CN114279604A - Pressure testing method and device, electronic equipment and computer readable storage medium - Google Patents
Pressure testing method and device, electronic equipment and computer readable storage medium Download PDFInfo
- Publication number
- CN114279604A CN114279604A CN202111372416.2A CN202111372416A CN114279604A CN 114279604 A CN114279604 A CN 114279604A CN 202111372416 A CN202111372416 A CN 202111372416A CN 114279604 A CN114279604 A CN 114279604A
- Authority
- CN
- China
- Prior art keywords
- cable
- insulating material
- signal
- resistance
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 103
- 238000003860 storage Methods 0.000 title claims abstract description 28
- 239000011810 insulating material Substances 0.000 claims abstract description 86
- 238000000034 method Methods 0.000 claims abstract description 43
- 239000000463 material Substances 0.000 claims abstract description 36
- 238000006243 chemical reaction Methods 0.000 claims description 28
- 238000012549 training Methods 0.000 claims description 28
- 230000015654 memory Effects 0.000 claims description 17
- 238000009662 stress testing Methods 0.000 claims description 10
- 238000004590 computer program Methods 0.000 claims description 7
- 238000005516 engineering process Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 18
- 239000010408 film Substances 0.000 description 17
- 230000008859 change Effects 0.000 description 9
- 238000009413 insulation Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 238000005259 measurement Methods 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000004088 simulation Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 101100434411 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) ADH1 gene Proteins 0.000 description 2
- 101150102866 adc1 gene Proteins 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 239000004703 cross-linked polyethylene Substances 0.000 description 2
- 229920003020 cross-linked polyethylene Polymers 0.000 description 2
- 238000005034 decoration Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 101100162020 Mesorhizobium japonicum (strain LMG 29417 / CECT 9101 / MAFF 303099) adc3 gene Proteins 0.000 description 1
- 101150042711 adc2 gene Proteins 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
Images
Landscapes
- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
Abstract
The invention discloses a pressure testing method, a pressure testing device, electronic equipment and a computer readable storage medium. Wherein, the method comprises the following steps: acquiring a resistance signal output by a pressure sensor, wherein the pressure sensor is connected with a cable and an insulating material; converting the resistance signal into a voltage digital signal; and obtaining a pressure test result between the cable and the insulating material according to the cable parameters of the cable, the material parameters of the insulating material and the voltage digital signals. The invention solves the technical problem of inaccurate test result when the pressure between the cable and the insulating material is tested in the related technology.
Description
Technical Field
The invention relates to the field of computers, in particular to a pressure testing method, a pressure testing device, electronic equipment and a computer readable storage medium.
Background
In the related art, when the pressure between the cable and the insulating material is measured, a sensor with a higher standard is generally used for measuring, and a photoelastic method measurement model is used for analyzing the pressure test result. When the scheme is adopted for pressure testing, the requirement on the size specification of the sensor is high, the photoelastic method is used for measuring the difference between the model and the actual accessory structure, and the result is compared and verified with more experimental data.
In view of the above problems, no effective solution has been proposed.
Disclosure of Invention
The embodiment of the invention provides a pressure testing method, a pressure testing device, electronic equipment and a computer readable storage medium, which are used for at least solving the technical problem that a testing result is inaccurate when the pressure between a cable and an insulating material is tested in the related art.
According to an aspect of the embodiments of the present invention, there is also provided a pressure testing method, including: acquiring a resistance signal output by a pressure sensor, wherein the pressure sensor is connected with a cable and an insulating material; converting the resistance signal into a voltage digital signal; and obtaining a pressure test result between the cable and the insulating material according to the cable parameters of the cable, the material parameters of the insulating material and the voltage digital signals.
Optionally, the acquiring a resistance signal output by the pressure sensor includes: acquiring the resistance deformation quantity of the pressure sensor; and obtaining the resistance signal according to the resistance deformation quantity.
Optionally, the converting the resistance signal into a voltage digital signal includes: inputting the resistance signal into a bridge to obtain a voltage analog signal; and inputting the voltage analog signal to a singlechip to obtain the voltage digital signal.
Optionally, the inputting the resistance signal into the bridge to obtain a voltage analog signal includes: acquiring a feedback resistance signal of the electric bridge and a power supply voltage signal of the electric bridge; determining a product of the feedback resistance signal and the supply voltage signal; determining a ratio of the product to the resistance signal as the voltage analog signal.
Optionally, the obtaining a pressure test result between the cable and the insulating material according to the cable parameter of the cable, the material parameter of the insulating material, and the voltage digital signal includes: and inputting the cable parameters of the cable, the material parameters of the insulating material and the voltage digital signals into a pressure test model to obtain a pressure test result between the cable and the insulating material.
Optionally, before inputting the cable parameter of the cable, the material parameter of the insulating material, and the voltage digital signal into a pressure test model to obtain a pressure test result between the cable and the insulating material, the method further includes: obtaining a sample training set, wherein training data in the sample training set comprises: cable parameters, material parameters, voltage digital signals and pressure test results; and training an initial model by adopting the sample training set to obtain the pressure test model.
According to another aspect of the embodiments of the present invention, there is also provided a pressure testing apparatus, including: the device comprises a first acquisition module, a second acquisition module and a control module, wherein the first acquisition module is used for acquiring a resistance signal output by a pressure sensor, and the pressure sensor is connected with a cable and an insulating material; the conversion module is used for converting the resistance signal into a voltage digital signal; and the second acquisition module is used for acquiring a pressure test result between the cable and the insulating material according to the cable parameters of the cable, the material parameters of the insulating material and the voltage digital signals.
According to another aspect of the embodiments of the present invention, there is also provided an electronic device, including: a processor; a memory for storing the processor-executable instructions; wherein the processor is configured to execute the instructions to implement the stress testing method of any of the above.
According to another aspect of embodiments of the present invention, there is also provided a computer-readable storage medium, wherein instructions of the computer-readable storage medium, when executed by a processor of an electronic device, enable the electronic device to perform any one of the above-mentioned stress testing methods.
According to another aspect of the embodiments of the present invention, there is also provided a computer program product, including a computer program, which when executed by a processor implements the stress testing method of any one of the above.
In the embodiment of the invention, the pressure sensor is connected with the cable and the insulating material to obtain the resistance signal output by the pressure sensor, so that the resistance signal is converted into the voltage digital signal, and the pressure test result between the cable and the insulating material can be obtained according to the cable parameter of the cable, the material parameter of the insulating material and the voltage digital signal. Because the pressure test result is obtained according to the cable parameters of the cable and the material parameters of the insulating material, the obtained test result is more accurate, and the technical problem that the test result is inaccurate when the pressure between the cable and the insulating material is tested in the related technology is solved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the invention without limiting the invention. In the drawings:
FIG. 1 is a flow chart of a pressure testing method according to an embodiment of the invention;
FIG. 2 is a schematic diagram of a method for testing interfacial pressure provided by an alternative embodiment of the present invention;
FIG. 3 is a functional block diagram provided in an alternative embodiment of the present invention;
FIG. 4 is a schematic diagram of a pressure sensor provided in an alternative embodiment of the present invention;
FIG. 5 is a block diagram of a resistance-to-voltage conversion module provided in an alternative embodiment of the present invention;
FIG. 6 is a pictorial diagram of a resistance-to-voltage conversion module in accordance with an alternative embodiment of the present invention
FIG. 7 is a diagram of a single chip microcomputer according to an alternative embodiment of the present invention;
FIG. 8 is a flow diagram of a portion of an acquisition module provided in an alternative embodiment of the present invention;
FIG. 9 is a block diagram of a pressure testing device according to an embodiment of the present invention;
fig. 10 is a block diagram illustrating a structure of a terminal according to an exemplary embodiment.
Detailed Description
In order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the invention described herein are capable of operation in sequences other than those illustrated or described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Example 1
In accordance with an embodiment of the present invention, there is provided an embodiment of a stress testing method, it should be noted that the steps illustrated in the flowchart of the drawings may be performed in a computer system such as a set of computer executable instructions and that, although a logical order is illustrated in the flowchart, in some cases, the steps illustrated or described may be performed in an order different than that presented herein.
Fig. 1 is a flow chart of a pressure testing method according to an embodiment of the present invention, as shown in fig. 1, the method including the steps of:
step S102, acquiring a resistance signal output by a pressure sensor, wherein the pressure sensor is connected with a cable and an insulating material;
step S104, converting the resistance signal into a voltage digital signal;
and S106, obtaining a pressure test result between the cable and the insulating material according to the cable parameters of the cable, the material parameters of the insulating material and the voltage digital signals.
Through the steps, the pressure sensor is connected with the cable and the insulating material, and the resistance signal output by the pressure sensor is obtained, so that the resistance signal is converted into the voltage digital signal, and the pressure test result between the cable and the insulating material can be obtained according to the cable parameter of the cable, the material parameter of the insulating material and the voltage digital signal. Because the pressure test result is obtained according to the cable parameters of the cable and the material parameters of the insulating material, the obtained test result is more accurate, and the technical problem that the test result is inaccurate when the pressure between the cable and the insulating material is tested in the related technology is solved.
As an alternative embodiment, a resistance signal output by a pressure sensor is acquired, wherein the pressure sensor connects the cable with the insulating material. When the resistance signal is output through the pressure sensor, the film type pressure sensor can be selected, the measurement of the pressure between the cable and the insulating material in a large range can be realized, the resistance deformation value in the film type pressure sensor is converted into the resistance signal, namely, the deformation quantity of the metal wire in the film type pressure sensor is converted into the form of the resistance value to be output, and further, the pressure between the cable and the insulating material can be reflected through the resistance value output by measuring the film type pressure sensor. That is, when the resistance signal output by the pressure sensor is obtained by the thin film pressure sensor, the method may include the following steps: and acquiring the resistance deformation quantity of the pressure sensor, and acquiring a resistance signal according to the resistance deformation quantity. The resistance deformation amount refers to a deformation amount of a wire in the pressure sensor, and the resistance signal refers to a resistance value output by the pressure sensor, for example, the length, cross-sectional area, and the like of the wire change accordingly with stretching or compression by an external force. When the resistance is stretched by external force, the length is increased, the sectional area is reduced, and the resistance value is increased; when the pressure is reduced, the length is reduced, the sectional area is increased, and the resistance value is reduced. Therefore, a resistance signal can be obtained from the amount of resistance deformation.
As an alternative embodiment, the resistance signal is converted into a voltage digital signal, because the pressure test result cannot be obtained directly according to the resistance signal, the resistance signal needs to be converted into a voltage digital signal which can be identified, and then the pressure test result between the cable and the insulating material can be obtained. When converting the resistance signal into a voltage digital signal, the following steps may be included: the resistance signal is firstly input into the bridge to obtain a voltage analog signal, and then the voltage analog signal is input into the singlechip to obtain a voltage digital signal. And converting the signals through different devices to obtain voltage digital signals. When the resistance signal is input into the bridge to obtain the voltage analog signal, the bridge comprises a temperature compensation strain gauge and a resistance-voltage conversion module, and the resistance signal is converted into the voltage analog signal by mainly utilizing the resistance-voltage conversion module in the bridge, namely the resistance value is converted into the voltage value. In the process of inputting the resistance signal into the bridge to obtain the voltage analog signal, firstly, a feedback resistance signal of a resistance-voltage conversion module in the bridge and a power supply voltage signal of the resistance-voltage conversion module in the bridge are obtained, the feedback resistance signal is multiplied by the power supply voltage signal to obtain a product of the feedback resistance signal and the power supply voltage signal, and then the product is divided by the input resistance signal to obtain the voltage analog signal. When the voltage analog signal is input to the single chip microcomputer to obtain the voltage digital signal, the signal conversion can be carried out through an A/D (voltage analog signal \ voltage digital signal) conversion module in the single chip microcomputer. To ensure that a voltage digital signal is available.
As an alternative embodiment, when obtaining the pressure test result between the cable and the insulating material according to the cable parameter of the cable and the material parameter of the insulating material, and the voltage digital signal, the method may include the following steps: and inputting the cable parameters of the cable, the material parameters of the insulating material and the voltage digital signals into a pressure test model to obtain a pressure test result between the cable and the insulating material. The pressure test model can be placed in a PC, and the pressure test model can be various types of models, for example, a mechanical simulation model comprising a mechanical calculation program. By inputting the cable parameters of the cable, the material parameters of the insulating material and the voltage digital signals into the pressure test model, the obtained pressure test result can be ensured to be obtained by integrating various parameters. Therefore, the obtained pressure test result is more accurate.
As an alternative embodiment, before inputting the cable parameters of the cable, the material parameters of the insulating material, and the voltage digital signals into the pressure test model to obtain the pressure test result between the cable and the insulating material, the method may further include the following steps: obtaining a sample training set, wherein training data in the sample training set comprises: and training the initial model by adopting a sample training set to obtain a pressure test model. Because the pressure test model is continuously subjected to sample training through training data such as cable parameters, material parameters, voltage digital signals and pressure test results, the accuracy of the test result can be effectively improved, the problem of inaccuracy of the test result is effectively avoided, and in addition, the model is trained through various training data, the change rule of the cable and the insulating material under various factors can be comprehensively obtained, so that the test result is more accurate.
Based on the above embodiments and alternative embodiments, an alternative implementation is provided, which is described in detail below.
In an optional embodiment of the invention, a pressure testing method is provided, which can combine a built-in sensor with finite element simulation analysis, explore the pressure between a cable and an insulating material under the action of cold and hot circulation, and main influence factors and action rules of the pressure, and further reflect the sealing property between the cable and the insulating material through the pressure change condition. The following detailed description of alternative embodiments of the invention:
the pressure between the cable and the insulation is generated by the interference fit of the accessory insulation SIR and the cable body insulation XLPE, and during the insulation production process, the plastic support bars are used to keep the insulation in an expanded state. During the installation of the insulation, the plastic support strip is pulled out, and radial stress F1 and tangential stress F21 and F22 are generated between the SIR of the accessory insulation and XLPE of the cable body. The radial stress and the tangential stress can reflect the pressure between the cable and the insulating material.
Fig. 2 is a schematic diagram of a pressure testing method according to an alternative embodiment of the present invention, and as shown in fig. 2, the pressure testing method according to the alternative embodiment of the present invention mainly comprises two parts, including a hardware measuring device and a software analysis system. The hardware measuring device mainly comprises a film pressure sensor, a voltage conversion module and an acquisition module, and the software analysis system is composed of a pressure test model. According to the pressure testing method provided by the optional embodiment of the invention, the pressure between the cable and the insulating material is collected through the film pressure sensor, the voltage conversion module, the collection module, the software analysis system and the like. The following respectively introduces the hardware measurement device to the software analysis system:
the hardware measuring device mainly comprises a film pressure sensor, a voltage conversion module and an acquisition module, and specifically comprises: pressure sensor, measuring bridge, AD conversion module, singlechip, power module. The working process is that the deformation quantity caused by the pressure between the cable and the insulating material is measured by the film pressure sensor and is output in the form of a resistance value, namely a resistance signal, then the resistance signal is converted into a voltage analog signal through the voltage conversion module and the A/D conversion module, the voltage analog signal is converted into a voltage digital signal, and data is output to an upper computer, namely a PC (personal computer) through the serial port module.
The software analysis system is composed of a pressure test model, wherein the pressure test model can be various types of models, such as a built-in cable joint mechanical model. And according to the pressure test model, combining the result obtained by measuring by the hardware measuring device, and the cable parameters and the material parameters under different conditions, further calculating the pressure between the cable and the insulating material.
The method provided by the alternative embodiment of the present invention divides the system into 3 functional modules from the aspect of function, and fig. 3 is a schematic diagram of the functional modules provided by the alternative embodiment of the present invention, as shown in fig. 3, the method includes: the device comprises a measuring module, an acquisition module and a calculation module. The measuring module comprises a pressure sensor and a measuring bridge, the collecting module mainly comprises an A \ D conversion module and a single chip microcomputer, and the calculating and analyzing module mainly comprises a pressure testing model.
The following details the components provided by the alternative embodiments of the present invention:
1) a thin film pressure sensor:
the optional embodiment of the invention adopts a flexible film pressure sensor, which is a novel pressure sensor prepared by a nano process based on novel materials, is different from the traditional pressure sensor, and is particularly suitable for measuring the surface contact stress due to good flexibility, free bending, small thickness and high sensitivity. Therefore, the film type pressure sensor is selected as a joint interface pressure sensor.
The working principle of the film pressure sensor is the resistance strain effect, that is, when the metal wire in the film pressure sensor is under pressure, the resistance of the metal wire changes correspondingly with the magnitude of the mechanical deformation (stretching or compressing). The theoretical formula is as follows: r ═ ρ ═ L/S, where ρ is the resistivity (Ω × mm2/m), L is the length (m) of the wire, and S is the cross-sectional area (mm2) of the wire. As can be seen from the above equation, when the wire is subjected to mechanical deformation by stress, ρ and L, S change in all of them, which causes a change in resistance value. When the resistance is stretched by external force, the length is increased, the sectional area is reduced, and the resistance value is increased; when compressed, the lengthThe sectional area is increased, and the resistance value is reduced. Therefore, the change in resistance value can be measured from the strain of the wire. The conversion relationship is as follows:
wherein R is an initial value of resistance; Δ R is the amount of change in resistance value; k0 is the strain sensitive coefficient of a metallic material, which is essentially a constant value within the elastic limit; epsilon is the axial strain value of the metal material, and the range of epsilon is 0.24-0.4.
In the measurement system, a FlexiForc HT201 thin film type pressure sensor with high temperature resistance is adopted, and fig. 4 is a schematic diagram of a pressure sensor provided by an alternative embodiment of the present invention, as shown in fig. 4. The main structural parameters of the sensor are shown in table 1, and the main performance parameters are shown in table 2. The measurement range of the sensor is 0-222N, an output curve can be fitted by an exponential function, and the sensor needs to be calibrated before use. The film type pressure sensor is attached between the cable and the insulating material. When the interface pressure generates strain, the film pressure sensor stuck on the interface pressure generates the same mechanical deformation, and the resistance of the film pressure sensor is caused to change correspondingly.
TABLE 1
TABLE 2
2) A measuring bridge:
the measuring bridge is mainly composed of a temperature compensation strain gauge and a resistance-voltage conversion module. Since the output is a resistance value, a resistance-voltage conversion module is required to be added in order to convert the output into a voltage. The resistance-voltage conversion module is mainly composed of a low-power operational amplifier, a voltage value is obtained by inputting a measured resistance value and outputting the resistance value through the MCP6004 module, fig. 5 is a structural diagram of the resistance-voltage conversion module according to the alternative embodiment of the present invention, and fig. 6 is a physical diagram of the resistance-voltage conversion module according to the alternative embodiment of the present invention, as shown in fig. 5 and 6. The conversion formula between the input resistor Rin and the output voltage Vout is:
wherein Vcc is power voltage and is 5V or 3.3V; rf is a feedback resistance of 20 k.OMEGA..
3) An acquisition module:
the acquisition module mainly comprises an A \ D conversion module and a singlechip. The single chip microcomputer selected by the optional embodiment of the invention is STM32F103, and has the characteristics of high processing speed, high performance, low voltage, low power consumption and the like. STM32F1 has 3 ADC channels with 12-bit precision, and a maximum of 16 external channels per ADC. The ADC1 and the ADC2 both have 16 external channels, and the ADC3 generally has 8 external channels according to the number of different channels of the CPU pins. The single chip microcomputer is also provided with a Direct Memory Access (DMA) peripheral which can be used for carrying data without occupying a Central Processing Unit (CPU), namely, the CPU can process other processes when transmitting data, thereby greatly improving the working efficiency of the single chip microcomputer. Fig. 7 is a real object diagram of a single chip microcomputer provided in an alternative embodiment of the present invention, as shown in fig. 7. After the program is compiled by the singlechip, the voltage analog signal is converted into a voltage digital signal by opening the pin and the A \ D conversion module, and data is output to the upper computer through the serial port module. Fig. 8 is a flowchart of an acquisition module portion provided in an alternative embodiment of the present invention, and as shown in fig. 8, the digital-to-analog conversion module used in the alternative embodiment of the present invention is ADC1, the total number of channels is 13, which are PA2, PA3, PA4, PA5, PA6, PA7, PB0, PB1, PC0, PC1, PC2, PC3, and PC4, respectively. Firstly, pins of PA, PB and PC are initialized and configured, then working parameters of ADC, Ustart serial ports and DMA are configured respectively, then data acquired by the ADC are read, the data are directly taken out from DMA peripherals and sent to the serial ports, and finally the data are displayed on serial port software of an upper computer to finish one-time data acquisition. Wherein, table 3 is an example of channel allocation of the single chip ADC.
TABLE 3
4) Software analysis system:
the software analysis system, also called a software analysis module, mainly comprises an upper computer acquisition program and a mechanical calculation program comprising a pressure test model, wherein the acquisition program stores and displays the result obtained by the acquisition module, and transmits the result to the mechanical calculation program so as to obtain the pressure test result. The mechanical calculation program converts the input test voltage signal into a measured pressure value between the cable and the insulating material.
Through the above alternative embodiment, at least the following advantages can be achieved:
(1) the built-in sensor is a high-temperature-resistant film pressure sensor which can measure pressure in a large range, convert the measured interface pressure value into a resistance value and reflect the interface pressure through the output resistance value of the measuring sensor;
(2) finite element analysis selects COMSOL multi-physical field simulation software, and the stress distribution of a joint interface and the stress change rule under the action of multiple factors are simulated and analyzed by building a mechanical simulation model;
(3) an interface pressure measuring system based on a film type pressure sensor is constructed, and mainly comprises a hardware measuring device and a software analysis system, and a measuring module, an acquisition module and a calculation and analysis module, so that the direct measurement of the pressure between a cable and an insulating material can be realized, and the system is suitable for measuring the pressure between the cable and the insulating material under complex conditions.
It should be noted that, for simplicity of description, the above-mentioned method embodiments are described as a series of acts or combination of acts, but those skilled in the art will recognize that the present invention is not limited by the order of acts, as some steps may occur in other orders or concurrently in accordance with the invention. Further, those skilled in the art should also appreciate that the embodiments described in the specification are preferred embodiments and that the acts and modules referred to are not necessarily required by the invention.
Through the above description of the embodiments, those skilled in the art can clearly understand that the method according to the above embodiments can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware, but the former is a better implementation mode in many cases. Based on such understanding, the technical solutions of the present invention may be embodied in the form of a software product, which is stored in a storage medium (such as ROM/RAM, magnetic disk, optical disk) and includes instructions for enabling a terminal device (such as a mobile phone, a computer, a server, or a network device) to execute the method according to the embodiments of the present invention.
Example 2
According to an embodiment of the present invention, there is also provided an apparatus for implementing the above pressure testing method, and fig. 9 is a block diagram of a structure of the pressure testing apparatus according to an embodiment of the present invention, as shown in fig. 9, the apparatus includes: a first obtaining module 901, a converting module 902 and a second obtaining module 903, which are described in detail below.
A first obtaining module 901, configured to obtain a resistance signal output by a pressure sensor, where the pressure sensor is connected to a cable and an insulating material; a conversion module 902, connected to the first obtaining module 901, for converting the resistance signal into a voltage digital signal; the second obtaining module 903 is connected to the converting module 902, and configured to obtain a pressure test result between the cable and the insulating material according to the cable parameter of the cable, the material parameter of the insulating material, and the voltage digital signal.
It should be noted here that the first obtaining module 901, the converting module 902 and the second obtaining module 903 correspond to steps S102 to S106 in the pressure testing method, and the modules are the same as the corresponding steps in the implementation example and the application scenario, but are not limited to the disclosure in embodiment 1.
Example 3
Embodiments of the present disclosure may provide an electronic device, which may be a terminal. In this embodiment, the electronic device may be any one of computer terminal devices in a computer terminal group as a terminal. Optionally, in this embodiment, the terminal may also be a terminal device such as a mobile terminal.
Optionally, in this embodiment, the terminal may be located in at least one network device of a plurality of network devices of a computer network.
Alternatively, fig. 10 is a block diagram illustrating a structure of a terminal according to an exemplary embodiment. As shown in fig. 10, the terminal may include: one or more processors (only one shown) 101, a memory 102 for storing processor-executable instructions; wherein the processor is configured to execute instructions to implement any of the stress testing methods described above.
The memory may be configured to store software programs and modules, such as program instructions/modules corresponding to the pressure testing method and apparatus in the embodiments of the disclosure, and the processor executes various functional applications and data processing by running the software programs and modules stored in the memory, so as to implement the pressure testing method. The memory may include high speed random access memory, and may also include non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some examples, the memory may further include memory located remotely from the processor, and these remote memories may be connected to the computer terminal through a network. Examples of such networks include, but are not limited to, the internet, intranets, local area networks, mobile communication networks, and combinations thereof.
The processor can call the information and application program stored in the memory through the transmission device to execute the following steps: acquiring a resistance signal output by a pressure sensor, wherein the pressure sensor is connected with a cable and an insulating material; converting the resistance signal into a voltage digital signal; and obtaining a pressure test result between the cable and the insulating material according to the cable parameters of the cable, the material parameters of the insulating material and the voltage digital signals.
Optionally, the processor may further execute the program code of the following steps: acquiring a resistance signal output by a pressure sensor, comprising: acquiring a resistance deformation quantity of the pressure sensor; and obtaining a resistance signal according to the resistance deformation quantity.
Optionally, the processor may further execute the program code of the following steps: converting the resistance signal to a voltage digital signal, comprising: inputting the resistance signal into a bridge to obtain a voltage analog signal; and inputting the voltage analog signal to the singlechip to obtain a voltage digital signal.
Optionally, the processor may further execute the program code of the following steps: inputting the resistance signal into the bridge to obtain a voltage analog signal, comprising: acquiring a feedback resistance signal of the bridge and a power supply voltage signal of the bridge; determining a product of the feedback resistance signal and the supply voltage signal; and determining the ratio of the product to the resistance signal as a voltage analog signal.
Optionally, the processor may further execute the program code of the following steps: obtaining a pressure test result between the cable and the insulating material according to the cable parameter of the cable, the material parameter of the insulating material and the voltage digital signal, wherein the pressure test result comprises the following steps: and inputting the cable parameters of the cable, the material parameters of the insulating material and the voltage digital signals into a pressure test model to obtain a pressure test result between the cable and the insulating material.
Optionally, the processor may further execute the program code of the following steps: before inputting the cable parameters of the cable, the material parameters of the insulating material and the voltage digital signals into the pressure test model to obtain the pressure test result between the cable and the insulating material, the method further comprises the following steps: obtaining a sample training set, wherein training data in the sample training set comprises: cable parameters, material parameters, voltage digital signals and pressure test results; and training the initial model by adopting a sample training set to obtain a pressure test model.
It will be understood by those skilled in the art that the structure shown in fig. 10 is only an illustration, for example, the terminal may also be a terminal device such as a smart phone (e.g., an Android phone, an iOS phone, etc.), a tablet computer, a palmtop computer, a Mobile Internet Device (MID), a PAD, and the like. Fig. 10 is a diagram illustrating a structure of the electronic device. For example, it may also include more or fewer components (e.g., network interfaces, display devices, etc.) than shown in FIG. 10, or have a different configuration than shown in FIG. 10.
Those skilled in the art will appreciate that all or part of the steps in the methods of the above embodiments may be implemented by a program instructing hardware associated with the terminal device, where the program may be stored in a computer-readable storage medium, and the storage medium may include: flash disks, Read-Only memories (ROMs), Random Access Memories (RAMs), magnetic or optical disks, and the like.
Example 4
In an exemplary embodiment, there is also provided a computer readable storage medium comprising instructions which, when executed by a processor of a terminal, enable the terminal to perform the stress testing method of any of the above. Alternatively, the computer readable storage medium may be a non-transitory computer readable storage medium, for example, the non-transitory computer readable storage medium may be a ROM, a Random Access Memory (RAM), a CD-ROM, a magnetic tape, a floppy disk, an optical data storage device, and the like.
Optionally, in this embodiment, the computer-readable storage medium may be used to store program codes executed by the pressure testing method provided in the above embodiment.
Optionally, in this embodiment, the computer-readable storage medium may be located in any one of a group of computer terminals in a computer network, or in any one of a group of mobile terminals.
Optionally, in this embodiment, the computer readable storage medium is configured to store program code for performing the following steps: acquiring a resistance signal output by a pressure sensor, wherein the pressure sensor is connected with a cable and an insulating material; converting the resistance signal into a voltage digital signal; and obtaining a pressure test result between the cable and the insulating material according to the cable parameters of the cable, the material parameters of the insulating material and the voltage digital signals.
Optionally, in this embodiment, the computer readable storage medium is configured to store program code for performing the following steps: acquiring a resistance signal output by a pressure sensor, comprising: acquiring a resistance deformation quantity of the pressure sensor; and obtaining a resistance signal according to the resistance deformation quantity.
Optionally, in this embodiment, the computer readable storage medium is configured to store program code for performing the following steps: converting the resistance signal to a voltage digital signal, comprising: inputting the resistance signal into a bridge to obtain a voltage analog signal; and inputting the voltage analog signal to the singlechip to obtain a voltage digital signal.
Optionally, in this embodiment, the computer readable storage medium is configured to store program code for performing the following steps: inputting the resistance signal into the bridge to obtain a voltage analog signal, comprising: acquiring a feedback resistance signal of the bridge and a power supply voltage signal of the bridge; determining a product of the feedback resistance signal and the supply voltage signal; and determining the ratio of the product to the resistance signal as a voltage analog signal.
Optionally, in this embodiment, the computer readable storage medium is configured to store program code for performing the following steps: obtaining a pressure test result between the cable and the insulating material according to the cable parameter of the cable, the material parameter of the insulating material and the voltage digital signal, wherein the pressure test result comprises the following steps: and inputting the cable parameters of the cable, the material parameters of the insulating material and the voltage digital signals into a pressure test model to obtain a pressure test result between the cable and the insulating material.
Optionally, in this embodiment, the computer readable storage medium is configured to store program code for performing the following steps: before inputting the cable parameters of the cable, the material parameters of the insulating material and the voltage digital signals into the pressure test model to obtain the pressure test result between the cable and the insulating material, the method further comprises the following steps: obtaining a sample training set, wherein training data in the sample training set comprises: cable parameters, material parameters, voltage digital signals and pressure test results; and training the initial model by adopting a sample training set to obtain a pressure test model.
In an exemplary embodiment, a computer program product is also provided, in which the computer program, when executed by a processor of an electronic device, enables the electronic device to perform the stress testing method of any of the above.
The above-mentioned serial numbers of the embodiments of the present invention are merely for description and do not represent the merits of the embodiments.
In the above embodiments of the present invention, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
In the embodiments provided in the present application, it should be understood that the disclosed technology can be implemented in other ways. The above-described embodiments of the apparatus are merely illustrative, and for example, the division of the units may be a logical division, and in actual implementation, there may be another division, for example, multiple units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, units or modules, and may be in an electrical or other form.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
In addition, functional units in the embodiments of the present invention may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit. The integrated unit can be realized in a form of hardware, and can also be realized in a form of a software functional unit.
The integrated unit, if implemented in the form of a software functional unit and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present invention may be embodied in the form of a software product, which is stored in a storage medium and includes instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method according to the embodiments of the present invention. And the aforementioned storage medium includes: a U-disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a removable hard disk, a magnetic or optical disk, and other various media capable of storing program codes.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (10)
1. A pressure testing method, comprising:
acquiring a resistance signal output by a pressure sensor, wherein the pressure sensor is connected with a cable and an insulating material;
converting the resistance signal into a voltage digital signal;
and obtaining a pressure test result between the cable and the insulating material according to the cable parameters of the cable, the material parameters of the insulating material and the voltage digital signals.
2. The method of claim 1, wherein the obtaining a resistance signal output by a pressure sensor comprises:
acquiring the resistance deformation quantity of the pressure sensor;
and obtaining the resistance signal according to the resistance deformation quantity.
3. The method of claim 1, wherein converting the resistance signal to a voltage digital signal comprises:
inputting the resistance signal into a bridge to obtain a voltage analog signal;
and inputting the voltage analog signal to a singlechip to obtain the voltage digital signal.
4. The method of claim 3, wherein inputting the resistance signal into a bridge to obtain a voltage analog signal comprises:
acquiring a feedback resistance signal of the electric bridge and a power supply voltage signal of the electric bridge;
determining a product of the feedback resistance signal and the supply voltage signal;
determining a ratio of the product to the resistance signal as the voltage analog signal.
5. The method according to claim 1, wherein obtaining the pressure test result between the cable and the insulating material according to the cable parameter of the cable and the material parameter of the insulating material, and the voltage digital signal comprises:
and inputting the cable parameters of the cable, the material parameters of the insulating material and the voltage digital signals into a pressure test model to obtain a pressure test result between the cable and the insulating material.
6. The method of claim 5, wherein before inputting the cable parameters of the cable and the material parameters of the insulating material, and the voltage digital signals into a pressure test model to obtain a pressure test result between the cable and the insulating material, the method further comprises:
obtaining a sample training set, wherein training data in the sample training set comprises: cable parameters, material parameters, voltage digital signals and pressure test results;
and training an initial model by adopting the sample training set to obtain the pressure test model.
7. A pressure testing device, comprising:
the device comprises a first acquisition module, a second acquisition module and a control module, wherein the first acquisition module is used for acquiring a resistance signal output by a pressure sensor, and the pressure sensor is connected with a cable and an insulating material;
the conversion module is used for converting the resistance signal into a voltage digital signal;
and the second acquisition module is used for acquiring a pressure test result between the cable and the insulating material according to the cable parameters of the cable, the material parameters of the insulating material and the voltage digital signals.
8. An electronic device, comprising:
a processor;
a memory for storing the processor-executable instructions;
wherein the processor is configured to execute the instructions to implement the stress testing method of any one of claims 1 to 6.
9. A computer-readable storage medium, wherein instructions in the computer-readable storage medium, when executed by a processor of an electronic device, enable the electronic device to perform the stress testing method of any of claims 1-6.
10. A computer program product comprising a computer program, characterized in that the computer program, when being executed by a processor, implements the stress testing method of any one of claims 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111372416.2A CN114279604A (en) | 2021-11-18 | 2021-11-18 | Pressure testing method and device, electronic equipment and computer readable storage medium |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111372416.2A CN114279604A (en) | 2021-11-18 | 2021-11-18 | Pressure testing method and device, electronic equipment and computer readable storage medium |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114279604A true CN114279604A (en) | 2022-04-05 |
Family
ID=80869432
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111372416.2A Pending CN114279604A (en) | 2021-11-18 | 2021-11-18 | Pressure testing method and device, electronic equipment and computer readable storage medium |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114279604A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105445606A (en) * | 2015-11-12 | 2016-03-30 | 国网重庆市电力公司电力科学研究院 | High-voltage power cable joint fault monitoring method based on deformation measurement |
| US20170191883A1 (en) * | 2016-01-06 | 2017-07-06 | Rhode Island Board Of Education, State Of Rhode Island And Providence Plantations | Coaxial cable sensor device for distributed strain measurement and shape sensing applications |
| CN111513425A (en) * | 2020-06-04 | 2020-08-11 | 厉晨宇 | Detecting insole and walking posture adjusting system |
| CN211954508U (en) * | 2020-01-07 | 2020-11-17 | 国网甘肃省电力公司电力科学研究院 | SMD MEMS transmission line monitoring sensor |
| CN212254427U (en) * | 2020-04-14 | 2020-12-29 | 杭州柯林电气股份有限公司 | Cable joint stress monitoring circuit and cable joint stress monitoring device |
| US20200408625A1 (en) * | 2013-10-05 | 2020-12-31 | Bertec Limited | Force Measurement System |
| CN112256153A (en) * | 2020-10-29 | 2021-01-22 | 大连理工大学 | Signal acquisition, processing and display method of touch perception array |
| CN113237587A (en) * | 2021-02-02 | 2021-08-10 | 国网电力科学研究院武汉南瑞有限责任公司 | Cable joint interface pressure measurement system |
-
2021
- 2021-11-18 CN CN202111372416.2A patent/CN114279604A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20200408625A1 (en) * | 2013-10-05 | 2020-12-31 | Bertec Limited | Force Measurement System |
| CN105445606A (en) * | 2015-11-12 | 2016-03-30 | 国网重庆市电力公司电力科学研究院 | High-voltage power cable joint fault monitoring method based on deformation measurement |
| US20170191883A1 (en) * | 2016-01-06 | 2017-07-06 | Rhode Island Board Of Education, State Of Rhode Island And Providence Plantations | Coaxial cable sensor device for distributed strain measurement and shape sensing applications |
| CN211954508U (en) * | 2020-01-07 | 2020-11-17 | 国网甘肃省电力公司电力科学研究院 | SMD MEMS transmission line monitoring sensor |
| CN212254427U (en) * | 2020-04-14 | 2020-12-29 | 杭州柯林电气股份有限公司 | Cable joint stress monitoring circuit and cable joint stress monitoring device |
| CN111513425A (en) * | 2020-06-04 | 2020-08-11 | 厉晨宇 | Detecting insole and walking posture adjusting system |
| CN112256153A (en) * | 2020-10-29 | 2021-01-22 | 大连理工大学 | Signal acquisition, processing and display method of touch perception array |
| CN113237587A (en) * | 2021-02-02 | 2021-08-10 | 国网电力科学研究院武汉南瑞有限责任公司 | Cable joint interface pressure measurement system |
Non-Patent Citations (1)
| Title |
|---|
| 王子康 等: "冷热循环对电缆附件界面压力及带材材料特性的影响", 《高电压技术》（录用定稿，网络首发论文）, pages 1 - 10 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP3205990A1 (en) | Weighing sensor, weighing network and monitoring method | |
| CN102793544B (en) | System and method for measuring physiological parameter | |
| CN102099662A (en) | Arrangement for linearizing a non-linear sensor | |
| CN112556927B (en) | Pressure sensor self-correcting method, equipment, storage medium and device | |
| CN104062618B (en) | A kind of capacitive apparatus on-Line Monitor Device method of calibration of dual signal source | |
| JP7364005B2 (en) | Intraoral measurement device and intraoral measurement system | |
| CN104155044A (en) | Measuring device and measuring method for cable force of cable-stayed bridge based on mobile terminal | |
| CN114279604A (en) | Pressure testing method and device, electronic equipment and computer readable storage medium | |
| CN103504724B (en) | Digital mechanical measurement toe last and signal acquisition and analysis method thereof | |
| Li et al. | Flexible pressure sensors tuned by interface structure design–Numerical and experimental study | |
| CN117147022A (en) | Force sensor nonlinear compensation method and system | |
| CN113237587A (en) | Cable joint interface pressure measurement system | |
| Khaled et al. | Humidity and temperature effects on torque transducers, bridge calibration unit and amplifiers | |
| CN106137205A (en) | Insole type sole pressure apparatus for measuring distribution and system | |
| CN202916226U (en) | Moisture testing circuit | |
| CN205333175U (en) | Healthy electronic scale based on thing networking | |
| CN105651936A (en) | Gas sensor comprehensive tester and measurement method thereof | |
| JP2005517949A (en) | Universal input data collection module for measuring physical quantities | |
| CN110244251B (en) | Method and device for acquiring calibration coefficient and calibration chip | |
| Khandakar et al. | Design and implementation of a complete wearable smart insole solution to measure plantar pressure and temperature | |
| CN104964890B (en) | Hardness detection method based on integral type terminal applies | |
| CN111487011B (en) | Pressure chip baking method and device and readable storage medium | |
| Kumru et al. | Design and application of IoT based weather station for high voltage laboratories | |
| US20140278257A1 (en) | Probe communications module and a computing device | |
| CN116046029B (en) | Temperature drift compensation structure of piezoelectric mechanical sensor and compensation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20220405 |