CN114280892A - Method for quick exposure of different dry films - Google Patents
Method for quick exposure of different dry films Download PDFInfo
- Publication number
- CN114280892A CN114280892A CN202111263665.8A CN202111263665A CN114280892A CN 114280892 A CN114280892 A CN 114280892A CN 202111263665 A CN202111263665 A CN 202111263665A CN 114280892 A CN114280892 A CN 114280892A
- Authority
- CN
- China
- Prior art keywords
- dry film
- energy
- dmd
- calculating
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 31
- 230000003287 optical effect Effects 0.000 claims abstract description 19
- 238000001259 photo etching Methods 0.000 claims abstract description 10
- 238000004590 computer program Methods 0.000 claims description 15
- 238000004364 calculation method Methods 0.000 claims description 6
- 238000001459 lithography Methods 0.000 claims description 6
- 238000005286 illumination Methods 0.000 claims description 3
- 230000006870 function Effects 0.000 description 3
- 238000004422 calculation algorithm Methods 0.000 description 2
- 238000007635 classification algorithm Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 201000010099 disease Diseases 0.000 description 2
- 208000037265 diseases, disorders, signs and symptoms Diseases 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
Images
Landscapes
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
A method for rapid exposure of different dry films, comprising the steps of: s1, determining the model of the dry film, the laser, the optical lens and the related parameters of the DMD; s2, calculating the energy density alpha at the optical facet of the dry film; s3, calculating the energy J obtained by the dry film in the photoetching process and the minimum energy J of the dry film under the maximum frequency frame and the given line numbermin(ii) a S4, energy J according to dry film requirementA＝JminCalculating the actual line number of the dry film of the corresponding model, obtaining the minimum display line number of the DMD under the condition of the maximum frame frequency, calculating the energy required by the dry film corresponding to the laser power actually used by the laser when the minimum display line number is obtained, and enabling the energy required by the dry film to meet the condition that J is J according to the speed adjustmentA. The application enables the system to exert the maximum performance under the condition of dry films with different energy sizes.
Description
Technical Field
The invention belongs to the technical field of PCB plate making, and particularly relates to a method for quick exposure of different dry films.
Background
The exposure equipment using the PCB plate making currently focuses on the capacity of the equipment, namely the quantity of products produced in unit time. For the LDI device, the productivity of the image device is mainly determined by the energy of the laser and the frame rate of the DMD. For dry films, the exposure equipment must have an energy greater than the minimum exposure energy of the dry film, ranging from tens of joules of focus to hundreds of joules of focus. For dry films requiring large energy, the exposure speed of LDI is mainly limited by the energy of the laser. But for small energy dry films, the frame rate of DMD is the limiting factor. And the frame rate of the DMD is related to the number of display lines of the DMD.
The traditional method is that the number of rows of the DMD is fixed, so that the performance of the device can be exerted to the maximum extent by the LDI in a large-energy dry film, but the frame frequency of the DMD cannot be improved in a small-energy dry film, and therefore the exposure speed of the LDI is limited.
Disclosure of Invention
In order to consider dry films with different energy levels, the invention provides a method for quickly exposing different dry films, and the specific scheme is as follows:
a method for rapid exposure of different dry films, comprising the steps of:
s1, determining the model of the dry film, the parameters of the laser, the optical lens and the DMD;
s2, calculating the energy density alpha at the optical facet of the dry film;
s3, calculating the energy J obtained by the dry film in the photoetching process and the minimum energy J of the dry film under the maximum frequency frame and the given line numbermin；
S4, energy J according to dry film requirementA＝JminCalculating the actual line number of the dry film of the corresponding model, obtaining the minimum display line number of the DMD under the condition of the maximum frame frequency, calculating the energy required by the dry film corresponding to the laser power actually used by the laser when the minimum display line number is obtained, and enabling the energy required by the dry film to meet the condition that J is J according to the speed adjustmentA。
Specifically, step S1 specifically includes: determining the type of the dry film and the energy J required by the dry film of the corresponding typeAThe total power omega of the laser, the method multiplying power beta of the optical lens, the optical efficiency tau of the optical system and the maximum line number L of the DMD lighting spots.
Specifically, step S2 specifically includes:
s2, calculating the energy density alpha at the dry film light facet, wherein the calculation formula is as follows:
where a denotes the number of columns of the DMD.
Specifically, step S3 specifically includes: calculating the energy J obtained by the dry film in the photoetching process, wherein the calculation formula is as follows:
t represents the photoetching time of the dry film; n represents the number of rows actually displayed by the DMD; v represents the actual lithography speed; f represents the frame rate of the DMD; l is1Indicating the distance that the platform triggers the DMD to flip;
where the maximum frame rate f is 1/(0.04 × N +8), the minimum energy of the dry film at a given number of rows is therefore:
specifically, step S4 specifically includes:
lithography energy J according to dry filmA＝JminCalculating the value of N, wherein N is the number of rows displayed by the actual DMD of the dry film with the corresponding model;
the energy required for dry film is satisfied at the maximum frame frequency, i.e.
Wherein N isminThe minimum number of display lines for the DMD;
calculating the laser power alpha actually used by the laser according to the formula (5)1Energy required for corresponding dry film
If the DMD illumination spot uses the maximum number of lines L, the energy required by the dry film is not satisfied at this time, that is
The scanning speed of the platform is reduced to make J equal to JA。
A computer readable storage medium having stored thereon a computer program for executing a method for rapid exposure of different dry films according to any one of the preceding claims.
A computer system comprising a processor, a storage medium having a computer program stored thereon, the processor reading the computer program from the storage medium and executing the computer program to perform a method for different dry film rapid exposures as claimed in any one of claims 1-6.
The invention has the beneficial effects that: the application enables the system to exert the maximum performance under the condition of dry films with different energy sizes.
Drawings
FIG. 1 is a flow chart of a method for rapid exposure of different dry films according to the present invention.
Detailed Description
As shown in fig. 1, a method for rapid exposure of different dry films includes the steps of:
s1, determining the model of the dry film, the parameters of the laser, the optical lens and the DMD;
specifically, the type of the dry film and the energy J required by the dry film of the corresponding type are determinedAThe total power omega of the laser, the method multiplying power beta of the optical lens, the optical efficiency tau of the optical system and the maximum line number L of the DMD lighting spots.
S2, calculating the energy density alpha at the optical facet of the dry film; the calculation formula is as follows:
where a denotes the number of columns of the DMD.
S3, calculating the energy J obtained by the dry film in the photoetching process and the minimum energy J of the dry film under the maximum frequency frame and the given line numbermin；
Calculating the energy J obtained by the dry film in the photoetching process according to the following calculation formula:
t represents the photoetching time of the dry film; n represents the number of rows actually displayed by the DMD; v represents the actual lithography speed; f represents the frame rate of the DMD; l is1Indicating the distance that the platform triggers the DMD to flip;
where the maximum frame rate f is 1/(0.04 × N +8), the minimum energy of the dry film at a given number of rows is therefore:
s4, energy J according to dry film requirementA＝JminCalculating the actual line number of the dry film of the corresponding model, obtaining the minimum display line number of the DMD under the condition of the maximum frame frequency, calculating the energy required by the dry film corresponding to the laser power actually used by the laser when the minimum display line number is obtained, and enabling the energy required by the dry film to meet the condition that J is J according to the speed adjustmentA。
Step S4 specifically includes:
lithography energy J according to dry filmA＝JminCalculating the value of N, wherein N is the number of rows displayed by the actual DMD of the dry film with the corresponding model;
the energy required for dry film is satisfied at the maximum frame frequency, i.e.
Wherein N isminThe minimum number of display lines for the DMD;
calculating the laser power alpha actually used by the laser according to the formula (5)1Energy required for corresponding dry film
If the DMD illumination spot uses the maximum number of lines L, the energy required by the dry film is not satisfied at this time, that is
The scanning speed of the platform is reduced to make J equal to JA。
In addition, the invention also discloses a computer readable storage medium, on which a computer program is stored, and the computer program is executed to execute the disease detection method based on the online classification algorithm as described in the foregoing embodiment.
The invention also discloses a computer system, which comprises a processor and a storage medium, wherein the storage medium is stored with a computer program, and the processor reads the computer program from the storage medium and runs the computer program to execute the disease detection method based on the online classification algorithm described in the foregoing embodiment.
While, for purposes of simplicity of explanation, the methodologies are shown and described as a series of acts, it is to be understood and appreciated that the methodologies are not limited by the order of acts, as some acts may, in accordance with one or more embodiments, occur in different orders and/or concurrently with other acts from that shown and described herein or not shown and described herein, as would be understood by one skilled in the art.
Those of skill would further appreciate that the various illustrative logical blocks, modules, circuits, and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both. To clearly illustrate this interchangeability of hardware and software, various illustrative components, blocks, modules, circuits, and steps have been described above generally in terms of their functionality. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the overall system. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present invention.
The various illustrative logical blocks, modules, and circuits described in connection with the embodiments disclosed herein may be implemented or performed with a general purpose processor, a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), a Field Programmable Gate Array (FPGA) or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any combination thereof designed to perform the functions described herein. A general purpose processor may be a microprocessor, but in the alternative, the processor may be any conventional processor, controller, microcontroller, or state machine. A processor may also be implemented as a combination of computing devices, e.g., a combination of a DSP and a microprocessor, a plurality of microprocessors, one or more microprocessors in conjunction with a DSP core, or any other such configuration.
The steps of a method or algorithm described in connection with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. A software module may reside in RAM memory, flash memory, ROM memory, EPROM memory, EEPROM memory, registers, hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to the processor such the processor can read information from, and write information to, the storage medium. In the alternative, the storage medium may be integral to the processor. The processor and the storage medium may reside in an ASIC. The ASIC may reside in a user terminal. In the alternative, the processor and the storage medium may reside as discrete components in a user terminal.
In one or more exemplary embodiments, the functions described may be implemented in hardware, software, firmware, or any combination thereof. If implemented in software as a computer program product, the functions may be stored on or transmitted over as one or more instructions or code on a computer-readable medium. Computer-readable media includes both computer storage media and communication media including any medium that facilitates transfer of a computer program from one place to another. A storage media may be any available media that can be accessed by a computer. By way of example, and not limitation, such computer-readable media can comprise RAM, ROM, EEPROM, CD-ROM or other optical disk storage, magnetic disk storage or other magnetic storage devices, or any other medium that can be used to carry or store desired program code in the form of instructions or data structures and that can be accessed by a computer. Any connection is properly termed a computer-readable medium. For example, if the software is transmitted from a web site, server, or other remote source using a coaxial cable, fiber optic cable, twisted pair, Digital Subscriber Line (DSL), or wireless technologies such as infrared, radio, and microwave, then the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwave are included in the definition of medium. Disk (disk) and disc (disc), as used herein, includes Compact Disc (CD), laser disc, optical disc, Digital Versatile Disc (DVD), floppy disk and blu-ray disc where disks (disks) usually reproduce data magnetically, while discs (discs) reproduce data optically with lasers. Combinations of the above should also be included within the scope of computer-readable media.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (7)
1. A method for rapid exposure of different dry films, comprising the steps of:
s1, determining the model of the dry film, the parameters of the laser, the optical lens and the DMD;
s2, calculating the energy density alpha at the optical facet of the dry film;
s3, calculating the energy J obtained by the dry film in the photoetching process and the minimum energy J of the dry film under the maximum frequency frame and the given line numbermin；
S4, energy J according to dry film requirementA＝JminCalculating the actual line number of the dry film of the corresponding model, obtaining the minimum display line number of the DMD under the condition of the maximum frame frequency, calculating the energy required by the dry film corresponding to the laser power actually used by the laser when the minimum display line number is obtained, and enabling the energy required by the dry film to meet the condition that J is J according to the speed adjustmentA。
2. The method according to claim 1, wherein the step S1 is specifically as follows: determining the type of the dry film and the energy J required by the dry film of the corresponding typeAThe total power omega of the laser, the method multiplying power beta of the optical lens, the optical efficiency tau of the optical system and the maximum line number L of the DMD lighting spots.
3. The method according to claim 1, wherein the step S2 is specifically as follows:
s2, calculating the energy density alpha at the dry film light facet, wherein the calculation formula is as follows:
where a denotes the number of columns of the DMD.
4. The method according to claim 1, wherein the step S3 is specifically as follows: calculating the energy J obtained by the dry film in the photoetching process, wherein the calculation formula is as follows:
t represents the photoetching time of the dry film; n represents the number of rows actually displayed by the DMD; v represents the actual lithography speed; f represents the frame rate of the DMD; l is1Indicating the distance that the platform triggers the DMD to flip;
where the maximum frame rate f is 1/(0.04 × N +8), the minimum energy of the dry film at a given number of rows is therefore:
5. the method according to claim 4, wherein the step S4 is specifically as follows:
lithography energy J according to dry filmA＝JminCalculating the value of N, wherein N is the number of rows displayed by the actual DMD of the dry film with the corresponding model;
the energy required for dry film is satisfied at the maximum frame frequency, i.e.
Wherein N isminThe minimum number of display lines for the DMD;
calculating the laser power alpha actually used by the laser according to the formula (5)1Energy required for corresponding dry film
If the DMD illumination spot uses the maximum number of lines L, the energy required by the dry film is not satisfied at this time, that is
The scanning speed of the platform is reducedChanging J to JA。
6. A computer-readable storage medium, characterized in that the medium stores a computer program which, when run, performs a method for rapid exposure of different dry films according to any one of claims 1 to 5.
7. A computer system comprising a processor, a storage medium having a computer program stored thereon, the processor reading the computer program from the storage medium and executing the computer program to perform a method for rapid exposure of different dry films according to any one of claims 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111263665.8A CN114280892B (en) | 2021-10-25 | 2021-10-25 | Method for quick exposure of different dry films |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111263665.8A CN114280892B (en) | 2021-10-25 | 2021-10-25 | Method for quick exposure of different dry films |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114280892A true CN114280892A (en) | 2022-04-05 |
| CN114280892B CN114280892B (en) | 2024-01-16 |
Family
ID=80868760
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111263665.8A Active CN114280892B (en) | 2021-10-25 | 2021-10-25 | Method for quick exposure of different dry films |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114280892B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117812834A (en) * | 2023-12-30 | 2024-04-02 | 珠海和正柔性线路板有限公司 | Method and system for etching dry film circuit by laser |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070014929A1 (en) * | 2005-07-02 | 2007-01-18 | Stefan Eggers | Method for exposure of flexo printing plates |
| CN101938886A (en) * | 2010-09-03 | 2011-01-05 | 深圳崇达多层线路板有限公司 | Method for adhering multi-layer dry films to manufacture circuit boards |
| US20140300881A1 (en) * | 2013-04-04 | 2014-10-09 | Samsung Display Co., Ltd. | Digital exposure device using glv and digital exposure device using dmd |
| CN106647189A (en) * | 2017-02-24 | 2017-05-10 | 西安电子科技大学 | Large-area exposure method for maskless scanning photoetching |
| CN106647181A (en) * | 2016-12-19 | 2017-05-10 | 电子科技大学 | High-speed image exposure method for maskless lithography machine of DMD |
| CN109348126A (en) * | 2018-11-07 | 2019-02-15 | 中国科学院光电研究院 | A kind of face battle array continuous push-scanning image method of number TDI for space camera |
| CN111673265A (en) * | 2020-07-07 | 2020-09-18 | 北京航空航天大学 | Laser lithography-oriented self-adaptive control method |
| CN112596346A (en) * | 2020-12-09 | 2021-04-02 | 合肥芯碁微电子装备股份有限公司 | Control method of exposure system and exposure system |
| CN113438424A (en) * | 2021-06-04 | 2021-09-24 | 杭州海康威视数字技术股份有限公司 | Synchronous exposure processing method, device, system and equipment |
| WO2021193403A1 (en) * | 2020-03-25 | 2021-09-30 | 富士フイルム株式会社 | Imaging device, imaging method, and imaging program |
-
2021
- 2021-10-25 CN CN202111263665.8A patent/CN114280892B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070014929A1 (en) * | 2005-07-02 | 2007-01-18 | Stefan Eggers | Method for exposure of flexo printing plates |
| CN101938886A (en) * | 2010-09-03 | 2011-01-05 | 深圳崇达多层线路板有限公司 | Method for adhering multi-layer dry films to manufacture circuit boards |
| US20140300881A1 (en) * | 2013-04-04 | 2014-10-09 | Samsung Display Co., Ltd. | Digital exposure device using glv and digital exposure device using dmd |
| CN106647181A (en) * | 2016-12-19 | 2017-05-10 | 电子科技大学 | High-speed image exposure method for maskless lithography machine of DMD |
| CN106647189A (en) * | 2017-02-24 | 2017-05-10 | 西安电子科技大学 | Large-area exposure method for maskless scanning photoetching |
| CN109348126A (en) * | 2018-11-07 | 2019-02-15 | 中国科学院光电研究院 | A kind of face battle array continuous push-scanning image method of number TDI for space camera |
| WO2021193403A1 (en) * | 2020-03-25 | 2021-09-30 | 富士フイルム株式会社 | Imaging device, imaging method, and imaging program |
| CN111673265A (en) * | 2020-07-07 | 2020-09-18 | 北京航空航天大学 | Laser lithography-oriented self-adaptive control method |
| CN112596346A (en) * | 2020-12-09 | 2021-04-02 | 合肥芯碁微电子装备股份有限公司 | Control method of exposure system and exposure system |
| CN113438424A (en) * | 2021-06-04 | 2021-09-24 | 杭州海康威视数字技术股份有限公司 | Synchronous exposure processing method, device, system and equipment |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117812834A (en) * | 2023-12-30 | 2024-04-02 | 珠海和正柔性线路板有限公司 | Method and system for etching dry film circuit by laser |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114280892B (en) | 2024-01-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108885393B (en) | Method for reducing linear waviness | |
| JP4413825B2 (en) | Latent image calculation method, mask pattern creation method, and semiconductor device manufacturing method | |
| EP2570854B1 (en) | Illumination-source shape definition in optical lithography | |
| CN112650029B (en) | Method, computer system, and non-transitory computer readable medium for correcting non-uniform image patterns on a substrate | |
| TWI676867B (en) | Method of adjusting focus setting for digital lithography system, and computer system and non-transitory computer readable medium therefor | |
| US20170003598A1 (en) | Correction of non-uniform patterns using time-shifted exposures | |
| CN111242217A (en) | Training method and device of image recognition model, electronic equipment and storage medium | |
| CN114280892A (en) | Method for quick exposure of different dry films | |
| CN112255887A (en) | Segmented alignment modeling method | |
| US10067997B2 (en) | Replicating a source storage system | |
| CN112559291A (en) | Resource monitoring method and device, electronic equipment and storage medium | |
| JP4863947B2 (en) | Modulation table optimum solution search method, and hologram information recording / reproducing apparatus equipped with the modulation table | |
| US10338547B2 (en) | System, method and apparatuses for determining parameter settings for a power generation system and a tangible computer readable medium | |
| CN109063967B (en) | Processing method and device for wind control scene feature tensor and electronic equipment | |
| US9818168B2 (en) | Data tuning for fast computation and polygonal manipulation simplification | |
| CN113934115B (en) | Method for controlling direct-writing type photoetching machine and direct-writing type photoetching machine | |
| CN111598121A (en) | Cabinet equipment detection method | |
| CN112654929B (en) | Method for improving resolution of maskless lithography while maintaining high image contrast | |
| CN113836154A (en) | Database switching method and device | |
| TWI715184B (en) | Method and device for positioning target object in image, computer device and storage medium | |
| CN117313641A (en) | Training method, device, equipment and storage medium for lithography mask generation model | |
| CN117294951A (en) | Shooting method, equipment and medium | |
| JP4178263B2 (en) | Data storage method and data storage device | |
| CN115861682A (en) | Small sample image classification method and device, electronic equipment and storage medium | |
| TW202145077A (en) | Image identification method, device, computer device and storage media |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |