CN114255666A - Driving back plate and display device - Google Patents

Driving back plate and display device Download PDF

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Publication number
CN114255666A
CN114255666A CN202011038435.7A CN202011038435A CN114255666A CN 114255666 A CN114255666 A CN 114255666A CN 202011038435 A CN202011038435 A CN 202011038435A CN 114255666 A CN114255666 A CN 114255666A
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China
Prior art keywords
line
lines
sub
connection
width
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CN202011038435.7A
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Chinese (zh)
Inventor
张天宇
何敏
谢晓冬
钟腾飞
桑华煜
曾亭
李媛
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BOE Technology Group Co Ltd
Hefei Xinsheng Optoelectronics Technology Co Ltd
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BOE Technology Group Co Ltd
Hefei Xinsheng Optoelectronics Technology Co Ltd
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Application filed by BOE Technology Group Co Ltd, Hefei Xinsheng Optoelectronics Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to US17/356,772 priority Critical patent/US11538776B2/en
Publication of CN114255666A publication Critical patent/CN114255666A/en
Pending legal-status Critical Current

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes

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  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The invention discloses a driving backboard and a display device, wherein the driving backboard comprises: the semiconductor device comprises a substrate, a plurality of signal lines, a plurality of binding electrodes and a plurality of connecting lines, wherein the signal lines, the binding electrodes and the connecting lines are arranged on the substrate; at least one of the plurality of signal lines extends in a first direction, a first end of any one of the plurality of connection lines is electrically connected with at least one of the plurality of bonding electrodes, and a second end is electrically connected with one of the plurality of signal lines; at least one of the plurality of connection lines has a line width at a first end that is smaller than a line width at a second end; at least one of a plurality of connection lines, comprising: the device comprises a first straight line part extending along a first direction, and a diagonal line part with a certain included angle between the extending direction and the first direction; one end of the first straight line part is electrically connected with the binding electrode; the other end of the first straight line part is electrically connected with the signal line through the diagonal line part. The driving back plate can make full use of wiring space, reduce the area of a fan-out area and reduce the wiring difficulty of signal wires.

Description

Driving back plate and display device
Cross Reference to Related Applications
The present application claims priority from the chinese patent application filed 24/09/2020, having application number 202011017476.8 and entitled "a driving backplane and display device", which is incorporated herein by reference in its entirety.
Technical Field
The invention relates to the technical field of display, in particular to a driving back plate and a display device.
Background
With the development of Light Emitting Diode (LED) technology, the micro LED display technology will become the next revolutionary technology, and the micro LED is a display technology that miniaturizes and matrixing the conventional LED structure and uses an integrated circuit process to make a driving back plate to realize the address control and individual driving of each pixel.
For a micro light emitting diode display device, the line width of a signal line in a driving back plate is large and can reach 3.8mm or even larger, and the arrangement of light emitting diodes is dense, and a frame is narrow, so that the wiring difficulty of a Fan-out area (Fan out) is large.
Disclosure of Invention
The embodiment of the invention provides a driving back plate and a display device, which are used for solving the problem that the wiring difficulty of a fan-out area in a micro light-emitting diode display device in the related technology is higher.
An embodiment of the present invention provides a driving backplane, including:
the semiconductor device comprises a substrate, a plurality of signal lines, a plurality of binding electrodes and a plurality of connecting lines, wherein the signal lines, the binding electrodes and the connecting lines are arranged on the substrate;
at least one of the plurality of signal lines extends in a first direction;
a first end of any one of the plurality of connection lines is electrically connected to at least one of the plurality of bonding electrodes, and a second end is electrically connected to one of the plurality of signal lines;
a line width of at least one of the connection lines of the plurality of connection lines at the first end is smaller than a line width at the second end;
at least one of the plurality of connection lines, comprising: the first straight line part extends along the first direction, and the oblique line part has a certain included angle with the first direction in the extending direction;
one end of the first straight line part is electrically connected with the binding electrode; the other end of the first straight line part is electrically connected with the signal line through the inclined line part.
In a possible implementation manner, in the driving backplane provided in the embodiment of the present invention, the driving backplane includes a plurality of rows of light-emitting areas sequentially arranged along a first direction;
at least one of the connecting lines has an overlap with an orthographic projection of a first row of light-emitting areas on the substrate, and the first row of light-emitting areas is the light-emitting area closest to one side of the substrate, on which the binding electrode is arranged, among the plurality of rows of light-emitting areas.
In a possible implementation manner, in the above-mentioned driving back plate provided by the embodiment of the present invention, in a direction in which the first end of the connecting line points to the second end, a line width of the diagonal portion in a direction perpendicular to an extending direction of the diagonal portion is gradually increased, and the line width of the diagonal portion is greater than or equal to a line width of the first straight portion.
In a possible implementation manner, in the driving backplane provided in an embodiment of the present invention, the first straight line portion of at least one of the connection lines includes two sub-sides along the first direction, and a width of a portion of the first straight line portion corresponding to an overlapping area of projections of the two sub-sides in the first direction respectively is uniform in a direction perpendicular to the first direction.
In a possible implementation manner, in the driving backplane provided in the embodiment of the present invention, in the second direction, a length of each of the first linear portions in the first direction tends to increase first and then decrease; the second direction is a direction perpendicular to the first direction.
In a possible implementation manner, in the driving back plate provided by the embodiment of the present invention, in the second direction, lengths of the first straight portions in the first direction are symmetrically distributed along a symmetry axis of the first direction.
In a possible implementation manner, in the driving back plate provided by the embodiment of the present invention, on one side of the symmetry axis, a length of one of the two sub-sides of each first straight line portion, which is close to the symmetry axis, is greater than or equal to a length of the other sub-side, and any two first straight line portions arranged in the second direction, any one of the two sub-sides of one of the first straight line portions, which is closer to the symmetry axis, is greater than or equal to any one of the two sub-sides of the other first straight line portion.
In a possible implementation manner, in the above-mentioned driving backplane provided in an embodiment of the present invention, at least one of the connection lines further includes: a second linear portion extending in the first direction;
the diagonal part is electrically connected with the signal wire through the second straight line part;
the line width of the second straight line portion is greater than or equal to the line width of the diagonal line portion.
In a possible implementation manner, in the above-mentioned driving back plate provided by the embodiment of the present invention, the second straight line portion of at least one of the connection lines includes two sub-sides along the first direction, and a width of a portion of the second straight line portion, corresponding to an overlapping area of projections of the two sub-sides in the first direction, is uniform in a direction perpendicular to the first direction.
In a possible implementation manner, in the driving back plate provided in the embodiment of the present invention, in a second direction, a length of each of the second straight line portions in the first direction tends to decrease first and then increase; the second direction is a direction perpendicular to the first direction.
In a possible implementation manner, in the driving back plate provided by the embodiment of the present invention, in the second direction, lengths of the second linear portions in the first direction are symmetrically distributed along a symmetry axis of the first direction.
In a possible implementation manner, in the above-mentioned driving back plate provided by the embodiment of the present invention, on one side of the symmetry axis, a length of one of the two sub-sides of each second straight line portion, which is close to the symmetry axis, is less than or equal to a length of the other sub-side, and any two of the second straight line portions arranged along the second direction, which are closer to the symmetry axis, are less than or equal to any one of the two sub-sides of the other second straight line portion.
In a possible implementation manner, in the driving backplane provided in the embodiment of the present invention, a line width of the connection line at the second end is consistent with a line width of the signal line.
In a possible implementation manner, in the driving backplane provided in the embodiment of the present invention, a line width of the connection line at the first end is greater than a width of each of the corresponding connected bonding electrodes.
In a possible implementation manner, in the driving backplane provided in the embodiment of the present invention, a line width of the signal line is 20 to 130 times a line width of the bonding electrode.
In a possible implementation manner, in the above driving backplane provided in an embodiment of the present invention, the plurality of signal lines include: a plurality of power signal lines and a plurality of ground lines;
the driving back plate further comprises: a plurality of connection electrodes arranged in pairs to be bonded with the light emitting diodes;
one of the connection electrodes provided in a pair is electrically connected to the power signal line, and the other is electrically connected to the ground line.
In a possible implementation manner, in the above-mentioned driving back plate provided by the embodiment of the present invention, a minimum line width of the diagonal portion electrically connected to at least one of the plurality of power signal lines is the same as a minimum line width of the diagonal portion electrically connected to at least one of the plurality of ground lines.
In a possible implementation manner, in the above driving backplane provided in an embodiment of the present invention, a line width of the power signal line or the ground line is in a range from 1500 μm to 9000 μm;
a minimum line width of the hatched portion electrically connected to at least one of the plurality of power signal lines is in a range of 1800 μm to 1815 μm;
the number of the bonding electrodes to which the power signal line is electrically connected differs from the number of the bonding electrodes to which the ground line is electrically connected by 1 or 2.
An embodiment of the present invention further provides a display device, including: the driving back plate and a plurality of light emitting diodes electrically connected with the driving back plate.
The invention has the following beneficial effects:
the driving backboard and the display device provided by the embodiment of the invention comprise: the semiconductor device comprises a substrate, a plurality of signal lines, a plurality of binding electrodes and a plurality of connecting lines, wherein the signal lines, the binding electrodes and the connecting lines are arranged on the substrate; at least one of the plurality of signal lines extends in a first direction; a first end of any one of the plurality of connecting wires is electrically connected with at least one of the plurality of binding electrodes, and a second end is electrically connected with one of the plurality of signal wires; at least one of the plurality of connection lines has a line width at a first end that is smaller than a line width at a second end; at least one of a plurality of connection lines, comprising: the device comprises a first straight line part extending along a first direction, and a diagonal line part with a certain included angle between the extending direction and the first direction; one end of the first straight line part is electrically connected with the binding electrode; the other end of the first straight line part is electrically connected with the signal line through the diagonal line part. By adopting the wiring mode in the embodiment of the invention, the wiring space of the driving back plate can be fully utilized, so that each connecting wire can meet the requirements of a driving circuit, a certain distance can be formed between the connecting wires, the phenomenon of connecting wire intersection is prevented, in addition, the area of a fan-out area can be reduced, and the wiring difficulty of signal wires is reduced.
Drawings
Fig. 1 is a schematic structural diagram of a driving backplate according to an embodiment of the present invention;
FIG. 2a is an enlarged partial schematic view of FIG. 1;
FIG. 2b is a schematic enlarged partial view of four connecting lines of FIG. 1 arranged symmetrically about the axis of symmetry P;
fig. 3 is a second schematic structural diagram of a driving backplate according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a specific structure of a light-emitting region according to an embodiment of the present invention;
FIG. 5 is a partial diagram of a binding region in an embodiment of the invention;
FIG. 6 is a diagram illustrating signal line division according to an embodiment of the present invention;
FIG. 7 is a schematic diagram of a wired structure according to an embodiment of the present invention;
FIG. 8 is a schematic diagram of the power signal lines and the ground lines of FIG. 7 connected to the corresponding bonding electrodes via a plurality of sub-connection lines;
FIG. 9 is an enlarged schematic view of region Q1 of FIG. 7;
FIG. 10 is an enlarged schematic view of region Q2 of FIG. 7;
FIG. 11 is an enlarged schematic view of region Q3 of FIG. 7;
FIG. 12 is a diagram illustrating a structure of FIG. 9 in which sub-connecting lines are merged into a connecting line;
FIG. 13 is an enlarged schematic view of a signal line connected to a corresponding bonding electrode via a connection line according to an embodiment of the present invention;
FIG. 14 is a schematic diagram illustrating an arrangement of auxiliary connection lines according to an embodiment of the present invention;
fig. 15 is a schematic diagram of an arrangement manner of the broken line structure in the embodiment of the invention.
Detailed Description
The embodiment of the invention provides a driving backboard and a display device, aiming at the problem that the wiring difficulty of a fan-out area in a micro light-emitting diode display device in the related art is high.
The following describes specific embodiments of the driving backplane and the display device according to embodiments of the present invention in detail with reference to the accompanying drawings. The sizes and shapes of the various parts in the drawings are not to scale and are merely intended to illustrate the invention.
An embodiment of the present invention provides a driving backplate, fig. 1 is a schematic structural diagram of the driving backplate provided in the embodiment of the present invention, and fig. 2a is a schematic partial enlarged view of fig. 1, as shown in fig. 1 and fig. 2a, including: a substrate (not shown in the figure), a plurality of signal lines 10, a plurality of bonding electrodes 20, and a plurality of connection lines 30 provided on the substrate;
at least one signal line 10 extends in a first direction (a direction indicated by an arrow T in the figure);
the first end a of the connection line 30 is electrically connected with at least one binding electrode 20, and the second end b is electrically connected with one signal line 10;
the line width d1 of the at least one connection line 30 at the first end a is smaller than the line width d2 at the second end b;
at least one connection line 30 comprising: a first straight line portion 301 extending along the first direction T1, and a slant line portion 302 extending in a direction having an angle with the first direction T1;
one end of the first straight line portion 301 is electrically connected to the binding electrode 20; the other end of the first straight line portion 301 is electrically connected to the signal line 10 via a diagonal line portion 302.
In the driving back plate provided by the embodiment of the invention, the signal wires are electrically connected with the corresponding binding electrodes by arranging the connecting wires, the wire width of at least one connecting wire at the first end is smaller than that at the second end, and the at least one connecting wire comprises the first straight wire part and the diagonal wire part.
Referring to fig. 1 and 2a, in the micro light emitting diode display device, a binding region B is generally located at an edge position of a driving backplane, the binding region B includes a plurality of binding electrodes 20 therein, and the binding electrodes 20 can be bound and connected with components such as a driving chip or a flexible circuit board, so that the number and size of the binding electrodes 20 in the binding region B need to be matched with the components such as the driving chip or the flexible circuit board, and in order to ensure the lightness and thinness and narrow frame of the whole device, the size of the components such as the driving chip or the flexible circuit board is generally small, so the width of the binding region B is narrow, and the size of each binding electrode 20 in the binding region B is small.
However, unlike other electronic devices such as liquid crystal display devices and touch devices, in a micro light emitting diode display device, in order to ensure the performance of a product, a signal line on a driving backplane needs to have a certain line width, which needs to be 3.8mm or more, and due to the limitation of a design space, the signal line cannot be electrically connected with a corresponding bonding electrode. In the embodiment of the present invention, the signal line 10 is electrically connected to the corresponding bonding electrode 20 by disposing the connecting lines 30, the line width d1 of the first end a of at least one connecting line 30 is smaller than the line width d2 of the second end b, and the at least one connecting line 30 includes the first straight line portion 301 and the oblique line portion 302, wherein the extending direction of the oblique line portion 302 and the first direction T1 form a certain included angle, so that the space in the driving backplane can be reasonably utilized, and the signal line 10 can be electrically connected to the corresponding bonding electrode 30. As shown in fig. 1, the connection line 30 is located in the fan-out region F, and by using the connection manner in the embodiment of the present invention, the area of the fan-out region can be reduced, which is more favorable for the narrow bezel design.
It should be noted that, in the embodiment of the present invention, the line width of the connection line may be understood as a width of the connection line in a direction perpendicular to the extending direction of the connection line.
In specific implementation, the number of the bonding electrodes connected to each signal line may be determined according to the width of the bonding region B, the number of the signal lines in the driving backplane, and the like, which is illustrated in fig. 2a by taking an example that one signal line 10 is electrically connected to one bonding electrode 20, in specific implementation, one signal line 10 may also be electrically connected to a plurality of bonding electrodes 20, where the corresponding relationship between the signal line 10 and the bonding electrode 20 is not limited.
In the embodiment of the present invention, the line width d1 of the at least one connection line 30 at the first end a is smaller than the line width d2 at the second end b, for example, the line width of the at least one connection line 30 is gradually increased in a direction from the first end a to the second end b of the connection line 30, and it should be noted herein that the line width of the connection line 30 may be gradually increased from the first end a to the second end b, or the line width of a certain portion of the connection line 30 is gradually increased and the line width of the remaining portion is not changed as long as the line width of the connection line 30 is gradually increased as a whole.
In specific implementation, as shown in fig. 2a, in the above-mentioned driving back plate provided in the embodiment of the present invention, in a direction in which the first end a of the connecting line 30 points to the second end b, a line width of the oblique line portion 302 in a direction perpendicular to an extending direction of the oblique line portion 302 is gradually increased, and the line width of the oblique line portion 302 is greater than or equal to a line width of the first straight line portion 301. That is, in a direction in which the second end b of the connection line 30 points to the first end a, the line width of the sloped line portion 302 is gradually narrowed, and the extending direction of the sloped line portion 302 forms an angle with the first direction T1, so that the sloped line portion 302 is inclined toward the bonding electrode 20, thereby enabling the connection line 30 to connect the signal line 10 and the corresponding bonding electrode 20 and fully utilize the wiring space of the driving backplane.
Optionally, in the above-mentioned driving back plate provided by the embodiment of the present invention, as shown in fig. 2a, the first straight line 301 of the at least one connection line 30 includes two sub-sides (as shown in 301a and 301b in fig. 2 a) along the first direction T1, and the widths of the portions of the first straight line 301 corresponding to the overlapped areas of the projections of the two sub-sides in the first direction T1 are the same in a direction perpendicular to the first direction T1. The first straight line parts 301 extending along the first direction T1 are arranged in the connecting line 30, so that the connecting line 30 and the binding electrodes 20 can be electrically connected, and the width of the parts, perpendicular to the first direction T1, of the first straight line parts 301 corresponding to the projection overlapping areas of the two sub-sides in the first direction T1 respectively is consistent, so that the first straight line parts which are matched with the width of the corresponding binding electrodes and meet the requirement of the distance between the adjacent connecting lines are obtained, and the adjacent connecting lines can be prevented from being short-circuited or subjected to signal crosstalk.
In the embodiment of the present invention, the line widths of the portions of the first straight line portions 301 corresponding to the projection overlapping areas of the two sub-sides in the first direction T1 are consistent in the direction perpendicular to the first direction T1, which can be understood as follows: the difference in line width of the first straight line portion 301 at each position in the portion is smaller than a set value, that is, the line width of the first straight line portion 301 at each position in the portion is approximately the same.
In practical applications, in the driving back plate provided by the embodiment of the present invention, as shown in fig. 1 and fig. 2a, in the second direction T2, the length of each first straight line portion 301 in the first direction T1 tends to increase first and then decrease; the second direction T2 is a direction perpendicular to the first direction T1. As shown in fig. 1, a part of the straight line of the connecting line 30 connected to the bonding region B in the drawing is a first straight line, and as is apparent from fig. 1, in the second direction T2, that is, in a direction from left to right in the drawing, the length of the first straight line in the first direction T1 tends to increase first and then decrease, that is, in the plurality of connecting lines 30 in the driving backplane, the length of the first straight line in the middle position is larger, and the length of the first straight line in the two side positions is smaller, so that the space of the fan-out region F can be more reasonably utilized, and the signal line 10 can be electrically connected to the corresponding bonding electrode.
In the plurality of signal lines 10 in the driving backplane, the distance between the signal line 10 at the middle position and the binding region B is short, and thus the diagonal portion of the connection line 30 corresponding to the signal line 10 at the middle position can be short, and the distance between the signal line 10 at the two side positions and the binding region B is long, and thus the diagonal portion of the connection line 30 corresponding to the signal line 10 at the two side positions needs to be long, and therefore, by making the length of the first straight line portion at the middle position large and the length of the first straight line portion at the two side positions small, the space of the fan-out region F can be more reasonably utilized.
Further, in the above-mentioned driving back plate provided by the embodiment of the present invention, as shown in fig. 1, in the second direction T2, the lengths of the first straight line portions 301 in the first direction T1 are symmetrically distributed along the symmetry axis P of the first direction T1, so that the space of the fan-out region F can be more reasonably utilized, and the wiring design in the fan-out region F is facilitated, so that the connection lines 30 in the fan-out region F can meet the requirement of circuit configuration.
It should be noted that, in the embodiment of the present invention, referring to fig. 2a, the length of the first straight line portion 301 in the first direction T1 may be understood as follows: the length of the portion of the first straight line portion 301 corresponding to the overlapping region where the projections of the two sub-sides 301a and 301b in the first direction T1 overlap each other, that is, the length of the region where the widths of the line widths of the first straight line portion 301 are the same, is mainly used.
Fig. 2b is a partially enlarged schematic view of four connecting lines symmetrically disposed about the symmetry axis P in fig. 1, and as shown in fig. 2b, in the driving backplate provided in the embodiment of the present invention, on one side of the axis of symmetry P, one of the two sub-sides of each first straight line portion 301 that is close to the axis of symmetry P has a length greater than or equal to the length of the other sub-side, in FIG. 2b, the sub-side near the symmetry axis P is denoted as 301b, the sub-side far from the symmetry axis P is denoted as 301a, i.e. the length of sub-side 301b is greater than the length of sub-side 301a in each first linear portion 301, and any two of the first straight line portions 301 arranged in the second direction T2, any one of the two sub-sides of one of the first straight line portions 301 closer to the axis of symmetry P is equal to or greater than any one of the two sub-sides of the other first straight line portion 301. For example, in fig. 2b, on the one hand, the lengths of two sub-sides of the first straight line portion 301 closer to the symmetry axis P, out of the two first straight line portions 301 on the left side of the symmetry axis P, are greater than the lengths of two sub-sides of the other first straight line portion. By means of the arrangement, the first straight line part with small width can be obtained, so that the requirement of the distance between the adjacent connecting lines is met, and signal crosstalk between the adjacent signal lines is prevented. On the other hand, the larger one of the two angles between the sub-side 301a of the first straight line portion 301 and the side of the oblique line portion 302 connected thereto is the first angle, and the smaller one of the two angles between the sub-side 301b and the side of the oblique line portion 302 connected thereto is the second angle, so that on one side of the symmetry axis P, the farther the first straight line portion 301 is from the symmetry axis P, the larger the first angle is, and the smaller the second angle is, for example, in fig. 2b, in two adjacent connecting lines 30 on the right side of the symmetry axis P, the first angle θ 1 is smaller than the first angle θ 2, and the second angle γ 1 is larger than the second angle γ 2.
Further, in the above-mentioned driving back plate provided in the embodiment of the present invention, as shown in fig. 1 and fig. 2a, at least one of the plurality of connection lines 30 may further include: a second straight line portion 303 extending in the first direction T1;
the diagonal portion 302 is electrically connected to the signal line 10 via a second straight portion 303;
the line width of the second straight line portion 303 is greater than or equal to the line width of the diagonal line portion 302.
In the embodiment of the present invention, each connection line 30 is located in the fan-out area F, and by providing the second straight line portion 303, the length and the inclination degree of the diagonal portion 302 in each connection line 30 can be adjusted, so that each signal line 10 can be electrically connected to the corresponding bonding electrode 20 through the connection line 30, and a certain distance is maintained between the connection lines 30, thereby avoiding short circuit of adjacent connection lines 30, so that the space can be more reasonably utilized, the space occupied by the fan-out area F in the vertical direction (the direction shown by the arrow T1 in the drawing) is smaller, and the narrow frame design is more facilitated.
In practical implementation, as shown in fig. 2a, in the above-mentioned driving back plate provided by the embodiment of the present invention, the second straight line portion 303 of at least one connection line 30 includes two sub-sides (as shown in 303a and 303b in fig. 2 a) along the first direction T1, and the widths of the portions of the second straight line portion 303 corresponding to the overlapping areas of the projections of the two sub-sides in the first direction T1 are the same in a direction perpendicular to the first direction T1, so that the short circuit of the adjacent connection lines 30 can be avoided.
It should be noted that, in the embodiment of the present invention, the widths of the portions of the second straight line portion 303 corresponding to the overlapping areas of the projections of the two sub-sides in the first direction T1 are consistent in the direction perpendicular to the first direction T1, and it can be understood that: the difference in line width of the second straight line portion 303 at each position in the portion is smaller than a set value, that is, the line width of the second straight line portion 303 at each position in the portion is approximately the same.
In practical applications, in the driving back plate provided by the embodiment of the present invention, as shown in fig. 1 and fig. 2a, in the second direction T2, the length of each second linear portion 303 in the first direction T1 tends to decrease first and then increase; the second direction T2 is a direction perpendicular to the first direction T1. As shown in fig. 1, a part of the straight line of the connection line 30 connected to the signal line 10 in the drawing is a second straight line portion, and as is apparent from fig. 1, in the second direction T2, that is, in a direction from left to right in the drawing, the length of the second straight line portion in the first direction T1 tends to decrease first and then increase, that is, in the plurality of connection lines 30 in the driving backplane, the length of the second straight line portion at the middle position is smaller, and the length of the second straight line portion at the two side positions is larger, so that the space of the fan-out region F can be more reasonably utilized, and the signal line 10 can be electrically connected to the corresponding bonding electrode.
Among the plurality of signal lines 10 in the driving backplane, the signal line 10 at the middle position is closer to the bonding area B, therefore, the diagonal portion of the connection line 30 corresponding to the signal line 10 at the intermediate position can be short, and the distance between the signal lines 10 at the two side positions and the bonding region B is relatively long, therefore, the diagonal portions of the connection lines 30 corresponding to the signal lines 10 at the two side positions need to be longer, in the embodiment of the invention, by setting the length of the first straight line part at the middle position to be larger and the length of the first straight line part at the two side positions to be smaller, moreover, the length of the second straight line part at the middle position is smaller, the length of the second straight line part at the two side positions is larger, therefore, the length and the inclination degree of the diagonal part in each connecting line can be adjusted, so that the signal line can be electrically connected with the corresponding binding electrode through the connecting line, and the space of the fan-out area F can be more reasonably utilized.
Further, in the driving back plate provided by the embodiment of the invention, as shown in fig. 1, in the second direction T2, the lengths of the second linear portions 303 in the first direction T1 are symmetrically distributed along the symmetry axis P of the first direction T1. Thus, the space of the fan-out area F can be more reasonably utilized, and the wiring design in the fan-out area F is convenient to carry out, so that each connecting wire 30 in the fan-out area F can meet the requirement of circuit arrangement.
It should be noted that, in the embodiment of the present invention, referring to fig. 2a, the length of the second straight line portion 303 in the first direction T1 may be understood as: the length of the portion of the second linear portion 303 corresponding to the overlapping region of the projections of the two sub-sides 303a and 303b in the first direction T1 is mainly defined, that is, the length of the region of the second linear portion 303 in which the line widths are uniform is mainly defined.
As shown in fig. 2b, taking four connecting lines symmetrically disposed about the symmetry axis P as an example, in the above-mentioned driving back plate provided by the embodiment of the present invention, on one side of the symmetry axis P, the length of one of the two sub-sides of each second linear portion 303 close to the symmetry axis P is smaller than or equal to the length of the other sub-side, and in fig. 2b, the length of the sub-side 303b in each second linear portion 303 is smaller than the length of the sub-side 303a, and the length of the sub-side 303b in each second linear portion 303 away from the symmetry axis P is 303a, for example, in fig. 2b, that any two second linear portions 303 arranged along the second direction T2, any one of the two sub-sides of one of the second linear portions 303 closer to the symmetry axis P, is smaller than or equal to any one of the two sub-sides of the other second linear portions 303, for example, on the other hand, in the two second linear portions 303 on the left side of the symmetry axis P, the lengths of the two sub-sides of the second linear portion 303 closer to the symmetry axis P are smaller than the lengths of the two sub-sides of the other second linear portion. On the other hand, the smaller one of the two included angles between the sub-side 303a of the second straight-line portion 303 and the side of the oblique-line portion 302 connected thereto is the third included angle, and the larger one of the two included angles between the sub-side 303b and the side of the oblique-line portion 302 connected thereto is the fourth included angle, on one side of the symmetry axis P, the farther the distance between the second straight-line portion 303 and the symmetry axis P is, the smaller the third included angle is, and the larger the fourth included angle is, for example, in fig. 2b, in two adjacent connecting lines 30 on the right side of the symmetry axis P, the third included angle β 1 is greater than the third included angle β 2, and the fourth included angle α 1 is smaller than the fourth included angle α 2.
In practical applications, as shown in fig. 1 and fig. 2a, in the above-mentioned driving back plate provided in the embodiment of the present invention, the signal line 10 is electrically connected to the corresponding binding electrodes 20 through the connection line 30, and the line width d2 of the connection line 30 at the second end b is set to be consistent with the line width of the signal line 10, so that the line width of the connection line 30 is larger without increasing the difficulty of wiring, and thus, the resistance of the connection line 30 is smaller, and the product performance of the driving back plate is better. It should be noted that, in the embodiment of the present invention, the line width of the connection line 30 at the second end b is consistent with the line width of the signal line 10, which means that the difference between the line width of the connection line 30 at the second end b and the line width of the signal line 10 is smaller than a predetermined value, that is, the line width of the connection line 30 at the second end b is approximately equal to the line width of the signal line 10.
In addition, in the embodiment of the present invention, the line width d2 of the connection line 30 at the second end b is taken as an example to be consistent with the line width of the signal line 10, and in a specific implementation, the line width d2 of the connection line 30 at the second end b may be greater than or equal to the line width of the signal line 10, as long as the circuit design requirements in the driving backplane can be met, and the line width of the connection line is not limited herein.
In addition, the line width d1 of the connection line 30 at the first end a is set to be greater than the width of each of the corresponding binding electrodes 20, in order to ensure the performance of the product, the minimum width of the connection line 30 needs to be greater than a set threshold, and the size of the binding electrode 20 connected to the connection line 30 is smaller, so that the line width d1 of the connection line 30 at the first end a may be set to be greater than the width of each of the corresponding binding electrodes 20, and when the connection line 30 is correspondingly connected to a plurality of binding electrodes 20, the line width d1 of the connection line 30 at the first end a may be greater than the sum of the total width and the gap of the corresponding binding electrodes 20, for example, when the signal line 10 is electrically connected to three binding electrodes 20 through the connection line 30, the line width of the connection line 30 at the first end a is greater than the total width of the three binding electrodes 30 and the gap between the three binding electrodes 30. In this way, the width of the connection line 30 can be further increased, and thus, the resistance of the connection line 30 can be further reduced. It should be noted that the line width of the connection line 30 at the first end a is larger than the width of each of the bonding electrodes 20 connected correspondingly, and it is necessary to ensure that: a certain distance is kept between the adjacent connecting lines 30, so that short circuit between the adjacent connecting lines 30 is prevented.
Specifically, in the driving backplane provided by the embodiment of the present invention, the line width of the signal line is 20 to 130 times the line width of the bonding electrode.
In practical application, the line width of the bonding electrode is about 70 μm, and the line width of the signal line is between 1500 μm and 9000 μm. Therefore, in the micro light emitting diode display device, the difference between the line width of the signal line in the driving back plate and the line width of the binding electrode is large, so that the wiring difficulty of the fan-out area is large. In the embodiment of the invention, the signal wire is electrically connected with the corresponding binding electrode by arranging the connecting wire, and the technical problem of higher wiring difficulty of the fan-out area is solved.
In some driving backplanes provided in the embodiments of the present invention, as shown in fig. 3, a plurality of signal lines 10 includes: a plurality of power signal lines 101, and a plurality of ground lines 102; the driving back plate may further include: a plurality of connection electrodes to be bonded with the light emitting diode 401 are provided in pairs. One of the connection electrodes provided in a pair is electrically connected to the power signal line 101, and the other is electrically connected to the ground line 102. Thus, power can be supplied to the light emitting diode through the power supply signal line 101 and the ground line 102. In particular, in order to reduce the voltage loss of the electrical signal on the power signal line 101 and the ground line 102, the power signal line 101 and the ground line 102 may be set to have a wider line width, for example, the line width of the power signal line may be set to be between 3800 μm and 8800 μm; the line width of the grounding wire is 1600-3800 μm. Of course, other dimensions may be provided without limitation.
In some driving backplanes provided in the embodiments of the present invention, as shown in fig. 3, the plurality of signal lines 10 further include: the plurality of power supply lines 103, the driving back plate may further include: a plurality of connection pads to be bonded with control chip 402. The power supply line is used for supplying an electrical signal to the control chip 402, and because the load on the electrical signal path is small, the line width of the power supply line may be smaller than that of the power signal line 101 and the ground line 102, for example, the line width of the power supply line may be between 800 μm and 1200 μm. Of course, other dimensions are possible and not limited.
In practical applications, in the above-mentioned driving back plate provided by the embodiment of the present invention, as shown in fig. 3, the minimum line width of the diagonal portion electrically connected to at least one of the plurality of power signal lines 101 is the same as the minimum line width of the diagonal portion electrically connected to at least one of the plurality of ground lines 102.
Referring to fig. 2a, the connection line 30 may include: the display panel comprises a first straight line part 301 extending along a first direction T1, a slant line part 302 extending along a direction having a certain included angle with the first direction T1, and a second straight line part 303 extending along the first direction T1, wherein the line width of the second straight line part 303 is greater than or equal to the line width of the slant line part 302, and the line width of the slant line part 302 is greater than or equal to the line width of the first straight line part 301. The minimum line width of the sloped line portion 302 to which the at least one power signal line 101 is electrically connected is the same as the minimum line width of the sloped line portion 302 to which the at least one ground line 102 is electrically connected, and it can be understood that: the line width of one end of the oblique line part electrically connected with at least one power signal line 101, which is connected with the first straight line part, is the same as the line width of one end of the oblique line part electrically connected with at least one ground line 102, which is connected with the first straight line part 301, so that the line widths and the distribution of each first straight line part 301 in the fan-out region F are uniform, and short circuit between the adjacent first straight line parts 301 is prevented.
Specifically, in the driving backplane provided in the embodiment of the present invention, a ratio of a line width of the power signal line or the ground line to a line width of the ground line is in a range from 0.18: 1.1, the line width of the power signal line or the line width of the ground line is 20-125 times the width of the binding electrode. For example, the line widths of the power signal line and the ground line are 3800 μm, and the width of the binding electrode is 70 μm; or the line width of the power signal line is 1600 μm, the line width of the ground line is 8800 μm, and the width of the bonding electrode is 70 μm.
Because the line widths of the power signal line and the grounding line are wider, the line width of the power signal line or the grounding line can be generally set within the range of 1500-9000 μm, and therefore, the number of the binding electrodes which are correspondingly and electrically connected with the power signal line (or the grounding line) is larger. In specific implementation, when the ratio of the line width of the power signal line to the line width of the ground line is 0.9: 1.1, the difference between the number of the binding electrodes electrically connected with the power signal wire and the number of the binding electrodes electrically connected with the grounding wire is not more than 2. For example, the line widths of the power signal line and the ground line are the same and are 3800 micrometers; the number of the bonding electrodes electrically connected corresponding to the power signal line may be 14, and the number of the bonding electrodes electrically connected corresponding to the ground line may be 13. The number of the binding electrodes electrically connected to the power signal line (or the ground line) may also be other values, and is not limited herein, and in practical applications, the number of the binding electrodes electrically connected to the power signal line and the number of the binding electrodes electrically connected to the ground line may be determined according to connection pins of elements such as a driver chip or a flexible circuit board that are bound to the driver backplane.
In practical applications, since the line width of the signal line (e.g., a power signal line or a ground line) is large and the number of the bonding electrodes electrically connected to the signal line is large, the minimum width of the diagonal portion of the connection line needs to be controlled within a certain range, for example, 1800 μm to 1815 μm, in order to allow the connection line in the fan-out region to satisfy the design requirement of electrical connection of the circuit driving the backplane, taking into consideration the resistance and arrangement pitch of the connection line in the fan-out region.
Since the number of the binding electrodes is matched with the number of the golden fingers of the driving chip or the flexible circuit board and other elements, the signal lines with the same width are usually connected with the same number of binding electrodes; in some cases, in order to accommodate a plurality of different sizes and designs of driving back plates, the width of the signal lines, for example, the difference between the number of the bonding electrodes corresponding to the power signal lines and the ground lines, is controlled to be 1 or 2, and the line width of the first straight line portion in the connecting lines connected to the power signal lines and the line width of the first straight line portion in the connecting lines connected to the ground lines differ from each other by one every time, by no more than 2 times of 1 bonding electrode, such as about 130 μm.
In specific implementation, in the driving backplane provided by the embodiment of the present invention, as shown in fig. 3, the driving backplane includes a plurality of rows of light-emitting areas E sequentially arranged along a first direction; each of the plurality of rows of light-emitting areas E includes at least one light-emitting diode; the at least one light emitting diode may be driven by a control chip or a pixel driving circuit including at least one thin film transistor. Taking driving the light emitting diodes by the control chip as an example, at least one control chip 402 is connected with the connection pad in the driving backboard in a binding manner, at least one light emitting diode 401 is connected with the connection electrode in the driving backboard in a binding manner, and the control chip 402 is coupled with the light emitting diode 401 by a signal connection line.
And after the driving back plate is manufactured, the control chip is bound to the corresponding connecting pad, and the light emitting diode is bound to the corresponding connecting electrode. In order to ensure good electrical connection, the connection pad, the film layer where the connection electrode is located, and the signal line, the connection electrode and the binding electrode may be located in different film layers.
The connection positions where each connection line 30 is in direct contact with the corresponding signal line 10 are located: in a direction in which the first end of the connection line 30 points to the second end (as indicated by arrow T1 in fig. 3), an area between the first row of light-emitting areas and the second row of light-emitting areas, that is, an orthogonal projection of at least one connection line 30 on the substrate overlaps an orthogonal projection of the light-emitting diodes located in the first row of light-emitting areas on the substrate. It is to be understood that the first row of light-emitting regions in the embodiments of the present invention is a row of light-emitting regions closest to one side of the substrate where the bonding electrode is disposed, among the plurality of rows of light-emitting regions. It will be appreciated that depending on the size of the driving backplane and the number of signal lines provided thereon, the orthographic projection of at least one connection line 30 on the substrate may overlap not only the orthographic projection of the light emitting diodes in the light emitting areas of the first row on the substrate, but also the orthographic projection of the light emitting diodes in the light emitting areas of the second row on the substrate, and the connection position of each connection line 30 in direct contact with the corresponding signal line 10 is also shifted inwardly of the display area.
In the embodiment of the present invention, referring to fig. 2a, the connection line 30 includes a first straight line portion 301, a slant line portion 302 and a second straight line portion 303, the extending direction of the first straight line portion 301 and the extending direction of the second straight line portion 303 are consistent with the first direction T1, the extending direction of the slant line portion 302 has a certain angle with the first direction T1, and the line width d1 of the connection line 30 at the first end a is smaller than the line width d2 at the second end b, so that the connection position where each connection line directly contacts with the corresponding signal line can be located between the first row of light-emitting regions and the second row of light-emitting regions in the first direction T1. Thus, for the light emitting diodes and the control chips in the first row of light emitting areas in the first direction T1, the connection with the corresponding signal lines can be realized at the connection positions by the routing wires extending along the first direction, and the other rows of light emitting areas except the first row of light emitting areas can be connected with the corresponding signal lines by the routing wires located in the light emitting areas where the light emitting diodes and the control chips are located, so that the routing wires corresponding to the first row of light emitting areas do not overlap with the routing wires corresponding to the other light emitting areas.
If all the connection lines 30 are not arranged in the space of the first row of light-emitting areas, the connection position where each connection line 30 is in direct contact with the corresponding signal line needs to be moved in the first direction, so that the area of the fan-out area F is increased; the light emitting diodes and the control chips in the light emitting areas overlapped with the fan-out area F are connected to the connecting position and the corresponding signal line through the routing wires, so that the leads corresponding to different light emitting areas are overlapped, the wiring complexity is improved, and the signal transmission is influenced by the overlapping capacitance. Taking the connection position between the second row of light-emitting areas and the third row of light-emitting areas as an example, the light-emitting diodes and the control chips in the first row of light-emitting areas need to be connected to the connection position through the wires, and the light-emitting diodes and the control chips in the second row of light-emitting areas also need to be connected to the connection position through the wires, so that the wires corresponding to the first row of light-emitting areas and the wires corresponding to the second row of light-emitting areas need to be prevented from overlapping when the wires corresponding to the first row of light-emitting areas and the wires corresponding to the second row of light-emitting areas are designed. Therefore, in the embodiment of the invention, the connecting position is positioned between the first row of light-emitting areas and the second row of light-emitting areas, so that the leads can be prevented from overlapping, the connecting wire below the connecting position is simpler, the number of the leads above the light-emitting areas is reduced, and the phenomenon of short circuit of the driving circuit is prevented.
As shown in fig. 3, the light emitting areas E in the same column are connected to the same power signal line 101, i.e., the power signal line 101 can provide power to the light emitting diodes in the light emitting areas E in the column, and the light emitting areas E in the same column are connected to the same ground line 102, i.e., the ground line 102 can be electrically connected to the control chip in the light emitting areas E in the column. In practical implementation, the plurality of signal lines 10 in the embodiment of the present invention may further include a plurality of power supply lines 103 connected to the control chip and a plurality of address signal lines (not shown in the figure). Wherein, the control chips in the same row of light-emitting areas E are electrically connected to the same power supply line 103, thereby supplying power to each control chip in the row of light-emitting areas E; and each two columns of light emitting areas E correspond to one addressing signal line, and the connection mode can be different according to different driving logics of specific control chips. Generally, the load of a signal path where the power supply line 103 and the address signal line are located is small, and can be designed to be narrow relative to the line widths of the power supply signal line 101 and the ground line 102, specifically, the line width of the power supply line 103 is about 1mm, and the line width of the address signal line is about 500 μm, and the connection lines corresponding to the power supply line 103 and the address signal line can be arranged according to the space in the fan-out region F.
Fig. 4 is a schematic diagram of a specific structure of a single light-emitting area E, and as shown in fig. 4, in order to clearly illustrate a connection relationship between each light-emitting diode and the control chip, the structure shown in fig. 4 is a schematic diagram after the driving backplane is bonded with the light-emitting diodes and the control chip, specifically, each light-emitting diode is bonded with a corresponding connection electrode in the light-emitting area, and the control chip is bonded with a contact pad in the light-emitting area. In fig. 4, each light-emitting region includes four light-emitting diodes 401(401a, 401b, 401c, 401d), which are illustrated as an example, and in a specific implementation, the number of the light-emitting diodes corresponding to the light-emitting region may also be other values, which is not limited herein.
As shown in fig. 4, the control chip 402 is electrically connected to the power supply line 103 and the address signal line 104, the power supply line 103 may provide power to the control chip 402, the address signal line 104 may transmit an address signal to the control chip 402, and the control chip 402 may obtain an address to be transmitted by analyzing the address signal. In addition, the control chip 402 may be electrically connected to a ground line through the first voltage terminal 404. The light emitting diodes 401(401a, 401b, 401c, 401d) corresponding to the light emitting region are sequentially connected in series, and the light emitting diodes 401(401a, 401b, 401c, 401d) are connected between the second voltage terminal 403 and the control chip 402, and the second voltage terminal 403 is electrically connected to the power signal line to supply power to the light emitting diodes in the light emitting region.
Based on the same inventive concept, an embodiment of the present invention further provides a display device, including: the driving back plate and a plurality of light emitting diodes electrically connected with the driving back plate. The display device can be applied to any product or component with a display function, such as a mobile phone, a tablet personal computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like. Because the principle of the display device for solving the problems is similar to that of the driving back plate, the implementation of the display device can be referred to that of the driving back plate, and repeated details are not repeated.
In a specific implementation, a plurality of light emitting diodes may be bound at each connection electrode in the driving backplane to achieve electrical connection between the light emitting diodes and the driving backplane. In order to make the display image have high definition and good display effect, the light emitting diode can be a miniature light emitting diode or mini light emitting diode with smaller size.
Specifically, in order to realize the color display of the display device, a blue light emitting diode may be used, and a color film layer is disposed on a light emitting side of the light emitting diode, and the color film layer includes: a plurality of red conversion units and a plurality of green conversion units; the light emitted by the blue light emitting diode is emitted to the red conversion unit to convert the blue light into red light, the light emitted by the blue light emitting diode is emitted to the green conversion unit to convert the blue light into green light, and the converted red light, the converted green light and the blue light are combined to obtain white light, so that color display is realized.
In the embodiment of the invention, the signal wire is electrically connected with the corresponding binding electrode by arranging the connecting wire, and the technical problem of higher wiring difficulty of the fan-out area is solved. The following describes in detail a wiring design process of the driving backplane according to an embodiment of the present invention with reference to the accompanying drawings.
The width of the binding region in the driving back plate, the number of the signal lines and the width of the binding electrodes corresponding to each gold finger of the driving chip or the flexible circuit board one by one determine the number of the binding electrodes corresponding to each signal line.
In order to ensure the performance of the product, the minimum line width of the diagonal line part in the corresponding connecting lines of the power signal line and the grounding line in the fan-out area needs to be the same, and a certain distance needs to be kept between the adjacent connecting lines. The line widths of the power signal lines and the ground lines are basically the same, but if the number of the bonding electrodes allocated to each power signal line is different from the number of the bonding electrodes allocated to each ground line, if the power signal lines and the ground lines are directly connected with the corresponding bonding electrodes, the minimum line widths of diagonal portions in the connecting lines corresponding to the power signal lines and the ground lines cannot be guaranteed to be the same, and the distance between adjacent connecting lines cannot be guaranteed.
Specifically, according to the requirement of circuit design, because the number of light emitting areas that the power signal line and the ground line need to drive is large, in order to reduce resistance, the line widths of the power signal line and the ground line are large, and the widths of the power signal line and the ground line are substantially the same, for example, 3800 μm, while the width of the power supply line is smaller than that of the power signal line or the ground line, for example, the line width of the power supply line may be 800 μm to 1200 μm, for example, the line width of the power supply line may be 1000 μm, that is, the ratio of the line width of the power signal line to the line width of the power supply line is 3 to 5, the distance between the adjacent power signal line and the ground line needs to be greater than 200 μm, but the distance between the adjacent ground line and the power supply line needs to be greater than 100 μm. Similarly, in the bonding region, a suspended electrode needs to be disposed between the bonding electrodes correspondingly connected to the two adjacent signal lines, so as to avoid crosstalk of electrical signals between the adjacent signal lines, thereby ensuring stable transmission of the electrical signals.
As shown in fig. 5, 13 binding electrodes 201 electrically connected to the ground line 102 are provided, and a binding electrode 202 electrically connected to the power feed line 103 is shown, and a floating electrode 203 is provided. In the figure, two floating electrodes 203 are illustrated as being disposed between the bonding electrodes corresponding to two adjacent signal lines, and in specific implementation, the number of the floating electrodes may be set according to actual situations, which is not limited herein. In the related art, the flying electrode 203 is not generally electrically connected to the signal line. In addition, since the ground line 102 and the power supply line 103 are electrically connected to the corresponding bonding electrodes through the connection lines, not directly to the bonding electrodes, the ground line 102 and the power supply line 103 are shown by dashed boxes in fig. 5 to show the correspondence relationship between the ground line 102 and the power supply line 103 and the bonding electrodes.
In the embodiment of the present invention, 14 bonding electrodes are provided for each power signal line, and 13 bonding electrodes are provided for each ground line.
First, since it is necessary to ensure that the minimum line widths of the diagonal portions in the connecting lines corresponding to the power signal line and the ground line are the same, when designing the ground line, referring to fig. 5, it may be considered to use the floating electrodes adjacent to the 13 binding electrodes corresponding to the current ground line 102, i.e., the floating electrodes 2030 shown by the dashed line frame. That is, one ground line 102 may correspond to 14 binding electrodes (13 binding electrodes 201 and one floating electrode 2030) as well as 14 binding electrodes corresponding to one power signal line.
Then, referring to fig. 7, since the line widths of the power signal line 101 and the ground line 102 are large, the width L2 of the region where the plurality of bonding electrodes connected corresponding to each of the power signal line 101 or the ground line 102 are located is about 1/2 of the line width L1 of the power signal line 101 or the ground line 102, and it is difficult to directly realize the connection therebetween. Therefore, in the embodiment of the present invention, each wider signal line is first divided into a plurality of sub-signal lines according to the number of the bonding electrodes corresponding to each signal line. As shown in fig. 6, at one end of the power signal line 101 to be connected to the connection line, according to the correspondence relationship between the number of signal lines and the number of bonding electrodes; 14 sub power signal lines 1010 are branched, and 14 sub ground lines 1020 are branched at one end of the ground line 102 to be connected to the connection line.
Then, considering that the sub-signal lines and the corresponding bonding electrodes are connected by a plurality of sub-connecting lines, specifically, the first ends of the sub-connecting lines are connected to the bonding electrodes, and the second ends of the sub-connecting lines are connected to the sub-power signal lines (or sub-ground lines), similar to the structure of the connecting lines, each sub-connecting line may also include: the first sub straight line part, the sub diagonal line part, and the second sub straight line part. Here, the line width and line distance of one end of each sub-connection line connected to the power signal line (or ground line) need to be determined, specifically, since the floating electrodes are used, the number of the binding electrodes corresponding to the power signal line and the ground line is the same, for example, 14. Taking the power signal line as an example, the power signal line is divided into 14 sub power signal lines, 13 seams exist among the 14 sub power signal lines, and assuming that the line width of each sub power signal line is x and the width of each seam is y, the equation can be obtained: 14x +13y 3800(μm), and x > y, there may be multiple solutions to this equation calculated as one set of integer solutions: x is 225 μm, and y is 50 μm, that is, the line width of the sub power supply signal line may be 225 μm, and the width of the seam between two adjacent sub power supply signal lines may be 50 μm. Similarly, the line width of the sub-ground lines may be 225 μm, and the width of the seam between two adjacent sub-ground lines may be 50 μm. Thus, the first ends of the sub-connection lines are electrically connected to the bonding electrodes, the second ends are electrically connected to the sub-power signal lines (or sub-ground lines), and the second ends of the sub-connection lines may have the same width as the sub-power signal lines (or sub-ground lines), and thus, the second ends of the sub-connection lines may have a width of 225 μm and a pitch of 50 μm.
Next, the width and spacing of the sub-connection lines at the first end are determined. Referring to fig. 5, each of the bonding electrodes has a width of about 70 μm, a distance between two adjacent bonding electrodes is about 60 μm, and a width of a repetition period is 130 μm, that is, a total width of 14 bonding electrodes corresponding to one power signal line (or ground line) and 13 pitches is about: 14 × 70+13 × 60 is 1760(μm), and the minimum line width of the diagonal portions in the connecting wires corresponding to the power signal wires and the ground wires is 1800 μm, so if the width of the first end 300 of the sub-connecting wire is the same as the width of the bonding electrode, the circuit requirements cannot be satisfied. Therefore, the first end 300 of the sub-connection line needs to be widened, and assuming that the width of the first end 300 of the sub-connection line is m and the distance between two adjacent sub-connection lines is m, the formula can be obtained: 14m +13n ≧ 1800(μm), in order to avoid short-circuiting between adjacent bonding electrodes, it is necessary to ensure that the repetition period of the sub-connection lines is the same as the repetition period width of the bonding electrodes, i.e., m + n ≧ 130(μm). Two sets of solutions were calculated: m is 115 μm, n is 15 μm; or m is 110 μm and n is 20 μm. Considering that the actually prepared line width is slightly narrower than the designed line width due to the influence of the process in the manufacturing process, m is 115 μm, and n is 15 μm, so as to ensure that the finally formed connecting line can meet the circuit requirement.
Referring to fig. 5 and 6 again, according to the line width and line distance of the sub-connection lines determined by the design requirements, 14 sub-connection lines need to be connected with 14 sub-power signal lines 1010 and corresponding 14 bonding electrodes, and 14 sub-connection lines need to be connected with 14 sub-ground lines 1020 and corresponding 13 bonding electrodes, and the structure after connection may be as shown in fig. 7. As can be seen from fig. 7, the power signal line 101 and the ground line 102 are connected to the bonding region B through sub-connection lines 300, and the power supply line 103 is connected to the bonding region B through connection lines 30.
It should be noted that, in fig. 7, the line widths of the power signal line 101 and the ground line 102 are wider, the power signal line 101 and the ground line 102 are respectively connected to the bonding region B through a plurality of sub-connecting lines 300, and since the sub-connecting lines 300 are denser, the sub-connecting lines 300 are illustrated in fig. 7 for clarity, the sub-connecting lines 300 connected to the power signal line 101 (or the ground line 102) are represented by 3 sub-connecting lines 300, and the number of the sub-connecting lines 300 actually connected to the power signal line 101 (or the ground line 102) may be more than 3, for example, may be 14.
Since the line width of the power supply line 103 is narrow, the power supply line 103 can be connected to the corresponding bonding electrode in the bonding region B through one connection line 30.
Fig. 8 is an enlarged schematic view of the power signal line 101 and the ground line 102 of fig. 7 connected to the corresponding bonding electrodes through a plurality of sub-connection lines 300. Specifically, the sub-connection line 300 may include: the first sub straight line portion 3001, the sub diagonal line portion 3002, and the second sub straight line portion 3003, where 204 denotes a plurality of bonding electrodes corresponding to the power signal line 101, 201 denotes a plurality of bonding electrodes corresponding to the ground line 102, and 2030 denotes a floating electrode that the ground line 102 borrows in the wire design process.
Fig. 9 is an enlarged schematic view of a region Q1 in fig. 7, in which 31 denotes a plurality of sub-connection lines 300 connected to power signal lines, 32 denotes a plurality of sub-connection lines 300 connected to ground lines and one sub-connection line 300 ', 300' denotes a sub-connection line corresponding to a floating electrode, and 33 denotes a connection line 30 connected to a power supply line.
Fig. 10 is an enlarged schematic view of a region Q2 in fig. 7, where 204 denotes 14 bonding electrodes connected to a power signal line, 201 denotes 13 bonding electrodes connected to a ground line, 202 denotes a bonding electrode connected to a power supply line, and 203 denotes a floating electrode.
Fig. 11 is an enlarged schematic view of a region Q3 in fig. 7, as shown in fig. 11, in order to avoid the floating electrode from affecting the normal operation of the signal line and simultaneously avoid the signal crosstalk and other disadvantages between the ground line and the power supply line, in the connection process, the sub-connection line 300 'corresponding to the floating electrode in the plurality of sub-connection lines 300 corresponding to one ground line cannot be electrically connected to the floating electrode, and therefore the sub-connection line 300' needs to be connected to the bonding electrode closest to the floating electrode, and share the same first straight line portion 3001 to be electrically connected to the bonding electrode. That is, the structure shown in the dashed box of fig. 11 includes sub diagonal portions 3002 and 3002' that are parallel to and spaced apart from each other, but only one sub straight portion 3001. Thereby it is ensured that each sub-connection line connected to one ground line is connected to a binding electrode transmitting an effective electrical signal, thereby avoiding the sub-connection lines being connected to suspended electrodes.
And finally, combining a plurality of sub-connecting lines connected with one signal line into a connecting line. In the aforementioned process of dividing the signal line into sub-signal lines corresponding to the number of the bonding electrodes and satisfying the minimum line width requirement, and then designing the sub-connection lines to realize corresponding connection paths with the bonding electrodes, there is a spacing between adjacent sub-signal lines, for example, a spacing of about 15 μm. In view of this, it is necessary to combine sub-connecting lines connected to the same signal line into a unitary structure without a hollowed-out area (i.e., pitch). Specifically, as shown in fig. 8, the outer contours of the two outermost sub-connection lines among the sub-connection lines connected to the same ground line 102 may be obtained and formed into a closed shape to obtain the pattern of the connection line 30. Fig. 12 is an enlarged schematic view of the connection line 30 shown in the region Q1 in fig. 7 obtained by connecting the outer contours of the sub-connection lines 300 in fig. 9, and the connection lines are connected to the power signal line 101, the ground line 102, and the power supply line 103 in this order from left to right.
Fig. 13 is an enlarged schematic view of the power signal line 101 and the ground line 102 connected to the corresponding bonding electrodes 20 via the connection wires 30. As shown in fig. 13, in the finally obtained fan-out region, the minimum line width of the diagonal portion in the connecting line 30 corresponding to the power signal line 101 substantially coincides with the minimum line width of the diagonal portion in the connecting line 30 corresponding to the ground line 102, and the line width L3 of the first straight portion in the connecting line corresponding to the power signal line 101 differs from the line width L4 of the first straight portion in the connecting line 30 corresponding to the ground line 102 by not more than 2 widths of the first sub-straight portions.
In some embodiments, the step of "merging a plurality of sub-connection lines connected to one signal line into a connection line" may not be performed, that is, the connection between one signal line and a corresponding plurality of bonding electrodes is realized by directly using the plurality of sub-connection lines, and the sum of the line widths of the diagonal portions of the plurality of connection lines corresponding to different signal lines is substantially the same, for example, the sum of the line widths of the diagonal portions of the plurality of sub-connection lines corresponding to the power signal line is substantially the same as the sum of the line widths of the diagonal portions of the sub-connection lines corresponding to the ground line.
It should be noted that, in the above wiring design process provided in the embodiment of the present invention, by using the floating electrodes adjacent to the bonding electrodes corresponding to the ground lines, it is assumed that the number of the bonding electrodes corresponding to the power signal lines is the same as the number of the bonding electrodes corresponding to the ground lines, so that the minimum widths of diagonal portions in the connecting lines corresponding to the power signal lines and the ground lines are substantially the same in the fan-out region obtained after the wiring design. In the specific implementation, in the wiring design process, when the number of the binding electrodes corresponding to the power signal lines and the grounding is the same, the wiring design can be directly carried out without using suspended electrodes.
Referring to fig. 1, the length of the diagonal portion of the connecting line 30 close to the symmetry axis P is shorter than the diagonal portions of the connecting lines 30 on both sides, so that the resistance of the connecting lines 30 on both sides and the resistance of the connecting lines 30 close to the symmetry axis P have a certain difference, and in order that the resistance ratio between the signal transmission channels corresponding to each connecting line 30 is within a preset range to reduce the signal delay, the embodiment of the present invention at least adopts the following manner to implement the equal resistance design of each connecting line 30.
The first method is as follows:
as shown in fig. 14, the auxiliary connection lines 50 are disposed at least at the connection lines 30 at two side positions, and the auxiliary connection lines 50 and the corresponding connection lines 30 form a double-layer parallel wiring, for example, the auxiliary connection lines 50 may be disposed at positions where the oblique line portions of the corresponding connection lines 30 are located, and in order to avoid the auxiliary connection lines 50 occupying the space of the fan-out region F, the auxiliary connection lines 50 and the connection lines 30 may be disposed in different layers, and in order to save the manufacturing cost, the auxiliary connection lines 50 and other metal film layers in the driving backplane may be disposed in the same layer.
In order to further reduce the resistance difference of the connection lines 30 in the fan-out region F, the auxiliary connection lines 50 may be disposed at the connection lines 30 at the two side positions, and the auxiliary connection lines 50 are not disposed at the connection lines 30 near the symmetry axis P, that is, the connection lines 30 at the middle position are single-layer wires, and the length of the auxiliary connection lines 50 gradually decreases along the direction from the two side positions to the center position.
The second method comprises the following steps:
as shown in fig. 15, while the minimum line width of the diagonal portion of the connection line 30 is ensured to satisfy the circuit design requirement, the polygonal line structure 60 is provided at least in the connection portion 30 near the symmetry axis P, and the polygonal line structures 60 included in the connection line 30 are gradually reduced in the direction from the center position to the both side positions, for example, the number of the polygonal line structures 60 may be gradually reduced, or the size of the polygonal line structure 60 may be gradually reduced. The fold line structure 60 may be provided at any position of the diagonal line portion, the first straight line portion, or the second straight line portion in the connection line 30.
It should be noted that fig. 15 is only for illustrating the approximate position of the broken line structure 60, and the size and shape of the connection line 30 are not limited, and the size (e.g., line width) and shape of the connection line 30 still satisfy the definition in the embodiment of the present invention.
In the embodiment of the present invention, the above-mentioned first and second modes are taken as examples to illustrate the design of the equal resistance of each connection line, and in order to make the resistances of the connection lines uniform, the above-mentioned first and second modes may be combined, that is, the auxiliary connection line 50 may be provided at least at the connection line 30 at the two sides, and the broken line structure 60 may be provided at least at the connection portion 30 near the symmetry axis P, or other modes may be adopted as long as the resistances of the connection lines can be made uniform, which is not limited herein.
According to the driving back plate and the display device provided by the embodiment of the invention, the signal wires are electrically connected with the corresponding binding electrodes by arranging the connecting wires, the line width of at least one of the connecting wires is gradually increased in the direction that the first end of the connecting wire points to the second end, and at least one of the connecting wires comprises the first straight wire part and the inclined wire part.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.

Claims (20)

1. A drive backplate, comprising: the semiconductor device comprises a substrate, a plurality of signal lines, a plurality of binding electrodes and a plurality of connecting lines, wherein the signal lines, the binding electrodes and the connecting lines are arranged on the substrate;
at least one of the plurality of signal lines extends in a first direction;
a first end of any one of the plurality of connection lines is electrically connected to at least one of the plurality of bonding electrodes, and a second end is electrically connected to one of the plurality of signal lines;
a line width of at least one of the plurality of connection lines at the first end is smaller than a line width at the second end;
at least one of the plurality of connection lines, comprising: the first straight line part extends along the first direction, and the oblique line part has a certain included angle with the first direction in the extending direction;
one end of the first straight line part is electrically connected with the binding electrode; the other end of the first straight line part is electrically connected with the signal line through the inclined line part.
2. The driving backplane of claim 1, wherein the driving backplane comprises a plurality of rows of light emitting areas arranged in sequence along a first direction;
at least one of the connecting lines has an overlap with an orthographic projection of a first row of light-emitting areas on the substrate, and the first row of light-emitting areas is the light-emitting area closest to one side of the substrate, on which the binding electrode is arranged, among the plurality of rows of light-emitting areas.
3. The driving backplate according to any one of claims 1 or 2, wherein the line width of the diagonal portion in a direction perpendicular to the direction in which the first end of the connecting line points toward the second end thereof gradually increases, and the line width of the diagonal portion is greater than or equal to the line width of the first linear portion.
4. The driving backplate of claim 1, wherein the first straight line portion of at least one of the plurality of connection lines includes two sub-side edges along the first direction, and wherein the first straight line portion has a uniform width perpendicular to the first direction at portions corresponding to overlapping regions of projections of the two sub-side edges in the first direction, respectively.
5. The driving backplate of claim 4, wherein in a second direction, the length of each of the first linear portions in the first direction increases and then decreases; the second direction is a direction perpendicular to the first direction.
6. The driving back plate of claim 5, wherein in the second direction, the lengths of the plurality of first linear portions in the first direction are symmetrically distributed along the symmetry axis of the first direction.
7. The driving backplate of claim 6, wherein, on one side of the axis of symmetry, one of the two sub-sides of each of the first linear portions that is closer to the axis of symmetry has a length greater than or equal to that of the other sub-side, and any two of the first linear portions arranged in the second direction have either one of the two sub-sides of one of the first linear portions that is closer to the axis of symmetry greater than or equal to either one of the two sub-sides of the other first linear portion.
8. The driving backplate of claim 1, wherein at least one of the plurality of connecting wires further comprises: a second linear portion extending in the first direction;
the diagonal part is electrically connected with the signal wire through the second straight line part;
the line width of the second straight line portion is greater than or equal to the line width of the diagonal line portion.
9. The driving backplate of claim 8, wherein the second linear portion of at least one of the plurality of connecting lines includes two sub-sides along the first direction, and the width of the second linear portion in the direction perpendicular to the first direction is uniform at a portion of the second linear portion corresponding to an overlapping area of projections of the two sub-sides in the first direction, respectively.
10. The driving back plate of claim 9, wherein in a second direction, the length of each of the second linear portions in the first direction tends to decrease and then increase; the second direction is a direction perpendicular to the first direction.
11. The drive backplate of claim 10, wherein the length of each of the second linear portions in the second direction along the axis of symmetry is symmetrically distributed.
12. The driving backplate of claim 11, wherein on one side of the axis of symmetry, a length of one of the two sub-sides of each of the second linear portions that is closer to the axis of symmetry is less than or equal to a length of the other sub-side, and wherein any two of the second linear portions arranged in the second direction, any one of the two sub-sides of one of the second linear portions that is closer to the axis of symmetry, is less than or equal to any one of the two sub-sides of the other second linear portion.
13. The driving backplane of claim 1, wherein a line width of the connection line at the second end is identical to a line width of the signal line.
14. The driving backplane of claim 1, wherein a line width of the connection line at the first end is greater than a width of each of the bonding electrodes of the corresponding connection.
15. The driving backplane of claim 1, wherein the line width of the signal line is 20 to 130 times the line width of the bonding electrode.
16. The driving backplane of claim 1, wherein the plurality of signal lines comprises: a plurality of power signal lines and a plurality of ground lines;
the driving back plate further comprises: a plurality of connection electrodes arranged in pairs to be bonded with the light emitting diodes;
one of the connection electrodes provided in a pair is electrically connected to the power signal line, and the other is electrically connected to the ground line.
17. The driving backplane of claim 16, wherein a minimum line width of the diagonal portion electrically connected to at least one of the plurality of power signal lines is the same as a minimum line width of the diagonal portion electrically connected to at least one of the plurality of ground lines.
18. The driving backplane of claim 17, wherein a ratio of a line width of the power signal lines to a line width of the ground lines is between 0.18: 1.1, the line width of the power signal line or the line width of the ground line is 20-125 times the width of the binding electrode.
19. The driving backplane of claim 18, wherein a ratio of a line width of the power signal lines to a line width of the ground lines is between 0.9: 1.1, the difference between the number of the binding electrodes electrically connected to the power signal line and the number of the binding electrodes electrically connected to the ground line is not more than 2.
20. A display device, comprising: the driving backplane of any of claims 1 to 19, and a plurality of light emitting diodes electrically connected to the driving backplane.
CN202011038435.7A 2020-09-24 2020-09-28 Driving back plate and display device Pending CN114255666A (en)

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CN115315812A (en) * 2022-06-29 2022-11-08 京东方科技集团股份有限公司 Display substrate and display device

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WO2022227058A1 (en) * 2021-04-30 2022-11-03 京东方科技集团股份有限公司 Display substrate and display device
WO2022241747A1 (en) * 2021-05-21 2022-11-24 京东方科技集团股份有限公司 Display substrate and preparation method therefor, and display apparatus
CN116264233A (en) * 2021-12-15 2023-06-16 合肥京东方瑞晟科技有限公司 LED driving backboard and display device
CN114442384B (en) * 2022-01-26 2023-01-24 绵阳惠科光电科技有限公司 Array substrate and display panel

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115315812A (en) * 2022-06-29 2022-11-08 京东方科技集团股份有限公司 Display substrate and display device
CN115315812B (en) * 2022-06-29 2023-09-01 京东方科技集团股份有限公司 Display substrate and display device

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