CN114316340B - Semi-hard epoxy resin foam material and preparation method and application thereof - Google Patents
Semi-hard epoxy resin foam material and preparation method and application thereof Download PDFInfo
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- CN114316340B CN114316340B CN202111646394.4A CN202111646394A CN114316340B CN 114316340 B CN114316340 B CN 114316340B CN 202111646394 A CN202111646394 A CN 202111646394A CN 114316340 B CN114316340 B CN 114316340B
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Abstract
The invention relates to the technical field of high polymer materials, in particular to a semi-rigid epoxy resin foam material, and a preparation method and application thereof. Preheating epoxy resin, adding a mixed curing agent, a foaming agent and fillers with different forms, and uniformly stirring to obtain a premix; continuing to heat the obtained premix under stirring; when the premix has evidence of foaming, the premix is rapidly poured into a preheated mold and foamed to form a semi-rigid epoxy foam. The epoxy resin matrix obtained by the invention is composed of linear epoxy resin containing a large number of long-chain flexible chain segments, so that the epoxy resin matrix has higher flexibility and damping performance, and secondly, fillers with different forms are added, thereby further improving the strength and damping performance of the material. Therefore, on the basis of improving the damping performance of the epoxy resin foam material, the application range of the epoxy resin foam material is widened.
Description
Technical Field
The invention belongs to the technical field of high polymer materials, and particularly relates to a semi-rigid epoxy resin foam material, and a preparation method and application thereof.
Background
The polymer foam material is a foam material taking general plastic as matrix resin, and mainly comprises polystyrene foam, polyurethane foam, polypropylene foam, polyethylene foam, polyvinyl chloride foam and the like. Polymer foams have been widely used since the advent of excellent properties, light weight, high specific strength, etc., and have now covered many areas of social production and life. With the development of technology, the requirements of fields such as national defense, military industry, aerospace and the like on the performance of polymer foam materials are higher and higher, such as high temperature resistance, irradiation resistance, corrosion resistance, high mechanical strength and the like, but the traditional polymer foam materials cannot meet the requirements.
The epoxy resin foam material is a polymer foam material which takes epoxy resin and a curing agent as main bodies and is formed by foaming, has the advantages of excellent mechanical property, excellent water resistance, excellent chemical corrosion resistance, excellent heat resistance (the long-term use temperature can reach 200 ℃), excellent dimensional stability, excellent electrical performance and the like, and is a polymer foam material with high performance, and meanwhile, the epoxy resin foam material also has the characteristic of no toxicity because isocyanate monomers are not used in the production process, so the epoxy resin foam material is widely applied to the fields of aerospace, military national defense, automobile industry, biology, electronics, medicine and the like. At present, the epoxy resin foam materials are all hard foam materials, and have good mechanical properties and high hardness. For example, chinese patent No. CN101302304 discloses a method for preparing an epoxy resin based foaming material, which uses bisphenol a type epoxy resin, amine curing agent solidified at normal temperature, foaming agent, foam stabilizer and auxiliary agent as raw materials, and after stirring and stirring uniformly at high speed, heating at 40-80 ℃ for 0.5-2 hours in a stainless steel mold, and cooling to room temperature to obtain the epoxy resin based foaming material, wherein the foaming ratio can reach 2.7 at maximum, and the epoxy resin based foaming material has good water resistance, chemical corrosion resistance, bending strength and compression strength. Chinese patent CN101319085 discloses a light high-strength epoxy foaming material and a preparation method thereof, wherein the preparation process of the pre-reaction is carried out by mixing 50-90% of epoxy resin, 5-40% of amine curing agent, 0.1-15% of azo compound and hydrazine foaming agent, 2-20% of toughening agent, 0.1-5% of surfactant and 0-30% of filler, preparing the epoxy resin foam, coordinating the foaming speed and the curing speed of an epoxy foaming curing system, and then further carrying out post-curing and shaping. The obtained epoxy resin foam has smooth surface and compact and uniform internal cell structure, and has been applied to various fragile end cover products of missile launcher.
The epoxy resin foam material has excellent mechanical strength, excellent water resistance, excellent chemical corrosion resistance, excellent heat resistance, excellent dimensional stability and the like, and is mainly determined by the existing raw materials, formula process and highly crosslinked molecular structure of the epoxy resin. The existing epoxy resin has few or no flexible chain segments in the molecular structure and overlarge crosslinking degree, so that the epoxy resin has high brittleness and poor flexibility. For example, in the formulation system formed by bisphenol a type epoxy resins and amine type epoxy resin curing agents which are widely used at present, each epoxy resin molecule has 2 terminal epoxy groups (epoxy resin has 2 functionalities), each amine type curing agent also has at least 2 primary amino groups, which are equivalent to at least more than 4 active H atoms (curing agent molecules have 4 functionalities), and each epoxy group reacts with one H atom to connect the epoxy resin molecule and the curing agent molecule. Under the conditions of the prior art, in general, when a person skilled in the art designs the formulation of an epoxy resin, the stoichiometric ratio of epoxy resin to curing agent is calculated according to one epoxy group corresponding to one active hydrogen atom to design the formulation of the epoxy resin system. After the epoxy resin foam material is solidified according to the metering ratio, a highly cross-linked three-dimensional network structure is formed, as shown in a formula (I), so that the material has high hardness, high strength, high brittleness and insufficient damping performance, and the application range of the epoxy resin foam material is limited.
With the rapid development of science and technology, rocket, missile, artificial satellite, naval vessel, mechanical, electronic and electrical equipment are developed towards high speed, precision, integration, multifunction and high power, and vibration and noise have become key problems affecting product reliability, service life and environmental pollution. From failure analysis statistics, about 2/3 of the faults of the artificial satellite are related to vibration; the guided precision of the target can be affected by the vibration of the missile or the control failure of an explosion system can be affected; parts such as blades and the like are subjected to fatigue fracture due to vibration of an airplane or a gas turbine; the submarines are tracked or hit by enemy due to vibration and noise; about eight failure of an electronic device is failure due to multi-formant response of the structure caused by broadband random excitation; the main shaft of the power station generator is broken due to vibration; cases such as derailment and subversion caused by vibration of trains running at high speed are not enumerated. Epoxy resin foam plastic has wide application in the above fields as a high-strength structural foam, but the general epoxy resin foam material has strong chemical structural rigidity, so that the epoxy resin foam has high brittleness, low impact strength and poor damping performance. These disadvantages limit the range of applications for epoxy foam materials. At present, no research report on improving the damping performance of the epoxy resin foam material exists.
On the other hand, foams can be classified into flexible foams, semi-rigid foams and rigid foams in terms of properties. At present, all epoxy resin foam materials are rigid foam materials, and no semi-rigid epoxy resin foam materials are reported.
Disclosure of Invention
Aiming at the problems of the epoxy resin foam material, the invention aims to provide a semi-rigid epoxy resin foam material, a preparation method and application thereof, solves the problem of poor damping performance of the epoxy resin foam material, and has the advantages of convenient manufacture, short period, moderate density, good performance and uniform cells of the obtained semi-rigid epoxy resin foam material.
The invention provides a method for manufacturing a semi-rigid epoxy resin foam material from the standpoint of macromolecular design of the epoxy resin foam material. The invention adopts the control of the mole ratio between the epoxy group in the epoxy resin and the active hydrogen atom in the curing agent, so that the epoxy group only reacts with the first hydrogen atom in the primary amino group, thereby enabling the epoxy resin molecule and the curing agent molecule to form a linear or lightly crosslinked macromolecular structure; the amino-terminated polyether with the molecular weight more than or equal to 1000 and the amino-terminated liquid butyronitrile curing agent are used for introducing flexible components or chain segments into the macromolecular structure of the epoxy resin, so that the rigidity of the epoxy resin is further reduced, and the proper flexible semi-rigid epoxy resin foam material is obtained.
The aim of the invention can be achieved by the following technical scheme:
a first object of the present invention is to provide a semi-rigid epoxy resin foam composed of a flexible segment-containing linear epoxy resin having a molecular structure represented by formula (II):
in the middle ofRepresenting a rigid segment->The soft segment is a segment containing a benzene ring structure in the epoxy resin, and the soft segment is a segment containing an aliphatic structure in the epoxy resin.
The second object of the present invention is to provide a method for preparing a semi-rigid epoxy resin foam material, comprising the steps of:
(1) Preheating epoxy resin;
(2) Adding a mixed curing agent and a foaming agent into the preheated epoxy resin, and uniformly stirring to obtain a premix;
(3) Continuing to heat the obtained premix under stirring;
(4) When the premix has evidence of foaming, the premix is poured into a preheated mold and foamed to form a semi-rigid epoxy foam.
In one embodiment of the present invention, in the step (1), the epoxy resin is preferably bisphenol a type epoxy resin having an epoxy value of 0.40 to 0.60eq/100g, and is selected from a mixture of two or more epoxy resins having different epoxy values.
In one embodiment of the present invention, in step (1), the preheating is at a temperature of 40 to 60 ℃.
In one embodiment of the present invention, in the step (2), the curing agent is a compound amine curing agent, and is formed by directly mixing a curing agent with a short molecular chain and a curing agent with a long molecular chain, wherein the curing agent with a short molecular chain is one or more selected from aromatic amine, modified aromatic amine, aliphatic polyamine or amine-terminated polyether with a short molecular chain, and the active hydrogen equivalent of the curing agent is 50-100; the curing agent with long molecular chain is selected from one or a mixture of more than or equal to 1000 of amino-terminated polyether and amino-terminated liquid butyronitrile; wherein the mole ratio of the short molecular chain curing agent to the long molecular chain curing agent is 3: 7-7: 3.
in one embodiment of the present invention, in step (2), the mass ratio of epoxy resin to curing agent is 100: 150-100: 260.
in one embodiment of the present invention, in the step (2), the foaming agent is a chemical foaming agent or a physical foaming agent, preferably one or a mixture of several of azodicarbonamide (ADCA or AC), 2' -Azobisisobutyronitrile (AIBN), diisopropyl azodicarbonate, diethyl azodicarbonate, N ' -dimethyl-N, N ' -dinitroso terephthalamide, diazoaminobenzene (DAB) and toluene.
In one embodiment of the present invention, in step (2), the mass ratio of the epoxy resin to the foaming agent is 100:0.2 to 100:5.0.
in one embodiment of the present invention, in step (2), a filler may also be added to the preheated epoxy resin.
In one embodiment of the invention, the filler is selected from one or more of glass fibers, hollow glass beads, carbon nanotubes and graphene oxide; in one embodiment of the invention, in step (2), the filler is added in an amount of 0.1 to 10% by mass of the premix.
In one embodiment of the present invention, in step (3), the continuous heating temperature is 100 to 120 ℃.
In one embodiment of the invention, in step (4), the mold is preheated to 90-140 ℃, and when the heated premix has evidence of initiation, it is rapidly poured into the mold and foamed to form a semi-rigid epoxy foam.
The third object of the invention is to provide the application of the semi-rigid epoxy resin foam material in the fields of aerospace, military industry and national defense, automobile industry, biology, electronics, medicine and the like.
Compared with the prior art, the invention has the following beneficial effects:
(1) The invention adopts the control of the mole ratio between the epoxy group in the epoxy resin and the active hydrogen atom in the curing agent, so that the epoxy group only reacts with the first hydrogen atom in the primary amino group (shown in formula III), thereby leading the epoxy resin molecule and the curing agent molecule to form a linear or lightly crosslinked macromolecular structure; the components or the flexible chain segments are introduced into the macromolecular structure of the epoxy resin so as to further reduce the rigidity of the epoxy resin, and the semi-rigid epoxy resin foam material with proper flexibility is obtained.
(2) The semi-rigid epoxy resin foam material obtained by the invention has moderate hardness, excellent damping performance and good comprehensive performance, fills a blank of the semi-rigid epoxy resin foam material, and widens the application range for the epoxy resin foam.
(3) Compared with the existing epoxy resin foam materials in the market, the invention adjusts the curing speed of the epoxy resin through the research and test of the curing process and the foaming process and the amino-terminated curing agent with long molecular chains, so that the problem of the matching of the curing speed of the epoxy resin and the forming speed of the foam holes is well solved, and the foam holes of the whole semi-rigid epoxy resin foam material are uniform and the process is stable; and it is convenient to manufacture and has short period.
(4) Compared with the existing semi-rigid polyurethane foam material, the invention does not use isocyanate monomer in the preparation process, so the prepared semi-rigid epoxy resin foam material has the characteristic of no toxicity to human body.
Detailed Description
The invention provides a semi-hard epoxy resin foam material, which is composed of a linear epoxy resin containing a flexible long chain segment, wherein the molecular structure of the linear epoxy resin containing the flexible long chain segment is shown as a formula (II):
in the middle ofRepresenting a rigid segment->The soft segment is a segment containing a benzene ring structure in the epoxy resin, and the soft segment is a segment containing an aliphatic structure in the epoxy resin.
The invention also provides a preparation method of the semi-hard epoxy resin foam material, which comprises the following steps:
(1) Preheating epoxy resin;
(2) Adding a mixed curing agent and a foaming agent into the preheated epoxy resin, and uniformly stirring to obtain a premix;
(3) Continuing to heat the obtained premix under stirring;
(4) When the premix has evidence of foaming, the premix is poured into a preheated mold and foamed to form a semi-rigid epoxy foam.
In one embodiment of the present invention, in the step (1), the epoxy resin is preferably bisphenol a type epoxy resin having an epoxy value of 0.40 to 0.60eq/100g, and is selected from a mixture of two or more epoxy resins having different epoxy values.
In one embodiment of the present invention, in step (1), the preheating is at a temperature of 40 to 60 ℃.
In one embodiment of the present invention, in the step (2), the curing agent is a compound amine curing agent, and is formed by directly mixing a curing agent with a short molecular chain and a curing agent with a long molecular chain, wherein the curing agent with a short molecular chain is one or more selected from aromatic amine, modified aromatic amine, aliphatic polyamine or amine-terminated polyether with a short molecular chain, and the active hydrogen equivalent of the curing agent is 50-100; the curing agent with long molecular chain is selected from one or a mixture of more than or equal to 1000 of amino-terminated polyether and amino-terminated liquid butyronitrile; wherein the mole ratio of the short molecular chain curing agent to the long molecular chain curing agent is 3: 7-7: 3.
in one embodiment of the present invention, in step (2), the mass ratio of epoxy resin to curing agent is 100: 150-100: 260.
in one embodiment of the present invention, in the step (2), the foaming agent is a chemical foaming agent or a physical foaming agent, preferably one or a mixture of several of azodicarbonamide (ADCA or AC), 2' -Azobisisobutyronitrile (AIBN), diisopropyl azodicarbonate, diethyl azodicarbonate, N ' -dimethyl-N, N ' -dinitroso terephthalamide, diazoaminobenzene (DAB) and toluene.
In one embodiment of the present invention, in step (2), the mass ratio of the epoxy resin to the foaming agent is 100:0.2 to 100:5.0.
in one embodiment of the present invention, in step (2), a filler may also be added to the preheated epoxy resin.
In one embodiment of the invention, the filler is selected from one or more of glass fibers, hollow glass beads, carbon nanotubes and graphene oxide; in one embodiment of the invention, in step (2), the filler is added in an amount of 0.1 to 10% by mass of the premix.
In one embodiment of the present invention, in step (3), the continuous heating temperature is 100 to 120 ℃.
In one embodiment of the invention, in step (4), the mold is preheated to 90-140 ℃, and when the heated premix has evidence of initiation, it is rapidly poured into the mold and foamed to form a semi-rigid epoxy foam.
The invention also provides application of the semi-rigid epoxy resin foam material in the fields of aerospace, military national defense, automobile industry, biology, electronics, medicine and the like.
The present invention will be described in detail with reference to specific examples.
Example 1
The embodiment provides a preparation method of a semi-hard epoxy resin foam material, which comprises the following steps:
(1) Bisphenol A type epoxy resin having an epoxy value of 0.51eq/100g was weighed and then preheated to 50 ℃.
(2) After the epoxy resin is preheated, 2.0 parts of azodicarbonamide is added and stirred uniformly based on the mass of the epoxy resin (100 parts), 230 parts of 3,3 '-diethyl-4, 4' -diaminodiphenyl methane and amine-terminated polyether with the molecular weight of 2000 (wherein the molar ratio of the 3,3 '-diethyl-4, 4' -diaminodiphenyl methane to the amine-terminated polyether with the molecular weight of 2000 is 6:4) are added, 10 parts of chopped glass fibers are added and stirred uniformly, and a mixture is obtained.
(3) Heating the mixture to 110 ℃ with stirring;
(4) The mold was preheated to 120 ℃ in an oven in advance, and after the above epoxy resin premix was heated to 110 ℃, it was rapidly poured into the mold and clamped. Foaming and curing to form the semi-rigid epoxy resin foam material with uniform cells. The density of the semi-rigid epoxy resin foam was 0.49g/cm 3 The hardness was 90Shore A. The damping factor obtained by DMA test was 1.45, and tan delta>The temperature range of 0.3 was 35 ℃.
Example 2
The embodiment provides a preparation method of a semi-hard epoxy resin foam material, which comprises the following steps:
(1) Bisphenol A type epoxy resin having an epoxy value of 0.44eq/100g was weighed and then preheated to 50 ℃.
(2) 2.0 parts of Diazoaminobenzene (DAB) is added and stirred uniformly based on the mass of the epoxy resin (100 parts), 240 parts of aliphatic amine curing agent 5768 and amine-terminated liquid butyronitrile with the molecular weight of 1300 (the molar ratio of 5768 to amine-terminated liquid butyronitrile with the molecular weight of 1300 is 4:6), 20 parts of hollow glass microsphere and 0.3 part of carbon nanotube are added and stirred uniformly, so that a mixture is obtained.
(3) Heating the mixture to 110 ℃ with stirring;
(4) The mold was preheated to 120 ℃ in an oven in advance, and after the above epoxy resin premix was heated to 110 ℃, it was rapidly poured into the mold and clamped. Foaming and curing to form the semi-rigid epoxy resin foam material with uniform cells. The density of the semi-rigid epoxy resin foam was 0.43g/cm 3 The hardness was 90Shore A. The damping factor obtained by DMA test was 1.37, and tan delta>A temperature of 0.3The range was 32 ℃.
Example 3
The embodiment provides a preparation method of a semi-hard epoxy resin foam material, which comprises the following steps:
(1) Bisphenol A type epoxy resin having an epoxy value of 0.40eq/100g was weighed and then preheated to 40 ℃.
(2) After the epoxy resin is preheated, 2.0 parts of azodicarbonamide is added and stirred uniformly based on the mass of the epoxy resin (100 parts), 150 parts of 3,3 '-diethyl-4, 4' -diaminodiphenyl methane and amino-terminated polyether with the molecular weight of 2000 (wherein the molar ratio of the 3,3 '-diethyl-4, 4' -diaminodiphenyl methane to the amino-terminated polyether with the molecular weight of 2000 is 7:3) are added, 10 parts of chopped glass fibers are added and stirred uniformly, and a mixture is obtained.
(3) Heating the mixture to 100 ℃ under stirring;
(4) The mold was preheated to 90 ℃ in an oven in advance, and after the above epoxy resin premix was heated to 100 ℃, it was rapidly poured into the mold and clamped. Foaming and curing to form the semi-rigid epoxy resin foam material with uniform cells. The density of the semi-rigid epoxy resin foam was 0.43g/cm 3 The hardness was 95Shore A. The damping factor obtained by DMA test was 1.07, and tan delta>The temperature range of 0.3 is 30 ℃.
Example 4
The embodiment provides a preparation method of a semi-hard epoxy resin foam material, which comprises the following steps:
(1) Bisphenol A type epoxy resin having an epoxy value of 0.60eq/100g was weighed and then preheated to 60 ℃.
(2) After the epoxy resin is preheated, 2.0 parts of azodicarbonamide is added based on the mass of the epoxy resin (100 parts), and uniformly stirred, 400 parts of 3,3 '-diethyl-4, 4' -diaminodiphenyl methane and amino-terminated polyether with the molecular weight of 2000 (wherein the molar ratio of the 3,3 '-diethyl-4, 4' -diaminodiphenyl methane to the amino-terminated polyether with the molecular weight of 2000 is 3:7) are added, 10 parts of chopped glass fibers are added, and uniformly stirred, so that a mixture is obtained.
(3) Heating the mixture to 120 ℃ with stirring;
(4) The mold was preheated to 140 ℃ in an oven in advance, and after the above epoxy resin premix was heated to 120 ℃, it was rapidly poured into the mold and clamped. Foaming and curing to form the semi-rigid epoxy resin foam material with uniform cells. The density of the semi-rigid epoxy resin foam was 0.55g/cm 3 The hardness was 85Shore A. The damping factor obtained from the DMA test was 1.25, and tan delta>The temperature range of 0.3 was 33 ℃.
Comparative example
The comparative example comprises the following steps:
(1) Bisphenol A type epoxy resin having an epoxy value of 0.51eq/100g was weighed and then preheated to 50 ℃.
(2) After the epoxy resin is preheated, 2.0 parts of azodicarbonamide is added and stirred uniformly based on the mass of the epoxy resin (100 parts), 43 parts of 3,3 '-diethyl-4, 4' -diaminodiphenyl methane and amine-terminated polyether with the molecular weight of 400 (wherein the molar ratio of the 3,3 '-diethyl-4, 4' -diaminodiphenyl methane to the amine-terminated polyether with the molecular weight of 400 is 6:4) are added and stirred uniformly to obtain a mixture.
(3) Heating the mixture to 110 ℃ with stirring;
(4) The mold was preheated to 120 ℃ in an oven in advance, and after the above epoxy resin premix was heated to 110 ℃, it was rapidly poured into the mold and clamped. Foaming and curing to form the epoxy resin foam material with uniform cells. The density of the epoxy resin foam was 0.49g/cm 3 The hardness is 70Shore D, and the damping performance is poor because the foam material is a hard epoxy resin foam material.
The previous description of the embodiments is provided to facilitate a person of ordinary skill in the art in order to make and use the present invention. It will be apparent to those skilled in the art that various modifications can be readily made to these embodiments and the generic principles described herein may be applied to other embodiments without the use of the inventive faculty. Therefore, the present invention is not limited to the above-described embodiments, and those skilled in the art, based on the present disclosure, should make improvements and modifications without departing from the scope of the present invention.
Claims (6)
1. The preparation method of the semi-hard epoxy resin foam material is characterized by comprising the following steps of:
(1) Preheating epoxy resin;
(2) Adding a mixed curing agent and a foaming agent into the preheated epoxy resin, and uniformly stirring to obtain a premix;
(3) Continuing to heat the obtained premix under stirring;
(4) When the premix has evidence of foaming, pouring the premix into a preheated mold, and foaming to form a semi-rigid epoxy resin foam material;
in the step (1), the epoxy resin is selected from one bisphenol A type epoxy resin or a mixture of more than two bisphenol A type epoxy resins, and the epoxy value of the bisphenol A type epoxy resin is between 0.40 and 0.60eq/100 g;
in the step (2), the curing agent is a compound amine curing agent and is formed by directly mixing a curing agent with a short molecular chain and a curing agent with a long molecular chain, wherein the curing agent with the short molecular chain is one or more of aromatic amine, modified aromatic amine, aliphatic polyamine or amine-terminated polyether with the short molecular chain, and the active hydrogen equivalent of the curing agent is 50-100; the curing agent with long molecular chain is selected from one or a mixture of more than or equal to 1000 of amino-terminated polyether and amino-terminated liquid butyronitrile; wherein the mole ratio of the short molecular chain curing agent to the long molecular chain curing agent is 3:7~7:3, a step of;
in the step (2), the mass ratio of the epoxy resin to the foaming agent is 100: 0.2-100: 5.0; the mass ratio of the epoxy resin to the curing agent is 100: 150-100: 260.
2. the method for preparing a semi-rigid epoxy resin foam according to claim 1, wherein in the step (1), the preheating temperature is 40-60 ℃.
3. The method for preparing a semi-rigid epoxy resin foam according to claim 1, wherein the foaming agent is a chemical foaming agent or a physical foaming agent, and is selected from one or a mixture of more of azodicarbonamide, 2' -azobisisobutyronitrile, diisopropyl azodicarbonate, diethyl azodicarbonate, N ' -dimethyl-N, N ' -dinitroso terephthalamide, diazoaminobenzene and toluene.
4. The method for producing a semi-rigid epoxy resin foam according to claim 1, wherein in the step (2), a filler is further added to the preheated epoxy resin;
the filler is one or more selected from glass fiber, hollow glass beads, carbon nanotubes and graphene oxide; the filling amount of the filler is 0.1-10% of the mass of the premix.
5. The method for producing a semi-rigid epoxy resin foam according to claim 1, wherein in the step (3), the continuous heating temperature is 100 to 120 ℃.
6. The method for preparing a semi-rigid epoxy resin foam according to claim 1, wherein in the step (4), the mold is preheated to 90-140 ℃.
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000109590A (en) * | 1998-10-01 | 2000-04-18 | Asahi Fiber Glass Co Ltd | Production of epoxy resin foam |
| CN104530463A (en) * | 2014-12-26 | 2015-04-22 | 上海材料研究所 | Preparation method of epoxy resin foamed plastic |
| CN104693150A (en) * | 2015-02-17 | 2015-06-10 | 南通职业大学 | Flexible epoxy resin and preparation method thereof |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000109590A (en) * | 1998-10-01 | 2000-04-18 | Asahi Fiber Glass Co Ltd | Production of epoxy resin foam |
| CN104530463A (en) * | 2014-12-26 | 2015-04-22 | 上海材料研究所 | Preparation method of epoxy resin foamed plastic |
| CN104693150A (en) * | 2015-02-17 | 2015-06-10 | 南通职业大学 | Flexible epoxy resin and preparation method thereof |
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