CN114296261A - Chip integrated microwave quantum signal conversion method - Google Patents
Chip integrated microwave quantum signal conversion method Download PDFInfo
- Publication number
- CN114296261A CN114296261A CN202111421935.3A CN202111421935A CN114296261A CN 114296261 A CN114296261 A CN 114296261A CN 202111421935 A CN202111421935 A CN 202111421935A CN 114296261 A CN114296261 A CN 114296261A
- Authority
- CN
- China
- Prior art keywords
- microwave
- signal
- quantum
- signals
- waveguide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
Abstract
The invention discloses a conversion method of a chip integrated microwave quantum signal, wherein the surface of a chip integrated waveguide is covered with a coating structure capable of sensing an electromagnetic signal, the coating structure absorbs the microwave signal and changes the refractive index of the chip integrated waveguide, an optical carrier signal in a non-coding light quantum form passes through the refractive index of the chip integrated waveguide and converts the microwave signal into a light quantum signal, the light quantum signal is obtained through single photon detection, and the conversion of the light quantum signal into the microwave signal is realized through electrically driving a microwave source. The invention can provide intercommunication and interconnection means for microwave domain equipment such as microwave communication, microwave radar and the like and quantum communication, quantum sensor and other sub-domain equipment, greatly expands the application scope of microwave photon thought, and promotes the subversive change of the performance indexes of the existing communication and detection equipment.
Description
Technical Field
The invention belongs to the interdisciplinary field of integrated optics, quantum optics and microwave photonics, in particular to a method for converting a microwave signal into a light quantum signal by receiving the microwave signal through a coating material to adjust the refractive index of an integrated waveguide of a chip and realizing the conversion from the light quantum signal to the microwave signal through single photon detection and electric drive of a microwave source, and particularly relates to a method and a system for converting the chip integrated microwave quantum signal and a storage medium.
Background
With the rapid development of 5G communication technology, the development and utilization of millimeter waves, sub-millimeter waves and even terahertz waves have become inevitable. Limited by the transit time of electrons, the conventional electronic devices and electronic systems are difficult to adapt to the requirements of generation, transmission and processing of ultrahigh frequency microwaves. In order to solve the problem of electronic bottleneck, researchers develop a new method for converting high-frequency microwave signals into optical wave bands to be processed, and a new cross discipline, namely microwave photonics, is derived. The microwave photonic system has small volume, light weight, low power consumption, large bandwidth, parallel operation and electromagnetic interference resistance, and can provide a brand new technical solution for ultra-wideband wireless access, ultra-high frequency microwave transceiving, multi-band synthetic aperture radar and the like.
In the field of wireless communication, the greatest contribution of microwave photonics is to provide a high-speed microwave signal processing method, i.e., a microwave signal is modulated on an optical carrier and processed by an all-optical signal processing system. The eigenfrequency of the optical field is far higher than that of microwave, and one path of optical carrier can simultaneously bear multiple paths of microwave signals; due to the fact that the photoelectric device manufacturing process is mature day by day and the deep development of the modular photoelectric information system is advanced, the chip integrated all-optical signal processing system is also from the concept design to the device breakthrough to the complete machine integration. On the other hand, the microwave photonic system can establish an effective communication means for a wireless communication system and a quantum communication system, can effectively combine the inherent random access and long-distance propagation characteristics of microwave signals and the unique high sensitivity and high safety attributes of quantum signals, and promotes a new discipline, namely microwave quantum science.
Disclosure of Invention
Based on the problems of the prior art, the technical problems to be solved by the invention are as follows: how to cover the surface of the chip integrated waveguide with a coating material capable of sensing electromagnetic signals, realizing the adjustment of the refractive index of the chip integrated waveguide by absorbing microwave signals and converting the microwave signals into free carriers through a coating structure, converting optical carriers existing in a non-coding light quantum form into quantum signals under the influence of refractive index changes, detecting the quantum signals through a decoding system and a single photon detector and converting the quantum signals into microwave signals through an electric drive microwave source, thereby realizing the high-efficiency Huhu conversion of the microwave signals and the quantum signals.
Aiming at the defects in the prior art, the invention aims to provide a conversion method of a chip integrated microwave quantum signal, wherein a coating material capable of sensing an electromagnetic signal is covered on the surface of a chip integrated waveguide, the adjustment of the refractive index of the chip integrated waveguide is realized through a free carrier generated after a coating structure absorbs the microwave signal, the phase change of a non-coding light quantum is caused by the refractive index change, and the microwave signal is compiled into a quantum signal; the quantum signals are converted into binary electrical signals through decoding and single photon detection, and the electrical signals are converted into microwave signals through electrically driving a microwave source.
Preferably, a plating layer capable of sensing electromagnetic signals is covered on the upper surface of the silicon-based waveguide; the coating layer senses the intensity change of the microwave signal and is repeatedly engraved into the change of the free carrier concentration, the change of the free carrier concentration of the coating layer causes the change of the refractive index of the silicon-based waveguide, and at the moment, a certain optical degree of freedom of the uncoded photon signal is changed, so that the conversion of the microwave signal to the photon signal is realized.
Preferably, the polarization-encoded quantum signal is divided into two beams by the polarization beam splitter, the two beams are respectively detected by the two independent single-photon detectors, the polarization distribution of the quantum signal is analyzed according to the time sequence of the detection result of the single-photon detectors, namely, the electrical signal of the binary encoding is obtained, and the microwave of the binary encoding is transmitted by the electrically-driven microwave source, so that the conversion from the quantum signal to the microwave signal is realized.
Preferably, the specific freedom of the single photon sequence is converted into specific parameters which can be identified by the single photon detector and the time analyzer through analysis, the quantum signal is effectively detected through single photon detection and time analysis, the result is compiled into a binary electrical signal, and the microwave source is driven through the electrical signal to generate the required microwave signal.
Preferably, the method specifically comprises:
s101, microwave signal vector quantum signal conversion is carried out, a coating material capable of sensing electromagnetic signals covers the surface of the chip integrated waveguide, the adjustment of the refractive index of the chip integrated waveguide is realized through free carriers generated after the coating structure absorbs the microwave signals, the phase change of uncoded light quanta is caused by the refractive index change, and the microwave signals are compiled into quantum signals;
and S102, converting the quantum signals into microwave signals, converting the quantum signals into binary electrical signals through a decoding system and a single photon detector, and converting the electrical signals into microwave signals through an electrically driven microwave source.
Preferably, the method specifically comprises:
s201, preparing a transmission waveguide required by quantum signal compiling, optimally designing a cross section structure to enable transmission loss to be low and waveguide refractive index to be sensitively changed, optimally designing waveguide length to give consideration to second transmission loss and large modulation depth, optimally designing waveguide space arrangement to enable a coating to cover as accurately as possible, and optimally designing a device structure to enable specific freedom degree of a non-coding quantum signal to be modulated according to requirements;
s202, transferring a coating material sensitive to electromagnetic signals to the surface of a waveguide without damage, and optimally designing the thickness of the coating to enable the concentration of free carriers generated by microwave signals of unit electric field intensity of a specific waveband to be maximum and the dissipation time to be shortest;
s203, preparing a transmission waveguide required by quantum signal decoding, and converting the quantum signal coding freedom into parameters such as detection paths, arrival time and the like which can be identified by a single photon detector and a time analyzer;
s204, converting the microwave signals into quantum signals according to the sequence of the free carrier concentration of the coating → the refractive index of the waveguide → the optical degree of freedom, and converting the quantum signals into the microwave signals according to the sequence of the optical degree of freedom → the single photon detection result → the time analysis result → the driving voltage of the microwave source.
Preferably, the plating layer is closely attached to the upper surface and the side surfaces of the waveguide or closely attached to the upper surface.
Preferably, the time analyzer converts the detection result of the single photon detector into a driving signal for electrically driving the microwave source and generates a binarily encoded microwave signal.
A system for realizing the above chip integrated microwave quantum signal conversion method comprises a silicon-based waveguide with a surface covered by a coating, a decoding system, a time analyzer, a single photon detector, a microwave signal to quantum signal conversion module and a quantum signal to microwave signal conversion module, wherein,
the microwave signal-to-quantum signal conversion module is used for covering a coating material capable of sensing electromagnetic signals on the surface of the chip integrated waveguide, adjusting the refractive index of the chip integrated waveguide by using a free carrier generated after the coating structure absorbs the microwave signals, wherein the change of the refractive index causes the phase change of uncoded optical quanta, and the microwave signals are compiled into quantum signals;
and the quantum signal-to-microwave signal conversion module is used for converting the quantum signals into binary electrical signals through the decoding system and the single photon detector and converting the electrical signals into microwave signals through the electric drive microwave source.
A computer-readable storage medium, on which a computer program is stored which, when being executed by a processor, carries out the above-mentioned method.
A computer program product comprising computer programs/instructions which, when executed by a processor, implement the steps of the above-described method.
Compared with the prior art, the invention has the following advantages:
1. the invention provides a microwave signal-quantum signal conversion method based on a chip integrated optical path, which simultaneously realizes the functions of an antenna and coding through the processes of coating electromagnetic perception → free carrier modulation → quantum coding and the like;
2. the invention provides a quantum signal-microwave signal conversion method based on a chip integrated optical circuit, which converts a quantum signal into a flexibly accessed microwave signal through a single photon detection and electric drive microwave source, has high compatibility with the preparation process of a chip integrated optical device by a selected technical route, and is particularly suitable for realizing a general photoelectric system with large system scale, complex structure function and numerous devices;
3. the invention provides a microwave quantum concept, provides an interconnection means for microwave domain equipment such as microwave communication and microwave radar and sub-domain equipment such as quantum communication and quantum sensors, greatly expands the application scope of microwave photon thought, and is expected to promote the subversive change of performance indexes of the existing communication and detection equipment.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the embodiments of the present invention will be briefly described below, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 shows a schematic diagram of the working principle of the conversion of the chip integrated microwave quantum signals.
Detailed Description
Features and exemplary embodiments of various aspects of the present invention will be described in detail below, and in order to make objects, technical solutions and advantages of the present invention more apparent, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not to be construed as limiting the invention. It will be apparent to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present invention by illustrating examples of the present invention.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The invention provides an embodiment of a conversion method of a chip integrated microwave quantum signal, wherein a coating material capable of sensing an electromagnetic signal is covered on the surface of a chip integrated waveguide, the adjustment of the refractive index of the chip integrated waveguide is realized through a free carrier generated after a coating structure absorbs the microwave signal, the phase change of uncoded light quantum is caused by the refractive index change, and the microwave signal is compiled into a quantum signal; the quantum signals are converted into binary electrical signals through decoding and single photon detection, and the electrical signals are converted into microwave signals through electrically driving a microwave source.
In some embodiments, the upper surface of the silicon-based waveguide is covered with a coating capable of sensing electromagnetic signals; the coating layer senses the intensity change of the microwave signal and is repeatedly engraved into the change of the free carrier concentration, the change of the free carrier concentration of the coating layer causes the change of the refractive index of the silicon-based waveguide, and at the moment, a certain optical degree of freedom of the uncoded photon signal is changed, so that the conversion of the microwave signal to the photon signal is realized.
In some embodiments, the polarization-encoded quantum signal is divided into two beams by the polarization beam splitter, the two beams are respectively detected by two independent single-photon detectors, the polarization distribution of the quantum signal is analyzed according to the time sequence of the detection result of the single-photon detectors, that is, the electrical signal of the binary encoding is obtained, and the microwave of the binary encoding is transmitted by the electrically-driven microwave source, so that the conversion from the quantum signal to the microwave signal is realized.
In some embodiments, the microwave source is driven by an electrical signal to generate the desired microwave signal by resolving the specific degrees of freedom of a single photon sequence into specific parameters that can be identified by the single photon detector and the time analyzer, effectively detecting the quantum signal by single photon detection and time analysis and compiling the result into a binarized electrical signal.
In some embodiments, the cladding layer conforms closely to the waveguide upper surface and side surfaces or to the upper surface.
In some embodiments, the time analyzer converts the single photon detector detection results into a drive signal that electrically drives the microwave source and generates a binarily encoded microwave signal.
The invention provides an embodiment of a chip integrated microwave quantum signal conversion method, which comprises the following steps:
s101, microwave signal vector quantum signal conversion is carried out, a coating material capable of sensing electromagnetic signals covers the surface of the chip integrated waveguide, the adjustment of the refractive index of the chip integrated waveguide is realized through free carriers generated after the coating structure absorbs the microwave signals, the phase change of uncoded light quanta is caused by the refractive index change, and the microwave signals are compiled into quantum signals;
and S102, converting the quantum signals into microwave signals, converting the quantum signals into binary electrical signals through a decoding system and a single photon detector, and converting the electrical signals into microwave signals through an electrically driven microwave source.
The invention provides an embodiment of a chip integrated microwave quantum signal conversion method, which comprises the following steps:
s201, preparing a transmission waveguide required by quantum signal compiling, optimally designing a cross section structure to enable transmission loss to be low and waveguide refractive index to be sensitively changed, optimally designing waveguide length to give consideration to second transmission loss and large modulation depth, optimally designing waveguide space arrangement to enable a coating to cover as accurately as possible, and optimally designing a device structure to enable specific freedom degree of a non-coding quantum signal to be modulated according to requirements;
s202, transferring a coating material sensitive to electromagnetic signals to the surface of a waveguide without damage, and optimally designing the thickness of the coating to enable the concentration of free carriers generated by microwave signals of unit electric field intensity of a specific waveband to be maximum and the dissipation time to be shortest;
s203, preparing a transmission waveguide required by quantum signal decoding, and converting the quantum signal coding freedom into parameters such as detection paths, arrival time and the like which can be identified by a single photon detector and a time analyzer;
s204, converting the microwave signals into quantum signals according to the sequence of the free carrier concentration of the coating → the refractive index of the waveguide → the optical degree of freedom, and converting the quantum signals into the microwave signals according to the sequence of the optical degree of freedom → the single photon detection result → the time analysis result → the driving voltage of the microwave source.
The invention provides an embodiment of a chip integrated microwave quantum signal conversion method, which comprises the following steps:
s301, preparing a transmission waveguide required by quantum signal compiling, wherein the cross section structure needs to be optimally designed to enable the transmission loss to be low and the refractive index of the waveguide to be sensitively changed, the waveguide length needs to be optimally designed to give consideration to the first transmission loss and the large modulation depth, the spatial arrangement of the waveguide needs to be optimally designed to enable a coating to be covered as accurately as possible, and the device structure needs to be optimally designed to enable the specific freedom (such as polarization, phase, arrival time and the like) of a non-coded quantum signal (single photon sequence) to be modulated as required;
s302, a coating material sensitive to electromagnetic signals is transferred to the surface of the waveguide in a lossless mode through a chemical vapor deposition method, the thickness of the coating needs to be optimally designed to enable the concentration of free carriers generated by microwave signals of unit electric field intensity of a specific waveband to be maximum and the dissipation time to be shortest, and the coating can be tightly attached to the upper surface and the side surface of the waveguide and can also be tightly attached to the upper surface;
s303, preparing a transmission waveguide required by quantum signal decoding, wherein the requirements are basically the same as the requirements of the previous steps, the encoding freedom degree of the quantum signal can be converted into parameters such as a detection path, arrival time and the like which can be identified by a single photon detector and a time analyzer, and the time analyzer can convert the detection result of the single photon detector into a driving signal of an electric driving microwave source and generate a binaryzation encoded microwave signal;
s304, the microwave signals can be converted into quantum signals according to the sequence of the free carrier concentration of the coating layer → the refractive index of the waveguide → the optical degree of freedom, and the quantum signals can be converted into the microwave signals according to the sequence of the optical degree of freedom → the single photon detection result → the time analysis result → the driving voltage of the microwave source.
The invention provides a system embodiment for realizing the chip integrated microwave quantum signal conversion method, which comprises a silicon-based waveguide with a coating covered on the surface, a decoding system, a time analyzer, a single photon detector, a microwave signal-to-quantum signal conversion module and a quantum signal-to-microwave signal conversion module, wherein,
the microwave signal-to-quantum signal conversion module is used for covering a coating material capable of sensing electromagnetic signals on the surface of the chip integrated waveguide, adjusting the refractive index of the chip integrated waveguide by using a free carrier generated after the coating structure absorbs the microwave signals, wherein the change of the refractive index causes the phase change of uncoded optical quanta, and the microwave signals are compiled into quantum signals;
and the quantum signal-to-microwave signal conversion module is used for converting the quantum signals into binary electrical signals through the decoding system and the single photon detector and converting the electrical signals into microwave signals through the electric drive microwave source.
As shown in fig. 1, a structural principle of a chip integrated microwave quantum signal conversion system is shown. The left side of the conversion method of the chip integrated microwave quantum signal is the process of converting the microwave signal into the quantum signal, and the right side is the process of converting the quantum signal into the microwave signal:
(1) the non-coding light quantum signal is transmitted along the silicon-based waveguide in the radial direction, and the upper surface of the silicon-based waveguide is covered with a coating capable of sensing electromagnetic signals; the coating layer senses the intensity change of the microwave signal and is repeatedly etched into the free carrier concentration change, the change of the free carrier concentration of the coating layer causes the refractive index change of the silicon-based waveguide, and at the moment, a certain optical degree of freedom (such as a polarization state) of the uncoded light quantum signal is changed, namely, the conversion from the microwave signal to the quantum signal is realized. The method not only executes the antenna function of microwave signal receiving, but also realizes the modulation function of quantum signal coding, can convert wireless communication signals into quantum communication signals, realizes optical fiber remote communication with safety property, can also convert microwave detection signals into quantum sensing signals, and provides a safety information sharing means for distributed detection.
(2) The polarization-encoded quantum signal is divided into two beams by the polarization beam splitter, the two beams are respectively detected by the two independent single-photon detectors, the polarization distribution of the quantum signal can be analyzed according to the time sequence of the detection result of the single-photon detectors, namely, the electrical signal of the binary encoding is obtained, the microwave of the binary encoding is sent by the electrically-driven microwave source, and the conversion from the quantum signal to the microwave signal is realized. It should be noted that the method can only generate digitally encoded microwave signals (rather than analog signals), that is, quantum communication signals can be converted into wireless communication signals, thereby realizing the mechanical-solid interconnection of the access nodes at the end of the high-security fixed network, and quantum sensing signals can also be converted into microwave communication signals, thereby realizing the high-precision cooperative sensing of random access and flexible transmission.
The invention provides an embodiment of a conversion method of a chip integrated microwave quantum signal, wherein a coating structure capable of sensing an electromagnetic signal covers the surface of a chip integrated waveguide, the coating structure absorbs the microwave signal and changes the refractive index of the chip integrated waveguide, an optical carrier signal in a non-coding light quantum form passes through the refractive index of the chip integrated waveguide and converts the microwave signal into a light quantum signal, the light quantum signal is obtained through single photon detection, and the conversion of the light quantum signal into the microwave signal is realized through electrically driving a microwave source.
In some embodiments, the chip integrated waveguide can be manufactured by a standard chip integrated optical circuit process, has a certain degree of freedom of structural design, can efficiently and losslessly transmit an optical field, and can generate refractive index change under the action of free carriers, and the material platform used by the chip integrated waveguide includes but is not limited to silicon on insulator, hydrogen-loaded amorphous silicon, silicon nitride, silicon carbide, chalcogenide glass, high-refractive-index quartz, gallium arsenic aluminum in three five groups, indium phosphide in three five groups, and the like, and can adopt a single material integration method or a multi-material mixed integration method.
In some embodiments, the coating can be transferred to the surface of the chip integrated waveguide without damage by a standard process and can be tightly attached by controlling parameters through a growth process, can accurately regulate and control parameters by taking a crystal structure and a layer thickness as degrees of freedom, can absorb electromagnetic wave signals of a specific waveband and generate free carriers, can quickly dissipate the free carriers, and the concentration of the free carriers is sensitively related to the conductivity and the refractive index, without limiting the specific details of the coating structure parameters, the chemical components and the preparation process.
In some embodiments, the microwave signal is converted into a quantum signal, the cladding absorbs the microwave signal and converts the microwave signal into a free carrier concentration change, and the refractive index of the chip integrated waveguide covered by the cladding changes and influences the specific degree of freedom of a quantum signal carrier, i.e. a single photon sequence.
In some embodiments, the degrees of freedom include, but are not limited to, phase, intensity, polarization, mode, etc., without limitation to waveguide structure parameters and growth process, without limitation to specific wavebands of microwave signals, specific wavelengths of quantum signals, etc., without limitation to the source of microwave signals and the destination of quantum signals, without limitation to specific application.
In some embodiments, the conversion of the quantum signal into the microwave signal can convert the specific degree of freedom of the single photon sequence into specific parameters which can be identified by the single photon detector and the time analyzer through the analytic system, the quantum signal can be effectively detected through the single photon detector and the time analyzer, the result can be compiled into a binary electrical signal, and the microwave source can be driven through the electrical signal to generate the required microwave signal.
In some embodiments, the specific structure of the analytical system, the parameters of the single photon detector, the operation mode of the time analyzer, and the specific parameters of the electrically driven microwave source are not limited. The source of the quantum signal and the destination of the microwave signal are not limited, and the specific application mode is not limited.
The invention also provides an embodiment of a computer-readable storage medium, on which a computer program is stored which, when being executed by a processor, carries out the above-mentioned method.
The invention also provides an embodiment of a computer program which, when executed by a processor, implements the above method.
Compared with the prior art, the invention has the following advantages:
the invention provides a microwave signal-quantum signal conversion method based on a chip integrated optical path, which realizes the antenna and coding functions simultaneously through the processes of coating electromagnetic perception → free carrier modulation → quantum coding and the like;
secondly, the invention provides a quantum signal-microwave signal conversion method based on a chip integrated optical circuit, which converts quantum signals into flexibly accessed microwave signals through single photon detection and electric drive microwave sources, has high compatibility with the preparation process of a chip integrated optical device by a selected technical route, and is particularly suitable for realizing a general photoelectric system with large system scale, complex structure function and numerous devices;
in addition, the invention provides a microwave quantum concept, provides an interconnection means for microwave domain equipment such as microwave communication and microwave radar and sub-domain equipment such as quantum communication and quantum sensors, greatly expands the application scope of the microwave photon idea, and is expected to promote the subversive change of the performance indexes of the existing communication and detection equipment.
For convenience of description, the above devices are described as being divided into various units by function, and are described separately. Of course, the functionality of the units may be implemented in one or more software and/or hardware when implementing the present application.
As will be appreciated by one skilled in the art, embodiments of the present invention may be provided as a method, system, or computer program product. Accordingly, the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present invention may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.
The present invention is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the invention. It will be understood that each flow and/or block of the flow diagrams and/or block diagrams, and combinations of flows and/or blocks in the flow diagrams and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
The application may be described in the general context of computer-executable instructions, such as program modules, being executed by a computer. Generally, program modules include routines, programs, objects, components, data structures, etc. that perform particular tasks or implement particular abstract data types. The application may also be practiced in distributed computing environments where tasks are performed by remote processing devices that are linked through a communications network. In a distributed computing environment, program modules may be located in both local and remote computer storage media including memory storage devices.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
In a typical configuration, a computing device includes one or more processors (CPUs), input/output interfaces, network interfaces, and memory.
The memory may include forms of volatile memory in a computer readable medium, Random Access Memory (RAM) and/or non-volatile memory, such as Read Only Memory (ROM) or flash memory (flash RAM). Memory is an example of a computer-readable medium.
Computer-readable media, including both non-transitory and non-transitory, removable and non-removable media, may implement information storage by any method or technology. The information may be computer readable instructions, data structures, modules of a program, or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), Static Random Access Memory (SRAM), Dynamic Random Access Memory (DRAM), other types of Random Access Memory (RAM), Read Only Memory (ROM), Electrically Erasable Programmable Read Only Memory (EEPROM), flash memory or other memory technology, compact disc read only memory (CD-ROM), Digital Versatile Discs (DVD) or other optical storage, magnetic cassettes, magnetic tape magnetic disk storage or other magnetic storage devices, or any other non-transmission medium that can be used to store information that can be accessed by a computing device. As defined herein, a computer readable medium does not include a transitory computer readable medium such as a modulated data signal and a carrier wave.
It should also be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The embodiments in the present specification are described in a progressive manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, for the system embodiment, since it is substantially similar to the method embodiment, the description is simple, and for the relevant points, reference may be made to the partial description of the method embodiment.
The above description is only an example of the present application and is not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.
Claims (10)
1. A chip integrated microwave quantum signal conversion method, cover the cladding material that can feel the electromagnetic signal on the surface of the integrated waveguide of the chip, realize the adjustment of the integrated waveguide refractive index of the chip through the free carrier that the cladding structure produces after absorbing the microwave signal, the refractive index change causes the phase place change of the uncoded photon, compile the microwave signal into the quantum signal; the quantum signals are converted into binary electrical signals through decoding and single photon detection, and the electrical signals are converted into microwave signals through electrically driving a microwave source.
2. The method for converting a chip integrated microwave quantum signal according to claim 1, wherein a plating layer capable of sensing an electromagnetic signal is covered on the upper surface of the silicon-based waveguide; the coating layer senses the intensity change of the microwave signal and is repeatedly engraved into the change of the free carrier concentration, the change of the free carrier concentration of the coating layer causes the change of the refractive index of the silicon-based waveguide, and at the moment, a certain optical degree of freedom of the uncoded photon signal is changed, so that the conversion of the microwave signal to the photon signal is realized.
3. The method for converting chip-integrated microwave quantum signals according to claim 1, wherein the polarization-encoded quantum signals are divided into two beams by a polarization beam splitter, the two beams are respectively detected by two independent single-photon detectors, the polarization distribution of the quantum signals is analyzed according to the time sequence of the detection results of the single-photon detectors, that is, the electrical signals of the binary encoding are obtained, and the electric driving microwave source transmits the microwaves of the binary encoding, so as to realize the conversion from the quantum signals to the microwave signals.
4. The method for converting a chip integrated microwave quantum signal according to one of claims 1 to 3, wherein the specific degree of freedom of the single photon sequence is analyzed and converted into specific parameters which can be identified by the single photon detector and the time analyzer, the quantum signal is effectively detected through single photon detection and time analysis, the result is compiled into a binary electrical signal, and the microwave source is driven by the electrical signal to generate the required microwave signal.
5. The chip integrated microwave quantum signal conversion method of claim 1, comprising:
s101, microwave signal vector quantum signal conversion is carried out, a coating material capable of sensing electromagnetic signals covers the surface of the chip integrated waveguide, the adjustment of the refractive index of the chip integrated waveguide is realized through free carriers generated after the coating structure absorbs the microwave signals, the phase change of uncoded light quanta is caused by the refractive index change, and the microwave signals are compiled into quantum signals;
and S102, converting the quantum signals into microwave signals, converting the quantum signals into binary electrical signals through a decoding system and a single photon detector, and converting the electrical signals into microwave signals through an electrically driven microwave source.
6. The chip integrated microwave quantum signal conversion method of claim 1, comprising:
s201, preparing a transmission waveguide required by quantum signal compiling, optimally designing a cross section structure to enable transmission loss to be low and waveguide refractive index to be sensitively changed, optimally designing waveguide length to give consideration to second transmission loss and large modulation depth, optimally designing waveguide space arrangement to enable a coating to cover as accurately as possible, and optimally designing a device structure to enable specific freedom degree of a non-coding quantum signal to be modulated according to requirements;
s202, transferring a coating material sensitive to electromagnetic signals to the surface of a waveguide without damage, and optimally designing the thickness of the coating to enable the concentration of free carriers generated by microwave signals of unit electric field intensity of a specific waveband to be maximum and the dissipation time to be shortest;
s203, preparing a transmission waveguide required by quantum signal decoding, and converting the quantum signal coding freedom into parameters such as detection paths, arrival time and the like which can be identified by a single photon detector and a time analyzer;
s204, converting the microwave signals into quantum signals according to the sequence of the free carrier concentration of the coating → the refractive index of the waveguide → the optical degree of freedom, and converting the quantum signals into the microwave signals according to the sequence of the optical degree of freedom → the single photon detection result → the time analysis result → the driving voltage of the microwave source.
7. The chip integrated microwave quantum signal conversion method of claim 6, wherein the coating is tightly attached to the upper surface and the side surface of the waveguide or the upper surface.
8. The chip integrated microwave quantum signal conversion method of claim 6, wherein the time analyzer converts the single photon detector detection result into a driving signal for electrically driving the microwave source and generating a binarily encoded microwave signal.
9. A system for realizing the chip integrated microwave quantum signal conversion method of claims 1-8, comprising a silicon-based waveguide covered with a coating on the surface, a decoding system, a time analyzer and a single photon detector, and further comprising a microwave signal to quantum signal conversion module and a quantum signal to microwave signal conversion module, wherein,
the microwave signal-to-quantum signal conversion module is used for covering a coating material capable of sensing electromagnetic signals on the surface of the chip integrated waveguide, adjusting the refractive index of the chip integrated waveguide by using a free carrier generated after the coating structure absorbs the microwave signals, wherein the change of the refractive index causes the phase change of uncoded optical quanta, and the microwave signals are compiled into quantum signals;
and the quantum signal-to-microwave signal conversion module is used for converting the quantum signals into binary electrical signals through the decoding system and the single photon detector and converting the electrical signals into microwave signals through the electric drive microwave source.
10. A computer-readable storage medium, on which a computer program is stored which, when being executed by a processor, carries out the method of any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111421935.3A CN114296261A (en) | 2021-11-26 | 2021-11-26 | Chip integrated microwave quantum signal conversion method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111421935.3A CN114296261A (en) | 2021-11-26 | 2021-11-26 | Chip integrated microwave quantum signal conversion method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114296261A true CN114296261A (en) | 2022-04-08 |
Family
ID=80965488
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111421935.3A Pending CN114296261A (en) | 2021-11-26 | 2021-11-26 | Chip integrated microwave quantum signal conversion method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114296261A (en) |
-
2021
- 2021-11-26 CN CN202111421935.3A patent/CN114296261A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Zhao et al. | A survey of 6G wireless communications: Emerging technologies | |
| Kareem et al. | A survey of optical fiber communications: challenges and processing time influences | |
| Zhang et al. | A metasurface-based light-to-microwave transmitter for hybrid wireless communications | |
| Zhao et al. | Capacity limits of spatially multiplexed free-space communication | |
| Upadhyay et al. | High-speed 120 Gbps AMI-WDM-PDM free space optical transmission system | |
| Amiri et al. | GHz frequency band soliton generation using integrated ring resonator for WiMAX optical communication | |
| Chaudhary et al. | Empirical evaluation of high-speed cost-effective Ro-FSO system by incorporating OCDMA-PDM scheme under the presence of fog | |
| Grover et al. | Performance analysis of mode division multiplexing based free space optics system incorporating on–off keying and polarization shift keying under dynamic environmental conditions | |
| CN113472453B (en) | Distributed quantum sensing networking method based on time division multiplexing centralized detection | |
| Morsy et al. | Performance analysis of OCDMA wireless communication system based on double length modified prime code for security improvement | |
| Bchir et al. | Design of silicon‐based two‐dimensional photonic integrated circuits: XOR gate | |
| Zhang et al. | Performance analysis of mode division multiplexing-based free space optical systems for healthcare infrastructure’s | |
| Anand Prem et al. | A millimeter-wave generation scheme based on frequency octupling using LiNbO3 Mach–Zehnder modulator | |
| Malathy et al. | Modeling and performance investigation of 4× 20 Gbps underwater optical wireless communication link incorporating space division multiplexing of Hermite Gaussian modes | |
| CN101211090B (en) | Phase modulation -type analog to digital converter | |
| Neves et al. | Beyond 5G fronthaul based on FSO using spread spectrum codes and graphene modulators | |
| CN113472451A (en) | Quantum time synchronization method for mechanical-solid interconnection | |
| Kumar et al. | Design of multi-beam free space optical communication system for mitigation of atmospheric and geometric nonlinearities | |
| Yang et al. | Inter/intra-chip optical interconnection network: Opportunities, challenges, and implementations | |
| CN114296261A (en) | Chip integrated microwave quantum signal conversion method | |
| Ji et al. | Internet of things with optical connectivity, networking, and beyond | |
| Saghezchi et al. | Drive towards 6G | |
| Madhag et al. | Satellite vibration effects on communication quality of OISN system | |
| CN114609808A (en) | Chip integrated electro-optical signal conversion method based on two-dimensional layered material film | |
| CN114301534A (en) | Method for realizing ultra-wideband chip integrated microwave photonic antenna |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |