CN114274624A

CN114274624A - Semiconductor equipment sealing assembly and manufacturing method thereof

Info

Publication number: CN114274624A
Application number: CN202111613819.1A
Authority: CN
Inventors: 谢昌杰; 别大奎
Original assignee: Shanghai Xinmi Technology Co ltd
Current assignee: Shanghai Xinmi Technology Co ltd
Priority date: 2021-12-27
Filing date: 2021-12-27
Publication date: 2022-04-05

Abstract

The invention discloses a semiconductor equipment sealing assembly and a manufacturing method thereof, wherein the manufacturing method of the semiconductor equipment sealing assembly comprises the following steps: providing a base material; forming a plurality of concave portions on a surface of the base material, and fitting the plurality of concave portions to each other; an elastic body is arranged in the concave part and fills and covers the concave part; and vulcanizing the elastomer to form the semiconductor device sealing assembly. By the semiconductor equipment sealing assembly and the manufacturing method thereof, the performance of the semiconductor equipment sealing assembly is improved, and the manufacturing cost is reduced.

Description

Semiconductor equipment sealing assembly and manufacturing method thereof

Technical Field

The invention relates to the field of semiconductor equipment, in particular to a semiconductor equipment sealing assembly and a manufacturing method thereof.

Background

The hermeticity of semiconductor devices directly affects the yield of semiconductor device fabrication. The semiconductor equipment comprises a sealing assembly formed by compounding an elastomer and a base material by adopting an adhesive, but the adhesive component can be decomposed at high temperature in a severe using environment, so that the elastomer and the base material are layered and even completely separated, the sealing assembly is invalid, the sealing performance of the equipment is influenced, and the semiconductor device is scrapped. On the other hand, each elastomer and different base materials are chemically bonded, so that adaptive adhesives need to be developed, and the development period and the experiment cost of a project are increased.

Therefore, how to obtain a sealing assembly with good sealing performance and low cost becomes a problem to be solved urgently.

Disclosure of Invention

In view of the above-mentioned shortcomings of the prior art, it is an object of the present invention to provide a semiconductor device sealing assembly and a method for fabricating the same, which can physically bond an elastomer and a substrate, improve the delamination phenomenon, shorten the fabrication cycle, and save the cost.

In order to achieve the above objects and other related objects, the present invention adopts the following technical solutions:

provided is a method for manufacturing a semiconductor device sealing assembly, including:

providing a base material;

forming a plurality of concave portions on a surface of the base material, and fitting the plurality of concave portions to each other;

an elastic body is arranged in the concave part and fills and covers the concave part; and vulcanizing the elastomer to form the semiconductor device sealing assembly.

In some embodiments of the invention, the recess is at least one of circular, rectangular, elliptical, polygonal, or linear.

In some embodiments of the present invention, the depth of the recess is 0.2 to 3 mm.

In some embodiments of the invention, the substrate comprises a metal substrate, and the metal substrate comprises at least one of a magnesium substrate, a titanium substrate, an aluminum substrate, a copper substrate, a chromium substrate, an alloy substrate, or a stainless steel substrate.

In some embodiments of the present invention, after the formation of the recessed portion, the metal base material is subjected to an anodic oxidation treatment to form a porous anodic oxide on the surface of the metal base material.

In some embodiments of the invention, the substrate comprises a high molecular polymer substrate, and the high molecular polymer substrate comprises at least one of a polyetheretherketone substrate, a polytetrafluoroethylene substrate, a polyphenylene ether substrate, a polyimide substrate, a poly 4-methylpentene substrate, a polyetherketone substrate, a polyamide substrate, or a composite substrate.

In some embodiments of the present invention, the polymeric substrate is corona surface treated after the formation of the depressions.

In some embodiments of the present invention, the surface roughness of the polymer substrate is 5 to 100 μm.

In some embodiments of the present invention, the elastomer is physically bonded to the recess after the elastomer is once vulcanized, thereby forming the semiconductor device sealing assembly.

Another object of the present invention is to provide a semiconductor device sealing assembly, including:

a base material, wherein the surface of the base material is provided with a plurality of mutually embedded concave parts; and

an elastomer, and the elastomer fills and covers the recess.

The invention provides a semiconductor equipment sealing assembly and a manufacturing method thereof, wherein the elastomer is firmly combined with a base material, the prepared semiconductor equipment sealing assembly is high in mechanical strength, the layering phenomenon is reduced, no chemical adhesive is used, the bonding mode is simple, the working procedures are few, the period is short, the energy consumption is saved, and the cost is reduced. In summary, the semiconductor device sealing assembly and the manufacturing method thereof provided by the invention can improve the performance of the sealing assembly and reduce the cost.

Drawings

Fig. 1 is a schematic structural diagram of a semiconductor device sealing assembly according to an embodiment.

FIG. 2 is a schematic diagram of a substrate and a recess structure according to an embodiment.

FIG. 3 is a schematic diagram of a substrate and a recess structure according to an embodiment.

FIG. 4 is a schematic diagram of a substrate and a recess structure according to an embodiment.

FIG. 5 is a schematic diagram of a substrate and a recess structure according to an embodiment.

FIG. 6 is a schematic diagram of a substrate and a recess structure according to an embodiment.

FIG. 7 is a schematic diagram of a substrate and a recess structure according to an embodiment.

FIG. 8 is a schematic view of the internal destruction of an elastomer in one embodiment.

FIG. 9 is a schematic diagram illustrating test delamination after direct lamination of an elastomer and a substrate in one embodiment.

FIG. 10 is a schematic diagram illustrating test delamination after an elastomer and a substrate are compounded by an adhesive in one embodiment.

Description of reference numerals:

1 a substrate; 2, an elastomer; 3 a recess; 4, adhesive.

Detailed Description

The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.

It is to be understood that the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Unless otherwise specified, "%" and "part" shown in the following examples mean "% by mass" and "part", respectively.

The invention provides a semiconductor sealing assembly and a manufacturing method thereof. In the formed sealing assembly, the base material and the elastomer are physically bonded and firmly combined, and the elastomer is not easy to delaminate and fall off and has good mechanical and chemical properties. The sealing assembly does not contain adhesive, and the sealing element cannot lose efficacy due to adhesive failure. The method can be widely applied to semiconductor sealing components in semiconductor equipment, such as etching, cleaning, film coating and other processes, and can also be applied to the industries of transportation, metallurgy, electric power, electronic instruments and meters, part sealing and the like.

Referring to fig. 1, in an embodiment of the present invention, a surface of a substrate 1 is roughened to form a plurality of recesses 3. The material of the substrate 1 is not limited in the present invention, and may be selected according to the application, for example, the substrate 1 may be selected from at least one of a metal substrate, a polymer substrate, and the like, wherein the metal substrate includes but is not limited to at least one of a magnesium substrate, a titanium substrate, an aluminum substrate, a copper substrate, a chromium substrate, an alloy substrate, or a stainless steel substrate, and the polymer substrate includes but is not limited to at least one of a Polyetheretherketone (PEEK) substrate, a Polytetrafluoroethylene (PTFE) substrate, a polyphenylene oxide (PPO) substrate, a Polyimide (PI) substrate, a poly 4-methylpentene (TPX) substrate, a Polyetherketone (PEK) substrate, a Polyamide (PA) substrate, or a composite material.

Referring to fig. 1, in an embodiment of the present invention, the concave portion 3 on the surface of the substrate 1 is formed with a plurality of three-dimensional hollow-out lines on the surface of the substrate 1, and the concave portion 3 is manufactured by an integrated molding process, wherein a metal substrate is manufactured by, for example, Numerical Control (CNC) integrated molding, a polymer substrate is manufactured by, for example, 3D printing integrated molding, and the concave portion 3 is manufactured by the integrated molding process, which is beneficial for the substrate 1 to maintain high strength. The concave parts 3 on the base material 1, namely the three-dimensional hollow lines are embedded with each other, so that the binding force between the base material 1 and the elastic body 2 can be improved. The shape of the concave portion 3 is not limited in the present invention, and may be at least one of a circle, a square, a polygon, or a curve, for example, that is, the shape of the three-dimensional hollow-out pattern may be flexibly selected. In other embodiments, other forming methods can be selected to form the concave part 3 with other shapes according to the manufacturing requirements.

Referring to fig. 1, in an embodiment of the present invention, the depth of the recess 3, i.e., the hollow portion, on the surface of the substrate 1 is, for example, 0.2 to 3.0mm, and the thickness of the untreated bottom of the substrate 1 is determined by the size of the sealing element, for example, greater than 0.5 mm. After the formation of the recesses 3, the substrate 1 is further treated to increase the roughness of the surface of the substrate 1, wherein a metal substrate is treated, for example by anodization, to form a porous anodic oxide on the surface thereof, and a high molecular polymer substrate is treated, for example by corona, to increase the roughness thereof. In the present embodiment, the average roughness of the surface of the polymer substrate is, for example, 5 to 100 μm, and is, for example, 10 to 100 μm, wherein the average roughness is measured by a laser microscope. In other embodiments, the depth of the recess 3 and the thickness of the untreated substrate 1 may be changed according to the use scenario of the seal assembly.

Referring to fig. 1, in one embodiment of the present invention, elastomer 2 is selected from, for example, a fluoroelastomer, and the fluoroelastomer composition is selected from, for example, an elastomer that has not been vulcanized, including but not limited to, one or a combination of perfluoroether elastomer, tetrapropylene fluoroelastomer, tetrafluoroethylene/propylene/vinylidene fluoride type fluoroelastomer, ethylene/hexafluoropropylene/tetrafluoroethylene type fluoroelastomer, fluoropolysiloxane type fluoroelastomer, and fluorinated coupled phosphazene type fluoroelastomer. In other embodiments, the elastic body 2 may also be selected according to the use scenario. A cross-linking agent is added into the elastomer 2, and the content of the cross-linking agent is at least 1 part, wherein the cross-linking agent comprises one or a combination of a peroxide cross-linking agent, a polyol cross-linking agent, a polyamine cross-linking agent, a triazine cross-linking agent, an oxazole cross-linking agent, an imidazole cross-linking agent or a thiazole cross-linking agent and the like. By adding the crosslinking agent, the functional group in the crosslinking agent and the crosslinking point in the elastomer 2 undergo addition, cyclization and other reactions at a certain temperature and under a certain pressure, so that the molecular chains in the elastomer 2 are promoted to crosslink from linear structures into network structures, and high elasticity is imparted to the sealing component product.

Referring to fig. 1, in one embodiment of the present invention, various additives, such as an anti-aging agent, an antioxidant, a vulcanization accelerator, a tackifier, a silane coupling agent, a plasticizer, a flame retardant, and the like, are added to the elastomer 2. By adding various additives, the performance of the sealing component is improved. In the present embodiment, a release agent is further added to the elastomer 2, and for example, octadecylamine or the like is selected. By adding the release agent, when the elastomer 2 is combined with the base material 1, the release of the elastomer 2 and a metal mold is facilitated, the contact part of the elastomer 2 and the mold is prevented from being adhered to the mold, the defects that a preforming sealing element is broken instantly in the one-time vulcanization mold opening process of a press and the like are caused, and meanwhile, the processing performance of the elastomer 2 is facilitated to be regulated and controlled.

Referring to fig. 1, in an embodiment of the present invention, the elastic body 2 is disposed on one side of the concave portion 3 of the substrate 1, and the elastic body 2 is filled in the concave portion 3 by a physical method, so as to improve the mechanical strength of the sealing assembly and increase the physical adhesion between the elastic body 2 and the substrate 1. In this embodiment, the elastomer 2 and the substrate 1 are molded to prepare the sealing assembly, and before molding, the elastomer 2 passes through a plunger type extruder to remove gas in the rubber compound, and meanwhile, the molecular chain segments in the rubber strip are orderly arranged along the long-range direction of the flow field, which is beneficial to improving the dimensional stability in the molding stage and the mechanical property of the rubber compound along the direction of the flow field. The extrusion temperature of the elastomer 2 is, for example, 60 to 100 ℃, and the extrusion speed of the rubber compound is, for example, 10 to 70 mm/s. At this temperature and extrusion speed, the gas in the compound can be completely excluded. The extruded rubber material has smooth surface, and is favorable for regulating and controlling the size of the cross section of the product in the one-step molding process of die pressing.

Referring to fig. 1, in one embodiment of the present invention, elastomer 2 is once vulcanized in a press and laminated to produce a sealed assembly. In the embodiment, the primary vulcanization is performed in a press, and the temperature of the primary vulcanization is, for example, 150 to 200 ℃, the pressure of the primary vulcanization is, for example, 5 to 20MPa, and the vulcanization time is, for example, 3 to 20 min. After the primary vulcanization is carried out at the temperature, time and pressure, the preformed product keeps higher crosslinking degree, and the production efficiency can be considered while the mechanical property of the product is improved.

Referring to fig. 1, in an embodiment of the present invention, in a compression molding process of a sealing assembly, a substrate 1 is placed between an upper mold and a lower mold, and a bottom of the substrate 1 is fixed to prevent the substrate 1 from shaking between the upper mold and the lower mold during the compression molding process, the fixing manner of the substrate 1 includes a method of providing a positioning pin at the bottom of the substrate 1 or designing a mold cavity for placing the substrate 1 in the lower mold, and the like, so that the substrate 1 is fixed to facilitate tight adhesion between an elastomer 2 and the substrate 1 during the compression molding process, and improve a yield of the sealing assembly. When the base material 1 is a metal material, the base material 1 is placed between the upper and lower molds and can be preheated for a time longer than 30 seconds, so as to ensure that the laminating temperature of the metal base material and the upper and lower molds is consistent, ensure that the elastomer 2 reaches 90% of crosslinking degree in the one-time vulcanization process, and improve the physical and mechanical properties of the elastomer 2. When the substrate 1 is a high molecular polymer substrate, the thermal expansion coefficient of the plastic such as polyetheretherketone, polytetrafluoroethylene or poly 4-methylpentene is larger than that of the mold metal in the process of laminating the high molecular polymer substrate, and therefore, the preheating treatment is not performed. Since plastic base materials are mostly thermoplastic, the high molecular polymer base material softens when the mold temperature approaches the melting point, and therefore, the temperature of the primary vulcanization is lower than the melting point of the polymer base material, and the temperature of the primary vulcanization is lower than the melting point of the polymer base material by at least 30 ℃ or more, for example, in the process of press molding. By setting the temperature of the primary vulcanization to be lower than the melting point of the polymer base material, the strength of the base material 1 is ensured.

Referring to fig. 1, in an embodiment of the invention, the total thickness of the elastic body 2 is greater than the maximum thickness of the concave portion 3, that is, the elastic body 2 completely fills the three-dimensional hollow substrate portion and covers the surface of the substrate 1, and the total thickness of the elastic body 2 after being molded is, for example, greater than 30% or more of the maximum thickness of the concave portion 3. In other embodiments, the thickness of the elastic body 2 can be flexibly selected according to the manufacturing requirements. After the compression molding of the sealing component, the elastomer 2 is subjected to secondary vulcanization, wherein the temperature of the secondary vulcanization is 210-280 ℃, and the time of the secondary vulcanization is 4-30 hours, for example. After vulcanization, the mechanical properties of the sealing assembly are tested, and the mechanical properties of the sealing assembly are tested according to the rubber property test standard test method, namely the test standard of the adhesion strength test (ASTM D429-14) of the sealing assembly with a rigid matrix. In the invention, the elastomer 2 and the substrate 1 are completely bonded by physical crosslinking, so that the method is environment-friendly and safe, has less processes and can improve the production efficiency. And the sealing component has no delamination phenomenon between the elastomer 2 and the metal or polymer substrate in the using process, and can be suitable for sealing high temperature, corrosivity, ultraviolet rays, plasmas or vacuum chambers.

Referring to fig. 2, in an embodiment of the present invention, the substrate 1 is a poly-tetramethylpentene substrate, and the recess 3 is processed by 3D printing. The total thickness of the substrate 1 is, for example, 5mm, the minimum depth of the three-dimensional hollow pattern is, for example, 0.3mm, the maximum depth is, for example, 2mm, and the total thickness of the elastic body is, for example, 3 mm. After the processing of the recessed portion 3 of the substrate 1 is completed, the processed substrate 1 is subjected to corona treatment to secure an average roughness of, for example, 15um on the surface of the polytetramethylpentene substrate. A crosslinking agent such as 2 parts of 2, 5-dimethyl-2, 5-di (t-butylperoxy) hexane and an antioxidant such as 0.3 part of GA550 are added to the raw elastomer rubber, mixed uniformly, and extruded into a rubber strip of a specific shape in a ram extruder. Wherein the extrusion temperature is, for example, 70 ℃ and the extrusion rate is, for example, 50 mm/s. The extruded strip is subjected to a primary vulcanization in a press at a temperature of, for example, 150 c, a pressure of 10MPa and a time of 15min, and then laminated to prepare a sealing assembly article. And then the sealing assembly product is subjected to secondary vulcanization at the temperature of 210 ℃ for 24 hours for example, and the preparation of the sealing assembly is finished. The mechanical properties of the seal assembly, such as the 180 ° peel test at 150 ℃ of the test elastomer, were tested and the seal assembly exhibited internal failure of the elastomer and no delamination, as shown in figure 8. The sealing assembly prepared by the method has better mechanical property because the elastomer is well adhered to the base material 1 and is embedded in the concave part 3 on the base material 1.

Referring to fig. 9, in an embodiment of the present invention, the substrate 1 is a polytetramethylpentene substrate, and the polytetramethylpentene substrate is not surface-treated. A crosslinking agent such as 2 parts of 2, 5-dimethyl-2, 5-di (t-butylperoxy) hexane and an antioxidant such as 0.3 part of GA550 are added to the raw elastomer rubber, mixed uniformly, and extruded into a rubber strip of a specific shape in a ram extruder. Wherein the extrusion temperature is, for example, 70 ℃ and the extrusion rate is, for example, 50 mm/s. The extruded strip is subjected to a primary vulcanization in a press at a temperature of, for example, 150 c, a pressure of 10MPa and a time of 15min, and then laminated to prepare a sealing assembly article. And then the sealing assembly product is subjected to secondary vulcanization at the temperature of 210 ℃ for 24 hours for example, and the preparation of the sealing assembly is finished. The mechanical properties of the seal assembly, such as the 180 ° peel test of elastomer 2 at 150 ℃, were tested, and the elastomer 2 delaminated from the substrate 1 in the seal assembly, indicating poor adhesion between the elastomer 2 and the substrate 1, further indicating increased adhesion of the elastomer to the substrate through the recesses.

Referring to fig. 2, in an embodiment of the present invention, the substrate 1 is a metal aluminum-chromium alloy substrate, and the concave portion 3 is formed by CNC processing, wherein a total thickness of the substrate 1 is, for example, 8mm, a minimum depth of the three-dimensional hollow pattern is, for example, 0.7mm, a maximum depth is, for example, 3mm, and a total thickness of the elastomer is, for example, 4.5 mm. After the recess 3 of the substrate 1 is finished, the processed substrate 1 is anodized. For example, 1.5 parts of a dicumyl hydroperoxide crosslinking agent and 0.3 part of a silane coupling agent, vinyltris (2-methoxyethoxy) silane, are added to an elastomer raw rubber, mixed uniformly, and extruded into a rubber strip of a specific shape in a ram extruder. Wherein the extrusion temperature is, for example, 80 ℃, the extrusion rate is, for example, 35mm/s, and the substrate 1 is preheated, for example, for 60s before extruding the bead. The extruded strip is once vulcanized in a press, for example at a temperature of 170 ℃, a pressure of 20MPa and a time of 20min, and then laminated to produce a sealing assembly article. And then the sealing assembly product is subjected to secondary vulcanization at the temperature of 230 ℃ for 28 hours for example, and the preparation of the sealing assembly is finished. The mechanical properties of the sealing assembly are tested, for example, the 180-degree peeling test of the elastomer at 150 ℃ is tested, the elastomer in the sealing assembly is internally damaged and does not have the delamination phenomenon, so that the elastomer is well adhered to the base material 1, the elastomer is embedded in the concave part 3 on the base material 1, and different base materials and concave parts can be well physically adhered to the elastomer.

Referring to fig. 2, in an embodiment of the present invention, the substrate 1 is made of a metal aluminum substrate, and the recess 3 is formed by CNC machining, wherein the total thickness of the substrate 1 is, for example, 8mm, the minimum depth of the three-dimensional hollow pattern is, for example, 1.5mm, the maximum depth is, for example, 3mm, and the total thickness of the elastomer is, for example, 5 mm. After the recess 3 of the substrate 1 is finished, the processed substrate 1 is anodized. To the raw elastomer rubber, for example, 1.5 parts of 2, 5-dimethyl-2, 5-di (t-butylperoxy) hexane crosslinking agent and, for example, 0.2 part of 3, 5-di-t-butyl-4-hydroxyphenylpropionic acid isooctyl ester as an antioxidant are added, and after mixing uniformly, the mixture is extruded into a strip of a specific shape in a ram extruder. Wherein the extrusion temperature is, for example, 80 ℃, the extrusion rate is, for example, 60mm/s, and the substrate 1 is preheated, for example, 45s before extruding the strip. The extruded strip is subjected to a primary vulcanization in a press at a temperature of, for example, 170 c, a pressure of 15MPa and a time of 15min, followed by lamination to prepare a sealing assembly article. And then the sealing assembly product is subjected to secondary vulcanization at the temperature of 250 ℃ for 15 hours, and the preparation of the sealing assembly is finished. The mechanical properties of the seal assembly, for example, 180 ° peel test of the elastomer at 150 ℃, were tested, and the elastomer in the seal assembly was internally damaged and no delamination occurred, indicating that the adhesion between the elastomer and the substrate 1 was good, the elastomer was embedded in the recess 3 on the substrate 1, and the type of the elastomer and the substrate 1 did not affect the embedding of the elastomer and the substrate 1 by the depth of the recess 3.

Referring to fig. 3, in an embodiment of the invention, the substrate 1 is a polyetheretherketone substrate, and the recess 3 is processed by 3D printing, wherein the total thickness of the substrate 1 is, for example, 3mm, the minimum depth of the three-dimensional hollow pattern is, for example, 0.2mm, the maximum depth is, for example, 1mm, and the total thickness of the elastomer is, for example, 4 mm. After the processing of the recessed portion 3 of the substrate 1 is completed, the processed substrate 1 is subjected to corona treatment to secure an average roughness of, for example, 10um on the surface of the polyetheretherketone substrate. To the elastomer raw rubber, for example, 1 part of methyltrimethoxysilane and, for example, 0.5 part of N, N-methylenebisacrylamide are added as a crosslinking agent, and, for example, 0.2 part of plasticizer phthalate, and after mixing uniformly, a strip of a specific shape is extruded in a ram extruder. Wherein the extrusion temperature is, for example, 75 ℃ and the extrusion rate is, for example, 60 mm/s. The extruded strip is subjected to a primary vulcanization in a press at a temperature of, for example, 160 ℃, a pressure of 15MPa and a time of 15min, and then laminated to prepare a sealing assembly product. And then the sealing assembly product is subjected to secondary vulcanization at the temperature of 230 ℃ for 20 hours, and the preparation of the sealing assembly is finished. The mechanical property of the sealing assembly is tested, the 180-degree peeling test of the elastomer at 150 ℃ is tested, the elastomer is internally damaged and does not have the layering phenomenon in the sealing assembly, the adhesion between the elastomer and the base material 1 is better, the elastomer is embedded in the concave part 3 on the base material 1, and the appearance of the concave part does not influence the physical adhesion between the elastomer and the base material.

Referring to fig. 9, in an embodiment of the invention, the substrate 1 is a peek substrate, and the peek substrate is not surface-treated. To the elastomer raw rubber, for example, 1 part of methyltrimethoxysilane and, for example, 0.5 part of N, N-methylenebisacrylamide are added as a crosslinking agent, for example, 0.2 part of plasticizer phthalate, and after mixing uniformly, a strip of a specific shape is extruded in a ram extruder. Wherein the extrusion temperature is, for example, 75 ℃ and the extrusion rate is, for example, 60 mm/s. The extruded strip is subjected to a primary vulcanization in a press at a temperature of, for example, 160 ℃, a pressure of 15MPa and a time of 15min, and then laminated to prepare a sealing assembly product. And then the sealing assembly product is subjected to secondary vulcanization at the temperature of 230 ℃ for 20 hours, and the preparation of the sealing assembly is finished. The mechanical properties of the seal assembly, for example, the 180 ° peel test of elastomer 2 at 150 ℃, were tested, and the elastomer 2 delaminated from the substrate 1 in the seal assembly, indicating poor adhesion between the elastomer 2 and the substrate 1, and further, the elastomer was directly bonded to the polymeric substrate, and the adhesion between the elastomer and the polymeric substrate was poor.

Referring to fig. 3, in an embodiment of the invention, the substrate 1 is made of a metal stainless steel substrate, and the recess 3 is machined by CNC machining, wherein a total thickness of the substrate 1 is, for example, 7mm, a minimum depth of the three-dimensional hollow pattern is, for example, 0.3mm, a maximum depth is, for example, 2.5mm, and a total thickness of the elastomer is, for example, 5 mm. After the recess 3 of the substrate 1 is finished, the processed substrate 1 is anodized. To the raw elastomer rubber, for example, 5 parts of bis [2- (perfluorohexyl) ethyl ] phosphate crosslinking agent and, for example, 0.1 part of dioctyl phthalate, as a plasticizer, are added, mixed uniformly, and extruded into a strip of a specific shape in a ram extruder. Wherein the extrusion temperature is, for example, 100 ℃, the extrusion rate is, for example, 25mm/s, and the substrate 1 is preheated, for example, 40s, before extruding the bead. The extruded strip is subjected to a primary vulcanization in a press at a temperature of, for example, 180 ℃, a pressure of 12MPa and a time of 20min, and then laminated to prepare a sealing assembly product. And then the sealing assembly product is subjected to secondary vulcanization at the temperature of 270 ℃ for 12 hours, and the preparation of the sealing assembly is finished. The mechanical properties of the seal assembly, for example, 180 ° peel test of the elastomer at 150 ℃, were tested, and the elastomer in the seal assembly was internally damaged and no delamination occurred, indicating that the elastomer adhered well to the substrate 1 and that the elastomer was embedded in the recess 3 in the metal substrate on the substrate 1.

Referring to fig. 3, in an embodiment of the present invention, the substrate 1 is a copper substrate, and the recess 3 is processed by CNC processing, wherein the total thickness of the substrate 1 is, for example, 4.5mm, the minimum depth of the three-dimensional hollow pattern is, for example, 0.3mm, the maximum depth is, for example, 1.5mm, and the total thickness of the elastomer is, for example, 3 mm. After the recess 3 of the substrate 1 is finished, the processed substrate 1 is anodized. For example, 1.5 parts of 2, 5-dimethyl-2, 5-di (t-butylperoxy) hexane crosslinking agent and 0.3 part of triethoxyfluorosilane as silane coupling agent are added to raw elastomer rubber, mixed uniformly, and extruded into rubber strips with specific shapes in a ram extruder. Wherein the extrusion temperature is, for example, 80 ℃, the extrusion rate is, for example, 35mm/s, and the substrate 1 is preheated, for example, 55s, before extruding the bead. The extruded strip is subjected to primary vulcanization in a press at a temperature of 190 ℃, a pressure of 15MPa and a time of 8min, for example, and then laminated to prepare a sealing assembly product. And then the sealing assembly product is subjected to secondary vulcanization at the temperature of 220 ℃ for 28 hours for example, and the preparation of the sealing assembly is finished. The mechanical properties of the seal assembly, for example, the 180 ° peel test of the elastomer at 150 ℃, were tested, and the elastomer in the seal assembly was internally damaged and no delamination occurred, indicating that the adhesion between the elastomer and the substrate 1 was good, the elastomer was embedded in the recess 3 on the substrate 1, and the shape of the recess 3 did not affect the bonding of the elastomer and the substrate 1.

Referring to fig. 4, in an embodiment of the invention, the substrate 1 is a metal titanium substrate, and the concave portion 3 is processed by CNC machining, wherein a total thickness of the substrate 1 is, for example, 5mm, a minimum depth of the three-dimensional hollow pattern is, for example, 0.5mm, a maximum depth is, for example, 1.5mm, and a total thickness of the elastomer is, for example, 3 mm. After the recess 3 of the substrate 1 is finished, the processed substrate 1 is anodized. The elastomer raw rubber is added with, for example, 1.0 part of sodium dibutyldithiocarbamate crosslinking agent and, for example, 0.3 part of plasticizer phthalate, and after being uniformly mixed, is extruded into a rubber strip of a specific shape in a ram extruder. Wherein the extrusion temperature is, for example, 95 ℃ and the extrusion rate is, for example, 40mm/s, and the substrate 1 is preheated, for example, for 50s, before the strip is extruded. The extruded strip is subjected to a primary vulcanization in a press at a temperature of, for example, 150 c, a pressure of 8MPa and a time of 20min, followed by lamination to prepare a sealing assembly article. And then the sealing assembly product is subjected to secondary vulcanization at the temperature of 210 ℃ for 30 hours, and the preparation of the sealing assembly is finished. The mechanical properties of the seal assembly, for example, the 180 ° peel test of the elastomer at 150 ℃, were tested, and the elastomer in the seal assembly was internally damaged and no delamination occurred, indicating that the elastomer was well adhered to the substrate 1, the elastomer was embedded in the recess 3 on the substrate 1, and the material of the substrate 1 did not affect the physical adhesion of the elastomer 2 to the substrate 1.

Referring to fig. 9, in an embodiment of the invention, the substrate 1 is a metallic titanium substrate, and the metallic titanium substrate is not subjected to surface treatment. The elastomer raw rubber is added with, for example, 1.0 part of sodium dibutyldithiocarbamate crosslinking agent and, for example, 0.3 part of plasticizer phthalate, and after being uniformly mixed, is extruded into a rubber strip of a specific shape in a ram extruder. Wherein the extrusion temperature is, for example, 95 ℃ and the extrusion rate is, for example, 40 mm/s. The extruded strip is subjected to a primary vulcanization in a press at a temperature of, for example, 150 c, a pressure of 8MPa and a time of 20min, followed by lamination to prepare a sealing assembly article. And then the sealing assembly product is subjected to secondary vulcanization at the temperature of 210 ℃ for 30 hours, and the preparation of the sealing assembly is finished. The mechanical properties of the seal assembly, for example the 180 ° peel test at 150 ℃ of the test elastomer, in which the elastomer delaminates from the substrate 1, are tested, indicating poor adhesion between the elastomer 2 and the substrate 1.

Referring to fig. 4, in an embodiment of the present invention, the substrate 1 is a magnesium substrate, and the recess 3 is processed by CNC machining, wherein the total thickness of the substrate 1 is, for example, 2.9mm, the minimum depth of the three-dimensional hollow pattern is, for example, 0.4mm, the maximum depth is, for example, 0.9mm, and the total thickness of the elastomer is, for example, 3.5 mm. After the recess 3 of the substrate 1 is finished, the processed substrate 1 is anodized. To the raw elastomer rubber, for example, 1 part of perfluoro-1, 3-dimethylcyclohexane and, for example, 1 part of benzoyl peroxide crosslinking agent, for example, 0.3 part of silane coupling agent (3-mercaptopropyl) trimethoxysilane, are added, mixed uniformly, and extruded into a rubber strip of a specific shape in a ram extruder. Wherein the extrusion temperature is, for example, 85 ℃, the extrusion rate is, for example, 20mm/s, and the substrate 1 is preheated, for example, 40s, before extruding the bead. The extruded strip is subjected to primary vulcanization in a press at a temperature of 190 ℃, a pressure of 15MPa and a time of 15min, for example, and then laminated to prepare a sealing assembly product. And then the sealing assembly product is subjected to secondary vulcanization at the temperature of 280 ℃ for 6 hours, and the preparation of the sealing assembly is finished. The mechanical properties of the seal assembly, for example, 180 ° peel test of the elastomer at 150 ℃, were tested, and the seal assembly exhibited internal failure of the elastomer and no delamination, indicating that the adhesion of the elastomer to the substrate 1 was good, that the elastomer was embedded in the recess 3 on the substrate 1, and that the depth of the recess had little effect on the adhesion between the elastomer 2 and the substrate 1.

Referring to fig. 4, in an embodiment of the present invention, the substrate 1 is a polyamide substrate, and the recess 3 is processed by 3D printing, wherein the total thickness of the substrate 1 is, for example, 7.5mm, the minimum depth of the three-dimensional hollow pattern is, for example, 0.5mm, the maximum depth is, for example, 3mm, and the total thickness of the elastomer is, for example, 4.5 mm. After the processing of the recessed portion 3 of the base material 1 is completed, the processed base material 1 is subjected to corona treatment to secure the roughness of the polyamide base material surface of, for example, 55 um. For example, 3 parts of a di-tert-butyl peroxide crosslinking agent and 0.3 part of a silane coupling agent, tributylsilane, are added to an elastomer raw rubber, and after uniform mixing, a rubber strip with a specific shape is extruded in a ram extruder. Wherein the extrusion temperature is, for example, 95 ℃ and the extrusion rate is, for example, 70 mm/s. The extruded strip is once vulcanized in a press, for example at a temperature of 185 ℃, a pressure of 15MPa and a time of 5min, and then laminated to produce a sealing assembly article. And then the sealing assembly product is subjected to secondary vulcanization at the temperature of 270 ℃ for 20 hours, and the preparation of the sealing assembly is finished. The mechanical properties of the seal assembly, for example, 180 ° peel test of the elastomer at 150 ℃, were tested, and the elastomer in the seal assembly was internally damaged and no delamination occurred, indicating that the adhesion between the elastomer and the substrate 1 was good, the elastomer was embedded in the recess 3 on the substrate 1, and the kind of the crosslinking agent did not affect the performance of the seal assembly.

Referring to fig. 5, in an embodiment of the present invention, the substrate 1 is made of a metal aluminum substrate, and the recess 3 is processed by CNC, wherein the total thickness of the substrate 1 is, for example, 3mm, the minimum depth of the three-dimensional hollow pattern is, for example, 0.4mm, the maximum depth is, for example, 1mm, and the total thickness of the elastomer is, for example, 3.5 mm. After the recess 3 of the substrate 1 is finished, the processed substrate 1 is anodized. For example, 1.2 parts of bis [2- (perfluorohexyl) ethyl ] phosphate crosslinking agent and 0.5 parts of plasticizer terephthalate are added to the raw elastomer rubber, mixed uniformly, and extruded into a strip of a specific shape in a ram extruder. Wherein the extrusion temperature is, for example, 90 ℃ and the extrusion rate is, for example, 30mm/s, and the substrate 1 is preheated, for example, for 30s, before extruding the bead. The extruded strip is subjected to primary vulcanization in a press at a temperature of 190 ℃, a pressure of 8MPa and a time of 3min, for example, and then laminated to prepare a sealing assembly product. And then the sealing assembly product is subjected to secondary vulcanization at the temperature of 280 ℃ for 8 hours, and the preparation of the sealing assembly is finished. The mechanical properties of the seal assembly, for example, 180 ° peel test of the test elastomer at 150 ℃, were tested, and the seal assembly exhibited internal failure of the elastomer and no delamination, indicating that the elastomer adhered to the substrate 1 well and that the elastomer was embedded in the recess 3 on the substrate 1.

Referring to FIG. 9, in one embodiment of the present invention, the substrate 1 is a metal aluminum substrate without surface treatment. For example, 1.2 parts of bis [2- (perfluorohexyl) ethyl ] phosphate crosslinking agent and 0.5 parts of plasticizer terephthalate are added to the raw elastomer rubber, mixed uniformly, and extruded into a strip of a specific shape in a ram extruder. Wherein the extrusion temperature is, for example, 90 ℃ and the extrusion rate is, for example, 30 mm/s. The extruded strip is subjected to primary vulcanization in a press at a temperature of 190 ℃, a pressure of 8MPa and a time of 3min, for example, and then laminated to prepare a sealing assembly product. And then the sealing assembly product is subjected to secondary vulcanization at the temperature of 280 ℃ for 8 hours, and the preparation of the sealing assembly is finished. The mechanical properties of the seal assembly, for example a 180 ° peel test of the test elastomer at 150 ℃, are tested, in which the elastomer 2 delaminates from the substrate 1, indicating poor adhesion between the elastomer 2 and the substrate 1, further indicating that the elastomer adheres tightly to the substrate through the recesses, and if no recesses are present, the adhesion between the elastomer and the substrate is also low through the crosslinking agent and other auxiliaries.

Referring to fig. 5, in an embodiment of the present invention, the substrate 1 is made of a metal aluminum substrate, and the recess 3 is processed by CNC, wherein the total thickness of the substrate 1 is, for example, 7.7mm, the minimum depth of the three-dimensional hollow pattern is, for example, 0.4mm, the maximum depth is, for example, 2.7mm, and the total thickness of the elastomer is, for example, 3 mm. After the recess 3 of the substrate 1 is finished, the processed substrate 1 is anodized. To the raw elastomer rubber, for example, 2 parts of 2, 5-dimethyl-2, 5-di (t-butylperoxy) hexane crosslinking agent and, for example, 0.3 part of 3-glycidyltrimethoxysilane as a silane coupling agent were added, mixed uniformly, and extruded into a rubber strip of a specific shape in a ram extruder. Wherein the extrusion temperature is, for example, 90 ℃ and the extrusion rate is, for example, 55mm/s, and the substrate 1 is preheated, for example, 45s before extruding the strip. The extruded strip is once vulcanized in a press, for example at a temperature of 175 ℃, a pressure of 18MPa and a time of 5min, and then laminated to prepare a sealing assembly article. And then the sealing component product is subjected to secondary vulcanization at the temperature of 260 ℃ for 15 hours for example, and the preparation of the sealing component is finished. The mechanical property of the sealing assembly is tested, for example, the 180-degree peeling test of the elastomer at 150 ℃ is tested, the elastomer is internally damaged and does not have the layering phenomenon in the sealing assembly, and the extrusion speed of the rubber strip has small influence on the mechanical property of the sealing assembly.

Referring to fig. 5, in an embodiment of the present invention, the substrate 1 is a polyphenylene oxide substrate, and the recess 3 is processed by 3D printing, wherein the total thickness of the substrate 1 is, for example, 7mm, the minimum depth of the three-dimensional hollow pattern is, for example, 0.5mm, the maximum depth is, for example, 2.5mm, and the total thickness of the elastomer is, for example, 4.5 mm. After the processing of the recessed portion 3 of the base material 1 is completed, the processed base material 1 is subjected to corona treatment to secure the roughness of the surface of the polyphenylene ether base material to, for example, 10 um. To the elastomer raw rubber, for example, 1 part of 2-ethyl-4-methylimidazole and, for example, 1 part of a phthalic anhydride crosslinking agent, for example, 0.3 part of a silane coupling agent, dimethylphenylsilane, are added, mixed uniformly, and then extruded into a rubber strip of a specific shape in a ram extruder. Wherein the extrusion temperature is, for example, 75 ℃ and the extrusion rate is, for example, 10 mm/s. The extruded strip is once vulcanized in a press, for example at a temperature of 185 ℃, a pressure of 18MPa and a time of 18min, and then laminated to produce a sealing assembly article. And then the sealing assembly product is subjected to secondary vulcanization at the temperature of 250 ℃ for 24 hours, and the preparation of the sealing assembly is finished. The mechanical properties of the seal assembly, for example, 180 ° peel test of the test elastomer at 150 ℃, were tested, and the seal assembly exhibited internal failure of the elastomer and no delamination, indicating that the elastomer adhered to the substrate 1 well and that the elastomer was embedded in the recess 3 on the substrate 1.

Referring to fig. 6, in an embodiment of the invention, the substrate 1 is a polyimide substrate, and the recess 3 is processed by 3D printing, wherein the total thickness of the substrate 1 is, for example, 3mm, the minimum depth of the three-dimensional hollow pattern is, for example, 0.7mm, the maximum depth is, for example, 1mm, and the total thickness of the elastomer is, for example, 4 mm. After the processing of the concave portion 3 of the substrate 1 is completed, the processed substrate 1 is subjected to corona treatment to secure the roughness of the polyimide substrate surface to 35um, for example. To the raw elastomer rubber, for example, 3 parts of 2, 2-bis (trifluoromethanesulfonyloxy) -1, 1-biphenyl (1, 1-bisphenol bisphenolate) as a crosslinking agent and 0.2 part of diisononyl phthalate as a plasticizer are added, mixed uniformly, and extruded in a ram extruder into a rubber strip of a specific shape. Wherein the extrusion temperature is, for example, 70 ℃ and the extrusion rate is, for example, 10 mm/s. The extruded strip is once vulcanized in a press, for example at a temperature of 160 ℃, a pressure of 20MPa and a time of 10min, and then laminated to produce a sealing assembly article. And then the sealing assembly product is subjected to secondary vulcanization at the temperature of 280 ℃ for 15 hours, and the preparation of the sealing assembly is finished. The mechanical properties of the seal assembly, for example, 180 ° peel test of the test elastomer at 150 ℃, were tested, and the seal assembly exhibited internal failure of the elastomer and no delamination, indicating that the elastomer adhered to the substrate 1 well and that the elastomer was embedded in the recess 3 on the substrate 1.

Referring to fig. 6, in an embodiment of the present invention, the substrate 1 is a polyetherketone substrate, and the recess 3 is processed by 3D printing, wherein the total thickness of the substrate 1 is, for example, 8mm, the minimum depth of the three-dimensional hollow pattern is, for example, 0.5mm, the maximum depth is, for example, 3mm, and the total thickness of the elastomer is, for example, 5 mm. After the processing of the recessed portion 3 of the substrate 1 is completed, the processed substrate 1 is subjected to corona treatment to secure a roughness of, for example, 70um on the surface of the polyether ketone substrate. To the raw elastomer rubber, for example, 2 parts of 2-ethyl-4-methylimidazole crosslinking agent and, for example, 0.2 part of 3, 6-dihydroxybenzonorbornane as an antioxidant are added, mixed uniformly, and extruded into a rubber strip of a specific shape in a ram extruder. Wherein the extrusion temperature is, for example, 100 ℃ and the extrusion rate is, for example, 40 mm/s. The extruded strip is subjected to a primary vulcanization in a press at a temperature of, for example, 180 ℃, a pressure of 13MPa and a time of 17min, and then laminated to prepare a sealing member article. And then the sealing assembly product is subjected to secondary vulcanization at the temperature of 280 ℃ for 16 hours, and the preparation of the sealing assembly is finished. The mechanical properties of the seal assembly, for example, 180 ° peel test of the test elastomer at 150 ℃, were tested, and the seal assembly exhibited internal failure of the elastomer and no delamination, indicating that the elastomer adhered to the substrate 1 well and that the elastomer was embedded in the recess 3 on the substrate 1.

Referring to fig. 7, in an embodiment of the present invention, the substrate 1 is a composite material substrate of peek and ptfe, and the recess 3 is processed by 3D printing, wherein a total thickness of the substrate 1 is, for example, 5.5mm, a minimum depth of the three-dimensional hollow pattern is, for example, 1mm, a maximum depth is, for example, 2mm, and a total thickness of the elastomer is, for example, 3.5 mm. After the processing of the recessed portion 3 of the substrate 1 is completed, the processed substrate 1 is subjected to corona treatment to secure the roughness of the composite material substrate of polyetheretherketone and polytetrafluoroethylene to 35um, for example. To the raw elastomer rubber, for example, 1 part of 2-ethyl-4-methylimidazole and, for example, 1 part of a phthalic anhydride crosslinking agent, for example, 0.3 part of a silane coupling agent, dimethylphenylsilane, are added, mixed uniformly, and then extruded into a rubber strip of a specific shape in a ram extruder. Wherein the extrusion temperature is, for example, 70 ℃ and the extrusion rate is, for example, 35 mm/s. The extruded strip is subjected to a primary vulcanization in a press at a temperature of, for example, 150 c, a pressure of 20MPa and a time of 17min, followed by lamination to prepare a sealing assembly article. The sealing assembly product is then subjected to secondary vulcanization at a temperature of, for example, 260 ℃ for, for example, 18 hours, and the sealing assembly is completely prepared. The mechanical properties of the seal assembly, for example, 180 ° peel test of the test elastomer at 150 ℃, were tested, and the seal assembly exhibited internal failure of the elastomer and no delamination, indicating that the elastomer adhered to the substrate 1 well and that the elastomer was embedded in the recess 3 on the substrate 1.

Referring to FIG. 10, in one embodiment of the present invention, the substrate 1 is a metal aluminum substrate, a layer of adhesive 4 is coated on the substrate 1, and the adhesive 4 is Polydimethylsiloxane (PDMS), and the uncrosslinked elastomer pieces are placed directly on the substrate 1 by pendulum material. The sealing assembly article is prepared by lamination after a first vulcanization of the elastomeric compound at a temperature of, for example, 145 c, a pressure of, for example, 5MPa and a time of, for example, 40 min. And then the sealing assembly product is subjected to secondary vulcanization at the temperature of 200 ℃ for 10 hours, and the preparation of the sealing assembly is finished. The mechanical properties of the seal assembly, for example the 180 ° peel test at 150 ℃ of the elastomer 2, in which the elastomer 2 delaminates from the substrate 1, were tested, indicating that the adhesion between the elastomer 2 and the substrate 1 is poor for a seal assembly compounded with the adhesive 4, and is not suitable for use in demanding equipment.

Referring to fig. 10, in one embodiment of the present invention, the substrate 1 is a PTFE substrate, a layer of binder 4 is coated on the substrate 1, and the binder 4 is, for example, kellok 607(Chemlok 607), and the uncrosslinked elastomer fragments are directly placed on the substrate 1 by pendulum material. The sealing assembly article is prepared by lamination after a first vulcanization of the elastomeric compound at a temperature of, for example, 200 c, a pressure of, for example, 25MPa and a time of, for example, 3 min. And then the sealing assembly product is subjected to secondary vulcanization at the temperature of 295 ℃ for 18 hours for example, and the preparation of the sealing assembly is finished. The mechanical properties of the seal assembly, for example the 180 ° peel test at 150 ℃ of elastomer 2, in which the elastomer 3 delaminates from the substrate 1, were tested, indicating the poor adhesion between the elastomer 2 and the substrate 1 of the seal assembly compounded by the adhesive 4.

Referring to fig. 10, in an embodiment of the present invention, a metal aluminum magnesium alloy substrate is selected as the substrate 1, a layer of binder 4 is coated on the substrate 1, and the binder 4 is, for example, an epoxy resin binder, and the uncrosslinked elastomer fragments are directly placed on the substrate 1 in a material arrangement manner. The sealing assembly article is prepared by lamination after a first vulcanization of the elastomeric compound at a temperature of, for example, 160 c, a pressure of, for example, 10MPa and a time of, for example, 5 min. And then the sealing assembly product is subjected to secondary vulcanization at the temperature of 220 ℃ for 16 hours, and the preparation of the sealing assembly is finished. The mechanical properties of the seal assembly, for example, the 180 ° peel test at 150 ℃ of the elastomer 2, in which the elastomer 2 delaminates from the substrate 1, were tested, indicating that the seal assembly compounded with the adhesive 4, the adhesion between the elastomer 2 and the substrate 1 was poor and was not suitable for use in environmentally harsh sealing conditions.

Referring to fig. 10, in an embodiment of the present invention, a metal aluminum magnesium alloy substrate is selected as the substrate 1, a layer of binder 4 is coated on the substrate 1, and the binder 4 is, for example, an epoxy resin binder, and the uncrosslinked elastomer fragments are directly placed on the substrate 1 in a material arrangement manner. The sealing assembly article is prepared by lamination after a first vulcanization of the elastomeric compound at a temperature of, for example, 170 c, for example at a pressure of 15MPa, and for a time of, for example, 15 min. The sealing assembly product is then subjected to secondary vulcanization at a temperature of, for example, 260 ℃ for, for example, 18 hours, and the sealing assembly is completely prepared. The mechanical properties of the seal assembly, for example, the 180 ° peel test of the elastomer 2 at 150 ℃, were tested, and the seal assembly in which the elastomer 2 was delaminated from the substrate 1, indicating that the seal assembly was compounded with the adhesive 4, but the adhesive 4 was different in kind, but the adhesion between the elastomer 2 and the substrate 1 was not improved, and was not suitable for use in the more environmentally harsh sealing conditions.

In summary, the present invention provides a semiconductor device sealing assembly and a method for manufacturing the same, in which an elastomer and a substrate are physically bonded by a three-dimensional hollow pattern of a concave portion, so as to improve mechanical and chemical properties of the sealing assembly, and the manufacturing cost is low. When the sealing component is applied to semiconductor sealing equipment, the sealing failure caused by the delamination of the elastomer and the substrate can be avoided, so that the reliability of the semiconductor manufacturing process is improved.

The preferred embodiments of the invention disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A method of making a semiconductor device package, comprising:

providing a base material;

an elastic body is arranged in the concave part and fills and covers the concave part; and

vulcanizing the elastomer to form the semiconductor device sealing assembly.

2. The method of claim 1, wherein the recess is at least one of circular, rectangular, elliptical, polygonal, or linear.

3. The method of manufacturing a semiconductor device sealing assembly according to claim 2, wherein the depth of the recess is 0.2 to 3 mm.

4. The method of claim 1, wherein the substrate comprises a metal substrate, and the metal substrate comprises at least one of a magnesium substrate, a titanium substrate, an aluminum substrate, a copper substrate, a chromium substrate, an alloy substrate, or a stainless steel substrate.

5. The method of claim 4, wherein after the recess is formed, the metal substrate is anodized to form a porous anodic oxide on the surface of the metal substrate.

6. The method of claim 1, wherein the substrate comprises a high polymer substrate, and the high polymer substrate comprises at least one of a polyetheretherketone substrate, a polytetrafluoroethylene substrate, a polyphenylene ether substrate, a polyimide substrate, a poly 4-methylpentene substrate, a polyetherketone substrate, a polyamide substrate, or a composite substrate.

7. The method of claim 6, wherein the polymeric substrate is corona treated after the recess is formed.

8. The method of claim 6, wherein the polymer substrate has a surface roughness of 5 to 100 μm.

9. The method of manufacturing a semiconductor device sealing assembly according to claim 1, wherein the elastic body is physically bonded to the concave portion after primary vulcanization to form the semiconductor device sealing assembly.

10. A semiconductor device sealing assembly, comprising:

the substrate comprises a substrate, wherein the surface of the substrate is provided with a plurality of mutually-embedded concave parts; and

an elastomer, and the elastomer fills and covers the recess.