CN114228274A - Halogen-free high-Tg high-speed copper-clad plate for communication server and preparation method thereof - Google Patents
Halogen-free high-Tg high-speed copper-clad plate for communication server and preparation method thereof Download PDFInfo
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- CN114228274A CN114228274A CN202111574939.5A CN202111574939A CN114228274A CN 114228274 A CN114228274 A CN 114228274A CN 202111574939 A CN202111574939 A CN 202111574939A CN 114228274 A CN114228274 A CN 114228274A
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- resin
- copper
- clad plate
- halogen
- copper foil
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- 238000004891 communication Methods 0.000 title claims abstract description 26
- 238000002360 preparation method Methods 0.000 title abstract description 18
- 229920005989 resin Polymers 0.000 claims abstract description 142
- 239000011347 resin Substances 0.000 claims abstract description 142
- 239000003292 glue Substances 0.000 claims abstract description 70
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 45
- 239000011889 copper foil Substances 0.000 claims abstract description 42
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 41
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 41
- 239000011574 phosphorus Substances 0.000 claims abstract description 41
- 239000003063 flame retardant Substances 0.000 claims abstract description 38
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 claims abstract description 37
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims abstract description 33
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 26
- 239000003822 epoxy resin Substances 0.000 claims abstract description 24
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 24
- 239000000945 filler Substances 0.000 claims abstract description 23
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 22
- CMLFRMDBDNHMRA-UHFFFAOYSA-N 2h-1,2-benzoxazine Chemical compound C1=CC=C2C=CNOC2=C1 CMLFRMDBDNHMRA-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 13
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000005011 phenolic resin Substances 0.000 claims abstract description 11
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 11
- PYSRRFNXTXNWCD-UHFFFAOYSA-N 3-(2-phenylethenyl)furan-2,5-dione Chemical compound O=C1OC(=O)C(C=CC=2C=CC=CC=2)=C1 PYSRRFNXTXNWCD-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229920000147 Styrene maleic anhydride Polymers 0.000 claims abstract description 10
- 235000012239 silicon dioxide Nutrition 0.000 claims abstract description 9
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims abstract description 7
- 229910019142 PO4 Inorganic materials 0.000 claims abstract description 5
- GKTNLYAAZKKMTQ-UHFFFAOYSA-N n-[bis(dimethylamino)phosphinimyl]-n-methylmethanamine Chemical compound CN(C)P(=N)(N(C)C)N(C)C GKTNLYAAZKKMTQ-UHFFFAOYSA-N 0.000 claims abstract description 5
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims abstract description 5
- 239000010452 phosphate Substances 0.000 claims abstract description 5
- 238000002156 mixing Methods 0.000 claims description 20
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 18
- 239000004744 fabric Substances 0.000 claims description 14
- 239000003365 glass fiber Substances 0.000 claims description 14
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 14
- 238000003756 stirring Methods 0.000 claims description 11
- XAZPKEBWNIUCKF-UHFFFAOYSA-N 1-[4-[4-[2-[4-[4-(2,5-dioxopyrrol-1-yl)phenoxy]phenyl]propan-2-yl]phenoxy]phenyl]pyrrole-2,5-dione Chemical compound C=1C=C(OC=2C=CC(=CC=2)N2C(C=CC2=O)=O)C=CC=1C(C)(C)C(C=C1)=CC=C1OC(C=C1)=CC=C1N1C(=O)C=CC1=O XAZPKEBWNIUCKF-UHFFFAOYSA-N 0.000 claims description 8
- 238000001035 drying Methods 0.000 claims description 8
- 239000002245 particle Substances 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 238000006243 chemical reaction Methods 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000002131 composite material Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 2
- 238000002791 soaking Methods 0.000 claims description 2
- YBUPZEKLPLIZNR-UHFFFAOYSA-N C.C(C)C=1C=CC=C(C1N1C(C=CC1=O)=O)C.C(C)C=1C=CC=C(C1N1C(C=CC1=O)=O)C Chemical compound C.C(C)C=1C=CC=C(C1N1C(C=CC1=O)=O)C.C(C)C=1C=CC=C(C1N1C(C=CC1=O)=O)C YBUPZEKLPLIZNR-UHFFFAOYSA-N 0.000 claims 1
- 238000009413 insulation Methods 0.000 claims 1
- 239000012774 insulation material Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 150000001875 compounds Chemical class 0.000 abstract 2
- 239000010410 layer Substances 0.000 description 24
- 239000000203 mixture Substances 0.000 description 21
- 239000000126 substance Substances 0.000 description 11
- 238000005303 weighing Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 239000000047 product Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 230000002195 synergetic effect Effects 0.000 description 4
- DXZMANYCMVCPIM-UHFFFAOYSA-L zinc;diethylphosphinate Chemical compound [Zn+2].CCP([O-])(=O)CC.CCP([O-])(=O)CC DXZMANYCMVCPIM-UHFFFAOYSA-L 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- YUWBVKYVJWNVLE-UHFFFAOYSA-N [N].[P] Chemical compound [N].[P] YUWBVKYVJWNVLE-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 230000007062 hydrolysis Effects 0.000 description 2
- 238000006460 hydrolysis reaction Methods 0.000 description 2
- 230000033001 locomotion Effects 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical class [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- 241000282414 Homo sapiens Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000012648 alternating copolymerization Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000004643 cyanate ester Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 230000026030 halogenation Effects 0.000 description 1
- 238000005658 halogenation reaction Methods 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 230000006855 networking Effects 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920013636 polyphenyl ether polymer Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2435/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Derivatives of such polymers
- C08J2435/06—Copolymers with vinyl aromatic monomers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2461/00—Characterised by the use of condensation polymers of aldehydes or ketones; Derivatives of such polymers
- C08J2461/04—Condensation polymers of aldehydes or ketones with phenols only
- C08J2461/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2461/00—Characterised by the use of condensation polymers of aldehydes or ketones; Derivatives of such polymers
- C08J2461/34—Condensation polymers of aldehydes or ketones with monomers covered by at least two of the groups C08J2461/04, C08J2461/18, and C08J2461/20
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/5399—Phosphorus bound to nitrogen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/14—Glass
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
- C08K7/18—Solid spheres inorganic
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
The invention discloses a halogen-free high-Tg high-speed copper-clad plate for a communication server and a preparation method thereof, belonging to the technical field of copper-clad plates for 5G communication servers and production processes thereof. The prepared copper-clad plate comprises a bottom copper foil layer, a top copper foil layer and an insulating medium layer which is positioned between the bottom copper foil layer and the top copper foil layer and is formed by superposing a plurality of prepregs, wherein a resin glue solution used by each prepreg comprises a multifunctional group phosphorus epoxy resin, a maleimide resin, a curing agent, a flame retardant and a filler, the resin glue solution takes a compound of a modified multifunctional group phosphorus epoxy resin and a plurality of maleimide resins as a main resin system, a phosphorus-containing phenolic resin, a benzoxazine resin and a styrene-maleic anhydride resin as a curing agent, a compound flame retardant system of a phosphate flame retardant and a phosphazene flame retardant, and spherical aluminum hydroxide and spherical silicon dioxide as fillers.
Description
Technical Field
The invention relates to a copper-clad plate and a preparation method thereof, in particular to a halogen-free high-Tg high-speed copper-clad plate for a communication server and a preparation method thereof, belonging to the technical field of the copper-clad plate for the 5G communication server and the production process thereof.
Background
With the development of scientific information technology in various countries, various electronic products are produced and used worldwide, and the most core part of electronic equipment is the circuit board, but the circuit board and components generate a lot of harmful substances in the manufacturing process. In contrast, the European Union and the continent of China promulgate the ROHS instruction of harmful substances, and clearly indicate that the substances such as mercury, lead, cadmium and the like cannot be used for manufacturing electronic products; meanwhile, green and peace organizations are also beginning to strongly enforce green policies, and all electronic manufacturers are definitely required not to use brominated flame retardants and polyvinyl chloride in electronic products, but to manufacture lead-free and halogen-free green electronic devices. However, in order to improve the flame retardant coefficient of the circuit board and reduce the production cost in the manufacture of a plurality of circuit boards in China, bromine compounds are still contained in the circuit boards; the halide can release a large amount of corrosive harmful gases in the combustion process, thereby not only polluting the environment, but also being harmful to the health of human beings.
In recent years, rapid development of global information technology towards digitization and networking, ultra-large capacity information transmission, ultra-fast speed and ultra-high density information processing have become targets for the development of information and communication equipment (ICT) technology. The achievement of these goals poses unprecedented challenges for system design, end product processing, PCB, copper clad laminate, copper foil fabrication, and the like. The application of non-halogenation to a substrate material for a high-speed digital circuit dedicated for communication, internet equipment and server PCBs with low transmission loss has become the mainstream trend of the current market, and few copper-clad plates capable of being applied to a 5G communication server and meeting the requirements simultaneously in the prior art are currently available, which becomes a research hotspot in the technical field of current copper-clad plate research.
Disclosure of Invention
In order to solve the technical problems, the invention provides a halogen-free high-Tg high-speed copper-clad plate for a communication server and a preparation method thereof, wherein the copper-clad plate prepared by the method belongs to the copper-clad plate for the 5G communication server, has the characteristics of high frequency, high speed, high heat resistance, excellent flame retardant property, low thermal expansion coefficient, good dimensional stability and the like, and is simple and easy to operate.
The technical scheme of the invention is as follows:
the halogen-free high-Tg high-speed copper-clad plate for the communication server comprises a bottom copper foil layer positioned on a bottom layer and a top copper foil layer positioned on a top layer, wherein an insulating medium layer is arranged between the bottom copper foil layer and the top copper foil layer and is formed by overlapping 1-8 pieces of prepreg, and each piece of prepreg is obtained by soaking glass fiber cloth in resin glue solution and then drying.
The thicknesses of the bottom copper foil layer and the top copper foil layer in the copper-clad plate are respectively 3-150 mu m.
The resin glue solution in the copper-clad plate comprises the following components in parts by weight: 400-500 parts of modified multifunctional phosphorus epoxy resin, 450-550 parts of maleimide resin, 350-400 parts of curing agent, 200-250 parts of flame retardant and 900-1000 parts of filler.
The resin glue solution of the invention adopts modified multifunctional phosphorus epoxy resin, and south Asia NPEP210 resin is preferably selected in the specific embodiment. The resin simultaneously contains two flame-retardant elements of silicon and phosphorus, phosphorus is introduced into a cured epoxy resin to form a stable phosphorus-containing substance, and the introduction of silicon can form a stable protective layer so as to achieve the flame-retardant effect, and the resin reacts with phosphorus-containing and nitrogen-containing resins (phosphorus-containing phenolic resin) and flame retardants (phosphate flame retardant and phosphazene flame retardant) to realize N-P compounding/synergetic flame retardance and enters a cross-linked network of the epoxy resin. Meanwhile, the dendritic substance is formed by self hydrolysis and condensation, and the chain segment motion of the epoxy resin condensate is limited by the rigidity and the steric hindrance of the dendritic substance, so that the Tg of the plate is improved, high heat resistance can be achieved, and the good toughness of the plate is kept, thereby facilitating processing.
The maleimide resin adopted in the resin glue solution is obtained by uniformly mixing a first maleimide resin, a second maleimide resin and a third maleimide resin according to the mass ratio of (4-6) to (1-2) to 1. Wherein the first maleimide resin is 4,4' -bismaleimide diphenylmethane, the second maleimide resin is bis (3-ethyl-5-methyl-4-maleimide phenyl) methane, and the third maleimide resin is 2, 2-bis (4- (4-maleimide phenoxy) phenyl) propane. More preferably, the maleimide resin is obtained by uniformly mixing 4,4' -bismaleimide diphenylmethane, bis (3-ethyl-5-methyl-4-maleimide benzene) methane and 2, 2-bis (4- (4-maleimide phenoxy) phenyl) propane according to the mass ratio of 4:1: 1. Among the three resins, 4,4' -bismaleimide diphenylmethane and 2, 2-bis (4- (4-maleimide phenoxy) phenyl) propane have poor solubility, and Df performance is between that of cyanate ester and epoxy resin, but the cost is low and the Tg is high; the bis (3-ethyl-5-methyl-4-maleimide benzene) methane Df is low and has good solubility. The three maleimide resins are mixed for use, and compared with the prior art that a single maleimide resin is used, the Df can be kept low, and the cost can be greatly reduced.
The curing agent adopted in the resin glue solution is obtained by uniformly mixing phosphorus-containing phenolic resin, benzoxazine resin and styrene-maleic anhydride resin according to a mass ratio of 10 (8-10) to (7-9), and the preferred ratio is 10:9: 9. In the curing agent system, SMA (styrene-maleic anhydride) resin formed by copolymerizing styrene and maleic anhydride is additionally added into common phosphorus-containing phenolic resin, wherein the maleic anhydride is difficult to homopolymerize under common conditions due to steric hindrance effect, but easily forms a charge transfer complex with the styrene under the electrostatic action, and free radical polymerization is carried out under the action of an initiator to form a typical binary alternating copolymerization structure, and the curing agent system is low in price and has good heat resistance and size stability; and when the epoxy resin is cured, the Df performance of the plate can be reduced, and the CAF resistance performance can be greatly improved by reacting with the maleimide resin for mixing. Meanwhile, the benzoxazine resin is added, so that the benzoxazine resin has excellent heat resistance and moisture resistance, good dielectric property (dielectric constant: 2.2-3.5, 1GHz) and dimensional stability, the nitrogen element of the benzoxazine resin and the phosphorus element in the phosphorus-containing raw material can form a phosphorus-nitrogen synergistic flame retardant effect, the cured structure of the resin has a certain flame retardant effect, and the benzoxazine resin is used in a halogen-free flame retardant product, so that the addition amount of the phosphorus-containing raw material can be reduced, the phosphorus content in the system is reduced, the N-P composite flame retardant is realized, and the halogen-free flame retardant is realized.
The flame retardant adopted in the resin glue solution is obtained by uniformly mixing the phosphate flame retardant and the phosphazene flame retardant according to the mass ratio of 1: 1.
The filler adopted in the resin glue solution is obtained by uniformly mixing spherical alumina and spherical silica according to the mass ratio of 1 (2-3), preferably 1:2, and the particle diameters of the spherical alumina and the spherical silica are 0.7-2.0 mu m. According to the application, the mixture of spherical alumina and spherical silica with relatively consistent particle size is selected in the aspect of filler, and the mixture has excellent characteristics of high heat resistance, low thermal expansion coefficient, low dielectric constant, low dielectric loss and the like, so that the electrical property of the high-speed copper-clad plate for the halogen-free high-TG communication server is greatly improved.
The invention also discloses a preparation method of the halogen-free high-Tg high-speed copper-clad plate for the communication server, which mainly comprises the following steps:
s1, preparing resin glue solution: adding 400-500 parts by weight of modified multifunctional phosphorus epoxy resin, 450-550 parts by weight of maleimide resin, 350-400 parts by weight of curing agent, 200-250 parts by weight of flame retardant and 900-1000 parts by weight of filler into a reaction kettle, and stirring for 4-6 hours at 30-40 ℃;
s2, coating the resin glue solution prepared in the step S1 on two sides of the glass fiber cloth, and drying for 2-4 min at 200-250 ℃, wherein the prepared glass fiber cloth impregnated sheet is a prepreg;
and S3, according to the thickness and the shape structure required by the final copper-clad plate, 1-8 pieces of the prepreg prepared in the step S2 are stacked together and cut, finally, a layer of copper foil is covered on two sides to be used as a top copper foil layer and a bottom copper foil layer respectively, the two sides are hot-pressed for 180-200 min under the conditions of-700 to-730 mmHg and 200-220 ℃, and then the two sides are naturally cooled to room temperature to obtain the required copper-clad plate.
The beneficial technical effects of the invention are as follows:
1. the modified multifunctional phosphorus epoxy resin adopted by the resin glue solution contains silicon and phosphorus flame retardant elements, wherein phosphorus is introduced into a cured epoxy resin to form a stable phosphorus-containing substance, and the introduction of silicon can form a stable protective layer so as to achieve a flame retardant effect, and the modified multifunctional phosphorus epoxy resin reacts with phosphorus-containing and nitrogen-containing resin (phosphorus-containing phenolic resin) and a flame retardant (a phosphate flame retardant and a phosphazene flame retardant) to realize N-P compounding/synergetic flame retardance and enters a cross-linked network of the epoxy resin; meanwhile, due to the hydrolysis and condensation of the dendritic substance, the dendritic substance can form a dendritic substance, and the rigidity and the steric hindrance of the dendritic substance limit the chain segment movement of the cured epoxy resin, so that the Tg of the plate is improved, and the plate can achieve high heat resistance and maintain good toughness of the plate.
2. The resin glue solution of the application adopts three maleimide resins to be mixed for use, and compared with the prior art that a single maleimide resin is used, the cost can be greatly reduced while the Df is kept low.
3. The curing agent adopted by the resin glue solution is added with SMA resin and benzoxazine in the phosphorus-containing phenolic resin, so that the Df performance of the plate can be reduced when the SMA resin and the benzoxazine are cured with epoxy resin, and the CAF resistance can be greatly improved through reaction with the compounded maleimide resin; the added benzoxazine resin has excellent heat resistance, moisture resistance, good dielectric property (dielectric constant: 2.2-3.5, 1GHz) and dimensional stability, the nitrogen element of the benzoxazine resin and the phosphorus element in the phosphorus-containing raw material can form a phosphorus-nitrogen synergistic flame retardant effect, the cured structure of the resin has a certain flame retardant effect, and the benzoxazine resin is used in a halogen-free flame retardant product, can reduce the addition of the phosphorus-containing raw material, reduce the phosphorus content in the system, realize N-P composite flame retardance and further realize halogen-free flame retardance.
4. The resin glue solution filler is a mixture of spherical alumina and spherical silica with relatively consistent particle size, and has excellent characteristics of high heat resistance, low thermal expansion coefficient, low dielectric constant, low dielectric loss and the like, so that the electrical property of the high-speed copper-clad plate for the halogen-free high-TG communication server is greatly improved.
5. In the preparation of the copper-clad plate, the preparation process of coating and presoaking, cutting, copper-clad, hot pressing and cooling is adopted, the operation is simple and convenient, the production of the copper-clad plate can be completed by using conventional equipment, and the large-scale production is facilitated.
In conclusion, by selecting the components and the proportion of the resin glue solution, the copper-clad plate has excellent performances such as high heat resistance, high toughness, high ion migration resistance, good dimensional stability, low thermal expansion coefficient, low dielectric constant, low dielectric loss and the like, and particularly has more outstanding advantages in the aspect of stable high-temperature mechanical properties (mainly comprising bending strength property at high temperature, elastic modulus, copper foil bonding strength property, surface hardness and the like) compared with substrate materials made of other resins (such as substrate materials made of common epoxy resin, polyimide resin, polyphenyl ether resin and the like), so that the copper-clad plate has better applicability in the fields of 5G communication servers and the like.
Detailed Description
In order to clearly understand the technical means of the present invention and to implement the technical means according to the content of the specification, the following embodiments are further described in detail in the following with reference to the specific examples, which are used for illustrating the present invention and are not intended to limit the scope of the present invention.
When the copper-clad plates of the following specific examples and comparative examples are prepared, the resin glue solution adopted is composed as follows. The modified multifunctional phosphorus-based epoxy resin in the resin glue solution is south Asia NPEP 210.
Resin glue solution A:the resin glue solution comprises the following components, by weight, 400 parts of modified multifunctional phosphorus epoxy resin and 450 parts of maleic acidImide resin, 350 parts of curing agent, 200 parts of flame retardant and 900 parts of filler.
Wherein the maleimide resin is prepared by uniformly mixing 4,4' -bismaleimide diphenylmethane, bis (3-ethyl-5-methyl-4-maleimide benzene) methane and 2, 2-bis (4- (4-maleimide phenoxy) phenyl) propane according to the mass ratio of 4:1: 1.
The curing agent is prepared by uniformly mixing phosphorus-containing phenolic resin, benzoxazine resin and styrene-maleic anhydride resin according to the mass ratio of 10:9: 9.
Wherein the filler is obtained by uniformly mixing spherical aluminum hydroxide and spherical silicon dioxide according to the mass ratio of 1:2, and the particle diameters of the spherical aluminum hydroxide and the spherical silicon dioxide are both 0.7-2.0 μm.
Resin glue solution B:the resin glue solution comprises, by weight, 450 parts of modified multifunctional phosphorus-based epoxy resin, 500 parts of maleimide resin, 380 parts of curing agent, 220 parts of flame retardant and 950 parts of filler. The maleimide resin composition is as described in resin glue solution A, the curing agent composition is as described in resin glue solution A, and the filler composition is as described in resin glue solution A.
Resin glue solution C:the resin glue solution comprises the following components, by weight, 500 parts of modified multifunctional phosphorus epoxy resin, 550 parts of maleimide resin, 400 parts of curing agent, 250 parts of flame retardant and 1000 parts of filler. The maleimide resin composition is as described in resin glue solution A, the curing agent composition is as described in resin glue solution A, and the filler composition is as described in resin glue solution A.
Resin glue solution D:the resin glue solution has the same content of each component as the resin glue solution A.
Wherein the maleimide resin is prepared by uniformly mixing 4,4' -bismaleimide diphenylmethane, bis (3-ethyl-5-methyl-4-maleimide benzene) methane and 2, 2-bis (4- (4-maleimide phenoxy) phenyl) propane according to the mass ratio of 4:2: 1.
The curing agent is prepared by uniformly mixing phosphorus-containing phenolic resin, benzoxazine resin and styrene-maleic anhydride resin according to the mass ratio of 10:8: 7.
Wherein the filler is obtained by uniformly mixing spherical aluminum hydroxide and spherical silicon dioxide according to the mass ratio of 1:3, and the particle size and the type are consistent with those of the resin glue solution A.
Resin glue solution E:the resin glue solution has the same content of each component as the resin glue solution A.
Wherein the maleimide resin is prepared by uniformly mixing 4,4' -bismaleimide diphenylmethane, bis (3-ethyl-5-methyl-4-maleimide benzene) methane and 2, 2-bis (4- (4-maleimide phenoxy) phenyl) propane according to the mass ratio of 6:1: 1.
The curing agent is prepared by uniformly mixing phosphorus-containing phenolic resin, benzoxazine resin and styrene-maleic anhydride resin according to the mass ratio of 10:9: 8.
Wherein the filler is obtained by uniformly mixing spherical aluminum hydroxide and spherical silicon dioxide according to the mass ratio of 1:2, and the particle size and the type of the filler are consistent with those of the filler used in the resin glue solution A.
Resin glue solution A':the resin glue solution has the same content of each component as the resin glue solution A.
Wherein the maleimide resin is 4,4' -bismaleimide diphenylmethane.
The composition of the curing agent is the same as that of the resin glue solution A.
Wherein the composition of the filler is the same as that in the resin glue solution A.
Resin glue solution B':the resin glue solution has the same content of each component as the resin glue solution A.
Wherein the composition of the maleimide resin is the same as that in the resin colloidal solution A.
Wherein the curing agent is only phosphorus-containing phenolic resin.
Wherein the composition of the filler is the same as that in the resin glue solution A.
Resin glue solution C':the resin glue solution has the same content of each component as the resin glue solution A.
Wherein the composition of the maleimide resin is the same as that in the resin colloidal solution A.
The composition of the curing agent is the same as that of the resin glue solution A.
Wherein the filler is spherical silicon dioxide, and the particle size and the type of the adopted spherical silicon dioxide are the same as those in the resin glue solution A.
The preparation method of the copper-clad plate by adopting the resin glue solution mainly comprises the following steps:
s1, weighing the components according to the resin glue solution composition, adding the components into a reaction kettle, and stirring for 4-6 hours at the temperature of 30-40 ℃;
s2, coating the resin glue solution prepared in the step S1 on two sides of the glass fiber cloth, and drying for 2-4 min at 200-250 ℃, wherein the prepared glass fiber cloth impregnated sheet is a prepreg;
and S3, according to the thickness and the shape structure required by the final copper-clad plate, 1-8 pieces of the prepreg prepared in the step S2 are stacked together and cut, finally, a layer of copper foil is covered on two sides to be used as a top copper foil layer and a bottom copper foil layer respectively, the two sides are hot-pressed for 180-200 min under the conditions of-700 to-730 mmHg and 200-220 ℃, and then the two sides are naturally cooled to room temperature to obtain the required copper-clad plate.
Copper-clad plate preparation embodiment 1:
s1, weighing the components according to the resin glue solution A, and stirring for 4 hours at the temperature of 30 ℃;
s2, coating the resin glue solution A prepared in the step S1 on two sides of the glass fiber cloth, and drying for 2min at 200 ℃ to obtain a glass fiber cloth impregnated sheet which is a prepreg;
and S3, according to the thickness and the shape structure required by the final copper-clad plate, 6 pieces of the prepreg prepared in the step S2 are stacked together and cut, finally, a layer of copper foil with the thickness of 25 mu m is covered on two sides to be used as a top copper foil layer and a bottom copper foil layer respectively, the two copper foils are hot-pressed for 180min under the conditions of-700 mmHg and 200 ℃, and the two copper foils are naturally cooled to room temperature to obtain the required copper-clad plate.
Copper-clad plate preparation embodiment 2:
s1, weighing the components according to the composition of the resin glue solution B, and stirring for 5 hours at 35 ℃;
s2, coating the resin glue solution B prepared in the step S1 on two sides of the glass fiber cloth, and drying for 3min at 210 ℃ to obtain a glass fiber cloth impregnated sheet which is a prepreg;
and S3, according to the thickness and the shape structure required by the final copper-clad plate, 6 pieces of the prepreg prepared in the step S2 are stacked together and cut, finally, a layer of copper foil with the thickness of 25 mu m is covered on two sides to be used as a top copper foil layer and a bottom copper foil layer respectively, the two copper foils are hot-pressed for 190min under the conditions of-710 mmHg and 210 ℃, and the two copper foils are naturally cooled to room temperature to obtain the required copper-clad plate.
Copper-clad plate preparation embodiment 3:
s1, weighing the components according to the composition of the resin glue solution C, and stirring for 6 hours at 40 ℃;
s2, coating the resin glue solution C prepared in the step S1 on two sides of the glass fiber cloth, and drying for 4min at 220 ℃ to obtain a glass fiber cloth impregnated sheet which is a prepreg;
and S3, according to the thickness and the shape structure required by the final copper-clad plate, 6 pieces of the prepreg prepared in the step S2 are stacked together and cut, finally, a layer of copper foil with the thickness of 25 mu m is covered on two sides to be used as a top copper foil layer and a bottom copper foil layer respectively, the two copper foils are hot-pressed for 200min under the conditions of-730 mmHg and 220 ℃, and the two copper foils are naturally cooled to room temperature to obtain the required copper-clad plate.
Copper-clad plate preparation embodiment 4:
s1, weighing the components according to the composition of the resin glue solution D, and stirring for 4 hours at the temperature of 30 ℃;
the steps S2 and S3 are the same as those in the first embodiment.
Copper-clad plate preparation embodiment 5:
s1, weighing the components according to the composition of the resin glue solution E, and stirring for 4 hours at the temperature of 30 ℃;
the steps S2 and S3 are the same as those in the first embodiment.
Copper-clad plate preparation comparative example 1:
s1, weighing the components according to the composition of the resin glue solution A', and stirring for 4 hours at the temperature of 30 ℃;
the steps S2 and S3 are the same as those in the first embodiment.
Copper-clad plate preparation comparative example 2:
s1, weighing the components according to the composition of the resin glue solution B', and stirring for 4 hours at the temperature of 30 ℃;
the steps S2 and S3 are the same as those in the first embodiment.
Copper-clad plate preparation comparative example 3:
s1, weighing the components according to the composition of the resin glue solution C', and stirring for 4 hours at the temperature of 30 ℃;
the steps S2 and S3 are the same as those in the first embodiment.
Copper-clad plate comparative example 4:
and a conventional common halogen-free copper-clad plate sold in the market is adopted.
The results of testing the performance of the copper clad laminates prepared and purchased in the above specific examples and comparative examples are shown in table 1.
TABLE 1 Performance results of copper clad laminates prepared and purchased in specific examples and comparative examples
The performance test table shows that the copper-clad plate of the embodiment has excellent dielectric constant, dielectric loss and heat resistance, and is more prominent than similar high-end products in the market.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, it should be noted that, for those skilled in the art, many modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.
Claims (10)
1. A halogen-free high-Tg high-speed copper-clad plate for a communication server is characterized in that: the composite insulation material comprises a bottom copper foil layer positioned on the bottom layer and a top copper foil layer positioned on the top layer, wherein an insulation medium layer is arranged between the bottom copper foil layer and the top copper foil layer and is formed by overlapping 1-8 pieces of prepreg, wherein each piece of prepreg is obtained by soaking glass fiber cloth in resin glue solution and then drying; wherein the resin glue solution comprises the following components in parts by weight: 400-500 parts of modified multifunctional phosphorus epoxy resin, 450-550 parts of maleimide resin, 350-400 parts of curing agent, 200-250 parts of flame retardant and 900-1000 parts of filler.
2. The halogen-free high-Tg high-speed copper-clad plate for the communication server according to claim 1, wherein: the maleimide resin is prepared by uniformly mixing a first maleimide resin, a second maleimide resin and a third maleimide resin according to the mass ratio of (4-6): 1-2): 1.
3. The halogen-free high-Tg high-speed copper-clad plate for the communication server according to claim 2, wherein: the first maleimide resin is 4,4' -bismaleimide diphenylmethane; the second maleimide resin is bis (3-ethyl-5-methyl-4-maleimidobenzene) methane; the third maleimide resin is 2, 2-bis (4- (4-maleimidophenoxy) phenyl) propane.
4. The halogen-free high-Tg high-speed copper-clad plate for the communication server according to claim 3, wherein: the maleimide resin is prepared by uniformly mixing 4,4' -bismaleimide diphenylmethane, bis (3-ethyl-5-methyl-4-maleimide benzene) methane and 2, 2-bis (4- (4-maleimide phenoxy) phenyl) propane according to the mass ratio of 4:1: 1.
5. The halogen-free high-Tg high-speed copper-clad plate for the communication server according to claim 1, wherein: the curing agent is prepared by uniformly mixing phosphorus-containing phenolic resin, benzoxazine resin and styrene-maleic anhydride resin according to a mass ratio of 10 (8-10) to 7-9.
6. The halogen-free high-Tg high-speed copper-clad plate for the communication server according to claim 1, wherein: the flame retardant is prepared by uniformly mixing a phosphate flame retardant and a phosphazene flame retardant according to the mass ratio of 1: 1.
7. The halogen-free high-Tg high-speed copper-clad plate for the communication server according to claim 1, wherein: the filler is obtained by uniformly mixing spherical aluminum hydroxide and spherical silicon dioxide according to the mass ratio of 1 (2-3), and the particle diameters of the spherical aluminum hydroxide and the spherical silicon dioxide are both 0.7-2.0 mu m.
8. The halogen-free high-Tg high-speed copper-clad plate for the communication server according to claim 1, wherein: the thicknesses of the bottom copper foil layer and the top copper foil layer are respectively 3-150 mu m.
9. The halogen-free high-Tg high-speed copper-clad plate for the communication server according to claim 1, wherein: the modified multifunctional phosphorus-based epoxy resin is south Asia NPEP 210.
10. A method for preparing a halogen-free high Tg high speed copper clad laminate for communication server as claimed in any one of claims 1 to 9, which mainly comprises the following steps:
s1, preparing resin glue solution: adding 400-500 parts by weight of modified multifunctional phosphorus epoxy resin, 450-550 parts by weight of maleimide resin, 350-400 parts by weight of curing agent, 200-250 parts by weight of flame retardant and 900-1000 parts by weight of filler into a reaction kettle, and stirring for 4-6 hours at 30-40 ℃;
s2, coating the resin glue solution prepared in the step S1 on two sides of the glass fiber cloth, and drying for 2-4 min at 200-250 ℃, wherein the prepared glass fiber cloth impregnated sheet is a prepreg;
and S3, according to the thickness and the shape structure required by the final copper-clad plate, 1-8 pieces of the prepreg prepared in the step S2 are stacked together and cut, finally, a layer of copper foil is covered on two sides to be used as a top copper foil layer and a bottom copper foil layer respectively, the two sides are hot-pressed for 180-200 min under the conditions of-700 to-730 mmHg and 200-220 ℃, and then the two sides are naturally cooled to room temperature to obtain the required copper-clad plate.
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Application publication date: 20220325 |