CN114297012B - Method and device for detecting equipment precision, electronic equipment and storage medium - Google Patents
Method and device for detecting equipment precision, electronic equipment and storage medium Download PDFInfo
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- CN114297012B CN114297012B CN202111666115.0A CN202111666115A CN114297012B CN 114297012 B CN114297012 B CN 114297012B CN 202111666115 A CN202111666115 A CN 202111666115A CN 114297012 B CN114297012 B CN 114297012B
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Abstract
The application provides a method and a device for detecting the precision of equipment, electronic equipment and a storage medium, wherein the method comprises the following steps: determining equipment to be detected in the test request, a first process line for detecting each equipment to be detected and a test piece bound for each first process line; for each test piece, controlling each device in the first process line to process the test piece to obtain a first processing result; if the first processing result does not meet the preset precision requirement, replacing a first process line corresponding to the first processing result with a second process line containing the equipment to be detected; binding a second test piece for each second process line; each device in a second process line bound by a second test piece is controlled to process the second test piece to obtain a second processing result; and determining the machining precision of the equipment to be detected according to the first machining result and the second machining result. By the method, the device can be automatically tested, and the device precision can be determined according to the test data.
Description
Technical Field
The present application relates to the field of chip manufacturing technologies, and in particular, to a method and an apparatus for detecting device accuracy, an electronic device, and a storage medium.
Background
With the continuous development of the integrated circuit manufacturing technology, the chip feature size is smaller and smaller, so the chip processing and manufacturing requirements are higher and higher, and thus, the equipment for processing the chip is required to have higher accuracy and precision, and the higher the precision of the equipment is, the higher the chip manufacturing process can be achieved. Therefore, whether the equipment to be detected after updating, maintaining and parameter adjusting can be put into mass production is determined according to the current precision of the equipment to be detected.
The inventor finds in research that in the prior art, people need to participate in testing the precision of the equipment, recording and analyzing the test data to obtain the precision of the equipment, and when a large number of detected equipment exist, the equipment needs to be checked one by one, so that the workload of people is large.
Disclosure of Invention
In view of this, embodiments of the present application provide a method and an apparatus for detecting device accuracy, an electronic device, and a storage medium, so as to automatically test a device and determine device accuracy according to test data.
In a first aspect, an embodiment of the present application provides a method for detecting accuracy of a device, where the method includes:
after receiving a test request sent by a user side, determining at least one device to be tested in the test request, a first process line for detecting each device to be tested and a test piece bound for each first process line; each first process line comprises a device to be detected and auxiliary equipment for matching with the device to be detected to execute processing actions;
for each test piece, controlling each device in a first process line corresponding to the test piece to process the test piece to obtain a first processing result;
if the first processing result does not meet the preset precision requirement, replacing a first process line corresponding to the first processing result with a second process line containing the equipment to be detected; the auxiliary equipment in the second process line is different from the auxiliary equipment in the first process line;
binding a second test piece for each second process line;
for each second test piece, controlling each device in a second process line bound by the second test piece to process the second test piece to obtain a second processing result;
and determining the machining precision of the equipment to be detected according to the first machining result and the second machining result.
In a possible embodiment, before receiving the test request sent by the user terminal, the method further includes:
after receiving an inquiry request from a user side, acquiring at least one process line containing equipment to be detected aiming at each equipment to be detected in the inquiry request;
according to the machining precision requirement of each process line and the importance of the process line in the whole machining link, carrying out priority sequencing on at least one process line;
and sending the priority sequence corresponding to each device to be detected to the user side so as to display a display interface containing the priority sequence on the user side.
In one possible embodiment, the second process line is a first process line in the prioritization after the first process line.
In a possible embodiment, after obtaining the second processing result, the method further comprises:
if the first processing result does not meet a preset precision requirement and the second processing result meets the preset precision requirement, determining at least one different auxiliary device in the first process line and the second process line;
and marking the label to be detected for the at least one different auxiliary device, so that the auxiliary device carrying the label to be detected is used as a new device to be detected.
In one possible embodiment, when the first process line performs the processing action as grinding the test strip, the method further comprises:
measuring a first thickness value and a first uniformity of the test piece before processing;
measuring a second thickness value and a second uniformity of the processed test piece;
and obtaining the first processing result according to a first difference value between the second thickness value and the first thickness value and a second difference value between the second uniformity and the first uniformity.
In a second aspect, an embodiment of the present application further provides an apparatus for detecting accuracy of a device, where the apparatus includes:
the first determining unit is used for determining at least one device to be tested in the test request, a first process line for detecting each device to be tested and a test piece bound for each first process line after receiving the test request sent by the user side; each first process line comprises a device to be detected and auxiliary equipment for matching with the device to be detected to execute processing actions;
the first control unit is used for controlling each device in a first process line corresponding to each test piece to process the test piece so as to obtain a first processing result;
the route switching unit is used for replacing a first process line corresponding to the first processing result with a second process line containing the equipment to be detected if the first processing result does not meet the preset precision requirement; the auxiliary equipment in the second process line is different from the auxiliary equipment in the first process line;
the binding unit is used for binding a second test piece for each second process line;
the second control unit is used for controlling each device in a second process line bound by each second test piece to process the second test piece so as to obtain a second processing result;
and the second determining unit is used for determining the machining precision of the equipment to be detected according to the first machining result and the second machining result.
In one possible embodiment, the apparatus further comprises:
the device comprises an acquisition unit, a processing unit and a processing unit, wherein the acquisition unit is used for acquiring at least one process line containing equipment to be detected aiming at each equipment to be detected in an inquiry request after the inquiry request is received from a user side before a test request sent by the user side is received;
the sequencing unit is used for carrying out priority sequencing on at least one process line according to the processing precision requirement of each process line and the importance of the process line in the whole processing link;
and the sending unit is used for sending the priority sequence corresponding to each device to be detected to the user side so as to display a display interface containing the priority sequence on the user side.
In one possible embodiment, the second process line is a first process line in the prioritization after the first process line.
In one possible embodiment, the apparatus further comprises:
a third determining unit, configured to determine, after a second processing result is obtained, if the first processing result does not meet a preset accuracy requirement and the second processing result meets the preset accuracy requirement, at least one different auxiliary device in the first process line and at least one different auxiliary device in the second process line;
and the marking unit is used for marking the label to be detected for the at least one different auxiliary device so as to take the auxiliary device carrying the label to be detected as a new device to be detected.
In one possible embodiment, the apparatus further comprises:
the first measuring unit is used for measuring a first thickness value and a first uniformity of the test piece before processing when the processing action executed by the first process line is used for grinding the test piece;
the second measuring unit is used for measuring a second thickness value and a second uniformity of the processed test piece when the processing action executed by the first process line is used for grinding the test piece;
and the calculating unit is used for obtaining the first processing result according to a first difference value between the second thickness value and the first thickness value and a second difference value between the second uniformity and the first uniformity.
In a third aspect, an embodiment of the present application further provides an electronic device, including: a processor, a storage medium and a bus, wherein the storage medium stores machine-readable instructions executable by the processor, when the electronic device runs, the processor and the storage medium communicate with each other through the bus, and the processor executes the machine-readable instructions to perform the steps of the method for detecting the accuracy of the device according to any one of the first aspect.
In a fourth aspect, the present application further provides a computer-readable storage medium, on which a computer program is stored, where the computer program is executed by a processor to perform the steps of the method for detecting the accuracy of a device according to any one of the first aspect.
According to the method, the device, the electronic equipment and the storage medium for detecting the equipment precision, after a test request sent by a user side is received, at least one equipment to be detected in the test request, a first process line for detecting each equipment to be detected and a test piece bound for each first process line are determined; each first process line comprises a device to be detected and auxiliary equipment for matching with the device to be detected to execute processing actions; for each test piece, controlling each device in a first process line corresponding to the test piece to process the test piece to obtain a first processing result; if the first processing result does not meet the preset precision requirement, replacing a first process line corresponding to the first processing result with a second process line containing the equipment to be detected; the auxiliary equipment in the second process line is different from the auxiliary equipment in the first process line; binding a second test piece for each second process line; for each second test piece, controlling each device in a second process line bound by the second test piece to process the second test piece to obtain a second processing result; and determining the machining precision of the equipment to be detected according to the first machining result and the second machining result. Compared with the scheme that the precision of the equipment needs to be artificially tested, the precision of the equipment needs to be artificially recorded and analyzed in the prior art, the method and the device can automatically test the equipment after a user submits a test request, the precision of the equipment is determined according to the test data, and the artificial workload is reduced.
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
To more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and those skilled in the art can also obtain other related drawings based on the drawings without inventive efforts.
Fig. 1 shows a flowchart of a method for detecting accuracy of a device according to an embodiment of the present application.
Fig. 2 shows a flowchart of a sorting method provided in an embodiment of the present application.
Fig. 3 shows a schematic structural diagram of an apparatus for detecting accuracy of a device provided in an embodiment of the present application.
Fig. 4 shows a schematic structural diagram of an electronic device provided in an embodiment of the present application.
Detailed Description
In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it should be understood that the drawings in the present application are for illustrative and descriptive purposes only and are not used to limit the scope of protection of the present application. Additionally, it should be understood that the schematic drawings are not necessarily drawn to scale. The flowcharts used in this application illustrate operations implemented according to some embodiments of the present application. It should be understood that the operations of the flow diagrams may be performed out of order, and steps without logical context may be performed in reverse order or simultaneously. In addition, one skilled in the art, under the guidance of the present disclosure, may add one or more other operations to the flowchart, or may remove one or more operations from the flowchart.
In addition, the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present application without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that in the embodiments of the present application, the term "comprising" is used to indicate the presence of the features stated hereinafter, but does not exclude the addition of further features.
It should be noted that the apparatuses, electronic devices, and the like according to the embodiments of the present application may be executed on a single server or may be executed in a server group. The server group may be centralized or distributed. In some embodiments, the server may be local or remote to the terminal. For example, the server may access information and/or data stored in the service requester terminal, the service provider terminal, or the database, or any combination thereof, via the network. As another example, the server may be directly connected to at least one of the service requester terminal, the service provider terminal and the database to access the stored information and/or data. In some embodiments, the server may be implemented on a cloud platform; by way of example only, the cloud platform may include a private cloud, a public cloud, a hybrid cloud, a community cloud (community cloud), a distributed cloud, an inter-cloud, a multi-cloud, and the like, or any combination thereof.
Fig. 1 shows a flowchart of a method for detecting accuracy of a device according to an embodiment of the present application, where as shown in fig. 1, the method includes the following steps:
Specifically, the user side includes a display screen for providing the user side for issuing a control request or a test request. The test request is generated by the operation of a user at a user terminal and comprises at least one device to be detected, a first process circuit selected for each device to be detected and a test piece bound for each first process circuit. Each first process line only comprises one device to be detected, and the other auxiliary devices are devices which pass the detection. Each test piece is provided with an identity, the first process line selected in each test request is also provided with a unique identity, and each first process line in the test request is bound with the identity of the test piece to obtain the corresponding relation between the test piece and the first process line. Specifically, each first process line may be bound with one test strip, or may be bound with a plurality of test strips, and when a plurality of test strips are bound, the purpose is to perform multiple processes in the first process line.
Taking a wafer fabrication process of 200mm cmos chips as an example, the fabrication process of semiconductor chips involves specific steps such as cvd, optical development, and cmp, wherein cvd is a technique used to deposit a film, which may be a dielectric material or a semiconductor, during the fabrication of microelectronic devices. The physical vapor deposition technique uses inert gas to impact the sputtering target material to deposit the required material on the wafer surface. The high temperature and vacuum environment in the process reaction chamber can make the metal atoms form crystal grains, and the required conductive circuit is obtained after patterning and etching; optical development is the transfer of the pattern on the mask to the film. Optical development generally includes photoresist coating, baking, photo-alignment, exposure, and development. Dry etching is the most common etching method, and uses gas as the main etching medium to drive the reaction by plasma. Etching is to remove some unwanted material from the surface; chemical Mechanical Polishing (CMP) is a technique combining Mechanical Polishing and acid-base solution type Chemical Polishing, and can make the surface of a wafer flat and facilitate the subsequent processes. During polishing, the slurry is between the wafer and the polishing pad. The factors affecting the cmp are: pressure of the polishing head and wafer flatness, rotational speed, slurry chemistry, etc.
Therefore, if the device to be tested is a chemical mechanical polishing device and a preparation work (for example, a round edge process) is required to be performed on the test piece before performing the chemical mechanical polishing, the device for performing the round edge operation on the test piece is an auxiliary device, wherein the round edge refers to: in order to avoid the influence of edge chipping on the strength of the wafer, damage to the surface smoothness of the wafer and bring pollution particles to the subsequent process, the edge shape and the outer diameter size of the wafer must be automatically trimmed by special computer control equipment. Therefore, the test piece subjected to the round edge operation is ground to obtain the ground test piece, and the problem that the process precision does not reach the standard due to the fact that no previous process operation is carried out is solved.
It should be noted that, if no auxiliary device is needed, the first process line only includes the device to be detected, and the device to be detected is used to directly process the test piece.
And 102, controlling each device in a first process line corresponding to each test piece to process the test piece so as to obtain a first processing result.
Specifically, after each device to be detected, the first process line corresponding to each device to be detected, and the test piece bound to each first process line are determined according to step 102, each device in the first process line bound to the test piece is determined for each test piece.
And controlling each device to process the test piece, and acquiring a first processing result of the test piece after the test piece completes the first process line. The first processing result can be obtained by shooting, measuring, equipment parameter acquisition and the like.
103, if the first processing result does not meet the preset precision requirement, replacing a first process line corresponding to the first processing result with a second process line containing the equipment to be detected; the auxiliary equipment in the second process line is different from the auxiliary equipment in the first process line.
Specifically, the preset precision requirement is preset, and after all the processes in the first process line are executed, the preset precision requirement corresponding to the last execution process in the first process line is determined by taking the last execution process as a standard; for each test piece, when a first processing result obtained after a first process line bound by the test piece processes the test piece does not meet a preset precision requirement, at least one device in the first process line is considered to be not in accordance with the processing requirement of a wafer manufacturing process, and in order to eliminate interference of other devices, the first process line is switched to a second process line containing the device to be detected. The equipment to be detected in the first process line and the second process line is not replaced, other auxiliary equipment is replaced, and the equipment precision of the auxiliary equipment in the second process line and the equipment precision of the auxiliary equipment in the first process line can be the same or different. It should be noted that the auxiliary equipment in the second process line may also be the same as the auxiliary equipment in the first process line, and when the auxiliary equipment in the second process line is the same as the auxiliary equipment in the first process line, a user may adjust the processing parameters of the equipment according to the provided first interface, and process the test piece in the second process line based on the processing parameters.
And step 104, binding a second test piece for each second process line.
Specifically, when it is determined according to step 103 that the first processing result of each device on the test piece in the first process line does not meet the preset precision requirement, a new test piece needs to be bound again for processing test, and the binding relationship between the test piece and the second process line is added to the execution log generated for the test request. In a specific implementation process, the second process line is automatically selected, the selection data of the second process line and the display data of the binding relationship between the second process line and the second test piece can be sent to the user side to remind the user, and when the user disagrees with the binding relationship or disagrees with the selection of the second process line, the adjustment can be performed according to a display interface of the user side.
In step 101, it is mentioned that there may be one or multiple test strips bound for each first process line, and when there are multiple test strips bound for the first process line, the binding relationship between one of the test strips and the first process line may be changed to the binding relationship between the test strip and the second process line, and a new test strip does not need to be obtained again; or automatically acquiring a new test piece, binding the new test piece to the second process line, and adjusting according to actual conditions without changing the test times of the first process line set by a user in the test request.
And 105, controlling each device in a second process line bound by each second test piece to process the second test piece so as to obtain a second processing result.
Specifically, the method for testing each second test strip is the same as the testing method in step 102, and the specific implementation process is not described again, and a second processing result for each second test strip is obtained according to step 105.
And 106, determining the machining precision of the equipment to be detected according to the first machining result and the second machining result.
Specifically, after the first processing result and the second processing result are obtained according to steps 102 to 105, the processing precision of the device to be detected is determined according to the first processing result and the second processing result. Specifically, the method for determining the machining accuracy includes: and acquiring first processing results or second processing results of all test pieces passing through the equipment to be detected. Determining each first processing precision according to each first processing result corresponding to the equipment to be detected, and determining each second processing precision according to each second processing result corresponding to the equipment to be detected; and according to each first machining precision and each second machining precision corresponding to the equipment to be detected. And determining the processing precision of the equipment to be detected according to the first average value of the first processing precision, the second average value of the second processing precision and the number of the second processing results. The weights may be set for the first machining accuracy, the second machining accuracy, and the number of the second machining results. When the number of the second processing results is more, the times representing that the first processing results do not meet the processing precision requirement are more, and the processing precision of the equipment to be detected is lower.
After the machining precision of the equipment to be detected is determined, whether the equipment to be detected passes the detection is determined according to the machining precision, and if the machining precision of the equipment to be detected is greater than or equal to the machining precision requirement preset for the equipment, a label which is qualified in detection is marked for the equipment to be detected; and if the machining precision of the equipment to be detected is smaller than the machining precision requirement of damaged equipment, marking a label which is unqualified for detection for the equipment to be detected.
It should be noted that, if only the equipment to be detected is in the first process line, and no auxiliary equipment is provided, the first process line does not need to be replaced, and the label that is "unqualified for detection" is directly marked for the equipment to be detected. Or binding the target number of test pieces for the equipment to be detected again, and determining whether the machining precision of the equipment to be detected meets the standard or not according to the machining results of all the test pieces. And if the equipment to be detected does not meet the standard, marking a label which is unqualified in detection for the equipment to be detected. Or if the first processing results meet the preset precision requirement, determining a target test piece of which each first processing result in the test request meets the preset precision requirement; marking each target test strip with a "process-qualified" label; determining the target to-be-detected equipment in the first process line corresponding to each target test piece and the number of the target test pieces carrying qualified processing, which are obtained by processing each target to-be-detected equipment; and if the ratio of the number to the number of the test pieces bound for the first process line corresponding to the equipment to be detected exceeds a preset ratio, marking a qualified label for the equipment to be detected.
According to the method for detecting the precision of the equipment, after a test request sent by a user side is received, at least one equipment to be detected, a first process line for detecting each equipment to be detected and a test piece bound for each first process line in the test request are determined; each first process line comprises a device to be detected and auxiliary equipment for matching with the device to be detected to execute processing actions; for each test piece, controlling each device in a first process line corresponding to the test piece to process the test piece so as to obtain a first processing result; if the first processing result does not meet the preset precision requirement, replacing a first process line corresponding to the first processing result with a second process line containing the equipment to be detected; the auxiliary equipment in the second process line is different from the auxiliary equipment in the first process line; binding a second test piece for each second process line; for each second test piece, controlling each device in a second process line bound by the second test piece to process the second test piece to obtain a second processing result; and determining the machining precision of the equipment to be detected according to the first machining result and the second machining result. Compared with the scheme that the precision of the equipment needs to be artificially tested by recording and analyzing the test data, the precision of the equipment needs to be obtained, the method provided by the embodiment of the application can automatically test the equipment after a user submits a test request, automatically determines the precision of the equipment according to the test data, and reduces the artificial workload.
In a possible implementation, fig. 2 shows a flowchart of a sorting method provided in the embodiment of the present application, and as shown in fig. 2, before performing step 101, the method further includes the following steps:
Specifically, the query request includes at least one device to be detected, that is, device identification information that the user wants to detect, which is submitted by the user at the user side. And determining each process line associated with the equipment to be detected according to the equipment identification information provided by the user in the inquiry request. All process lines required to pass through in the wafer processing process are preset in the system.
It should be noted that the processing steps performed by the process lines formed by different equipment may be the same or different. For example, for the process lines involved in the polishing process, the devices used for completing polishing are a first polishing device, a second polishing device and a third polishing device with different processing accuracies, and a first auxiliary device, a second auxiliary device, a third auxiliary device and a fourth auxiliary device used for assisting the polishing devices in completing polishing; the first auxiliary equipment and the third auxiliary equipment have the same function and different equipment identity marks; the second auxiliary device and the fourth auxiliary device are two devices with the same function and different device identification marks.
The first process line may be: the device comprises a first polishing device, a first auxiliary device and a second auxiliary device; the second process line may be: the second polishing device, the third auxiliary device and the fourth auxiliary device. The processes and roles of the first process line and the second process line are the same, but the processing accuracy of the first process line and the second process line is different because the accuracy of the first polishing apparatus and the second polishing apparatus is different.
Specifically, the importance of the process line in the whole processing link is preset, for example, some processing processes which are not very high in precision requirement are involved in the wafer processing process, such as a nitride precipitation process, and when the device to be detected is not a nitride precipitation device, but a nitride precipitation device is used as an auxiliary device, the priority of the process line including the nitride precipitation device is relatively low. Therefore, the process line with higher priority is preferentially displayed in the plurality of process lines including the equipment to be detected, so that a user can preferentially detect the process line with higher processing precision requirement and higher process importance when selecting the process line.
Specifically, after the priority ranking is completed, display data including the priority ranking is generated, and the display data is sent to the user side, so that a display interface including the priority ranking and each process line is displayed on the user side.
In a possible embodiment, when step 103 is executed to replace the first process line corresponding to the first processing result with the second process line containing the device to be tested, the method further includes the following steps: the second process line is a first process line in the prioritization after the first process line.
Specifically, according to the priority ranking sent to the user side in step 203, the first process line after the first process line in the priority ranking of the process lines corresponding to the same device to be detected is ranked.
In a possible embodiment, after obtaining the second processing result according to step 105, the method further comprises the steps of:
step 210, if the first processing result does not meet a preset precision requirement and the second processing result meets the preset precision requirement, determining at least one different auxiliary device in the first process line and the second process line; and marking the label to be detected for the at least one different auxiliary device, so that the auxiliary device carrying the label to be detected is used as a new device to be detected.
Specifically, if the first processing result does not meet the preset precision requirement, but the second processing result meets the preset precision requirement, it is indicated that the precision deficiency of the first processing result is not necessarily caused by the device to be detected, and may be caused by other auxiliary devices in the first process line, and it is necessary to determine different auxiliary devices in the first process line and the second process line, and mark the tag to be detected for the auxiliary devices. It should be noted that different auxiliary devices include devices with the same functionality, different device identities, or different device identities with different functionalities. It is to be noted that the device to be detected by the auxiliary device marked with the label to be detected is distinguished from the device to be detected by the non-auxiliary device, so that the detection regions for the auxiliary device and the non-auxiliary device can be separated.
In one possible embodiment, when the first process line performs a processing action as grinding of the test strip, the method further comprises the steps of:
and step 212, measuring a first thickness value and a first uniformity degree of the test piece before processing.
Specifically, the method for measuring the first thickness value and the first uniformity may adopt a contact detection method, a non-contact detection method, and the like, and in the specific implementation process, the non-contact detection method further includes a specific detection method such as an imaging detection method and a non-imaging detection method. The embodiment of the application does not limit the detection method, for example, the detection is performed by a sensor, and the thickness and the uniformity of the test piece are determined according to the value returned by the sensor. The first thickness value is used to represent the thickness of the test piece before processing.
The first uniformity is used for representing the surface flatness of the test piece before processing, and the detection method of the first uniformity comprises the following steps: a needle contact method and a non-contact method, the contact method being represented by the needle contact method; non-contact methods can be further classified into atomic force methods and optical methods. In particular applications, imaging and non-imaging can be distinguished. As its name implies, the needle touch method is a surface detection method which detects a material to be detected by a contact of a stylus with the material, and is relatively early in the manufacturing industry. The shape profile information of the surface to be measured is transmitted to the sensor by the stylus, so the size and shape of the stylus is particularly important. According to the detection principle of the needle touch method, the radius of the needle point approaches to 0, so that the real outline of the detected object can be detected. However, the thinner the tip of the stylus, the greater the pressure generated on the surface to be measured, and the stylus is susceptible to wear and damage the surface of the object to be measured. For the coating surface layer and the soft metal, the contact detection is easy to damage the surface layer of the tested sample, and is generally unusable. The scanning tunnel microscope uses quantum tunnel effect, and the needle point and the surface of the object to be measured are used as two poles. An extremely fine tip is used to approach the sample surface and when the distance is close, a tunnel junction is formed. Keeping the distance between the needle tip and the surface of the sample constant, enabling the needle tip to perform three-dimensional motion on the surface of the sample, transmitting the atomic height sensed by the needle tip into a computer, and obtaining the three-dimensional appearance of the surface of the measured object through post-processing. A first uniformity of the test piece is analyzed based on the three-dimensional topography.
And step 213, measuring a second thickness value and a second uniformity of the processed test piece.
Specifically, the method for measuring the second thickness value and the second uniformity is the same as the method for measuring the first thickness value and the first uniformity in step 212, and is not repeated here.
Step 214, obtaining the first processing result according to a first difference between the second thickness value and the first thickness value and a second difference between the second uniformity and the first uniformity.
Specifically, a first difference between the second thickness value and the first thickness value represents the grinding thickness of the equipment, so that whether the grinding precision of the equipment is within a standard range or not is determined according to the first difference. And a second difference between the second evenness and the first evenness represents whether the smoothness of the test piece is improved in the grinding process of the device. If the second uniformity of the test piece after grinding is lower than the first uniformity, the grinding precision of the device is lower. And determining a first processing result according to the first difference and the second difference. The second processing result is determined in the same manner as the first processing result.
Fig. 3 is a schematic structural diagram of an apparatus for detecting accuracy of a device according to an embodiment of the present application, where as shown in fig. 3, the apparatus includes: a first determining unit 301, a first controlling unit 302, a route switching unit 303, a binding unit 304, a second controlling unit 305, and a second determining unit 306.
A first determining unit 301, configured to determine, after receiving a test request sent by a user, at least one device to be tested in the test request, a first process line for detecting each device to be tested, and a test piece bound to each first process line; each first process line comprises a device to be detected and auxiliary equipment for matching the device to be detected to execute processing actions.
The first control unit 302 is configured to control, for each test strip, each device in the first process line corresponding to the test strip to process the test strip, so as to obtain a first processing result.
The route switching unit 303 is configured to, if the first processing result does not meet the preset precision requirement, replace the first process line corresponding to the first processing result with a second process line including the device to be detected; the auxiliary equipment in the second process line is different from the auxiliary equipment in the first process line.
And a binding unit 304, configured to bind a second test strip for each of the second process lines.
A second control unit 305, configured to, for each second test piece, control each device in the second process line to which the second test piece is bound to process the second test piece, so as to obtain a second processing result.
A second determining unit 306, configured to determine the processing accuracy of the device to be detected according to the first processing result and the second processing result.
In one possible embodiment, the apparatus further comprises:
the device comprises an acquisition unit and a processing unit, wherein the acquisition unit is used for acquiring at least one process line containing the equipment to be detected aiming at each equipment to be detected in an inquiry request after the inquiry request is received from a user side before the test request sent by the user side is received.
And the sequencing unit is used for sequencing the priority of the at least one process line according to the machining precision requirement of each process line and the importance of the process line in the whole machining link.
And the sending unit is used for sending the priority sequence corresponding to each device to be detected to the user side so as to display a display interface containing the priority sequence on the user side.
In one possible embodiment, the second process line is a first process line in the prioritization after the first process line.
In one possible embodiment, the apparatus further comprises:
and a third determining unit, configured to determine, after a second processing result is obtained, if the first processing result does not meet a preset accuracy requirement and the second processing result meets the preset accuracy requirement, at least one different auxiliary device in the first process line and at least one different auxiliary device in the second process line.
And the marking unit is used for marking the label to be detected for the at least one different auxiliary device so as to take the auxiliary device carrying the label to be detected as a new device to be detected.
In one possible embodiment, the apparatus further comprises:
the first measuring unit is used for measuring a first thickness value and a first uniformity of the test piece before processing when the processing action executed by the first process line is used for grinding the test piece.
And the second measuring unit is used for measuring a second thickness value and a second uniformity of the processed test piece when the processing action executed by the first process line is used for grinding the test piece.
And the calculating unit is used for obtaining the first processing result according to a first difference value between the second thickness value and the first thickness value and a second difference value between the second uniformity and the first uniformity.
According to the device for detecting the precision of the equipment, after a test request sent by a user side is received, at least one equipment to be detected, a first process line for detecting each equipment to be detected and a test piece bound for each first process line in the test request are determined; each first process line comprises a device to be detected and auxiliary equipment for matching with the device to be detected to execute processing actions; for each test piece, controlling each device in a first process line corresponding to the test piece to process the test piece so as to obtain a first processing result; if the first processing result does not meet the preset precision requirement, replacing a first process line corresponding to the first processing result with a second process line containing the equipment to be detected; the auxiliary equipment in the second process line is different from the auxiliary equipment in the first process line; binding a second test piece for each second process line; for each second test piece, controlling each device in a second process line bound by the second test piece to process the second test piece to obtain a second processing result; and determining the machining precision of the equipment to be detected according to the first machining result and the second machining result. Compared with the scheme that the precision of the equipment is obtained by artificially participating in precision and artificial recording and analyzing of the test data of the test equipment in the prior art, the device provided by the embodiment of the application can automatically test the equipment after a user submits a test request, and the precision of the equipment is determined according to the test data, so that the artificial workload is reduced.
Fig. 4 shows a schematic structural diagram of an electronic device provided in an embodiment of the present application, including: a processor 401, a storage medium 402 and a bus 403, wherein the storage medium 402 stores machine-readable instructions executable by the processor 401, when an electronic device executes a method for detecting device accuracy as in the embodiments, the processor 401 communicates with the storage medium 402 via the bus 403, and the processor 401 executes the machine-readable instructions to perform the steps as in the embodiments.
In an embodiment, the storage medium 402 may further execute other machine-readable instructions to perform other methods as described in the embodiments, and for the method steps and principles of specific execution, reference is made to the description of the embodiments, which is not described in detail herein.
Embodiments of the present application further provide a computer-readable storage medium, on which a computer program is stored, where the computer program is executed by a processor when the computer program is executed to perform the steps in the embodiments.
In the embodiments of the present application, when being executed by a processor, the computer program may further execute other machine-readable instructions to perform other methods as described in the embodiments, and for the method steps and principles of specific execution, reference is made to the description of the embodiments, and details are not repeated here.
In the several embodiments provided in the present application, it should be understood that the disclosed system, apparatus and method may be implemented in other ways. The above-described apparatus embodiments are merely illustrative, and for example, the division of the modules is merely a logical division, and there may be other divisions in actual implementation, and for example, a plurality of modules or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection of devices or modules through some communication interfaces, and may be in an electrical, mechanical or other form.
The modules described as separate parts may or may not be physically separate, and parts displayed as modules may or may not be physical units, may be located in one position, or may be distributed on multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
In addition, functional units in the embodiments of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit.
The functions, if implemented in software functional units and sold or used as a stand-alone product, may be stored in a non-transitory computer-readable storage medium executable by a processor. Based on such understanding, the technical solution of the present application or portions thereof that substantially contribute to the prior art may be embodied in the form of a software product stored in a storage medium and including instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method according to the embodiments of the present application. And the aforementioned storage medium includes: various media capable of storing program codes, such as a U disk, a removable hard disk, a ROM, a RAM, a magnetic disk, or an optical disk.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. A method of detecting accuracy of a device, the method comprising:
after receiving a test request sent by a user side, determining at least one device to be tested in the test request, a first process line for detecting each device to be tested and a test piece bound for each first process line; each first process line comprises a device to be detected and auxiliary equipment for matching with the device to be detected to execute processing actions;
for each test piece, controlling each device in a first process line corresponding to the test piece to process the test piece so as to obtain a first processing result;
if the first processing result does not meet the preset precision requirement, replacing a first process line corresponding to the first processing result with a second process line containing the equipment to be detected; the auxiliary equipment in the second process line is different from the auxiliary equipment in the first process line;
binding a second test piece for each second process line;
for each second test piece, controlling each device in a second process line bound by the second test piece to process the second test piece to obtain a second processing result;
determining the machining precision of the equipment to be detected according to the first machining result and the second machining result;
the determining the machining precision of the equipment to be detected according to the first machining result and the second machining result comprises the following steps:
determining each first processing precision according to each first processing result corresponding to the equipment to be detected, and determining each second processing precision according to each second processing result corresponding to the equipment to be detected;
and determining the machining precision of the equipment to be detected according to the first average value of the first machining precision, the second average value of the second machining precision and the number of the second machining results.
2. The method of claim 1, wherein before receiving the test request sent by the user side, the method further comprises:
after receiving an inquiry request from a user side, acquiring at least one process line containing equipment to be detected aiming at each equipment to be detected in the inquiry request;
according to the machining precision requirement of each process line and the importance of the process line in the whole machining link, carrying out priority sequencing on at least one process line;
and sending the priority sequence corresponding to each device to be detected to the user side so as to display a display interface containing the priority sequence on the user side.
3. The method of claim 2, wherein the second process line is a first process line in the prioritization after the first process line.
4. The method of claim 1, wherein after obtaining a second processing result, the method further comprises:
if the first processing result does not meet a preset precision requirement and the second processing result meets the preset precision requirement, determining at least one different auxiliary device in the first process line and the second process line;
and marking the label to be detected for the at least one different auxiliary device, so that the auxiliary device carrying the label to be detected is used as a new device to be detected.
5. The method of claim 1, wherein when the first process line performs the machining action as grinding the test strip, the method further comprises:
measuring a first thickness value and a first uniformity of the test piece before processing;
measuring a second thickness value and a second uniformity of the processed test piece;
and obtaining the first processing result according to a first difference value between the second thickness value and the first thickness value and a second difference value between the second uniformity and the first uniformity.
6. An apparatus for detecting accuracy of a device, the apparatus comprising:
the first determining unit is used for determining at least one device to be tested in the test request, a first process line for detecting each device to be tested and a test piece bound for each first process line after receiving the test request sent by the user side; each first process line comprises a device to be detected and auxiliary equipment for matching with the device to be detected to execute processing actions;
the first control unit is used for controlling each device in the first process line corresponding to each test piece to process the test piece so as to obtain a first processing result;
the route switching unit is used for replacing a first process line corresponding to the first processing result with a second process line containing the equipment to be detected if the first processing result does not meet the preset precision requirement; the auxiliary equipment in the second process line is different from the auxiliary equipment in the first process line;
the binding unit is used for binding a second test piece for each second process line;
the second control unit is used for controlling each device in a second process line bound by each second test piece to process the second test piece so as to obtain a second processing result;
the second determining unit is used for determining the machining precision of the equipment to be detected according to the first machining result and the second machining result;
when the second determining unit is configured to determine the machining precision of the device to be detected according to the first machining result and the second machining result, the second determining unit is specifically configured to:
determining each first processing precision according to each first processing result corresponding to the equipment to be detected, and determining each second processing precision according to each second processing result corresponding to the equipment to be detected;
and determining the machining precision of the equipment to be detected according to the first average value of the first machining precision, the second average value of the second machining precision and the number of the second machining results.
7. The apparatus of claim 6, further comprising:
the device comprises an acquisition unit, a processing unit and a processing unit, wherein the acquisition unit is used for acquiring at least one process line containing equipment to be detected aiming at each equipment to be detected in an inquiry request after the inquiry request is received from a user side before the test request sent by the user side is received;
the sequencing unit is used for carrying out priority sequencing on at least one process line according to the processing precision requirement of each process line and the importance of the process line in the whole processing link;
and the sending unit is used for sending the priority sequence corresponding to each device to be detected to the user side so as to display a display interface containing the priority sequence on the user side.
8. The apparatus of claim 6, further comprising:
a third determining unit, configured to determine, after a second processing result is obtained, if the first processing result does not meet a preset accuracy requirement and the second processing result meets the preset accuracy requirement, at least one different auxiliary device in the first process line and at least one different auxiliary device in the second process line;
the marking unit is used for marking the label to be detected for the at least one different auxiliary device so as to take the auxiliary device carrying the label to be detected as a new device to be detected.
9. An electronic device, comprising: a processor, a storage medium and a bus, the storage medium storing machine-readable instructions executable by the processor, the processor and the storage medium communicating via the bus when the electronic device is running, the processor executing the machine-readable instructions to perform the steps of the method of detecting the accuracy of the device according to any one of claims 1 to 5.
10. A computer-readable storage medium, having stored thereon a computer program which, when being executed by a processor, carries out the steps of a method of detecting the accuracy of a device according to any one of claims 1 to 5.
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| JP2018049492A (en) * | 2016-09-23 | 2018-03-29 | 富士通株式会社 | Analysis device, analysis program and analysis method |
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