CN114226745B - Method for cleaning micron-sized flake silver powder - Google Patents

Method for cleaning micron-sized flake silver powder Download PDF

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Publication number
CN114226745B
CN114226745B CN202111509080.XA CN202111509080A CN114226745B CN 114226745 B CN114226745 B CN 114226745B CN 202111509080 A CN202111509080 A CN 202111509080A CN 114226745 B CN114226745 B CN 114226745B
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silver powder
silver
cleaning
micron
impedance
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CN114226745A (en
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康云祥
王强
邵志伟
吴子明
叶文波
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Jiangxi Beiteli New Material Co ltd
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Jiangxi Beiteli New Material Co ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00Making metallic powder or suspensions thereof
    • B22F9/16Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23GCLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
    • C23G5/02Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents
    • C23G5/032Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents containing oxygen-containing compounds

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Powder Metallurgy (AREA)

Abstract

The invention provides a method for cleaning micron-sized flake silver powder, which comprises the following steps: mixing silver nitrate, a reducing agent and a hydrophobic agent, and reacting to obtain a reaction product; dehydrating the reaction product until the mass content of silver powder is more than or equal to 95%, and adding ethanol for slurrying; adding iodine compound under ultrasonic condition, shearing and washing at 1500-2500 rpm, solid-liquid separating and stoving to obtain micron level silver flake. According to the method provided by the invention, the hydrophobic agent such as oleic acid is used for carrying out the surface hydrophobic treatment of the silver powder in the reaction process, so that the interaction force between the silver powder is changed, the surface free energy of the agglomeration of the silver powder is broken through washing in a high-speed shearing mode, the dispersibility of the silver powder in an oily system is reasonably improved, and the impedance of the silver powder is reduced. The impedance of silver powder obtained by cleaning by the cleaning method provided by the invention can be reduced by 10-20%; the impedance reaches 170Ω.

Description

Method for cleaning micron-sized flake silver powder
Technical Field
The invention belongs to the technical field of noble metal cleaning, and particularly relates to a method for cleaning micron-sized flake silver powder.
Background
The low-impedance micron-sized flake silver powder is an important raw material for preparing the conductive silver paste of the circuit board. At present, research on micron-sized flake silver powder is mainly focused on a synthesis method, cooperation of a reaction device and control of reaction conditions, and little research is conducted on post-treatment steps after silver powder synthesis. The D50 of the micron-sized silver powder is generally concentrated at 3-5 mu m, the surface energy is large, and the aggregation is very easy.
The traditional silver powder cleaning method adopts a method of centrifugation and stirring soaking, can not fully break the agglomeration of flake silver powder, and the agglomerated particles enable micron-sized silver powder to form compact lamination in silver paste, so that impedance is increased, and conductivity is poor.
Disclosure of Invention
In view of the above, the present invention aims to provide a method for cleaning micron-sized plate-like silver powder, which can reduce the impedance of silver paste.
The invention provides a method for cleaning micron-sized flake silver powder, which comprises the following steps:
mixing silver nitrate, a reducing agent and a hydrophobic agent, and reacting to obtain a reaction product;
dehydrating the reaction product until the mass content of silver powder is more than or equal to 95%, and adding ethanol for slurrying;
adding iodine compound under ultrasonic condition, shearing and washing at 1500-2500 rpm, solid-liquid separating and stoving to obtain micron level silver flake.
In the present invention, the hydrophobic agent is selected from unsaturated fatty acids.
In the present invention, the hydrophobic agent is selected from oleic acid.
In the invention, the mass ratio of the hydrophobizing agent to the silver nitrate is 0.01-0.02:1.
In the present invention, the iodine compound is selected from potassium iodide and/or hydrogen iodide.
In the invention, the mass ratio of the iodine compound to the unsaturated fatty acid is 0.95-1.05:40.
In the invention, the mass ratio of the ethanol to the silver powder is 1:0.95 to 1.05.
In the invention, the mass concentration of the ethanol is 95-99%.
In the invention, the temperature of the drying is 65-75 ℃.
In the invention, the frequency of the ultrasonic wave is 3000-4000 Hz;
stirring at 1500-2500 rpm for 3000-4000 min.
The invention provides a method for cleaning micron-sized flake silver powder, which comprises the following steps: mixing silver nitrate, a reducing agent and a hydrophobic agent, and reacting to obtain a reaction product; dehydrating the reaction product until the mass content of silver powder is more than or equal to 95%, and adding ethanol for slurrying; adding iodine compound under ultrasonic condition, shearing and washing at 1500-2500 rpm, solid-liquid separating and stoving to obtain micron level silver flake. According to the method provided by the invention, the hydrophobic agent such as oleic acid is used for carrying out the surface hydrophobic treatment of the silver powder in the reaction process, so that the interaction force between the silver powder is changed, the surface free energy of the agglomeration of the silver powder is broken through washing in a high-speed shearing mode, the dispersibility of the silver powder in an oily system is reasonably improved, and the impedance of the silver powder is reduced.
Detailed Description
In order to further illustrate the present invention, a method for cleaning a micron-sized plate-like silver powder according to the present invention is described in detail with reference to examples, but they should not be construed as limiting the scope of the present invention.
Example 1
(1) The silver powder surface hydrophobization treatment of the micron silver powder is that silver nitrate (50 kg) is reduced into micron silver powder by taking ascorbic acid as a reducing agent, and unsaturated fatty acid (oleic acid, 400 g) serving as a hydrophobizing agent is added during the reduction to prepare initial silver powder;
(2) Dehydrating: adding the silver powder after the reaction into a filter press to carry out dehydration treatment, and controlling the mass fraction of the silver powder to be more than 95%;
(3) Pulping: adding alcohol with the weight ratio of 1:1 into the silver powder, and performing slurrying treatment;
(4) And (3) surface-active treatment: adding 10g of active substance potassium iodide under 3000Hz while performing ultrasonic treatment;
(5) High-speed shearing and washing: stirring the slurry in a high-speed dispersing machine at 1500-2000 rpm for 60min;
(6) Solid-liquid separation: carrying out solid-liquid separation on the slurry by using a centrifugal machine, wherein the centrifugal speed is 600rpm;
(7) And (3) drying: and (3) placing the silver powder subjected to solid-liquid separation into a vacuum oven at 70 ℃, and baking to constant weight to obtain the micron-sized flake silver powder.
The silver powder obtained in example 1 was prepared into a silver paste containing 53 silver and having an impedance of 170Ω, with the particle size of the silver flakes ranging from 2.8 to 3.2 μm and the particle size distribution being more uniform and concentrated.
Comparative example 1
(1) The reaction: directly reducing silver nitrate into silver powder by a reducing agent;
(2) Sedimentation: settling the silver powder after the reaction for more than half an hour;
(3) Controlling the water content of silver powder: pumping out the supernatant, and controlling the mass fraction of the silver powder to be about 80%;
(4) Pulping: adding pure water in a weight ratio of 1:1 into the silver powder, and performing slurrying treatment;
(5) Stirring, soaking and cleaning: placing the pulped slurry into a stirrer for stirring at the stirring speed of 500-800 rpm, and repeatedly cleaning for three times after suction filtration;
(6) And (3) drying: and placing the obtained silver powder in a vacuum oven at 70 ℃, and drying to constant weight to obtain the micron-sized flake silver powder.
The particle size of the micron-sized plate-like silver powder was 2.8 to 3.5. Mu.m, and the silver powder obtained in comparative example 1 was made into 53-silver-containing silver paste having an impedance of 200Ω.
The impedance of the silver paste was reduced by 30Ω, and the particle size distribution of the silver powder was narrower and better controlled, than in comparative example 1.
Example 2
(1) Hydrophobization treatment of silver powder surface: adding 400g of hydrophobic agent oleic acid into silver nitrate (50 kg) in the process of replacing silver powder;
(2) Dehydrating: adding the silver powder after the reaction into a filter press to carry out dehydration treatment, and controlling the mass fraction of the silver powder to be more than 90%;
(3) Pulping: adding alcohol with the weight ratio of 1:0.9 into the silver powder, and pulping;
(4) And (3) surface-active treatment: adding 10g of active substance potassium iodide under 3000Hz while performing ultrasonic treatment;
(5) High-speed shearing and washing: stirring the slurry in a high-speed dispersing machine at 2000-2500 rpm for 60min;
(6) Solid-liquid separation: carrying out solid-liquid separation on the slurry by using a centrifugal machine, wherein the centrifugal speed is 800rpm;
(7) And (3) drying: and (3) placing the silver powder subjected to solid-liquid separation into a vacuum oven at 65 ℃, and baking to constant weight to obtain the micron-sized flake silver powder.
The particle size of the micron-sized plate-like silver powder was 2.7 to 3.3. Mu.m, and the silver powder obtained in example 2 was made into a 53-silver-containing silver paste having an impedance of 185. OMEGA.
Comparative example 2
(1) The reaction: the silver nitrate is directly replaced;
(2) Sedimentation: settling the silver powder after the reaction for more than half an hour;
(3) Controlling the water content of silver powder: pumping out the supernatant, and controlling the mass fraction of the silver powder to be about 75%;
(4) Pulping: adding pure water with the weight ratio of 1:0.75 into the silver powder, and performing slurrying treatment;
(5) Stirring, soaking and cleaning: and placing the pulped slurry into a stirrer for stirring at the stirring speed of 800-1000 rpm, and repeatedly cleaning for three times after suction filtration.
(6) And (3) drying: and placing the obtained silver powder in a vacuum oven at 65 ℃, and drying to constant weight to obtain the micron-sized silver powder.
The particle size of the micron-sized plate-like silver powder was 2.6 to 3.6 microns, and the silver powder obtained in comparative example 2 was made into a 53-silver-containing silver paste having an impedance of 210. OMEGA.
Example 2 the resistance of the silver paste was reduced by 25 Ω and the particle size distribution of the silver powder was narrower and better controlled than comparative example 2.
As can be seen from the above examples, the present invention provides a method for cleaning micron-sized plate silver powder, comprising the following steps: mixing silver nitrate, a reducing agent and a hydrophobic agent, and reacting to obtain a reaction product; dehydrating the reaction product until the mass content of silver powder is more than or equal to 95%, and adding ethanol for slurrying; adding iodine compound under ultrasonic condition, shearing and washing at 1500-2500 rpm, solid-liquid separating and stoving to obtain micron level silver flake. According to the method provided by the invention, the hydrophobic agent such as oleic acid is used for carrying out the surface hydrophobic treatment of the silver powder in the reaction process, so that the interaction force between the silver powder is changed, the surface free energy of the agglomeration of the silver powder is broken through washing in a high-speed shearing mode, the dispersibility of the silver powder in an oily system is reasonably improved, and the impedance of the silver powder is reduced. The experimental results show that: the impedance of silver powder obtained by cleaning by the cleaning method provided by the invention can be reduced by 10-20%; the impedance reaches 170Ω.
The foregoing is merely a preferred embodiment of the present invention and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the present invention, which are intended to be comprehended within the scope of the present invention.

Claims (5)

1. The method for cleaning the micron-sized flake silver powder comprises the following steps of:
mixing silver nitrate, a reducing agent and a hydrophobic agent, and reacting to obtain a reaction product; the hydrophobizing agent is selected from oleic acid; the mass ratio of the hydrophobizing agent to the silver nitrate is 0.01-0.02:1;
dehydrating the reaction product until the mass content of silver powder is more than or equal to 95%, and adding ethanol for slurrying;
adding an iodine compound under the ultrasonic condition, shearing and washing at 1500-2500 rpm, separating solid from liquid, and drying to obtain micron-sized flake silver powder;
the iodine compound is selected from potassium iodide and/or hydrogen iodide; the mass ratio of the iodine compound to the oleic acid is 0.95-1.05:40.
2. The cleaning method according to claim 1, wherein the mass ratio of the ethanol to the silver powder is 1:0.95 to 1.05.
3. The method according to claim 1, wherein the mass concentration of the ethanol is 95 to 99%.
4. The cleaning method according to claim 1, wherein the temperature of the drying is 65 to 75 ℃.
5. The cleaning method according to claim 1, wherein the frequency of the ultrasonic wave is 3000 to 4000Hz;
the time of shearing and washing at 1500-2500 rpm is 30-60 min.
CN202111509080.XA 2021-12-10 2021-12-10 Method for cleaning micron-sized flake silver powder Active CN114226745B (en)

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1686646A (en) * 2005-04-26 2005-10-26 四川大学 Preparation method of grain size controllable single dispersed nano silver powder
CN102407341A (en) * 2011-10-27 2012-04-11 浙江光达电子科技有限公司 surface modified particle diameter mixed silver powder and preparation method thereof
CN103079730A (en) * 2011-06-16 2013-05-01 住友金属矿山株式会社 Silver powder and method for producing same
CN106753026A (en) * 2016-12-30 2017-05-31 中国科学院深圳先进技术研究院 The modified method in surface, modified silver powder and the conductive silver glue comprising it are carried out to silver powder
CN109550933A (en) * 2018-12-04 2019-04-02 苏州市贝特利高分子材料股份有限公司 A kind of superthin section silver and its chemical synthesis process
CN112605394A (en) * 2020-12-10 2021-04-06 广东先导稀材股份有限公司 Preparation method of silver powder for conductive paste
CN113399679A (en) * 2021-05-08 2021-09-17 东方电气集团科学技术研究院有限公司 Preparation method of high-tap aging-resistant superfine silver powder for electronic paste

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1686646A (en) * 2005-04-26 2005-10-26 四川大学 Preparation method of grain size controllable single dispersed nano silver powder
CN103079730A (en) * 2011-06-16 2013-05-01 住友金属矿山株式会社 Silver powder and method for producing same
CN102407341A (en) * 2011-10-27 2012-04-11 浙江光达电子科技有限公司 surface modified particle diameter mixed silver powder and preparation method thereof
CN106753026A (en) * 2016-12-30 2017-05-31 中国科学院深圳先进技术研究院 The modified method in surface, modified silver powder and the conductive silver glue comprising it are carried out to silver powder
CN109550933A (en) * 2018-12-04 2019-04-02 苏州市贝特利高分子材料股份有限公司 A kind of superthin section silver and its chemical synthesis process
CN112605394A (en) * 2020-12-10 2021-04-06 广东先导稀材股份有限公司 Preparation method of silver powder for conductive paste
CN113399679A (en) * 2021-05-08 2021-09-17 东方电气集团科学技术研究院有限公司 Preparation method of high-tap aging-resistant superfine silver powder for electronic paste

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