CN114243287A - Millimeter wave phased array antenna array integrated adapter - Google Patents

Millimeter wave phased array antenna array integrated adapter Download PDF

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Publication number
CN114243287A
CN114243287A CN202111510173.4A CN202111510173A CN114243287A CN 114243287 A CN114243287 A CN 114243287A CN 202111510173 A CN202111510173 A CN 202111510173A CN 114243287 A CN114243287 A CN 114243287A
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CN
China
Prior art keywords
metal
millimeter wave
phased array
wave phased
antenna array
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202111510173.4A
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Chinese (zh)
Inventor
赵怀松
胡莉萍
陈靖
朱逸华
郭晓雪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Institute of Microwave Technology CETC 50 Research Institute
Original Assignee
Shanghai Institute of Microwave Technology CETC 50 Research Institute
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Institute of Microwave Technology CETC 50 Research Institute filed Critical Shanghai Institute of Microwave Technology CETC 50 Research Institute
Priority to CN202111510173.4A priority Critical patent/CN114243287A/en
Publication of CN114243287A publication Critical patent/CN114243287A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/48—Earthing means; Earth screens; Counterpoises
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/061—Two dimensional planar arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H01R4/029—Welded connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/10—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation
    • H01R4/18—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by crimping

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Waveguide Aerials (AREA)

Abstract

The invention provides a millimeter wave phased array antenna array integrated adapter, which comprises a metal ground, terminals arranged on the front surface of the metal ground and metal needles arranged on the back surface of the metal ground, wherein the terminals and the metal needles are connected in a one-to-one correspondence mode to form inner conductors, the metal ground is an outer conductor, the terminals looking down on the front surface of the metal ground or the metal needles looking down on the back surface of the metal ground are arranged in an array mode, and impedance media are filled between the inner conductors and the outer conductors.

Description

Millimeter wave phased array antenna array integrated adapter
Technical Field
The invention relates to the technical field of communication, in particular to a millimeter wave phased array antenna array integrated adapter.
Background
Millimeter wave phased array antennas are gradually applied to mobile communication systems, and due to high operating frequency and large array scale, millimeter wave phased array antennas are small in size and high in manufacturing cost. The phased array antenna based on the microstrip line technology is flat in structure, small in size, easy to process and low in cost, and is widely applied to a beam forming communication system.
For the interconnection between the microstrip line antenna array and the multichannel radio frequency transceiving component, the traditional method is to adopt a mode of connecting multistage radio frequency connectors in series, namely, SMP connectors are respectively installed on the antenna array and the transceiving component and are interconnected through K-K connectors. The method needs three groups of joints, and for a large-scale phased array, the number of radio frequency joints is too large, so that the transmission loss of radio frequency signals is increased, and the system cost is increased; moreover, as the SMP connector and the K-K head are assembled to meet the thickness requirement of the structure, the gap between the antenna and the transceiving component is too large, which is not beneficial to miniaturization; in addition, the mounting of the SMP needs a sintering process, and the large-scale antenna array and transceiver module need to be assembled with SMP connectors in a large number, which often makes it difficult to ensure the consistency of the process, and directly affects the performance of the whole system.
The interconnection between the antenna array and the receiving and transmitting assembly is directly integrated by adopting a coupling feed mode, but the mutual coupling is serious in a millimeter wave frequency band, the realization difficulty is high, and the coupling mode cannot realize the independent test of the related functions of the independent channels in the receiving and transmitting assembly. Therefore, how to solve the problem of low loss, compact structure and good consistency of radio frequency interconnection between the microstrip line phased array antenna array and the multichannel transceiving component is urgent to solve.
Patent document CN206516752U discloses a tile-based millimeter wave 64-array element tile-based phased array antenna, which includes 2 × 2 TR module arrays, where the number of sub-array channels of each TR module is 4 × 4, and 64 sub-array channels are total; every TR subassembly includes receiving and dispatching passageway module, power module, control module and structural cavity, and power module links to each other with external interface, and power module and control module pass through the perpendicular interconnection of contact pin, and control module and receiving and dispatching passageway module pass through the gold wire bonding and link to each other, and 3 modules are parallel placement in proper order, but this design still can not solve compact structure, the good radio frequency interconnection's of uniformity problem.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a millimeter wave phased array antenna array integrated adapter.
The millimeter wave phased array antenna array integrated adapter provided by the invention comprises a metal ground, a terminal arranged on the front surface of the metal ground and a metal pin arranged on the back surface of the metal ground;
the terminals and the metal needles are connected in a one-to-one correspondence mode to form inner conductors, the metal ground is an outer conductor, and the terminals on the front side or the metal needles on the back side of the metal ground are arranged in an array mode in a overlooking mode;
and an impedance medium is filled between the inner conductor and the outer conductor.
Preferably, the impedance medium is made of a teflon material.
Preferably, the terminal is of a resilient structure.
Preferably, the metal ground front terminals or back metal pins are arranged in an array of 4 ﹡ 4.
Preferably, the spacing between two adjacent terminals or two adjacent metal pins is half the wavelength of the operating frequency.
Preferably, the surfaces of the terminal, the metal ground and the metal pin are all subjected to gold plating treatment.
Preferably, the metal ground has one or more mounting holes and one or more positioning holes.
Preferably, the diameter of the terminal is 0.4mm, and the telescopic elastic range is 0-0.4 mm;
the diameter of the metal needle is 0.4mm, and the length of the metal needle is 1 mm.
Preferably, when in use, the terminal is connected with the printed board radio frequency interface of the transceiver module in a welding-free crimping mode.
Preferably, the metal pin is connected with the microstrip antenna by welding or bonding with a conductive adhesive.
Compared with the prior art, the invention has the following beneficial effects:
1. the invention adopts the millimeter wave phased array antenna array integrated conversion joint, directly integrates 4-by-4 radio frequency signal switching interconnection, greatly reduces the using number of common radio frequency joints and reduces the manufacturing cost of the phased array antenna array.
2. The invention directly realizes the connection of the radio frequency transceiving component signal to the antenna without any adapter in the middle, reduces the insertion loss caused by the adapter and improves the performance of a radio frequency channel.
3. According to the invention, the millimeter wave phased array antenna array integrated adapter is adopted, the performance consistency among the multi-path connectors on the integrated adapter is ensured by a close-fit fixing mode, the consistency is greatly improved compared with the traditional mode of welding or bonding a plurality of independent SMP connectors, the whole integrated adapter only needs simple screws for fastening and installation, and the installation process is greatly simplified.
4. According to the invention, the millimeter wave phased array antenna array integrated adapter is adopted, and the phased array communication system can respectively carry out independent test and performance evaluation on each receiving and transmitting channel, so that the method has more flexibility compared with a mode of integrating a microstrip antenna and a receiving and transmitting component into a whole.
5. The invention adopts the millimeter wave phased array antenna array integrated adapter and the box body structure integrated design of the receiving and transmitting assembly, thereby reducing the weight and the volume of the whole phased array antenna system.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
FIG. 1 is a schematic front view of the present invention;
FIG. 2 is a schematic side view of the present invention;
FIG. 3 is a schematic view of the reverse structure of the present invention;
FIG. 4 is an exploded view of an example mounting structure of the present invention;
FIG. 5 is a graph showing a simulation of standing waves in example 2 of the present invention;
fig. 6 is a simulation diagram of insertion loss in embodiment 2 of the present invention.
The figures show that:
terminal 1 positioning hole 5
Metal ground 2 microstrip array antenna 6
Integrated adapter 7 of metal needle 3
Mounting hole 4 transmit-receive assembly printed board 8
Detailed Description
The present invention will be described in detail with reference to specific examples. The following examples will assist those skilled in the art in further understanding the invention, but are not intended to limit the invention in any way. It should be noted that it would be obvious to those skilled in the art that various changes and modifications can be made without departing from the spirit of the invention. All falling within the scope of the present invention.
Example 1:
the invention provides a millimeter wave phased array antenna array integrated adapter, which comprises a metal ground 2, terminals 1 arranged on the front surface of the metal ground 2 and metal pins 3 arranged on the back surface of the metal ground 2, wherein the terminals 1 and the metal pins 3 are connected in a one-to-one correspondence manner to form inner conductors, and the terminals 1 are of an elastic structure, such as elastic telescopic hair buttons. The metal ground 2 is an outer conductor, and the terminals 1 on the front surface or the metal pins 3 on the back surface of the metal ground 2 are arranged in an array in a plan view, and the terminals 1 on the front surface or the metal pins 3 on the back surface of the metal ground 2 are preferably arranged in an array of 4 ﹡ 4. An impedance medium is filled between the inner conductor and the outer conductor and is matched with 50 ohms, and the impedance medium is preferably made of a Teflon material.
The spacing between two adjacent terminals 1 or two adjacent metal pins 3 is half the wavelength of the operating frequency.
In practical application, the metal ground 2 is provided with one or more mounting holes 4 and one or more positioning holes 5, so that the installation and fixation are convenient.
When the connector is used, the front side of the printed board radio frequency interface which is a receiving and transmitting component is connected, a welding-free crimping mode is adopted, the back side of the printed board radio frequency interface is connected with a microstrip antenna, the microstrip antenna is fixed on a metal ground 2 on the back side of the connector in a welding or conductive adhesive bonding mode, and antenna feed is connected with a metal probe on the back side of the connector in a welding or conductive adhesive bonding mode.
Example 2:
this embodiment is a preferred embodiment of embodiment 1.
In this embodiment, as shown in fig. 1, fig. 2, and fig. 3, the integrated adapter 7 includes 16 front elastic terminals 1, metal grounds 2, and 16 back metal pins 3, where the front terminals 1 and the back metal pins 3 are interconnected, and millimeter wave signals are transmitted between the terminals 1 and the metal pins 3.
The terminals 1 and the metal pins 3 are arranged in an array of 4 x 4, the arrangement interval is one half of the working wavelength, and the specific size is determined by the working center frequency. The diameter of the terminal 1 is 0.4mm, the elastic range of the telescopic is 0-0.4 mm, the diameter of the metal needle 3 is 0.4mm, and the length is 1 mm.
The terminal 1 and the metal needle 3 are inner conductors of the adapter, the metal ground 2 is an outer conductor of the adapter, and a Teflon medium is filled between the inner conductors and the outer conductor and is subjected to 50-ohm impedance matching.
The terminal 1 and the receiving and transmitting assembly printed board are interconnected in a welding-free crimping mode, and the metal needle 3 and the microstrip antenna are interconnected in a welding mode.
The surfaces of the terminal 1, the metal ground 2 and the reverse metal needle 3 are all plated with gold.
The metal ground 2 has two positioning holes 5 and five mounting holes 4, as shown in fig. 3.
The millimeter wave phased array antenna array integrated adapter is suitable for millimeter wave phased array antenna array systems, and is particularly suitable for microstrip line type antenna arrays. Fig. 4 is an exploded view of an example structure using the integrated adapter of the millimeter wave phased array antenna array, in this example, only 4 integrated adapters 7 are used to realize direct interconnection between a 64-unit microstrip array antenna 6 and a printed board 8 of a transceiver module, and the millimeter wave phased array antenna array system has the advantages of compact structure, simple installation, excellent performance, and wide application to a large-scale planar millimeter wave phased array antenna array system.
FIG. 5 is a graph showing the simulation of standing waves for a single-channel RF adapter according to the present invention, wherein the abscissa is frequency, the unit GHz, and the ordinate is input return loss VSWR, and the result is that VSWR is less than or equal to 1.03 in the frequency range from 25GHz to 30 GHz.
FIG. 6 shows a simulation graph of the insertion loss of the single-channel RF adapter according to the present invention, wherein S21 is less than or equal to-0.1 dB in the frequency range from 25GHz to 30 GHz. The rest 15 joints are completely consistent with the simulation result of the single joint.
The invention adopts a 4-by-4 array integrated radio frequency conversion joint, one end of the joint is in compression joint with a receiving and transmitting component by adopting an elastic fuzz button without welding, the other end of the joint is provided with a probe, the probe feeds power to a microstrip line antenna array by adopting a welding mode, and the middle part of the joint is metal and serves as a shielding box body of the receiving and transmitting component and also serves as a reflection ground of the microstrip array antenna. The inner conductor and the outer conductor of the connector are filled with a medium and are matched with each other by 50 ohms. The invention can realize the interconnection between the 16-unit microstrip antenna array and the 16-channel transceiving component, and has the advantages of low loss, compact structure, good consistency, small volume and easy integration and installation.
In the description of the present application, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present application.
The foregoing description of specific embodiments of the present invention has been presented. It is to be understood that the present invention is not limited to the specific embodiments described above, and that various changes or modifications may be made by one skilled in the art within the scope of the appended claims without departing from the spirit of the invention. The embodiments and features of the embodiments of the present application may be combined with each other arbitrarily without conflict.

Claims (10)

1. A millimeter wave phased array antenna array integrated transition joint is characterized by comprising a metal ground (2), a terminal (1) arranged on the front surface of the metal ground (2) and a metal pin (3) arranged on the back surface of the metal ground (2);
the terminals (1) and the metal needles (3) are connected in a one-to-one correspondence manner to form inner conductors, the metal ground (2) is an outer conductor, and the terminals (1) on the front surface or the metal needles (3) on the back surface of the metal ground (2) are arranged in an array manner in a overlooking manner;
and an impedance medium is filled between the inner conductor and the outer conductor.
2. The millimeter wave phased array antenna array integrated transition joint of claim 1, wherein the impedance medium is teflon.
3. The millimeter wave phased array antenna array integrated transition joint of claim 1, characterized in that the terminals (1) are of a resilient structure.
4. The millimeter wave phased array antenna array integrated transition joint of claim 1, wherein the metal ground (2) front side terminals (1) or back side metal pins (3) are arranged in an array of 4 ﹡ 4.
5. The millimeter wave phased array antenna array integrated transition joint according to claim 1, characterized in that the spacing between two adjacent terminals (1) or two adjacent metal pins (3) is half a wavelength of the operating frequency.
6. The millimeter wave phased array antenna array integrated transition joint according to claim 1, characterized in that the surfaces of the terminals (1), the metal ground (2) and the metal pins (3) are all plated with gold.
7. The millimeter wave phased array antenna array integrated transition joint according to claim 1, characterized in that the metal ground (2) has one or more mounting holes (4) and one or more positioning holes (5) thereon.
8. The millimeter wave phased array antenna array integrated conversion sub of claim 1, characterized in that the diameter of the terminal (1) is 0.4mm, and the elastic range of the telescopic is 0-0.4 mm;
the diameter of the metal needle (3) is 0.4mm, and the length of the metal needle is 1 mm.
9. The millimeter wave phased array antenna array integrated transition joint of claim 1, characterized in that, when in use, the terminal (1) is connected with a printed board radio frequency interface of the transceiver module in a welding-free crimping manner.
10. The millimeter wave phased array antenna array integrated transition joint according to claim 1, characterized in that the metal pins (3) are connected with the microstrip antenna by means of welding or conductive adhesive bonding.
CN202111510173.4A 2021-12-10 2021-12-10 Millimeter wave phased array antenna array integrated adapter Pending CN114243287A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111510173.4A CN114243287A (en) 2021-12-10 2021-12-10 Millimeter wave phased array antenna array integrated adapter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111510173.4A CN114243287A (en) 2021-12-10 2021-12-10 Millimeter wave phased array antenna array integrated adapter

Publications (1)

Publication Number Publication Date
CN114243287A true CN114243287A (en) 2022-03-25

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111510173.4A Pending CN114243287A (en) 2021-12-10 2021-12-10 Millimeter wave phased array antenna array integrated adapter

Country Status (1)

Country Link
CN (1) CN114243287A (en)

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