CN114232089B - Periodic Modulation Method of Diamond Nucleation Density on Silicon Carbide Substrate - Google Patents
Periodic Modulation Method of Diamond Nucleation Density on Silicon Carbide Substrate Download PDFInfo
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- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 87
- 239000010432 diamond Substances 0.000 title claims abstract description 87
- 239000000758 substrate Substances 0.000 title claims abstract description 58
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title claims abstract description 53
- 229910010271 silicon carbide Inorganic materials 0.000 title claims abstract description 53
- 230000006911 nucleation Effects 0.000 title claims abstract description 31
- 238000010899 nucleation Methods 0.000 title claims abstract description 31
- 238000000034 method Methods 0.000 title claims abstract description 30
- 230000000737 periodic effect Effects 0.000 title claims abstract 4
- 239000002245 particle Substances 0.000 claims abstract description 56
- 239000007789 gas Substances 0.000 claims abstract description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000012495 reaction gas Substances 0.000 claims abstract description 8
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 8
- 239000010703 silicon Substances 0.000 claims abstract description 8
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 7
- 238000005520 cutting process Methods 0.000 claims description 2
- 238000003698 laser cutting Methods 0.000 claims description 2
- 210000002381 plasma Anatomy 0.000 abstract description 9
- 238000001878 scanning electron micrograph Methods 0.000 description 18
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 17
- 238000005229 chemical vapour deposition Methods 0.000 description 10
- 239000010408 film Substances 0.000 description 7
- 239000013078 crystal Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 238000001069 Raman spectroscopy Methods 0.000 description 2
- 238000001237 Raman spectrum Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000005137 deposition process Methods 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 239000012798 spherical particle Substances 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 229920001197 polyacetylene Polymers 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/04—Diamond
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/18—Epitaxial-layer growth characterised by the substrate
- C30B25/186—Epitaxial-layer growth characterised by the substrate being specially pre-treated by, e.g. chemical or physical means
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B28/00—Production of homogeneous polycrystalline material with defined structure
- C30B28/12—Production of homogeneous polycrystalline material with defined structure directly from the gas state
- C30B28/14—Production of homogeneous polycrystalline material with defined structure directly from the gas state by chemical reaction of reactive gases
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Abstract
Description
技术领域technical field
本申请涉及金刚石薄膜的化学气相沉积技术领域,尤其涉及一种金刚石在碳化硅衬底上成核密度周期性调制方法。The present application relates to the technical field of chemical vapor deposition of diamond films, in particular to a method for periodically modulating the nucleation density of diamond on a silicon carbide substrate.
背景技术Background technique
金刚石具有优异的光学、电学、机械和热学性能,因此具有巨大的应用潜力。特别是金刚石薄膜具有宽带隙、光学透明性和异常高导热性的特点,是一种理想的半导体材料。在高密度集成电路封装材料、保护涂层、电化学电极等高科技领域具有良好的应用前景。近年来,利用微波等离子体化学气相沉积(MPCVD)方法生长金刚石薄膜的研究受到了越来越多的关注,因为即使是多晶金刚石也比大多数现有的晶体具有更大的优势。特别是由高载流子迁移率和独特的光学特性驱动的最高声波速度和热导率,使金刚石薄膜成为许多新兴器件应用的理想材料,如超高频声滤波器、电力电子、集成光学电路以及量子换能器等。Diamond possesses excellent optical, electrical, mechanical and thermal properties, and thus has great application potential. In particular, thin diamond films are ideal semiconductor materials due to their wide bandgap, optical transparency, and exceptionally high thermal conductivity. It has good application prospects in high-tech fields such as high-density integrated circuit packaging materials, protective coatings, and electrochemical electrodes. In recent years, the growth of diamond thin films by microwave plasma chemical vapor deposition (MPCVD) has received increasing attention, because even polycrystalline diamond has great advantages over most existing crystals. In particular, the highest acoustic velocity and thermal conductivity driven by high carrier mobility and unique optical properties make diamond films ideal for many emerging device applications, such as ultra-high frequency acoustic filters, power electronics, integrated optical circuits, and quantum transducer etc.
用于金刚石薄膜生长的衬底有硅(Si)、钼(Mo)、碳化硅(SiC)等。由于与金刚石有关的衬底材料的晶格参数和结构是决定良好薄膜生长的重要考虑因素,所有衬底材料在获得良好的薄膜附着力方面的反应并不相同。金刚石与β-SiC的晶格匹配较好,晶格失配率约为18.2%(金刚石与Si的晶格失配率为52%)。因此,当SiC作为衬底时,更容易成核。另外,SiC材料热膨胀系数小,导热系数高,这些特性与金刚石非常相似,使得金刚石膜在SiC衬底上的附着力更好。结合两种材料的性能,具有很大的应用潜力。由于当前金刚石多晶的成核存在很多问题,很多研究表明,其热导率与晶粒尺寸之间存在密切的关系,为了对金刚石多晶的热导率进行调制,因此有必要对金刚石多晶的颗粒进行调制。The substrates used for diamond film growth include silicon (Si), molybdenum (Mo), silicon carbide (SiC) and the like. Since the lattice parameters and structure of diamond-related substrate materials are important considerations in determining good film growth, all substrate materials do not respond equally in achieving good film adhesion. The lattice matching of diamond and β-SiC is good, and the lattice mismatch rate is about 18.2% (the lattice mismatch rate of diamond and Si is 52%). Therefore, when SiC is used as the substrate, it is easier to nucleate. In addition, the SiC material has a small thermal expansion coefficient and a high thermal conductivity. These characteristics are very similar to diamond, which makes the adhesion of the diamond film on the SiC substrate better. Combining the properties of the two materials has great application potential. Since there are many problems in the nucleation of diamond polycrystals, many studies have shown that there is a close relationship between its thermal conductivity and grain size. In order to modulate the thermal conductivity of diamond polycrystals, it is necessary to particles are modulated.
发明内容Contents of the invention
为解决上述问题,本申请实施例提供了一种金刚石在碳化硅衬底上成核密度周期性调制方法。In order to solve the above problems, an embodiment of the present application provides a method for periodically modulating the nucleation density of diamond on a silicon carbide substrate.
本申请实施例提供的金刚石在碳化硅衬底上成核密度周期性调制方法,主要包括如下步骤:The method for periodically modulating the nucleation density of diamond on a silicon carbide substrate provided in the embodiment of the present application mainly includes the following steps:
在碳化硅衬底的碳面或硅面上制备凹槽;Prepare grooves on the carbon or silicon surface of the silicon carbide substrate;
将所述碳化硅衬底放置在CVD设备的生长腔内;placing the silicon carbide substrate in a growth chamber of a CVD device;
通入反应气体和辅助气体进行金刚石颗粒的生长,生长至预设时间后,将所述碳化硅衬底从所述生长腔内取出。The reaction gas and auxiliary gas are introduced to grow the diamond particles, and after the growth reaches a preset time, the silicon carbide substrate is taken out of the growth chamber.
本申请实施例提供的金刚石在碳化硅衬底上成核密度周期性调制方法,通过在碳化硅衬底的碳面或硅面上制备凹槽,然后,将制备有凹槽的碳化硅衬底放置在CVD设备的生长腔内,通入反应气体和辅助气体进行金刚石颗粒的生长,最后,生长至预设时间后,将所述碳化硅衬底从所述生长腔内取出,观察所述凹槽的底部、侧壁以及外部的金刚石颗粒形貌和成核密度。基于在金刚石颗粒生长过程中,处于凹槽不同的位置接触到等离子体有差异,使得凹槽不同位置的金刚石颗粒成核密度的差异,进而实现金刚石颗粒在碳化硅衬底上成核密度周期性调制。The method for periodically modulating the nucleation density of diamond on a silicon carbide substrate provided in the embodiment of the present application is to prepare grooves on the carbon or silicon surface of the silicon carbide substrate, and then prepare the silicon carbide substrate with the grooves placed in the growth chamber of the CVD equipment, fed with reaction gas and auxiliary gas to grow diamond particles, and finally, after growing for a preset time, the silicon carbide substrate was taken out of the growth chamber, and the concave Morphology and nucleation density of diamond particles at the bottom, sidewalls, and exterior of the groove. Based on the fact that during the growth process of diamond particles, different positions in the groove are exposed to different plasmas, which makes the nucleation density of diamond particles at different positions in the groove different, and then realizes the periodicity of the nucleation density of diamond particles on the silicon carbide substrate. modulation.
附图说明Description of drawings
此处的附图被并入说明书中并构成本说明书的一部分,示出了符合本发明的实施例,并与说明书一起用于解释本发明的原理。The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description serve to explain the principles of the invention.
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,对于本领域普通技术人员而言,在不付出创造性劳动性的前提下,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, for those of ordinary skill in the art, In other words, other drawings can also be obtained from these drawings without paying creative labor.
图1为本申请实施例提供的金刚石在碳化硅衬底上成核密度周期性调制方法的基本流程示意图;FIG. 1 is a schematic flow diagram of a method for periodically modulating the nucleation density of diamond on a silicon carbide substrate provided in an embodiment of the present application;
图2为本申请实施提供金刚石在SiC衬底上成核的原理图;Fig. 2 provides the schematic diagram of diamond nucleation on SiC substrate for the implementation of the present application;
图3a为甲烷浓度在1sccm、成核时间为10min,在SiC衬底凹槽底部沉积的金刚石颗粒的SEM图像;Figure 3a is an SEM image of diamond particles deposited at the bottom of the SiC substrate groove at a methane concentration of 1 sccm and a nucleation time of 10 min;
图3b为甲烷浓度在3sccm、成核时间为10min,在SiC衬底凹槽底部沉积的金刚石颗粒的SEM图像Figure 3b is an SEM image of diamond particles deposited at the bottom of the SiC substrate groove at a methane concentration of 3 sccm and a nucleation time of 10 min
图3c为甲烷浓度在6sccm、成核时间为10min,在SiC衬底凹槽底部沉积的金刚石颗粒的SEM图像;Figure 3c is an SEM image of diamond particles deposited at the bottom of the SiC substrate groove at a methane concentration of 6 sccm and a nucleation time of 10 min;
图3d为甲烷浓度在9sccm、成核时间为10min,在SiC衬底凹槽底部沉积的金刚石颗粒的SEM图像;Figure 3d is an SEM image of diamond particles deposited at the bottom of the SiC substrate groove at a methane concentration of 9 sccm and a nucleation time of 10 min;
图3e为甲烷浓度在12sccm、成核时间为10min,在SiC衬底凹槽底部沉积的金刚石颗粒的SEM图像;Figure 3e is an SEM image of diamond particles deposited at the bottom of the SiC substrate groove at a methane concentration of 12 sccm and a nucleation time of 10 min;
图4a为CH4流速为6sccm、生长时间为1h的条件下,在SiC衬底凹槽处沉积的金刚石颗粒的SEM图像;Figure 4a is an SEM image of diamond particles deposited at the SiC substrate groove under the conditions of a CH flow rate of 6 sccm and a growth time of 1 h;
图4b为图4a中凹槽底部沉积的金刚石颗粒的SEM图像;Figure 4b is an SEM image of the diamond particles deposited at the bottom of the groove in Figure 4a;
图4c为图4a中凹槽侧壁沉积的金刚石颗粒的第一SEM图像;Figure 4c is the first SEM image of the diamond particles deposited on the sidewall of the groove in Figure 4a;
图4d为图4a中凹槽侧壁沉积的金刚石颗粒的第二SEM图像;Figure 4d is the second SEM image of the diamond particles deposited on the sidewall of the groove in Figure 4a;
图4e为图4a中凹槽外部沉积的金刚石颗粒的第一SEM图像;Figure 4e is the first SEM image of diamond particles deposited outside the grooves in Figure 4a;
图4f为图4a中凹槽侧壁沉积的金刚石颗粒的第二SEM图像;Figure 4f is a second SEM image of the diamond particles deposited on the sidewall of the groove in Figure 4a;
图5为CH4流速为6sccm、生长时间为1h的条件下,在SiC衬底凹槽处成核的金刚石拉曼光谱。Figure 5 is the Raman spectrum of diamond nucleated at the SiC substrate groove under the conditions of CH4 flow rate of 6 sccm and growth time of 1 h.
具体实施方式Detailed ways
这里将详细地对示例性实施例进行说明,其示例表示在附图中。下面的描述涉及附图时,除非另有表示,不同附图中的相同数字表示相同或相似的要素。以下示例性实施例中所描述的实施方式并不代表与本发明相一致的所有实施方式。相反,它们仅是与如所附权利要求书中所详述的、本发明的一些方面相一致的装置和方法的例子。Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the present invention. Rather, they are merely examples of apparatuses and methods consistent with aspects of the invention as recited in the appended claims.
本实施例利用微波等离子体化学气相沉积(Microwave Plasma Chemical VaporDeposition,MPCVD)法进行金刚石薄膜沉积,采用的是俄罗斯Optosystems公司生产的ARDIS-300MPCVD设备述原理,在具体实施过程中也可以采用CVD(化学气相沉积,ChemicalVapor Deposition)的设备,本实施例不作具体限定。This embodiment utilizes microwave plasma chemical vapor deposition (Microwave Plasma Chemical VaporDeposition, MPCVD) method to carry out diamond thin film deposition, what adopted is the ARDIS-300MPCVD equipment that Russian Optosystems Company produces to describe the principle, also can adopt CVD (chemical Vapor deposition, Chemical Vapor Deposition) equipment, this embodiment does not specifically limit.
下面将结合附图对本实施例提供的方法进行详细介绍。如图1为本实施例提供的金刚石在碳化硅衬底上成核密度周期性调制方法的基本流程示意图,该方法主要包括如下步骤:The method provided by this embodiment will be described in detail below with reference to the accompanying drawings. Figure 1 is a schematic diagram of the basic flow of the method for periodically modulating the nucleation density of diamond on a silicon carbide substrate provided in this embodiment. The method mainly includes the following steps:
S101:在碳化硅衬底的碳面或硅面上制备凹槽。S101: Prepare grooves on the carbon surface or the silicon surface of the silicon carbide substrate.
具体的,可以在碳化硅衬底的C面或Si面上,使用采用激光切割或锯片机切割的方法制作沟槽,沟槽可以均匀排布也可以为非均匀排布,沟槽可以交互排布也可以为非交互排布,在尺寸上,沟槽的宽度可以为100~500μm,沟槽的深度可以为50~300μm,但并不于该数值范围。为了更好的观察凹槽不同位置的成核情况,优选地,设置凹槽的截面形状为方形,具体可以是长方形也可以是正方形结构。Specifically, the grooves can be made on the C surface or the Si surface of the silicon carbide substrate by laser cutting or cutting with a saw blade. The grooves can be arranged uniformly or non-uniformly, and the grooves can be alternately arranged. The arrangement can also be a non-alternative arrangement. In terms of size, the width of the grooves can be 100-500 μm, and the depth of the grooves can be 50-300 μm, but not within this numerical range. In order to better observe the nucleation conditions at different positions of the groove, preferably, the cross-sectional shape of the groove is set to be a square, specifically, it may be a rectangle or a square structure.
S102:将所述碳化硅衬底放置在CVD设备的生长腔内。S102: Place the silicon carbide substrate in a growth chamber of a CVD device.
沟槽制作完毕后,可以依次采用氢氟酸、丙酮、无水乙醇和去离子水对碳化硅衬底进行表面清洁处理,以去除制作沟槽时产生的碎屑,当然,并不限于该清洗方式。After the groove is made, the surface of the silicon carbide substrate can be cleaned with hydrofluoric acid, acetone, absolute ethanol and deionized water in order to remove the debris generated when the groove is made. Of course, it is not limited to this cleaning Way.
S103:通入反应气体和辅助气体进行金刚石颗粒的生长,生长至预设时间后,将所述碳化硅衬底从所述生长腔内取出。S103: The reaction gas and the auxiliary gas are introduced to grow the diamond particles, and after the growth reaches a preset time, the silicon carbide substrate is taken out of the growth chamber.
将碳化硅衬底放置在MPCVD设备的生长腔内后,通入H2、CH4作为反应气体、Ar、O2和/或N2等作为辅助气体进行金刚石颗粒的生长,其中,本实施例中的辅助气体起到调节金刚石颗粒大小、成核质量等作用。After the silicon carbide substrate is placed in the growth chamber of the MPCVD equipment, H 2 and CH 4 are introduced as reaction gases, and Ar, O 2 and/or N 2 are used as auxiliary gases to grow diamond particles. Among them, the present embodiment The auxiliary gas plays the role of adjusting the size of diamond particles and the quality of nucleation.
本实施例中,使用的微波功率为2000~8000W,用双干涉红外辐射热高温计测量所述碳化硅衬底温度为800-1100℃,衬底温度由发射率为0.1的双干涉红外辐射热高温计通过2mm狭缝测量所得,沉积过程利用H2和CH4在150Torr左右的压力下进行,H2的流量约为50~600sccm,CH4的流量为1~40sccm。In this embodiment, the microwave power used is 2000-8000W, and the temperature of the silicon carbide substrate measured by a double-interference infrared radiant pyrometer is 800-1100°C. The pyrometer is measured through a 2mm slit. The deposition process uses H 2 and CH 4 at a pressure of about 150 Torr. The flow rate of H 2 is about 50-600 sccm, and the flow rate of CH 4 is 1-40 sccm.
为更好的观察金刚石成核过程,本实施例利用多个碳化硅衬底,分别在不同的CH4流速和不同的生长时间下进行金刚石颗粒的生长。具体的,设定H2的流速为第一预设值,分别设定不同的CH4流速进行金刚石颗粒的生长,生长时间为第一预设时间,例如,可以设定H2的流速为150~300sccm中的任一值、CH4的流速分别为1sccm、3sccm、6sccm、9sccm和12sccm进行金刚石颗粒的生长,生长时间为5~15min;设定H2的流速为第一预设值,设定CH4流速为第二预设值进行金刚石颗粒的生长,生长时间为第二预设时间。其中,所述第二预设时间大于所述第一预设时间;CH4流速的第二预设值为生长时间为第一预设时间时,所选用的CH4流速中的任一值。例如,设定H2的流速为150~300sccm中的任一值、CH4流速为1sccm、3sccm、6sccm、9sccm和12sccm中的任一值,生长时间为0.5~1.5h。In order to better observe the diamond nucleation process, this embodiment uses multiple silicon carbide substrates to grow diamond particles at different CH 4 flow rates and different growth times. Concretely, the flow velocity of setting H 2 is the first preset value, different CH flow velocities are respectively set to carry out the growth of diamond particles, and the growth time is the first preset time, for example, the flow velocity of H 2 can be set as 150 Arbitrary value in ~ 300sccm, the flow velocity of CH is respectively 1sccm, 3sccm, 6sccm, 9sccm and 12sccm to carry out the growth of diamond particles, and the growth time is 5 ~ 15min; the flow velocity of setting H 2 is the first preset value, and the Set the flow rate of CH 4 as the second preset value to grow the diamond particles, and the growth time is the second preset time. Wherein, the second preset time is greater than the first preset time; the second preset value of the CH 4 flow rate is any value of the selected CH 4 flow rate when the growth time is equal to the first preset time. For example, set the flow rate of H2 to be any value in 150-300 sccm, the flow rate of CH4 to be any value in 1 sccm, 3 sccm, 6 sccm, 9 sccm and 12 sccm, and the growth time to be 0.5-1.5 h.
图2为本申请实施提供金刚石在SiC衬底上成核的原理图。如图2所示,基于在金刚石颗粒生长过程中,处于凹槽不同的位置接触到等离子体有差异,其中,凹槽底部接触到的等离子体最少进而金刚石颗粒成核密度最低,凹槽外部接触到的等离子体最多进而金刚石颗粒成核密度最大,这样凹槽不同的位置金刚石颗粒成核密度的差异,进而实现金刚石颗粒在凹槽不同的位置的调制,即金刚石颗粒实现碳化硅衬底上成核密度周期性调制。FIG. 2 is a schematic diagram of diamond nucleation on a SiC substrate provided for the implementation of the present application. As shown in Figure 2, based on the fact that during the growth of diamond particles, there are differences in exposure to plasma at different positions in the groove. Among them, the plasma at the bottom of the groove is the least exposed and the nucleation density of diamond particles is the lowest, and the outside of the groove is exposed to plasma. The most plasma is received and the nucleation density of diamond particles is the highest, so that the difference in the nucleation density of diamond particles in different positions of the groove can realize the modulation of diamond particles in different positions of the groove, that is, the diamond particles can be formed on the silicon carbide substrate. Nuclei density is periodically modulated.
基于上述方法,下面将结合实例,对成核过程观察方法进行进一步介绍。本实施例在碳化硅衬底的C面采用锯片机法制备凹槽,凹槽间隔1mm,凹槽的深度110μm、宽度200μm,清洗后,将样品放置在MPCVD。使用微波功率为4000W、用双干涉红外辐射热高温计测量衬底温度为900℃,衬底温度由发射率为0.1的双干涉红外辐射热高温计通过2mm狭缝测量所得,沉积过程在150Torr的压力下进行。H2的流速为150sccm,CH4的流速为1sccm、3sccm、6sccm、9sccm和12sccm,生长时间10min;另一个样品进行1h的生长,CH4的流速为6sccm,其他条件不变。Based on the above method, the observation method of the nucleation process will be further introduced in combination with examples below. In this embodiment, grooves are prepared on the C surface of the silicon carbide substrate by saw blade method, the groove interval is 1 mm, the depth of the groove is 110 μm, and the width is 200 μm. After cleaning, the sample is placed in MPCVD. Using a microwave power of 4000W, the substrate temperature was measured at 900°C with a double-interference infrared bolometer. The substrate temperature was measured by a double-interference infrared bolometer with an emissivity of 0.1 through a 2mm slit. The deposition process was carried out at 150 Torr. Do it under pressure. The flow rate of H 2 was 150 sccm, the flow rate of CH 4 was 1 sccm, 3 sccm, 6 sccm, 9 sccm and 12 sccm, and the growth time was 10 min; another sample was grown for 1 h, the flow rate of CH 4 was 6 sccm, and other conditions remained unchanged.
将样品取出,进行观察,本实施例采用扫描电子显微镜(SEM)观察金刚石颗粒的形貌。如图3a、3b、3c、3d和3e中分别为甲烷浓度在1sccm、3sccm、6sccm、9sccm和12sccm,成核时间为10min,在SiC衬底凹槽底部沉积的金刚石颗粒的SEM图像。图3a~3e所示,随着甲烷浓度的增加,球形颗粒逐渐增多。The sample was taken out for observation. In this embodiment, a scanning electron microscope (SEM) was used to observe the morphology of the diamond particles. Figures 3a, 3b, 3c, 3d and 3e are SEM images of diamond particles deposited at the bottom of SiC substrate grooves at methane concentrations of 1 sccm, 3 sccm, 6 sccm, 9 sccm and 12 sccm, and nucleation time of 10 min, respectively. As shown in Figures 3a-3e, as the methane concentration increases, the number of spherical particles gradually increases.
图4a为CH4流速为6sccm、生长时间为1h的条件下,在SiC衬底凹槽处沉积的金刚石颗粒的SEM图像,可以为出凹槽内颗粒分布致密。图4b为图4a中凹槽底部沉积的金刚石颗粒的SEM图像,即图4a中A区域的放大图,中间区晶粒尺寸大于5μm。Figure 4a is the SEM image of the diamond particles deposited in the groove of the SiC substrate under the condition that the flow rate of CH 4 is 6 sccm and the growth time is 1 h. It can be seen that the particle distribution in the groove is dense. Fig. 4b is an SEM image of diamond particles deposited at the bottom of the groove in Fig. 4a, that is, an enlarged view of area A in Fig. 4a, and the grain size in the middle region is greater than 5 μm.
图4c为图4a中凹槽侧壁沉积的金刚石颗粒的第一SEM图像,图4d为图4a中凹槽侧壁沉积的金刚石颗粒的第二SEM图像,即图4a中B区域的放大图,可以看出槽侧壁附近的晶粒呈半球形,晶面逐渐光滑,并且颗粒由球体逐渐形成一个扁平的方形平面,颗粒表面有许多细小的方形面。图4e为图4a中凹槽外部沉积的金刚石颗粒的第一SEM图像,即图4a中C区域的放大图,可以看出位于槽口附近金刚石晶粒明显呈单晶金刚石形状,晶面多为方形和三角形。晶粒与衬底之间存在一层键合层;图4f为图4a中凹槽侧壁沉积的金刚石颗粒的第二SEM图像,凹槽侧壁的金刚石颗粒呈现棱角八面体形状,呈现平坦的方形(100)面和粗糙的六角形(111)面。Figure 4c is the first SEM image of the diamond particles deposited on the sidewall of the groove in Figure 4a, and Figure 4d is the second SEM image of the diamond particles deposited on the sidewall of the groove in Figure 4a, that is, the enlarged view of the B area in Figure 4a, It can be seen that the crystal grains near the side wall of the groove are hemispherical, the crystal plane is gradually smooth, and the grain gradually forms a flat square plane from a sphere, and there are many small square planes on the grain surface. Figure 4e is the first SEM image of the diamond particles deposited outside the groove in Figure 4a, that is, the enlarged view of area C in Figure 4a, it can be seen that the diamond grains near the groove are obviously in the shape of single crystal diamond, and the crystal planes are mostly square and triangle. There is a bonding layer between the crystal grains and the substrate; Figure 4f is the second SEM image of the diamond particles deposited on the sidewall of the groove in Figure 4a, the diamond particles on the sidewall of the groove are in the shape of an angular octahedron, showing a flat Square (100) faces and rough hexagonal (111) faces.
图5为CH4流速为6sccm、生长时间为1h的条件下,在SiC衬底凹槽处成核的金刚石拉曼光谱。本实施例分别测定了凹槽底部、凹槽侧壁和凹槽外三个位置,①、②和③表示了零应力金刚石、石墨和反式聚乙炔的拉曼位移位置。根据图5的拉曼结果显示,凹槽内球状颗粒为石墨,凹槽侧壁为金刚石颗粒,凹槽外的颗粒金刚石相更为明显。Figure 5 is the Raman spectrum of diamond nucleated at the SiC substrate groove under the conditions of CH4 flow rate of 6 sccm and growth time of 1 h. In this embodiment, three positions at the bottom of the groove, at the side wall of the groove and outside the groove were respectively measured. ①, ② and ③ represent the Raman shift positions of zero-stress diamond, graphite and trans-polyacetylene. According to the Raman results in Figure 5, the spherical particles in the groove are graphite, the side walls of the groove are diamond particles, and the diamond phase outside the groove is more obvious.
本说明书中的各个实施例均采用递进的方式描述,各个实施例之间相同相似的部分互相参见即可,每个实施例重点说明的都是与其他实施例的不同之处。本领域技术人员在考虑说明书及实践这里申请的公开后,将容易想到本申请的其它实施方案。本申请旨在涵盖本申请的任何变型、用途或者适应性变化,这些变型、用途或者适应性变化遵循本申请的一般性原理并包括本申请未公开的本技术领域中的公知常识或惯用技术手段。说明书和实施例仅被视为示例性的,本申请的真正范围和精神由下面的权利要求指出。Each embodiment in this specification is described in a progressive manner, the same and similar parts of each embodiment can be referred to each other, and each embodiment focuses on the differences from other embodiments. Other embodiments of the present application will be readily apparent to those skilled in the art from consideration of the specification and practice of the disclosure of this application. This application is intended to cover any modification, use or adaptation of the application, these modifications, uses or adaptations follow the general principles of the application and include common knowledge or conventional technical means in the technical field not disclosed in the application . The specification and examples are to be considered exemplary only, with a true scope and spirit of the application indicated by the following claims.
应当理解的是,本申请并不局限于上面已经描述并在附图中示出的精确结构,并且可以在不脱离其范围进行各种修改和改变。本申请的范围仅由所附的权利要求来限制。It should be understood that the present application is not limited to the precise constructions which have been described above and shown in the accompanying drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the application is limited only by the appended claims.
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