CN114239470B - Compound semiconductor imposition design method and system - Google Patents
Compound semiconductor imposition design method and system Download PDFInfo
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- CN114239470B CN114239470B CN202111564285.8A CN202111564285A CN114239470B CN 114239470 B CN114239470 B CN 114239470B CN 202111564285 A CN202111564285 A CN 202111564285A CN 114239470 B CN114239470 B CN 114239470B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/392—Floor-planning or layout, e.g. partitioning or placement
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/30—Computing systems specially adapted for manufacturing
Abstract
The invention discloses a compound semiconductor imposition design method and a system, which belong to the technical field of semiconductor imposition and comprise the steps of obtaining a data processing threshold value of a production line; judging whether the current imposition design data meet a data processing threshold value or not according to the production time, and outputting a feasibility report if the current imposition design data meet the data processing threshold value; if not, outputting a guiding report; and adjusting the imposition design data according to the guide report until the imposition design data meets the data processing threshold. The invention evaluates the current imposition design data based on the data processing threshold value of the production line, can feed back the latest production state of the production line to the imposition design end in advance, intensively and indifferently, and restricts, adjusts and avoids the demand exceeding the production limit of the process in advance possibly occurring later, thereby improving the passing efficiency of imposition design, shortening the production time of products, and avoiding the problems of resource idling and productivity waste caused by a large quantity of backlogged products in a certain link of the production line.
Description
Technical Field
The invention relates to the technical field of semiconductor imposition, in particular to a compound semiconductor imposition design method and system.
Background
The integrated circuit layout design plays a crucial role in the design process of the compound semiconductor, and is an important intermediate link for connecting the radio frequency circuit design and correctly expressing the process. Along with the maturing of the compound semiconductor in the domestic development, the requirements of high yield and high-efficiency layout drawing are gradually developed, and the compound semiconductor imposition design which is stable and reliable, strong in process affinity, easy to cut and pick and high in area utilization rate can be rapidly obtained, so that the stability of a production line is further improved, the productivity is saved, and the chip development period is effectively shortened.
When the chip is actually processed and produced, the layout design data of the lower line is required to meet the real-time accurate requirements of links such as production line production, cutting, picking and testing, and the like, and the layout design scheme which is feasible, high in accuracy and good in consistency of requirements at each end of the production line is provided, so that the layout design scheme is significant for high yield and on-time delivery of the product chip. In the actual production process of the imposition design offline, the real-time change of the production capacity makes the production state difficult to grasp or untimely in feedback, and even necessary information is transmitted from the production end to the design end and can be discovered and transmitted by solving abnormal events. Such a conduction mechanism is clearly an inefficient and less fault tolerant path. At the same time, such a conduction process is simply a stress response mechanism, and there is no opportunity for current imposition design data to be tuned. Meanwhile, when the imposition data which is not matched with the productivity is produced on line, a large amount of production resources are occupied, a certain link of the production line is greatly congested, and orders cannot be delivered on schedule, so that an imposition design method for solving the feedback blind area of the information of the existing imposition data is urgently needed.
Disclosure of Invention
The invention aims to overcome the problems in the prior art and provides a compound semiconductor imposition design method and system.
The aim of the invention is realized by the following technical scheme: a compound semiconductor imposition design method, comprising the steps of:
acquiring a data processing threshold of a production line, wherein the data processing threshold comprises a process feasibility threshold, an exposure production threshold, a cutting threshold, a film picking threshold, a testing capability threshold and a productivity threshold;
judging whether the current imposition design data meet a data processing threshold value or not according to the production time, and outputting a feasibility report if the current imposition design data meet the data processing threshold value; if not, outputting a guiding report;
and adjusting the imposition design data according to the guide report until the imposition design data meets the data processing threshold.
In an example, the acquiring the data processing threshold of the production line includes:
acquiring a data processing threshold of the production line based on the current production capacity of the production line; and/or the number of the groups of groups,
and acquiring a data processing threshold of the production line based on the historical imposition design and the production data.
In an example, the method further comprises a data store update step:
and storing the data processing threshold value of the production line, the imposition design data before and after adjustment, the feasibility report and the guidance report related to the semiconductor imposition design process so as to update the historical imposition design and production data.
In one example, the imposition design data includes the quantity proportioning information and delivery form of each model chip to be delivered.
In one example, the guidance report includes prompt information for prompting specific data processing thresholds that are not met by the current imposition design data.
In an example, the guidance report further includes guidance advice information for giving reference imposition design data that meets the data processing threshold.
The invention also includes a compound semiconductor imposition design system having the same inventive concept as the above compound semiconductor imposition design, the system comprising:
the data processing threshold acquisition unit is used for acquiring data processing thresholds of the production line, including a process feasibility threshold, an exposure production threshold, a cutting threshold, a film picking threshold and a testing capability threshold;
the calculation judging unit is used for judging whether the current imposition design data meet a data processing threshold value or not, and outputting a feasibility report if the current imposition design data meet the data processing threshold value; if not, outputting a guiding report;
and the adjusting unit is used for adjusting the imposition design data according to the instruction report until the imposition design data meets the data processing threshold value.
In one example, the system further includes a database for storing and updating historical imposition design and production data in real time.
In an example, the computing determination unit includes a prompting module configured to prompt a specific data processing threshold that is not satisfied by the current imposition design data.
In an example, the computing determination unit includes a guidance advice module for giving reference imposition design data that meets the data processing threshold.
It should be further noted that the technical features corresponding to the examples above may be combined with each other or replaced to form a new technical solution.
Compared with the prior art, the invention has the beneficial effects that:
1. in an example, based on the data processing threshold value of the production line, the current imposition design data is evaluated, the latest production state of the production line can be fed back to the imposition design end in advance, in a centralized manner and indifferently, and the subsequent requirements exceeding the production limit of the process can be restrained, adjusted and avoided in advance, so that the passing efficiency of imposition design is improved, the production time of products is shortened, and the problems of resource idling and productivity waste caused by a large number of backlogged products in a certain link of the production line are avoided.
2. In an example, by continuously updating the historical imposition design and production data, the data processing threshold is always in a positive updating state and is consistent with the productivity level of the production line, so that the accuracy of the acquired data processing threshold is ensured, and the imposition design data has high applicability in all links of the production process.
Drawings
The following detailed description of the present invention is further detailed in conjunction with the accompanying drawings, which are provided to provide a further understanding of the present application, and in which like reference numerals are used to designate like or similar parts throughout the several views, and in which the illustrative examples and descriptions thereof are used to explain the present application and are not meant to be unduly limiting.
FIG. 1 is a flow chart of a method in an example of the invention;
fig. 2 is a flow chart of a method of a preferred example of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made apparent and fully understood from the accompanying drawings, in which some, but not all embodiments of the invention are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be noted that directions or positional relationships indicated as being "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships described in the drawings are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or elements to be referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
In addition, the technical features of the different embodiments of the present invention described below may be combined with each other as long as they do not collide with each other.
The invention provides a sand table exercise method aiming at compound semiconductor imposition design data, which can carry out advance constraint and advance solution aiming at each imposition project, has the advantages of strong timeliness, perfect feedback mechanism and high accuracy, can effectively solve the current situations of information asymmetry and information hysteresis caused by feedback chain length, avoids the situation that the final off-line layout design is not matched with the production capacity, and ensures that the chip production efficiency is higher.
In an example, a compound semiconductor imposition design method, as shown in fig. 1, specifically includes the following steps:
s1: acquiring a data processing threshold of a production line, wherein the data processing threshold comprises a process feasibility threshold, an exposure production threshold, a cutting threshold, a film picking threshold, a testing capability threshold and a productivity threshold; the production line is a production equipment assembly line for chip processing production. The process feasibility threshold value represents the corresponding process parameter value for realizing chip production on the basis of ensuring the high-level chip yield; the exposure production threshold value represents an exposure area value of chip production on the basis of ensuring higher-level chip yield; the dicing threshold represents a chip size value (chip size) that enables normal dicing to be completed, while ensuring a higher level of chip yield; picking up the wafer chips, wherein the wafer picking threshold value represents the chip size value (chip size) and the number of single chips which can normally finish picking up the chips on the basis of ensuring higher-level chip yield and certain production time; the testing capability threshold value is expressed as corresponding testing performance parameters required by production equipment for realizing higher-level chip yield; the capacity threshold represents the upper limit value of the number of chips which can be produced by the current production line according to the corresponding model on the basis of ensuring the yield of the chips with higher level. More specifically, the above-mentioned higher level is defined according to different production demands, or data processing performance of the production line, or the like. Further, the data processing threshold of the production line is a real-time threshold, and can be updated in real time according to the data processing threshold uploaded by the user.
S2: judging whether the current imposition design data meet a data processing threshold value or not according to the production time, and outputting a feasibility report if the current imposition design data meet the data processing threshold value; if not, outputting a guiding report; specifically, the production time corresponds to the delivery time of the delivery chip; the imposition design data comprises the quantity proportioning information and delivery form of various types of chips to be delivered (produced). The number proportion of the chips of different types limits the design data of the chips, namely the exposure area, the cutting size, the pick-up size, the number, the productivity and the like of the wafer; delivery forms include delivery by wafer or chip set, overall delivery or batch delivery, etc., defining the number of chips of each type on the wafer, i.e. defining the exposure area, dicing size, pick-up size and number, throughput, etc. of the wafer. The output feasibility report indicates that the chip production can be performed according to the current imposition design data, and indicates that the pre-evaluation stage of the project is finished and the formal imposition production stage of the data is started to be implemented.
S3: and adjusting the imposition design data according to the guide report until the imposition design data meets the data processing threshold.
In this example, whether the current makeup design data meets the data processing threshold value is judged in combination with the production time, namely, the current makeup design data is evaluated based on the data processing threshold value of the production line, the latest production state of the production line can be fed back to the makeup design end in advance, in a concentrated manner and indifferently, so that the makeup design data suitable for the current production requirement is provided, the development efficiency of chip products is improved, the requirements exceeding the production limit of the process can be restrained, adjusted and avoided in advance, the passing efficiency of the makeup design is improved, the production time of the products is shortened, and the problems of resource idling and productivity waste caused by a large number of backlog products in a certain link of the production line are avoided.
In an example, the acquiring the data processing threshold of the production line in step S1 includes:
and acquiring a data processing threshold of the production line based on the current production capacity of the production line, the historical imposition design and the production data. The historical imposition design and production data comprise data processing threshold values of production lines involved in the semiconductor imposition design process of each project, imposition design data before and after adjustment according to a guidance report, feasibility reports and guidance reports. And analyzing and classifying the historical imposition design and the production data, and combining the current production capacity of the production line, so that the data processing threshold value corresponding to the current project imposition design can be rapidly screened. Specifically, the current production capacity of the production line includes dicing capacity, remaining capacity, exposure tool performance, chip pick-up capacity, and testing capacity.
In an example, the method further comprises the step of data store update:
the data processing threshold value, imposition design data before and after adjustment, feasibility reports and guidance reports of the production line related in the semiconductor imposition design process of the project are stored to update historical imposition design and production data, so that the data processing threshold value is always in a positive updating state and is consistent with the productivity level of the production line, the accuracy of the obtained data processing threshold value is further ensured, and the imposition design data has high applicability in all links of the production process.
In one example, the guidance report includes prompt information for prompting specific data processing thresholds that are not met by the current imposition design data. In the process of judging whether the current imposition design data meets the data processing threshold, the imposition design data and the data processing threshold are of known quantity, the quantity proportioning information and delivery mode of chips of various types in the imposition design data further limit the data processing parameters such as chip production process parameters, testing capability, exposure area, cutting size, pick-up size and quantity, productivity parameters and the like, the data processing parameters and the data processing threshold are compared one by one, and then the data processing parameters which do not meet the data processing threshold can be obtained, for example, a specific process exceeds the process feasibility threshold, the single delivery quantity exceeds the processable upper limit (exceeds the productivity threshold) of each single chip, and the pre-imposition area exceeds the exposure production threshold and the like.
In an example, the guidance report further includes guidance advice information for giving reference imposition design data that meets the data processing threshold. In the process of judging whether the current imposition design data meets the data processing threshold value, reversely correcting the quantity proportioning information and the delivery mode of each type chip according to the data processing threshold value by the mapping relation between the quantity proportioning information and the data processing parameters of each type chip in the imposition design data, and giving out the quantity proportioning quantity and the specific delivery mode of the corresponding type chip, thereby maximally realizing the matching of the imposition design data and the production capacity.
Combining the above examples, as shown in fig. 2, results in a preferred example of the present invention, specifically including the following steps:
s1': acquiring historical imposition design and production data;
s2': acquiring a data processing threshold of the production line based on the current production capacity of the production line, the historical imposition design and production data;
s3': judging whether the current imposition design data meet a data processing threshold value or not according to the production time, and outputting a feasibility report if the current imposition design data meet the data processing threshold value; if not, outputting a guiding report;
s4': and adjusting the imposition design data according to the guide report until the imposition design data meets the data processing threshold.
The invention also comprises a compound semiconductor imposition design system which has the same inventive concept as the compound semiconductor imposition design method, and the system comprises:
the data processing threshold acquisition unit is used for acquiring real-time data processing thresholds of the production line, including a process feasibility threshold, an exposure production threshold, a cutting threshold, a film picking threshold and a testing capability threshold; the data processing threshold value acquisition unit can receive the data processing threshold value uploaded by the user in real time.
The calculation judging unit is used for judging whether the current imposition design data meet a data processing threshold value or not, and outputting a feasibility report if the current imposition design data meet the data processing threshold value; if not, outputting a guiding report; further, the calculation judging unit further comprises a data receiving module, which is used for receiving the uploaded imposition design data, including the first imposition design data and the imposition design data after subsequent adjustment and modification.
And the adjusting unit is used for adjusting the imposition design data according to the instruction report until the imposition design data meets the data processing threshold value.
In one example, the system further includes a database for storing and updating historical imposition design and production data in real time.
In an example, the database includes a positioning unit, which is used for screening out corresponding imposition design and production data from the database according to the keywords, and provides a function of quickly looking up the data.
In an example, the calculation and judgment unit includes a prompting module, configured to prompt a specific data processing threshold that is not satisfied by the current imposition design data, and the design end more intuitively obtains an nonstandard parameter in the current imposition design data, so as to improve the nonstandard parameter.
In an example, the computing determination unit includes a guidance advice module for giving reference imposition design data that meets the data processing threshold. The reference imposition design data is that a judging unit reversely corrects the quantity proportioning information and delivery modes of the chips of each model according to the mapping relation between the quantity proportioning information of the chips of each model and the data processing parameters in the imposition design data and gives out the quantity proportioning quantity and specific delivery modes of the corresponding chips of each model according to the data processing threshold value, and the quantity proportioning information and the delivery modes are used as the adjustment imposition design data reference of a design end instead of the final imposition design data.
The foregoing detailed description of the invention is provided for illustration, and it is not to be construed that the detailed description of the invention is limited to only those illustration, but that several simple deductions and substitutions can be made by those skilled in the art without departing from the spirit of the invention, and are to be considered as falling within the scope of the invention.
Claims (8)
1. A compound semiconductor imposition design method is characterized in that: the method comprises the following steps:
acquiring a data processing threshold of a production line, wherein the data processing threshold comprises a process feasibility threshold, an exposure production threshold, a cutting threshold, a film picking threshold, a testing capability threshold and a productivity threshold;
judging whether the current imposition design data meet a data processing threshold value or not according to the production time, and outputting a feasibility report if the current imposition design data meet the data processing threshold value; if not, outputting a guiding report;
adjusting the imposition design data according to the guide report until the imposition design data meets a data processing threshold;
the acquiring the data processing threshold value of the production line comprises the following steps:
acquiring a data processing threshold of the production line based on the current production capacity of the production line; and/or the number of the groups of groups,
acquiring a data processing threshold of a production line based on historical imposition design and production data, wherein the data processing threshold of the production line is a real-time threshold;
the imposition design data comprises the quantity proportioning information and delivery form of each type of chip to be delivered; the production time corresponds to the delivery time of the delivery chip.
2. The compound semiconductor imposition design method according to claim 1, characterized in that: the method further comprises the step of updating the data store:
and storing the data processing threshold value of the production line, the imposition design data before and after adjustment, the feasibility report and the guidance report related to the semiconductor imposition design process so as to update the historical imposition design and production data.
3. The compound semiconductor imposition design method according to claim 1, characterized in that: the guidance report includes prompt information for prompting specific data processing thresholds not met by the current imposition design data.
4. A compound semiconductor imposition design method according to claim 1 or 3, characterized in that: the instruction report also includes instruction suggestion information for giving reference imposition design data that meets the data processing threshold.
5. A compound semiconductor imposition design system characterized in that: the system comprises:
the data processing threshold acquisition unit is used for acquiring data processing thresholds of the production line, including a process feasibility threshold, an exposure production threshold, a cutting threshold, a film picking threshold and a testing capability threshold;
the calculation judging unit is used for judging whether the current imposition design data meet a data processing threshold value or not, and outputting a feasibility report if the current imposition design data meet the data processing threshold value; if not, outputting a guiding report;
the adjusting unit is used for adjusting the imposition design data according to the instruction report until the imposition design data meets the data processing threshold value;
the acquiring the data processing threshold value of the production line comprises the following steps:
acquiring a data processing threshold of the production line based on the current production capacity of the production line; and/or the number of the groups of groups,
acquiring a data processing threshold of a production line based on historical imposition design and production data, wherein the data processing threshold of the production line is a real-time threshold;
the imposition design data comprises the quantity proportioning information and delivery form of each type of chip to be delivered; the production time corresponds to the delivery time of the delivery chip.
6. The compound semiconductor imposition design system of claim 5 wherein: the system also includes a database for storing and updating historical imposition design and production data in real time.
7. The compound semiconductor imposition design system of claim 5 wherein: the calculation judging unit comprises a prompting module which is used for prompting specific data processing threshold values which are not met by the current imposition design data.
8. A compound semiconductor imposition design system according to claim 5 or 7, characterized in that: the calculation judging unit comprises a guiding suggestion module for giving reference imposition design data which accords with a data processing threshold value.
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