CN114292612A - Single-component epoxy flexible adhesive and preparation method thereof - Google Patents
Single-component epoxy flexible adhesive and preparation method thereof Download PDFInfo
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Abstract
The invention discloses a single-component epoxy flexible adhesive and a preparation method thereof, wherein the adhesive is mainly prepared from the following raw materials in parts by weight: 5-20 parts of bisphenol epoxy resin, 20-50 parts of flexible epoxy resin, 1-10 parts of toughening agent, 25-50 parts of filler, 1-5 parts of reactive diluent, 1-6 parts of latent curing agent, 0.1-1 part of coupling agent, 0.1-1 part of auxiliary agent and 0-0.2 part of surfactant; the bisphenol epoxy resin is at least one of bisphenol A epoxy resin and bisphenol F epoxy resin; the flexible epoxy resin is at least one of polyurethane modified epoxy resin, elastomer modified epoxy resin, dimer acid modified epoxy resin and polyether modified epoxy resin. The invention has good flexibility, can effectively solve the problem that the flexibility of the single-component epoxy flexible adhesive glue is reduced after high-temperature aging in the prior art, reduces the damage to electronic components, can be cured at low and medium temperature, and can be applied to more fields.
Description
Technical Field
The invention relates to the technical field of single-component epoxy adhesive, in particular to a single-component epoxy flexible adhesive and a preparation method thereof.
Background
With the development of electronic components, new requirements are made on epoxy adhesive for packaging and fixing the electronic components. The conventional epoxy adhesive glue has high hardness (more than D80) and poor toughness, and the forming, curing and shrinkage in the curing process and the change of temperature in the application environment can cause the inside of an application material to generate large stress, so that electronic components can be damaged, and the service performance of the electronic components can be further damaged. The existing single-component epoxy flexible adhesive has low hardness, good flexibility and large self deformation, and can offset part of internal stress generated in curing and use environment, thereby avoiding damage to electronic components. However, the hardness of the existing single-component epoxy flexible adhesive increases after long-time high-temperature aging, and the flexibility thereof sharply decreases, which still causes great damage to electronic components.
In view of the above, the present invention is particularly proposed.
Disclosure of Invention
The invention aims to provide a single-component epoxy flexible adhesive and a preparation method thereof, and aims to solve the technical problems in the prior art. The invention has good flexibility, can effectively solve the problem that the flexibility of the single-component epoxy flexible adhesive glue is reduced after high-temperature aging in the prior art, can reduce the internal stress generated by the adhesive glue during curing or in high and low temperature environments, reduces the damage to electronic components, can be cured only at low and medium temperature, saves resources, reduces the cost, improves the production efficiency, and can be applied to more fields.
The purpose of the invention is realized by the following technical scheme:
a single-component epoxy flexible adhesive is mainly prepared from the following raw materials in parts by weight: 5-20 parts of bisphenol epoxy resin, 20-50 parts of flexible epoxy resin, 1-10 parts of toughening agent, 25-50 parts of filler, 1-5 parts of reactive diluent, 1-6 parts of latent curing agent, 0.1-1 part of coupling agent, 0.1-1 part of auxiliary agent and 0-0.2 part of surfactant; wherein the bisphenol epoxy resin is at least one of bisphenol A epoxy resin and bisphenol F epoxy resin; the flexible epoxy resin is at least one of polyurethane modified epoxy resin, elastomer modified epoxy resin, dimer acid modified epoxy resin and polyether modified epoxy resin; the toughening agent is at least one of blocked polyurethane, nitrile rubber modified epoxy resin and polybutadiene rubber modified epoxy resin.
Preferably, the latent curing agent adopts at least two of dicyandiamide, modified imidazole, substituted urea latent curing agent and modified amine latent curing agent.
Preferably, the auxiliary agent is a dispersant, and the surfactant is an antifoaming agent.
Preferably, the filler is one or two of silica micropowder, calcium carbonate, aluminum hydroxide, alumina, talcum powder and nano calcium.
A preparation method of a single-component epoxy flexible adhesive is used for preparing the single-component epoxy flexible adhesive and comprises the following steps:
step 1, weighing the following raw materials in parts by weight: 5-20 parts of bisphenol epoxy resin, 20-50 parts of flexible epoxy resin, 1-10 parts of toughening agent, 25-50 parts of filler, 1-5 parts of reactive diluent, 1-6 parts of latent curing agent, 0.1-1 part of coupling agent, 0.1-1 part of auxiliary agent and 0-0.2 part of surfactant;
step 2, adding the bisphenol epoxy resin, the flexible epoxy resin, the toughening agent, the reactive diluent, the coupling agent, the auxiliary agent and the surfactant into a reaction kettle, and stirring for 20-40 min at the temperature of 25-60 ℃;
step 3, adding the filler into the reaction kettle, stirring for 50-70 min at the temperature of 25-60 ℃, and simultaneously starting vacuum;
and 4, adding the latent curing agent into the reaction kettle at the temperature of 25-35 ℃, starting vacuum, stirring for 15-30 min, and controlling the temperature to be 25-50 ℃ in the stirring process, thereby preparing the single-component epoxy flexible adhesive.
Compared with the prior art, the single-component epoxy flexible adhesive glue is prepared by adopting the special bisphenol epoxy resin, the flexible epoxy resin, the toughening agent, the filler, the reactive diluent, the latent curing agent, the coupling agent, the auxiliary agent and the surfactant according to a specific proportion, so that the single-component epoxy flexible adhesive glue has good flexibility, the problem that the flexibility of the single-component epoxy flexible adhesive glue is reduced after the single-component epoxy flexible adhesive glue is aged at high temperature in the prior art can be effectively solved, the internal stress generated when the adhesive glue is cured or in a high-low temperature environment can be reduced, the damage to electronic components can be reduced, the single-component epoxy flexible adhesive glue can be cured at a low temperature, the resources can be saved, the cost can be reduced, the production efficiency can be improved, and the single-component epoxy flexible adhesive glue can be applied to more fields.
Detailed Description
The technical scheme in the embodiment of the invention is clearly and completely described below; it is to be understood that the described embodiments are merely exemplary of the invention, and are not intended to limit the invention to the particular forms disclosed. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without making any creative effort, shall fall within the protection scope of the present invention.
The terms that may be used herein are first described as follows:
the terms "comprising," "including," "containing," "having," or other similar terms of meaning should be construed as non-exclusive inclusions. For example: including a feature (e.g., material, component, ingredient, carrier, formulation, material, dimension, part, component, mechanism, device, process, procedure, method, reaction condition, processing condition, parameter, algorithm, signal, data, product, or article of manufacture), is to be construed as including not only the particular feature explicitly listed but also other features not explicitly listed as such which are known in the art.
The term "consisting of … …" is meant to exclude any technical feature elements not explicitly listed. If used in a claim, the term shall render the claim closed except for the inclusion of the technical features that are expressly listed except for the conventional impurities associated therewith. If the term occurs in only one clause of the claims, it is defined only to the elements explicitly recited in that clause, and elements recited in other clauses are not excluded from the overall claims.
The term "parts by weight" is intended to indicate the relationship of mass proportions between the various components, for example: if the X component is described as X parts by weight and the Y component is described as Y parts by weight, the mass ratio of the X component to the Y component is represented as X: Y; 1 part by weight may represent any mass, for example: 1 part by weight may be expressed as 1kg or 3.1415926 kg. The sum of the parts by weight of all components is not necessarily 100 parts and may be greater than 100 parts, less than 100 parts or equal to 100 parts. Parts, ratios and percentages described herein are by mass unless otherwise indicated.
When concentrations, temperatures, pressures, dimensions, or other parameters are expressed as ranges of values, the ranges are to be understood as specifically disclosing all ranges formed from any pair of upper, lower, and preferred values within the range, regardless of whether ranges are explicitly recited; for example, if a numerical range of "2 ~ 8" is recited, then the numerical range should be interpreted to include ranges of "2 ~ 7", "2 ~ 6", "5 ~ 7", "3 ~ 4 and 6 ~ 7", "3 ~ 5 and 7", "2 and 5 ~ 7", and the like. Unless otherwise indicated, the numerical ranges recited herein include both the endpoints thereof and all integers and fractions within the numerical range.
The single-component epoxy flexible adhesive and the preparation method thereof provided by the invention are described in detail below. Details which are not described in detail in the embodiments of the invention belong to the prior art which is known to the person skilled in the art. Those not specifically mentioned in the examples of the present invention were carried out according to the conventional conditions in the art or conditions suggested by the manufacturer. The reagents or instruments used in the examples of the present invention are not specified by manufacturers, and are all conventional products available by commercial purchase.
The invention provides a single-component epoxy flexible adhesive which is mainly prepared from the following raw materials in parts by weight: 5-20 parts of bisphenol epoxy resin, 20-50 parts of flexible epoxy resin, 1-10 parts of toughening agent, 25-50 parts of filler, 1-5 parts of reactive diluent, 1-6 parts of latent curing agent, 0.1-1 part of coupling agent, 0.1-1 part of auxiliary agent and 0-0.2 part of surfactant.
Specifically, the single-component epoxy flexible adhesive may include the following embodiments:
(1) the bisphenol epoxy resin is at least one of bisphenol A epoxy resin and bisphenol F epoxy resin.
(2) The flexible epoxy resin is at least one of polyurethane modified epoxy resin, elastomer modified epoxy resin, dimer acid modified epoxy resin and polyether modified epoxy resin.
(3) The toughening agent is at least one of blocked polyurethane, nitrile rubber modified epoxy resin and polybutadiene rubber modified epoxy resin.
(4) The filler can be one or two of silica micropowder, calcium carbonate, aluminum hydroxide, aluminum oxide, talcum powder and nano calcium.
(5) The active diluent is one or a mixture of more of C dodecyl-C tetradecyl glycidyl ether, benzyl glycidyl ether, polypropylene glycol diglycidyl ether, 1, 4-butanediol diglycidyl ether and neopentyl glycol diglycidyl ether.
(6) The latent curing agent adopts at least two of dicyandiamide, modified imidazole, substituted urea latent curing agent and modified amine latent curing agent.
(7) The coupling agent adopts at least one of gamma- (2, 3-epoxypropoxy) propyl trimethoxy silane, 3-aminopropyl triethoxy silane and gamma-mercaptopropyl trimethoxy silane.
(8) The auxiliary agent is a dispersant. The dispersing agent is one or a mixture of more of BYK-W9010, DISPERBYK-111, BYK-9076, BYK-W980, DISPERBYK-102 and DISPERBYK-103, and the dispersing agents are all from Germany Pickery chemistry.
(9) The surfactant is a defoaming agent. The defoaming agent adopts BYK A530 of Pico chemistry, TEGO Airex 900 of Germany and KSZ-169A of Xinyue.
Further, the invention also provides a preparation method of the single-component epoxy flexible adhesive, which is used for preparing the single-component epoxy flexible adhesive and comprises the following steps:
step 1, weighing the following raw materials in parts by weight: 5-20 parts of bisphenol epoxy resin, 20-50 parts of flexible epoxy resin, 1-10 parts of toughening agent, 25-50 parts of filler, 1-5 parts of reactive diluent, 1-6 parts of latent curing agent, 0.1-1 part of coupling agent, 0.1-1 part of auxiliary agent and 0-0.2 part of surfactant.
And 2, adding the bisphenol epoxy resin, the flexible epoxy resin, the toughening agent, the reactive diluent, the coupling agent, the auxiliary agent and the surfactant into a reaction kettle, and stirring at a low speed of 200-800 rpm/min for 20-40 min at a temperature of 25-60 ℃.
And 3, adding the filler into the reaction kettle, stirring at a high speed of 900-1500 rpm/min for 50-70 min at the temperature of 25-60 ℃, and simultaneously opening vacuum.
And 4, adding the latent curing agent into the reaction kettle at the temperature of 25-35 ℃, starting vacuum, stirring at a high speed of 900-1500 rpm/min for 15-30 min, and controlling the temperature to be 25-50 ℃ in the stirring process, thereby preparing the single-component epoxy flexible adhesive.
Compared with the prior art, the single-component epoxy flexible adhesive provided by the invention has at least the following advantages:
(1) according to the invention, the special bisphenol epoxy resin, the special flexible epoxy resin and the special toughening agent are used in a matching manner according to a specific proportion, so that the adhesive has good flexibility, the hardness of a cured product of the adhesive is between A50 and D60, and the adhesive still maintains good flexibility after high-temperature aging.
(2) The single-component epoxy flexible adhesive provided by the invention has good flexibility, and can reduce the internal stress generated when the adhesive is cured or in a high-temperature and low-temperature environment, thereby reducing the damage to components.
(3) The single-component epoxy flexible adhesive provided by the invention adopts the special latent curing agent, so that the prepared single-component epoxy flexible adhesive only needs to be cured at a medium-low temperature of 80-120 ℃, and can be used in more applications, resources can be saved, the cost is reduced, and the production efficiency is improved.
(4) According to the invention, the single-component epoxy flexible adhesive glue is prepared by adopting the special bisphenol epoxy resin, the flexible epoxy resin, the toughening agent, the filler, the reactive diluent, the latent curing agent, the coupling agent, the auxiliary agent and the surfactant according to a specific proportion, so that the single-component epoxy flexible adhesive glue has good flexibility, the problem of flexibility reduction of the single-component epoxy flexible adhesive glue after high-temperature aging in the prior art can be effectively solved, the internal stress generated during curing of the adhesive glue or in a high-low temperature environment can be reduced, the damage to electronic components can be reduced, the single-component epoxy flexible adhesive glue can be cured only at a low temperature, the resources can be saved, the cost can be reduced, the production efficiency can be improved, and the single-component epoxy flexible adhesive glue can be applied to more fields.
(5) The single-component epoxy flexible adhesive provided by the invention is simple in preparation process and easy to operate.
In conclusion, the embodiment of the invention has good flexibility, can effectively solve the problem that the flexibility of the single-component epoxy flexible adhesive glue is reduced after the single-component epoxy flexible adhesive glue is aged at high temperature in the prior art, can reduce the internal stress generated when the adhesive glue is cured or in high and low temperature environments, reduces the damage to electronic components, can be cured at low and medium temperature, saves resources, reduces the cost, improves the production efficiency, and can be applied to more fields.
In order to more clearly show the technical scheme and the technical effects provided by the present invention, the following describes in detail the single-component epoxy flexible adhesive and the preparation method thereof provided by the embodiment of the present invention with specific embodiments.
Example 1
The preparation method of the single-component epoxy flexible adhesive comprises the following steps:
step A1, weighing the raw materials according to the formula in the following table 1:
TABLE 1
Step A2, adding the bisphenol epoxy resin shown in the table 1, the flexible epoxy resin shown in the table 1, the toughening agent shown in the table 1, the reactive diluent shown in the table 1, the coupling agent shown in the table 1, the auxiliary agent shown in the table 1 and the surfactant shown in the table 1 into a reaction kettle, and stirring at a low speed of 600rpm/min for 30min at a temperature of 25-60 ℃.
Step A3, adding the filler shown in the table 1 into the reaction kettle, stirring at a high speed of 1200rpm/min at the temperature of 35 ℃ and vacuumizing, wherein the high-speed stirring time is 50min, stopping stirring, closing vacuumizing, and starting to reduce the temperature.
And step A4, after the temperature is reduced to 25 ℃, adding the latent curing agent shown in the table 1 into the reaction kettle, starting vacuum, stirring at a high speed of 1200rpm/min for 20min, and controlling the temperature to be below 35 ℃ (not lower than 25 ℃) in the stirring process, thereby preparing the single-component epoxy flexible adhesive.
Example 2
The preparation method of the single-component epoxy flexible adhesive comprises the following steps:
step B1, weighing the raw materials according to the formula in the following table 2:
TABLE 2
And B2, adding the bisphenol epoxy resin shown in the table 2, the flexible epoxy resin shown in the table 2, the toughening agent shown in the table 2, the reactive diluent shown in the table 2, the coupling agent shown in the table 2, the auxiliary agent shown in the table 2 and the surfactant shown in the table 2 into the reaction kettle, and stirring at a low speed of 800rpm/min for 20min at a temperature of 25-60 ℃.
And step B3, adding the filler shown in the table 2 into the reaction kettle, stirring at a high speed of 1100rpm/min at the temperature of 30 ℃ and vacuumizing, wherein the high-speed stirring time is 60min, stopping stirring, closing vacuumizing, and starting to reduce the temperature.
And step B4, after the temperature is reduced to 30 ℃, adding the latent curing agent shown in the table 2 into the reaction kettle, starting vacuum, stirring at a high speed of 1200rpm/min for 20min, and controlling the temperature to be below 35 ℃ (not lower than 25 ℃) in the stirring process, thereby preparing the single-component epoxy flexible adhesive.
Example 3
The preparation method of the single-component epoxy flexible adhesive comprises the following steps:
step C1, weighing the raw materials according to the formula in the following table 3:
TABLE 3
And C2, adding the bisphenol epoxy resin shown in the table 3, the flexible epoxy resin shown in the table 3, the toughening agent shown in the table 3, the reactive diluent shown in the table 3, the coupling agent shown in the table 3, the auxiliary agent shown in the table 3 and the surfactant shown in the table 3 into the reaction kettle, and stirring at a low speed of 800rpm/min for 40min at a temperature of 25-60 ℃.
And step C3, adding the filler shown in the table 3 into the reaction kettle, stirring at a high speed of 1300rpm/min at the temperature of 40 ℃, vacuumizing, stopping stirring, closing vacuumizing, and starting to reduce the temperature, wherein the high-speed stirring time is 50 min.
And step C4, after the temperature is reduced to 30 ℃, adding the latent curing agent shown in the table 3 into the reaction kettle, starting vacuum, stirring at a high speed of 1100rpm/min for 30min, and controlling the temperature to be below 35 ℃ (not lower than 25 ℃) in the stirring process, thereby preparing the single-component epoxy flexible adhesive.
Example 4
The preparation method of the single-component epoxy flexible adhesive comprises the following steps:
step D1, weighing the raw materials according to the formula in the following table 4:
TABLE 4
| Composition of | Name (R) | Parts by weight |
| Bisphenol epoxy resin | Bisphenol F type epoxy resin NPEF-170 | 6 portions of |
| Polyether modified epoxy resin | ZK1815 | 45 portions of |
| Toughening agent | Closed polyurethane | 5 portions of |
| Toughening agent | Nitrile rubber modified epoxy resin | 4 portions of |
| Reactive diluent | 1, 4-butanediol diglycidyl ether | 4 portions of |
| Defoaming agent | BYK A530 | 0.1 part |
| Dispersing agent | BYK-W9010 | 0.3 part |
| Coupling agent | Gamma- (2, 3-glycidoxy) propyltrimethoxysilane | 0.5 portion |
| Filler material | Calcium carbonate | 32 portions of |
| Latent curing agent | Dicyandiamide, modified imidazole and substituted urea latent curing agent | 3 portions of |
。
And D2, adding the bisphenol epoxy resin shown in the table 4, the flexible epoxy resin shown in the table 4, the toughening agent shown in the table 4, the reactive diluent shown in the table 4, the coupling agent shown in the table 4, the auxiliary agent shown in the table 4 and the surfactant shown in the table 4 into the reaction kettle, and stirring at a low speed of 800rpm/min for 30min at a temperature of 25-60 ℃.
And D3, adding the filler shown in the table 4 into the reaction kettle, stirring at a high speed of 1400rpm/min at the temperature of 40 ℃, vacuumizing, stopping stirring, closing vacuumizing, and starting to reduce the temperature, wherein the high-speed stirring time is 40 min.
And D4, after the temperature is reduced to 35 ℃, adding the latent curing agent shown in the table 4 into the reaction kettle, starting vacuum, stirring at a high speed of 1200rpm/min for 20min, and controlling the temperature to be below 35 ℃ (not lower than 25 ℃) in the stirring process, thereby preparing the single-component epoxy flexible adhesive.
Comparative example 1
A single-component epoxy flexible adhesive comprises the following steps:
step a1, weighing the raw materials according to the formula in the following table 5:
TABLE 5
| Composition of | Name (R) | Parts by weight |
| Polyurethane modified epoxy resin | EPU 133L | 60 portions of |
| Polyether modified epoxy resin | Gen R509-2 | 15 portions of |
| Defoaming agent | BYK A530 | 0.1 part |
| Coupling agent | Gamma- (2, 3-glycidoxy) propyltrimethoxysilane | 0.5 portion |
| Filler material | Calcium carbonate and talcum powder | 15.9 portions |
| Latent curing agent | Dicyandiamide, modified imidazole and substituted urea latent curing agent | 8.5 parts of |
Step a2, adding the polyurethane modified epoxy resin shown in the table 5, the polyether modified epoxy resin shown in the table 5, the defoaming agent shown in the table 5 and the coupling agent shown in the table 5 into a reaction kettle, and stirring at a low speed of 800rpm/min for 20min at a temperature of 25-60 ℃.
Step a3, adding the filler shown in the table 5 into the reaction kettle, stirring at a high speed of 1300rpm/min at the temperature of 40 ℃ and vacuumizing, wherein the high-speed stirring time is 50min, then stopping stirring, closing vacuumizing, and starting to reduce the temperature.
Step a4, after the temperature is reduced to 35 ℃, adding the latent curing agent shown in the table 5 into the reaction kettle, starting vacuum, stirring at a high speed of 1200rpm/min for 30min, and controlling the temperature to be below 35 ℃ (not lower than 25 ℃) in the stirring process, thereby preparing the single-component epoxy flexible adhesive.
Performance detection
The following performance tests were performed on the one-component epoxy flexible adhesive prepared in the examples 1, 2,3, and 4 of the present invention and the one-component epoxy flexible adhesive prepared in the comparative example 1, respectively:
(1) and (3) detecting the hardness after curing: the post-curing hardness of example 1, example 2, example 3, example 4 and comparative example 1 was measured using a durometer in accordance with GB/T531.1-2008, respectively, to obtain the results shown in Table 6 below.
(2) And (3) detecting the tensile shear strength: the tensile shear strengths of example 1, example 2, example 3, example 4 and comparative example 1 were respectively measured using a tensile machine in accordance with GB/T7124-2008, thereby obtaining the results shown in Table 6 below.
(3) Hardness after aging at 130 ℃ for 24 h: the hardness of example 1, example 2, example 3, example 4 and comparative example 1 after aging at 130 c for 24 hours was respectively measured using a durometer to obtain the results shown in table 6 below.
TABLE 6
As can be seen from table 5 above: the curing agent can be cured at medium and low temperature of 80-120 ℃ in the embodiments 1, 2,3 and 4 of the invention. The hardness of the comparative example 1 after high-temperature aging at 130 ℃ for 24h is twice as high as that before high-temperature aging, which reaches the hardness of the conventional hard epoxy adhesive in the prior art and loses flexibility; the hardness of the single-component epoxy flexible adhesive in the embodiments 1, 2,3 and 4 of the invention after aging at 130 ℃ for 24h is slightly changed from the hardness before aging at high temperature, which shows that the embodiments of the invention not only have good flexibility, but also have high flexibility and stability, can effectively solve the problem of reduced flexibility of the single-component epoxy flexible adhesive in the prior art after aging at high temperature, can reduce the internal stress of the adhesive in high and low temperature environments, can reduce the damage to electronic components, and can be well applied to various electronic components.
In conclusion, the embodiment of the invention has good flexibility, can effectively solve the problem that the flexibility of the single-component epoxy flexible adhesive glue is reduced after the single-component epoxy flexible adhesive glue is aged at high temperature in the prior art, can reduce the internal stress generated when the adhesive glue is cured or in high and low temperature environments, reduces the damage to electronic components, can be cured at low and medium temperature, saves resources, reduces the cost, improves the production efficiency, and can be applied to more fields.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims. The information disclosed in this background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person skilled in the art.
Claims (5)
1. The single-component epoxy flexible adhesive is characterized by being mainly prepared from the following raw materials in parts by weight: 5-20 parts of bisphenol epoxy resin, 20-50 parts of flexible epoxy resin, 1-10 parts of toughening agent, 25-50 parts of filler, 1-5 parts of reactive diluent, 1-6 parts of latent curing agent, 0.1-1 part of coupling agent, 0.1-1 part of auxiliary agent and 0-0.2 part of surfactant;
wherein the bisphenol epoxy resin is at least one of bisphenol A epoxy resin and bisphenol F epoxy resin; the flexible epoxy resin is at least one of polyurethane modified epoxy resin, elastomer modified epoxy resin, dimer acid modified epoxy resin and polyether modified epoxy resin; the toughening agent is at least one of blocked polyurethane, nitrile rubber modified epoxy resin and polybutadiene rubber modified epoxy resin.
2. The one-component epoxy flexible adhesive according to claim 1, wherein the latent curing agent is at least two of dicyandiamide, modified imidazole, a substituted urea latent curing agent and a modified amine latent curing agent.
3. The one-component epoxy flexible adhesive according to claim 1 or 2, wherein the auxiliary agent is a dispersant, and the surfactant is an antifoaming agent.
4. The one-component epoxy flexible adhesive according to claim 1 or 2, wherein the filler is one or two of silica micropowder, calcium carbonate, aluminum hydroxide, alumina, talcum powder and nano calcium.
5. A method for preparing a single-component epoxy flexible adhesive according to any one of claims 1 to 4, comprising the steps of:
step 1, weighing the following raw materials in parts by weight: 5-20 parts of bisphenol epoxy resin, 20-50 parts of flexible epoxy resin, 1-10 parts of toughening agent, 25-50 parts of filler, 1-5 parts of reactive diluent, 1-6 parts of latent curing agent, 0.1-1 part of coupling agent, 0.1-1 part of auxiliary agent and 0-0.2 part of surfactant;
step 2, adding the bisphenol epoxy resin, the flexible epoxy resin, the toughening agent, the reactive diluent, the coupling agent, the auxiliary agent and the surfactant into a reaction kettle, and stirring for 20-40 min at the temperature of 25-60 ℃;
step 3, adding the filler into the reaction kettle, stirring for 50-70 min at the temperature of 25-60 ℃, and simultaneously starting vacuum;
step 4, adding the latent curing agent into the reaction kettle at the temperature of 25-35 ℃, starting vacuum, stirring for 15-30 min, and controlling the temperature to be 25-50 ℃ in the stirring process, thereby preparing the single-component epoxy flexible adhesive according to any one of claims 1-4.
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