CN114245622A

CN114245622A - Online compression fittings of high strength multilayer circuit board

Info

Publication number: CN114245622A
Application number: CN202111679152.5A
Authority: CN
Inventors: 侯柏林; 张方阳; 李建发
Original assignee: Huizhou City Vocational College (huizhou Business And Tourism Advanced Vocational And Technical School)
Current assignee: Huizhou City Vocational College (huizhou Business And Tourism Advanced Vocational And Technical School)
Priority date: 2021-12-31
Filing date: 2021-12-31
Publication date: 2022-03-25
Anticipated expiration: 2041-12-31
Also published as: CN114245622B

Abstract

The invention relates to an online laminating device for a high-strength multilayer circuit board, which comprises a rack, a laminating component, a driver, a plurality of supporting columns, a plurality of rubber blocks and a plurality of elastic pieces, wherein the rack is provided with a plurality of supporting columns; the driver is arranged on the frame; the pressing assembly comprises a pressing plate and a base plate, a driver is in driving connection with the pressing plate, the base plate and the pressing plate are oppositely arranged, the base plate is connected with the rack, the driver is used for driving the pressing plate to be close to or far away from the base plate, and the pressing plate is a first rubber plate; each support column arch sets up in the one side of base plate orientation clamp plate, each support column is the matrix and arranges, flexible chamber has been seted up to the one end of each support column, each rubber block arch is provided with connecting portion, each elastic component sets up in a flexible intracavity, each connecting portion insert locate a flexible intracavity, elastic component one end is connected with connecting portion, the other end and the bottom in flexible chamber of elastic component are connected, make each rubber block form independent subregion on the base plate, can adapt to and fix a position the multilayer circuit board of different specifications, thereby compression fittings's suitability has been improved.

Description

Online compression fittings of high strength multilayer circuit board

Technical Field

The invention relates to the technical field of circuit board production, in particular to a high-strength multilayer circuit board online pressing device.

Background

The multilayer circuit board is a product of the development of electronic technology towards high speed, multifunction, large capacity and small volume. With the continuous development of electronic technology, especially the wide application of large-scale and super-large-scale integrated circuits, the multilayer circuit board is rapidly developing in the direction of high density, high precision and high numeralization to generate the technologies of micro-fine lines, small aperture penetration, blind hole buried hole, high board thickness aperture ratio and the like so as to meet the market demand.

In the production and processing process of the multilayer circuit board, a plurality of circuit boards and a plurality of insulating layers need to be stacked and fixed on a laminating machine at intervals, and then the laminating operation is carried out to obtain the multilayer circuit board.

In order to ensure that the multilayer circuit board can be well pressed on the insulating layer, the stability between the circuit board and the insulating layer can be achieved only by applying larger force, so that the pressing plate is easy to sideslip with the contact surface of the circuit board under larger pressure, the surface of the circuit board is easy to generate traces, and the smoothness and the flatness of the surface of the multilayer circuit board are reduced.

Therefore, how to enable the pressing device to ensure the pressing quality of the multilayer circuit board and ensure the surface of the multilayer circuit board to be smooth and even is a problem which needs to be solved at present.

Disclosure of Invention

In view of the above, it is necessary to provide a die laser welding apparatus.

The technical scheme for solving the technical problems is as follows:

a high-strength multilayer circuit board online pressing device comprises a rack, a pressing component, a driver, a plurality of supporting columns, a plurality of rubber blocks and a plurality of elastic pieces;

the driver is arranged on the frame;

the pressing assembly comprises a pressing plate and a substrate, the driver is in driving connection with the pressing plate, the substrate is arranged opposite to the pressing plate, the substrate is connected with the rack, the driver is used for driving the pressing plate to be close to or far away from the substrate, and the pressing plate is a first rubber plate;

each support column protrusion is arranged on one surface, facing the pressing plate, of the base plate, each support column is arranged in a matrix mode, a telescopic cavity is formed in one end of each support column, each rubber block protrusion is provided with a connecting portion, each elastic piece is arranged in one telescopic cavity, each connecting portion is inserted in one telescopic cavity, one end of each elastic piece is connected with the corresponding connecting portion, and the other end of each elastic piece is connected with the bottom of the corresponding telescopic cavity.

In one embodiment, the distance between the rubber blocks is 0.2cm-0.8 cm.

In one embodiment, still include a plurality of centre gripping subassemblies, the material of centre gripping subassembly is rubber, the centre gripping subassembly includes first grip block, second grip block, third grip block and fourth grip block, first grip block, second grip block, third grip block and fourth grip block set up respectively in the outside of rubber block, first grip block, second grip block, third grip block and fourth grip block are used for the fixed of work piece.

In one embodiment, the first clamping block and the second clamping block are respectively provided with a first arc-shaped part and a second arc-shaped part, and the first clamping block and the second clamping block are arranged in parallel relatively.

In one embodiment, the third clamping block and the fourth clamping block are respectively provided with a third arc-shaped part and a fourth arc-shaped part, and the third clamping block and the fourth clamping block are arranged in parallel relatively.

In one embodiment, the shape of each of the rubber blocks includes any one of a square, a rectangle, and a hemisphere.

In one embodiment, the guide assembly further comprises a first guide column and a second guide column, the first guide column and the second guide column are arranged on the frame at intervals, and the pressing plate is movably arranged on the first guide column and the second guide column.

In one embodiment, the device further comprises a connecting plate, the driver is in driving connection with the connecting plate, and the pressing plate is detachably connected with the connecting plate.

In one embodiment, the pressing plate further comprises a nut, the pressing plate is provided with a bolt, the connecting plate is provided with a through hole, and one end of the bolt penetrates through the through hole and is in threaded connection with the nut.

In one embodiment, the substrate processing apparatus further comprises a pressure sensor disposed on the substrate, the pressure sensor being configured to detect a pressure between the platen and the substrate.

Compared with the prior art, the invention has at least the following advantages:

1. the driver is connected with the clamp plate drive, make the clamp plate can be with multilayer circuit board pressfitting on the base plate under the driver drive, in order to ensure the pressfitting quality of compression fittings to multilayer circuit board, need increase the pressfitting power of clamp plate to multilayer circuit board, because the clamp plate is first rubber slab, first rubber slab has good elasticity, wet-skid resistance and wearability, make the clamp plate can take place deformation under the effect of great pressure, and be difficult to take place the phenomenon of sideslipping with multilayer circuit board and produce the vestige, the smooth roughness on multilayer circuit board surface has been ensured, thereby satisfy the production demand of high accuracy multilayer circuit board.

2. Each supporting column bulge is arranged on one surface of the substrate facing the pressing plate, and each supporting column is arranged in a matrix on the substrate, so that each supporting column can realize independent partition on the substrate, each supporting column is provided with a telescopic cavity, so that the elastic piece can be arranged in the telescopic cavity, each rubber block bulge is provided with a connecting part, so that the connecting part of each rubber block can be inserted in the corresponding telescopic cavity, so that each elastic piece can be compressed and deformed in the telescopic cavity under the pressing action of the pressing plate, when the multilayer circuit board is placed on part of the rubber blocks through a manipulator for pressing, a plurality of rubber blocks in contact with the multilayer circuit board can be sunken under the action of pressure, and the height of the rubber blocks not in contact with the multilayer circuit board can not be changed, so that the plurality of rubber blocks which are sunken can form a containing groove with the rubber blocks which are not sunken, make multilayer circuit board block well in the storage tank, avoided multilayer circuit board to appear sideslip the phenomenon of aversion at the pressfitting in-process, ensured the effect of pressfitting.

3. Each rubber block and the pressing plate are made of rubber, so that in the pressing process, the rubber can comprehensively protect the multilayer circuit board, scratches on the surface of the multilayer circuit board are avoided, and the multilayer circuit board can meet the high-precision production requirement.

4. Through being connected each rubber block and each support column one-to-one to make each rubber block can be the matrix and arrange on the base plate, and form independent subregion on the base plate, can adapt to and fix a position the multilayer circuit board of different specifications, avoided in the traditional compression fittings need frequently change the phenomenon of different anchor clamps to the multilayer circuit board of multiple different specifications, thereby improved compression fittings's suitability.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.

Fig. 1 is a schematic structural view of a high-strength multilayer circuit board on-line laminating device according to an embodiment of the present invention in one direction;

FIG. 2 is a schematic structural view of a high-strength multi-layer circuit board on-line bonding apparatus according to another direction in one embodiment of the present invention;

FIG. 3 is a schematic diagram of a connection structure of a rubber block and a supporting pillar of the high-strength multilayer circuit board on-line laminating device according to an embodiment of the present invention;

FIG. 4 is a schematic structural diagram of the on-line laminating apparatus for high-strength multi-layer circuit boards in FIG. 1, showing the connection between each rubber block, each supporting post, each clamping assembly and the substrate, according to an embodiment of the present invention;

FIG. 5 is a schematic view of a connection structure of a rubber block, a supporting pillar and a clamping assembly of the high-strength multilayer circuit board on-line laminating device according to an embodiment of the present invention;

FIG. 6 is a schematic view of a portion of A in FIG. 1;

fig. 7 is a partial structural diagram of B in fig. 4.

In the drawings, 10, a press fitting device; 100. a frame; 110. an installation part; 200. pressing the components; 210. pressing a plate; 211. a bolt; 220. a substrate; 300. a driver; 400. a support pillar; 410. a telescoping chamber; 420. an external thread; 500. a rubber block; 510. a connecting portion; 600. an elastic member; 700. a clamping assembly; 710. a first clamping block; 711. a first arcuate portion; 720. a second clamping block; 721. a second arcuate portion; 730. a third clamping block; 731. a third arc-shaped portion; 740. a fourth clamping block; 741. a fourth arc-shaped portion; 800. a guide assembly; 810. a first guide post; 820. a second guide post; 900. a connecting plate; 910. an anti-collision block; 911. a first anti-collision block; 912. a second anti-collision block; 920. a pressure sensor; 930. and a nut.

Detailed Description

To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

In one embodiment, as shown in fig. 1 to 7, an in-line laminating apparatus 10 for high-strength multi-layer circuit boards includes a frame 100, a laminating assembly 200, a driver 300, a plurality of supporting columns 400, a plurality of rubber blocks 500, and a plurality of elastic members 600; the driver 300 is disposed on the rack 100; the pressing assembly 200 comprises a pressing plate 210 and a substrate 220, the driver 300 is in driving connection with the pressing plate 210, the substrate 220 is arranged opposite to the pressing plate 210, the substrate 220 is connected with the frame 100, the driver 300 is used for driving the pressing plate 210 to approach or leave the substrate 220, and the pressing plate 210 is a first rubber plate; each supporting column 400 is convexly arranged on one surface of the substrate 220 facing the pressing plate 210, each supporting column 400 is arranged in a matrix, one end of each supporting column 400 is provided with a telescopic cavity 410, each rubber block 500 is convexly provided with a connecting part 510, each elastic part 600 is arranged in one telescopic cavity 410, each connecting part 510 is inserted in one telescopic cavity 410, one end of each elastic part 600 is connected with the connecting part 510, and the other end of each elastic part 600 is connected with the bottom of the telescopic cavity 410.

In this embodiment, the frame 100 not only can provide the support for each part, and the mounting groove has been seted up to the frame 100 for pressing components 200, a plurality of support columns 400, a plurality of lumps of rubber 500 and a plurality of elastic component 600 can be placed in the mounting groove, make each part can not expose outside the mounting groove, have ensured the neatness of compression fittings 10 all around edge, have avoided exposing the part and have aroused phenomenons such as personnel's scratch or fall.

In this embodiment, driver 300 and clamp plate 210 drive connection, specifically, frame 100 arch is provided with installation department 110, and installation department 110 has seted up movable chamber, and clamp plate 210 is provided with the movable rod, and the movable rod is worn to establish movable intracavity, and the power take off end of driver 300 penetrates movable chamber for driver 300 can be connected with the movable rod drive, in this embodiment, driver 300 includes the pneumatic cylinder, through setting up driver 300 to the pneumatic cylinder, can provide the power supply, thereby makes driver 300 can drive the motion of clamp plate 210, and then, realizes the drive to clamp plate 210. In still other embodiments, the drive 300 may also be a motor.

In this embodiment, the substrate 220 and the pressing plate 210 are disposed opposite to each other, so that a pressing structure can be formed between the substrate 220 and the pressing plate 210, and the pressing plate 210 can press the multilayer circuit board on the substrate 220 under the driving of the driver 300, thereby implementing the pressing operation of the multilayer circuit board.

It is worth mentioning, in order to ensure the pressfitting quality of compression fittings 10 to the multilayer circuit board, need increase clamp plate 210 to the pressfitting power of multilayer circuit board, because clamp plate 210 is first rubber slab, first rubber slab has good elasticity, wet skid resistance and wearability, make clamp plate 210 can take place deformation under the effect of great pressure, and be difficult to take place the phenomenon of sideslipping with the multilayer circuit board and produce the vestige, the smooth roughness on multilayer circuit board surface has been ensured, thereby satisfy the production demand of high accuracy multilayer circuit board.

It can be understood that, each support column 400 is convexly arranged on one side of the substrate 220 facing the press plate 210, and each support column 400 is arranged in a matrix on the substrate 220, so that each support column 400 can realize independent partition on the substrate 220, one end of each support column 400 is provided with a telescopic cavity 410, so that the elastic member 600 can be arranged in the telescopic cavity 410, each rubber block 500 is convexly provided with a connecting part 510, so that the connecting part 510 of each rubber block 500 can be inserted in the corresponding telescopic cavity 410, so that each elastic member 600 can be compressed and deformed in the telescopic cavity 410 under the pressing action of the press plate 210, when the multilayer circuit board is placed on part of the rubber blocks 500 by a manipulator for pressing, a plurality of rubber blocks 500 contacting with the multilayer circuit board can be sunken under the action of pressure, and the height of the rubber blocks 500 not contacting with the multilayer circuit board can not be changed, thereby make a plurality of rubber blocks 500 that take place to cave in can form a storage tank with the rubber block 500 that does not take place to cave in for multilayer circuit board can block well in the storage tank, has avoided multilayer circuit board to appear sideslip the phenomenon of aversion at the pressfitting in-process, has ensured the effect of pressfitting.

It can be understood that the pressing plate 210 is a first rubber plate, so that each rubber block 500 and the pressing plate 210 are made of rubber, and in the pressing process, the rubber can comprehensively protect the multilayer circuit board, thereby avoiding scratching the surface of the multilayer circuit board, and further enabling the multilayer circuit board to meet the high-precision production requirement.

It should be further noted that, as shown in fig. 1, fig. 4, fig. 6 and fig. 7, the rubber blocks 500 are correspondingly connected to the supporting pillars 400, so that the rubber blocks 500 can be arranged on the substrate 220 in a matrix, and independent partitions are formed on the substrate 220, which can be adapted to positioning multi-layer circuit boards of different specifications, thereby avoiding the phenomenon that different clamps are frequently replaced for multi-layer circuit boards of different specifications in the conventional press-fitting device 10, and improving the applicability of the press-fitting device 10.

In this embodiment, the elastic member 600 is a spring. It can be understood that, by arranging the elastic member 600 as a spring, the elastic member 600 has good elasticity and can be compressed and deformed in the expansion chamber 410 under the pressing effect, so that each rubber block 500 can be depressed, and when the pressing force applied to each rubber block 500 disappears, each elastic member 600 returns to normal, so that each rubber block 500 returns to the original height for the next pressing operation.

To ensure that the pressing plate 210 can press the multilayer circuit board better, in one embodiment, the first rubber plate includes any one of an ethylene propylene diene monomer rubber plate, a silicone rubber plate and a fluorine rubber plate. It can be understood that the first rubber plate is set to be one of an ethylene propylene diene monomer rubber plate, a silicon rubber plate or a fluorine rubber plate, and the ethylene propylene diene monomer rubber plate, the silicon rubber plate or the fluorine rubber plate has good hardness, elasticity, wet skid resistance and low abrasion resistance, so that the pressing plate 210 has small friction force with the multilayer circuit board in the pressing process, and the multilayer circuit board can be well protected.

To ensure that the pressing plate 210 can press the multilayer circuit board better and can not scratch the surface of the multilayer circuit board. In one embodiment, the first rubber plate comprises the following components in parts by mass: 80-90 parts of ethylene propylene diene monomer rubber plate, 30-40 parts of carbon black, 40-50 parts of walnut shell abrasive, 4-5 parts of chromium powder, 4-5 parts of zinc oxide, 1-1.5 parts of stearic acid, 0.8-1.5 parts of anti-aging agent, 1.5-2 parts of vulcanizing agent, 1-1.2 parts of accelerator and 6-8 parts of silane coupling agent. It can be understood that the added ethylene propylene diene monomer rubber plate has higher hardness and certain elasticity, the walnut shell abrasive is a barreled material, the barreled material is added into the ethylene propylene diene monomer rubber plate, and the first rubber plate made of other auxiliary materials has better hardness, elasticity, wet-skid resistance and lower wearability, so that the pressing plate 210 can be ensured to better press the multilayer circuit board and can not scratch the surface of the multilayer circuit board.

In order to allow each rubber block 500 to be well deformed, the material of the rubber block 500 includes any one of butadiene rubber and styrene-butadiene rubber. It can be understood that, because butadiene rubber and butadiene styrene rubber have certain hardness, and elasticity is fine, so, through each block rubber 500 that adopts butadiene rubber and butadiene styrene rubber to make, when clamp plate 210 carried out the pressfitting to the multilayer circuit board, each block rubber 500 can take place deformation well under the effect of external force to can play fine guard action to the multilayer circuit board.

In order to ensure that each rubber block 500 can be deformed well and will not scratch the surface of the multilayer circuit board. In one embodiment, the rubber block comprises the following components in parts by weight: 90-95 parts of styrene butadiene rubber, 30-40 parts of carbon black, 20-25 parts of walnut grinding material, 3-5 parts of zinc oxide, 1.2-1.5 parts of stearic acid, 1-1.5 parts of anti-aging agent, 1.8-2.5 parts of vulcanizing agent, 1.5-1.8 parts of accelerator and 3-7 parts of silane coupling agent. It can be understood that the added styrene butadiene rubber has high elasticity, the walnut shell abrasive is a roller burnishing material, the walnut shell abrasive is added into the styrene butadiene rubber, and rubber blocks made of other auxiliary materials have high elasticity, wet skid resistance and low abrasion resistance, so that each rubber block 500 can be well deformed and cannot scratch the surface of the multilayer circuit board.

Furthermore, it should be noted that the material of the pressing plate 210 is any one of an epdm rubber plate, a silicone rubber plate and a fluororubber plate, and the material of the rubber blocks 500 is any one of butadiene rubber and styrene butadiene rubber, so that the hardness of the pressing plate 210 is higher than that of each rubber block 500, and the elasticity of each rubber block 500 is higher than that of the pressing plate 210, so that the pressing plate 210 can well press the multilayer circuit board, thereby ensuring the pressing effect of the multilayer circuit board, because each rubber block 500 has better elasticity, on one hand, the plurality of rubber blocks 500 contacting the multilayer circuit board can be recessed better and faster, on the other hand, the depth of a containing groove formed by the plurality of recessed rubber blocks 500 and the plurality of rubber blocks 500 not recessed is increased, so that the multilayer circuit board can be better clamped in the containing groove by increasing the depth of the containing groove, the phenomenon that the multilayer circuit board sideslips and shifts in the pressfitting in-process has effectively been avoided, has ensured the effect of pressfitting, in addition, can also play fine guard action to the surface of multilayer circuit board to satisfy the demand of high accuracy production.

In order to fix the rubber blocks 500 to the multilayer circuit board well, in one embodiment, the distance between the rubber blocks 500 is 0.2cm to 0.8 cm. It can be understood that, by setting the distance between the rubber blocks 500 to 0.2cm-0.8cm, the gap between adjacent rubber blocks 500 is smaller, so that the rubber blocks 500 which are not recessed are closer to the outer side of the multilayer circuit board, and the rubber blocks 500 which are not recessed can better fix the peripheral edge of the multilayer circuit board.

In order to make the plurality of rubber blocks 500 form a matrix partition with small gaps and regular alignment on the substrate 220, in one embodiment, the shape of each rubber block 500 includes any one of a square, a rectangle and a hemisphere. It can be understood that the shapes of the rubber blocks 500 are set to be square, rectangular and hemispherical, so that the shapes of the rubber blocks 500 are regular and neat, and a matrix partition with a small gap and regular and neat can be formed with numerous regular rubber blocks 500, so that the rubber blocks 500 can be neatly arranged on the substrate 220 and form independent partitions, on one hand, the pressing device can adapt to positioning of multilayer circuit boards with different specifications, and avoids the phenomenon that different clamps are frequently replaced for the multilayer circuit boards with different specifications in the conventional pressing device 10, thereby improving the applicability of the pressing device 10, on the other hand, the recessed rubber blocks 500 and the non-recessed rubber blocks 500 form accommodating grooves which also have regular and neat and no edge angles, thereby better positioning the multilayer circuit boards and avoiding the phenomenon of side slipping, and can also effectively avoid scraping the multilayer circuit board, thereby playing a good role in protecting the surface of the multilayer circuit board.

In order to fix the outer side of the multilayer circuit board well, in an embodiment, as shown in fig. 4 and 5, the multilayer circuit board further includes a plurality of clamping assemblies 700, the clamping assemblies 700 are made of rubber, the clamping assemblies 700 include a first clamping block 710, a second clamping block 720, a third clamping block 730 and a fourth clamping block 740, the first clamping block 710, the second clamping block 720, the third clamping block 730 and the fourth clamping block 740 are respectively disposed on the outer side of the rubber block 500, and the first clamping block 710, the second clamping block 720, the third clamping block 730 and the fourth clamping block 740 are used for fixing a workpiece.

It can be understood that, by providing the first clamping block 710, the second clamping block 720, the third clamping block 730 and the fourth clamping block 740 on the first side wall, the second side wall and the fourth side wall of each rubber block 500, each rubber block 500 can drive the first clamping block 710, the second clamping block 720 and the fourth clamping block 740 to be able to displace towards one end close to the supporting column 400 when the rubber block 500 is recessed, so that the first clamping block 710, the second clamping block 720 and the fourth clamping block 740 on the rubber block 500 which is not recessed can be protruded out of the side wall of the accommodating groove, and thus, the first clamping block 710, the second clamping block 720 and the fourth clamping block 740 can form limiting blocks in the accommodating groove, so that the first clamping block 710, the second clamping block 720 and the fourth clamping block 740 can form limiting blocks in the accommodating groove, and the first clamping block 710, the second clamping block 720, the second clamping block, The second holding block 720 and the fourth holding block 740 can fix the outer side of the multilayer circuit board well.

Further, in order to achieve better fixation of the multilayer circuit board, in one embodiment, as shown in fig. 5, the first clamping block 710 and the second clamping block 720 are respectively provided with a first arc-shaped part 711 and a second arc-shaped part 721, and the first clamping block 710 and the second clamping block 720 are arranged in parallel. It can be understood that, by providing the first arc-shaped part 711 and the second arc-shaped part 721 on the first clamping block 710 and the second clamping block 720 respectively, the first arc-shaped part 711 and the second arc-shaped part 721 are arranged in parallel, so that the first arc-shaped part 711 and the second arc-shaped part 721 can be uniformly distributed on two sides of the rubber block 500, so that the first arc-shaped part 711 and the second arc-shaped part 721 are in arc contact with the multilayer circuit board, thereby effectively reducing the friction between the multilayer circuit board and the circuit board, and when the pressing plate 210 presses the multilayer circuit board, the first arc-shaped part 711 and the second arc-shaped part 721 on the un-depressed rubber block 500 can form an accommodating groove with the depressed rubber block 500, so that the first arc-shaped parts 711 and the second arc-shaped parts 721 are distributed on two sides of the wall of the accommodating groove, so that the first arc-shaped parts 711 and the second arc-shaped parts 721 can be quickly deformed under the pressing action of the external force during the pressing action, not only realize spacing to multilayer circuit board, and can play fine protection to multilayer circuit board outside surface.

Further, in one embodiment, as shown in fig. 5, the first arc portion 711 and the second arc portion 721 are concave. It can be understood that, by setting the first arc-shaped part 711 and the second arc-shaped part 721 as the concave shape, it can be understood that the concave shape is a shape formed by the central position of the first clamping block 710 or the second clamping block 720 far away from one side of the rubber block 500 and sinking towards one end close to the rubber block 500, and thus, the concave shape of the first arc-shaped part 711 and the second arc-shaped part 721 can deform more quickly, so that the phenomenon that the outer side surface of the multilayer circuit board is not easily scratched can be better protected, and the production requirement of the high-precision multilayer circuit board can be met.

Further, in order to achieve better fixing of the multilayer circuit board, in one embodiment, the third clamping block 730 and the fourth clamping block 740 are respectively provided with a third arc-shaped portion 731 and a fourth arc-shaped portion 741, and the third clamping block 730 and the fourth clamping block 740 are arranged in parallel and opposite to each other. It can be understood that, by providing the third arc-shaped portion 731 and the fourth arc-shaped portion 741 on the third clamping block 730 and the fourth clamping block 740 respectively, so that the first arc-shaped portion 711, the second arc-shaped portion 721, the third arc-shaped portion 731 and the fourth arc-shaped portion 741 are in arc contact with the multilayer circuit board, friction between the multilayer circuit board and the first arc-shaped portion 711, the second arc-shaped portion 721, the third arc-shaped portion 731 and the fourth arc-shaped portion 741 on the un-recessed rubber block 500 can form a receiving groove with the recessed rubber block 500 when the pressing plate 210 performs a pressing operation on the multilayer circuit board, and so that the plurality of first arc-shaped portions 711, the plurality of second arc-shaped portions 721, the plurality of third arc-shaped portions 731 and the plurality of fourth arc-shaped portions 741 can be distributed on four sides of the wall of the receiving groove, so that the plurality of first arc-shaped portions 711, the plurality of second arc-shaped portions 721, the plurality of second arc-shaped portions 731 and the plurality of fourth arc-shaped portions 741 can be distributed on four sides of the wall of the receiving groove wall of the first arc-shaped portion 711, the plurality of second arc-shaped portions 721 during the pressing operation, The third arc-shaped parts 731 and the fourth arc-shaped parts 741 can be deformed quickly under the extrusion of external force, so that the limitation of the multilayer circuit board is realized, and the outer side surface of the multilayer circuit board can be well protected.

In this embodiment, the widths of the first clamping block 710, the second clamping block 720, the third clamping block 730 and the fourth clamping block 740 are equal to 0.2cm-0.8 cm. It can be understood that, by setting the widths of the first clamping block 710, the second clamping block 720, the third clamping block 730 and the fourth clamping block 740 to be 0.2cm-0.8cm, the first clamping block 710, the second clamping block 720, the third clamping block 730 and the fourth clamping block 740 can be just filled in each gap of each rubber block 500, and the distance between each clamping assembly 700 and each rubber block 500 is reduced, so that the clamping assemblies can be more embedded and distributed on the substrate 220, and thus, when the pressing plate 210 performs a pressing operation on a multilayer circuit board, because the first clamping block 710, the second clamping block 720, the third clamping block 730 and the fourth clamping block 740 are all made of rubber materials, they have certain flexibility and better elasticity, so that each rubber block 500 can not only be compressed and deformed more smoothly on each supporting column 400, but also the first clamping block 710, the third clamping block 730 and the fourth clamping block 740 on the side wall of the accommodating groove can be compressed and deformed more smoothly, The second clamping block 720, the third clamping block 730 and the fourth clamping block 740 can be better positioned with the outer side of the multilayer circuit board.

It should be noted that, the user can calculate the matrix distribution of each rubber block 500 and each clamping assembly 700 according to the area of the actually produced multi-layer circuit board, and in order to improve the accurate positioning of the multi-layer circuit board, the size of each rubber block 500 and the size of each clamping assembly 700 may be set to be small, for example, the size of the rubber block 500 may be 1cm, the size of the first clamping block 710 may be 0.2cm 1cm, the size of the second clamping block 720 may be 0.2cm 1cm, the size of the third clamping block 730 may be 0.2cm 1cm, the size of the fourth clamping block 740 may be 0.2cm 1cm, each rubber block 500, each first clamping block 710, each second clamping block 720, each third clamping block 730, and each fourth clamping block 740 may be uniformly arranged on the substrate 740 in a dense matrix, such that, make the independent subregion that each rubber block 500 and each centre gripping subassembly 700 formed littleer, and more meticulous to more do benefit to the manipulator and place the multilayer circuit board and carry out pinpointing on a plurality of rubber blocks 500 and a plurality of centre gripping subassemblies 700, thereby can carry out the block to the multilayer circuit board and fix.

In order to prevent the pressure plate 210 from shifting during the movement, in one embodiment, the pressure plate further includes a guide assembly 800, the guide assembly 800 includes a first guide column 810 and a second guide column 820, the first guide column 810 and the second guide column 820 are disposed on the frame 100 at an interval, and the pressure plate 210 is movably disposed on the first guide column 810 and the second guide column 820.

It can be understood that, by providing the first guide post 810 and the second guide post 820 on the rack 100, the press plate 210 is correspondingly provided with mounting holes, so that the first guide post 810 and the second guide post 820 can respectively penetrate through the mounting holes of the press plate 210, and the press plate 210 can be movably disposed on the first guide post 810 and the second guide post 820, so that the press plate 210 can reciprocate along the first guide post 810 and the second guide post 820 under the driving of the driver 300, and thus the press plate 210 does not deviate in the moving process, and can well press the multilayer circuit board on each rubber plate.

In order to facilitate the user to mount and dismount the pressing plate 210, in one embodiment, as shown in fig. 1 and 2, the pressing plate further comprises a connection plate 900, the driver 300 is in driving connection with the connection plate 900, and the pressing plate 210 is detachably connected with the connection plate 900. It can be understood that, by arranging the pressing plate 210 and the connecting plate 900 to be detachably connected, the user can conveniently install and detach the pressing plate 210, so that the damaged pressing plate 210 can be quickly replaced, and the maintenance time can be saved.

In this embodiment, the protruding installation department 110 that is provided with of frame 100, movable chamber has been seted up to installation department 110, the one end of connecting plate 900 is provided with the connecting rod, the connecting rod is worn to establish at movable intracavity, the power take off end of driver 300 penetrates movable chamber for driver 300 can be connected with the connecting rod drive, when driver 300 can drive connecting plate 900 motion, thereby drive the clamp plate 210 that is connected with connecting plate 900 and move together, and then, realize the drive to clamp plate 210.

In order to detachably connect the pressing plate 210 to the connecting plate 900, in an embodiment, as shown in fig. 1 and 2, a nut 930 is further included, the pressing plate 210 is provided with a bolt 211, the connecting plate 900 is provided with a through hole, and one end of the bolt 211 passes through the through hole and is screwed with the nut 930. It can be understood that, by providing the bolts 211 on the pressure plate 210, when the user needs to disassemble the pressure plate 210, the nuts 930 can be loosened, and then the pressure plate 210 can be taken out from the connecting plate 900 to complete the disassembling operation, and when the user needs to assemble the pressure plate 210, one end of the bolt 211 of the pressure plate 210 can be passed through the through hole, and then the nut 930 can be screwed on the bolt 211 to complete the assembling operation. By using the connection mode, the operation is simple and convenient, so that a user can select the pressing plates 210 with different specifications according to actual production requirements, and the applicability of the pressing device 10 is improved.

In order to make the connection between the connection plate 900 and the pressure plate 210 more stable, in one embodiment, the number of the nuts 930 is plural, and the number of the bolts 211 is plural. It can be understood that, by increasing the number of the nuts 930 and the bolts 211, the connection between the connecting plate 900 and the pressure plate 210 can be further improved and stabilized, thereby ensuring the stability of the pressure plate 210 during the pressing process.

In order to better control the pressure on the multilayer circuit board, in one embodiment, as shown in fig. 1, a pressure sensor 920 is further included, the pressure sensor 920 is disposed on the substrate 220, and the pressure sensor 920 is used for detecting the pressure between the pressing plate 210 and the substrate 220. Specifically, by providing the pressure sensor 920 on the substrate 220, a user can know the magnitude of the pressure applied to the multilayer circuit board by the pressing plate through the pressure sensor 920, so that the user can better control the pressing effect of the pressing plate 210 on the multilayer circuit board, thereby ensuring the pressing quality of the product.

In order to facilitate the replacement of the damaged rubber block 500 by the user, in one embodiment, as shown in fig. 3 and 5, the other end of each supporting column 400 is provided with an external thread 420, the base plate 220 is correspondingly provided with a threaded hole, the other end of each supporting column 400 is inserted into one threaded hole, and the external thread 420 of each supporting column 400 is screwed with the side wall of one threaded hole. It can be understood that, through being provided with external screw thread 420 at the other end of each support column 400, base plate 220 is seted up threaded hole correspondingly, so, can realize dismantling of each support column 400 and base plate 220 and be connected, when rubber block 500 has some damage, because each support column 400 is connected with each rubber block 500, the user can manually unscrew the support column 400 that damaged rubber block 500 corresponds, thereby take out damaged rubber block 500 from base plate 220, then aim at the screw hole of base plate 220 with support column 400 on the good rubber block 500, support column 400 is screwed up again manually, thereby realized the change to damaged rubber block 500.

In one embodiment, the anti-collision device further includes an anti-collision block 910, as shown in fig. 2, the anti-collision block 910 includes a first anti-collision block 911 and a second anti-collision block 912, the first anti-collision block 911 is disposed on an end of the first guiding column 810 away from the base plate 220, the second anti-collision block 912 is disposed on an end of the second guiding column 820 away from the base plate 220, and both the first anti-collision block 911 and the second anti-collision block 912 are connected to the rack 100. It can be understood that the first anti-collision block 911 and the second anti-collision block 912 are added to effectively achieve the anti-collision effect on the pressure plate 210 and the actuator 300, so as to ensure the service life of the pressure plate 210 and the actuator 300.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above embodiments only express a few embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A high-strength multilayer circuit board online pressing device is characterized by comprising a rack, a pressing component, a driver, a plurality of supporting columns, a plurality of rubber blocks and a plurality of elastic pieces;

the driver is arranged on the frame;

2. The on-line laminating device for high-strength multi-layer circuit boards according to claim 1, wherein the distance between the rubber blocks is 0.2cm-0.8 cm.

3. The on-line press-fit device for the high-strength multilayer circuit board according to claim 1, further comprising a plurality of clamping assemblies, wherein the clamping assemblies are made of rubber, the clamping assemblies comprise a first clamping block, a second clamping block, a third clamping block and a fourth clamping block, the first clamping block, the second clamping block, the third clamping block and the fourth clamping block are respectively arranged on the outer side of the rubber block, and the first clamping block, the second clamping block, the third clamping block and the fourth clamping block are used for fixing a workpiece.

4. The on-line laminating device for high-strength multi-layer circuit boards according to claim 3, wherein the first clamping block and the second clamping block are respectively provided with a first arc-shaped portion and a second arc-shaped portion, and the first clamping block and the second clamping block are arranged in parallel relatively.

5. The on-line laminating device for high-strength multi-layer circuit boards according to claim 4, wherein the third clamping block and the fourth clamping block are respectively provided with a third arc-shaped portion and a fourth arc-shaped portion, and the third clamping block and the fourth clamping block are arranged in parallel relatively.

6. The on-line press-fitting device for high-strength multi-layer circuit boards according to claim 1, wherein the shape of each rubber block comprises any one of a square shape, a rectangular shape and a hemispherical shape.

7. The on-line laminating device for the high-strength multilayer circuit board according to claim 1, further comprising a guide assembly, wherein the guide assembly comprises a first guide post and a second guide post, the first guide post and the second guide post are arranged on the frame at an interval, and the pressing plate is movably arranged on the first guide post and the second guide post.

8. The on-line press-fit device for high-strength multilayer circuit boards according to claim 1, further comprising a connection board, wherein the driver is in driving connection with the connection board, and the pressing plate is detachably connected with the connection board.

9. The on-line pressing device for the high-strength multilayer circuit board according to claim 8, further comprising a nut, wherein the pressing plate is provided with a bolt, the connecting plate is provided with a through hole, and one end of the bolt penetrates through the through hole and is in threaded connection with the nut.

10. The on-line bonding apparatus for high-strength multi-layer circuit board according to any one of claims 1 to 9, further comprising a pressure sensor disposed on the substrate, the pressure sensor being configured to detect a pressure between the pressing plate and the substrate.