CN114295248A - Integrated optical temperature measurement sensing chip, optical temperature measurement sensing equipment and temperature measurement method - Google Patents
Integrated optical temperature measurement sensing chip, optical temperature measurement sensing equipment and temperature measurement method Download PDFInfo
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- CN114295248A CN114295248A CN202111350163.9A CN202111350163A CN114295248A CN 114295248 A CN114295248 A CN 114295248A CN 202111350163 A CN202111350163 A CN 202111350163A CN 114295248 A CN114295248 A CN 114295248A
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Abstract
The invention discloses an integrated optical temperature measurement sensing chip, an optical temperature measurement sensing device and a temperature measurement method, wherein the integrated optical temperature measurement sensing chip comprises a wafer substrate and an integrated optical path arranged on the wafer substrate, the integrated optical path comprises a closed-loop integrated optical resonant cavity and an open-loop bus optical waveguide, and a coupling area is formed between the bus optical waveguide and the integrated optical resonant cavity. Based on the principle that the difference of the resonant frequencies of two orthogonal polarization modes changes along with the change of the cavity temperature, the frequency of tunable laser is locked on one polarization resonant frequency of an integrated optical resonant cavity through a PDH (Pound-Drever-Hall) frequency locking technology, the sideband modulation frequency is locked on the difference of the resonant frequencies of the two orthogonal polarization modes, and the real-time tracking of the sideband modulation frequency on the difference of the resonant frequencies of the two orthogonal polarization modes is realized; by monitoring the change of the sideband modulation frequency, the accurate measurement of the temperature change of the integrated optical resonant cavity is realized.
Description
Technical Field
The invention relates to the technical field of precision sensing, in particular to an integrated optical temperature measurement sensing chip, optical temperature measurement sensing equipment and a temperature measurement method.
Background
The planar integrated optical circuit is widely applied to the fields of optical communication, quantum optics, nonlinear optics, space-time measurement and the like. Many sophisticated optoelectronic devices and systems are miniaturized and integrated in the form of integrated optical circuits, and the optical properties of the integrated optics directly determine the performance of these miniaturized optoelectronic devices and systems. Thermal stability of an integrated optical device is one of the important factors affecting its optical properties. For example, changes in device temperature can change the refractive index of the material, which in turn affects the optical path and phase difference of the propagation, ultimately resulting in changes in the function and performance of the optical device. Accurately measuring the temperature change of the optical device and suppressing and compensating the temperature noise is an effective method for improving the thermal stability of the integrated optical device.
However, the conventional electrical temperature measuring device represented by the thermistor cannot fully meet the requirements of the integrated optoelectronic chip on temperature measurement and control. Firstly, the requirement of the optoelectronic chip on the temperature precision is high and needs to reach 1 μ K or even lower, while the temperature measurement precision of the current commercial equipment based on the thermistor is 100 μ K. Secondly, the material and the preparation process of the thermistor are incompatible with the integrated optical device, so that the temperature measuring device and the integrated optical device cannot be prepared on the same wafer, and the processing and packaging difficulty is increased. Third, the physical gap between the integrated optics and the thermometry device due to the packaging process results in the temperature sensed by the thermistor not being the temperature on the surface or inside the integrated optics, which reduces the accuracy of the temperature measurement.
Accordingly, the prior art is yet to be improved and developed.
Disclosure of Invention
In view of the above-mentioned deficiencies of the prior art, the present invention aims to provide an integrated optical temperature measurement sensing chip, an optical temperature measurement sensing device and a temperature measurement method, which aim to solve the problem that the existing resistance sensor cannot accurately measure the temperature variation of the integrated optical device.
The technical scheme of the invention is as follows:
an integrated optical thermometric sensing chip comprises a wafer substrate and an integrated optical path arranged on the wafer substrate, wherein the integrated optical path comprises a closed-loop integrated optical resonant cavity and an open-loop bus optical waveguide, and a coupling area is formed between the bus optical waveguide and the integrated optical resonant cavity.
The integrated optical temperature measurement sensing chip is characterized in that two orthogonal polarization modes are arranged in the integrated optical resonant cavity, and the difference of the resonant frequencies of the two orthogonal polarization modes changes along with the change of the temperature of the integrated optical resonant cavity.
The integrated optical temperature measurement sensing chip is characterized in that the two orthogonal polarization modes are used for exciting laser into transverse electric field waves and transverse magnetic field waves respectively.
The integrated optical temperature measurement sensing chip is characterized in that one end of the bus optical waveguide is a light incident port, and the other end of the bus optical waveguide is a light emergent port.
The invention provides an optical temperature measurement sensing device, which comprises an integrated optical temperature measurement sensing chip.
The optical temperature measurement sensing equipment comprises a signal generator, a laser controller, a laser, a first optical polarization controller, an electro-optic phase modulator, a second optical polarization controller, an integrated optical temperature measurement sensing chip, a third optical polarization controller and a polarization beam splitter which are sequentially connected; one end of the polarization beam splitter is sequentially connected with a first photoelectric detector, a first frequency mixer, a low-pass filter and a first proportional integral differential circuit, and the other end of the polarization beam splitter is sequentially connected with a second photoelectric detector, a second frequency mixer, a band-pass filter, a second proportional integral differential circuit and a voltage control oscillator; the first proportional integral differential circuit is connected with the laser controller; the first mixer and the second mixer are both connected with the signal generator; the voltage controlled oscillator is connected with the electro-optic phase modulator.
The optical temperature measurement sensing equipment is characterized in that the laser, the first optical polarization controller, the electro-optic phase modulator, the second optical polarization controller, the integrated optical temperature measurement sensing chip, the third optical polarization controller and the polarization beam splitter are connected through an optical path; the polarization beam splitter is connected with the first photoelectric detector and the second photoelectric detector through light paths respectively; the signal generator is connected with the laser controller through a light path; the first photoelectric detector, the first mixer, the low-pass filter, the first proportional integral differential circuit, the laser controller and the laser are sequentially connected through a circuit; the second photoelectric detector, the second mixer, the band-pass filter, the second proportional-integral-differential circuit, the voltage control oscillator and the electro-optic phase modulator are sequentially connected through a circuit.
The invention relates to a temperature measurement method based on optical temperature measurement sensing equipment, which comprises the following steps:
the first proportional integral difference circuit applies a periodic triangular wave signal to the laser controller so that the laser frequency f of the laser is enabled0Periodically linearly varying; at the same time, the signal generator generates a periodic sinusoidal modulation frequency omega1To drive a laser controller for modulating the laser; the modulated laser sequentially passes through the first optical polarization controller, the electro-optic phase modulator and the second optical polarization controller and then is coupled into the integrated optical temperature measurement sensing chip;
after passing through a third optical polarization controller and a polarization beam splitter, light coupled out from the integrated optical temperature measurement sensing chip is divided into two paths of light only containing one polarization mode, wherein one path of light only containing one polarization mode P1 is converted into an electric signal through a first photoelectric detector, and the electric signal and a modulation signal omega generated by a signal generator1Generating a frequency discrimination signal E1 in a first mixer, converting the frequency discrimination signal E1 into a control signal through a low-pass filter and a first proportional integral difference circuit, and feeding the control signal back to a laser controller; the other light containing only the other polarization mode P2 is converted into an electrical signal by a second photodetector, and the electrical signal and the modulation signal omega generated by the signal generator1Generating a frequency discrimination signal E2 in a second mixer, wherein the frequency discrimination signal E2 is converted into a control signal through a band-pass filter and a second proportional-integral-differential circuit and is fed back to the voltage-controlled oscillator;
the voltage controlled oscillator applies a periodic sinusoidal signal omega2To an electro-optical phase modulator so that the laser light passing through the electro-optical phase modulator is at a carrier frequency f0Nearby generation of sideband frequency f0±Ω2(ii) a Changing the modulation frequency omega by adjusting the DC input voltage of a voltage controlled oscillator2To tune the sidebands of one polarization modeThe peak coincides with the carrier resonance peak of the other polarization mode, at which time the frequency omega of the voltage controlled oscillator2Equal to the difference | f between the resonant frequencies of two orthogonal polarization modes in the integrated optical thermometric sensing chip1-f2|；
The periodic triangular wave signal is closed, and the laser frequency f is adjusted by a PDH frequency stabilization technology0Locking the resonant frequency of a polarization mode of the integrated optical temperature measurement sensing chip to control the frequency omega of the voltage controlled oscillator2Locked as the difference | f between resonance frequencies of two orthogonal polarization modes in the integrated optical thermometric sensing chip1-f2|；
The frequency of the voltage control oscillator in the locking state reflects the change information of the difference between the resonant frequencies of the two orthogonal polarization modes, namely the change information of the temperature of the integrated optical temperature measurement sensing chip; change amount delta | f of difference between resonance frequencies1-f2I, thermal sensitivity divided by the difference in resonant frequency, Δ | f1-f2And I/dT, namely obtaining the temperature change, delta T, sensed by the integrated optical temperature measurement sensing chip.
Has the advantages that: the invention provides an integrated optical temperature measurement sensing chip, optical temperature measurement sensing equipment and a temperature measurement method, based on the principle that the difference of the resonant frequencies of two orthogonal polarization modes changes along with the change of the temperature of a cavity, the frequency of tunable laser is locked on one polarization resonant frequency of an integrated optical resonant cavity through a PDH frequency locking technology, and the sideband modulation frequency is locked on the difference of the resonant frequencies of the two orthogonal polarization modes, so that the real-time tracking of the sideband modulation frequency on the difference of the resonant frequencies of the two orthogonal polarization modes is realized; by monitoring the change of the sideband modulation frequency, the accurate measurement of the temperature change of the integrated optical resonant cavity is realized. The invention has the advantages that the temperature of the sensor is measured by using an optical method, the measurement precision is higher than that of the thermistor, and the work of a photonic device is not interfered; the integrated optical temperature measurement sensing chip is prepared by a semiconductor process, can be integrated with other optoelectronic devices, and reduces the manufacturing cost.
Drawings
Fig. 1 is a schematic view of a first view structure of an integrated optical temperature measurement sensor chip according to the present invention.
Fig. 2 is a schematic diagram of a second view structure of an integrated optical temperature measurement sensing chip according to the present invention.
FIG. 3 is a schematic diagram of the frequency difference between two orthogonal polarization modes of the present invention as a function of the cavity temperature.
Fig. 4 is a schematic structural diagram of an optical temperature measurement sensing device according to the present invention.
FIG. 5 is a schematic diagram of a locking frequency of the integrated optical thermometry sensing chip.
Detailed Description
The optical method is adopted to measure the temperature, no additional electronic device is needed to be introduced, the optical path transmission is not influenced, and the measurement precision is higher than that of a thermistor device. The optical temperature measuring method based on two orthogonal polarization modes utilizes the difference of thermo-optic coefficients of optical mode fields in two orthogonal polarization directions in an optical device, and reversely deduces the change of temperature in the device by reading the change of transmission properties of the optical mode fields in the two orthogonal polarization directions in the optical device, thereby realizing the accurate measurement of the temperature change. The method is applied to a table type Fabry-Perot resonant cavity and a echo wall resonant cavity, however, the optical resonant cavities have large volumes, the preparation process is incompatible with a semiconductor process, and the optical resonant cavities cannot be integrated on the same wafer with other planar optical devices, so that the application of the optical resonant cavities in integrated optical chip temperature measurement is limited.
Based on this, the present invention provides an integrated optical thermometric sensing chip, as shown in fig. 1 and fig. 2, comprising a wafer substrate 100, and an integrated optical circuit disposed on the wafer substrate 100, wherein the integrated optical circuit comprises a closed-loop integrated optical resonator 200 and an open-loop bus optical waveguide 300, and a coupling region 400 is formed between the bus optical waveguide 300 and the integrated optical resonator 200.
In this embodiment, the integrated optical temperature measurement sensing chip is fabricated on the wafer substrate 100 in the form of an integrated planar optical path by a semiconductor fabrication technology, two orthogonal polarization modes are disposed in the integrated optical resonant cavity 200, a difference between resonant frequencies of the two orthogonal polarization modes changes with a change in temperature of the integrated optical resonant cavity, optical waves of the two orthogonal polarization modes supported by the integrated optical temperature measurement sensing chip are a transverse electric field wave and a transverse magnetic field wave, respectively, a difference between resonant frequencies of the transverse electric field wave and the transverse magnetic field wave changes with a change in temperature of the cavity, as shown in fig. 3, if a resonant frequency position of one polarization mode is taken as a reference point, a resonant frequency of the other polarization mode moves with a change in temperature; the polarization mode of the integrated optical resonant cavity can be characterized in a certain laser frequency range through parameters such as resonant frequency, load quality factor, full width at half maximum, extinction ratio and the like. In this embodiment, one end of the bus optical waveguide is a light incident port, and the other end of the bus optical waveguide is a light emergent port.
In this embodiment, an integrated optical resonant cavity supporting two orthogonal polarization modes is fabricated on a wafer substrate by using a semiconductor processing technology, and the temperature change of the optical sensing chip is inversely inferred by monitoring the relative change of the resonant frequencies of the two orthogonal polarization modes.
In some embodiments, the integrated optical thermometric sensing chip can be packaged as a stand-alone device, or can be integrated with other integrated optical circuits or integrated circuit devices on a wafer.
In some embodiments, an optical thermometry sensing device is also provided, which includes the integrated optical thermometry sensing chip of the present invention.
Specifically, as shown in fig. 4, the optical temperature measurement sensing device includes a signal generator 1, a laser controller 2, a laser 3, a first optical polarization controller 4, an electro-optical phase modulator 5, a second optical polarization controller 6, an integrated optical temperature measurement sensing chip 7, a third optical polarization controller 8, and a polarization beam splitter 9, which are connected in sequence; one end of the polarization beam splitter 9 is sequentially connected with a first photoelectric detector 10, a first mixer 12, a low-pass filter 14 and a first proportional integral differential circuit 16, and the other end of the polarization beam splitter 9 is sequentially connected with a second photoelectric detector 11, a second mixer 13, a band-pass filter 15, a second proportional integral differential circuit 17 and a voltage control oscillator 18; the first proportional integrating and differentiating circuit 16 is connected with the laser controller 2; the first mixer 12 and the second mixer 13 are both connected to the signal generator 1; the voltage controlled oscillator 18 is connected to the electro-optical phase modulator 5.
In this embodiment, the laser 3, the first optical polarization controller 4, the electro-optic phase modulator 5, the second optical polarization controller 6, the integrated optical temperature measurement sensing chip 7, the third optical polarization controller 8 and the polarization beam splitter 9 are connected by an optical path; the polarization beam splitter 9 is connected with the first photodetector 10 and the second photodetector 11 through optical paths respectively; the signal generator 1 is connected with the laser controller 2 through an optical path. The first photodetector 10, the first mixer 12, the low-pass filter 14, the first proportional integrating and differentiating circuit 16, the laser controller 2, and the laser 3 are connected in sequence by circuits. The second photodetector 11, the second mixer 13, the band-pass filter 15, the second proportional-integral-differential circuit 17, the voltage-controlled oscillator 18, and the electro-optical phase modulator 5 are sequentially connected by a circuit.
In this embodiment, the laser emitted from the laser is coupled into the integrated optical thermometric sensing chip, and excites the light in the transverse electric field wave and transverse magnetic field wave modes to propagate in the optical waveguide; the frequency of the laser is locked on the resonant frequency of one polarization mode of the integrated optical resonant cavity by a PDH frequency stabilization technology; the laser generates sidebands near the carrier by phase modulation; the frequency of the phase modulation is just the difference of the resonant frequencies of the two orthogonal polarization modes in the integrated optical resonant cavity; through phase modulation, the sideband frequency of the laser is superposed with the resonance frequency of the other polarization mode of the integrated optical resonant cavity; by the PDH frequency stabilization technique, the frequency of the phase modulation is locked to the difference between the resonant frequencies of the two orthogonal polarization modes; the temperature change of the integrated optical resonant cavity is obtained by monitoring the phase modulation frequency.
In some embodiments, there is also provided a thermometry method based on the optical thermometry sensing device of the present invention, which includes the steps of:
s10, the first proportional integrating and differentiating circuit 16 applies a periodic triangular signal to the laser controller 2 so that the laser frequency f of the laser 30Periodic earth wireA sexual change; at the same time, the signal generator 1 generates a periodic sinusoidal modulation frequency Ω1To drive the laser controller 2 for modulating the frequency f of the laser 30The signal generator 1 is used for providing required modulation and demodulation signals for PDH frequency stabilization technology; the modulated laser sequentially passes through the first optical polarization controller 4, the electro-optic phase modulator 5 and the second optical polarization controller 6 and then is coupled into the integrated optical temperature measurement sensing chip 7, and specifically, by adjusting the state of the second optical polarization controller 6, light waves of two orthogonal polarization modes can be excited in the bus light waveguide and coupled into the integrated optical resonant cavity.
S20, after passing through a third optical polarization controller 8 and a polarization beam splitter 9, the light coupled out from the integrated optical temperature measurement sensing chip 7 is divided into two paths of light only containing one polarization mode, wherein one path of light only containing one polarization mode P1 is converted into an electric signal through a first photoelectric detector 10, and the electric signal and a modulation signal omega generated by a signal generator 11Generating a frequency discrimination signal E1 in the first mixer 12, wherein the frequency discrimination signal E1 is converted into a control signal through the low pass filter 14 and the first proportional integral difference circuit 16 and fed back to the laser controller 2; the other light, which contains only the other polarization mode P2, is converted by the second photodetector 11 into an electrical signal, which is combined with the modulation signal Ω generated by the signal generator 11Generating a frequency discrimination signal E2 in the second mixer 13, wherein the frequency discrimination signal E2 is converted into a control signal through the band-pass filter 15 and the second proportional-integral-difference circuit 17 and fed back to the voltage-controlled oscillator 18;
s30, the voltage control oscillator 18 applies a periodic sinusoidal signal omega2To an electro-optical phase modulator 5 such that the laser light passing through said electro-optical phase modulator 5 is at a carrier frequency f0Nearby generation of sideband frequency f0±Ω2(ii) a As shown in fig. 5, the modulation frequency Ω is changed by adjusting the dc input voltage of the voltage controlled oscillator 182So that the sideband harmonic peak of one polarization mode coincides with the carrier harmonic peak of the other polarization mode, at which time the frequency omega of the voltage controlled oscillator2Equal to two orthogonal polarization modes in integrated optical temperature measurement sensing chipDifference of resonant frequencies | f1-f2|；
S40, turning off the periodic triangular wave signal, enabling the servo modes of the first proportional integral difference circuit 16 and the second proportional integral difference circuit 17, and stabilizing the laser frequency f by a PDH frequency stabilization technology0Locking on the resonance frequency of one polarization mode of the integrated optical temperature measurement sensing chip, as shown in the solid line position in fig. 5; controlling the frequency omega of a voltage controlled oscillator2Locked as the difference | f between resonance frequencies of two orthogonal polarization modes in the integrated optical thermometric sensing chip1-f2As shown by the arrows in fig. 5;
s50, the frequency of the voltage control oscillator in the locking state reflects the change information of the difference between the resonant frequencies of the two orthogonal polarization modes, namely the change information of the temperature of the integrated optical temperature measurement sensing chip; change amount delta | f of difference between resonance frequencies1-f2I, thermal sensitivity divided by the difference in resonant frequency, Δ | f1-f2And I/dT, namely obtaining the temperature change, delta T, sensed by the integrated optical temperature measurement sensing chip. Specifically, in the case where both the frequency of the laser 1 and the frequency of the voltage controlled oscillator 18 are frequency-locked by PDH stabilization, the frequency Ω of the voltage controlled oscillator 18 is monitored2The change of the resonant frequency difference of the two orthogonal polarization modes in the integrated optical resonant cavity 7 can be obtained, so that the change of the cavity temperature of the integrated optical resonant cavity 7 can be obtained; in addition, since the frequency of the vco 18 is determined by the input signal, monitoring the frequency of the vco 18 can also be achieved by monitoring the input control signal.
The invention relates to a temperature measurement method based on optical temperature measurement sensing equipment, which is characterized in that a laser frequency is locked on a resonant frequency of a polarization mode by utilizing matched optical and electrical devices, a voltage control oscillator frequency is locked on a difference between the resonant frequencies of two orthogonal polarization modes, and the change of the temperature of a cavity of an optical resonant cavity is obtained by monitoring the change of the voltage control oscillator frequency; the method uses the optical signal to measure the temperature of the chip, does not need to introduce an additional thermistor device near the integrated photonic device, and avoids the interference on the performance of the integrated photonic device; the optical and electrical devices used by the method have the potential of further on-chip integration, and lay a foundation for the integration, the miniaturization and the commercialization of the integrated optoelectronic chip with high temperature stability.
In summary, the invention provides an integrated optical temperature measurement sensing chip, an optical temperature measurement sensing device and a temperature measurement method, based on the principle that the difference between the resonant frequencies of two orthogonal polarization modes changes along with the change of the cavity temperature, the frequency of tunable laser is locked on one polarization resonant frequency of an integrated optical resonant cavity through a PDH frequency locking technology, and the sideband modulation frequency is locked on the difference between the resonant frequencies of the two orthogonal polarization modes, so that the real-time tracking of the sideband modulation frequency on the difference between the resonant frequencies of the two orthogonal polarization modes is realized; by monitoring the change of the sideband modulation frequency, the accurate measurement of the temperature change of the integrated optical resonant cavity is realized.
It is to be understood that the invention is not limited to the examples described above, but that modifications and variations may be effected thereto by those of ordinary skill in the art in light of the foregoing description, and that all such modifications and variations are intended to be within the scope of the invention as defined by the appended claims.
Claims (8)
1. An integrated optical temperature measurement sensing chip is characterized by comprising a wafer substrate and an integrated optical path arranged on the wafer substrate, wherein the integrated optical path comprises a closed-loop integrated optical resonant cavity and an open-loop bus optical waveguide, and a coupling area is formed between the bus optical waveguide and the integrated optical resonant cavity.
2. The integrated optical thermometric sensing chip according to claim 1, wherein two orthogonal polarization modes are disposed within the integrated optical resonant cavity, and a difference between resonant frequencies of the two orthogonal polarization modes changes with a change in temperature of the integrated optical resonant cavity.
3. The integrated optical thermometric sensing chip of claim 2, wherein the two orthogonal polarization modes are used to excite the laser into a transverse electric field wave and a transverse magnetic field wave, respectively.
4. The integrated optical thermometric sensing chip according to claim 1, wherein one end of the bus optical waveguide is a light incident port and the other end of the bus optical waveguide is a light exiting port.
5. An optical thermometry sensing device comprising the integrated optical thermometry sensing chip of any one of claims 1-4.
6. The optical temperature measurement sensing equipment according to claim 5, comprising a signal generator, a laser controller, a laser, a first optical polarization controller, an electro-optical phase modulator, a second optical polarization controller, an integrated optical temperature measurement sensing chip, a third optical polarization controller, and a polarization beam splitter, which are connected in sequence; one end of the polarization beam splitter is sequentially connected with a first photoelectric detector, a first frequency mixer, a low-pass filter and a first proportional integral differential circuit, and the other end of the polarization beam splitter is sequentially connected with a second photoelectric detector, a second frequency mixer, a band-pass filter, a second proportional integral differential circuit and a voltage control oscillator; the first proportional integral differential circuit is connected with the laser controller; the first mixer and the second mixer are both connected with the signal generator; the voltage controlled oscillator is connected with the electro-optic phase modulator.
7. The optical temperature measurement sensing equipment according to claim 6, wherein the laser, the first optical polarization controller, the electro-optical phase modulator, the second optical polarization controller, the integrated optical temperature measurement sensing chip, the third optical polarization controller and the polarization beam splitter are connected through an optical path; the polarization beam splitter is connected with the first photoelectric detector and the second photoelectric detector through light paths respectively; the signal generator is connected with the laser controller through a light path; the first photoelectric detector, the first mixer, the low-pass filter, the first proportional integral differential circuit, the laser controller and the laser are sequentially connected through a circuit; the second photoelectric detector, the second mixer, the band-pass filter, the second proportional-integral-differential circuit, the voltage control oscillator and the electro-optic phase modulator are sequentially connected through a circuit.
8. A temperature measuring method based on the optical temperature measuring and sensing device of any one of claims 6 to 7, comprising the steps of:
the first proportional integral difference circuit applies a periodic triangular wave signal to the laser controller so that the laser frequency f of the laser is enabled0Periodically linearly varying; at the same time, the signal generator generates a periodic sinusoidal modulation frequency omega1To drive a laser controller for modulating the laser; the modulated laser sequentially passes through the first optical polarization controller, the electro-optic phase modulator and the second optical polarization controller and then is coupled into the integrated optical temperature measurement sensing chip;
after passing through a third optical polarization controller and a polarization beam splitter, light coupled out from the integrated optical temperature measurement sensing chip is divided into two paths of light only containing one polarization mode, wherein one path of light only containing one polarization mode P1 is converted into an electric signal through a first photoelectric detector, and the electric signal and a modulation signal omega generated by a signal generator1Generating a frequency discrimination signal E1 in a first mixer, converting the frequency discrimination signal E1 into a control signal through a low-pass filter and a first proportional integral difference circuit, and feeding the control signal back to a laser controller; the other light containing only the other polarization mode P2 is converted into an electrical signal by a second photodetector, and the electrical signal and the modulation signal omega generated by the signal generator1Generating a frequency discrimination signal E2 in a second mixer, wherein the frequency discrimination signal E2 is converted into a control signal through a band-pass filter and a second proportional-integral-differential circuit and is fed back to the voltage-controlled oscillator;
the voltage controlled oscillator applies a periodic sinusoidal signal omega2To an electro-optical phase modulator so that the laser light passing through the electro-optical phase modulator is at a carrier frequency f0Nearby generation of sideband frequency f0±Ω2(ii) a Changing the modulation frequency omega by adjusting the DC input voltage of a voltage controlled oscillator2So that the sideband harmonic peak of one polarization mode coincides with the carrier harmonic peak of the other polarization mode, at which time the frequency of the voltage controlled oscillator is omega2Equal to the difference | f between the resonant frequencies of two orthogonal polarization modes in the integrated optical thermometric sensing chip1-f2|；
The periodic triangular wave signal is closed, and the laser frequency f is adjusted by a PDH frequency stabilization technology0Locking the resonant frequency of a polarization mode of the integrated optical temperature measurement sensing chip to control the frequency omega of the voltage controlled oscillator2Locked as the difference | f between resonance frequencies of two orthogonal polarization modes in the integrated optical thermometric sensing chip1-f2|；
The frequency of the voltage control oscillator in the locking state reflects the change information of the difference between the resonant frequencies of the two orthogonal polarization modes, namely the change information of the temperature of the integrated optical temperature measurement sensing chip; change amount delta | f of difference between resonance frequencies1-f2I, thermal sensitivity divided by the difference in resonant frequency, Δ | f1-f2And I/dT, namely obtaining the temperature change, delta T, sensed by the integrated optical temperature measurement sensing chip.
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