one evaporation period can be improved, and the pixel position precision in one evaporation period is improved.
Description
Technical Field
The embodiment of the application relates to the field of display, in particular to an evaporation method and an evaporation system.
Background
Nowadays, electronic devices have become an integral part of people's daily lives, such as smartphones, tablet computers, etc. The display device of the electronic device may be an Organic Light-Emitting Diode (OLED) panel, and the preparation steps of the OLED panel include forming an anode, evaporating an Organic Light-Emitting material to form a Light-Emitting layer, and the like.
Providing a substrate and a mask plate, forming a pixel definition layer (Pixel Define Layer, PDL) and a pixel definition opening on the substrate, wherein the mask plate is provided with a mask opening; the mask plate is positioned on the substrate, the pixel opening is aligned with the mask opening, the luminescent material forms pixels in the pixel opening through the mask opening on the mask plate, and a plurality of pixels form a luminescent layer of the display panel.
However, in the evaporation process, as the evaporation time length and the number of sheets increase, the deviation between the glass substrate and the mask plate also gradually increases, that is, the pixel position accuracy (Pattern Position Accuracy, PPA) becomes poor, color mixing between pixels is caused, poor display occurs, and the production yield is affected.
Disclosure of Invention
The embodiment of the application provides an evaporation method and an evaporation system, which are at least beneficial to improving the matching problem between a mask plate and a substrate in one evaporation period and improving the pixel position precision in one evaporation period.
According to some embodiments of the present application, an aspect of an embodiment of the present application provides an evaporation method, including: testing and obtaining the total deviation of the pixel positions of the mask plate and the substrate in one evaporation period; the evaporation period comprises at least two continuous evaporation periods, and sub-deviation values of pixel positions of the mask plate and the substrate in each evaporation period are obtained through testing; acquiring a compensation amount of the position of the pixel opening of the substrate corresponding to each evaporation time based on the sub-deviation amount and the total deviation amount; the same mask plate is adopted for actual evaporation, and pixels are respectively evaporated in the pixel openings of the substrate with compensation quantity corresponding to the evaporation time in different evaporation time periods of the mask plate.
In some embodiments, a method of obtaining a total amount of deviation of pixel positions includes: acquiring the position of a pixel formed by evaporating a first substrate in an evaporation period in a pixel opening as an initial position; acquiring the position of a pixel formed by evaporating the last substrate in the evaporation period in a pixel opening as a final position; based on the initial position and the final position, a total deviation amount is acquired.
In some embodiments, a method of obtaining a sub-offset amount includes: acquiring the position of a pixel formed by evaporating a first substrate in an evaporation period in a pixel opening as an initial position; in one evaporation period, obtaining a pixel formed by evaporating the last substrate, and taking the position in the pixel opening as a final position; based on the initial position and the final position, a sub-deviation amount is acquired.
In some embodiments, prior to testing for the amount of sub-offset, further comprising: acquiring a time dividing line of adjacent evaporation periods, wherein the time dividing line is used as a reference for dividing different evaporation periods in an actual evaporation period; the method for acquiring the time dividing line comprises the following steps: based on the ratio of the sub-deviation amount of any vapor deposition period to the total deviation amount, the relative deviation amount of the vapor deposition period is obtained, and if the relative deviation amount reaches a preset threshold value, the duration of the previous vapor deposition period is recorded, and the duration is used as a time dividing line for defining the previous vapor deposition period and the subsequent vapor deposition period.
In some embodiments, the evaporation period includes at least three consecutive evaporation periods, each evaporation period except the last evaporation period corresponds to a preset threshold, and the preset threshold corresponding to the nth evaporation period satisfies the following relationship: phi= (1/N) x n+a, wherein phi is a preset threshold value, N is the total number of evaporation periods, -5% or more and-5% or less.
In some embodiments, the evaporation period comprises two consecutive evaporation periods, the preset threshold being 48% -52%.
In some embodiments, the preset threshold is 50%.
In some embodiments, a method of obtaining a compensation amount includes: x= (a m +A m-1 ) Wherein X is a compensation coefficient of the current evaporation period, A m A is the relative deviation of the current evaporation period m-1 The relative deviation of the previous vapor deposition period is the ratio of the sub-deviation of any vapor deposition period to the total deviation of the vapor deposition period, and is 1.8-2.2, if the current vapor deposition period is the last vapor deposition period in the vapor deposition period, A m 100%, if the current vapor deposition period is the first vapor deposition period in the vapor deposition cycle, A m-1 Is 0; based on the total deviation amount, obtaining a total compensation amount corresponding to the total deviation amount; and acquiring the compensation quantity of each evaporation period based on the total compensation quantity and the compensation coefficient of each evaporation period.
In some embodiments, the vapor deposition cycle includes two consecutive vapor deposition periods, and v is 2, where the first vapor deposition period corresponds to a compensation amount of 25% of the total compensation amount corresponding to the total deviation amount, and the second vapor deposition period corresponds to a compensation amount of 75% of the total compensation amount corresponding to the total deviation amount.
According to some embodiments of the present application, another aspect of the embodiments of the present application further provides an evaporation system, which is applied to any one of the evaporation methods described above, and the test module is configured to test and obtain a total deviation amount of pixel positions of the mask plate and the substrate in one evaporation period, where the evaporation period includes at least two consecutive evaporation periods, and the test module is further configured to test and obtain a sub-deviation amount of pixel positions of the mask plate and the substrate in each evaporation period; an acquisition module for acquiring a compensation amount of the position of the pixel opening of the substrate corresponding to each evaporation period based on the sub-deviation amount and the total deviation amount; and the calling module is used for calling the unused substrate to carry out actual evaporation in different evaporation periods of the same mask plate so as to respectively evaporate pixels in the pixel openings of the substrate with the compensation quantity corresponding to the evaporation period.
The technical scheme provided by the embodiment of the application has at least the following advantages:
in the technical scheme of the vapor deposition method provided by the embodiment of the application, the total deviation of the pixel positions of the mask plate and the substrate in one vapor deposition period is obtained through pre-testing, and the sub-deviation corresponding to each vapor deposition period in the vapor deposition period is also obtained; acquiring compensation amounts of positions of pixel openings of the substrate corresponding to each evaporation time based on the sub-deviation amounts of the pixel positions and the total deviation amounts of the pixel positions; then, pixels are vapor deposited in pixel openings of the substrate having a compensation amount corresponding to the vapor deposition period in different vapor deposition periods in which actual vapor deposition is performed using the same mask plate. Therefore, the substrates in different evaporation periods respectively correspond to different deformation amounts of the matched mask plates, different substrates are adopted in different evaporation periods for evaporation, namely, the positions of pixel openings of the substrates adopted in different evaporation periods are provided with compensation amounts matched with the deformation amounts of the mask plates in the evaporation periods, so that the deviation of the positions of evaporation pixels in different evaporation periods can be improved, the deviation of the positions of the pixels in the whole evaporation period (including the early, middle and later evaporation periods) can be improved, poor display of the display panel caused by color mixing among the pixels can be avoided, the situation that the reliability of the evaporation substrates is poor is improved, and the production yield of the display panel is improved.
Drawings
One or more embodiments are illustrated by way of example and not limitation in the figures of the accompanying drawings, which are not to be construed as limiting the embodiments unless specifically indicated otherwise.
FIG. 1 is a schematic diagram of a mask in the initial stage of vapor deposition,
fig. 2 is a schematic structural diagram of a mask plate in a middle evaporation stage;
fig. 3 is a schematic structural diagram of a mask plate in the later stage of vapor deposition;
FIG. 4 is a schematic view of a substrate;
fig. 5 is a schematic flow chart of an evaporation method according to an embodiment of the present disclosure;
fig. 6 is a schematic structural diagram of an evaporation structure formed by an evaporation method according to an embodiment of the present disclosure;
fig. 7 is a schematic cross-sectional view of an evaporation structure formed by an evaporation method according to an embodiment of the present disclosure;
fig. 8 is a schematic structural diagram of a substrate formed by an evaporation method according to an embodiment of the present disclosure;
FIG. 9 is a schematic diagram of another substrate formed by an evaporation method according to an embodiment of the present disclosure;
fig. 10 is a schematic diagram illustrating arrangement of multiple evaporation periods in an evaporation period according to an embodiment of the present disclosure;
fig. 11 is a schematic structural diagram of an evaporation system according to an embodiment of the present application.
Detailed Description
As can be seen from the background art, the pixel position deviation in the vapor deposition period is difficult to compensate.
Referring to fig. 1 to 3, fig. 1 is a schematic structural diagram of a mask plate at an initial stage of evaporation, and fig. 2 is a schematic structural diagram of a mask plate at a middle stage of evaporation; fig. 3 is a schematic structural diagram of a mask plate in a later stage of evaporation, and it is known from analysis that one of the reasons for the above problems is that the mask plate 120 has a mask opening for evaporating pixels after aligning with the pixel opening of the substrate 100, and the substrate 100 has a pixel opening and a pixel defining layer 110. In the evaporation process, as the evaporation time length and the number of substrate sheets increase, the deformation difference between the mask plate 120 and the substrate 100 is larger and larger under the influence of heat radiation, the deviation between the pixel opening 111 of the pixel defining layer 110 on the substrate 100 and the mask opening 121 on the mask plate 120 is also gradually increased, and finally the deviation between the evaporation position of the organic luminescent material and the pixel opening 111 on the substrate 100 in the later evaporation stage is serious, that is, the pixel position precision between the mask opening 121 of the mask plate 120 and the pixel opening 111 of the substrate 100 is poor, color mixing between pixels is caused, poor display occurs, and the production yield is affected.
Referring to fig. 4, fig. 4 is a schematic structural diagram of a substrate, in which the pixel opening of the first substrate and the pixel opening of the last substrate are compensated, the compensation coefficient of the compensated substrate is 50%, that is, the compensation amount B of the pixel opening of the compensated substrate is equal to 50% of the total deviation a, and the deviation of the pixel positions of the mask opening 121 of the mask plate 120 and the pixel opening 111 of the substrate 100 is improved to some extent, but the deviation compensation in the pre-evaporation period and the post-evaporation period is poor, wherein the pixel opening of the first substrate is defined as a first opening 130, the pixel opening of the last substrate is defined as a second opening 140, and the pixel opening of the compensated substrate is defined as a compensation opening 131.
Therefore, the implementation of the application provides a vapor deposition method and a vapor deposition system, wherein the total deviation of pixel positions of a mask plate and a substrate in one vapor deposition period is obtained through testing in advance, and the sub-deviation corresponding to each vapor deposition period in the vapor deposition period is also obtained; acquiring a compensation amount of the position of the pixel opening of the substrate corresponding to each evaporation time based on the sub-deviation amount of the pixel position and the total deviation amount of the pixel position; then, pixels are vapor deposited in pixel openings of the substrate having a compensation amount corresponding to the vapor deposition period in different vapor deposition periods in which actual vapor deposition is performed using the same mask plate. Therefore, the substrates in different evaporation periods respectively correspond to different deformation amounts of the matched mask plates, different substrates are adopted in different evaporation periods for evaporation, namely, the positions of pixel openings of the substrates adopted in different evaporation periods are provided with compensation amounts matched with the deformation amounts of the mask plates in the evaporation periods, so that the deviation of the positions of evaporation pixels in different evaporation periods can be improved, the deviation of the positions of the pixels in the whole evaporation period (including the early, middle and later evaporation periods) can be improved, poor display of the display panel caused by color mixing among the pixels can be avoided, the situation that the reliability of the evaporation substrates is poor is improved, and the production yield of the display panel is improved.
Embodiments of the present application will be described in detail below with reference to the accompanying drawings. However, as will be appreciated by those of ordinary skill in the art, in the various embodiments of the present application, numerous technical details have been set forth in order to provide a better understanding of the present application. However, the technical solutions claimed in the present application can be implemented without these technical details and with various changes and modifications based on the following embodiments.
Referring to fig. 5 to fig. 10, fig. 5 is a schematic flow chart of an evaporation method according to an embodiment of the present application; fig. 6 is a schematic structural diagram of an evaporation structure formed by an evaporation method according to an embodiment of the present disclosure; fig. 7 is a schematic cross-sectional view of an evaporation structure formed by an evaporation method according to an embodiment of the present disclosure; fig. 8 is a schematic structural diagram of a substrate formed by an evaporation method according to an embodiment of the present disclosure; FIG. 9 is a schematic diagram of another substrate formed by an evaporation method according to an embodiment of the present disclosure; fig. 10 is a schematic diagram illustrating arrangement of multiple evaporation periods in an evaporation period according to an embodiment of the present disclosure.
Some embodiments of the present application provide an evaporation method, including the following steps:
s1, testing and obtaining the total deviation of pixel positions of the mask plate 220 and the substrate 200 in one evaporation period;
s2, the evaporation period comprises at least two continuous evaporation periods, and the sub-deviation of the pixel positions of the mask plate 220 and the substrate 200 in each evaporation period is obtained through testing;
s3, acquiring compensation amounts of positions of the pixel openings 211 of the substrate 200 corresponding to each evaporation time based on the sub-deviation amounts and the total deviation amounts;
s4, performing actual evaporation by adopting the same mask plate 220, and respectively evaporating pixels in the pixel openings 211 of the substrate 200 with compensation amounts corresponding to the evaporation time in different evaporation times of the mask plate 220.
In some embodiments, the evaporation period may be a time for evaporating a specified number of substrates 200 from one mask plate 220, that is, in one evaporation period, the number of mask plates 220 is one, and the number of substrates 200 may be multiple. In a specific example, the evaporation period may be a time for evaporating 60 substrates 200 from one mask 220. The pixel is a basic unit forming an organic light emitting layer, and includes red (R), green (G), and blue (B) sub-pixels. The light emitting layer of the red (R) subpixel is a red light emitting layer, the light emitting layer of the green (G) subpixel is a green light emitting layer, and the light emitting layer of the blue (B) subpixel is a blue light emitting layer.
In some embodiments, referring to fig. 6 or fig. 7, the Mask 220 may be a Fine Metal Mask (FMM), and the Mask 220 has a Mask opening 221 for aligning with the pixel opening 211 of the substrate 200 and evaporating pixels. The substrate 200 may be a low temperature polysilicon (Low Temperature Poly-silicon, LTPS) substrate, and the substrate 200 has a pixel defining layer 210 thereon, and the pixel defining layer 210 has a pixel opening 211 penetrating the pixel defining layer 210 thereon. The pixel defining layer 210 is mainly used for preventing the mask 220 from directly contacting the pixels during actual evaporation, resulting in defects caused by pixel scratch.
In some embodiments, in step S1, the method for obtaining the total deviation of the pixel positions includes: acquiring the position of a vapor deposition pixel in a pixel opening of a first substrate 200 of the pixels formed in the vapor deposition period as an initial position; acquiring the position of an evaporation pixel in a pixel opening of the last substrate 200 in the evaporation period as a final position; based on the initial position and the final position, a total deviation amount is obtained. Specifically, the deviation between the final position and the initial position is the total deviation amount. The first substrate 100 and the last substrate 100 are used to determine the total deviation amount, so that the accuracy of the total deviation amount is high.
In a specific example, referring to fig. 8 or 9, in one evaporation cycle, the position of the evaporation pixel of the first substrate is defined as an initial pixel position 230, and the position of the evaporation pixel of the last substrate is defined as a final pixel position 240; based on the initial pixel position 230 and the final pixel position 240, a total deviation amount a is obtained, which is equal to the position deviation value between the initial pixel position 230 and the final pixel position 240.
It will be appreciated that in other embodiments, the initial position may also be defined by the first m in the evaporation cycle 1 The positions of the vapor deposition pixels in the pixel defining openings of any one of the substrates are determined, m 1 May be less than or equal to 5; the final position can also be determined by the last n in the evaporation period 1 The positions of the vapor deposition pixels in the pixel defining openings of any one of the substrates are determined, n 1 May be less than or equal to 5.
In some embodiments, in step S1, the method for obtaining the sub-offset amount includes: in the vapor deposition period, the position of the pixel formed by the first substrate 200 in the pixel opening 211 is acquired as an initial position; in one of the vapor deposition periods, the position of the pixel formed by the last substrate 200 in the pixel opening 211 is acquired as a final position; based on the initial position and the final position, a sub-deviation amount is acquired.
The sub-shift amount refers to a pixel position shift amount for each vapor deposition period. In other embodiments, the first m in the vapor deposition cycle may be used 2 The positions of the vapor deposition pixels in the pixel defining openings of any one of the substrates are determined, m 2 May be less than or equal to 3; the final position can also be defined by the last n in the evaporation period 2 The positions of the vapor deposition pixels in the pixel defining openings of any one of the substrates are determined, n 2 May be less than or equal to 3.
In some embodiments, the evaporation period may be at least two consecutive evaporation periods. Specifically, the first vapor deposition period of the vapor deposition cycle is defined as P1, the second vapor deposition period is defined as P2, the third vapor deposition period is defined as P3, and the other vapor deposition periods are defined in sequence; the sub-shift amount L1 of the first vapor deposition period P1, the sub-shift amount L2 of the second vapor deposition period P1, and the sub-shift amount L3 of the third vapor deposition period P3 sequentially define the sub-shift amounts of the other vapor deposition periods. The evaporation period comprises a plurality of evaporation periods, each evaporation period has corresponding sub-deviation amount, which is equivalent to solving a large overall problem in turn in a plurality of small links, the coverage range is wider, the deformation difference of the mask plate and the substrate is analyzed from the sub-deviation amounts in the evaporation periods, the situation that the displacement compensation at the earlier stage or later stage of the evaporation period is lower is avoided, the situation that the pixel opening on the substrate is deviated seriously at the evaporation position of the organic luminescent material at the later stage of the evaporation is effectively improved, thereby the poor display of the display panel caused by color mixing among pixels can be avoided, the poor reliability of the evaporation substrate is improved, and the production yield of the display panel is improved.
In some embodiments, in step S1, before testing the obtained sub-deviation amount, further includes: acquiring a time dividing line of adjacent evaporation periods, wherein the time dividing line is used as a reference for dividing different evaporation periods in an actual evaporation period; the method for acquiring the time dividing line comprises the following steps: based on the ratio of the sub-deviation amount of any vapor deposition period to the total deviation amount, the relative deviation amount of the vapor deposition period is obtained, and if the relative deviation amount reaches a preset threshold value, the duration of the previous vapor deposition period is recorded, and the duration is used as a time dividing line for defining the previous vapor deposition period and the subsequent vapor deposition period. The evaporation period comprises at least three continuous evaporation periods, each evaporation period except the last evaporation period corresponds to a preset threshold value, and the preset threshold value corresponding to the nth evaporation period satisfies the following relationship: phi= (1/N) x n+a, wherein phi is a preset threshold value, N is the total number of evaporation periods, -5% or more and-5% or less. Wherein 1 is the total duty ratio of the deviation amount in the total deviation amount in the whole evaporation period, namely, the ratio of the total deviation amount to the total deviation amount is 1, the total duty ratio 1 is equally divided according to the total number of evaporation periods, and a is the tolerance duty ratio.
In some embodiments, referring to FIG. 10, the evaporation period is made up of 4 consecutive evaporation periods, then a first sub-preset threshold value φ 1 = (1/4) ×1+a, i.e. the first sub-preset threshold value Φ 1 20% -30%; a second sub-preset threshold value phi 2 = (1/4) × 2+a, i.e. second sub-preset threshold value Φ 2 45% -55%; a third sub-preset threshold value phi 3 = (1/4) × 3+a, i.e. third sub-preset threshold value Φ 3 70% -80%.
In a specific example, the first sub-preset threshold value φ 1 25%, a second sub-preset threshold value phi 2 Is 50% and a third sub-preset threshold value phi 3 75%, one evaporation cycle includes evaporating 60 substrates. If the 15 th substrate is vapor deposited, the relative deviation between the 15 th substrate vapor deposited pixel and the first substrate vapor deposited pixel reaches a first sub-preset threshold value phi 1 The duration t1 of the vapor deposition substrates 1 to 15 is set as the first vapor deposition period P1; if the 30 th substrate is vapor deposited, the relative deviation between the 30 th substrate vapor deposited pixel and the first substrate vapor deposited pixel reaches the second sub-preset threshold value phi 2 The duration t2-t1 of the vapor deposition substrates 16 to 30 is taken as a second vapor deposition period P2; if the 45 th substrate is vapor deposited, the relative deviation between the 45 th substrate vapor deposited pixel and the first substrate vapor deposited pixel reaches a third sub-preset threshold value phi 3 The time period t3-t2 of the vapor deposition substrates 31 to 45 is set as the third vapor deposition period P3, and the time period t4-t3 of the vapor deposition substrates 46 to 60 is set as the fourth vapor deposition period P4.
In some embodiments, the evaporation period includes two consecutive evaporation periods, and the preset threshold is 48% -52%, specifically may be 48%, 49%, 50% or 52%. In a specific example, the preset threshold is 50%, and one evaporation cycle includes evaporating 60 substrates. When the 30 th substrate is vapor-deposited, the ratio of the sub-deviation amount of the 30 th substrate vapor-deposited pixel to the total deviation amount of the first substrate vapor-deposited pixel in the vapor-deposition period, that is, the relative deviation amount reaches a preset threshold, that is, the ratio of the sub-deviation amount of the 30 th substrate vapor-deposited pixel to the total deviation amount of the first substrate vapor-deposited pixel is equal to 50%, the length of the vapor-deposited substrates 1 to 30 is taken as the first vapor-deposition period P1, the length of the vapor-deposited substrates 31 to 60 is taken as the second vapor-deposition period P2, the whole vapor-deposition period is divided into two vapor-deposition periods equal to each other, the deformation amount between the substrate and the mask plate in the P1 is equal to the deformation amount between the substrate and the mask plate in the P2, and the displacement compensation is performed on the substrates in the two vapor-deposition periods respectively, so that the pixel opening deviation distance in the earlier stage or later stage of the vapor-deposited period is reduced, the display failure of the display panel caused by color mixture between the pixels can be improved, the situation of poor reliability of the vapor-deposited substrates is facilitated, and the production yield of the display panel is facilitated to be improved.
In some embodiments, in step S2, a method for obtaining a compensation amount includes: x= (a m +A m-1 ) Wherein X is a compensation coefficient of the current evaporation period, A m A is the relative deviation of the current evaporation period m-1 The relative deviation of the previous vapor deposition period is 1.8 v 2.2, if the current vapor deposition period is the last vapor deposition period in the vapor deposition period, A m 100%, if the current vapor deposition period is the first vapor deposition period in the vapor deposition cycle, A m-1 Is 0; based on the total deviation amount, obtaining a total compensation amount corresponding to the total deviation amount; and acquiring the compensation quantity of each evaporation period based on the total compensation quantity and the compensation coefficient of each evaporation period.
In some embodiments, referring to fig. 8 and 9, the vapor deposition cycle includes two consecutive vapor deposition periods, the preset threshold is 50%, the relative deviation of the first vapor deposition period is 50%, i.e., the ratio a of the sub-deviation of the first vapor deposition period to the total deviation m 50% and v is 2, the compensation coefficient x1= (0+50%)/2=25% at the first vapor deposition period, i.e., the compensation amount X corresponding to the first vapor deposition period 1 25% of the total compensation amount A corresponding to the total deviation amount; similarly, the compensation coefficient x2= (50% +100%)/2=75% at the second vapor deposition period, that is, the compensation amount X corresponding to the second vapor deposition period 2 75% of the total compensation amount A corresponding to the total deviation amount. Wherein, the pixel of the substrate 100 corresponding to the first vapor deposition period P1The compensation amount of the opening is 50% of the position deviation amount of the first substrate and the last substrate in the first evaporation period P1, and the pixel opening after compensation is defined as a first opening 231; compensation amount of pixel openings of the substrate corresponding to the second evaporation period P2 is 50% of the position deviation amount of the first substrate and the last substrate in the second evaporation period, and the compensated pixel opening is defined as the second opening 232, so that the evaporation pixel position deviation of the two evaporation periods can be improved under the condition of reducing the number of the substrates as much as possible, the pixel position deviation in the whole evaporation period (including the early, middle and later evaporation periods) can be improved, poor display of the display panel caused by color mixing among pixels can be avoided, the production yield of the display panel is improved, and meanwhile, the production cost is lower.
Accordingly, the vapor deposition cycle is composed of two successive vapor deposition periods, wherein in the actual vapor deposition process, a substrate with a compensation amount of 25% of the total compensation amount is used for vapor deposition in the first vapor deposition period, and a substrate with a compensation amount of 75% of the total compensation amount is used for vapor deposition in the second vapor deposition period.
In some embodiments, the process steps for preparing the substrate 200 corresponding to different evaporation periods include: preparing pixel mask plates corresponding to different evaporation periods, namely, the compensation amount of each pixel mask plate is different; the pixel layer 210 on the substrate 200 is patterned using the pixel mask plate as a mask to form the pixel layer 210 having the pixel openings 211 with different compensation amounts.
Referring to fig. 10, taking the example in which the vapor deposition cycle has the first vapor deposition period P1, the second vapor deposition period P2, the third vapor deposition period P3, and the fourth vapor deposition period P4 in succession, the compensation coefficient of the pixel opening of the substrate employed in the first vapor deposition period P1 is: (a0+a1)/2, in the second vapor deposition period P2, the compensation coefficient of the pixel opening of the substrate used is: (a1+a2)/2, in the third vapor deposition period P3, the compensation coefficient of the pixel opening of the substrate used is: in the fourth vapor deposition period P4, (a2+a3)/2, the compensation amount of the pixel opening of the substrate used is: (a3+a4)/2, wherein A0 is 0, A1 is a ratio of the total deviation L4 to the sub-deviation L1 corresponding to the first vapor deposition period P1, A2 is a ratio of the total deviation L4 to the sub-deviation L2 corresponding to the second vapor deposition period P2, A3 is a ratio of the total deviation L4 to the sub-deviation L3 corresponding to the third vapor deposition period P3, and A4 is 100%.
In some embodiments, in step S3, since the deformation amounts of the mask plate and the substrate are different in different evaporation periods, the position deviation of the pixel opening on the substrate and the position deviation of the mask opening of the mask plate are also different, and the substrate balance position deviation of different compensation amounts needs to be invoked. According to the length of each evaporation period or the number of the substrates evaporated in the evaporation period in step S2, one type of substrate evaporation pixels with different compensation amounts are called in different evaporation periods.
In the vapor deposition method provided by the embodiment of the application, the total deviation of the pixel positions of the mask plate 220 and the substrate 200 in one vapor deposition period is obtained through pre-testing, and the sub-deviation corresponding to each vapor deposition period in the vapor deposition period is also obtained; acquiring a compensation amount of the position of the pixel opening 211 of the substrate 200 corresponding to each vapor deposition period based on the sub-deviation amount of the pixel position and the total deviation amount of the pixel position; then, in a different vapor deposition period in which actual vapor deposition is performed using the same mask plate 220, pixels are vapor deposited in the pixel openings 211 of the substrate 200 having a compensation amount corresponding to the vapor deposition period. In this way, the substrates 200 in different evaporation periods respectively correspond to different deformation amounts of the matched mask plate 220, and different substrates 200 are adopted in different evaporation periods to perform evaporation, that is, the positions of the pixel openings 211 of the substrates 200 adopted in different evaporation periods have compensation amounts matched with the deformation amounts of the mask plate in the evaporation period, so that the deviation of the positions of evaporation pixels in different evaporation periods can be improved, the deviation of the positions of the pixels in the whole evaporation period (including the early, middle and later periods of evaporation) can be improved, the display defect of the display panel caused by color mixing among pixels can be avoided, the poor reliability of the evaporation substrate 200 can be improved, and the production yield of the display panel can be improved.
In addition, the vapor deposition period includes two consecutive vapor deposition periods, the compensation amount corresponding to the first vapor deposition period is 25% of the total compensation amount corresponding to the total deviation amount, the compensation amount corresponding to the second vapor deposition period is 75% of the total compensation amount corresponding to the total deviation amount, the compensation amounts of the two substrates 200 are respectively obtained based on 50% of the position deviation amounts of the first substrate and the last substrate in the first vapor deposition period and 50% of the position deviation amounts of the first substrate and the last substrate in the second vapor deposition period, and the total compensation amount is obtained, so that the position deviation of the vapor deposition pixels in the two vapor deposition periods is improved under the condition of reducing the number of the substrates 200 as much as possible, and the pixel position deviation in the whole vapor deposition period (including the early stage, the middle stage and the later stage of vapor deposition) can be improved, thereby avoiding poor display of the display panel caused by color mixing among pixels, being beneficial to improving the production yield of the display panel, and simultaneously enabling the production cost to be lower.
Accordingly, some embodiments of the present application provide a vapor deposition system, which is applied to the vapor deposition method of any one of the above embodiments, and referring to fig. 11, fig. 11 is a schematic structural diagram of the vapor deposition system provided in an embodiment of the present application, where the vapor deposition system includes: the test module 301 is configured to test and obtain a total deviation amount of pixel positions of the mask and the substrate in a vapor deposition period, where the vapor deposition period includes at least two consecutive vapor deposition periods, and further configured to test and obtain a sub-deviation amount of pixel positions of the mask and the substrate in each vapor deposition period; an obtaining module 302, configured to obtain a compensation amount of a position of a pixel opening of the substrate corresponding to each evaporation period based on the sub-deviation amount and the total deviation amount; and a calling module 303, configured to call the unused substrate to perform actual evaporation during different evaporation periods of the same mask plate, so as to evaporate pixels in the pixel openings of the substrate having the compensation amount corresponding to the evaporation period.
In some embodiments, the vapor deposition system is connected to the vapor deposition machine, and controls the vapor deposition machine to call up different substrates for actual vapor deposition at different vapor deposition periods. And testing the pixel position and time in the pixel opening of each substrate in the evaporation period based on the evaporation period of one mask plate. According to practical requirements, the method for obtaining the total deviation of the pixel positions of the mask plate and the substrate in the vapor deposition machine by the test module 301 includes: acquiring the position of an evaporation pixel in a pixel opening of a first substrate in an evaporation period as an initial position; acquiring the position of an evaporation pixel in a pixel opening of the last substrate in the evaporation period as a final position; based on the initial position and the final position, the deviation amount of the total pixel position is acquired. The method for obtaining the sub-deviation amount of the mask plate and the substrate in the vapor deposition machine by the test module 301 comprises the following steps: acquiring the position of a pixel formed by evaporating a first substrate in an evaporation period in a pixel opening as an initial position; in one evaporation period, obtaining a pixel formed by evaporating the last substrate, and taking the position in the pixel opening as a final position; based on the initial position and the final position, a sub-deviation amount is acquired.
In some embodiments, the test module 301 is configured to obtain a boundary between two adjacent evaporation periods, where the time boundary is used as a reference for dividing different evaporation periods during actual evaporation; the method for acquiring the time dividing line comprises the following steps: based on the ratio of the sub-deviation amount of any vapor deposition period to the total deviation amount, the relative deviation amount of the vapor deposition period is obtained, and if the relative deviation amount reaches a preset threshold value, the duration of the previous vapor deposition period is recorded, and the duration is used as a time dividing line for defining the previous vapor deposition period and the subsequent vapor deposition period.
In some embodiments, the acquisition module 302 is coupled to the test module 301. The method for acquiring the compensation amount in the acquisition module 302 based on the sub-compensation amount and the total compensation amount includes: x= (a m +A m-1 ) Wherein X is a compensation coefficient of the current evaporation period, A m A is the relative deviation of the current evaporation period m-1 The relative deviation of the previous vapor deposition period is 1.8 v 2.2, if the current vapor deposition period is the last vapor deposition period in the vapor deposition period, A m 100%, if the current vapor deposition period is the first vapor deposition period in the vapor deposition cycle, A m-1 Is 0; based on the total deviation amount, obtaining a total compensation amount corresponding to the total deviation amount; and acquiring the compensation quantity of each evaporation period based on the total compensation quantity and the compensation coefficient of each evaporation period.
In some embodiments, the vapor deposition cycle includes two consecutive vapor deposition periods, the preset threshold is 50%, the relative deviation of the first vapor deposition period is 50%, i.e. the ratio A of the sub-deviation of the first vapor deposition period to the total deviation m 50% and v is 2, the compensation coefficient x1= (0+50%)/2=25% at the first vapor deposition period, i.e., the compensation amount X corresponding to the first vapor deposition period 1 25% of the total compensation amount A corresponding to the total deviation amount; similarly, the compensation coefficient x2= (50% +100%)/2=75% at the second vapor deposition period, that is, the compensation amount X corresponding to the second vapor deposition period 2 75% of the total compensation amount A corresponding to the total deviation amount. The compensation amount of the pixel opening of the substrate 100 corresponding to the first evaporation period P1 is 50% of the position deviation amount of the first substrate and the last substrate in the first evaporation period P1, the compensated pixel opening is defined as the first opening 231, the compensation amount of the pixel opening of the substrate corresponding to the second evaporation period P2 is 50% of the position deviation amount of the first substrate and the last substrate in the second evaporation period, and the compensated pixel opening is defined as the second opening 232, so that the position deviation of the evaporation pixels in the two evaporation periods can be improved under the condition of reducing the number of the substrates as much as possible, the pixel position deviation in the whole evaporation period (including the early, middle and later periods of evaporation) can be improved, and thus the poor display of the display panel caused by color mixing among pixels can be avoided, the production yield of the display panel can be improved, and the production cost is lower.
In some embodiments, the invoking module 303 determines the duration of each evaporation period or the number of substrates evaporated during each evaporation period based on the dividing line of the evaporation period of the test module 301 in actual evaporation, and invokes the substrate evaporation pixels with different compensation amounts in different evaporation periods, wherein the preparation of the substrate with different compensation amounts is based on the obtaining of the different compensation amounts in the obtaining module 302.
It will be understood by those of ordinary skill in the art that the foregoing embodiments are specific examples of implementing the present application and that various changes in form and details may be made therein without departing from the spirit and scope of the present application. Various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the invention, and the scope of the invention shall be defined by the appended claims.
Claims (9)
1. A vapor deposition method, comprising:
testing and obtaining the total deviation of the pixel positions of the mask plate and the substrate in one evaporation period; the substrate is provided with a pixel definition layer and a pixel opening positioned in the pixel definition layer;
the evaporation period comprises at least two continuous evaporation periods, and sub-deviation values of pixel positions of the mask plate and the substrate in each evaporation period are obtained through testing;
acquiring a compensation amount of the positions of the pixel openings of the substrate corresponding to each vapor deposition period based on the sub-deviation amount and the total deviation amount;
performing actual evaporation by adopting the same mask plate, and respectively evaporating pixels in the pixel openings of the substrate with the compensation amount corresponding to the evaporation time in different evaporation time periods of the mask plate;
a method of obtaining the compensation amount, comprising:
obtaining compensation coefficient of current evaporation period, X= (A) m +A m-1 ) Wherein X is a compensation coefficient of the current evaporation period, A m A is the relative deviation of the current evaporation period m-1 The relative deviation of the previous vapor deposition period is the ratio of the sub-deviation of any vapor deposition period to the total deviation of the vapor deposition period, v is 1.8-2.2, and A is the last vapor deposition period in the vapor deposition period m 100%, if the current vapor deposition period is the first vapor deposition period in the vapor deposition period, A m-1 Is 0; acquiring a total compensation amount corresponding to the total deviation amount based on the total deviation amount; and acquiring the compensation amount of each evaporation period based on the total compensation amount and the compensation coefficient of each evaporation period.
2. The vapor deposition method according to claim 1, wherein the method of obtaining the total deviation amount of the pixel positions includes: acquiring the position of a pixel formed by evaporating a first substrate in the evaporation period in the pixel opening as an initial position;
acquiring the position of a pixel formed by evaporating the last substrate in the evaporation period in the pixel opening as a final position;
the total deviation amount is acquired based on the initial position and the final position.
3. The vapor deposition method according to claim 1, wherein the method of obtaining the sub-deviation amount includes:
acquiring the position of a pixel formed by evaporating a first substrate in the evaporation period in the pixel opening as an initial position;
in one of the evaporation periods, acquiring the position of a pixel formed by evaporating the last substrate in the pixel opening as a final position;
the sub-deviation amount is acquired based on the initial position and the final position.
4. The vapor deposition method according to claim 1, further comprising, before the sub-deviation amount is obtained by the test:
acquiring a time dividing line adjacent to the evaporation time, wherein the time dividing line is used as a reference for dividing different evaporation time during the actual evaporation period; the method for acquiring the time dividing line comprises the following steps: and acquiring the relative deviation amount of the vapor deposition period based on the ratio of the sub-deviation amount of any vapor deposition period to the total deviation amount, and recording the duration of the previous vapor deposition period as the time dividing line for defining the previous vapor deposition period and the next vapor deposition period if the relative deviation amount reaches a preset threshold.
5. The vapor deposition method according to claim 4, wherein the vapor deposition cycle includes at least three consecutive vapor deposition periods, each of the vapor deposition periods except for the last vapor deposition period corresponds to one of the preset thresholds, and the preset threshold corresponding to the nth vapor deposition period satisfies the following relationship: phi= (1/N) x n+a, wherein phi is a preset threshold value, N is the total number of evaporation periods, -5% or more and-5% or less.
6. The vapor deposition method according to claim 4, wherein the vapor deposition cycle includes two consecutive vapor deposition periods, and the preset threshold is 48% to 52%.
7. The vapor deposition method according to claim 6, wherein the preset threshold value is 50%.
8. The vapor deposition method according to claim 1, wherein the vapor deposition cycle includes two consecutive vapor deposition periods, and v is 2, the compensation amount corresponding to the first vapor deposition period is 25% of the total compensation amount corresponding to the total deviation amount, and the compensation amount corresponding to the second vapor deposition period is 75% of the total compensation amount corresponding to the total deviation amount.
9. A vapor deposition system applied to the vapor deposition method according to any one of claims 1 to 8, comprising:
the test module is used for testing and obtaining the total deviation of the pixel positions of the mask plate and the substrate in one evaporation period, wherein the evaporation period comprises at least two continuous evaporation periods, and the test module is also used for testing and obtaining the sub-deviation of the pixel positions of the mask plate and the substrate in each evaporation period;
an acquisition module configured to acquire a compensation amount of a position of a pixel opening of the substrate corresponding to each of the vapor deposition periods based on the sub-deviation amount and the total deviation amount;
and the calling module is used for calling the unused substrate to carry out actual evaporation in different evaporation periods of the same mask plate so as to respectively evaporate pixels in the pixel openings of the substrate with the compensation quantity corresponding to the evaporation period.
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