CN114213849A - Insulating heat-conducting gasket and preparation method thereof - Google Patents
Insulating heat-conducting gasket and preparation method thereof Download PDFInfo
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- CN114213849A CN114213849A CN202111488204.0A CN202111488204A CN114213849A CN 114213849 A CN114213849 A CN 114213849A CN 202111488204 A CN202111488204 A CN 202111488204A CN 114213849 A CN114213849 A CN 114213849A
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- 238000002360 preparation method Methods 0.000 title claims abstract description 13
- 239000002002 slurry Substances 0.000 claims abstract description 30
- 238000002156 mixing Methods 0.000 claims abstract description 23
- 238000000034 method Methods 0.000 claims abstract description 19
- 238000010438 heat treatment Methods 0.000 claims abstract description 11
- 239000011159 matrix material Substances 0.000 claims abstract description 11
- 229920000642 polymer Polymers 0.000 claims abstract description 11
- 238000001723 curing Methods 0.000 claims abstract description 10
- 238000005119 centrifugation Methods 0.000 claims abstract description 9
- 239000000945 filler Substances 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims abstract description 8
- 239000002994 raw material Substances 0.000 claims abstract description 5
- 239000000203 mixture Substances 0.000 claims description 33
- 239000007822 coupling agent Substances 0.000 claims description 18
- 239000003575 carbonaceous material Substances 0.000 claims description 15
- 239000000843 powder Substances 0.000 claims description 13
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 10
- 239000002245 particle Substances 0.000 claims description 9
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 8
- 239000004917 carbon fiber Substances 0.000 claims description 8
- -1 polysiloxane Polymers 0.000 claims description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 238000009826 distribution Methods 0.000 claims description 6
- 239000011787 zinc oxide Substances 0.000 claims description 5
- 239000011231 conductive filler Substances 0.000 claims description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 235000012239 silicon dioxide Nutrition 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 2
- 229910052582 BN Inorganic materials 0.000 claims description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 2
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 2
- 239000002041 carbon nanotube Substances 0.000 claims description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 2
- 229910003460 diamond Inorganic materials 0.000 claims description 2
- 239000010432 diamond Substances 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 229910021389 graphene Inorganic materials 0.000 claims description 2
- 229910002804 graphite Inorganic materials 0.000 claims description 2
- 239000010439 graphite Substances 0.000 claims description 2
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 2
- 239000000347 magnesium hydroxide Substances 0.000 claims description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 2
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims 1
- 238000007711 solidification Methods 0.000 claims 1
- 230000008023 solidification Effects 0.000 claims 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 12
- KEBRDNWIYNXRKR-UHFFFAOYSA-N dodecyl(dimethoxy)silane Chemical compound CCCCCCCCCCCC[SiH](OC)OC KEBRDNWIYNXRKR-UHFFFAOYSA-N 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- 238000000465 moulding Methods 0.000 description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 5
- 230000015556 catabolic process Effects 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 5
- 239000004205 dimethyl polysiloxane Substances 0.000 description 5
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000010998 test method Methods 0.000 description 3
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004049 embossing Methods 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- NMEPHPOFYLLFTK-UHFFFAOYSA-N trimethoxy(octyl)silane Chemical compound CCCCCCCC[Si](OC)(OC)OC NMEPHPOFYLLFTK-UHFFFAOYSA-N 0.000 description 2
- 208000012322 Raynaud phenomenon Diseases 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004636 vulcanized rubber Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/20—Compounding polymers with additives, e.g. colouring
- C08J3/205—Compounding polymers with additives, e.g. colouring in the presence of a continuous liquid phase
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2383/04—Polysiloxanes
- C08J2383/05—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2383/04—Polysiloxanes
- C08J2383/07—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2483/04—Polysiloxanes
- C08J2483/05—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2483/04—Polysiloxanes
- C08J2483/07—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/06—Elements
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
- C08K7/18—Solid spheres inorganic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Sealing Material Composition (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention belongs to the technical field of materials, and discloses an insulating heat-conducting gasket and a preparation method thereof. The preparation method comprises the following steps: mixing raw materials containing the heat-conducting filler and the polymer matrix material to prepare slurry, placing the slurry in a cylinder of a centrifuge, adjusting the centrifugal rate to disperse the slurry along the cylinder wall of the cylinder of the centrifuge for centrifugation, and heating and curing to prepare the insulating heat-conducting gasket. The centrifugal method is adopted, so that most of the heat-conducting filler is intensively distributed on one surface, the heat-conducting function is achieved, and most of the polymer matrix material is intensively distributed on the other surface, and the insulating function is achieved. The gasket with good heat-conducting property is used in the field of electronics, the problems of low heat-radiating speed, low working efficiency and short service life of electronic equipment can be effectively solved, and the insulating property of the gasket is good and the electronic equipment cannot be electrically conducted.
Description
Technical Field
The invention belongs to the technical field of materials, and particularly relates to an insulating heat-conducting gasket and a preparation method thereof.
Background
Along with electronic equipment and components develop to frivolous, the direction that becomes more meticulous, more heats will be produced to corresponding device that generates heat, if in time go out heat-conduction, will arouse thermal rapid accumulation in electronic equipment and the components and parts for the operating temperature of the device that generates heat risees, not only influences the work efficiency of corresponding equipment, also makes its life shorten greatly. The heat-conducting interface material has good heat conductivity, can be used as a bridge of a heating device and a heat dissipation device, can efficiently conduct heat generated by the heating device to the heat dissipation device, and is widely applied to the field of electronics, wherein the application range of the heat-conducting gasket is widest, and the heat conductivity of the heat-conducting gasket is higher and more beneficial to heat dissipation. The heat conducting gasket is a composite material formed by adding heat conducting fillers such as silicon dioxide, aluminum oxide and the like into a polymer matrix and then curing. In order to increase the thermal conductivity, it is generally necessary to increase the proportion of the thermally conductive filler, but as the filling ratio reaches the limit, the approach of increasing the thermal conductivity by increasing the filling ratio becomes increasingly difficult to implement.
The carbon material with higher thermal conductivity is used for replacing ceramic powder, so that the thermal conductivity can be further improved, and although the carbon material has good thermal conductivity, the carbon material also has electrical conductivity, so that the insulating property of the heat conducting gasket is poor, and the use is influenced. Therefore, the preparation of the gasket with good insulation and heat conduction has important significance.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art described above. Therefore, the invention provides a preparation method of the insulating heat-conducting gasket, which is used for preparing the heat-conducting gasket by a centrifugal method and can be used for preparing the insulating heat-conducting gasket at one time.
The invention also provides the insulating heat-conducting gasket prepared by the preparation method.
According to one aspect of the invention, a preparation method of an insulating and heat-conducting gasket is provided, which specifically comprises the following steps:
s1: mixing raw materials containing a heat-conducting filler and a high-molecular base material to prepare slurry;
s2: and (4) placing the slurry prepared in the step (S1) into a centrifuge cylinder, dispersing the slurry along the cylinder wall of the centrifuge cylinder for centrifugation, and heating and curing to prepare the insulating heat-conducting gasket.
According to a preferred embodiment of the present invention, at least the following advantages are provided:
the invention adopts a centrifugation method, and utilizes the advantages that the polymer matrix material with low density can be distributed in the centrifuge cylinder closer to the center of a circle during centrifugation, and the heat-conducting filler with high density can be tightly attached to the wall of the centrifuge cylinder, so that most of the heat-conducting filler is distributed on one surface in a concentrated manner during molding of the heat-conducting gasket, and most of the polymer matrix material is distributed on the other surface in a concentrated manner, thereby preparing the insulating heat-conducting gasket at one time without additional coating, and the operation is simple and convenient.
In some preferred embodiments of the present invention, the centrifugation rate in step S2 is 1000rpm to 40000 rpm.
In some preferred embodiments of the invention, the diameter of the centrifuge cylinder in step S2 is > 1 m.
In some preferred embodiments of the present invention, the wall of the centrifuge cylinder may be heated to 50-300 ℃ for completing the heat curing in step S2.
In some embodiments of the present invention, the gasket is peeled off after the heating and curing in step S2, and then cut and formed.
In some embodiments of the present invention, the thermally conductive filler of step S1 is in a unimodal distribution.
In some embodiments of the present invention, the thermally conductive filler comprises a carbon material and a thermally conductive powder.
In some preferred embodiments of the present invention, the carbon material comprises at least one of carbon fiber, carbon nanotubes, graphene or graphite; preferably, the mass percentage of the carbon material is 5% to 12%.
In some more preferred embodiments of the present invention, the carbon material is selected from carbon fibers.
In some preferred embodiments of the present invention, the thermally conductive powder includes at least one of silicon dioxide, zinc oxide, aluminum nitride, silicon nitride, boron nitride, silicon carbide, aluminum hydroxide, magnesium hydroxide, or diamond; preferably, the mass percentage of the heat-conducting powder is 5-90%.
In some more preferred embodiments of the present invention, the thermally conductive powder includes at least one of aluminum oxide or zinc oxide.
In some embodiments of the present invention, the polymer matrix material of step S1 includes at least one of polysiloxane, epoxy resin or acrylic.
In some embodiments of the present invention, the raw material of step S1 further includes a coupling agent, and the mass ratio of the coupling agent to the carbon material is (0.1-200): 100.
in some preferred embodiments of the present invention, the coupling agent is a silane coupling agent.
In some preferred embodiments of the present invention, the coupling agent functions in the form of a solution, and the mass ratio of the coupling agent to the solvent in the solution is (10-100): 100.
in some preferred embodiments of the present invention, the specific preparation method of the slurry comprises the following steps:
a1: mixing the carbon material with the coupling agent to prepare a mixture 1;
a2: mixing the heat-conducting powder with the coupling agent to prepare a mixture 2;
a3: and mixing the mixture 1, the mixture 2 and the polymer matrix material to obtain the slurry.
In some preferred embodiments of the invention, the coupling agent in step a1 and the coupling agent in step a2 are the same or different.
In some preferred embodiments of the present invention, the step a2 may be performed 1 to 3 times, where the particle size or the type of the thermal conductive powder selected each time is the same or different, and the coupling agent selected each time is the same or different.
In some preferred embodiments of the present invention, in step a3, the solvent in mixture 1 and mixture 2 is volatilized before being mixed with the polymer matrix material.
According to another aspect of the invention, an insulating and heat-conducting gasket manufactured according to the manufacturing method is provided.
According to a preferred embodiment of the present invention, at least the following advantages are provided:
the insulating heat-conducting gasket provided by the invention has good insulating heat-conducting property. The gasket with good heat-conducting property is used in the field of electronics, the problems of low heat-radiating speed, low working efficiency and short service life of electronic equipment and components can be effectively solved, and the insulating property of the gasket is good, and the electronic equipment and the components cannot be electrically conducted.
Detailed Description
The concept and technical effects of the present invention will be clearly and completely described below in conjunction with the embodiments to fully understand the objects, features and effects of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and those skilled in the art can obtain other embodiments without inventive effort based on the embodiments of the present invention, and all embodiments are within the protection scope of the present invention. The test methods used in the examples are all conventional methods unless otherwise specified; the materials, reagents and the like used are commercially available reagents and materials unless otherwise specified.
Example 1
In this example, a gasket 1 was prepared by the following specific process:
(1) 10 parts by mass of monomodal carbon fibers (10 μm in length) were mixed with 1 part by mass of dodecyldimethoxysilane containing 10% of a silane coupling agent to obtain a mixture 1;
(2) mixing 40 parts by mass of spherical alumina (particle diameter of 3 μm) in monomodal distribution with 4 parts by mass of dodecyldimethoxysilane containing 10% of a silane coupling agent to obtain a mixture 2;
(3) volatilizing the solvent of the mixture 1 and the mixture 2, and mixing with 49.5 parts by mass of vinyl-terminated polydimethylsiloxane (with the viscosity of 500cs) and polydimethylmethylhydrogensiloxane to prepare slurry;
(4) placing the slurry prepared in the step (3) into a centrifuge cylinder (the diameter is more than 1m), adjusting the centrifugal speed to 3000rpm, dispersing the slurry along the cylinder wall of the centrifuge cylinder, continuously centrifuging for 30min, and heating and curing at 120 ℃ for 20min to prepare a gasket 1;
(5) and peeling the gasket 1 and then cutting and molding.
Example 2
In this example, a gasket 2 was prepared, and the specific process was as follows:
(1) 15 parts by mass of monomodal carbon fibers (length 20 μm) were mixed with 2 parts by mass of octyltrimethoxysilane containing 10% of a silane coupling agent to give a mixture 1;
(2) mixing 30 parts by mass of spherical alumina (particle diameter of 5 μm) in monomodal distribution with 2 parts by mass of dodecyldimethoxysilane containing 10% of a silane coupling agent to obtain a mixture 2;
(3) mixing 8 parts by mass of monomodal zinc oxide (particle size of 0.5 μm) with 1 part by mass of dodecyldimethoxysilane containing 10% of a silane coupling agent to obtain a mixture 3;
(4) volatilizing the solvent of the mixture 1, the mixture 2 and the mixture 3, and mixing with 46.5 parts by mass of vinyl-terminated polydimethylsiloxane (with the viscosity of 500cs) and polydimethylmethylhydrosiloxane to prepare slurry;
(5) placing the slurry prepared in the step (4) into a centrifuge cylinder (the diameter is more than 1m), adjusting the centrifugal speed to 3800rpm, dispersing the slurry along the cylinder wall of the centrifuge cylinder, continuously centrifuging for 30min, and heating and curing at 120 ℃ for 20min to prepare a gasket 2;
(6) and peeling the gasket 2 and then cutting and molding.
Example 3
In this example, a gasket 3 was prepared by the following specific process:
(1) mixing 10 parts by mass of monomodal carbon fiber (length of 10 μm), 40 parts by mass of monomodal spherical alumina (particle diameter of 3 μm) and 5 parts by mass of dodecyldimethoxysilane containing 10% of a silane coupling agent to obtain a mixture;
(2) volatilizing the solvent of the mixture in the step (1), and mixing with 49.5 parts by mass of vinyl-terminated polydimethylsiloxane (with the viscosity of 500cs) and polydimethylmethylhydrogensiloxane to prepare slurry;
(3) placing the slurry prepared in the step (2) into a centrifuge cylinder (the diameter is more than 1m), adjusting the centrifugal speed to 3000rpm, dispersing the slurry along the cylinder wall of the centrifuge cylinder, continuously centrifuging for 30min, and heating and curing at 120 ℃ for 20min to prepare a gasket 3;
(4) and peeling the gasket 3 and then cutting and molding.
Comparative example 1
This comparative example prepared a gasket a, which is different from example 1 in that the slurry was treated by a hot embossing method instead of a centrifugation method. The specific process is as follows:
(1) 10 parts by mass of monomodal carbon fibers (10 μm in length) were mixed with 1 part by mass of dodecyldimethoxysilane containing 10% of a silane coupling agent to obtain a mixture 1;
(2) mixing 40 parts by mass of spherical alumina (particle diameter of 3 μm) in monomodal distribution with 4 parts by mass of dodecyldimethoxysilane containing 10% of a silane coupling agent to obtain a mixture 2;
(3) volatilizing the solvent of the mixture 1 and the mixture 2, and mixing with 49.5 parts by mass of vinyl-terminated polydimethylsiloxane (with the viscosity of 500cs) and polydimethylmethylhydrogensiloxane to prepare slurry;
(4) placing the slurry prepared in the step (3) in a hot press, heating and curing to prepare a gasket a;
(5) and peeling the gasket a and then cutting and molding.
Comparative example 2
This comparative example prepared a shim b, which differs from example 2 in that the slurry was treated by hot embossing instead of centrifugation. The specific process is as follows:
(1) 15 parts by mass of monomodal carbon fibers (length 20 μm) were mixed with 2 parts by mass of octyltrimethoxysilane containing 10% of a silane coupling agent to give a mixture 1;
(2) mixing 30 parts by mass of spherical alumina (particle diameter of 5 μm) in monomodal distribution with 2 parts by mass of dodecyldimethoxysilane containing 10% of a silane coupling agent to obtain a mixture 2;
(3) mixing 8 parts by mass of monomodal zinc oxide (particle size of 0.5 μm) with 1 part by mass of dodecyldimethoxysilane containing 10% of a silane coupling agent to obtain a mixture 3;
(4) volatilizing the solvent of the mixture 1, the mixture 2 and the mixture 3, and mixing with 46.5 parts by mass of vinyl-terminated polydimethylsiloxane (with the viscosity of 500cs) and polydimethylmethylhydrosiloxane to prepare slurry;
(5) placing the slurry prepared in the step (4) in a hot press, heating and curing to prepare a gasket b;
(6) and peeling the gasket b and then cutting and molding.
Test examples
This test example tested the performance of the gaskets prepared in the examples and comparative examples. Wherein:
(1) test method of insulating property: the breakdown voltage strength of the gaskets prepared in the examples and the comparative examples is tested by using a Beijing Zhonghangling force LIC-100KV voltage breakdown tester according to the test standards of GB/T1695-2005 vulcanized rubber power frequency voltage breakdown strength and voltage-resistant strength tests.
(2) Test method of thermal conductivity: the thermal conductivity of the gaskets prepared in the examples and comparative examples was measured using a taiwan-raynaud interface material thermal resistance and thermal conductivity meter LW9389 in accordance with the test standard of ASTM 5470.
The test results are shown in table 1.
TABLE 1
In table 1, the gaskets 1, 2 and 3 prepared by using the centrifugal method have high breakdown voltage strength and thermal conductivity, wherein the gasket 3 is prepared by mixing a carbon material, heat-conducting powder and a coupling agent firstly and then mixing the mixture with a polymer matrix material to prepare slurry;
the thermal conductivity of the pads a and b prepared using the hot stamping method was not affected, but the breakdown voltage strength was 0, i.e., both pads had thermal conductivity and were electrically conductive.
The above shows that the gasket prepared by the centrifugal method can endow the gasket with good insulating and heat conducting properties.
The embodiments of the present invention have been described in detail, but the present invention is not limited to the embodiments, and various changes can be made without departing from the gist of the present invention within the knowledge of those skilled in the art. Furthermore, the embodiments of the present invention and the features of the embodiments may be combined with each other without conflict.
Claims (10)
1. The preparation method of the insulating heat-conducting gasket is characterized by comprising the following steps:
s1: mixing raw materials containing a heat-conducting filler and a high-molecular base material to prepare slurry;
s2: and (4) placing the slurry prepared in the step (S1) into a centrifuge cylinder, dispersing the slurry along the cylinder wall of the centrifuge cylinder for centrifugation, and heating and curing to prepare the insulating heat-conducting gasket.
2. The method according to claim 1, wherein the centrifugation in step S2 is performed at a rate of 1000rpm to 40000 rpm.
3. The method according to claim 1, wherein the diameter of the centrifuge cylinder in step S2 is larger than 1m, and the wall of the centrifuge cylinder can be heated to 50-300 ℃ for completing the thermal solidification.
4. The method according to claim 1, wherein the thermally conductive filler of step S1 is in a unimodal distribution; preferably, the heat-conducting filler comprises a carbon material and heat-conducting powder;
the carbon material comprises at least one of carbon fiber, carbon nanotubes, graphene or graphite; preferably, the mass percentage of the carbon material is 5-12%;
the heat conducting powder comprises at least one of silicon dioxide, zinc oxide, aluminum nitride, silicon nitride, boron nitride, silicon carbide, aluminum hydroxide, magnesium hydroxide or diamond; preferably, the mass percentage of the heat-conducting powder is 5-90%.
5. The method according to claim 4, wherein the raw material of step S1 further comprises a coupling agent; preferably, the mass ratio of the coupling agent to the carbon material is (0.1-200): 100.
6. the method according to claim 1, wherein the polymer matrix material of step S1 includes at least one of polysiloxane, epoxy resin, or acrylic acid.
7. The method for preparing the slurry according to claim 5, wherein the specific preparation method of the slurry comprises the following steps:
a1: mixing the carbon material with the coupling agent to prepare a mixture 1;
a2: mixing the heat-conducting powder with the coupling agent to prepare a mixture 2;
a3: and mixing the mixture 1, the mixture 2 and the polymer matrix material to obtain the slurry.
8. The method of claim 7, wherein the coupling agent in step A1 and the coupling agent in step A2 are the same or different.
9. The method according to claim 7, wherein the step A2 is performed 1 to 3 times; preferably, the particle size or the kind of the heat-conducting powder selected each time is the same or different, and the coupling agent selected each time is the same or different.
10. An insulating and heat-conducting gasket, characterized in that it is prepared by the preparation method of any one of claims 1 to 9.
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