CN114289391A - Liquid supplementing device and system for supplementing liquid - Google Patents
Liquid supplementing device and system for supplementing liquid Download PDFInfo
- Publication number
- CN114289391A CN114289391A CN202111666003.5A CN202111666003A CN114289391A CN 114289391 A CN114289391 A CN 114289391A CN 202111666003 A CN202111666003 A CN 202111666003A CN 114289391 A CN114289391 A CN 114289391A
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- China
- Prior art keywords
- liquid
- groove
- fluid
- replacement device
- fluid replacement
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- 239000007788 liquid Substances 0.000 title claims abstract description 114
- 230000001502 supplementing effect Effects 0.000 title claims abstract description 17
- 239000012530 fluid Substances 0.000 claims abstract description 33
- 238000004891 communication Methods 0.000 claims abstract description 19
- 238000002637 fluid replacement therapy Methods 0.000 claims description 28
- 239000007789 gas Substances 0.000 claims description 21
- 238000010926 purge Methods 0.000 claims description 16
- 238000001816 cooling Methods 0.000 claims description 6
- -1 polytetrafluoroethylene Polymers 0.000 claims description 5
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 5
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 5
- 239000011261 inert gas Substances 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 description 20
- 239000000126 substance Substances 0.000 description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- 235000012431 wafers Nutrition 0.000 description 8
- 238000001802 infusion Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Landscapes
- Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Wet Developing In Electrophotography (AREA)
Abstract
The embodiment of the invention discloses a liquid supplementing device and a system for supplementing liquid, wherein the liquid supplementing device comprises: the device comprises a cylinder body, a liquid inlet and a liquid outlet, wherein the circumferential wall of the cylinder body is provided with the liquid inlet and the liquid outlet; the circumferential outer surface of the rotor is provided with a groove, and the circumferential outer surface is matched with the circumferential inner surface of the cylinder body so that the circumferential inner surface can seal the groove; a liquid supply for supplying liquid to the groove via the liquid inlet; a driver for driving the rotor to rotate about the longitudinal axis of the barrel such that the groove is intermittently in fluid communication with the inlet and the outlet.
Description
Technical Field
The invention relates to the field of semiconductor silicon wafer production, in particular to a liquid supplementing device and system for supplementing liquid.
Background
In a silicon wafer production process, it is generally necessary to clean the silicon wafer using a cleaning bath and a cleaning solution contained in the cleaning bath. Due to the volatilization of chemical components in the cleaning solution or the volatilization of the cleaning solution as a whole, the cleaning tank needs to be replenished continuously, so that the proportion of the chemical components of the cleaning solution or the total amount of the cleaning solution meets the cleaning requirement.
A float-type fluid replacement device is generally used at present, in which the amount of fluid replacement is determined by the distance by which a float floating in the fluid level of a fluid replacement tank moves down. Specifically, liquid in the fluid infusion jar is carried via the pump, and the floater plays the switch action, and when the fluid infusion volume satisfied fluid infusion demand, the floater passed through the signal that the cue transmission was used for closing the pump.
The liquid replenishing device cannot meet the requirement of accurate liquid replenishing, for example, a gap may exist between the floating ball and the floating ball rod, so that the closing signal has hysteresis and instability, and in addition, the liquid level fluctuation can cause a wrong closing signal.
Disclosure of Invention
In order to solve the above technical problems, embodiments of the present invention are directed to a solution supplementing device and system for supplementing a solution, which can achieve the purpose of accurate solution supplementing, thereby better satisfying various requirements of a cleaning solution in a cleaning tank for cleaning silicon wafers.
The technical scheme of the invention is realized as follows:
in a first aspect, an embodiment of the present invention provides a fluid replacement device for fluid replacement, where the fluid replacement device includes:
the device comprises a cylinder body, a liquid inlet and a liquid outlet, wherein the circumferential wall of the cylinder body is provided with the liquid inlet and the liquid outlet;
the circumferential outer surface of the rotor is provided with a groove, and the circumferential outer surface is matched with the circumferential inner surface of the cylinder body so that the circumferential inner surface can seal the groove;
a liquid supply for supplying liquid to the groove via the liquid inlet;
a driver for driving the rotor to rotate about the longitudinal axis of the barrel such that the groove is intermittently in fluid communication with the inlet and the outlet.
Since the volume of the recess is constant, the amount of liquid that can be contained in the recess is determined even if the liquid supplier supplies an excessive amount of liquid, so that when the recess containing a certain amount of liquid is rotated to a position in fluid communication with the liquid outlet of the cylinder, the certain amount of liquid is discharged via the liquid outlet for replenishment, for example, to replenish the liquid into a rinse tank for rinsing silicon wafers, and therefore the amount of liquid replenished per one rotation of the rotor is constant, and the total amount of liquid replenished can be accurately determined according to the number of rotations of the rotor.
Preferably, the circumferential wall of the cylinder is further formed with an air inlet passage which is also in fluid communication with the groove when the liquid outlet is in fluid communication with the groove, and the liquid replenishing apparatus further comprises a gas purge for supplying purge gas to the groove via the air inlet passage.
Preferably, the purge gas is an inert gas.
Preferably, the gas purger comprises a cooling means for cooling the purge gas supplied to the recess.
Preferably, the liquid supplier is connected with the liquid inlet in a sealing manner, and the circumferential wall of the cylinder is further formed with an exhaust channel which is also communicated with the groove when the liquid inlet is communicated with the groove in a fluid manner.
Preferably, the exhaust passage is in fluid communication with the liquid supply via a conduit.
Preferably, the rotor is made of polytetrafluoroethylene.
Preferably, the drive is a servo motor.
Preferably, the recess is defined by a smooth surface.
In a second aspect, an embodiment of the present invention provides a system for fluid replacement, where the system includes:
the fluid replacement device according to the first aspect;
the acquisition device is used for acquiring the information of the liquid to be replenished so as to obtain the required replenishing liquid amount;
and the control device is used for controlling the driver of the liquid supplementing device according to the required liquid supplementing amount so as to enable the rotor to rotate for the required number of turns.
Drawings
FIG. 1 is a schematic longitudinal cross-sectional view of a fluid replacement device for replacing a fluid according to an embodiment of the present disclosure;
FIG. 2 is a schematic cross-sectional view taken along line A-A in FIG. 1;
FIG. 3 is a schematic longitudinal cross-sectional view of a portion of components of a fluid replacement device for replacing a fluid in accordance with another embodiment of the present disclosure;
FIG. 4 is a schematic longitudinal cross-sectional view of a fluid replacement device for replacing fluid according to yet another embodiment of the present disclosure;
FIG. 5 is a schematic diagram of the components of a system for replenishing fluid in accordance with an embodiment of the present invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Referring to fig. 1 and 2, an embodiment of the present invention provides a fluid replacement device 10 for fluid replacement, where the fluid replacement device 10 may include:
a cylinder 100, a circumferential wall of the cylinder 100 being formed with a liquid inlet 110 and a liquid outlet 120;
a rotor 200, a circumferential outer surface 200S of the rotor 200 is formed with a groove 210, the circumferential outer surface 200S is matched with the circumferential inner surface 100S of the cylinder 100 so that the groove 210 can be closed by the circumferential inner surface 100S, for example, as can be easily understood by referring to fig. 2, the groove 210 can be closed by the circumferential inner surface 100S after the rotor 200 is rotated clockwise or counterclockwise by a sufficient angle with respect to the cylinder 100;
a liquid supply 300, said liquid supply 300 being adapted to supply liquid to said recess 210 via said inlet port 110, for example by means of a supply line P1 shown in fig. 1 and 2, as schematically shown in fig. 1 and 2 by the arrows marked on supply line P1;
a driver 400, said driver 400 for driving said rotor 200 in rotation about the longitudinal axis X of said cylinder 100, as schematically illustrated by the annular arrow lines at the driver 400 in fig. 1 and at the rotor 200 in fig. 2, such that said groove 210 is intermittently in fluid communication with said inlet port 110 and said outlet port 120.
Since the volume of the recess 210 is constant, the amount of the liquid contained in the recess 210 is determined even when the liquid supplier 300 supplies an excessive amount of the liquid, so that when the recess 210 containing a certain amount of the liquid is rotated to a position in fluid communication with the liquid outlet 120 of the cylinder 100, the certain amount of the liquid is discharged through the liquid outlet 120 to perform liquid replenishment, for example, to replenish the liquid into a rinse tank for rinsing silicon wafers, and thus, the amount of the liquid replenished per one rotation of the rotor 200 is constant, and the total amount of the liquid replenished can be accurately determined according to the number of rotations of the rotor 200.
Referring to fig. 3, the circumferential wall of the cylinder 100 may further be formed with an air inlet passage 130, the air inlet passage 130 is also in fluid communication with the groove 210 when the liquid outlet 120 is in fluid communication with the groove 210, and the fluid replacement device 10 may further include a gas purge 500, the gas purge 500 being configured to supply purge gas to the groove 210 via the air inlet passage 130, as schematically shown by an arrow line at the air inlet passage 130 in fig. 3. In this way, the liquid contained in the groove 210 can be further promoted to be discharged through the liquid outlet 120, and the liquid is prevented from remaining on the surface defining the groove 210, so that the accuracy of liquid supplementing is not affected.
For example, in the case of replenishing a cleaning tank for cleaning silicon wafers, various chemical components are dissolved in the liquid contained in the cleaning tank, and the purge gas may be an inert gas in order to avoid the influence of the purge gas on the chemical components of the replenished liquid. The inert gas does not have any chemical reaction with the cleaning liquid, so that the chemical components of the cleaning liquid are not affected.
Also for example, in the case of a liquid replenishment of a cleaning tank for cleaning silicon wafers, the liquid contained in the cleaning tank has various chemical components dissolved therein and thus the chemical components are volatile, and accordingly, the replenishment liquid also contains volatile chemical components, in order to allow the amount of the replenishment liquid to be accurately controlled and the chemical component content of the replenishment liquid to be accurately controlled, it is preferable that the gas blower 500 includes a cooling part 510, see also fig. 3, for cooling the purge gas supplied to the recess 210. The cooled purge gas may serve to cool the liquid exiting the recess 210, thereby inhibiting the volatilization of the chemical components in the liquid, so that the content of the chemical components in the replenished liquid can be precisely controlled.
Referring to FIG. 4, the liquid supply 300 may be sealingly connected to the liquid inlet 110, for example, as shown in FIG. 4, the end of the supply line P1 connected to the liquid inlet 110 may be closely attached to the entire inner peripheral wall of the liquid inlet 110, in which case, correspondingly, the peripheral wall of the cartridge 100 may be further formed with an exhaust passage 140, the exhaust passage 140 also being in fluid communication with the groove 210 when the liquid inlet 110 is in fluid communication with the groove 210. In this way, in the case where the end of the supply line P1 connected to the inlet port 110 is tightly attached to the entire inner circumferential wall of the inlet port 110, resulting in the failure of the gas in the groove 210 to be discharged through the inlet port 110, the gas in the groove 210 can be discharged through the gas discharge passage 140, so that the liquid contained in the liquid supplier 300 can be smoothly supplied into the groove 210 and fill the groove 210.
In the foregoing embodiment, it can be understood that after the groove 210 is filled, the liquid supplied from the liquid supplier 300 may overflow to the outside through the air exhaust channel 140, thereby causing waste of the liquid. In this regard, and still referring to fig. 4, the vent passageway 140 may be in fluid communication with the liquid supply 300 via a return line P2. Thus, the liquid supplied continuously can be returned to the liquid supplier 300 through the return line P2, and the liquid is prevented from overflowing to the outside and being wasted. For the case specifically shown in fig. 4, it is apparent that the liquid supplier 300 does not supply liquid to the groove 210 by the action of gravity, but rather by means of a pump not shown in the drawings.
Preferably, the rotor 200 may be made of teflon. Polytetrafluoroethylene has the characteristics of acid resistance, alkali resistance and resistance to various organic solvents, and is almost insoluble in all solvents. Meanwhile, the polytetrafluoroethylene has the characteristic of high temperature resistance, and most importantly, the friction coefficient of the polytetrafluoroethylene is extremely low, so that the rotor 200 cannot be abraded under the condition that the rotor 200 frequently rotates relative to the cylinder 100, and the service life of the rotor 200 is prolonged.
Preferably, the driver 400 may be a servo motor. Thereby facilitating the number of turns required for the rotation of the rotor 200.
Preferably, although not shown in the drawings, the groove 210 may be defined by a surface that is smooth or does not contain sharp corners. Thereby further avoiding the liquid remaining in such corners from affecting the accuracy of the fluid infusion amount.
Referring to fig. 5, an embodiment of the present invention further provides a system 1 for fluid replacement, where the system 1 may include:
the fluid infusion device 10 according to various embodiments of the present invention;
the acquisition device 20 is used for acquiring information of liquid to be replenished so as to obtain the required replenishing liquid amount;
a control device 30, wherein the control device 30 is used for controlling the driver 400 of the fluid infusion device 10 according to the required fluid infusion amount so as to rotate the rotor 200 for the required number of turns.
It should be noted that: the technical schemes described in the embodiments of the present invention can be combined arbitrarily without conflict.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (10)
1. A fluid replacement device for replacing fluid, comprising:
the device comprises a cylinder body, a liquid inlet and a liquid outlet, wherein the circumferential wall of the cylinder body is provided with the liquid inlet and the liquid outlet;
the circumferential outer surface of the rotor is provided with a groove, and the circumferential outer surface is matched with the circumferential inner surface of the cylinder body so that the circumferential inner surface can seal the groove;
a liquid supply for supplying liquid to the groove via the liquid inlet;
a driver for driving the rotor to rotate about the longitudinal axis of the barrel such that the groove is intermittently in fluid communication with the inlet and the outlet.
2. The fluid replacement device according to claim 1, wherein the circumferential wall of the cylinder is further formed with an inlet passage that is in fluid communication with the recess when the outlet port is in fluid communication with the recess, the fluid replacement device further comprising a gas purge for supplying purge gas to the recess via the inlet passage.
3. The fluid replacement device of claim 2, wherein the purge gas is an inert gas.
4. The fluid replacement device of claim 2, wherein the gas purge comprises a cooling component for cooling purge gas supplied to the recess.
5. The fluid replacement device according to claim 1, wherein the liquid supply is in sealed connection with the liquid inlet, and the circumferential wall of the cylinder is further formed with an exhaust channel which is in fluid communication with the groove when the liquid inlet is in fluid communication with the groove.
6. The fluid replacement device of claim 5, wherein the vent channel is in fluid communication with the liquid supply via a conduit.
7. The fluid replacement device of claim 1, wherein the rotor is made of polytetrafluoroethylene.
8. The fluid replacement device of claim 1, wherein the drive is a servo motor.
9. The fluid replacement device of claim 1, wherein the groove is defined by a smooth surface.
10. A system for fluid replacement, the system comprising:
the fluid replacement device according to any one of claims 1 to 9;
the acquisition device is used for acquiring the information of the liquid to be replenished so as to obtain the required replenishing liquid amount;
and the control device is used for controlling the driver of the liquid supplementing device according to the required liquid supplementing amount so as to enable the rotor to rotate for the required number of turns.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111666003.5A CN114289391A (en) | 2021-12-31 | 2021-12-31 | Liquid supplementing device and system for supplementing liquid |
| TW111130856A TWI825925B (en) | 2021-12-31 | 2022-08-17 | Rehydration device and system for rehydration |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111666003.5A CN114289391A (en) | 2021-12-31 | 2021-12-31 | Liquid supplementing device and system for supplementing liquid |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114289391A true CN114289391A (en) | 2022-04-08 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111666003.5A Pending CN114289391A (en) | 2021-12-31 | 2021-12-31 | Liquid supplementing device and system for supplementing liquid |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN114289391A (en) |
| TW (1) | TWI825925B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201648472U (en) * | 2009-12-31 | 2010-11-24 | 东莞市康汇聚线材科技有限公司 | Vacuum liquid supplementing control device |
| CN108993015A (en) * | 2018-09-27 | 2018-12-14 | 长江存储科技有限责任公司 | Filter device and its maintaining method |
| CN209005763U (en) * | 2018-09-28 | 2019-06-21 | 苏州浩谱嘉自动化装备有限公司 | A kind of titration cell with liquid replenishing function |
| CN111980910A (en) * | 2020-09-04 | 2020-11-24 | 合肥亦威科技有限公司 | Self-balancing liquid-supplementing exhaust device for temperature control equipment |
| CN213854624U (en) * | 2020-11-25 | 2021-08-03 | 河南赛诺特生物技术有限公司 | Liquid subpackaging tool |
| CN214411122U (en) * | 2021-03-04 | 2021-10-15 | 无锡瑞达半导体专用设备有限公司 | Automatic liquid supplementing device of corrosion cleaning machine for wafers |
-
2021
- 2021-12-31 CN CN202111666003.5A patent/CN114289391A/en active Pending
-
2022
- 2022-08-17 TW TW111130856A patent/TWI825925B/en active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201648472U (en) * | 2009-12-31 | 2010-11-24 | 东莞市康汇聚线材科技有限公司 | Vacuum liquid supplementing control device |
| CN108993015A (en) * | 2018-09-27 | 2018-12-14 | 长江存储科技有限责任公司 | Filter device and its maintaining method |
| CN209005763U (en) * | 2018-09-28 | 2019-06-21 | 苏州浩谱嘉自动化装备有限公司 | A kind of titration cell with liquid replenishing function |
| CN111980910A (en) * | 2020-09-04 | 2020-11-24 | 合肥亦威科技有限公司 | Self-balancing liquid-supplementing exhaust device for temperature control equipment |
| CN213854624U (en) * | 2020-11-25 | 2021-08-03 | 河南赛诺特生物技术有限公司 | Liquid subpackaging tool |
| CN214411122U (en) * | 2021-03-04 | 2021-10-15 | 无锡瑞达半导体专用设备有限公司 | Automatic liquid supplementing device of corrosion cleaning machine for wafers |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI825925B (en) | 2023-12-11 |
| TW202300239A (en) | 2023-01-01 |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: Room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi 710065 Applicant after: Xi'an Yisiwei Material Technology Co.,Ltd. Applicant after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: Room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi 710065 Applicant before: Xi'an yisiwei Material Technology Co.,Ltd. Applicant before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |
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| CB02 | Change of applicant information | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20220408 |
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| RJ01 | Rejection of invention patent application after publication |