CN114300373A - Height measuring method and device and die bonding device - Google Patents
Height measuring method and device and die bonding device Download PDFInfo
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- CN114300373A CN114300373A CN202111629768.1A CN202111629768A CN114300373A CN 114300373 A CN114300373 A CN 114300373A CN 202111629768 A CN202111629768 A CN 202111629768A CN 114300373 A CN114300373 A CN 114300373A
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Abstract
本发明提供了一种高度测量方法、装置及固晶装置，该高度测量方法包括如下步骤：测量图像测量装置距离固晶平台的初始高度时的光斑宽度L；把固晶平台上升H的高度，这个高度为固晶工作时的高度，通过图像测量装置测量固晶平台上两个光斑之间的初始距离L1；光斑距离测量步骤：任意时刻，通过图像测量装置测量基板上左光斑和右光斑之间的距离L2；高度偏差计算步骤：任意时刻，基板高度相对于固晶平台的高度偏差为Δh，Δh=H*|（L1‑L2）/（L‑L1）|。本发明的有益效果是：本发明通过二束交叉光源打在基板上形成两个点光斑，用图像测量装置测量两个光斑的距离，形成了一个与该距离对应的基准高度；通过比较和测量不同的光斑距离，可计算获得对应不同的基板高度或对应平整度。
The invention provides a height measurement method, device and die bonding device. The height measurement method includes the following steps: measuring the light spot width L when the image measuring device is away from the initial height of the die bonding platform; raising the die bonding platform to the height H, This height is the height of the die-bonding work, and the initial distance L1 between the two light spots on the die-bonding platform is measured by the image measuring device; the light spot distance measurement step: at any time, the image measuring device is used to measure the distance between the left and right light spots on the substrate. distance L2; height deviation calculation steps: at any time, the height deviation of the substrate height relative to the die bonding platform is Δh, Δh=H*|(L1‑L2)/(L‑L1)|. The beneficial effects of the present invention are: the present invention uses two beams of cross light sources to hit the substrate to form two spot light spots, and uses an image measuring device to measure the distance of the two light spots to form a reference height corresponding to the distance; Different spot distances can be calculated corresponding to different substrate heights or corresponding flatness.
Description
技术领域technical field
本发明涉及LED COB封装领域，尤其涉及一种高度测量方法、装置及固晶装置。The invention relates to the field of LED COB packaging, in particular to a height measurement method, device and die-bonding device.
背景技术Background technique
COB(Chip On Board)固晶机是将晶片固定在基板上的设备，固晶时，固晶头对基板的距离很敏感，所以，准确、快速测量固晶头与基板之间的高度距离，是现有技术亟待解决的技术问题。COB (Chip On Board) die bonder is a device that fixes the wafer on the substrate. During die bonding, the die bonding head is very sensitive to the distance of the substrate. Therefore, to accurately and quickly measure the height distance between the die bonding head and the substrate, It is an urgent technical problem to be solved in the prior art.
发明内容SUMMARY OF THE INVENTION
本发明提供了一种高度测量方法，包括如下步骤：The invention provides a height measurement method, comprising the following steps:
初始高度测量步骤：测量图像测量装置距离固晶平台的初始高度H时的光斑宽度L；Initial height measurement step: measure the spot width L when the image measuring device is at the initial height H from the die bonding platform;
移动固晶平台的高度H，此时高度为固晶平台的工作高度，左光源和右光源发出光，在固晶平台上形成两个光斑，通过图像测量装置测量固晶平台上两个光斑之间的初始距离L1；The height H of the mobile die-bonding platform is the working height of the die-bonding platform. The left and right light sources emit light to form two light spots on the die-bonding platform. The image measuring device measures the difference between the two light spots on the die-bonding platform. The initial distance L1 between;
光斑距离测量步骤：左光源和右光源发出光，在基板上形成左光斑和右光斑，任意时刻，通过图像测量装置测量基板上左光斑和右光斑之间的距离L2；Spot distance measurement step: the left light source and the right light source emit light, and the left and right light spots are formed on the substrate. At any time, the distance L2 between the left and right light spots on the substrate is measured by the image measuring device;
高度偏差计算步骤：任意时刻，基板高度相对于固晶平台的高度偏差为Δh，Δh＝H*|(L1-L2)/(L-L1)|。Steps for calculating height deviation: at any time, the height deviation of the substrate height relative to the die bonding platform is Δh, Δh=H*|(L1-L2)/(L-L1)|.
作为本发明的进一步改进，所述左光源和所述右光源发出激光或者红光。As a further improvement of the present invention, the left light source and the right light source emit laser light or red light.
作为本发明的进一步改进，所述图像测量装置包括相机和计算模块。As a further improvement of the present invention, the image measuring device includes a camera and a computing module.
本发明还提供了一种高度测量装置，包括：图像测量装置、左光源、右光源、基板和固晶平台，所述图像测量装置、左光源、右光源均位于所述基板上方，左光源和右光源发出光，在固晶平台上形成两个光斑，通过图像测量装置测量固晶平台上两个光斑之间的初始距离L1；左光源和右光源发出光，在基板上形成左光斑和右光斑，任意时刻，通过图像测量装置测量基板上左光斑和右光斑之间的距离L2；任意时刻，基板高度相对于固晶平台的高度偏差为Δh，Δh＝H*|(L1-L2)/(L-L1)|，H为移动固晶平台的高度，此时高度为固晶平台的工作高度。The present invention also provides a height measuring device, comprising: an image measuring device, a left light source, a right light source, a substrate and a die bonding platform, wherein the image measuring device, the left light source and the right light source are all located above the substrate, and the left light source and The right light source emits light, and two light spots are formed on the die bonding platform, and the initial distance L1 between the two light spots on the die bonding platform is measured by the image measuring device; the left and right light sources emit light to form left and right light spots on the substrate. Light spot, at any time, the distance L2 between the left light spot and the right light spot on the substrate is measured by the image measuring device; at any time, the height deviation of the substrate height relative to the die-bonding platform is Δh, Δh=H*|(L1-L2)/ (L-L1)|, H is the height of the mobile die-bonding platform, at this time the height is the working height of the die-bonding platform.
作为本发明的进一步改进，所述左光源和所述右光源发出激光或者红光。As a further improvement of the present invention, the left light source and the right light source emit laser light or red light.
作为本发明的进一步改进，所述图像测量装置包括相机和计算模块。As a further improvement of the present invention, the image measuring device includes a camera and a computing module.
本发明还提供了一种固晶装置，包括固晶头、以及所述的高度测量装置，根据Δh，控制固晶头下探到所述基板的高度。The present invention also provides a die-bonding device, comprising a die-bonding head, and the height measuring device, which controls the height of the die-bonding head descending to the substrate according to Δh.
本发明的有益效果是：本发明通过二束交叉光源打在基板上形成两个点光斑，用图像测量装置测量两个光斑的距离，形成了一个与该距离对应的基准高度；通过比较和测量不同的光斑距离，可计算获得对应不同的基板高度或对应平整度。The beneficial effects of the present invention are as follows: the present invention forms two spot light spots by hitting two cross light sources on the substrate, and measures the distance of the two light spots with an image measuring device, forming a reference height corresponding to the distance; Different spot distances can be calculated corresponding to different substrate heights or corresponding flatness.
附图说明Description of drawings
图1是本发明的原理框图。Fig. 1 is the principle block diagram of the present invention.
具体实施方式Detailed ways
如图1所示，本发明公开了一种高度测量方法，包括如下步骤：As shown in Figure 1, the present invention discloses a height measurement method, comprising the following steps:
初始高度测量步骤：测量图像测量装置1距离固晶平台7的初始高度时的光斑宽度L；The initial height measurement step: measuring the light spot width L when the image measuring device 1 is away from the initial height of the
移动固晶平台7的高度H，此时高度为固晶平台7的工作高度，左光源3和右光源2发出光，在固晶平台7上形成两个光斑，通过图像测量装置1测量固晶平台7上两个光斑之间的初始距离L1；Move the height H of the die-
光斑距离测量步骤：左光源3和右光源2发出光，在基板4上形成左光斑5和右光斑6，任意时刻，通过图像测量装置1测量基板4上左光斑5和右光斑6之间的距离L2；Spot distance measurement steps: the left light source 3 and the
高度偏差计算步骤：任意时刻，基板4高度相对于固晶平台7的高度偏差为Δh，Δh＝H*|(L1-L2)/(L-L1)|。Height deviation calculation step: At any time, the height deviation of the
所述左光源3和所述右光源2发出激光或者红光。The left light source 3 and the
所述图像测量装置1包括相机和计算模块，相机对固晶平台7上两个光斑进行拍照，通过计算模块计算固晶平台7上两个光斑之间的初始距离L1；相机对基板4上左光斑5和右光斑6进行拍照，通过计算模块计算基板4上左光斑5和右光斑6之间的距离L2。The image measuring device 1 includes a camera and a calculation module. The camera takes pictures of the two light spots on the
本发明还公开了一种高度测量装置，包括：图像测量装置1、左光源3、右光源2、基板4和固晶平台7，所述图像测量装置1、左光源3、右光源2均位于所述基板4上方，左光源3和右光源2发出光，在固晶平台7上形成两个光斑，通过图像测量装置1测量固晶平台7上两个光斑之间的初始距离L1；左光源3和右光源2发出光，在基板4上形成左光斑5和右光斑6，任意时刻，通过图像测量装置1测量基板4上左光斑5和右光斑6之间的距离L2；任意时刻，基板4高度相对于固晶平台7的高度偏差为Δh，Δh＝H*|(L1-L2)/(L-L1)|，H为移动固晶平台7的高度，此时高度为固晶平台7的工作高度。The present invention also discloses a height measuring device, comprising: an image measuring device 1, a left light source 3, a
本发明还公开了一种固晶装置，包括固晶头、以及所述的高度测量装置，根据Δh，控制固晶头下探到所述基板4的高度。The present invention also discloses a die-bonding device, comprising a die-bonding head and the height measuring device, which controls the height of the die-bonding head protruding down to the
本发明通过二束交叉光源打在基板4上形成两个点光斑，用图像测量装置1测量两个光斑的距离，形成了一个与该距离对应的基准高度；通过比较和测量不同的光斑距离，可计算获得对应不同的基板高度或对应平整度。In the present invention, two beams of cross light sources are hit on the
以上内容是结合具体的优选实施方式对本发明所作的进一步详细说明，不能认定本发明的具体实施只局限于这些说明。对于本发明所属技术领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干简单推演或替换，都应当视为属于本发明的保护范围。The above content is a further detailed description of the present invention in combination with specific preferred embodiments, and it cannot be considered that the specific implementation of the present invention is limited to these descriptions. For those of ordinary skill in the technical field of the present invention, without departing from the concept of the present invention, some simple deductions or substitutions can be made, which should be regarded as belonging to the protection scope of the present invention.
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH08210812A (en) * | 1995-02-03 | 1996-08-20 | Moritetsukusu:Kk | Length measuring instrument |
| US6782122B1 (en) * | 2000-04-27 | 2004-08-24 | Simmonds Precision Products, Inc. | Apparatus for measuring height of a liquid in a container using area image pattern recognition techniques |
| CN104227231A (en) * | 2013-06-17 | 2014-12-24 | 鸿富锦精密工业（深圳）有限公司 | Laser processing system |
| KR20190100777A (en) * | 2018-02-21 | 2019-08-29 | 주식회사 이오테크닉스 | Flip chip bonding apparatus and method |
| CN112908895A (en) * | 2021-01-20 | 2021-06-04 | 深圳市卓兴半导体科技有限公司 | Substrate plane correction method and system and laminating equipment |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08210812A (en) * | 1995-02-03 | 1996-08-20 | Moritetsukusu:Kk | Length measuring instrument |
| US6782122B1 (en) * | 2000-04-27 | 2004-08-24 | Simmonds Precision Products, Inc. | Apparatus for measuring height of a liquid in a container using area image pattern recognition techniques |
| CN104227231A (en) * | 2013-06-17 | 2014-12-24 | 鸿富锦精密工业（深圳）有限公司 | Laser processing system |
| KR20190100777A (en) * | 2018-02-21 | 2019-08-29 | 주식회사 이오테크닉스 | Flip chip bonding apparatus and method |
| CN112908895A (en) * | 2021-01-20 | 2021-06-04 | 深圳市卓兴半导体科技有限公司 | Substrate plane correction method and system and laminating equipment |
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