CN114310657A - Grinding head for chemical mechanical grinding equipment - Google Patents
Grinding head for chemical mechanical grinding equipment Download PDFInfo
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- CN114310657A CN114310657A CN202111406652.1A CN202111406652A CN114310657A CN 114310657 A CN114310657 A CN 114310657A CN 202111406652 A CN202111406652 A CN 202111406652A CN 114310657 A CN114310657 A CN 114310657A
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- annular
- polishing head
- head body
- grinding
- ring
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- 239000000126 substance Substances 0.000 title claims abstract description 15
- 238000005498 polishing Methods 0.000 claims abstract description 52
- 238000004891 communication Methods 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 claims description 6
- 229910003460 diamond Inorganic materials 0.000 claims description 6
- 239000010432 diamond Substances 0.000 claims description 6
- 238000005192 partition Methods 0.000 claims description 5
- 239000012528 membrane Substances 0.000 claims description 3
- 230000003750 conditioning effect Effects 0.000 abstract description 12
- 238000013461 design Methods 0.000 abstract description 7
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000010415 tidying Methods 0.000 description 1
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- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention relates to a grinding head for chemical mechanical grinding equipment, which has the advantages that a finishing ring and an annular air bag positioned above the finishing ring are arranged on the periphery of a check ring, so that the grinding head has the grinding function and the finishing function, and the structural design is simplified. In addition, the invention integrates the finishing ring on the grinding head, so compared with the prior art, the invention solves the problem that the finisher and the grinding head are easy to collide with each other. In addition, the lower surface area of the conditioning ring of the present invention is greater than the lower surface area of prior conditioners, thus improving the conditioning efficiency of the polishing pad.
Description
Technical Field
The invention relates to the technical field of semiconductor integrated circuit manufacturing equipment, in particular to a grinding head for chemical mechanical grinding equipment.
Background
Chemical Mechanical Polishing (CMP) is a precision processing technique for planarizing the surface of a wafer. Polishing heads are widely used in chemical mechanical polishing apparatuses and are the most central components in chemical mechanical polishing. The grinding pad needs to be polished by the grinding fluid flow on the grinding pad and the diamond finishing disc to finish the grinding pad, so that the grinding pad is always in the best working state.
In existing grinding apparatus, the grinding head and the diamond conditioning disk are separate moving parts. The diamond sorting disc needs a separate mechanical arm to control the rotation, the swing and the pressurization of the diamond sorting disc, and the structural design is complex.
Accordingly, the present invention is particularly set forth.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a grinding head for a chemical mechanical grinding device, which has the advantages that a finishing ring and an annular air bag positioned above the finishing ring are arranged on the periphery of a retainer ring, so that the grinding head has the grinding function and the finishing function, and the structural design is simplified.
Another object of the present invention is to provide a chemical mechanical polishing apparatus including the above polishing head.
In order to achieve the above object, the present invention provides the following technical solutions.
A polishing head for a chemical mechanical polishing apparatus, comprising:
the grinding head comprises a grinding head body, wherein an annular cavity is arranged at the edge of the lower surface of the grinding head body, and the annular cavity extends upwards or downwards from the lower surface of the grinding head body; the grinding head body is provided with a through hole, the through hole is provided with an outlet end and an inlet end, and the inlet end face is positioned on the upper surface of the grinding head body;
the annular air bag is arranged in the annular cavity, the top of the annular air bag is connected with the annular cavity, and the annular air bag is provided with an annular opening which is communicated with the outlet end of the through hole;
a pressure control structure in direct or indirect communication with the through-hole for controlling pressure in the bladder;
a membrane disposed on a lower surface of the polishing head body;
the check ring is sleeved on the periphery of the diaphragm; and
the arrangement ring is sleeved on the periphery of the retainer ring, the top of the arrangement ring is connected with the bottom of the annular air bag, and an arrangement structure is embedded in the lower surface of the arrangement ring.
A chemical mechanical polishing device comprises the polishing head.
Compared with the prior art, the invention has the beneficial effects that:
1. the invention provides a grinding head for chemical mechanical grinding equipment, which has the advantages that a finishing ring and an annular air bag positioned above the finishing ring are arranged on the periphery of a check ring, so that the grinding head has the grinding function and the finishing function, and the structural design is simplified. In addition, the invention integrates the finishing ring on the grinding head, so compared with the prior art, the invention solves the problem that the finisher and the grinding head are easy to collide with each other.
2. The lower surface area of the conditioning ring of the present invention is greater than the lower surface area of prior conditioners, thus improving the conditioning efficiency of the polishing pad.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to refer to like parts throughout the drawings. In the drawings:
figure 1 is a schematic diagram of an exemplary polishing head of the present invention.
Fig. 2 is a schematic structural view of the annular bladder of the present invention.
Figure 3 is a schematic diagram of another exemplary polishing head of the present invention.
Description of the reference numerals
100 is a grinding head body, 101 is a through hole, 200 is an annular cavity, 201 is an annular fixture, 202 is a vent hole, 203 is an annular partition plate, 300 is an annular air bag, 400 is a diaphragm, 500 is a retainer ring, 600 is an arrangement ring, 601 is an arrangement structure, 700 is a transmission pipeline, 800 is a driving shaft, and 900 is a channel.
Detailed Description
Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. It should be understood that the description is illustrative only and is not intended to limit the scope of the present disclosure. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present disclosure.
Various structural schematics according to embodiments of the present disclosure are shown in the figures. The figures are not drawn to scale, wherein certain details are exaggerated and possibly omitted for clarity of presentation. The shapes of various regions, layers, and relative sizes and positional relationships therebetween shown in the drawings are merely exemplary, and deviations may occur in practice due to manufacturing tolerances or technical limitations, and a person skilled in the art may additionally design regions/layers having different shapes, sizes, relative positions, as actually required.
In the context of the present disclosure, when a layer/element is referred to as being "on" another layer/element, it can be directly on the other layer/element or intervening layers/elements may be present. In addition, if a layer/element is "on" another layer/element in one orientation, then that layer/element may be "under" the other layer/element when the orientation is reversed.
The polishing head of the present invention will be further described with reference to the accompanying drawings.
Figure 1 provides a schematic diagram of an exemplary polishing head of the present invention. Fig. 2 shows a schematic view of the structure of the annular balloon of the present invention. Specifically, as shown in fig. 1 and 2, the polishing head for a chemical mechanical polishing apparatus of the present invention includes: the polishing head comprises a polishing head body 100, wherein an annular cavity 200 is arranged at the edge of the lower surface of the polishing head body 100, and the annular cavity 200 extends upwards or downwards from the lower surface of the polishing head body 100; the grinding head body 100 is provided with a through hole 101, the through hole 101 is provided with an outlet end and an inlet end, and the inlet end surface is positioned on the upper surface of the grinding head body 100; the annular airbag 300 is arranged in the annular cavity 200, the top of the annular airbag 300 is connected with the annular cavity 200, the annular airbag 300 is provided with an annular opening 301, and the annular opening 301 is communicated with the outlet end of the through hole 101; a membrane 400 disposed on the lower surface of the polishing head body 100; a retainer ring 500 fitted around the periphery of the diaphragm 400; and the arrangement ring 600 is sleeved on the periphery of the retainer ring 500, the top of the arrangement ring 600 is connected with the bottom of the annular air bag 300, and the arrangement structure 601 is embedded in the lower surface of the arrangement ring 600.
In the present invention, the cross-section of the annular cavity 200 is preferably rectangular or square. The side wall of the annular chamber 200 serves to define the shape of the annular bladder when the annular bladder 300 is inflated, thereby regularly inflating the annular bladder.
Preferably, the top of the annular cavity 200 is provided with an annular clamp 201, the annular clamp 201 is provided with a vent 202, and the vent 202 is communicated with the through hole 101 and the annular air bag 300; the cross section of the annular fixture 201 is in an inverted T shape, the top of the annular fixture is connected with the grinding head body 100, the bottom of the annular fixture is arranged below the annular opening 203, and the width of the bottom is larger than that of the annular opening 203; the annular bladder 300 is cuff-mounted to the annular clamp 201 through the annular opening 301 such that the top of the annular bladder 300 is connected to the annular cavity 200. The top of the annular bladder 300 is fixedly connected to the annular chamber 200 to ensure that the annular bladder 300 does not fall off the polishing head. The ring clamp 201 not only serves for the connection but also for sealing the annular opening 203.
Preferably, the ring clamp 201 is integrally formed with the polishing head body 100.
Preferably, the grinding bit body 100 is provided with 1 through hole 101 and the ring fixture 201 is provided with 1 vent 201. The design can reduce the structural complexity of the grinding head, and is favorable for integration.
Depending on the relative positions of the annular cavity 200 and the abrading head body 100, the present invention may include a first preferred embodiment and a second preferred embodiment as described below. Two preferred embodiments will be described in detail below with reference to the accompanying drawings.
In the first preferred embodiment, the annular chamber 200 is located below the grinding head body 100, as shown in fig. 3, the annular chamber 200 extends downward from the lower surface of the grinding head body 100, two annular partitions 203 are provided on two side walls of the annular chamber 200, and both annular partitions 203 are connected to the lower surface of the grinding head body 100. Preferably, the two annular baffles 203 are integrally formed with the grinding bit body 100.
In the second preferred embodiment, the annular cavity 200 is located within the grinding bit body 100, as shown in fig. 2, the annular cavity 200 extends upward from the lower surface of the grinding bit body 100, and the annular cavity 200 is an annular groove opened at the edge of the lower surface of the grinding bit body 100. The annular recess is preferably integrally formed with the grinding bit body 100. The present invention preferably places the annular cavity 200 within the polishing head body 100 to save material and avoid deformation of the sidewalls of the annular cavity 200 due to inflation and pressurization.
Preferably, the abrading head of the present invention further comprises: a pressure control structure in direct or indirect communication with the through hole 101 for controlling the pressure in the annular bladder 300. The pressure control structure may be a control valve. During the grinding process, the annular air bag can be inflated or exhausted by adjusting the control valve according to the surface condition of the grinding pad, so that the finishing ring is pressurized and decompressed or lifted to be completely separated from the surface of the grinding pad.
Preferably, the material of the annular bladder 300 may be an elastic material, such as rubber. The bottom of the annular airbag 300 is provided with at least one connecting hole, the upper surface of the tidying ring 600 is provided with at least one threaded hole, and each threaded hole corresponds to each connecting hole one to one. The grinding bit of the present invention also includes fasteners for connecting the annular balloon and the conditioning ring. The fastener may be a bolt. The bottom of the annular airbag and the trim ring can be connected by means of said bolts.
Preferably, the width of collation ring 600 is smaller than the width of annular balloon 300. During dressing of the polishing pad, the dressing ring 600 slightly pushes up the lower surface of the annular bladder 300 due to pressure, forming a convex structure. In addition, according to the surface condition of the polishing pad, a specific pressure can be selectively applied to the conditioning ring 600 by evacuating or inflating the annular bladder 300, so as to achieve the purpose of conditioning the polishing pad effectively. When the conditioning of the polishing pad is not required, the conditioning ring 600 can be lifted off the lower surface of the polishing pad by exhausting the gas in the annular bladder 300.
Preferably, the abrading head of the present invention further comprises: a transmission pipe 700, the transmission pipe 700 having an input end and an output end, the output end communicating with the through hole 101, and the transmission pipe 700 extending upward from the output end via the through hole 101. Where the polishing head of the present invention further comprises a transfer tubing 700, the pressure control structure is preferably in communication with the transfer tubing 700.
Preferably, the abrading head of the present invention further comprises: a drive shaft 800, the drive shaft 800 being provided with a channel 900, the channel 900 having an inflow end located at an upper surface of the drive shaft 800 and an outflow end communicating with an input end of the transmission duct 700. Where the abrading head of the present invention further comprises a drive shaft 800, the pressure control structure is preferably in communication with the channel 900.
Preferably, the organizing structure 601 is a diamond.
According to the grinding head disclosed by the invention, the arrangement ring 600 and the annular air bag 300 positioned above the arrangement ring 600 are arranged on the periphery of the retainer ring, so that the grinding head has a grinding function and an arrangement function, and the structural design is simplified. In addition, the invention integrates the finishing ring on the grinding head, so compared with the prior art, the invention solves the problem that the finisher and the grinding head are easy to collide with each other.
The lower surface area of the conditioning ring of the present invention is greater than the lower surface area of prior conditioners, thus improving the conditioning efficiency of the polishing pad.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (10)
1. A polishing head for a chemical mechanical polishing apparatus, comprising:
the grinding head comprises a grinding head body, wherein an annular cavity is arranged at the edge of the lower surface of the grinding head body, and the annular cavity extends upwards or downwards from the lower surface of the grinding head body; the grinding head body is provided with a through hole, the through hole is provided with an outlet end and an inlet end, and the inlet end face is positioned on the upper surface of the grinding head body;
the annular air bag is arranged in the annular cavity, the top of the annular air bag is connected with the annular cavity, and the annular air bag is provided with an annular opening which is communicated with the outlet end of the through hole;
a membrane disposed on a lower surface of the polishing head body;
the check ring is sleeved on the periphery of the diaphragm; and
the arrangement ring is sleeved on the periphery of the retainer ring, the top of the arrangement ring is connected with the bottom of the annular air bag, and an arrangement structure is embedded in the lower surface of the arrangement ring.
2. The polishing head of claim 1, wherein the top of the annular cavity is provided with an annular fixture, the annular fixture being provided with a vent, the vent being in communication with the through-hole and the annular bladder; the cross section of the annular fixture is in an inverted T shape, the top of the annular fixture is connected with the grinding head body, the bottom of the annular fixture is arranged below the annular opening, and the width of the bottom of the annular fixture is larger than that of the annular opening;
the annular air bag is sleeved on the annular clamp through the annular opening, so that the top of the annular air bag is connected with the annular cavity.
3. The polishing head of claim 1 or 2, wherein the annular cavity extends upwardly from the lower surface of the polishing head body, the annular cavity being an annular groove opening at an edge of the lower surface of the polishing head body.
4. The polishing head of claim 1 or 2, wherein the annular cavity extends downwardly from the lower surface of the polishing head body, and wherein the two sidewalls of the annular cavity are two annular partitions, each of the two annular partitions being connected to the lower surface of the polishing head body.
5. The polishing head of claim 1 or 2, further comprising:
a pressure control structure in direct or indirect communication with the through-hole for controlling pressure in the annular bladder.
6. The polishing head of claim 1 or 2, wherein said polishing head body is provided with 1 said through hole and said ring fixture is provided with 1 vent.
7. The polishing head of claim 1 or 2, further comprising:
a transport duct having an input end and an output end, the output end being in communication with the through hole and the transport duct extending upwardly from the output end via the through hole.
8. The polishing head of claim 7, further comprising:
a drive shaft provided with a channel having an inflow end and an outflow end, the inflow end surface being located on an upper surface of the drive shaft, the outflow end being in communication with the input end of the transmission duct.
9. The polishing head of claim 1 or 2, wherein the finishing structure is a diamond.
10. A chemical mechanical polishing apparatus comprising the polishing head of any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111406652.1A CN114310657A (en) | 2021-11-24 | 2021-11-24 | Grinding head for chemical mechanical grinding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111406652.1A CN114310657A (en) | 2021-11-24 | 2021-11-24 | Grinding head for chemical mechanical grinding equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114310657A true CN114310657A (en) | 2022-04-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111406652.1A Pending CN114310657A (en) | 2021-11-24 | 2021-11-24 | Grinding head for chemical mechanical grinding equipment |
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| Country | Link |
|---|---|
| CN (1) | CN114310657A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10146750A (en) * | 1996-11-13 | 1998-06-02 | Hitachi Ltd | Semiconductor device manufacturing method and device |
| JP2005271101A (en) * | 2004-03-23 | 2005-10-06 | Tokyo Seimitsu Co Ltd | Dressing device of polishing pad and polishing apparatus having the dressing device of polishing pad |
| CN103522167A (en) * | 2012-07-02 | 2014-01-22 | 中芯国际集成电路制造(上海)有限公司 | Grinding head and grinding device |
| TW201509591A (en) * | 2013-07-03 | 2015-03-16 | 三島光產股份有限公司 | Precision polishing method |
| CN208663469U (en) * | 2018-07-20 | 2019-03-29 | 德淮半导体有限公司 | Grinding head and chemical mechanical polishing device |
-
2021
- 2021-11-24 CN CN202111406652.1A patent/CN114310657A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10146750A (en) * | 1996-11-13 | 1998-06-02 | Hitachi Ltd | Semiconductor device manufacturing method and device |
| JP2005271101A (en) * | 2004-03-23 | 2005-10-06 | Tokyo Seimitsu Co Ltd | Dressing device of polishing pad and polishing apparatus having the dressing device of polishing pad |
| CN103522167A (en) * | 2012-07-02 | 2014-01-22 | 中芯国际集成电路制造(上海)有限公司 | Grinding head and grinding device |
| TW201509591A (en) * | 2013-07-03 | 2015-03-16 | 三島光產股份有限公司 | Precision polishing method |
| CN208663469U (en) * | 2018-07-20 | 2019-03-29 | 德淮半导体有限公司 | Grinding head and chemical mechanical polishing device |
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| RJ01 | Rejection of invention patent application after publication | ||
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Application publication date: 20220412 |