CN114302595A

CN114302595A - Electronic equipment, shell and preparation method thereof

Info

Publication number: CN114302595A
Application number: CN202111638541.3A
Authority: CN
Inventors: 郑俊威; 杨自美; 敖玉银
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2021-12-29
Filing date: 2021-12-29
Publication date: 2022-04-08

Abstract

The application provides an electronic device, a shell and a preparation method thereof; the preparation method comprises the following steps: providing a substrate, wherein the substrate comprises a main body part of an integrated structure and a bending part arranged at the edge position of the main body part; a transparent flexible base material is attached to the surface of one side of the substrate, wherein at least part of the transparent flexible base material covers the bent part; and forming an appearance effect layer on the surface of one side of the transparent flexible base material, which is far away from the substrate. According to the preparation method of the electronic equipment shell, the transparent flexible base material is firstly attached to the substrate, and then the appearance effect layer is formed on the transparent flexible base material. Therefore, the problem that the appearance effect layer on the membrane is cracked when the membrane is attached to the substrate with the large-angle and deep bending shape is solved; in addition, due to the protection of the transparent flexible base material, a transition buffer layer does not need to be sprayed on the surface of the substrate when an appearance effect layer is manufactured subsequently, so that the process is simplified, and the cost is reduced.

Description

Electronic equipment, shell and preparation method thereof

Technical Field

The invention relates to the technical field of electronic equipment shell preparation processes, in particular to electronic equipment, a shell and a preparation method thereof.

Background

CMF (abbreviation of Color-Material-Finishing), i.e., summary of Color, Material, and surface treatment) schemes for casings of electronic devices such as mobile phones are mainly classified into two types: a membrane scheme and a spray scheme.

The diaphragm scheme is that a CMF effect is achieved on base materials such as a PET sheet, and then the diaphragm is pasted on a glass substrate of electronic equipment. The mobile phone battery cover is of a planar structure, and a certain texture hand feeling and color appearance effect are realized by a scheme of generally adopting film lamination. The spraying scheme is generally to directly form an optical coating on a glass substrate without attaching a film, so as to achieve the required appearance effect.

In the spraying scheme of the conventional technology, before an optical coating film is formed on the surface of a glass substrate, a transition buffer layer is sprayed, and the material components of the transition buffer layer are mainly siloxane generally, so that the coating has the advantages of good coating performance, strong adhesion on glass, high surface hardness and high transmittance. The enhancement principle is as follows: the micro-cracks on the surface of the glass are repaired through excellent coating performance and super-strong adhesive force; the film which becomes high-strength after being cured can relieve the deformation stress of the glass when being impacted.

In order to achieve the appearance of high brightness, metal texture and the like with richer color expressive force, a scheme of laminating the membranes is mainly adopted at present, and the laminated structure of the membranes has more flexibility and can be superposed with various abundant texture and color design effects. However, in the technical scheme of the film lamination, the following disadvantages exist in the 3D glass rear cover (the edge is of an arc-shaped bending structure) which is bent at a large angle: the optical coating layer is mostly a brittle material, the hardness is high, the brittleness is high, and when the optical coating film formed on the film is attached to a 3D glass model with a large angle and a large depth (such as an edge bending area and a volcanic opening area corresponding to a camera), the optical coating layer is cracked, and a good appearance effect cannot be obtained. Therefore, at present, the design of the appearance effect of the complex modeling glass substrate (the edge is provided with a 3D bending structure and the like) is mainly realized by adopting a spraying scheme, so that the richness of the CMF effect of the shell is greatly limited.

Due to the brittleness of the optical coating, the problem of film cracking with a certain probability still exists in the process of attaching the optical coating to common small-angle bent glass, so that the yield is reduced, and the cost is increased. The thickness of the film is limited, and generally, the thickness of the film coating film cannot exceed 600nm in the conventional film laminating scheme (if the thickness is too large, the film cannot be laminated in the bending region of the glass substrate). Generally, the larger the thickness of the optical film is, the better the appearance effect is, the more the design matched with other effect layers is, therefore, the limit of the thickness of the optical film coating layer also limits the CMF effect of the film to a certain extent. The spraying scheme is generally simpler in effect, mainly takes pure color and gradient color as main colors, and has single relative expressive force.

Disclosure of Invention

A first aspect of an embodiment of the present application provides a method for manufacturing an electronic device housing, where the method includes:

providing a substrate, wherein the substrate comprises a main body part of an integrated structure and a bending part arranged at the edge position of the main body part;

a transparent flexible base material is attached to the surface of one side of the substrate, wherein at least part of the transparent flexible base material covers the bent part;

and forming an appearance effect layer on the surface of one side of the transparent flexible base material, which is far away from the substrate.

In a second aspect, an embodiment of the present application provides a housing for an electronic device, where the housing includes a substrate, a transparent flexible base material, and an appearance effect layer, which are sequentially stacked; the shell is prepared by the preparation method in any one of the above embodiments.

In addition, this application embodiment provides an electronic equipment again, electronic equipment include display screen, control circuit board and above-mentioned embodiment the casing, the casing with the display screen cooperation is formed with accommodation space, control circuit board locates in the accommodation space, and with the display screen electricity is connected.

According to the preparation method of the electronic equipment shell, the transparent flexible base material is firstly attached to the substrate, and then the appearance effect layer is formed on the transparent flexible base material. Therefore, the problem that the appearance effect layer on the membrane is cracked when the membrane is attached to the substrate with the large-angle and deep bending shape is solved; in addition, due to the protection of the transparent flexible base material, a transition buffer layer does not need to be sprayed on the surface of the substrate when an appearance effect layer is manufactured subsequently, so that the process is simplified, and the cost is reduced.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIG. 1 is a schematic flow chart diagram illustrating an embodiment of a method for manufacturing an electronic device housing according to the present application;

FIG. 2 is a schematic structural diagram of a substrate in this embodiment;

FIG. 3 is a schematic view of a partial structure of a substrate with a transparent flexible substrate attached thereon;

FIG. 4 is a schematic view of a stacked configuration of an embodiment of the present application housing;

FIG. 5 is a schematic flow chart diagram illustrating a method for manufacturing an electronic device housing according to another embodiment of the present disclosure;

FIG. 6 is a schematic structural diagram of another embodiment after a transparent flexible substrate is attached to a substrate;

FIG. 7 is a schematic structural diagram of an embodiment of an electronic device of the present application;

FIG. 8 is a schematic cross-sectional view taken along line A-A in the embodiment of FIG. 7;

fig. 9 is a block diagram illustrating a structural composition of an embodiment of an electronic device according to the present application.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be noted that the following examples are only illustrative of the present invention, and do not limit the scope of the present invention. Likewise, the following examples are only some but not all examples of the present invention, and all other examples obtained by those skilled in the art without any inventive step are within the scope of the present invention.

The terms "first", "second" and "third" in the embodiments of the present application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of the feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the invention. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

As used herein, an "electronic device" (or simply "terminal") includes, but is not limited to, an apparatus that is configured to receive/transmit communication signals via a wireline connection, such as via a Public Switched Telephone Network (PSTN), a Digital Subscriber Line (DSL), a digital cable, a direct cable connection, and/or another data connection/network, and/or via a wireless interface (e.g., for a cellular network, a Wireless Local Area Network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and/or another communication terminal). A communication terminal arranged to communicate over a wireless interface may be referred to as a "wireless communication terminal", "wireless terminal" or "mobile terminal". Examples of mobile terminals include, but are not limited to, satellite or cellular telephones; a Personal Communications System (PCS) terminal that may combine a cellular radiotelephone with data processing, facsimile and data communications capabilities; PDAs that may include radiotelephones, pagers, internet/intranet access, Web browsers, notepads, calendars, and/or Global Positioning System (GPS) receivers; and conventional laptop and/or palmtop receivers or other electronic devices that include a radiotelephone transceiver. A cellular phone is an electronic device equipped with a cellular communication module.

Please refer to fig. 1 and fig. 1, which are schematic flow charts illustrating an embodiment of a method for manufacturing a housing of an electronic device according to the present application, where the electronic device in the present application may include a mobile phone, a tablet computer, a notebook computer, a wearable device, and the like. The method for manufacturing the electronic device shell comprises the following steps. It should be noted that the terms "comprises" and "comprising," and any variations thereof, in the embodiments of the present application, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or may alternatively include other steps or elements inherent to such process, method, article, or apparatus.

In step S100, a substrate is provided.

Please refer to fig. 2, fig. 2 is a schematic structural diagram of a substrate in this embodiment, in which the substrate 100 includes a main body 110 and a bending portion 120 disposed on the main body 110, and the bending portion 120 in this embodiment may be located on two sides of the main body 110. The substrate 100 may be made of any one of glass, ceramic, plastic, sapphire and hard resin (such as acryl).

Alternatively, with reference to fig. 2, the manufacturing method in this embodiment is generally applied to a substrate with a large bending depth and angle, wherein the bending portion 120 of the substrate 100 has a curvature radius r not greater than 5mm, a bending depth d greater than 3mm, and a bending angle a greater than 45 degrees. In addition, the preparation method in this embodiment is not limited to the side edge attachment of the housing, and may also be used in a camera area of the housing, such as a complex 3D model similar to an integral crater or a large-angle and deep bend.

Referring to fig. 1, the method further includes a step S200 of attaching a transparent flexible substrate to a surface of one side of the substrate.

In this step, please refer to fig. 3, fig. 3 is a schematic partial structure diagram after a transparent flexible substrate is attached to a substrate, in this embodiment, the transparent flexible substrate 200 is attached to a concave surface of the substrate 100, and in some other embodiments, the transparent flexible substrate 200 may also be attached to a convex surface of the substrate 100. Alternatively, the transparent flexible substrate 200 may be made of a resin material, such as PET (Polyethylene terephthalate, commonly known as dacron resin) or PI (Polyimide, abbreviated as PI). The thickness of the transparent flexible substrate 200 may be 25-50 um; the transparent flexible substrate 200 at least partially covers the bending portion 120, because the technical solution of the present application mainly solves the problem of the substrate bending region bonding. The transparent flexible substrate 200 and the substrate 100 may be bonded together by UV glue (not shown), and the good toughness of the UV glue is utilized, so that the problems such as cracking and the like are not caused during the bonding process.

With reference to fig. 1, the method further includes step S300 of forming an appearance effect layer on a surface of the transparent flexible substrate facing away from the substrate.

Referring to fig. 4, fig. 4 is a schematic diagram of a stacked structure of an embodiment of the housing of the present application, in which the housing 10 includes a substrate 100, a transparent flexible substrate 200, and an appearance effect layer 300, which are sequentially stacked. The appearance effect layer 300 may be formed by forming at least one optical coating layer on a surface of the transparent flexible substrate facing away from the substrate by Physical Vapor Deposition (PVD). The principle of forming the color of the optical coating layer is as follows: incident light (such as 7 colors of visible light) is alternately reflected, refracted and transmitted through two or more than two media (coating layers) with high refractive index and low refractive index through optical coating, the required color is reflected, the unnecessary color is refracted and transmitted, and the purer required color is obtained through multi-layer superposition, multiple reflection, refraction and transmission. The film system structure design is realized by selecting the film coating materials with high and low refractive indexes and matching different film thicknesses according to a curve formed by the reflectivity or transmissivity of a certain color in a certain wave band, and meanwhile, the adhesive force between the film coating materials and different interfaces is required to be considered. Common coating materials are silicon dioxide, trititanium pentoxide, zirconium oxide, and the like. By their different thickness and stacking design, the desired effect is achieved. Optionally, the thickness of the optical coating layer may be 20 to 2000nm, and compared with the conventional technical scheme in which the optical coating layer is firstly formed on the film, the method in the embodiment of the present application may make the thickness of the optical coating layer thicker (in the conventional technical scheme, because the problem of cracking of the optical coating layer during the attachment needs to be considered, the thickness of the optical coating layer generally cannot exceed 600nm), and further obtain a better appearance effect (generally, the larger the thickness of the optical film is, the better the appearance effect is, and the design of matching with other effect layers is also richer).

Compared with the conventional CMF membrane attaching scheme, the preparation method in the embodiment of the application adjusts the optical coating process to the attaching state, and can effectively avoid the problem of cracking of the optical coating layer during the attaching of the glass model with a large angle and a deep model. Thereby realizing richer texture and color effects on the glass appearance piece with the complex modeling. Compared with the conventional CMF film laminating scheme, after the optical coating process is adjusted to be laminated, the limitation of the thickness of the optical film is reduced, and the more effective appearance effect can be realized from the original maximum value not more than 600nm to the current about 2000 nm. Compared with the conventional spraying appearance process, the preparation method in the embodiment does not need to form a transition buffer layer before forming the optical coating layer, and simultaneously does not need to attach an explosion-proof film, so that the process complexity is reduced, the efficiency is improved, and the cost is reduced. Compared with the conventional spraying, the preparation method in the embodiment is easier to rework and is consistent with the film laminating process.

Referring to fig. 5, fig. 5 is a schematic flow chart of another embodiment of a method for manufacturing an electronic device case according to the present application, where the method for manufacturing an electronic device case in the present embodiment includes, but is not limited to, the following steps.

In step S100, a substrate is provided.

In the present embodiment, a rear case of an electronic device is also taken as an example for description, and the substrate 100 may also include a main body portion with an integrated structure and a bending portion disposed at an edge of the main body portion. The substrate may be made of any one of glass, ceramic, plastic, sapphire, and hard resin.

Alternatively, the manufacturing method in this embodiment is generally applied to a substrate with a large bending depth and a large bending angle, wherein the bending parameters of the substrate are described in the foregoing embodiments and will not be described in detail herein.

Referring to fig. 5, unlike the previous embodiment, the manufacturing method in this embodiment further includes a step S400 of forming a UV texture layer on the transparent flexible substrate.

Among them, the UV texture layer is formed by UV transfer printing in general due to its forming characteristics, and there is no problem of bonding with a bending region and damage after formation, and the UV texture layer is more easily manufactured in a planar state, so the UV texture layer is selected to be formed before bonding. It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present application are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.

With reference to fig. 5, the manufacturing method of the present embodiment further includes a step S200 of attaching a transparent flexible substrate to a side surface of the substrate.

Alternatively, referring to fig. 6, fig. 6 is a schematic structural view of another embodiment after a transparent flexible substrate is attached on a substrate, and the transparent flexible substrate 200 may be made of a resin material, such as PET (Polyethylene terephthalate, commonly known as dacron) or PI (Polyimide, abbreviated as PI). The thickness of the transparent flexible substrate 200 may be 25-50 um; the transparent flexible substrate 200 at least partially covers the bending portion of the substrate 100 (see fig. 3), because the technical solution of the present application mainly solves the problem of bonding the substrate bending region. The transparent flexible substrate 200 and the substrate 100 may be bonded by UV glue (not shown), and the good toughness of the UV glue is utilized, so that the problems such as cracking and the like are not generated during the bonding process.

With reference to fig. 5, the manufacturing method in this embodiment further includes step S300 of forming an appearance effect layer on a surface of the transparent flexible substrate facing away from the substrate.

Referring to fig. 6, fig. 6 is a schematic view of a laminated structure of another embodiment of the housing of the present application, in which an appearance effect layer 300 includes a UV texture layer 310, an optical coating layer 320, and an ink layer 330, which are sequentially laminated. The optical coating layer 320 may be formed by Physical Vapor Deposition (PVD) to form at least one layer on the surface of the UV texture layer 310. The material of the optical coating layer 320 may be silicon dioxide, titanium pentoxide, zirconium oxide, etc. The thickness of the optical coating layer 320 may be 20-2000 nm.

Optionally, the ink layer 330 is formed on the optical coating layer 320, and the specific forming manner may be spraying, silk-screen printing, and the like. The ink layer 330 may further include a color ink layer 331 and a bottom-covering ink layer 332.

With reference to fig. 5, the manufacturing method in this embodiment further includes a step S500 of plating a fingerprint-proof film on a surface of the substrate away from the transparent flexible substrate.

Referring to fig. 6, the anti-fingerprint film 400 is formed on the surface of the substrate 100 away from the transparent flexible substrate 200, and the anti-fingerprint film 400 is used to improve the anti-fingerprint and anti-smudge capability of the glass surface.

According to the preparation method of the electronic equipment shell, the transparent flexible base material is firstly attached to the substrate, and then the appearance effect layer is formed on the transparent flexible base material. Therefore, the problem that the appearance effect layer on the membrane is cracked when the membrane is attached to the substrate with the large-angle and deep bending shape is solved; in addition, due to the protection of the transparent flexible base material, a transition buffer layer does not need to be sprayed on the surface of the substrate when an appearance effect layer is manufactured subsequently, so that the process is simplified, and the cost is reduced. In addition, the appearance effect layer in this embodiment can enrich the appearance display effect of casing through setting up structures such as printing ink layer and texture layer, improves user experience.

Further, an electronic device is provided in an embodiment of the present application, please refer to fig. 7 and fig. 8 together, fig. 7 is a schematic structural diagram of an embodiment of the electronic device of the present application, and fig. 8 is a schematic sectional structural diagram at a-a in the embodiment of fig. 7, and the electronic device in the present embodiment may include a display screen 30, a housing 10, and a control circuit board 20. The structure and the manufacturing method of the housing 10 are as described in the foregoing embodiments, and are not described herein again.

Optionally, the display screen 30 and the housing 10 cooperate to form an accommodating space 1000, the control circuit board 20 is disposed in the accommodating space 1000, the control circuit board 20 is electrically connected to the display screen 30, and the control circuit board 20 is configured to control the display screen 30 to work. The detailed technical features of other parts of the electronic device are within the understanding of those skilled in the art, and are not described herein.

Referring to fig. 9, fig. 9 is a block diagram illustrating a structural composition of an embodiment of an electronic device according to the present application, where the electronic device may be a mobile phone, a tablet computer, a notebook computer, a wearable device, and the like, and the embodiment illustrates a mobile phone as an example. The electronic device may include an RF circuit 910, a memory 920, an input unit 930, a display unit 940 (i.e., the display screen 30 in the above-described embodiment), a sensor 950, an audio circuit 960, a wifi module 970, a processor 980 (which may be the control circuit board 20 in the above-described embodiment), a power supply 990, and the like. Wherein the RF circuit 910, the memory 920, the input unit 930, the display unit 940, the sensor 950, the audio circuit 960, and the wifi module 970 are respectively connected with the processor 980; power supply 990 is operable to provide power to the entire electronic device 10.

Specifically, the RF circuit 910 is used for transmitting and receiving signals; the memory 920 is used for storing data instruction information; the input unit 930 is used for inputting information, and may specifically include a touch panel 931 and other input devices 932 such as operation keys; the display unit 940 may include a display panel 941; the sensor 950 includes an infrared sensor, a laser sensor, etc. for detecting a user approach signal, a distance signal, etc.; a speaker 961 and a microphone 962 are connected to the processor 980 through the audio circuit 960 for emitting and receiving sound signals; the wifi module 970 is used for receiving and transmitting wifi signals, and the processor 980 is used for processing data information of the electronic device. For specific structural features of the electronic device, please refer to the related description of the above embodiments, and detailed descriptions thereof will not be provided herein.

In the electronic device in this embodiment, the casing is formed by first attaching the transparent flexible base material to the substrate, and then forming the appearance effect layer on the transparent flexible base material. Therefore, the problem that the appearance effect layer on the membrane is cracked when the membrane is attached to the substrate with the large-angle and deep bending shape is solved; in addition, due to the protection of the transparent flexible base material, a transition buffer layer does not need to be sprayed on the surface of the substrate when an appearance effect layer is manufactured subsequently, so that the process is simplified, and the cost is reduced.

The above description is only a part of the embodiments of the present invention, and not intended to limit the scope of the present invention, and all equivalent devices or equivalent processes performed by the present invention through the contents of the specification and the drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims

1. A method for manufacturing an electronic device housing, the method comprising:

2. The method according to claim 1, wherein the step of attaching the transparent flexible base material to the one surface of the substrate further comprises: forming a UV texture layer on the transparent flexible substrate.

3. The method according to claim 1, wherein the substrate is made of any one of glass, ceramic, plastic, sapphire, and hard resin.

4. The production method according to claim 1, wherein the transparent flexible base material is made of a resin material.

5. The manufacturing method according to claim 2, wherein the step of forming the appearance effect layer on the surface of the transparent flexible base material on the side facing away from the substrate comprises: and forming at least one optical coating layer on the surface of one side of the transparent flexible base material, which is far away from the substrate, by using a physical vapor deposition method.

6. The method according to claim 5, wherein the step of forming an appearance effect layer on the surface of the transparent flexible substrate on the side away from the substrate further comprises: and coating an ink layer on the optical coating layer.

7. The preparation method according to claim 6, further comprising plating a fingerprint-proof film on the surface of the substrate facing away from the transparent flexible base material.

8. The method according to claim 1, wherein the radius of curvature of the bent portion of the substrate is not more than 5 mm.

9. A shell for electronic equipment is characterized by comprising a substrate, a transparent flexible base material and an appearance effect layer which are sequentially stacked; the shell is prepared by the preparation method of any one of claims 1 to 8.

10. An electronic device, comprising a display screen, a control circuit board and the housing of claim 9, wherein the housing and the display screen are matched to form an accommodating space, and the control circuit board is disposed in the accommodating space and electrically connected to the display screen.