CN114257308B - Packaging structure of optical module and optical adjustment method - Google Patents
Packaging structure of optical module and optical adjustment method Download PDFInfo
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- CN114257308B CN114257308B CN202210003207.9A CN202210003207A CN114257308B CN 114257308 B CN114257308 B CN 114257308B CN 202210003207 A CN202210003207 A CN 202210003207A CN 114257308 B CN114257308 B CN 114257308B
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/40—Transceivers
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04J—MULTIPLEX COMMUNICATION
- H04J14/00—Optical multiplex systems
- H04J14/02—Wavelength-division multiplex systems
- H04J14/0227—Operation, administration, maintenance or provisioning [OAMP] of WDM networks, e.g. media access, routing or wavelength allocation
- H04J14/0254—Optical medium access
- H04J14/0272—Transmission of OAMP information
Abstract
The embodiment of the application discloses a packaging structure and a light adjusting method of an optical module, wherein the packaging structure comprises the following components: the device comprises a modulation laser, a driving unit and a temperature control unit; the modulating laser is respectively connected with the driving unit and the temperature control unit; the modulation laser comprises at least one modulation unit and a temperature control component; the driving unit is used for obtaining a first electric signal and driving the first modulation unit to work based on the first electric signal; the first modulation unit is any modulation unit in the at least one modulation unit; the temperature control unit is used for controlling a first current parameter of the temperature control component; the first current parameter is used for adjusting the working temperature of the first modulation unit so that the first modulation unit outputs light with different wavelengths.
Description
Technical Field
The present application relates to the field of optoelectronic technologies, and in particular, to a packaging structure of an optical module and an optical adjustment method.
Background
With the continuous expansion of wireless communication technologies, conventional bearer networks have failed to meet the technical requirements, and 5G networks gradually start to replace 4G networks. In a 5G dense wavelength division multiplexing system, optical signals with different wavelengths are required, and a plurality of optical modules are often adopted as light sources at present, so that not only is the management of modules inside the system complicated, but also the problems of low utilization rate of module resources, high network construction cost and the like are caused.
Disclosure of Invention
The embodiment of the application provides a packaging structure of an optical module and an optical adjusting method.
The technical scheme of the application is realized as follows:
a first aspect of an embodiment of the present application provides a package structure of an optical module, where the package structure includes: the device comprises a modulation laser, a driving unit and a temperature control unit; the modulating laser is respectively connected with the driving unit and the temperature control unit; the modulation laser comprises at least one modulation unit and a temperature control component;
the driving unit is used for obtaining a first electric signal and driving the first modulation unit to work based on the first electric signal; the first modulation unit is any modulation unit in the at least one modulation unit;
the temperature control unit is used for controlling a first current parameter of the temperature control component; the first current parameter is used for adjusting the working temperature of the first modulation unit so that the first modulation unit outputs light with different wavelengths.
Optionally, the driving unit is further configured to obtain a second electrical signal, and drive the first modulating unit to stop and the second modulating unit to operate based on the second electrical signal; the second modulation unit is any modulation unit except the first modulation unit in the at least one modulation unit;
the temperature control unit is also used for controlling a second current parameter of the temperature control component; the second current parameter is used for adjusting the working temperature of the second modulation unit so that the second modulation unit outputs light with different wavelengths.
Optionally, the modulated laser further includes a first monitoring component, where the first monitoring component is connected to the first modulating unit and the second modulating unit respectively;
the first monitoring component is used for monitoring the optical power corresponding to the light with different wavelengths output by the first modulation unit or the second modulation unit.
Optionally, the modulated laser further includes a second monitoring component, where the second monitoring component is connected to the first modulating unit and the second modulating unit respectively;
the second monitoring component is used for monitoring the working temperature of the first modulation unit or the second modulation unit.
Optionally, the packaging structure further comprises a controller, and the controller is connected with the temperature control unit;
the controller is used for sending a first control instruction to the temperature control unit; the control instruction is used for controlling the voltage value of the pins of the temperature control unit so as to realize the control of the heating and refrigerating currents output by the temperature control unit.
Optionally, the package structure further includes: an interface unit; the interface unit is connected with the driving unit;
the interface unit is used for transmitting the input high-speed electric signals to the driving unit;
the driving unit is further configured to obtain the first electrical signal or the second electrical signal based on the high-speed electrical signal, amplify the first electrical signal, and send the amplified first electrical signal to the first modulation unit or amplify the second electrical signal and send the amplified second electrical signal to the second modulation unit.
Optionally, the modulated laser is configured to convert the amplified first electrical signal or the second electrical signal into an output optical signal.
Optionally, the packaging structure further comprises a high-voltage device, and the controller is connected with the high-voltage device;
the controller is also used for sending a second control instruction to the high-voltage device; the second control instruction is used for controlling the voltage value of the pin of the high-voltage device so as to control the output reverse bias voltage of the high-voltage device.
Optionally, the packaging structure further comprises a detection unit; the detection unit is respectively connected with the driving unit and the high-voltage device;
the detection unit is used for receiving an input optical signal, converting the input optical signal into a third electric signal, and sending the third electric signal to the high-voltage device through the driving unit so as to amplify the third electric signal.
Optionally, the detection unit includes an avalanche photodiode, and the avalanche photodiode is connected to the high-voltage device and is used for amplifying the third electric signal.
The second aspect of the embodiment of the application provides a light adjusting method, which is applied to a packaging structure of a light module; comprising the following steps:
obtaining an electric signal, and driving a first modulation unit to work based on the electric signal;
controlling current parameters of a temperature control component, and adjusting the working temperature of the first modulation unit based on the current parameters so as to output light with different wavelengths; the temperature control assembly is connected with the first modulation unit, and the first modulation unit is any one of at least one modulation unit.
According to the packaging structure and the light adjusting method of the light module, the first electric signal is obtained through the driving device, any one of the plurality of modulation units in the modulation laser is driven to work based on the first electric signal, and the first current parameter of the temperature control component in the modulation laser is controlled through the temperature control unit, so that the working temperature of the modulation unit is adjusted, different light with different wavelengths can be output by different modulation units at different working temperatures, the packaging structure of the light module is simplified, the resource utilization rate of the module is improved, and the network construction cost is reduced.
Drawings
Fig. 1 is a schematic structural diagram of a package structure of an optical module according to an embodiment of the present application;
fig. 2 is a schematic structural diagram of a modulated laser according to an embodiment of the present application;
fig. 3 is a schematic structural diagram of a package structure of an optical module according to an embodiment of the present application;
fig. 4 is a schematic structural diagram III of a package structure of an optical module according to an embodiment of the present application;
fig. 5 is a schematic flow chart of a light adjustment method according to an embodiment of the present application.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
Furthermore, the drawings are merely schematic illustrations of the present application and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and thus a repetitive description thereof will be omitted. Some of the block diagrams shown in the figures are functional entities and do not necessarily correspond to physically or logically separate entities. These functional entities may be implemented in software or in one or more hardware modules or integrated circuits or in different networks and/or processor devices and/or microcontroller devices.
The flow diagrams depicted in the figures are exemplary only and not necessarily all steps are included. For example, some steps may be decomposed, and some steps may be combined or partially combined, so that the order of actual execution may be changed according to actual situations.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. As used herein, the term "and/or" includes any and all combinations of the associated listed items.
Referring to fig. 1, fig. 1 is a schematic structural diagram of an optical module package structure provided in an embodiment of the present application, where the optical module package structure provided in the embodiment of the present application includes: a modulation laser 110, a driving unit 120, and a temperature control unit 130;
the modulation laser 110 is respectively connected with the driving unit 120 and the temperature control unit 130; the modulated laser 110 comprises at least one modulation unit 111 and a temperature control assembly 112;
a driving unit 120, configured to obtain a first electrical signal, and drive the first modulation unit to operate based on the first electrical signal; the first modulation unit is any one of the at least one modulation unit 111;
a temperature control unit 130 for controlling a first current parameter of the temperature control component 112; the first current parameter is used for adjusting the working temperature of the first modulation unit so that the first modulation unit outputs light with different wavelengths.
Modulating laser 110 may effect the conversion of an electrical signal into an optical signal. In this embodiment, the modulated laser 110 may include a plurality of modulation units, and each modulation unit may have a different modulation depth, that is, for the same electrical signal, optical signals having different wavelengths may be output through different modulation units.
The driving unit 120 is selectively connected to a plurality of modulation units within the modulated laser 110. The modulation unit is an electro-absorption modulation laser chip, when the first electrical signal indicates that the first modulation unit works, the driving unit 120 is conducted with the first modulation unit, and the driving unit 120 injects current into the first modulation unit, so that the first modulation unit starts to work to convert the electrical signal to be converted into a corresponding optical signal.
The temperature control unit 130 may control the first current parameter of the temperature control component 112, so as to adjust the working temperature of the first modulation unit, and further may output optical signals with different wavelengths. For example, when the first modulation unit is operated, the operating temperature of the first modulation unit is made T1 by the temperature control unit 130, and at this time, an optical signal having a wavelength of λ1 may be output; the optical signal to be converted is kept unchanged, and the temperature of the first modulation unit is set to T2 by the temperature control unit 130, at this time, the optical signal with the wavelength of λ2 may be output.
According to the embodiment of the application, the first electric signal is obtained through the driving device, any one of the plurality of modulation units in the modulation laser is driven to work based on the first electric signal, and the temperature control unit is used for controlling the first current parameter of the temperature control component in the modulation laser, so that the working temperature of the modulation unit is regulated, different modulation units can output light with different wavelengths at different working temperatures, the packaging structure of the optical module is simplified, the utilization rate of module resources is improved, and the network construction cost is reduced.
In some embodiments, referring to fig. 1 and fig. 2, fig. 2 is a schematic structural diagram of a modulated laser according to an embodiment of the present application.
The driving unit 120 is further configured to obtain a second electrical signal, and drive the first modulating unit 1110 to stop and the second modulating unit 1111 to operate based on the second electrical signal; the second modulation unit 1111 is any modulation unit other than the first modulation unit 1110 among the at least one modulation unit;
the temperature control unit 130 is further configured to control a second current parameter of the temperature control component 112; the second current parameter is used to adjust the operating temperature of the second modulation unit 1111 such that the second modulation unit 1111 outputs light of a different wavelength.
In the present embodiment, the modulated laser 110 includes a first modulation unit 1110 and a second modulation unit 1111 that differ in modulation depth. On the one hand, the first modulation unit 1110 may be controlled to operate by the driving unit, the second modulation unit 1111 is stopped, and based on this, the first current parameter of the temperature control assembly 112 is controlled by the temperature control unit, so as to adjust the operating temperature of the first modulation unit 1110, and the operating temperature of the first modulation unit 1110 includes ten temperature values, for example, so that ten optical signals of different wavelengths may be output. On the other hand, the first modulation unit 1110 may be controlled to stop by the driving unit, and the second modulation unit 1111 operates, based on which the second current parameter of the temperature control assembly 112 is controlled by the temperature control unit, thereby adjusting the operation temperature of the second modulation unit 1111, which includes ten temperature values, for example, whereby ten different wavelength optical signals may be additionally outputted. Of course, the operating temperature of each modulation unit 111 may be not limited to 10, but may be 5, 15, and is not limited thereto.
In some embodiments, referring again to fig. 2, the modulated laser 110 further includes a first monitoring component 113, where the first monitoring component 113 is connected to the first modulating unit 1110 and the second modulating unit 1111, respectively; the first monitoring component 113 is configured to monitor optical powers corresponding to different wavelengths of light output by the first modulation unit 1110 or the second modulation unit 1111.
Here, the first monitoring component 113 may be a Photodiode (PD) chip, may convert a detected optical signal into an electrical signal, and derive an optical power output by the first modulation unit 1110 or the second modulation unit 1111 based on the obtained electrical signal. The PD chip has the advantages of high response speed and high reliability, and can achieve a higher monitoring effect.
In some embodiments, referring again to fig. 2, the modulated laser 110 further includes a second monitoring component 114, where the second monitoring component 114 is connected to the first modulating unit 1110 and the second modulating unit 1111, respectively; the second monitoring component 114 is configured to monitor an operating temperature of the first modulation unit 1110 or the second modulation unit 1111.
Here, the second monitoring component 114 may be a thermistor, and the operating temperature of the first modulation unit 1110 or the second modulation unit 1111 may be determined by a change in the resistance value of the second monitoring component 114. The resistance change of the thermistor can be obtained through corresponding voltage parameters and current parameters.
In some embodiments, referring to fig. 1, fig. 2, fig. 3 is a schematic structural diagram of a package structure of an optical module according to an embodiment of the present application, where the package structure further includes a controller 140, and the controller 140 is connected to the temperature control unit 130; a controller 140 for sending a first control instruction to the temperature control unit 130; the control instruction is used for controlling the voltage value of the pin of the temperature control unit 130 so as to realize the control of the heating and cooling current output by the temperature control unit 130.
In this embodiment, the operating temperature of the modulation unit 111 and the wavelength of the optical signal output by the modulation unit are in a mapping relationship, that is, an operating temperature value may uniquely correspond to an optical signal, which may be obtained empirically. The controller sends the first control instruction to the temperature control unit to adjust the voltage value of the pins of the temperature control unit, so that the modulation unit 111 can reach a specific working temperature and output an optical signal with a specific wavelength. Or when the output optical signal needs to be changed, heating or cooling current is output to the temperature control unit, so that the wavelength of the output optical signal can be changed.
In some embodiments, referring again to fig. 3, the package structure further includes: an interface unit 150; the interface unit 150 is connected with the driving unit 120; an interface unit 150 for transmitting the input high-speed electric signal to the driving unit 120; the driving unit 120 is further configured to obtain a first electrical signal or a second electrical signal based on the high-speed electrical signal, amplify the first electrical signal, and send the amplified first electrical signal to the first modulating unit or amplify the second electrical signal and send the amplified second electrical signal to the second modulating unit.
In this embodiment, the interface unit is an SFP28 package for providing a plurality of ports. The interface unit is connected with the drive unit on one hand and connected with the system backboard on the other hand. The system backboard transmits the high-speed electric signal to the driving unit through the interface unit, and the driving unit can amplify the high-speed electric signal and send the high-speed electric signal to the corresponding modulation unit. Here, the high-speed signal may be a 2-channel 28G differential signal, which is encoded in the NRZ pattern.
In some embodiments, the modulated laser is used to convert the amplified first electrical signal or second electrical signal into an output optical signal.
Here, when the first modulation unit is operated and the second modulation unit is stopped, the modulation laser converts the amplified first electric signal into an output optical signal based on the first modulation unit; when the first modulation unit stops and the second modulation unit works, the modulation laser converts the amplified second electric signal into an output optical signal based on the second modulation unit.
In some embodiments, referring again to fig. 3, the package structure further includes a high voltage device 160, and the controller 140 is connected to the high voltage device 160; the controller 140 is further configured to send a second control instruction to the high-voltage device 160; the second control command is used for controlling the voltage value of the pin of the high-voltage device 160 so as to realize the control of the output reverse bias voltage of the high-voltage device 160.
Here, the high-voltage device can amplify the input voltage and output the amplified voltage, and the high-voltage device may be a dedicated boost chip capable of implementing a DC/DC conversion function, for example, LT1930 of Linear, max1771 of maximide, or the like. The input voltage (e.g., 3.3V or 5V) can be converted to a 20, 30 volt high voltage output by a high voltage device. Of course, this is only an exemplary illustration, and a larger voltage may be output by the high voltage device, and may be specifically implemented by controlling the voltage value of the pin of the high voltage device.
In some embodiments, the package structure includes a probe unit; the detection unit is respectively connected with the driving unit and the high-voltage device; the detection unit is used for receiving the input optical signal, converting the input optical signal into a third electric signal, and transmitting the third electric signal to the high-voltage device through the driving unit for amplifying the third electric signal.
Here, the detection unit may include an avalanche photodiode connected to the high-voltage device for amplifying the third electric signal.
In this embodiment, after receiving the second control instruction sent by the controller, the high-voltage device performs boosting processing on the input voltage, and outputs the boosted and amplified reverse bias voltage to the detection unit. The detection unit receives an input optical signal, converts the input optical signal into a third electric signal, and is connected with a reverse bias voltage output by the high-voltage device, the responsivity of the avalanche photodiode in the detection unit is increased along with the increase of the reverse bias voltage, and when the reverse bias voltage is close to a breakdown voltage, the responsivity of the avalanche photodiode is rapidly increased, namely an avalanche effect occurs, so that the third electric signal which is multiple times of that of the normal photoelectric conversion can be generated under the condition that the power of the input optical signal is unchanged, and the sensitivity of the detection unit is improved. The third photoelectric signal may be input to the interface unit after being limited by the driver Shan Yun. Here, the input optical signal may be an external optical signal or an optical signal output from a modulated laser.
Fig. 4 is a schematic structural diagram of a package structure of an optical module according to an embodiment of the present application; wherein A represents the output direction of the optical signal, and B represents the input direction of the optical signal. In the direction a, the interface unit 150 receives the high-speed signal sent by the system back board, and transmits the high-speed signal to the driving unit 120, and the driving unit 120 amplifies the high-speed signal and sends the amplified signal to the laser modulator 110, and the laser modulator 110 converts the amplified signal into an optical signal and outputs the optical signal. In the direction B, the detection unit 170 receives an optical signal, and the optical signal is amplified by the high-voltage device 160 connected to the detection unit 170, then converted into an electrical signal by the detection unit 170, and transmitted to the driving unit 120, and the driving unit 120 clips the electrical signal and then transmits the electrical signal to the interface unit 150.
Referring to fig. 5, fig. 5 is a schematic flow chart of a light adjustment method according to an embodiment of the present application, where the light adjustment method is applied to a package structure of an optical module; comprising the following steps:
s501, obtaining an electric signal, and driving a first modulation unit to work based on the electric signal;
s502, controlling current parameters of the temperature control component, and adjusting the working temperature of the first modulation unit based on the current parameters so as to output light with different wavelengths; the temperature control assembly is connected with the first modulation unit, and the first modulation unit is any one of the at least one modulation unit.
In this embodiment, the modulated laser may include a first modulation unit and a second modulation unit having different modulation depths. In one aspect, the driving unit may control the first modulation unit to operate based on the first electrical signal, and the second modulation unit to stop, based on which the first current parameter of the temperature control assembly is controlled by the temperature control unit, thereby adjusting the operating temperature of the first modulation unit, and the operating temperature of the first modulation unit includes ten temperature values, by way of example, whereby ten different wavelength optical signals may be output. On the other hand, the driving unit may control the first modulation unit to stop based on the first electric signal, and the second modulation unit to operate, based on which the second current parameter of the temperature control assembly is controlled by the temperature control unit, thereby adjusting the operating temperature of the second modulation unit, and the operating temperature of the second modulation unit includes ten temperature values, by way of example, whereby ten different wavelength optical signals may be additionally outputted. Of course, the operating temperature of each modulation unit may be not limited to 10, but may be 5, 15, and is not limited thereto. Specific examples are described with reference to the above device examples, and are not described in detail herein.
According to the embodiment of the application, the first electric signal is obtained, any one of the plurality of modulation units in the modulation laser is driven to work based on the first electric signal, and the temperature control unit is used for controlling the first current parameter of the temperature control component in the modulation laser, so that the working temperature of the modulation unit is regulated, different modulation units can output light with different wavelengths at different working temperatures, the packaging structure of the optical module is simplified, the utilization rate of module resources is improved, and the network construction cost is reduced.
The foregoing is merely illustrative of the present application, and the present application is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (8)
1. An encapsulation structure of an optical module, characterized in that the encapsulation structure comprises: the device comprises a modulation laser, a driving unit and a temperature control unit; the modulating laser is respectively connected with the driving unit and the temperature control unit; the modulation laser comprises at least one modulation unit and a temperature control component;
the driving unit is used for obtaining a first electric signal and driving the first modulation unit to work based on the first electric signal; the first modulation unit is any modulation unit in the at least one modulation unit;
the temperature control unit is used for controlling a first current parameter of the temperature control component; the first current parameter is used for adjusting the working temperature of the first modulation unit so that the first modulation unit outputs light with different wavelengths;
the packaging structure further comprises a controller, and the controller is connected with the temperature control unit;
the controller is used for sending a first control instruction to the temperature control unit; the control instruction is used for controlling the voltage value of the pins of the temperature control unit so as to realize the control of the heating and refrigerating currents output by the temperature control unit;
the packaging structure also comprises a high-voltage device, and the controller is connected with the high-voltage device;
the controller is also used for sending a second control instruction to the high-voltage device; the second control instruction is used for controlling the voltage value of the pin of the high-voltage device so as to realize the control of the output reverse bias voltage of the high-voltage device;
the packaging structure also comprises a detection unit; the detection unit is respectively connected with the driving unit and the high-voltage device;
the detection unit is used for receiving an input optical signal, converting the input optical signal into a third electric signal, and sending the third electric signal to the high-voltage device through the driving unit so as to amplify the third electric signal.
2. The package structure of claim 1, wherein,
the driving unit is further used for obtaining a second electric signal, and driving the first modulation unit to stop and the second modulation unit to work based on the second electric signal; the second modulation unit is any modulation unit except the first modulation unit in the at least one modulation unit;
the temperature control unit is also used for controlling a second current parameter of the temperature control component; the second current parameter is used for adjusting the working temperature of the second modulation unit so that the second modulation unit outputs light with different wavelengths.
3. The package structure of claim 2, wherein the modulated laser further comprises a first monitoring component connected to the first modulation unit and the second modulation unit, respectively;
the first monitoring component is used for monitoring the optical power corresponding to the light with different wavelengths output by the first modulation unit or the second modulation unit.
4. The package structure of claim 2, wherein the modulated laser further comprises a second monitoring component connected to the first and second modulation units, respectively;
the second monitoring component is used for monitoring the working temperature of the first modulation unit or the second modulation unit.
5. The package structure of claim 2, further comprising: an interface unit; the interface unit is connected with the driving unit;
the interface unit is used for transmitting the input high-speed electric signals to the driving unit;
the driving unit is further configured to obtain the first electrical signal or the second electrical signal based on the high-speed electrical signal, amplify the first electrical signal, and send the amplified first electrical signal to the first modulation unit or amplify the second electrical signal and send the amplified second electrical signal to the second modulation unit.
6. The package structure of claim 5, wherein the modulated laser is configured to convert the amplified first electrical signal or the second electrical signal into an output optical signal.
7. The package structure according to claim 1, wherein the detection unit includes an avalanche photodiode connected to the high-voltage device for amplifying the third electric signal.
8. The light adjusting method is characterized by being applied to a packaging structure of the light module; comprising the following steps:
obtaining an electric signal, and driving a first modulation unit to work based on the electric signal;
controlling current parameters of a temperature control component, and adjusting the working temperature of the first modulation unit based on the current parameters so as to output light with different wavelengths; the temperature control assembly is connected with the first modulation unit, and the first modulation unit is any modulation unit in at least one modulation unit;
the method further comprises the steps of:
sending a first control instruction to a temperature control unit; the control instruction is used for controlling the voltage value of the pins of the temperature control unit so as to realize the control of the heating and refrigerating currents output by the temperature control unit;
sending a second control instruction to the high-voltage device; the second control instruction is used for controlling the voltage value of the pin of the high-voltage device so as to realize the control of the output reverse bias voltage of the high-voltage device;
and receiving an input optical signal, converting the input optical signal into a third electric signal, and transmitting the third electric signal to the high-voltage device through the driving unit for amplifying the third electric signal.
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2007158774A (en) * | 2005-12-06 | 2007-06-21 | Matsushita Electric Ind Co Ltd | Optical receiver and optical transmission system |
| JP2012231186A (en) * | 2012-08-28 | 2012-11-22 | Japan Oclaro Inc | Wavelength variable optical transmitter and optical transmitter-receiver |
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| US6665457B2 (en) * | 2001-09-10 | 2003-12-16 | Altitun Ab | Tunable electro-absorption modulator and tunable laser |
| EP1436869B1 (en) * | 2001-10-09 | 2016-06-01 | Infinera Corporation | Transmitter photonic integrated circuit |
| WO2015124952A1 (en) * | 2014-02-24 | 2015-08-27 | Rockley Photonics Limited | Detector remodulator and optoelectronic switch |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007158774A (en) * | 2005-12-06 | 2007-06-21 | Matsushita Electric Ind Co Ltd | Optical receiver and optical transmission system |
| JP2012231186A (en) * | 2012-08-28 | 2012-11-22 | Japan Oclaro Inc | Wavelength variable optical transmitter and optical transmitter-receiver |
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