CN114276776B - Filling material for encapsulating electronic components of underwater acoustic equipment and acoustic array cable and preparation method thereof - Google Patents
Filling material for encapsulating electronic components of underwater acoustic equipment and acoustic array cable and preparation method thereof Download PDFInfo
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- CN114276776B CN114276776B CN202111545095.1A CN202111545095A CN114276776B CN 114276776 B CN114276776 B CN 114276776B CN 202111545095 A CN202111545095 A CN 202111545095A CN 114276776 B CN114276776 B CN 114276776B
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Abstract
The invention relates to the technical field of underwater acoustic materials, in particular to a filling material for encapsulating electronic components of underwater acoustic equipment with low water permeability coefficient and low acoustic insertion loss and an acoustic array cable and a preparation method thereof, wherein the filling material is prepared by solidifying the following components in percentage by mass: hydroxyl-terminated epoxidized polybutadiene EHTPB:52% -70%; dimer acid diisocyanate DDI:20% -41%; chain extender: 1% -10%; catalyst: 0% -0.05%; defoaming agent: 0 to 0.1 percent. Compared with the organosilicon pouring sealant widely used in the electronic industry, the novel filling material has the water permeability coefficient of only about 7 percent of that of the organosilicon pouring sealant. In addition, the encapsulating material for the electronic component of the underwater acoustic equipment with the low water permeability coefficient also has the self-healing characteristic, so that the service life of the material can be greatly prolonged, and the use safety of the material can be improved. The material has low mechanical strength of about 0.85MPa, easy disassembly and convenience for the maintenance of electronic components.
Description
Technical Field
The invention relates to the technical field of underwater acoustic materials, in particular to a filling material for encapsulating electronic components of underwater acoustic equipment with low water permeability coefficient and low acoustic insertion loss and an acoustic array cable and a preparation method thereof.
Background
Underwater extensions in underwater acoustic equipment such as underwater acoustic transducers, acoustic array cables and the like work underwater for a long time, and the prevention of the invasion and penetration of moisture is of great importance to the improvement of the reliability of components and even the whole system for such electronic components as junction boxes, electronic bins, circuit boards and the like inside the underwater extensions and internal cavity filling materials. Unlike general electronic components, the working environment of electronic components in hydroacoustic devices is more humid, especially when such components are operated underwater for a long period of time, not only is the intrusion and permeation rate of water vapor faster, but also the difficulty and cost of maintenance and assurance once a failure occurs accordingly are higher. At present, the common solution to the problems is to use organic silicon pouring sealant for sealing and filling, and the organic silicon pouring sealant has the characteristics of good ageing resistance and weather resistance, excellent high and low temperature resistance, certain waterproofness, adhesiveness and the like, so that the organic silicon pouring sealant is a very commonly used material in the field of electronic pouring.
However, the biggest drawback of silicone potting adhesive is the high water permeability (6.3x10 -13 g.cm/cm 2.s.Pa), is about 13 times of the common underwater acoustic material chloroprene rubber, and in addition, the filling material used in the acoustic array cable has high requirements on water resistance and sound transmission performance because sound waves pass through as nondestructively as possible while water is blocked and permeated. Therefore, the silicone potting adhesive is not suitable for insulating potting of electronic components in underwater equipment that need to operate under water for a long period of time and filling of acoustic array cables.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a filling material for encapsulating electronic components of underwater acoustic equipment and an acoustic array cable and a preparation method thereof, and compared with organosilicon pouring sealant widely used in the electronic industry, the novel filling material has a water permeability coefficient of only about 7 percent of that of the organosilicon pouring sealant. In addition, the encapsulating material for the electronic component of the underwater acoustic equipment with the low water permeability coefficient also has the self-healing characteristic, so that the service life of the material can be greatly prolonged, and the use safety of the material can be improved. The material has low mechanical strength of about 0.85MPa, easy disassembly and convenience for the maintenance of electronic components.
The invention is realized by the following technical scheme:
the filling material for encapsulating electronic components of underwater acoustic equipment with low water permeability coefficient and acoustic array cables is prepared by solidifying the following components in percentage by mass:
hydroxyl-terminated epoxidized polybutadiene EHTPB:52% -70%;
dimer acid diisocyanate DDI:20% -41%;
chain extender: 1% -10%;
catalyst: 0% -0.05%;
defoaming agent: 0 to 0.1 percent.
Preferably, the adhesive is obtained by curing the following components in percentage by mass: hydroxyl-terminated epoxidized polybutadiene EHTPB:52% -65%; dimer acid diisocyanate DDI:30% -40%; chain extender: 2% -5%; catalyst: 0 to 0.02 percent; defoaming agent: 0.01 to 0.05 percent.
Preferably, the molecular weight of the hydroxyl-terminated epoxy polybutadiene is 2200-4500.
Preferably, the molecular weight of the dimer acid diisocyanate is 400-1000.
Preferably, the chain extender is one or more combinations of ethylene glycol, diethylene glycol, 1- (phenylimino) bis-2-propanol, 1, 4-butanediol, 2-ethyl-1, 3-hexanediol, 1, 6-hexanediol, ethylenediamine, diethyltoluenediamine, 3 '-dichloro-4, 4' -diaminodiphenylmethane.
Preferably, the catalyst is one of stannous octoate, dibutyl tin dilaurate, alkyl tin dithiol, triphenylbismuth, tri (4-ethoxyphenyl) bismuth and tri (3-ethoxyphenyl) bismuth.
Preferably, the curing reaction temperature is 60 ℃ to 100 ℃ at normal temperature.
The invention also provides the following technical scheme: the preparation method of the filling material for encapsulating the electronic components of the underwater acoustic equipment and the acoustic array cable with the low water permeability coefficient comprises the following steps:
weighing the hydroxyl-terminated oxidized polybutadiene EHTPB, the dimer acid diisocyanate DDI and the chain extender according to the formula, adding the mixture into a container, stirring uniformly, adding 5-30 mg of catalyst, carrying out vacuum defoaming treatment, pouring the mixture into a metal mold, and curing for 3-18 h at 60-80 ℃.
The beneficial effects of the invention are as follows:
the invention provides a sealing material for electronic components of underwater acoustic equipment with low water permeability coefficient, which is a polyurethane gel material based on Dimer Diisocyanate (DDI). Dimer acid diisocyanate (DDI), a long chain of dimer fatty acids having 36 carbon atoms, has the following outstanding advantages: (1) the DDI has excellent water blocking performance, the nonpolar long-chain structure makes the DDI have extremely poor affinity to water, is very insensitive to water and hardly reacts, and polyurethane with excellent water blocking performance can be prepared by taking the DDI as a raw material; (2) the long-chain structure of the DDI endows the DDI with good flexibility, adhesiveness and low viscosity which are superior to other aliphatic isocyanates; (3) the NCO groups in the DDI react with active hydrogen slowly, so that the polyurethane material based on the DDI has longer operation time and longer application period, and brings convenience to process operation. The hydroxyl-terminated epoxidized polybutadiene (EHTPB) which is the main raw material in the invention is a nonpolar liquid, has high electrical insulation property, low dielectric constant and loss end, has a molecular skeleton similar to that of common solid rubber, and therefore has good electrical insulation performance, and can be used for preparing various electrical insulation materials.
Reducing the hydrophilicity of the material by hydroxy-capping the epoxidized polybutadiene (EHTPB) with a non-polar segment; meanwhile, as the hydroxyl-terminated epoxidized polybutadiene (EHTPB) contains epoxy groups, an interpenetrating network structure can be formed in the system, so that the free volume can be effectively reduced, and the water permeability coefficient of the material is reduced; in addition, the water permeability coefficient of the material is further reduced by introducing hydrophobic DDI, and finally the prepared polyurethane material based on the DDI has very low water permeability coefficient. The NCO groups in the DDI are enabled to have continuous reaction capacity by utilizing the low reactivity of the NCO groups and active hydrogen in the DDI, so that the material has self-healing capacity. Meanwhile, the mechanical strength of the material is lower, so that the material has better easy disassembly.
The polyurethane gel material based on the Dimer Diisocyanate (DDI) prepared by the invention has a water permeability coefficient of 6.7% of that of the organic silicon pouring sealant, which shows that the water blocking permeability of the polyurethane gel material is far better than that of the organic silicon pouring sealant; the insertion loss of the polyurethane gel material is far lower than that of polyether polyurethane, which indicates that the sound transmission performance of the polyurethane gel material is far better than that of polyether polyurethane JA-2S which is a common sound transmission material, and compared with the defects of organosilicon pouring sealant in terms of water resistance and sound transmission performance, the polyurethane gel material based on the Dimer Diisocyanate (DDI) prepared by the invention is more suitable for the pouring of electronic components of underwater sound equipment and the filling of acoustic array cables.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a graph of the water permeability coefficient of a polyurethane gel material based on Dimer Diisocyanate (DDI) of the present invention versus a silicone potting adhesive;
FIG. 2 is a graph comparing acoustic insertion loss of a polyurethane gel material based on Dimer Diisocyanate (DDI) of the present invention with that of polyether polyurethane JA-2S, a common sound-transmitting material.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1:
the specific technical process of the preparation method of the novel underwater sound pouring polyurethane material related to the embodiment is as follows: 40g of hydroxyl-terminated epoxy polybutadiene (EHTPB), 25g of dimer acid diisocyanate (DDI) and 2g of chain extender are added into a container and stirred uniformly, then 5mg of catalyst is added, after vacuum defoamation treatment, the mixture is poured into a metal mold and cured for 18 hours at 60 ℃.
Example 2:
the specific technical process of the preparation method of the novel underwater sound pouring polyurethane material related to the embodiment is as follows: 52g of hydroxyl-terminated epoxy polybutadiene (EHTPB), 25g of dimer acid diisocyanate (DDI) and 2g of chain extender are added into a container and stirred uniformly, then 30mg of catalyst is added, after vacuum defoamation treatment, the mixture is poured into a metal mold and cured for 3 hours at 80 ℃.
Example 3:
the specific technical process of the preparation method of the novel underwater sound pouring polyurethane material related to the embodiment is as follows: 38g of hydroxyl-terminated epoxy polybutadiene (EHTPB), 20g of dimer acid diisocyanate (DDI) and 2g of chain extender are added into a container and stirred uniformly, then 30mg of catalyst is added, after vacuum defoamation treatment, the mixture is poured into a metal mold and cured for 3 hours at 80 ℃.
Example 4:
the specific technical process of the preparation method of the novel underwater sound pouring polyurethane material related to the embodiment is as follows: 45g of hydroxyl-terminated epoxy polybutadiene (EHTPB), 20g of dimer acid diisocyanate (DDI) and 2g of chain extender are added into a container and stirred uniformly, then 30mg of catalyst is added, after vacuum defoamation treatment, the mixture is poured into a metal mold and cured for 3 hours at 80 ℃.
The performance test of the polyurethane gel material based on Dimer Diisocyanate (DDI) prepared in example 2 above compared with the silicone potting adhesive referred to the data comparison chart in fig. 1 and specific data gave a water vapor transmission coefficient of 4.24×10 for the novel polyurethane gel material -14 g·cm/cm 2 s.Pa, and the water vapor transmission coefficient of the polyether polyurethane material is 63 x 10 -14 g·cm/cm 2 ·s·Pa；
Referring to the comparison chart in FIG. 2, the insertion loss of the novel polyurethane gel material is 230dB/m in longitudinal wave attenuation coefficient at 700kHz frequency, while the insertion loss of the polyether polyurethane JA-2S which is a common sound-transmitting material is 390dB/m in longitudinal wave attenuation coefficient at 700kHz frequency. From the data, the polyurethane gel material based on the Dimer Diisocyanate (DDI) prepared by the invention has a water permeability coefficient of 6.7% of that of the organosilicon pouring sealant, which shows that the water blocking permeability of the polyurethane gel material is far better than that of the organosilicon pouring sealant; the insertion loss of the polyurethane gel material is far lower than that of polyether polyurethane, which indicates that the sound transmission performance of the polyurethane gel material is far better than that of polyether polyurethane JA-2S which is a common sound transmission material, and compared with the defects of organosilicon pouring sealant in terms of water resistance and sound transmission performance, the polyurethane gel material based on the Dimer Diisocyanate (DDI) prepared by the invention is more suitable for the pouring of electronic components of underwater sound equipment and the filling of acoustic array cables.
And table 1 is a table of mechanical properties data for polyurethane gel materials based on Dimer Diisocyanate (DDI):
the material has low mechanical strength of about 0.85MPa, easy disassembly and convenience for the maintenance of electronic components.
The above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (4)
1. The filling material for encapsulating electronic components of underwater acoustic equipment and acoustic array cables with low water permeability coefficient and low acoustic insertion loss is characterized in that: the adhesive is prepared by curing the following components in percentage by mass:
hydroxyl-terminated epoxidized polybutadiene EHTPB:52% -70%;
dimer acid diisocyanate DDI:20% -41%;
chain extender: 1% -10%;
catalyst: 0% -0.05%;
defoaming agent: 0% -0.1%;
the molecular weight of the hydroxyl-terminated epoxy polybutadiene is 2200-4500;
the molecular weight of the dimer acid diisocyanate is 400-1000;
the chain extender is one or more of 1,1- (phenylimino) bis-2-propanol, 2-ethyl-1, 3-hexanediol, 1, 6-hexanediol and 3,3 '-dichloro-4, 4' -diaminodiphenylmethane;
the catalyst is one of stannous octoate, alkyl tin dithiol, triphenylbismuth, tri (4-ethoxyphenyl) bismuth and tri (3-ethoxyphenyl) bismuth.
2. The filling material for encapsulating electronic components of underwater acoustic equipment and acoustic array cables according to claim 1, characterized in that: the adhesive is prepared by curing the following components in percentage by mass: hydroxyl-terminated epoxidized polybutadiene EHTPB:52% -65%; dimer acid diisocyanate DDI:30% -40%; chain extender: 2% -5%; catalyst: 0% -0.02%; defoaming agent: 0.01% -0.05%.
3. The filling material for encapsulating electronic components of underwater acoustic equipment and acoustic array cables according to claim 1, characterized in that: the curing reaction temperature is 60-100 ℃ at normal temperature.
4. A method for preparing a filling material for encapsulating electronic components of underwater acoustic equipment and acoustic array cables according to any one of claims 1 to 3, comprising the following steps:
weighing the hydroxyl-terminated oxidized polybutadiene EHTPB, the dimer acid diisocyanate DDI and the chain extender according to the formula, adding the mixture into a container, stirring uniformly, adding 5 mg-30 mg of catalyst, carrying out vacuum defoaming treatment, pouring the mixture into a metal mold, and curing for 3 h-18 h at 60-80 ℃.
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| CN202111545095.1A CN114276776B (en) | 2021-12-16 | 2021-12-16 | Filling material for encapsulating electronic components of underwater acoustic equipment and acoustic array cable and preparation method thereof |
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| CN202111545095.1A CN114276776B (en) | 2021-12-16 | 2021-12-16 | Filling material for encapsulating electronic components of underwater acoustic equipment and acoustic array cable and preparation method thereof |
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| US5854332A (en) * | 1996-12-20 | 1998-12-29 | Ppg Industries, Inc. | Aqueous urethane/acrylic resins with branched chain extension and coating compositions made therefrom |
| CN104530366B (en) * | 2014-12-18 | 2017-10-13 | 黎明化工研究设计院有限责任公司 | A kind of polyurethane sealing material and preparation method thereof |
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