CN114260376B - Differential plate contact heating temperature uniformity control method - Google Patents

Differential plate contact heating temperature uniformity control method Download PDF

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Publication number
CN114260376B
CN114260376B CN202111589720.2A CN202111589720A CN114260376B CN 114260376 B CN114260376 B CN 114260376B CN 202111589720 A CN202111589720 A CN 202111589720A CN 114260376 B CN114260376 B CN 114260376B
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heating
grooves
plate
temperature uniformity
differential
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CN114260376A (en
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徐振海
杨万里
单德彬
宗影影
徐杰
徐文臣
郭斌
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Harbin Institute of Technology
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Harbin Institute of Technology
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Abstract

The invention provides a differential plate contact heating temperature uniformity control method, and belongs to the technical field of heating. The heating rate of different areas of the plate is adjusted by arranging the grooves with unequal intervals on the surface of the heating block, so that the temperature uniformity during contact heating is improved, and the cost is effectively reduced by milling the grooves and re-processing the surface to recycle the heating block; specifically, in the contact heating of the differential thick plate, the distance between grooves from the thick plate heating part to the thin plate heating part is gradually reduced, so that the temperature rising rate difference between the thin plate and the thick plate can be obviously reduced, the temperature uniformity of the heated differential thick plate is ensured, and the performances of the plate are more consistent.

Description

Differential plate contact heating temperature uniformity control method
Technical Field
The invention belongs to the technical field of heating, and particularly relates to a differential plate contact heating temperature uniformity control method.
Background
As the temperature increases, the thermal movement of atoms in the metal is enhanced, so that the deformation resistance is reduced, or the deformation resistance is reduced due to simultaneous internal phase transformation and original hard phase transformation into soft phase. Therefore, in plastic working, a metal is often heated and then shaped by applying a load to a mold, and the heating process affects the quality and efficiency of the entire hot working. The control of the heating temperature and time has a critical effect on the product performance, and simultaneously brings new problems: the longer heating time seriously affects the tact of the product. The traditional heating mode, such as radiation heating, has the advantages of long time, serious influence on production continuity, high operation cost and large occupied area. The contact heating method is a rapid heating process, can effectively solve the problem of low heating efficiency of the traditional heating furnace, and has the advantages of low cost, small occupied area, small limitation on the shape of the plate material and the like.
However, for plates with different thicknesses such as thick plates, the contact heating is difficult to uniformly distribute the temperature in a short time, the temperature rise of the thick plate part is slow, and the temperature rise of the thin plate part is fast. The performance of the plates is inconsistent, and the quality of the products is reduced.
Disclosure of Invention
The invention aims to provide a method for controlling the uniformity of contact heating temperature of a differential thick plate, which adjusts the heating rate of different areas of a plate material by arranging grooves with unequal distances on the surface of a heating block, and improves the uniformity of temperature during contact heating.
In order to achieve the aim of the invention, the invention adopts the following technical scheme:
providing a method for controlling the uniformity of contact heating temperature of a thick plate, wherein non-equidistant grooves are arranged on the surface of a heating block so as to adjust the heating rate of different areas of the plate, thereby improving the uniformity of the temperature during contact heating; the grooves are densely distributed to reduce the heating rate, and the grooves are sparsely distributed or the grooves are not arranged to increase the heating rate.
Further: the space between the grooves is 0.01-0.05 times of the length of the heating block, and the width of the grooves is 0.005-0.02 times of the length of the heating block; the depth of the groove is 2-5mm.
Further: the interval between the grooves is 10-50mm, the width of the grooves is 5-20mm, and the depth of the grooves is 2-5mm.
Further: the heating block may be milled to remove surface grooves and reset the grooves.
The beneficial effects of the invention are as follows:
1. the heating rate of different areas of the plate is adjusted by arranging the grooves with unequal distances on the surface of the heating block, so that the temperature uniformity during contact heating is improved, the surface can be milled and reset, the heating block is recycled, and the cost is effectively reduced.
2. In the contact heating of the differential thick plate, the distance between grooves from the thick plate heating part to the thin plate heating part is gradually reduced, so that the temperature rising speed difference between the thin plate and the thick plate can be obviously reduced, the temperature uniformity of the heated differential thick plate is ensured, and the performances of the plate are more consistent.
3. The invention is also suitable for the situation that one side is a thick plate with equal thickness and the other side is a thin plate with equal thickness, at the moment, the grooves of the heating blocks on the thick plate side and the heating blocks on the thin plate side are respectively arranged at equal intervals, and the groove spacing of the heating blocks on the thick plate side is larger than the groove spacing of the heating blocks on the thin plate side.
Detailed Description
The following description of the embodiments of the present invention is provided to facilitate understanding of the present invention by those skilled in the art, but it should be understood that the present invention is not limited to the scope of the embodiments, and all the inventions which make use of the inventive concept are protected by the spirit and scope of the present invention as defined and defined in the appended claims to those skilled in the art.
Example 1
A method for controlling the uniformity of contact heating temperature of a thick plate comprises two heating blocks, wherein the thick plate is placed between the two heating blocks, grooves with unequal distances are formed in the surfaces of the heating blocks, and the distance between the grooves from the heating part of the thick plate to the heating part of the thin plate is gradually reduced so as to adjust the heating rate of different areas of the plate, thereby improving the uniformity of temperature during contact heating. The grooves are densely distributed to reduce the heating rate, and the grooves are sparsely distributed or are not arranged to improve the heating rate. The contact heating method is a conventional technology, and will not be described herein.
As a preferred mode, the interval of the distribution of the grooves is 0.01-0.05 times of the length of the heating block, the width of the grooves is 0.005-0.02 times of the length of the heating block, and the depth of the grooves is 2-5mm.
Further, the surface grooves can be milled out by the heating blocks, the grooves are reset, the plates are matched in a personalized mode, and the heating blocks are recycled.
Example 2
A method for controlling the uniformity of contact heating temperature of a thick plate includes such steps as arranging non-equidistant slots on the surface of heating block, gradually decreasing the distance between slots from thick plate to thin plate, and regulating the temp. rising speed of different areas of plate. The grooves are densely distributed to reduce the heating rate, and the grooves are sparsely distributed or the grooves are not arranged to increase the heating rate.
As a preferred mode, the interval between the distribution of the grooves is 10-50mm, the width of the grooves is 5-20mm, and the depth of the grooves is 2-5mm.
Further, the surface grooves can be milled out by the heating blocks, the grooves are reset, the plates are matched in a personalized mode, and the heating blocks are recycled.
Example 3
A method for controlling the uniformity of contact heating temperature of a thick plate comprises the steps of arranging non-equidistant grooves on the surface of a heating block, arranging a thick plate with equal thickness on one side and a thin plate with equal thickness on the other side of the thick plate, arranging the grooves of the heating block on the thick plate side and the grooves of the heating block on the thin plate side at equal intervals respectively, and arranging the grooves of the heating block on the thick plate side at intervals which are larger than the grooves of the heating block on the thin plate side. The grooves are densely distributed to reduce the heating rate, and the grooves are sparsely distributed or the grooves are not arranged to increase the heating rate.
As a preferred mode, the interval of the distribution of the grooves is 0.01-0.05 times of the length of the heating block, the width of the grooves is 0.005-0.02 times of the length of the heating block, and the depth of the grooves is 2-5mm.
Further, the surface grooves can be milled out by the heating blocks, the grooves are reset, the plates are matched in a personalized mode, and the heating blocks are recycled.
Table 1 shows the results of comparison of the contact heating temperature uniformity of a heating block with or without grooves on a thick plate with a length of 90mm and a thickness of 2mm and a thin plate with a length of 90mm and a thickness of 1 mm.
According to the invention, the grooves are formed in the surface of the heating block, so that the contact area is reduced, only part of the plate is heated directly through contact heating, and the other part of the plate is heated through heat conduction in the plate at the adjacent high-temperature part. The temperature rising speed of the thin plate part is reduced so as to be synchronous with the temperature rising of the thick plate part as much as possible, and the temperature uniformity of the whole plate is further improved.
The above embodiments are only for illustrating the technical solution of the present invention and not for limiting the same; while the invention has been described in detail with reference to the preferred embodiments, those skilled in the art will appreciate that: modifications may be made to the specific embodiments of the present invention or equivalents may be substituted for part of the technical features thereof; without departing from the spirit of the invention, it is intended to cover the scope of the invention as claimed.

Claims (2)

1. A differential plate contact heating temperature uniformity control method is characterized in that: the device comprises two heating plates, wherein a differential thick plate is arranged between the two heating plates, grooves with unequal distances are arranged on the surface of the heating block, and the distance between the grooves from the thick plate heating part to the thin plate heating part is gradually reduced so as to adjust the temperature uniformity during contact heating; the grooves are densely distributed to reduce the heating rate, and the grooves are sparsely distributed or are not arranged to increase the heating rate; the plate material of the heating block is a rolling differential thickness sheet;
the distribution space of the grooves is 0.01-0.05 times of the length of the heating block, the width of the grooves is 0.005-0.02 times of the length of the heating block, and the depth of the grooves is 2-5mm.
2. The differential thickness plate contact heating temperature uniformity control method according to claim 1, characterized in that: the heating block can mill out surface grooves and reset the grooves.
CN202111589720.2A 2021-12-23 2021-12-23 Differential plate contact heating temperature uniformity control method Active CN114260376B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111589720.2A CN114260376B (en) 2021-12-23 2021-12-23 Differential plate contact heating temperature uniformity control method

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Application Number Priority Date Filing Date Title
CN202111589720.2A CN114260376B (en) 2021-12-23 2021-12-23 Differential plate contact heating temperature uniformity control method

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CN114260376B true CN114260376B (en) 2024-03-08

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017201058A (en) * 2016-04-28 2017-11-09 ウシオ電機株式会社 Heat treatment method
CN208869486U (en) * 2018-08-17 2019-05-17 深圳市创世纪机械有限公司 Thermal insulation board and glass heat bender
CN109880993A (en) * 2019-02-19 2019-06-14 中国石油大学(华东) The not device and method of equal thickness connector local post weld heat treatment temperature field regulation
CN209759293U (en) * 2019-01-25 2019-12-10 东旭科技集团有限公司 heating plate assembly and glass hot bending machine forming device
CN110708934A (en) * 2019-10-31 2020-01-17 华为技术有限公司 Temperature equalizing component and electronic equipment
CN112309917A (en) * 2020-10-29 2021-02-02 常州捷佳创精密机械有限公司 Heating assembly and silicon wafer processing equipment
CN214188628U (en) * 2020-11-30 2021-09-14 安徽光智科技有限公司 Heating plate of molding press

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017201058A (en) * 2016-04-28 2017-11-09 ウシオ電機株式会社 Heat treatment method
CN208869486U (en) * 2018-08-17 2019-05-17 深圳市创世纪机械有限公司 Thermal insulation board and glass heat bender
CN209759293U (en) * 2019-01-25 2019-12-10 东旭科技集团有限公司 heating plate assembly and glass hot bending machine forming device
CN109880993A (en) * 2019-02-19 2019-06-14 中国石油大学(华东) The not device and method of equal thickness connector local post weld heat treatment temperature field regulation
CN110708934A (en) * 2019-10-31 2020-01-17 华为技术有限公司 Temperature equalizing component and electronic equipment
CN112309917A (en) * 2020-10-29 2021-02-02 常州捷佳创精密机械有限公司 Heating assembly and silicon wafer processing equipment
CN214188628U (en) * 2020-11-30 2021-09-14 安徽光智科技有限公司 Heating plate of molding press

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