CN114298263A - Radio frequency identification tag, radio frequency identification system and method - Google Patents
Radio frequency identification tag, radio frequency identification system and method Download PDFInfo
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- CN114298263A CN114298263A CN202111345950.4A CN202111345950A CN114298263A CN 114298263 A CN114298263 A CN 114298263A CN 202111345950 A CN202111345950 A CN 202111345950A CN 114298263 A CN114298263 A CN 114298263A
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Abstract
The present disclosure provides a radio frequency identification tag, a radio frequency identification system and a method. The radio frequency identification tag includes: the antenna layer comprises an integrated circuit chip and an antenna; the protective layer is positioned on one side of the antenna layer, covers the antenna layer and is fixedly connected with the antenna layer; the substrate layer is positioned on the other side of the antenna layer and is fixedly connected with the antenna layer to provide support for the antenna layer; the glue coating points are positioned on one side of the substrate layer, which is far away from the antenna layer, and the glue coating points are arranged at intervals; from the type paper layer, be located the one side of keeping away from the antenna layer of a plurality of rubber coating points, a plurality of rubber coating points will the substrate layer with leave the bonding of type paper layer. The present disclosure improves the sensitivity and group read identification rate of RFID tags.
Description
Technical Field
The present disclosure relates to the field of communications technologies, and in particular, to a radio frequency identification tag, a radio frequency identification system, and a radio frequency identification method.
Background
Radio Frequency Identification (RFID) technology is an automatic Identification technology that performs contactless two-way communication using induction, Radio waves, or microwaves for the purpose of Identification and data exchange. The target object can be tracked, managed and the like through the RFID system. The RFID system may include an RFID reader and an RFID tag. RFID tags are often attached to objects having a metallic surface or to containers containing liquids. The electromagnetic wave emitted by the RFID reader can be interfered by the reflection of the metal on the electromagnetic wave and the absorption of the liquid on the electromagnetic wave, which is not beneficial for the RFID reader to read the information of the RFID tag. For this reason, specially designed anti-metal interference tags and anti-liquid interference tags must be used, and the manufacturing processes of the anti-metal interference tags and the anti-liquid interference tags are complicated and costly compared to general electronic tags. Also, generally, the anti-metal interference tag is susceptible to interference of the absorption action of liquid on electromagnetic waves, and the anti-liquid interference tag is susceptible to interference of the reflection action of metal on electromagnetic waves. In an application scenario where a plurality of objects to be managed are mixed (i.e., there are both objects having metal surfaces and containers containing liquid in the objects to be managed), when a plurality of RFID tags are read in a group, the RFID tags are interfered by the absorption action of the liquid to electromagnetic waves and/or the reflection action of the metal to electromagnetic waves, which lowers the sensitivity and group reading recognition rate of the RFID tags.
Disclosure of Invention
In view of this, the present disclosure is directed to improving the sensitivity and group read recognition rate of RFID tags.
To achieve this object, according to a first aspect of the present disclosure, there is provided a radio frequency identification tag including:
the antenna layer comprises an integrated circuit chip and an antenna;
the protective layer is positioned on one side of the antenna layer, covers the antenna layer and is fixedly connected with the antenna layer;
the substrate layer is positioned on the other side of the antenna layer and is fixedly connected with the antenna layer to provide support for the antenna layer;
the glue coating points are positioned on one side, far away from the antenna layer, of the substrate layer, and are arranged at intervals;
and the release paper layer is positioned on one side of the antenna layer, which is far away from the plurality of gluing points, and the plurality of gluing points are used for bonding the substrate layer and the release paper layer.
Optionally, the plurality of glue applying points are distributed between the release paper layer and the substrate layer, and the positions and the number of the plurality of glue applying points are related to the size and the quality of the radio frequency identification tag.
Optionally, the plurality of glue applying points have a preset thickness, and isolate the release paper layer from the substrate layer.
Optionally, the radio frequency identification tag further comprises:
the antenna comprises a protective layer, an antenna layer, a first glue layer and a second glue layer, wherein the protective layer is arranged between the antenna layer and the first glue layer, one side of the first glue layer covers one side of the protective layer, which is close to the antenna layer, the other side of the first glue layer covers one side of the antenna layer, which is close to the protective layer, and the first glue layer is fixedly connected with the antenna layer.
Optionally, the radio frequency identification tag further includes:
the second glue film is located the antenna layer with between the substrate layer, one side of second glue film covers keeping away from of antenna layer one side of protective layer, the opposite side of second glue film covers being close to of substrate layer one side of antenna layer, the second glue film will the antenna layer with substrate layer fixed connection.
Optionally, the material of the plurality of glue application points comprises: industrial double-sided adhesive tape, foam cotton adhesive, silica gel and the like.
According to a second aspect of the present disclosure, there is provided a radio frequency identification system comprising:
the radio frequency identification tag of any of the above;
and the radio frequency identification reader-writer is used for reading/writing the information stored in the radio frequency identification label.
According to a third aspect of the present disclosure, there is provided a method of manufacturing a radio frequency identification tag, comprising:
obtaining an antenna layer, wherein the antenna layer comprises an integrated circuit chip and an antenna;
arranging a protective layer on one side of the antenna layer, wherein the protective layer covers the antenna layer and is fixedly connected with the antenna layer;
a substrate layer is arranged on the other side of the antenna layer and fixedly connected with the antenna layer to provide support for the antenna layer;
arranging a plurality of gluing points on one side of the substrate layer, which is far away from the antenna layer, wherein the gluing points are arranged at intervals;
one side of keeping away from of a plurality of rubber coating points antenna layer sets up from the type paper layer, a plurality of rubber coating points will the substrate layer with from the type paper layer bonding.
Optionally, the plurality of glue applying points are distributed between the release paper layer and the substrate layer, and the positions and the number of the plurality of glue applying points are related to the size and the quality of the radio frequency identification tag.
Optionally, the plurality of glue applying points have a preset thickness, and isolate the release paper layer from the substrate layer.
According to a fourth aspect of the present disclosure, there is provided a method of using a radio frequency identification tag, the radio frequency identification tag comprising:
the antenna layer comprises an integrated circuit chip and an antenna;
the protective layer is positioned on one side of the antenna layer, covers the antenna layer and is fixedly connected with the antenna layer;
the substrate layer is positioned on the other side of the antenna layer and is fixedly connected with the antenna layer to provide support for the antenna layer;
the glue coating points are positioned on one side, far away from the antenna layer, of the substrate layer, and are arranged at intervals;
the release paper layer is positioned on one side, far away from the antenna layer, of the plurality of gluing points, and the base material layer and the release paper layer are bonded through the plurality of gluing points;
the using method comprises the following steps:
removing the release paper layer;
the radio frequency identification label is adhered to an article to be managed by the plurality of gluing points, and the protective layer is positioned on one side far away from the article to be managed;
and placing the radio frequency identification tag in the action range of a radio frequency identification reader-writer so that the radio frequency identification reader-writer reads/writes the information stored in the radio frequency identification tag.
In the embodiment of the disclosure, the protective layer, the antenna layer, the substrate layer and the release paper layer in the RFID tag are sequentially stacked from top to bottom. A plurality of rubber coating points are located the substrate layer and leave between the type paper layer, with the substrate layer with leave the type paper layer bonding, utilize a plurality of rubber coating point mutual intervals to set up ingeniously, when the RFID label uses, tear and leave the type paper layer, a plurality of rubber coating points paste the radio frequency identification label on waiting to manage article, and like this, a plurality of rubber coating points can be at antenna layer and wait to manage this characteristics of formation air isolation region between the article surface, the air isolation region can reduce the metal surface of waiting to manage article and to the interference of the electromagnetic wave reflection effect of electromagnetic wave that the RFID read write line was sent and the absorption of electromagnetic wave of liquid in the article of waiting to manage, thereby improve the sensitivity and the group reading identification rate of RFID label.
Drawings
The foregoing and other objects, features, and advantages of the disclosure will be apparent from the following description of embodiments of the disclosure, which refers to the accompanying drawings in which:
FIG. 1 shows an architectural diagram for an RFID system in accordance with an embodiment of the present disclosure.
FIG. 2 illustrates an exploded perspective view of an RFID tag according to one embodiment of the present disclosure.
FIG. 3 shows a side cross-sectional schematic view of an RFID tag according to one embodiment of the present disclosure.
FIG. 4 shows a schematic top perspective view of an RFID tag according to one embodiment of the present disclosure.
FIG. 5 shows a flow chart of a method of manufacturing an RFID tag according to one embodiment of the present disclosure.
FIG. 6 shows a flow chart of a method of using an RFID tag according to one embodiment of the present disclosure.
Detailed Description
The present disclosure is described below based on examples, but the present disclosure is not limited to only these examples. In the following detailed description of the present disclosure, some specific details are set forth in detail. It will be apparent to those skilled in the art that the present disclosure may be practiced without these specific details. Well-known methods, procedures, and procedures have not been described in detail so as not to obscure the present disclosure. The figures are not necessarily drawn to scale.
Application scenario and application architecture of the present disclosure
The application scenarios of the embodiment of the present disclosure may include warehouse management, identity recognition, transportation, food medical treatment, entrance guard theft prevention, military industry, and the like in logistics storage, in these application scenarios, an RFID tag that is resistant to metal interference and liquid interference may be formed, and accurate tracking and management of a target object may be achieved by using an RFID system.
FIG. 1 shows an architectural diagram for an RFID system in accordance with an embodiment of the present disclosure. The RFID system 100 includes an RFID reader 110 and an RFID tag 120, wherein the RFID reader 110 and the RFID tag 120 can communicate with each other via Radio Frequency (RF) signals. The RFID reader 110 may transmit an interrogation RF signal, and the RFID tag 120 located near the RFID reader 110 may detect the interrogation RF signal transmitted by the RFID reader 110 and return a response RF signal to the RFID reader 110, where the response RF signal may carry information about the RFID tag 120 itself. The RFID reader 110 may detect and interpret the reply RF signal. Then, the RFID reader 110 may send the analyzed response RF signal to a host (not shown in the figure), and the host identifies the identity of the RFID tag 120 according to the logic operation, and performs corresponding processing and control for different settings.
In some embodiments, the RFID tag 120 may be a passive tag, and the RFID tag 120 may not have its own power source, and the RFID tag 120 may derive power from the interrogating RF signal. When the RFID system 100 is in operation, the RFID reader 110 transmits an interrogation RF signal (e.g., a carrier signal) of a specific frequency via the transmitting antenna; the RFID tag 120, upon receiving the interrogation RF signal, induces current to gain energy to modulate information stored in an integrated circuit chip (not shown) and then transmit the information through a built-in antenna (not shown). After receiving the response RF signal (e.g., a modulated signal), the receiving antenna (not shown) of the RFID reader 110 transmits the response RF signal to a signal processing module (not shown) of the RFID reader 110, and the signal processing module performs demodulation, decoding, and the like of the signal and transmits the signal to the host. Then, the host identifies the identity of the RFID tag 120 according to the logical operation, performs corresponding processing and control for different settings, and finally sends a signal to control the RFID reader 110 to complete different read/write operations.
It should be understood that fig. 1 exemplarily shows one RFID reader 110 and one RFID tag 120, in the RFID system 100, one RFID reader 110 may communicate with a plurality of RFID tags 120, and the RFID system 100 may include a plurality of RFID readers 110, which is not limited by the embodiment of the present disclosure.
RFID tag according to embodiments of the present disclosure
FIG. 2 illustrates an exploded perspective view of an RFID tag according to one embodiment of the present disclosure. In some embodiments, as shown in FIG. 2, RFID tag 120 includes: the protective layer 270, the first adhesive layer 260, the antenna layer 250, the second adhesive layer 240, the substrate layer 230, the plurality of glue dots 220, and the release paper layer 210. Antenna layer 250 includes an integrated circuit chip 251 and an antenna 252. In some embodiments, the protective layer 270, the first adhesive layer 260, the antenna layer 250, the second adhesive layer 240, the substrate layer 230, the plurality of glue dots 220, and the release paper layer 210 are sequentially stacked from top to bottom.
The integrated circuit chip 251 and the antenna 252 in the RFID tag 120 are key components for communicating with the RFID reader 110. In some embodiments, integrated circuit chip 251 includes modules (not shown) such as a radio frequency front end, an analog front end, a microcontroller, and a memory. The radio frequency front-end module is mainly used for rectifying and reflection modulating an interrogation RF signal; the analog front-end module is mainly used for generating a reference power supply and a system clock required in a chip, carrying out power-on reset and the like; the microcontroller is mainly used for encoding and decoding digital signals, processing an anti-collision protocol and the like; the memory module is used for information storage (i.e., signal data received and transmitted by the RFID tag 120, such as an identification code of the RFID tag 120, etc.). Since the integrated circuit chip 251 can be any chip in a conventional RFID tag, which is known in the art, it is not described in detail.
In some embodiments, integrated circuit chip 251 is electrically connected to antenna 252, for example, by conductive glue. The antenna 252 functions as a transmitting/receiving device for transmitting/receiving data between the RFID tag 120 and the RFID reader/writer 110, and receives/transmits an interrogation RF signal and a response RF signal in the form of electromagnetic waves. When the RFID tag 120 enters the active region of the RFID reader/writer 110, information can be read/written from/to the memory of the integrated circuit chip 251 using the antenna 252 according to a communication protocol. In some embodiments, the material of the antenna 252 includes conductive materials such as aluminum, copper, iron, graphite, carbon, silver, conductive ink, and the like. Due to the difference in material and manufacturing process, the antenna 252 can be classified into a metal etching antenna, a printed antenna, a copper-plated antenna, and the like. In some embodiments, the antenna 252 may be fabricated by conventional processes such as etching, printing, die cutting, and the like. The thickness of the antenna 251 can be controlled to secure the conductive ability and flexibility of the antenna 251. It should be noted that fig. 2 exemplarily shows an antenna pattern of the antenna 252, but the antenna 252 may also have other antenna patterns, which is not limited in this disclosure. Since the antenna 252 may be any antenna in a conventional RFID tag, which is well known in the art, it will not be described in detail.
In some embodiments, as shown in fig. 2, to improve the reliability of the antenna 252 and the integrated circuit chip 251, the antenna 252 and the integrated circuit chip 251 may be located between the protective layer 270 and the substrate layer 230, and the protective layer 270 and the substrate layer 230 are used to protect the antenna 252 and the integrated circuit chip 251. In some embodiments, the protective layer 270 may include a layer of flexible printable material such as a polyethylene terephthalate Plastic (PET) layer, a polyethylene Plastic (PE) layer, a Polycarbonate (PC) layer, a copperplate paper layer, and the like. A printer may be used to print a barcode, a number, a text, or a pattern on the protective layer 270 to improve the recognizability of the RFID tag 120 and the acquirability of the tag information. In some embodiments, the substrate layer 230 may include a flexible insulating material layer such as an ethylene-vinyl acetate copolymer (EVA) foam layer, a silicone layer, a polypropylene (PP) layer, a PET layer, and the like. The protective layer 270 and the substrate layer 230 may isolate the antenna 252 and the integrated circuit chip 251 from the external environment, and prevent environmental factors (e.g., water vapor, dust, etc.) from adversely affecting the sensitivity of the RFID tag 120.
FIG. 3 shows a side cross-sectional schematic view of an RFID tag according to one embodiment of the present disclosure. As shown in fig. 3, only the integrated circuit chip 251 in the antenna layer 250 is shown for convenience of illustration. In some embodiments, as shown in fig. 2 and 3, the protective layer 270 is located above the antenna layer 250, the protective layer 270 covers the antenna layer 250 and is fixedly connected with the antenna layer 250; the substrate layer 230 is located below the antenna layer 250, and the substrate layer 230 is fixedly connected with the antenna layer 250 to provide support for the antenna layer 250. The first adhesive layer 260 is located between the protective layer 270 and the antenna layer 250, the upper adhesive surface of the first adhesive layer 260 covers the lower surface of the protective layer 170, the lower adhesive surface of the first adhesive layer 260 covers the upper surface of the antenna layer 250, and the protective layer 270 and the antenna layer 250 are fixedly connected by the first adhesive layer 260. The second adhesive layer 240 is located between the antenna layer 250 and the substrate layer 230, the upper adhesive surface of the second adhesive layer 240 covers the lower surface of the antenna layer 250, the lower adhesive surface of the second adhesive layer 240 covers the upper surface of the substrate layer 230, and the antenna layer 250 and the substrate layer 230 are fixedly connected by the second adhesive layer 240. In some embodiments, the material of the first adhesive layer 260 includes a material that is adhesive, such as a hot melt adhesive. The material of the second adhesive layer 240 includes a viscous material such as polyurethane adhesive.
In some embodiments, as shown in fig. 2 and 3, in the RFID tag 120, a release paper layer 210 (also called a silicone oil paper layer or a release paper layer) is disposed below the substrate layer 230. In some embodiments, the plurality of glue dots 220 are located below the substrate layer 230, the upper glue surface of the plurality of glue dots 221 is connected to the lower surface of the substrate layer 230, the release paper layer 210 is located below the plurality of glue dots 220, and the lower glue surface of the plurality of glue dots 220 is connected to the upper surface of the release paper layer 210. The plurality of glue dots 220 bond the base material layer 230 and the release paper layer 210. In some embodiments, the material of the plurality of glue dots 220 includes adhesive materials such as industrial double-sided tape, foam, silicone, and the like. In use, the RFID tag 120 may be attached to an article to be managed by tearing the release paper layer 210 and applying the RFID tag 120 to the article using the plurality of adhesive dots 220. In some embodiments, the plurality of glue application points 220 are spaced from each other, and when the RFID tag 120 is used, the plurality of glue application points 220 can form an air isolation region between the antenna layer 250 and the surface of the article to be managed, and the air isolation region can reduce interference of the metal surface of the article to be managed on reflection of electromagnetic waves emitted by the RFID reader/writer 110 and absorption of the electromagnetic waves by liquid in the article to be managed, so as to improve sensitivity and group reading recognition rate of the RFID tag 120.
FIG. 4 shows a schematic top perspective view of an RFID tag according to one embodiment of the present disclosure. As shown in fig. 4, for convenience of illustration, only the antenna layer 250, the plurality of glue dots 220, and the release paper layer 210 are shown. In some embodiments, as shown in fig. 2 to 4, the plurality of glue dots 220 are distributed between the release paper layer 210 and the substrate layer 230 and have a predetermined thickness. In some embodiments, a preset number of glue dots 220 may be selectively disposed at preset positions between the release paper layer 210 and the substrate layer 230 according to the size, quality and the like of the RFID tag 120, so that the RFID tag 120 may be firmly fixed on the surface of the article to be managed. It should be understood that fig. 2 to 4 exemplarily show the position, number and thickness of the plurality of glue application points 220, but the plurality of glue application points 221 may have other designs, which is not limited by the embodiment of the present disclosure.
Method for manufacturing RFID tag according to embodiment of the present disclosure
According to one embodiment of the present disclosure, a method of manufacturing an RFID tag is provided. As shown in fig. 5, a method of manufacturing an RFID tag according to one embodiment of the present disclosure includes: step S510, obtaining an antenna layer, wherein the antenna layer comprises an integrated circuit chip and an antenna; step S520, arranging a protective layer on one side of the antenna layer, wherein the protective layer covers the antenna layer and is fixedly connected with the antenna layer; step S530, arranging a substrate layer on the other side of the antenna layer, wherein the substrate layer is fixedly connected with the antenna layer and provides support for the antenna layer; step S540, arranging a plurality of gluing points on one side of the substrate layer, which is far away from the antenna layer, wherein the gluing points are arranged at intervals; and S550, arranging a release paper layer on one side of the plurality of gluing points, which is far away from the antenna layer, and bonding the substrate layer and the release paper layer by the plurality of gluing points.
The above steps are described in detail below, respectively.
In step S510, an antenna layer is obtained, where the antenna layer includes an integrated circuit chip and an antenna.
The antenna layer is a key component of the RFID tag 120 communicating with the RFID reader 110. The integrated circuit chip and the antenna may be connected by conductive glue. Since the antenna and the integrated circuit chip may be conventional devices in the RFID tag, the manufacturing processes of the antenna and the integrated circuit chip are prior art, and thus are not described in detail. In some embodiments, after the antenna and integrated circuit chip are obtained, the antenna and integrated circuit chip may be bonded together using conventional processes. Since the bonding process is a conventional process technology, it is not described in detail.
Step S520, arranging a protective layer on one side of the antenna layer, wherein the protective layer covers the antenna layer and is fixedly connected with the antenna layer.
In some embodiments, a first adhesive layer is disposed between the protective layer and the antenna layer by a glue coating process, an upper adhesive surface of the first adhesive layer covers a lower surface of the protective layer, a lower adhesive surface of the first adhesive layer covers an upper surface of the antenna layer, and the protective layer and the antenna layer are fixedly connected by the first adhesive layer. Since the gluing process is the existing process, it is not described here.
And S530, arranging a substrate layer on the other side of the antenna layer, wherein the substrate layer is fixedly connected with the antenna layer and provides support for the antenna layer.
In some embodiments, a second adhesive layer is disposed between the antenna layer and the substrate layer by using a glue coating process, an upper adhesive surface of the second adhesive layer covers a lower surface of the antenna layer, a lower adhesive surface of the second adhesive layer covers an upper surface of the substrate layer, and the second adhesive layer fixedly connects the antenna layer and the substrate layer. Since the gluing process is the existing process, it is not described here.
And S540, arranging a plurality of gluing points on one side of the substrate layer, which is far away from the antenna layer, wherein the gluing points are arranged at intervals.
In some embodiments, a plurality of glue dots are disposed under the substrate layer by using a glue process, and the glue dots 220 are spaced apart from each other and have a predetermined thickness. The preset number of gluing points can be selectively arranged at the preset position below the base material layer according to the factors such as the size and the quality of the RFID label. Since the gluing process is the existing process, it is not described here.
And S550, arranging a release paper layer on one side of the plurality of gluing points, which is far away from the antenna layer, and bonding the substrate layer and the release paper layer by the plurality of gluing points.
In some embodiments, a release paper layer is disposed below the plurality of glue application points, the upper glue surfaces of the plurality of glue application points are connected with the lower surface of the substrate layer, and the lower glue surfaces of the plurality of glue application points are connected with the upper surface of the release paper layer. And the plurality of gluing points are distributed between the release paper layer and the base material layer, and the base material layer is bonded with the release paper layer. When the RFID label is used, the release paper layer is torn, the radio frequency identification label is pasted on an article to be managed by the plurality of gluing points, and thus the plurality of gluing points can form an air isolation area between the antenna layer and the surface of the article to be managed.
It should be noted that the manufacturing method of the RFID tag according to the embodiment of the present disclosure can be implemented by using the existing mass production manufacturing process of the RFID tag and only changing the gluing process of the production process. Since the structure and materials of the RFID tag have been described in detail in the above device embodiments, they will not be described in detail here.
Use of RFID tags according to embodiments of the present disclosureBy means of
According to one embodiment of the present disclosure, a method of using an RFID tag is provided. As shown in fig. 6, a method of using an RFID tag according to one embodiment of the present disclosure includes: step S610, removing the release paper layer; step S620, the radio frequency identification label is pasted on an article to be managed by the plurality of gluing points, and the protective layer is positioned on one side far away from the article to be managed; step S560, placing the rfid tag in an action range of an rfid reader, so that the rfid reader reads/writes information stored in the rfid tag.
Since the method of using the RFID tag has been described in detail in the above device embodiments, it is not described here again.
Commercial value of the disclosure
The embodiment of the disclosure improves the anti-interference capability of the RFID tag on the absorption effect of liquid on electromagnetic waves and/or the reflection effect of metal on electromagnetic waves. Compared with the conventional metal interference resistant RFID label and liquid interference resistant RFID label, the RFID label does not need an additional wave-absorbing material medium layer, has low design requirement on an antenna, and reduces the manufacturing cost and the process complexity of the label. The RFID tag is beneficial to improving the sensitivity and the group reading identification rate of the RFID tag, and is beneficial to realizing accurate tracking, management and the like of a target object by utilizing an RFID system in an application scene of mixing various objects to be managed, and the like, and has specific and wide application space and market value.
It should be understood that the above-described are only preferred embodiments of the present disclosure, and are not intended to limit the present disclosure, since many variations of the embodiments described herein will occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present disclosure should be included in the protection scope of the present disclosure.
It should be understood that the embodiments in this specification are described in a progressive manner, and that the same or similar parts in the various embodiments may be referred to one another, with each embodiment being described with emphasis instead of the other embodiments.
It should be understood that the above description describes particular embodiments of the present specification. Other embodiments are within the scope of the following claims. In some cases, the actions or steps recited in the claims may be performed in a different order than in the embodiments and still achieve desirable results. In addition, the processes depicted in the accompanying figures do not necessarily require the particular order shown, or sequential order, to achieve desirable results. In some embodiments, multitasking and parallel processing may also be possible or may be advantageous.
It should be understood that an element described herein in the singular or shown in the figures only represents that the element is limited in number to one. Furthermore, modules or elements described or illustrated herein as separate may be combined into a single module or element, and modules or elements described or illustrated herein as single may be split into multiple modules or elements.
It is also to be understood that the terms and expressions employed herein are used as terms of description and not of limitation, and that the embodiment or embodiments of the specification are not limited to those terms and expressions. The use of such terms and expressions is not intended to exclude any equivalents of the features shown and described (or portions thereof), and it is recognized that various modifications may be made within the scope of the claims. Other modifications, variations, and alternatives are also possible. Accordingly, the claims should be looked to in order to cover all such equivalents.
Claims (11)
1. A radio frequency identification tag, comprising:
the antenna layer comprises an integrated circuit chip and an antenna;
the protective layer is positioned on one side of the antenna layer, covers the antenna layer and is fixedly connected with the antenna layer;
the substrate layer is positioned on the other side of the antenna layer and is fixedly connected with the antenna layer to provide support for the antenna layer;
the glue coating points are positioned on one side, far away from the antenna layer, of the substrate layer, and are arranged at intervals;
and the release paper layer is positioned on one side of the antenna layer, which is far away from the plurality of gluing points, and the plurality of gluing points are used for bonding the substrate layer and the release paper layer.
2. The radio frequency identification tag according to claim 1, wherein the plurality of glue sites are distributed between the release paper layer and the substrate layer, the location and number of the plurality of glue sites being related to the size and quality of the radio frequency identification tag.
3. The radio frequency identification tag of claim 1, wherein the plurality of glue sites have a predetermined thickness separating the release paper layer from the substrate layer.
4. The radio frequency identification tag according to claim 1, further comprising:
the antenna comprises a protective layer, an antenna layer, a first glue layer and a second glue layer, wherein the protective layer is arranged between the antenna layer and the first glue layer, one side of the first glue layer covers one side of the protective layer, which is close to the antenna layer, the other side of the first glue layer covers one side of the antenna layer, which is close to the protective layer, and the first glue layer is fixedly connected with the antenna layer.
5. The radio frequency identification tag according to claim 1, further comprising:
the second glue film is located the antenna layer with between the substrate layer, one side of second glue film covers keeping away from of antenna layer one side of protective layer, the opposite side of second glue film covers being close to of substrate layer one side of antenna layer, the second glue film will the antenna layer with substrate layer fixed connection.
6. The radio frequency identification tag according to claim 1, wherein the material of the plurality of glue sites comprises: industrial double-sided adhesive tape, foam cotton adhesive, silica gel and the like.
7. A radio frequency identification system, comprising:
the radio frequency identification tag of any one of claims 1-6;
and the radio frequency identification reader-writer is used for reading/writing the information stored in the radio frequency identification label.
8. A method of manufacturing a radio frequency identification tag, comprising:
obtaining an antenna layer, wherein the antenna layer comprises an integrated circuit chip and an antenna;
arranging a protective layer on one side of the antenna layer, wherein the protective layer covers the antenna layer and is fixedly connected with the antenna layer;
a substrate layer is arranged on the other side of the antenna layer and fixedly connected with the antenna layer to provide support for the antenna layer;
arranging a plurality of gluing points on one side of the substrate layer, which is far away from the antenna layer, wherein the gluing points are arranged at intervals;
one side of keeping away from of a plurality of rubber coating points antenna layer sets up from the type paper layer, a plurality of rubber coating points will the substrate layer with from the type paper layer bonding.
9. The manufacturing method as claimed in claim 7, wherein the plurality of glue dots are distributed between the release paper layer and the substrate layer, and the positions and the number of the plurality of glue dots are related to the size and the quality of the radio frequency identification label.
10. The manufacturing method according to claim 7, wherein the plurality of glue dots have a predetermined thickness, and separate the release paper layer from the substrate layer.
11. A method of using a radio frequency identification tag, the radio frequency identification tag comprising:
the antenna layer comprises an integrated circuit chip and an antenna;
the protective layer is positioned on one side of the antenna layer, covers the antenna layer and is fixedly connected with the antenna layer;
the substrate layer is positioned on the other side of the antenna layer and is fixedly connected with the antenna layer to provide support for the antenna layer;
the glue coating points are positioned on one side, far away from the antenna layer, of the substrate layer, and are arranged at intervals;
the release paper layer is positioned on one side, far away from the antenna layer, of the plurality of gluing points, and the base material layer and the release paper layer are bonded through the plurality of gluing points;
the using method comprises the following steps:
removing the release paper layer;
the radio frequency identification label is adhered to an article to be managed by the plurality of gluing points, and the protective layer is positioned on one side far away from the article to be managed;
and placing the radio frequency identification tag in the action range of a radio frequency identification reader-writer so that the radio frequency identification reader-writer reads/writes the information stored in the radio frequency identification tag.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202111345950.4A CN114298263A (en) | 2021-11-15 | 2021-11-15 | Radio frequency identification tag, radio frequency identification system and method |
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| CN202111345950.4A CN114298263A (en) | 2021-11-15 | 2021-11-15 | Radio frequency identification tag, radio frequency identification system and method |
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| CN114298263A true CN114298263A (en) | 2022-04-08 |
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| CN202111345950.4A Pending CN114298263A (en) | 2021-11-15 | 2021-11-15 | Radio frequency identification tag, radio frequency identification system and method |
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| CN (1) | CN114298263A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080041868A (en) * | 2006-11-08 | 2008-05-14 | 포스데이타 주식회사 | Rfid tag and rfid system comprising the same |
| KR20150023992A (en) * | 2013-08-26 | 2015-03-06 | 이동희 | Label type metal RFID tag |
| KR101605191B1 (en) * | 2014-12-10 | 2016-03-22 | (주)알판트 | Multiple Attachments RFID tag With Dual Loop Operated In The UHF Band |
| JP2019194825A (en) * | 2018-04-26 | 2019-11-07 | コニカミノルタ株式会社 | Non-contact reading tag, method for manufacturing non-contact reading tag, determining device and identification information determining system |
| KR20200096890A (en) * | 2020-08-05 | 2020-08-14 | 이동희 | Label type metal RFID tag |
-
2021
- 2021-11-15 CN CN202111345950.4A patent/CN114298263A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080041868A (en) * | 2006-11-08 | 2008-05-14 | 포스데이타 주식회사 | Rfid tag and rfid system comprising the same |
| KR20150023992A (en) * | 2013-08-26 | 2015-03-06 | 이동희 | Label type metal RFID tag |
| KR101605191B1 (en) * | 2014-12-10 | 2016-03-22 | (주)알판트 | Multiple Attachments RFID tag With Dual Loop Operated In The UHF Band |
| JP2019194825A (en) * | 2018-04-26 | 2019-11-07 | コニカミノルタ株式会社 | Non-contact reading tag, method for manufacturing non-contact reading tag, determining device and identification information determining system |
| KR20200096890A (en) * | 2020-08-05 | 2020-08-14 | 이동희 | Label type metal RFID tag |
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