CN114260229A

CN114260229A - High-pressure stripping device of degumming stripping machine

Info

Publication number: CN114260229A
Application number: CN202111487748.5A
Authority: CN
Inventors: 蒋磊; 刘毅; 黄鹏飞
Original assignee: Jiangsu Jinyuda Semiconductor Co ltd
Current assignee: Jiangsu Jinyuda Semiconductor Co ltd
Priority date: 2022-02-24
Filing date: 2022-02-24
Publication date: 2022-04-01

Abstract

The invention discloses a high-pressure stripping device of a degumming stripping machine, which comprises an outer cavity, a cleaning cavity and a wafer clamping seat, wherein the cleaning cavity comprises an outer fixed ring, an inner fixed ring and a movable cover shell, the movable cover shell is arranged on the outer cavity in a lifting way and is positioned between the outer fixed ring and the inner fixed ring, a first lifting swing arm and a second lifting swing arm are arranged in the outer cavity, the tail ends of the first lifting swing arm and the second lifting swing arm are respectively provided with a normal-pressure nozzle and a high-pressure nozzle, the cleaning cavity is also provided with a lower nozzle, the normal-pressure nozzle and the high-pressure nozzle are respectively communicated with a stripping liquid supply system, the bottom of outer cavity is provided with outer leakage fluid dram, middle leakage fluid dram and interior drainage mouth, and outer leakage fluid dram, middle leakage fluid dram and interior drainage mouth all communicate with waste liquid collecting system pipeline, still are provided with extraction opening and feed inlet on the outer cavity, and the extraction opening is linked together with air exhaust system. The high-pressure stripping device can better strip photoresist, reduce consumption of stripping liquid and reduce splashing of the stripping liquid.

Description

High-pressure stripping device of degumming stripping machine

Technical Field

The invention relates to a high-pressure stripping device which is used for stripping photoresist and stripping metal from the surface of a wafer in a photoresist stripping machine.

Background

In the field of semiconductor technology, a metal layer needs to be generated on the surface of a wafer, and the current common practice is to generate a layer of photoresist on the wafer, then etch the photoresist to form a line groove, then form a metal layer on the surface of the photoresist and the line groove of the wafer through a metal ion evaporation company, finally remove the useless photoresist and the metal layer through a photoresist removing and stripping process, and retain the metal in the line groove. The structure of the prior stripping device is that a wafer is arranged on a rotary wafer clamping seat, the wafer clamping seat is positioned in a cleaning cavity, and then stripping liquid is sprayed on the surface of the wafer through a deflected spray head, but the prior stripping device has the following defects that 1, a large amount of stripping liquid is needed in the prior spraying process, the waste of the stripping liquid is easily caused, and the efficiency of photoresist stripping is slow; 2. in the existing spraying process, stripping liquid can be sputtered to various places of a cleaning cavity, so that other parts inside the cleaning cavity are corroded; 3. the current wafer stripping may need to be washed on the back surface, but the current angle of the nozzle on the back surface cannot be adjusted, so that the stripping effect on the back surface is not ideal.

Disclosure of Invention

The technical problem to be solved by the invention is as follows: the high-pressure stripping device of the stripping machine can better strip the photoresist, reduce the consumption of stripping liquid and reduce the splashing of the stripping liquid.

In order to solve the technical problems, the technical scheme of the invention is as follows: a high-pressure stripping device of a degumming stripping machine comprises an outer cavity, wherein a cleaning cavity is arranged in the outer cavity, a wafer clamping seat for clamping a wafer is rotatably arranged in the cleaning cavity and driven by a rotary power device, the cleaning cavity comprises an outer fixed ring, an inner fixed ring and a movable cover shell, the wafer clamping seat is positioned in the inner fixed ring, the outer fixed ring and the inner fixed ring are fixed at the bottom of the outer cavity, the movable cover shell is arranged on the outer cavity in a lifting way and is positioned between the outer fixed ring and the inner fixed ring, a spraying window is arranged at the upper end of the movable cover shell, the movable cover shell is driven by a first lifting power device, when the movable cover shell is positioned at a lower dead point, the wafer clamping seat is exposed out of the spraying window, a first lifting swing arm and a second lifting swing arm are arranged outside the cleaning cavity in the outer cavity, and the tail ends of the first lifting swing arm and the second lifting swing arm are respectively provided with a normal-pressure nozzle and a high-pressure nozzle, the cleaning cavity is further provided with a lower nozzle for spraying the bottom surface of the wafer, the lower nozzle, the normal-pressure nozzle and the high-pressure nozzle are respectively communicated with a stripping liquid supply system, an outer liquid discharge port is formed in the outer side, located in the cleaning cavity, of the bottom of the outer cavity, a middle liquid discharge port is formed between the outer fixing ring and the inner fixing ring, an inner liquid discharge port is formed in the inner fixing ring, located in the bottom of the outer cavity, the outer liquid discharge port, the middle liquid discharge port and the inner liquid discharge port are all communicated with a waste liquid collecting system pipeline, an air suction port and a feed port are further formed in the outer cavity, a feed port plugging device is installed at the feed port, and the air suction port is communicated with an air suction system.

As a preferred scheme, the movable housing comprises a housing body, the spraying window is arranged in the middle of the upper end of the housing body, the housing body is mounted on the outer cavity through a lifting structure, an annular caulking groove is formed in the lower end of the housing body, the inner fixing ring is located in the annular caulking groove, the movable housing is reasonable in structure, the inner fixing ring can be further protected through the annular caulking groove, two protective barriers are formed, and stripping liquid is further prevented from splashing out of the cleaning cavity.

As a preferred scheme, the lifting structure comprises a plurality of lifting connecting rods, the upper ends of the lifting connecting rods extend into the annular caulking groove and are fixed with the housing body, the lower ends of the lifting connecting rods penetrate through the bottom of the inner fixing ring and the bottom of the outer cavity in a sliding mode, the lower ends of the lifting connecting rods are connected with the first lifting power device, the lifting structure is convenient to install, and the inner space is saved.

As a preferable scheme, an outer cover shell is further arranged outside the cover shell body, an annular space is formed between the outer cover shell and the cover shell body, the lower end of the outer cover shell is located between the outer fixing ring and the inner fixing ring, and the lower end of the outer cover shell is lower than the lower end of the cover shell body, so that the protection capability can be further improved by using the outer cover shell.

As a preferred scheme, the quantity of middle leakage fluid dram and interior leakage fluid dram is a plurality of and becomes the circumference and arranges, be provided with respectively on the bottom of outer cavity with middle leakage fluid dram and interior leakage fluid dram position corresponding middle annular and interior annular, utilize middle annular and interior annular to collect stripping liquid like this, conveniently discharge from middle leakage fluid dram and interior leakage fluid dram.

As a preferable scheme, the stripping liquid supply system comprises a new liquid storage tank and a recovery liquid storage tank, the new liquid storage tank is communicated with the high-pressure nozzle through the new liquid supply system, and the recovery liquid storage tank is communicated with the lower nozzle and the normal-pressure nozzle through the recovery liquid supply system; the waste liquid collecting system is communicated with the recovery liquid storage tank through the recovery liquid supplementing pipeline, the recovery liquid supplementing pipeline is provided with the filter, therefore, the recovery liquid can be adopted for spraying when the recovery liquid supplementing pipeline is used for spraying at first, most of the photoresist is removed after the photoresist is sprayed for a period of time, the metal lines on the surface of the wafer are partially exposed or completely exposed, and the photoresist is sprayed and removed by high-pressure new liquid, so that the good photoresist removing and stripping effects are guaranteed, and the consumption of stripping liquid is reduced.

As a preferred scheme, the wafer cassette comprises an installation base which is detachably fixed at the bottom of an outer cavity and is positioned in an inner fixing ring, a cassette body is rotatably installed on the installation base, a clamping jaw disc which is convenient for positioning a wafer is arranged on the cassette body, the rotary power device is fixed below the outer cavity, a power end of the rotary power device is fixed with the cassette body, a lower nozzle is installed on the installation base through an angle adjusting mechanism, and the center of the spraying window is concentric with the center of the clamping jaw disc.

As a preferred scheme, angle adjustment mechanism is including being fixed in the fixed bolster that just the slope set up on the installation base, set up the regulation strip hole of slope on the fixed bolster, have a radial branch direction in the extending direction in the regulation strip hole, install locking bolt in the regulation strip hole, locking bolt is connected with the regulation support, down the nozzle is fixed in on the regulation support, just can change the regulation support angle through loosening locking bolt to the regulation support can slide in the within range in regulation strip hole, thereby not only change the angle of nozzle down, can change the position of spraying moreover, thereby change injection pressure, the effect of cleaing away at the wafer back is also better like this.

After the technical scheme is adopted, the invention has the effects that: because the high-pressure stripping device comprises an outer cavity, a cleaning cavity is arranged in the outer cavity, a wafer clamping seat for clamping a wafer is rotatably arranged in the cleaning cavity, the wafer clamping seat is driven by a rotary power device, the cleaning cavity comprises an outer fixed ring, an inner fixed ring and a movable cover shell, the wafer clamping seat is positioned in the inner fixed ring, the outer fixed ring and the inner fixed ring are fixed at the bottom of the outer cavity, the movable cover shell is arranged on the outer cavity in a lifting way and positioned between the outer fixed ring and the inner fixed ring, a spraying window is arranged at the upper end of the movable cover shell, the movable cover shell is driven by a first lifting power device, when the movable cover shell is positioned at a lower dead point, the wafer clamping seat is exposed from the spraying window, a first lifting swing arm and a second lifting swing arm are arranged at the outer side of the cleaning cavity in the outer cavity, and the tail ends of the first lifting swing arm and the second lifting swing arm are respectively provided with a normal pressure nozzle and a high pressure nozzle, the cleaning cavity is also provided with a lower nozzle for spraying the bottom surface of the wafer, the lower nozzle, the normal-pressure nozzle and the high-pressure nozzle are respectively communicated with a stripping liquid supply system, the bottom of the outer cavity body, which is positioned at the outer side of the cleaning cavity, is provided with an outer liquid discharge port, the bottom of the outer cavity body, which is positioned between the outer fixing ring and the inner fixing ring, is provided with a middle liquid discharge port, the bottom of the outer cavity body, which is positioned at the inner fixing ring, is provided with an inner liquid discharge port, the outer liquid discharge port, the middle liquid discharge port and the inner liquid discharge port are all communicated with a waste liquid collecting system pipeline, the outer cavity body is also provided with an air suction port and a feed port, the feed port is provided with a feed port plugging device, and the air suction port is communicated with an air suction system, so that when the cleaning cavity works, the movable housing is driven to descend by the first lifting power device, the wafer clamping seat is exposed at the moment, and then a manipulator can conveniently put the wafer from the feed port, after the wafer is placed, the movable cover shell rises to surround the whole wafer cassette and the wafer, then the first lifting swing arm and the second lifting swing arm drive the normal pressure nozzle and the high pressure nozzle to deflect above the wafer and then descend, the normal pressure nozzle sprays the surface of the wafer at normal pressure, meanwhile, the lower nozzle sprays stripping liquid, as the stripping liquid is continuously contacted with the surface of the wafer, the stripping liquid can take out photoresist and a metal layer attached to the photoresist, after the photoresist on the surface of the wafer is sprayed for a period of time at normal pressure, the photoresist on the surface of the wafer is either fallen off or loosened, then the high pressure nozzle sprays the surface of the wafer at high pressure, the high pressure described in the point is not an absolute value, the spraying pressure is improved on the basis of the bearing range of the pressure of the wafer, and under the condition that the spraying pressure is higher, the stripping liquid can wash the loosened photoresist and the metal layer on the surface of the wafer, thereby the effect that strips is glued to the going is better more thorough, at the whole in-process that sprays, the movable housing arc protects the liquid that strips who sputters, make the liquid that strips as far as be in the washing intracavity, and do not sputter the outside, whole process is under a relative confined environment simultaneously, air exhaust system can continuously bleed, thereby the convenient unified processing of smell discharge that will strip the liquid and give off, this high pressure stripping device has carried out better protection spraying the in-process, utilize the ordinary pressure to spray simultaneously and spray alternate use with the high pressure and can reduce the spray time, improve the stripping effect that strips that glues, reduce the consumption of the liquid that strips.

Drawings

The invention is further illustrated with reference to the following figures and examples.

FIG. 1 is a perspective view of an embodiment of the present invention;

FIG. 2 is a perspective view of an embodiment of the present invention with the upper cover of the outer chamber hidden;

FIG. 3 is a top view of the upper cover of the outer chamber body hidden;

FIG. 4 is a cross-sectional view of FIG. 3 at A-A;

FIG. 5 is a perspective cross-sectional view;

FIG. 6 is a schematic view of a stripping liquid supply system;

in the drawings: 1. an outer cavity; 101. a feed inlet; 102. an upper cover; 103. an air extraction opening; 104. a middle ring groove; 105. an inner ring groove; 2. a cleaning chamber; 201. a housing body; 202. spraying a window; 203. an annular caulking groove; 204. an outer casing; 205. an outer retainer ring; 206. an inner fixed ring; 3. a wafer cassette; 301. installing a base; 302. a rotary power device; 303. a card seat body; 4. a second lifting swing arm; 5. a first lifting swing arm; 6. a feed inlet plugging device; 601. a plugging plate; 602. plugging the air cylinder; 7. an outer drain port; 8. an angle adjusting mechanism; 801. fixing a bracket; 802. adjusting the bracket; 803. adjusting the bar holes; 9. a lifting connecting rod; 10. a first lifting power device; 11. a middle liquid discharge port; 12. an inner drainage port; 13. a filter; 14. a recycle solution replenishing pipeline; 15. a recovered liquid storage tank; 16. a new liquid storage tank; 17. a recycle liquid supply system; 18. and a fresh liquid supply system.

Detailed Description

The present invention is described in further detail below with reference to specific examples.

As shown in fig. 1 to 6, a high-pressure stripping device of a stripper comprises an outer cavity 1, wherein the outer cavity 1 comprises an outer cavity 1 main body and an upper cover 102 hinged above the outer cavity 1 main body, a cleaning cavity 2 is installed in the outer cavity 1, a wafer cassette 3 for clamping a wafer is rotatably installed in the cleaning cavity 2, and the wafer cassette 3 is driven by a rotary power device 302.

The cleaning cavity 2 comprises an outer fixed ring 205, an inner fixed ring 206 and a movable cover, the wafer cassette 3 is positioned in the inner fixed ring 206, the outer fixed ring 205 and the inner fixed ring 206 are fixed at the bottom of the outer cavity 1, the movable cover is installed on the outer cavity 1 in a lifting way and is positioned between the outer fixed ring 205 and the inner fixed ring 206, the upper end of the movable cover is provided with a spraying window 202, the movable cover is driven by a first lifting power device 10, when the movable cover is positioned at a lower dead point, the wafer cassette 3 is exposed from the spraying window 202,

the outer cavity 1 is internally provided with a first lifting swing arm 5 and a second lifting swing arm 4 outside the cleaning cavity 2, the tail ends of the first lifting swing arm 5 and the second lifting swing arm 4 are respectively provided with a normal pressure nozzle and a high pressure nozzle, the structures of the first lifting swing arm 5 and the second lifting swing arm 4 adopt the conventional structures, the deflection mode adopts a deflection motor to realize driving, and the lifting action adopts a second lifting power device to drive. In this embodiment, the first lifting power device 10 and the second lifting power device are driven by cylinders.

The cleaning cavity 2 is further provided with a lower nozzle for spraying the bottom surface of the wafer, the lower nozzle, the normal-pressure nozzle and the high-pressure nozzle are respectively communicated with a stripping liquid supply system, an outer liquid discharge port 7 is arranged at the outer side of the bottom of the outer cavity 1, which is positioned in the cleaning cavity 2, the bottom of the outer cavity 1 is positioned between the outer fixing ring 205 and the inner fixing ring 206 and is provided with a middle liquid discharge port 11, an inner liquid discharge port 12 is arranged at the bottom of the outer cavity 1, which is positioned in the inner fixing ring 206 and is communicated with a waste liquid collection system pipeline, the outer liquid discharge port 7, the middle liquid discharge port 11 and the inner liquid discharge port 12 are all communicated with a waste liquid collection system pipeline, the outer cavity 1 is further provided with an air suction port 103 and a feed port 101, the feed port 101 is provided with a feed port plugging device 6, and the air suction port 103 is communicated with an air exhaust system. The inlet plugging device 6 comprises a plugging plate 601, and the plugging plate 601 is slidably mounted at the inlet 101 and driven by a plugging cylinder 602. The air exhaust system is generally an air exhaust system which is arranged in a semiconductor production workshop.

As shown in fig. 4 and 5, the wafer cassette 3 includes a mounting base 301 detachably fixed at the bottom of the outer cavity 1 and located in the inner fixing ring 206, a cassette body 303 is rotatably mounted on the mounting base 301, wherein the cassette body 303 is of a conventional structure at present, a jaw disc convenient for positioning a wafer is disposed on the cassette body 303, the jaw disc is composed of a plurality of support pillars, each support pillar has a support step, a wafer is placed on the support step and positioned by the support pillar, the wafer is driven to rotate when rotating, the rotary power device 302 is fixed below the outer cavity 1, a power end of the rotary power device 302 is fixed with the cassette body 303, the lower nozzle is mounted on the mounting base 301 through an angle adjusting mechanism 8, a center of the spray window 202 is concentric with a center of the jaw disc, the rotary power device 302 is a driving motor, and an output shaft of the driving motor is connected with the card seat body 303 to drive the card seat body to rotate.

Wherein, angle adjustment mechanism 8 is including being fixed in the fixed bolster 801 that just the slope set up on installation base 301, set up the regulation strip hole 803 of slope on the fixed bolster 801, have a radial branch direction in the extending direction of regulation strip hole 803, install locking bolt in the regulation strip hole 803, locking bolt is connected with regulation support 802, down the nozzle is fixed in on the regulation support 802, just can change regulation support 802 angle through loosening locking bolt to regulation support 802 can slide in the within range of regulation strip hole 803, thereby not only change the angle of nozzle down, can change the position of spraying moreover, thereby change injection pressure, the effect of cleaing away at the wafer back is also better like this.

As shown in fig. 4 and 5, the movable housing comprises a housing body 201, the spray window 202 is disposed in the middle of the upper end of the housing body 201, the housing body 201 is mounted on the outer cavity 1 through a lifting structure, the lower end of the housing body 201 is provided with an annular caulking groove 203, the inner fixing ring 206 is disposed in the annular caulking groove 203, the movable housing has a reasonable structure, the inner fixing ring 206 can be further protected by the annular caulking groove 203, the lifting structure comprises a plurality of lifting connecting rods 9, the upper ends of the lifting connecting rods 9 extend into the annular caulking groove 203 and are fixed to each other, a connecting ring is bonded in the annular caulking groove 203 and fixed to the lifting connecting rods 9, so as to complete the fixation with the movable housing, the lower ends of the lifting connecting rods 9 slidably penetrate through the inner fixing ring 206 and the bottom of the outer cavity 1, and the lower ends of the lifting connecting rods 9 are connected to the first lifting power device 10, the lifting structure is convenient to install, and the internal space is saved.

Of course, in this embodiment, in order to better protect the stripping liquid, the outer casing 204 is further disposed outside the casing body 201, an annular space is formed between the outer casing 204 and the casing body 201, the lower end of the outer casing 204 is located between the outer fixing ring 205 and the inner fixing ring 206, and the lower end of the outer casing 204 is lower than the lower end of the casing body 201, so that the protection capability can be further improved by using the outer casing 204.

In this embodiment, the quantity of middle leakage fluid dram 11 and interior leakage fluid dram 12 is a plurality of and becomes the circumference and arranges, and the quantity of outer leakage fluid dram 7 is two, be provided with respectively on the bottom of outer cavity 1 with middle leakage fluid dram 11 and interior leakage fluid dram 12 position corresponding middle annular groove 104 and interior annular groove 105, utilize middle annular groove 104 and interior annular groove 105 to collect stripping liquid like this, discharge in convenient follow middle leakage fluid dram 11 and interior leakage fluid dram 12.

As shown in fig. 6, the stripping liquid supply system includes a new liquid storage tank 16 and a recovery liquid storage tank 15, the new liquid storage tank 16 is communicated with the high-pressure nozzle through a new liquid supply system 18, and the recovery liquid storage tank 15 is communicated with the lower nozzle and the normal-pressure nozzle through a recovery liquid supply system 17; the waste liquid collecting system is communicated with a recovery liquid storage tank 15 through a recovery liquid supplementing pipeline 14, a filter 13 is arranged on the recovery liquid supplementing pipeline 14, so that recovery liquid can be adopted for spraying when spraying under normal pressure, the concentration of the recovered stripping liquid is relatively low, solid particles are removed after filtering through the filter 13, after the spraying is carried out for a period of time, most of photoresist is removed at the moment, metal lines on the surface of a wafer are partially exposed or completely exposed, and high-pressure new liquid is reused for spraying and stripping at the moment, so that the consumption of the stripping liquid is reduced while the good stripping effect is ensured.

The gas circuit system, the motor and other execution devices mentioned in the embodiment are the conventional technologies at present, the specific structures and principles of the cylinder, the motor and other transmission mechanisms and other designs are disclosed in detail in the fifth edition of the mechanical design manual printed for twenty-eight times in beijing fifth edition in 4 months in 2008, and belong to the prior art, the structure of the gas circuit system is clear, a vacuum element, a gas circuit and program control are disclosed in detail in the 3 rd edition SMC teaching material of the modern practical pneumatic technology published by the mechanical industry publisher in 08 months and 01 days in 2008, so that the gas circuit structure in the embodiment is also the prior art, and it is clear that the control and the travel switch of the motor are also described in detail in the book of motor drive and speed regulation published by the chemical industry publisher in 07 months and 01 days in 2015, and therefore, the connection of the circuit and the gas circuit is clear. The above-mentioned embodiments are merely descriptions of the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention, and various modifications and alterations made to the technical solution of the present invention without departing from the spirit of the present invention are intended to fall within the scope of the present invention defined by the claims.

Claims

1. The utility model provides a high pressure stripping off device of machine is peeled off to degumming, includes outer cavity, install the washing chamber in the outer cavity, it installs the wafer cassette that clamps the wafer to wash the intracavity rotation, the wafer cassette is driven by rotary power device, its characterized in that: the cleaning cavity comprises an outer fixed ring, an inner fixed ring and a movable cover shell, the wafer clamping seat is positioned in the inner fixed ring, the outer fixed ring and the inner fixed ring are fixed at the bottom of the outer cavity, the movable cover shell is arranged on the outer cavity in a lifting way and is positioned between the outer fixed ring and the inner fixed ring, the upper end of the movable cover shell is provided with a spraying window, the movable cover shell is driven by a first lifting power device, when the movable cover shell is positioned at a lower dead point, the wafer clamping seat is exposed out of the spraying window, the outer side of the cleaning cavity in the outer cavity is provided with a first lifting swing arm and a second lifting swing arm, the tail ends of the first lifting swing arm and the second lifting swing arm are respectively provided with a normal pressure nozzle and a high pressure nozzle, the cleaning cavity is also provided with a lower nozzle for spraying the bottom surface of the wafer, and the lower nozzle, the normal pressure nozzle and the high pressure nozzle are respectively communicated with a stripping liquid supply system, the bottom of outer cavity is in the outside of wasing the chamber and is provided with outer leakage fluid dram, the bottom of outer cavity is in and is provided with middle leakage fluid dram between outer retainer plate and the interior retainer plate, and the bottom of outer cavity is in and is provided with interior drainage mouth in the interior retainer plate, outer leakage fluid dram, middle leakage fluid dram and interior drainage mouth all communicate with waste liquid collecting system pipeline, still be provided with extraction opening and feed inlet on the outer cavity, feed inlet department installs feed inlet plugging device, the extraction opening is linked together with air exhaust system.

2. The high-pressure stripping apparatus of a stripper as defined in claim 1, further comprising: the movable housing comprises a housing body, the spraying window is arranged in the middle of the upper end of the housing body, the housing body is installed on the outer cavity through a lifting structure, an annular caulking groove is formed in the lower end of the housing body, and the inner fixing ring is located in the annular caulking groove.

3. The high-pressure peeling apparatus of a stripper as defined in claim 2, wherein: the lifting structure comprises a plurality of lifting connecting rods, the upper ends of the lifting connecting rods extend into the annular caulking grooves and are fixed with the housing body, the lower ends of the lifting connecting rods slide and penetrate through the bottoms of the inner fixing ring and the outer cavity body, and the lower ends of the lifting connecting rods are connected with the first lifting power device.

4. A high-pressure peeling apparatus of a stripper as defined in claim 3, wherein: the outer cover shell is arranged outside the cover shell body, an annular space is formed between the outer cover shell and the cover shell body, the lower end of the outer cover shell is located between the outer fixing ring and the inner fixing ring, and the lower end of the outer cover shell is lower than the lower end of the cover shell body.

5. The high-pressure peeling apparatus of a stripper as defined in claim 4, wherein: the quantity of middle leakage fluid dram and interior leakage fluid dram is a plurality of and becomes the circumference and arranges, be provided with respectively on the bottom of outer cavity with middle leakage fluid dram and interior leakage fluid dram position corresponding middle annular and interior ring groove.

6. The high-pressure peeling apparatus of a stripper as defined in claim 5, wherein: the stripping liquid supply system comprises a new liquid storage tank and a recovery liquid storage tank, the new liquid storage tank is communicated with the high-pressure nozzle through the new liquid supply system, and the recovery liquid storage tank is communicated with the lower nozzle and the normal-pressure nozzle through the recovery liquid supply system; the waste liquid collecting system is communicated with the recovery liquid storage tank through a recovery liquid supplementing pipeline, and a filter is arranged on the recovery liquid supplementing pipeline.

7. The high-pressure peeling apparatus of a stripper as defined in claim 6, wherein: the wafer clamping seat comprises an installation base which is detachably fixed at the bottom of an outer cavity and is positioned in an inner fixing ring, a clamping seat body is rotatably installed on the installation base, a clamping jaw disc which is convenient for positioning a wafer is arranged on the clamping seat body, a rotary power device is fixed below the outer cavity, the power end of the rotary power device is fixed to the clamping seat body, a lower nozzle is installed on the installation base through an angle adjusting mechanism, and the center of a spraying window is concentric with the center of the clamping jaw disc.

8. The high-pressure peeling apparatus of a stripper as defined in claim 7, wherein: the angle adjusting mechanism is including being fixed in the fixed bolster that just the slope set up on the installation base, set up the regulation strip hole of slope on the fixed bolster, it radially divides the direction to have one in the extending direction in regulation strip hole, adjust the downthehole locking bolt that installs of strip, locking bolt is connected with the regulation support, the nozzle is fixed in down on the regulation support.