CN114282488A - Method, device, equipment and medium for checking and correcting wiring width of device pin - Google Patents
Method, device, equipment and medium for checking and correcting wiring width of device pin Download PDFInfo
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- 229910052802 copper Inorganic materials 0.000 claims abstract description 158
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Abstract
The invention belongs to the technical field of PCB design, and particularly provides a method, a device, equipment and a medium for checking and correcting the wiring width of a device pin, wherein the method comprises the following steps: selecting an examination region; obtaining pin information in an inspection area, and putting the obtained pin information into a pin array, wherein the pin information comprises pins and corresponding coordinate information; traversing each element of the pin array, and searching the connection of the pins; when the pin is connected with the line segment, comparing the pin width with the line segment width, and correcting the width of the connected line segment according to the comparison result; when the pins are connected with the copper sheets, the coordinate values of the pins and the copper sheets are compared, the area of the copper sheets exceeding the pins is calculated according to the comparison result, and the shape of the copper sheets is corrected according to the calculated area. When the pin with potential safety hazard is detected, wiring correction is carried out in PCB wiring, so that the safety and stability of PCB wiring are ensured.
Description
Technical Field
The invention relates to the technical field of PCB design, in particular to a method, a device, equipment and a medium for checking and correcting the wiring width of a device pin.
Background
At present, a plurality of PCB design software exist in the market, Cadence is used as the most widely applied software in the industry, and not only does the Cadence have strong functions and a plurality of related software as supports, but also a user can perform secondary development according to the Cadence. The speaker language is a high-level programming language which is built in Cadence software and is based on a C language and an LISP language, the Cadence provides rich interactive functions for the speaker language, and the work efficiency can be effectively improved by researching the speaker language and then writing tools and putting into application.
In the PCB design, in order to meet the loading requirements of devices with different parameter specifications, in the device packaging, the width of PIN design is to establish bonding pads with different widths according to chips. And in PCB design process, according to different attributes NET, have the line requirement of difference of walking, many attributes walk the width that line or the wiring copper sheet of connecting can exceed PIN in the design, and relatively intensive PIN will have the risk of short circuit because of after the later stage is finished, and later stage is wasted time and energy through manual inspection, omits easily.
Disclosure of Invention
The invention provides a method, a device, equipment and a medium for checking and correcting the wiring width of a device PIN, and aims to solve the problems that wiring or connected wiring copper sheets exceed the width of a PIN (personal identification number), relatively dense PINs have short circuit risks after parts are loaded in the later period, and time and labor are wasted and omission is easy to occur in the later period through manual checking.
The technical scheme of the invention is as follows:
in a first aspect, the technical solution of the present invention provides a method for inspecting and correcting a wiring width of a device pin, including the following steps:
selecting an examination region;
obtaining pin information in an inspection area, and putting the obtained pin information into a pin array, wherein the pin information comprises pins and corresponding coordinate information;
traversing each element of the pin array, and searching the connection of the pins;
when the pin is connected with the line segment, comparing the pin width with the line segment width, and correcting the width of the connected line segment according to the comparison result;
when the pins are connected with the copper sheets, the coordinate values of the pins and the copper sheets are compared, the area of the copper sheets exceeding the pins is calculated according to the comparison result, and the shape of the copper sheets is corrected according to the calculated area.
Further, when the pin is connected with the line segment, the pin width is compared with the line segment width, and the step of correcting the width of the connection line segment according to the comparison result comprises the following steps:
when the pin is connected with the line segment, acquiring the width of the pin and the width of the connected line segment;
calculating the difference between the width of the pin and the width of the line segment;
when the difference is greater than or equal to 0, deleting the pin from the pin array, and searching the connection of the next pin;
when the difference is less than 0, acquiring the length d of the pin;
the width of a line segment with the length d taking the center of the pin as a starting point is modified into the width of the pin.
Further, when the pin is connected with the copper sheet, the coordinate values of the pin and the copper sheet are compared, the area of the copper sheet exceeding the pin is calculated through the comparison result, and the step of correcting the shape of the copper sheet according to the calculated area comprises the following steps:
when the pins are connected with the copper sheets, coordinates of all vertexes of the copper sheets are obtained and are put into the copper sheet shape array;
obtaining the coordinates of each vertex of the pin and putting the coordinates into a pin shape array;
comparing the coordinate values of the pins and the copper sheet, and calculating the area of the copper sheet exceeding the pins according to the comparison result;
and correcting the shape of the copper sheet according to the calculated area.
Further, the step of comparing the coordinate values of the pins and the copper sheet and calculating the area of the copper sheet exceeding the pins according to the comparison result comprises the following steps:
comparing the coordinate of each vertex of the pin with the coordinate value of each vertex corresponding to the connected copper sheet;
when the coordinate value of any vertex of the copper sheet is larger than the coordinate value of the corresponding vertex of the pin, judging that the vertex coordinate of the copper sheet exceeds the vertex coordinate of the pin;
the area of excess is calculated from the compared difference.
Further, the step of comparing the coordinates of each vertex of the pin with the values of the coordinates of each vertex corresponding to the connected copper sheet further comprises:
acquiring outline coordinates of the pin shape array;
and acquiring contour coordinates of the copper sheet shape array, wherein the edge of the pin far away from the center of the device is defined as a third edge, the edge corresponding to the third edge is a first edge, and the edges connected with the first edge are respectively a second edge and a fourth edge.
Further, in the step of calculating the excess area by comparing the difference, the excess area is the sum of the area exceeding the first edge, the area exceeding the second edge and the area exceeding the fourth edge;
the step of correcting the shape of the copper sheet according to the calculated area comprises the following steps:
and cutting off the calculated exceeding area to enable the copper sheet to coincide with the connection positions of the first edge, the second edge and the fourth edge of the pin.
Further, the method further comprises:
setting a chamfer angle on the copper sheet connected with the third edge at the position of the pin connection inflection point according to the pin coordinate;
the corrected pin is deleted from the pin array.
In a second aspect, the technical scheme of the invention provides a device pin wiring width inspection and correction device, which comprises a region selection module, a pin information acquisition module, a traversal search module, a line segment inspection and correction module and a copper sheet inspection and correction module;
the region selection module is used for selecting an inspection region;
the pin information acquisition module is used for acquiring pin information in the inspection area and putting the acquired pin information into the pin array; the pin information comprises pins and corresponding coordinate information;
the traversal searching module is used for traversing each element of the pin array and searching the connection of the pins;
the line segment checking and correcting module is used for comparing the width of the pins with the width of the line segment when the pins are connected with the line segment, and correcting the width of the connected line segment according to a comparison result;
and the copper sheet checking and correcting module is used for comparing the pins with the coordinate values of the copper sheets when the pins are connected with the copper sheets, calculating the area of the copper sheets exceeding the pins according to the comparison result, and correcting the shape of the copper sheets according to the calculated area.
Further, the line segment checking and correcting module comprises a size obtaining unit, a first calculating unit, a processing unit and a width correcting unit;
the size acquisition unit is used for acquiring the width of the pin and the width of the connected line segment when the pin is connected with the line segment; the method is also used for obtaining the length d of the pin when the difference value is less than 0;
the first calculating unit is used for calculating the difference between the width of the pin and the width of the line segment;
the processing unit is used for deleting the pin from the pin number sequence when the difference value is greater than or equal to 0, and outputting information to the traversal searching module to search for the connection of the next pin;
and the correcting unit is used for modifying the width of a line segment with the length d taking the center of the pin as a starting point into the width of the pin.
Further, the copper sheet checking and correcting module comprises a vertex coordinate obtaining unit, a coordinate comparing unit, a second calculating unit and a shape correcting unit;
the vertex coordinate acquisition unit is used for acquiring coordinates of each vertex of the copper sheet and putting the coordinates into the copper sheet shape array when the pins are connected with the copper sheet; obtaining the coordinates of each vertex of the pin and putting the coordinates into a pin shape array;
the coordinate comparison unit is used for comparing the pin with the copper sheet coordinate value;
the second calculation unit is used for calculating the area of the copper sheet exceeding the pins according to the comparison result;
and the shape correcting unit is used for correcting the shape of the copper sheet according to the calculated area.
Further, the coordinate comparison unit is used for comparing the coordinate of each vertex of the pin with the value of the coordinate of each vertex corresponding to the connected copper sheet; when the coordinate value of any vertex of the copper sheet is larger than the coordinate value of the corresponding vertex of the pin, judging that the vertex coordinate of the copper sheet exceeds the vertex coordinate of the pin;
and the second calculating unit is used for calculating the exceeding area through the compared difference value.
Further, the copper sheet checking and correcting module also comprises a contour coordinate acquisition unit;
the outline coordinate acquisition unit is used for acquiring outline coordinates of the pin shape array; and acquiring contour coordinates of the copper sheet shape array, wherein the edge of the pin far away from the center of the device is defined as a third edge, the edge corresponding to the third edge is a first edge, and the edges connected with the first edge are respectively a second edge and a fourth edge.
Further, the second calculation unit calculates the excess area as the sum of the area exceeding the first edge and the area exceeding the second edge and the area exceeding the fourth edge;
and the shape correction unit is specifically used for cutting off the calculated exceeding area to enable the copper sheet to coincide with the connection positions of the first edge, the second edge and the fourth edge of the pin.
Furthermore, the device also comprises a setting module and a deleting module;
the setting module is used for setting a chamfer angle of the copper sheet connected with the third edge at the position of the pin connection inflection point according to the pin coordinate;
and the deleting module is used for deleting the corrected pins from the pin array.
In a third aspect, the present invention further provides a computer device, including a processor and a memory, where the processor and the memory complete communication with each other through a bus; the memory stores program instructions executable by the processor, and the processor calls the program instructions to execute the method for checking and correcting the wiring width of the pin of the device according to the first aspect.
In a fourth aspect, the present invention further provides a non-transitory computer-readable storage medium, which stores computer instructions for causing a computer to execute the method for checking and correcting the wiring width of a device pin according to the first aspect.
According to the technical scheme, the invention has the following advantages: the method can quickly and accurately check the pin wiring which possibly has potential safety hazards in the wiring of the printed circuit board. When the pin with potential safety hazard is detected, wiring correction is carried out in PCB wiring, so that the safety and stability of PCB wiring are ensured.
In addition, the invention has reliable design principle, simple structure and very wide application prospect.
Therefore, compared with the prior art, the invention has prominent substantive features and remarkable progress, and the beneficial effects of the implementation are also obvious.
Drawings
In order to more clearly illustrate the embodiments or technical solutions in the prior art of the present invention, the drawings used in the description of the embodiments or prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.
FIG. 1 is a schematic flow diagram of a method of one embodiment of the invention.
FIG. 2 is a schematic flow chart diagram of checking for corrections when connecting line segments in a method in accordance with one embodiment of the present invention.
FIG. 3 is a schematic flow chart of the inspection and correction of copper skin connections in a method according to one embodiment of the invention.
Fig. 4 is a schematic diagram of coordinates of the pin and the copper sheet according to the embodiment of the invention.
FIG. 5 is a schematic illustration of an over-area display calculated from the coordinates provided in FIG. 4.
FIG. 6 is a schematic block diagram of an apparatus of one embodiment of the present invention.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the drawings in the embodiment of the present invention, and it is obvious that the described embodiment is only a part of the embodiment of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1, an embodiment of the present invention provides a method for checking and correcting a device pin wiring width, including the following steps:
step 1: selecting an examination region;
in the step, a command Axl _ Seiect () can be used for selecting a pin in a Find window and selecting an inspection area by a mouse frame;
step 2: obtaining pin information in an inspection area, and putting the obtained pin information into a pin array, wherein the pin information comprises pins and corresponding coordinate information;
putting the selected pin into a pin number sequence list _ pin, wherein the list _ pin is taken as an element in the list _ pin as an example, and the list _ pin is equal to the list (pin1, pin 2 and pin 3 … …);
and step 3: traversing elements of the pin array, and searching the connection of the pins;
the line segment (surface layer trace) connected with the pin is found through the axlPinToCline function, and when the connected trace cannot be found, the copper sheet (copper-clad shape) connected with the pin is found through the axlPinToShape function.
And 4, step 4: when the pin is connected with the line segment, comparing the pin width with the line segment width, and correcting the width of the connected line segment according to the comparison result;
and 5: when the pins are connected with the copper sheets, the coordinate values of the pins and the copper sheets are compared, the area of the copper sheets exceeding the pins is calculated according to the comparison result, and the shape of the copper sheets is corrected according to the calculated area. When the connected wiring cannot be found, finding the copper sheet connected with the pin through an axlPinToShape function; the copper skin connected to this pin is found by the axlpinnToShape function.
In this embodiment, the traversal of each element in the pin list is completed. That is, step 4 and step 5 are followed by the steps of:
step 6: whether the pin list is traversed or not is finished; if yes, executing step 7, otherwise, executing step 3 to search the connection of the next pin;
and 7: and (6) ending.
As shown in fig. 2, in some embodiments, in step 4, when the pin connects the line segment, the pin width is compared with the line segment width, and the step of performing the width correction of the connection line segment according to the comparison result includes:
step 41: acquiring the width of the pin and the width of a connected line segment;
when finding out the line segment connected with the pin through the axlPinToCline function, the axlGain function is used to obtain the widths of the pin and the line segment. Here, the width of the pin is a, and the width of the line segment is b;
step 42: calculating the difference between the width of the pin and the width of the line segment; calculating the difference value of a and b as c;
step 43: judging whether the difference is less than 0, if so, executing step 45; otherwise, go to step 44;
step 44: deleting the pin from the pin sequence, executing the step 3, and searching the connection of the next pin;
step 45: obtaining the length d of the pin;
in the step, the length of the pin is obtained through an axlPinWidth function and is d;
step 46: modifying the width of a line segment with the length d taking the center of the pin as a starting point into the width of the pin;
step 47: and deleting the corrected pins in the pin array.
As shown in fig. 3, in some embodiments, in step 5, when the pin is connected to the copper sheet, the coordinate values of the pin and the copper sheet are compared, the area of the copper sheet exceeding the pin is calculated according to the comparison result, and the step of correcting the shape of the copper sheet according to the calculated area includes:
step 51: obtaining coordinates of each vertex of the copper sheet and putting the coordinates into a copper sheet shape array;
obtaining coordinates of each vertex of the copper sheet by using an axlshape function, and putting the coordinates into a copper sheet shape number series list _ shape;
step 52: obtaining the coordinates of each vertex of the pin and putting the coordinates into a pin shape array;
obtaining the coordinates of each vertex of the pin by using an axlpin function, and putting the coordinates into a pin shape sequence list _ pin shape;
step 53: comparing the coordinate values of the pins and the copper sheet, and calculating the area of the copper sheet exceeding the pins according to the comparison result;
it should be noted that the specific steps in this step include:
step 531: acquiring outline coordinates of the pin shape array;
for example, the series list _ pin contour coordinates (X1, Y1), (X1, Y3), (X3, Y1), (X3, Y4) are acquired;
step 532: acquiring contour coordinates of the copper sheet shape array, wherein the edge of the pin far away from the center of the device is defined as a third edge 103, the edge corresponding to the third edge 103 is a first edge 101, and the edges connected with the first edge 101 are a second edge 102 and a fourth edge 104 respectively; acquiring contour coordinates (X2, Y2), (X4, Y2), (X2, Y3), (X4, Y4) of the copper sheet 200; as shown in fig. 4.
Step 533: comparing the coordinate of each vertex of the pin with the coordinate value of each vertex corresponding to the connected copper sheet;
step 534: when the coordinate value of any vertex of the copper sheet is larger than the coordinate value of the corresponding vertex of the pin, judging that the vertex coordinate of the copper sheet exceeds the vertex coordinate of the pin;
for example, when | Y2| > | Y1| or | X2| > | X1| or | X4| > | X3| or | Y4| > | Y3| it is determined that the copper skin vertex coordinates exceed the pin vertex coordinates;
step 535: the area of excess is calculated from the compared difference.
S1=|X2-X1|*|Y2-Y3|+|X4-X3|*|Y4-Y2|+|X4-X2|*|Y2-Y1|;
Step 54: and correcting the shape of the copper sheet according to the calculated area.
Correcting the copper sheet with the same width as the pin by using an axlcutspane function; as shown in fig. 5, the copper skin of the black area S1 is cut away. The calculated S1 is cut out so that the copper sheet overlaps the connection positions of the first side 101, the second side 102, and the fourth side 104 of the lead.
Step 55: deleting the corrected pins from the pin array;
in some embodiments, to reduce interference, the method further comprises:
step 56: and setting a chamfer angle at the position of the pin connection inflection point of the copper sheet connected with the third edge according to the pin coordinate.
As shown in fig. 6, an embodiment of the present invention provides an inspection and correction device for a device pin wiring width, including a region selection module, a pin information acquisition module, a traversal search module, a line segment inspection and correction module, and a copper sheet inspection and correction module;
the region selection module is used for selecting an inspection region;
the pin information acquisition module is used for acquiring pin information in the inspection area and putting the acquired pin information into the pin array; the pin information comprises pins and corresponding coordinate information;
the traversal searching module is used for traversing each element of the pin array and searching the connection of the pins;
the line segment checking and correcting module is used for comparing the width of the pins with the width of the line segment when the pins are connected with the line segment, and correcting the width of the connected line segment according to a comparison result;
and the copper sheet checking and correcting module is used for comparing the pins with the coordinate values of the copper sheets when the pins are connected with the copper sheets, calculating the area of the copper sheets exceeding the pins according to the comparison result, and correcting the shape of the copper sheets according to the calculated area.
In some embodiments, the line segment checking and correcting module comprises a size obtaining unit, a first calculating unit, a processing unit and a width correcting unit;
the size acquisition unit is used for acquiring the width of the pin and the width of the connected line segment when the pin is connected with the line segment; the method is also used for obtaining the length d of the pin when the difference value is less than 0;
the first calculating unit is used for calculating the difference between the width of the pin and the width of the line segment;
the processing unit is used for deleting the pin from the pin number sequence when the difference value is greater than or equal to 0, and outputting information to the traversal searching module to search for the connection of the next pin;
and the correcting unit is used for modifying the width of a line segment with the length d taking the center of the pin as a starting point into the width of the pin.
In some embodiments, the copper sheet checking and correcting module comprises a vertex coordinate obtaining unit, a coordinate comparing unit, a second calculating unit and a shape correcting unit;
the vertex coordinate acquisition unit is used for acquiring coordinates of each vertex of the copper sheet and putting the coordinates into the copper sheet shape array when the pins are connected with the copper sheet; obtaining the coordinates of each vertex of the pin and putting the coordinates into a pin shape array;
the coordinate comparison unit is used for comparing the pin with the copper sheet coordinate value; the pin connecting device is specifically used for comparing the coordinates of each vertex of the pin with the values of the coordinates of each vertex corresponding to the connected copper sheets; when the coordinate value of any vertex of the copper sheet is larger than the coordinate value of the corresponding vertex of the pin, judging that the vertex coordinate of the copper sheet exceeds the vertex coordinate of the pin;
the second calculation unit is used for calculating the area of the copper sheet exceeding the pins according to the comparison result;
and the shape correcting unit is used for correcting the shape of the copper sheet according to the calculated area.
In some embodiments, the copper sheet checking and correcting module further comprises a contour coordinate acquisition unit;
the outline coordinate acquisition unit is used for acquiring outline coordinates of the pin shape array; and acquiring contour coordinates of the copper sheet shape array, wherein the edge of the pin far away from the center of the device is defined as a third edge, the edge corresponding to the third edge is a first edge, and the edges connected with the first edge are respectively a second edge and a fourth edge.
The second calculation unit calculates the sum of the area exceeding the first edge and the area exceeding the second edge and the area exceeding the fourth edge;
and the shape correction unit is specifically used for cutting off the calculated exceeding area to enable the copper sheet to coincide with the connection positions of the first edge, the second edge and the fourth edge of the pin.
In some embodiments, the apparatus further comprises a setup module and a delete module;
the setting module is used for setting a chamfer angle of the copper sheet connected with the third edge at the position of the pin connection inflection point according to the pin coordinate;
and the deleting module is used for deleting the corrected pins from the pin array.
The computer device provided by the embodiment of the invention can comprise: the system comprises a processor, a communication interface, a memory and a bus, wherein the processor, the communication interface and the memory are communicated with each other through the bus. The bus may be used for information transfer between the electronic device and the sensor. The processor may call logic instructions in memory to perform the following method: step 1: selecting an examination region; step 2: obtaining pin information in an inspection area, and putting the obtained pin information into a pin array, wherein the pin information comprises pins and corresponding coordinate information; and step 3: traversing elements of the pin array, and searching the connection of the pins; and 4, step 4: when the pin is connected with the line segment, comparing the pin width with the line segment width, and correcting the width of the connected line segment according to the comparison result; and 5: when the pins are connected with the copper sheets, the coordinate values of the pins and the copper sheets are compared, the area of the copper sheets exceeding the pins is calculated according to the comparison result, and the shape of the copper sheets is corrected according to the calculated area. Step 6: whether the pin list is traversed or not is finished; if yes, executing step 7, otherwise, executing step 3 to search the connection of the next pin; and 7: and (6) ending.
In some specific embodiments, the program instructions executed by the processor may specifically implement the following steps: step 41: acquiring the width of the pin and the width of a connected line segment; step 42: calculating the difference between the width of the pin and the width of the line segment; calculating the difference value of a and b as c; step 43: judging whether the difference is less than 0, if so, executing step 45; otherwise, go to step 44; step 44: deleting the pin from the pin sequence, executing the step 3, and searching the connection of the next pin; step 45: obtaining the length d of the pin; step 46: modifying the width of a line segment with the length d taking the center of the pin as a starting point into the width of the pin; step 47: and deleting the corrected pins in the pin array.
In some specific embodiments, the program instructions executed by the processor may specifically implement the following steps: step 51: obtaining coordinates of each vertex of the copper sheet and putting the coordinates into a copper sheet shape array; step 52: obtaining the coordinates of each vertex of the pin and putting the coordinates into a pin shape array; step 53: comparing the coordinate values of the pins and the copper sheet, and calculating the area of the copper sheet exceeding the pins according to the comparison result; step 54: and correcting the shape of the copper sheet according to the calculated area. Step 55: deleting the corrected pins from the pin array; step 56: and setting a chamfer angle at the position of the pin connection inflection point of the copper sheet connected with the third edge according to the pin coordinate.
In some specific embodiments, the program instructions executed by the processor may specifically implement the following steps: step 531: acquiring outline coordinates of the pin shape array; step 532: acquiring contour coordinates of the copper sheet shape array; step 533: comparing the coordinate of each vertex of the pin with the coordinate value of each vertex corresponding to the connected copper sheet; step 534: when the coordinate value of any vertex of the copper sheet is larger than the coordinate value of the corresponding vertex of the pin, judging that the vertex coordinate of the copper sheet exceeds the vertex coordinate of the pin; step 535: the area of excess is calculated from the compared difference.
In addition, the logic instructions in the memory may be implemented in the form of software functional units and may be stored in a computer readable storage medium when sold or used as a stand-alone product. Based on such understanding, the technical solution of the present invention may be embodied in the form of a software product, which is stored in a storage medium and includes instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method according to the embodiments of the present invention. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes.
Embodiments of the present invention provide a non-transitory computer-readable storage medium storing computer instructions that cause a computer to perform a method provided by the above method embodiments, for example, including: step 1: selecting an examination region; step 2: obtaining pin information in an inspection area, and putting the obtained pin information into a pin array, wherein the pin information comprises pins and corresponding coordinate information; and step 3: traversing elements of the pin array, and searching the connection of the pins; and 4, step 4: when the pin is connected with the line segment, comparing the pin width with the line segment width, and correcting the width of the connected line segment according to the comparison result; and 5: when the pins are connected with the copper sheets, the coordinate values of the pins and the copper sheets are compared, the area of the copper sheets exceeding the pins is calculated according to the comparison result, and the shape of the copper sheets is corrected according to the calculated area. Step 6: whether the pin list is traversed or not is finished; if yes, executing step 7, otherwise, executing step 3 to search the connection of the next pin; and 7: and (6) ending.
In some specific embodiments, the program instructions executed by the processor in the readable storage medium may specifically implement the following steps: step 41: acquiring the width of the pin and the width of a connected line segment; step 42: calculating the difference between the width of the pin and the width of the line segment; calculating the difference value of a and b as c; step 43: judging whether the difference is less than 0, if so, executing step 45; otherwise, go to step 44; step 44: deleting the pin from the pin sequence, executing the step 3, and searching the connection of the next pin; step 45: obtaining the length d of the pin; step 46: modifying the width of a line segment with the length d taking the center of the pin as a starting point into the width of the pin; step 47: and deleting the corrected pins in the pin array.
In some specific embodiments, the program instructions executed by the processor in the readable storage medium may specifically implement the following steps: step 51: obtaining coordinates of each vertex of the copper sheet and putting the coordinates into a copper sheet shape array; step 52: obtaining the coordinates of each vertex of the pin and putting the coordinates into a pin shape array; step 53: comparing the coordinate values of the pins and the copper sheet, and calculating the area of the copper sheet exceeding the pins according to the comparison result; step 54: and correcting the shape of the copper sheet according to the calculated area. Step 55: deleting the corrected pins from the pin array; step 56: and setting a chamfer angle at the position of the pin connection inflection point of the copper sheet connected with the third edge according to the pin coordinate.
In some specific embodiments, the program instructions executed by the processor in the readable storage medium may specifically implement the following steps: step 531: acquiring outline coordinates of the pin shape array; step 532: acquiring contour coordinates of the copper sheet shape array; step 533: comparing the coordinate of each vertex of the pin with the coordinate value of each vertex corresponding to the connected copper sheet; step 534: when the coordinate value of any vertex of the copper sheet is larger than the coordinate value of the corresponding vertex of the pin, judging that the vertex coordinate of the copper sheet exceeds the vertex coordinate of the pin; step 535: the area of excess is calculated from the compared difference.
Although the present invention has been described in detail by referring to the drawings in connection with the preferred embodiments, the present invention is not limited thereto. Various equivalent modifications or substitutions can be made on the embodiments of the present invention by those skilled in the art without departing from the spirit and scope of the present invention, and these modifications or substitutions are within the scope of the present invention/any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (10)
1. A method for checking and correcting the wiring width of a device pin is characterized by comprising the following steps:
selecting an examination region;
obtaining pin information in an inspection area, and putting the obtained pin information into a pin array, wherein the pin information comprises pins and corresponding coordinate information;
traversing each element of the pin array, and searching the connection of the pins;
when the pin is connected with the line segment, comparing the pin width with the line segment width, and correcting the width of the connected line segment according to the comparison result;
when the pins are connected with the copper sheets, the coordinate values of the pins and the copper sheets are compared, the area of the copper sheets exceeding the pins is calculated according to the comparison result, and the shape of the copper sheets is corrected according to the calculated area.
2. The method for inspecting and correcting the wiring width of the device pin according to claim 1, wherein when the pin is connected to the line segment, the pin width is compared with the line segment width, and the step of correcting the width of the connected line segment according to the comparison result comprises:
when the pin is connected with the line segment, acquiring the width of the pin and the width of the connected line segment;
calculating the difference between the width of the pin and the width of the line segment;
when the difference is greater than or equal to 0, deleting the pin from the pin array, and searching the connection of the next pin;
when the difference is less than 0, acquiring the length d of the pin;
the width of a line segment with the length d taking the center of the pin as a starting point is modified into the width of the pin.
3. The method for inspecting and correcting the wiring width of the device pin according to claim 2, wherein when the pin is connected to the copper sheet, the coordinate values of the pin and the copper sheet are compared, the area of the copper sheet exceeding the pin is calculated according to the comparison result, and the step of correcting the shape of the copper sheet according to the calculated area comprises:
when the pins are connected with the copper sheets, coordinates of all vertexes of the copper sheets are obtained and are put into the copper sheet shape array;
obtaining the coordinates of each vertex of the pin and putting the coordinates into a pin shape array;
comparing the coordinate values of the pins and the copper sheet, and calculating the area of the copper sheet exceeding the pins according to the comparison result;
and correcting the shape of the copper sheet according to the calculated area.
4. The method for inspecting and correcting the wiring width of the device pin according to claim 3, wherein the step of comparing the coordinate values of the pin and the copper sheet and calculating the area of the copper sheet exceeding the pin according to the comparison result comprises:
comparing the coordinate of each vertex of the pin with the coordinate value of each vertex corresponding to the connected copper sheet;
when the coordinate value of any vertex of the copper sheet is larger than the coordinate value of the corresponding vertex of the pin, judging that the vertex coordinate of the copper sheet exceeds the vertex coordinate of the pin;
the area of excess is calculated from the compared difference.
5. The method for inspecting and correcting the wiring width of the device pin according to claim 4, wherein the step of comparing the coordinates of each vertex of the pin with the values of the coordinates of each vertex corresponding to the connected copper sheet further comprises:
acquiring outline coordinates of the pin shape array;
and acquiring contour coordinates of the copper sheet shape array, wherein the edge of the pin far away from the center of the device is defined as a third edge, the edge corresponding to the third edge is a first edge, and the edges connected with the first edge are respectively a second edge and a fourth edge.
6. The method for inspecting and correcting wiring width of device pins according to claim 5, wherein in the step of calculating the excess area by comparing the difference, the excess area is a sum of the area exceeding the first edge and the area exceeding the second edge and the area exceeding the fourth edge;
the step of correcting the shape of the copper sheet according to the calculated area comprises the following steps:
and cutting off the calculated exceeding area to enable the copper sheet to coincide with the connection positions of the first edge, the second edge and the fourth edge of the pin.
7. The method for inspecting and correcting the wiring width of the device pin according to claim 6, further comprising:
setting a chamfer angle on the copper sheet connected with the third edge at the position of the pin connection inflection point according to the pin coordinate;
the corrected pin is deleted from the pin array.
8. The device pin wiring width inspection and correction device is characterized by comprising an area selection module, a pin information acquisition module, a traversal search module, a line segment inspection and correction module and a copper sheet inspection and correction module;
the region selection module is used for selecting an inspection region;
the pin information acquisition module is used for acquiring pin information in the inspection area and putting the acquired pin information into the pin array; the pin information comprises pins and corresponding coordinate information;
the traversal searching module is used for traversing each element of the pin array and searching the connection of the pins;
the line segment checking and correcting module is used for comparing the width of the pins with the width of the line segment when the pins are connected with the line segment, and correcting the width of the connected line segment according to a comparison result;
and the copper sheet checking and correcting module is used for comparing the pins with the coordinate values of the copper sheets when the pins are connected with the copper sheets, calculating the area of the copper sheets exceeding the pins according to the comparison result, and correcting the shape of the copper sheets according to the calculated area.
9. A computer device comprising a processor and a memory, wherein the processor and the memory communicate with each other via a bus; the memory stores program instructions executable by the processor, and the processor calls the program instructions to execute the method for checking and correcting the wiring width of the pin of the device according to any one of claims 1 to 7.
10. A non-transitory computer-readable storage medium storing computer instructions for causing a computer to perform the method of checking and correcting a device pin wiring width according to any one of claims 1 to 7.
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CN202111424931.0A CN114282488A (en) | 2021-11-26 | 2021-11-26 | Method, device, equipment and medium for checking and correcting wiring width of device pin |
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CN202111424931.0A CN114282488A (en) | 2021-11-26 | 2021-11-26 | Method, device, equipment and medium for checking and correcting wiring width of device pin |
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CN202111424931.0A Withdrawn CN114282488A (en) | 2021-11-26 | 2021-11-26 | Method, device, equipment and medium for checking and correcting wiring width of device pin |
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2021
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