CN114236349A - Integrated circuit testing device - Google Patents
Integrated circuit testing device Download PDFInfo
- Publication number
- CN114236349A CN114236349A CN202111464035.7A CN202111464035A CN114236349A CN 114236349 A CN114236349 A CN 114236349A CN 202111464035 A CN202111464035 A CN 202111464035A CN 114236349 A CN114236349 A CN 114236349A
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- Prior art keywords
- base
- platform
- integrated circuit
- transparent plate
- circuit testing
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- 238000012360 testing method Methods 0.000 title claims abstract description 23
- 238000001514 detection method Methods 0.000 claims abstract description 35
- 230000007246 mechanism Effects 0.000 claims description 16
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 2
- 238000003466 welding Methods 0.000 description 8
- 238000013459 approach Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
The invention provides an integrated circuit testing device, and relates to the field of integrated circuit testing. This integrated circuit testing arrangement, which comprises a base, the breach of placing has been seted up to the upper end of base, both ends all are equipped with two sleeves about the base, two sleeves of one side are located both ends around the base respectively, the bottom side fixed connection of sleeve and base, the top of base is equipped with the platform, the bottom surface fixed mounting of platform has four travelers, four travelers correspond respectively and peg graft in four sleeves in the below, equal fixed mounting has electric push rod A in both ends about the base, the output of electric push rod all with the bottom surface fixed connection of platform, the below of platform is equipped with the holder, the holder is located the top of base, the bottom surface of platform is fixed with four slide bars. This integrated circuit testing arrangement through setting up holder, transparent plate and detector, can detect the circuit board and the horizontally circuit board of buckling to can follow the holistic condition of analysis on the multiunit detection post, the precision is higher.
Description
Technical Field
The invention relates to the field of integrated circuit testing, in particular to an integrated circuit testing device.
Background
An integrated circuit is a microelectronic device or component. The transistor, the resistor, the capacitor, the inductor and other elements and wires required in a circuit are interconnected together by adopting a certain process, are manufactured on a small or a plurality of small semiconductor wafers or medium substrates, and are then packaged in a tube shell to form a micro structure with the required circuit function; unqualified samples are marked in the process of detecting the integrated circuit, so that the waste of packaging cost is avoided.
In the prior art, a plurality of devices for testing welding spots exist for testing an integrated circuit, but in an actual situation, an integrated circuit board can have a deformation condition, and the unsmooth circuit board can cause the inaccuracy of the length of the welding spots to be tested.
Disclosure of Invention
In view of the deficiencies of the prior art, the present invention provides an integrated circuit testing device that solves the problems set forth in the background above.
In order to achieve the purpose, the invention is realized by the following technical scheme: an integrated circuit testing device comprises a base, wherein the upper end of the base is provided with a placement notch, the left end and the right end of the base are respectively provided with two sleeves, the two sleeves on one side are respectively positioned at the front end and the rear end of the base, the sleeves are fixedly connected with the side surface of the bottom end of the base, a platform is arranged above the base, the bottom surface of the platform is fixedly provided with four sliding columns, the four sliding columns are respectively correspondingly inserted in the four sleeves below, equal fixed mounting has electric putter A in both ends about the base, electric putter A's output all with the bottom surface fixed connection of platform, the below of platform is equipped with the holder, the holder is located the top of base, the bottom surface of platform is fixed with four slide bars, four slide bars all run through the holder, the holder slides for the slide bar, the upper end fixed mounting of platform has electric putter B, electric putter B's output run through after the platform with the upper surface intermediate position fixed connection of holder.
The upper surface breach position fixed mounting of base has the cross slip table, and the upper end output end fixed mounting of cross slip table has the transparent plate, and the equal fixed mounting in both ends has the detector around the transparent plate, and the fixed grafting has a plurality of point contact mechanism of evenly arranging in the upper end of transparent plate.
Preferably, the point contact mechanism includes the barrel, detects post and touching needle, and the barrel is fixed to be pegged graft in the transparent plate, and touching needle point end up and fixed mounting is in the bottom of barrel, detects the post plug in the barrel, is equipped with the spring in the barrel, and compression spring when detecting the post and pushing down, and the detection post can't upwards pop out when not compressing spring.
Preferably, the lower end of the detection column is of a tip structure, the touch needle and the detection column are coaxially arranged, and the tip of the detection column is close to the tip of the touch needle.
Preferably, the upper surface of base and the equal level setting of bottom surface of platform, the width of platform and the width cooperation of breach.
Preferably, the bottom surface of the clamp is in a horizontal structure, and the clamp is parallel to the base and the platform at the same time.
Preferably, the transparent plate is a transparent acrylic plate, the lower end of the point contact mechanism is flush with the lower end of the transparent plate, and the detector is attached to the transparent plate.
Compared with the prior art, the invention has the following beneficial effects:
1. the integrated circuit testing device is provided with a holder, a transparent plate and a detector, wherein the holder can be provided with a holding mechanism for holding an integrated circuit board, an electric push rod A moves downwards to enable the integrated circuit board to approach the transparent plate, then an electric push rod B is controlled to jump so that an electric welding pin of the integrated circuit board is contacted with a detection column on a point contact mechanism, a touch needle is controlled to be electrified, the contact condition of a pressing detection column and the touch needle after the contact of the pin of the integrated circuit board and the detection column is obtained, if the lengths of the pins of the electric welding are the same, a specific result can be obtained from the electrified condition, if the integrated circuit board is bent, the integrated circuit board can be restored to a flat plate structure on the holder, and can be restored to a horizontal state when the integrated circuit board approaches the transparent plate, and the contact condition of the detection column of a dot matrix is calculated, can analyze which stitch and not conform to manufacturing standard, contrast prior art, this integrated circuit testing arrangement can detect the circuit board and the horizontally circuit board of buckling to can detect the holistic condition of analysis on the post from the multiunit, the precision is higher.
2. This integrated circuit testing arrangement, through setting up cross slip table and electric push rod B, the cross slip table is responsible for cooperating with electric push rod B, and electric push rod B's main effect is beated for driving integrated circuit board, and integrated circuit board's electric welding array foot is not the equidistance with the detection post is distributed the same, so need control cross slip table and drive transparent plate horizontal migration, again with the integrated circuit board cooperation periodic contact that electric push rod drove, can draw multiunit data, possess higher degree of accuracy.
3. This integrated circuit testing arrangement, through setting up transparent plate and detector, the detector is spectral detection, can detect the circumstances that moves down of every detection post through the transparent plate, has increased optical detection under the circumstances that original electric power detected, can make the result more accurate to through the detection circuitry board that the analysis can be quick.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a front view of the present invention;
FIG. 3 is a schematic view of the lower end structure of the present invention;
FIG. 4 is a schematic view of a portion of the present invention;
fig. 5 is a schematic structural diagram of the point contact mechanism of the present invention.
The device comprises a base 1, a notch 2, a sleeve 3, a platform 4, a sliding column 5, an electric push rod A6, an electric push rod A7 holder, a sliding rod 8, an electric push rod B9, a cross sliding table 10, a transparent plate 11, a detector 12, a point contact mechanism 13, a barrel 1301, a detection column 1302, a touch needle 1303 and a spring 1304.
Detailed Description
As shown in FIGS. 1-5, an integrated circuit testing device comprises a base 1, a placement gap 2 is formed at the upper end of the base 1, two sleeves 3 are respectively arranged at the left end and the right end of the base 1, the two sleeves 3 at one side are respectively positioned at the front end and the rear end of the base 1, the sleeves 3 are fixedly connected with the bottom end side surface of the base 1, a platform 4 is arranged above the base 1, the upper surface of the base 1 and the bottom surface of the platform 4 are horizontally arranged, the width of the platform 4 is matched with the width of the gap 2, four sliding columns 5 are fixedly arranged at the bottom surface of the platform 4, the four sliding columns 5 are respectively correspondingly inserted into the four sleeves 3 below, an electric push rod A6 is fixedly arranged in the left end and the right end of the base 1, the output end of the electric push rod A6 is fixedly connected with the bottom surface of the platform 4, a clamp 7 is arranged below the platform 4, a clamping structure can be arranged at the bottom surface of the clamp 7, and the clamping mechanism is used for clamping an integrated circuit board, the structure that can the centre gripping circuit board can be common structure among the prior art, holder 7 is located the top of base 1, the bottom surface of holder 7 is horizontal structure, holder 7 is parallel with base 1 and platform 4 simultaneously, the bottom surface of platform 4 is fixed with four slide bars 8, four slide bars 8 all run through holder 7, holder 7 slides for slide bar 8, the upper end fixed mounting of platform 4 has electric putter B9, the output of electric putter B9 run through behind the platform 4 with the upper surface intermediate position fixed connection of holder 7.
2 fixed mounting in upper surface breach of base 1 has cross slip table 10, cross slip table 10 is automatically controlled structure, can change the position of output at will, the upper end output fixed mounting of cross slip table 10 has transparent plate 11, the equal fixed mounting in both ends has detector 12 around transparent plate 11, transparent plate 11 is transparent ya keli board, the lower extreme of point contact mechanism 13 and the lower extreme parallel and level of transparent plate 11, detector 12 and the laminating of transparent plate 11, the inside fixed grafting in upper end of transparent plate 11 has a plurality of point contact mechanism 13 of evenly arranging.
The point contact mechanism 13 comprises a cylinder 1301, a detection column 1302 and a touch needle 1303, the cylinder 1301 is fixedly inserted into the transparent plate 11, the tip of the touch needle 1303 faces upward and is fixedly installed at the bottom end of the cylinder 1301, the detection column 1302 is inserted into the cylinder 1301, a spring 1304 is arranged in the cylinder 1301, the detection column 1302 compresses when being pressed down, the detection column 1302 cannot pop up when not compressing the spring 1304, the lower end of the detection column 1302 is of a tip structure, the touch needle 1303 and the detection column 1302 are coaxially arranged, and the tip of the detection column 1302 and the tip of the touch needle 1303 are close to each other.
When in use, the clamper 7 can be provided with a clamping mechanism for clamping an integrated circuit board, firstly, the electric push rod A6 moves downwards to enable the integrated circuit board to approach the transparent plate 11, then the electric push rod B9 is controlled to jump, electric welding pins of the integrated circuit board are enabled to be in contact with the detection columns 1302 on the point contact mechanism 13, the touch needles 1303 are controlled to be electrified, the contact condition of pressing down the detection columns 1302 and the touch needles 1303 after the pins of the integrated circuit board are in contact with the detection columns 1302 is obtained, if the lengths of the electric welding pins are the same, a specific result can be obtained from the electrified condition, if the integrated circuit board is bent, the integrated circuit board can be restored to a flat plate structure on the clamper 7, and can be restored to a horizontal state when the integrated circuit board is pressed down to approach the transparent plate 11, the cross sliding table 10 is in charge of being matched with the electric push rod B9, and the electric push rod B9 is mainly used for driving the integrated circuit board to jump, integrated circuit board's electric welding array foot is not the equidistance with detecting post 1302 the same and distributes, so need control cross slip table 10 to drive 11 horizontal migration of transparent plate, integrated circuit board cooperation cycle contact with electric push rod drive again, can derive multiunit data, possess higher degree of accuracy, the contact condition of detecting post 1302 through calculating the dot matrix, can analyze which stitch and not conform to the manufacturing standard, detector 12 can detect every circumstances that moves down that detects post 1302 through transparent plate 11, optical detection has been increased under the circumstances of original electric power detection, can make the result more accurate, thereby can be quick through the analysis detection circuitry board
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides an integrated circuit testing arrangement, includes base (1), and place breach (2), its characterized in that have been seted up to the upper end of base (1): the novel multifunctional socket is characterized in that two sleeves (3) are arranged at the left end and the right end of the base (1), the two sleeves (3) at one side are respectively positioned at the front end and the rear end of the base (1), the sleeves (3) are fixedly connected with the bottom side surface of the base (1), a platform (4) is arranged above the base (1), four sliding columns (5) are fixedly arranged on the bottom surface of the platform (4), the four sliding columns (5) are correspondingly inserted into the four sleeves (3) below in an inserting mode respectively, electric push rods A (6) are fixedly arranged in the left end and the right end of the base (1), the output ends of the electric push rods A (6) are fixedly connected with the bottom surface of the platform (4), a clamp holder (7) is arranged below the platform (4), the clamp holder (7) is positioned above the base (1), four sliding rods (8) are fixed on the bottom surface of the platform (4), the clamp holder (7) is penetrated through by the four sliding rods (8), and the clamp holder (7) slides relative to the sliding rods (8), an electric push rod B (9) is fixedly installed at the upper end of the platform (4), and the output end of the electric push rod B (9) penetrates through the platform (4) and then is fixedly connected with the middle position of the upper surface of the holder (7);
the upper surface breach (2) fixed mounting of base (1) has cross slip table (10), and the upper end output fixed mounting of cross slip table (10) has transparent plate (11), and the equal fixed mounting in both ends has detector (12) around transparent plate (11), and the inside fixed grafting in upper end of transparent plate (11) has a plurality of point contact mechanism (13) of evenly arranging.
2. An integrated circuit testing device according to claim 1, wherein: the point contact mechanism (13) comprises a cylinder body (1301), a detection column (1302) and a touch needle (1303), the cylinder body (1301) is fixedly inserted into the transparent plate (11), the tip of the touch needle (1303) faces upwards and is fixedly installed at the bottom end of the cylinder body (1301), the detection column (1302) is inserted into the cylinder body (1301), a spring (1304) is arranged in the cylinder body (1301), the spring is compressed when the detection column (1302) is pressed downwards, and the detection column (1302) cannot pop up upwards when the spring (1304) is not compressed.
3. An integrated circuit testing device according to claim 2, wherein: the lower end of the detection column (1302) is of a tip structure, the touch needle (1303) and the detection column (1302) are coaxially arranged, and the tip of the detection column (1302) is close to the tip of the touch needle (1303).
4. An integrated circuit testing device according to claim 1, wherein: the upper surface of base (1) and the equal level setting in bottom surface of platform (4), the width of platform (4) and the width cooperation of breach (2).
5. An integrated circuit testing device according to claim 1, wherein: the bottom surface of the clamp holder (7) is of a horizontal structure, and the clamp holder (7) is parallel to the base (1) and the platform (4) at the same time.
6. An integrated circuit testing device according to claim 1, wherein: the transparent plate (11) is a transparent acrylic plate, the lower end of the point contact mechanism (13) is flush with the lower end of the transparent plate (11), and the detector (12) is attached to the transparent plate (11).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202111464035.7A CN114236349B (en) | 2021-12-02 | 2021-12-02 | Integrated circuit testing device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202111464035.7A CN114236349B (en) | 2021-12-02 | 2021-12-02 | Integrated circuit testing device |
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CN114236349A true CN114236349A (en) | 2022-03-25 |
CN114236349B CN114236349B (en) | 2024-05-14 |
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CN202111464035.7A Active CN114236349B (en) | 2021-12-02 | 2021-12-02 | Integrated circuit testing device |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114994498A (en) * | 2022-05-17 | 2022-09-02 | 珠海市精实测控技术有限公司 | Function testing device for bent PCB |
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CN210005639U (en) * | 2019-05-21 | 2020-01-31 | 无锡三石电子有限公司 | automatic test equipment for circuit board |
CN211402624U (en) * | 2019-09-27 | 2020-09-01 | 四川豪威尔信息科技有限公司 | Integrated circuit testing device with high testing efficiency |
CN212568846U (en) * | 2020-03-16 | 2021-02-19 | 深圳市富伟电子有限公司 | PCB intelligent test equipment |
CN212808509U (en) * | 2020-07-02 | 2021-03-26 | 芜湖欣宏电子科技有限公司 | Die assembly type circuit board ICT detection table |
CN213023440U (en) * | 2020-07-08 | 2021-04-20 | 昆山升菖电子有限公司 | Quick detection device of PCB circuit board |
CN214409211U (en) * | 2021-03-30 | 2021-10-15 | 深圳市承大实业发展有限公司 | Jig for testing high-precision integrated circuit |
WO2021220105A1 (en) * | 2020-04-27 | 2021-11-04 | Ipte Factory Automation N.V. | Device for testing a printed circuit board |
CN214703718U (en) * | 2021-04-02 | 2021-11-12 | 成都启功科技有限责任公司 | Pneumatic testing arrangement of integrated circuit board |
-
2021
- 2021-12-02 CN CN202111464035.7A patent/CN114236349B/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN210005639U (en) * | 2019-05-21 | 2020-01-31 | 无锡三石电子有限公司 | automatic test equipment for circuit board |
CN211402624U (en) * | 2019-09-27 | 2020-09-01 | 四川豪威尔信息科技有限公司 | Integrated circuit testing device with high testing efficiency |
CN212568846U (en) * | 2020-03-16 | 2021-02-19 | 深圳市富伟电子有限公司 | PCB intelligent test equipment |
WO2021220105A1 (en) * | 2020-04-27 | 2021-11-04 | Ipte Factory Automation N.V. | Device for testing a printed circuit board |
CN212808509U (en) * | 2020-07-02 | 2021-03-26 | 芜湖欣宏电子科技有限公司 | Die assembly type circuit board ICT detection table |
CN213023440U (en) * | 2020-07-08 | 2021-04-20 | 昆山升菖电子有限公司 | Quick detection device of PCB circuit board |
CN214409211U (en) * | 2021-03-30 | 2021-10-15 | 深圳市承大实业发展有限公司 | Jig for testing high-precision integrated circuit |
CN214703718U (en) * | 2021-04-02 | 2021-11-12 | 成都启功科技有限责任公司 | Pneumatic testing arrangement of integrated circuit board |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114994498A (en) * | 2022-05-17 | 2022-09-02 | 珠海市精实测控技术有限公司 | Function testing device for bent PCB |
CN114994498B (en) * | 2022-05-17 | 2023-03-10 | 珠海精实测控技术股份有限公司 | Function testing device for bent PCB |
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CN114236349B (en) | 2024-05-14 |
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Effective date of registration: 20240422 Address after: Room 1098, Building 1, No. 188 Changyi Road, Baoshan District, Shanghai, 2019 Applicant after: SHANGHAI BIZIDEAL CO.,LTD. Country or region after: China Address before: 231139 Building 1, Huayao glass, the intersection of Wan'an Avenue and JAC Avenue, Gangji Town, Changfeng County, Hefei City, Anhui Province Applicant before: Li Pan Country or region before: China |
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