CN114213846A - Polyphenylene sulfide resin-based high-frequency low-loss composite material and preparation method and application thereof - Google Patents
Polyphenylene sulfide resin-based high-frequency low-loss composite material and preparation method and application thereof Download PDFInfo
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- 239000004734 Polyphenylene sulfide Substances 0.000 title claims abstract description 83
- 229920000069 polyphenylene sulfide Polymers 0.000 title claims abstract description 83
- 239000002131 composite material Substances 0.000 title claims abstract description 35
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- 238000002156 mixing Methods 0.000 claims abstract description 10
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- 229920001935 styrene-ethylene-butadiene-styrene Polymers 0.000 claims abstract description 7
- 238000004519 manufacturing process Methods 0.000 claims abstract description 5
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- 239000000463 material Substances 0.000 claims description 20
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- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 claims description 8
- FACXGONDLDSNOE-UHFFFAOYSA-N buta-1,3-diene;styrene Chemical group C=CC=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 FACXGONDLDSNOE-UHFFFAOYSA-N 0.000 claims description 6
- 238000001125 extrusion Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000004793 Polystyrene Substances 0.000 claims description 4
- 229920001400 block copolymer Polymers 0.000 claims description 4
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical group O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 4
- 229920002223 polystyrene Polymers 0.000 claims description 4
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- 238000001035 drying Methods 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- IMSODMZESSGVBE-UHFFFAOYSA-N 2-Oxazoline Chemical compound C1CN=CO1 IMSODMZESSGVBE-UHFFFAOYSA-N 0.000 claims description 2
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- 238000004891 communication Methods 0.000 abstract description 7
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- 238000002844 melting Methods 0.000 abstract description 3
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- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
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- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
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- 229920006351 engineering plastic Polymers 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
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- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
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- 229920001778 nylon Polymers 0.000 description 1
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- 238000011160 research Methods 0.000 description 1
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- 125000004434 sulfur atom Chemical group 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
- C08L81/02—Polythioethers; Polythioether-ethers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
The invention belongs to the technical field of polyphenylene sulfide-based composite materials, and particularly relates to a high-frequency low-dielectric-loss polyphenylene sulfide-based composite material, and a preparation method and application thereof, which are used for manufacturing a 5G antenna oscillator. The invention adopts linear polyphenylene sulfide as base resin, and utilizes the low-dielectric and high-impact toughener SEBS to carry out rheological modification on the polyphenylene sulfide, so that the melt rheological property of the polyphenylene sulfide is improved and the dielectric loss is further reduced on the basis of keeping good heat resistance, strength, rigidity and other properties of the polyphenylene sulfide; meanwhile, after the surface of the inorganic powder with low dielectric constant is activated by using a coupling agent, the inorganic powder and the polyphenyl ether composite resin are subjected to processes of high-speed premixing, melting, mixing, extruding and the like to prepare the composite material with preset dielectric constant, extremely low dielectric loss, high temperature resistance, low molding shrinkage, high strength and high rigidity from the organic resin and the inorganic powder, and the composite material can be widely used for producing communication components such as 5G antenna covers, phase shifters and the like.
Description
Technical Field
The invention belongs to the technical field of polyphenylene sulfide-based composite materials, and particularly relates to a high-frequency low-dielectric-loss polyphenylene sulfide-based composite material special for a 5G antenna oscillator, and a preparation method and application thereof.
Background
The fifth generation mobile phone mobile communication (abbreviated as 5G) has a peak theoretical transmission rate of 10 GB/second, which is hundreds of times faster than the transmission rate of 4G network. The arrival of the 5G technology enables scenes in science fiction films such as virtual reality, augmented reality, intelligent medical treatment and the like to be realized, and the development of strategic fields such as the Internet of things, cloud computing and the like is accelerated. In 5G communication, in order to improve data transmission speed, a very high frequency millimeter wave band is adopted, so that attenuation of the material in the transmission process is large, and therefore, in order to ensure signal transmission speed and reduce signal loss, the material with low dielectric constant and dielectric loss has a high application value in 5G related industries.
The 5G antenna oscillator is an important device in the 5G base station antenna, has the functions of guiding and amplifying electromagnetic waves, and is formed by die casting metal materials or combining a sheet metal part, a plastic fixing part and a circuit board in a traditional mode. After the 5G era, the requirement on communication quality is higher, the number of antenna elements is greatly increased, and if a metal material is used, the antenna becomes extremely heavy, the cost is higher, and the installation is complicated. Therefore, 5G antenna architecture evolves from 4G multiport antenna to dense array, and plastic antennas with high integration, high consistency, high production efficiency and high production performance of parts are more concerned.
The glass fiber reinforced polyphenylene sulfide has high strength, light weight, low price and stable structure, is one of the most common special materials in the 4G communication era, and is also a suitable material applied to a 5G antenna oscillator. The molecular structure of the polyphenylene sulfide is formed by the interactive arrangement of benzene rings and sulfur atoms, the configuration is neat, and a crystal structure with higher thermal stability is easy to form. Meanwhile, the molecular structure of the PPS material enables the PPS material to have a highly stable chemical bond characteristic, the benzene ring structure enables the PPS material to have higher rigidity, the thioether bond (-S-) provides certain flexibility, and the unique molecular structure enables the PPS material to have a plurality of performances superior to other engineering plastics, such as lower impact strength and strong rigidity of the PPS material, the bending modulus of pure PPS is 3.8GPa, and the reinforced modified PPS can reach 12.6 GPa. The bonding strength of polyphenylene sulfide (PPS) and metal is up to 3000N/cm2The heat resistance is excellent, the short-term heat resistance can reach 260 ℃, and the heat-resistant material can be used for a long time at the temperature of 200-240 ℃. The finished product has the characteristics of good dimensional stability, good creep resistance, low water absorption, good flame retardance, good chemical corrosion resistance and the like. PPS has low dielectric constant (3-3.3, 104Hz)) and low dielectric loss tangent (0.0007, 104Hz) and varies little over a wide range of frequencies and temperatures. However, in the actual use of PPS, glass fiber is required to be added for enhancement and modification, the dielectric constant of the conventional glass fiber is about 6.5, and the dielectric loss is also greater than 0.007, so when the PPS is applied to equipment such as 5G communication equipment, in order to improve transmission efficiency and reduce loss, the dielectric property still needs to be further improved, and the method for reducing the dielectric constant and the dielectric loss of the PPS plastic material is only carried out by means of changing fillers such as glass fiber.
The method for reducing the dielectric constant and dielectric loss of the glass fiber reinforced polyphenylene sulfide composite material at present focuses on using low dielectric filler.
CN108250751A discloses a polyphenylene sulfide resin composition for low dielectric constant NMT technology and a preparation method thereof, mainly comprising 20-80 parts of polyphenylene sulfide resin; 15-40 parts of low-dielectric-constant chopped glass fiber; 0.5-10 parts of hollow micro-beads; 3-15 parts of a toughening agent; 0.3-3 parts of antioxidant; 0.3-3 parts of heat stabilizer; 0.5-2 parts of lubricant; 0-3% of nucleating agent. The low-dielectric-constant chopped glass fiber has a dielectric constant of 4-5, the dielectric constant of the material is reduced by the inorganic hollow microspheres and the low-dielectric-constant chopped glass fiber, and the drawing force of the material and metal injection molding is high, so that the low-dielectric-constant chopped glass fiber is suitable for the NMT technology, but the dielectric loss performance of the product is not researched, and therefore, the low-dielectric-constant chopped glass fiber is not suitable for 5G antenna oscillator products requiring low dielectric loss characteristics.
CN108329692 discloses a polyphenylene sulfide resin composition with low dielectric constant and a preparation method thereof. The polyphenylene sulfide resin composition is prepared from 20-80 parts of PPS resin, 15-40 parts of glass fiber, 0.3-5 parts of cage-like silsesquioxane, 3-15 parts of flexibilizer, 0.3-3 parts of antioxidant, 0.5-3 parts of heat stabilizer, 0.3-3 parts of lubricant and 0-3 parts of nucleating agent by mass, has a dielectric constant of 2.8-3.3 under a 1GHz test condition, has a processing temperature of over 280 ℃ and can reach 320 ℃ at most, has a good flame retardant effect, and is suitable for the field of 5G communication.
CN102558863A glass fiber, kaolin and nano SiO2And the PPS/PTFE alloy is compounded and filled to prepare the PPS composite material with good dielectric property (Dk is 2.79-2.96 and Df is 0.0024-0.0031) and mechanical property. GuO Y et al use silica micropowder for high packing (mass fraction)>65 percent) of PPS/SBS (styrene-butadiene-styrene block copolymer) composite material, and a small amount of fluorine-containing resin auxiliary agent are added to prepare the novel electronic material with excellent dielectric property (Dk is 3.6, Df is 0.0023), low water absorption and thermal expansion coefficient. CN104817831A adopts polyimide fiber and nano SiO2The PPS/high-temperature nylon composite material is compounded and filled to prepare the electric insulation thermoplastic composite material with excellent dielectric property (Dk is 2.64 and Df is 0.001) and high electric strength. CN108165010A discloses a high-thermal-conductivity low-dielectric polyphenylene sulfide composite material and a preparation method thereof. High-fluidity PPS resin is compounded with 45 percent and 25 percent of micron BN fiber and low-dielectric glass fiber by mass percent respectively, and compatilizer hydrogenated SB S grafted glycidyl methacrylate (SEBS-g-GMA), KH550 coupling agent, dispersant silicone powder and the like are added for melt blending and extrusion, so that the low-dielectric loss (Dk) is successfully prepared<0.003) and high thermal conductivity (λ 4.2w/(m · K)). In these documents, the dielectric loss of the obtained composite material is large。
CN109705577A discloses a low dielectric coefficient PPS, the raw materials including: 45-70 parts of polyphenylene sulfide, 20-40 parts of hollow glass beads, 10-30 parts of low-dielectric-coefficient glass fibers and 1-5 parts of PPS toughening agent. The low dielectric constant glass fiber used in the invention, namely the low dielectric constant glass fiber with the dielectric constant of 4.2-4.8 produced in the market, achieves the purposes of reducing the dielectric constant of the material and simultaneously keeping the strength and the high temperature resistance of the material through the synergistic effect of the hollow glass beads and the low dielectric constant glass fiber, and the obtained low dielectric polyphenylene sulfide material product has a lower dielectric constant, however, the patent does not research the problem of dielectric loss of the product and limits the application of the product in some fields.
However, the initial 5G intermediate frequency band in China is two frequency bands of 3.3-3.6GHz and 4.8-5GHz, and the high frequency bands of 24.75-27.5GHz and 37-42.5GHz are gathering comments; and internationally 28GHz was used primarily for testing. Therefore, the dielectric properties still need to be further reduced; and the problem of difficult flowing and difficult processing is inevitably generated by adding the inorganic filler.
Disclosure of Invention
Aiming at the continuously improved performance requirements of the current related electronic materials, the invention adopts an organic/inorganic hybrid composite method, integrates the respective advantages of organic high polymer materials and inorganic powder, and successfully develops a high-strength high-modulus composite material with adjustable and controllable dielectric constant and dielectric loss lower than 0.001 under the high frequency of 10G.
In the invention, linear polyphenylene sulfide is used as base resin, so that the problems of difficult flowing and difficult processing are solved, the low-dielectric high-impact toughening agent SEBS is used for carrying out rheological modification on the polyphenylene sulfide, the melt rheological property of the polyphenylene sulfide is improved on the basis of keeping good heat resistance, strength, rigidity and other properties of the polyphenylene sulfide, and the dielectric loss is further reduced; meanwhile, after the surface of the inorganic powder with low dielectric constant is activated by using a coupling agent, the inorganic powder and the polyphenyl ether composite resin are subjected to processes of high-speed premixing, melting, mixing, extruding and the like to prepare the composite material with preset dielectric constant, extremely low dielectric loss, high temperature resistance, low molding shrinkage, high strength and high rigidity from the organic resin and the inorganic powder, and the composite material can be widely used for producing communication components such as 5G antenna covers, phase shifters and the like.
The invention provides a polyphenylene sulfide resin-based high-frequency low-loss composite material, which comprises the following components in parts by weight: 60-80 parts of PPS resin; 10-40 parts of glass fiber; 10-40 parts of silicon dioxide aerogel; 10-40 parts of a toughening agent; 1-4 parts of a compatilizer; 1-3 parts of a lubricant.
Wherein the glass fiber is low dielectric constant chopped glass fiber,
the silica aerogel needs to be activated by a coupling agent before use,
the toughening agent is hydrogenated styrene butadiene styrene block copolymer,
the compatilizer is maleic anhydride grafted styrene-ethylene-butadiene-styrene block copolymer or oxazoline grafted polystyrene,
the lubricant is fluorinated polyethylene wax, silicone or a mixture of the fluorinated polyethylene wax and the silicone, and the weight ratio of the fluorinated polyethylene wax to the silicone in the mixture is 1: 1.
the invention also provides a preparation method of the polyphenylene sulfide resin-based high-frequency low-loss composite material, which comprises the following steps:
(1) mixing materials:
mixing PPS resin, silicon dioxide aerogel, a toughening agent, a compatilizer and a lubricant according to a proportion to obtain a mixture;
(2) and (3) drying:
putting the mixture obtained in the step (1) into an extruder, carrying out melt extrusion, laterally feeding glass fibers, uniformly stirring, and granulating to obtain the polyphenylene sulfide resin composition;
the heating temperature of the extruder was set as: the temperature of the feeding section is less than 200 ℃, the temperature of the inner part of the charging barrel is gradually increased from 285 ℃ to 340 ℃ along the material extrusion direction, the temperature of the connector is 320-340 ℃, the temperature of the neck mold is 300-320 ℃, and the rotating speed of the main machine screw is 50-300 r/min.
Further, the extruder adopts a nine-section double-screw extruder, the fifth section feeds the glass fiber laterally, and the heating temperature of the extruder is set as follows: the internal temperature of the barrel was: the temperatures of the first zone to the ninth zone are 290 + -5 ℃, 300 + -5 ℃, 310 + -5 ℃, 320 + -5 ℃, 330 + -5 ℃, 320 + -5 ℃, the neck mold temperature is 310-.
The polyphenylene sulfide resin-based high-frequency low-loss composite material prepared by the invention has the dielectric constant of 2.4-3.0 and the dielectric loss of 0.0002-0.0004 under the high frequency of 10G.
The polyphenylene sulfide resin-based high-frequency low-loss composite material prepared by the invention is used for manufacturing a 5G antenna oscillator.
The invention has the beneficial effects that:
(1) the invention adopts an organic/inorganic hybrid composite method, integrates the advantages of organic high polymer materials and inorganic powder, and successfully develops a high-strength high-modulus composite material with adjustable and controllable dielectric constant and dielectric loss lower than 0.001 under 10G high frequency.
(2) In order to solve the problems of difficult flowing and difficult processing of linear polyphenylene sulfide, the linear polyphenylene sulfide is used as base resin, and the low-dielectric high-impact SEBS is used for performing rheological modification on the linear polyphenylene sulfide, so that the melt rheological property of the linear polyphenylene sulfide is improved on the basis of keeping good heat resistance, strength, rigidity and other properties of the linear polyphenylene sulfide, and the dielectric loss is further reduced;
(3) after the surface of the silicon dioxide aerogel with low dielectric constant is activated by using a coupling agent, the silicon dioxide aerogel with low dielectric constant and polyphenyl ether composite resin are subjected to processes of high-speed premixing, melting, mixing, extruding and the like, so that the organic resin and the inorganic powder are prepared into the composite material with preset dielectric constant, extremely low dielectric loss, high temperature resistance, low molding shrinkage, high strength and high rigidity.
Detailed Description
The present invention will be further described with reference to the following specific examples, but the scope of the present invention is not limited thereto.
Example 1
The polyphenylene sulfide resin composition of the embodiment comprises the following components in parts by mass: 80 parts of PPS resin; 30 parts of glass fiber; ③ 20 parts of silicon dioxide aerogel; 10 parts of a toughening agent; 2 parts of compatilizer; sixthly, 1 part of lubricant.
The glass fiber is low-dielectric-constant chopped glass fiber, the silicon dioxide aerogel needs to be activated by a coupling agent before use, the toughening agent is hydrogenated styrene butadiene styrene block copolymer, the compatilizer is maleic anhydride grafted styrene-ethylene-butadiene-styrene block copolymer, and the lubricant is fluorinated polyethylene wax.
The preparation method of the polyphenylene sulfide resin composition in this example is as follows:
(1) and (4) mixing the materials. Mixing the PPS resin, the silicon dioxide aerogel, the toughening agent, the compatilizer and the lubricant according to the proportion to obtain a mixture;
(2) and (5) drying. And putting the mixture into a nine-section double-screw extruder, carrying out melt extrusion, laterally feeding glass fibers at a fifth section of screw cylinder, uniformly stirring, and granulating to obtain the polyphenylene sulfide resin composition.
(3) The heating temperature is set. The heating temperature of the extruder was set as follows: the temperatures of the first zone to the ninth zone are 290 + -5 ℃, 300 + -5 ℃, 310 + -5 ℃, 320 + -5 ℃, 330 + -5 ℃, 320 + -5 ℃, the neck mold temperature is 310-.
Example 2
The polyphenylene sulfide resin composition of the embodiment comprises the following components in parts by mass: 60 parts of PPS resin; 30 parts of glass fiber; ③ 20 parts of silicon dioxide aerogel; 10 parts of a toughening agent; 2 parts of compatilizer; sixthly, 1.5 parts of a lubricant;
the glass fiber is low-dielectric-constant chopped glass fiber, the silica aerogel needs to be activated by a coupling agent before use, the toughening agent is hydrogenated styrene butadiene styrene block copolymer, the compatilizer is oxazoline grafted polystyrene, the lubricant is a mixture of fluorinated polyethylene wax and silicone, and the weight ratio of the fluorinated polyethylene wax to the silicone in the mixture is 1: 1.
the polyphenylene sulfide resin composition of this example was prepared in the same manner as in example 1.
Example 3
The polyphenylene sulfide resin composition of the embodiment comprises the following components in parts by mass: 60 parts of PPS resin; 30 parts of glass fiber; ③ 20 parts of silicon dioxide aerogel; 10 parts of a toughening agent; 2 parts of compatilizer; sixthly, 1.5 parts of a lubricant;
the glass fiber is low-dielectric-constant chopped glass fiber, the silicon dioxide aerogel needs to be activated by a coupling agent before use, the toughening agent is hydrogenated styrene butadiene styrene block copolymer, the compatilizer is maleic anhydride grafted styrene-ethylene-butadiene-styrene block copolymer, and the lubricant is fluorinated polyethylene wax.
The preparation method of the polyphenylene sulfide resin composition of this example was the same as that of example 2
Example 4
The polyphenylene sulfide resin composition of the embodiment comprises the following components in parts by mass: 60 parts of PPS resin; 30 parts of glass fiber; ③ 20 parts of silicon dioxide aerogel; 10 parts of a toughening agent; 2 parts of compatilizer; sixthly, 1.5 parts of a lubricant;
wherein the glass fiber is chopped glass fiber with low dielectric constant, the silicon dioxide aerogel is treated by a coupling agent, the toughening agent is hydrogenated styrene butadiene styrene block copolymer, the compatilizer is oxazoline grafted polystyrene, and the lubricant is fluorinated polyethylene wax and silicone according to the weight ratio of 1: 1.
the polyphenylene sulfide resin composition of this example was prepared in the same manner as in example 1.
TABLE 1 Properties of polyphenylene sulfide resin-based high-frequency low-loss composite materials of the examples
The present invention is not limited to the above-described embodiments, and any obvious improvements, substitutions or modifications can be made by those skilled in the art without departing from the spirit of the present invention.
Claims (9)
1. The polyphenylene sulfide resin-based high-frequency low-loss composite material is characterized by comprising the following components in parts by weight: 60-80 parts of PPS resin; 10-40 parts of glass fiber; 10-40 parts of silicon dioxide aerogel; 10-40 parts of a toughening agent; 1-4 parts of a compatilizer; 1-3 parts of a lubricant, wherein the toughening agent is hydrogenated styrene butadiene styrene block copolymer.
2. The polyphenylene sulfide resin-based high-frequency low-loss composite material as claimed in claim 1, wherein the dielectric constant is 2.4-3.0 and the dielectric loss is 0.0002-0.0004 at 10G high frequency.
3. The polyphenylene sulfide resin-based high-frequency low-loss composite material as claimed in claim 1, wherein the glass fiber is a low dielectric constant chopped glass fiber.
4. The polyphenylene sulfide resin-based high-frequency low-loss composite material as claimed in claim 1, wherein the silica aerogel is activated by a coupling agent before use.
5. The polyphenylene sulfide resin-based high-frequency low-loss composite material as claimed in claim 1, wherein the compatibilizer is a maleic anhydride grafted styrene-ethylene-butadiene-styrene block copolymer or oxazoline grafted polystyrene.
6. The polyphenylene sulfide resin-based high-frequency low-loss composite material as claimed in claim 1, wherein the lubricant is a fluorinated polyethylene wax, a silicone or a mixture of a fluorinated polyethylene wax and a silicone, and the weight ratio of the fluorinated polyethylene wax to the silicone in the mixture is 1: 1.
7. the preparation method of the polyphenylene sulfide resin-based high-frequency low-loss composite material as claimed in any one of claims 1 to 6, characterized by comprising the following steps:
(1) mixing materials:
mixing PPS resin, silicon dioxide aerogel, a toughening agent, a compatilizer and a lubricant according to a proportion to obtain a mixture;
(2) and (3) drying:
putting the mixture obtained in the step (1) into an extruder, carrying out melt extrusion, laterally feeding glass fibers, uniformly stirring, and granulating to obtain the polyphenylene sulfide resin composition;
wherein the heating temperature of the extruder is set as follows: the temperature of the feeding section is less than 200 ℃, the temperature of the inner part of the charging barrel is gradually increased from 285 ℃ to 340 ℃ along the material extrusion direction, the temperature of the connector is 320-340 ℃, the temperature of the neck mold is 300-320 ℃, and the rotating speed of the main machine screw is 50-300 r/min.
8. The method of claim 7, wherein the extruder is a nine-stage twin-screw extruder, the fifth stage is fed with glass fibers laterally, and the heating temperature of the extruder is set as follows: the internal temperature of the barrel was: the temperatures of the first zone to the ninth zone are 290 +/-5 ℃, 300 +/-5 ℃, 310 +/-5 ℃, 320 +/-5 ℃, 330 +/-5 ℃, 320 +/-5 ℃, the neck mold temperature is 310-.
9. Use of the polyphenylene sulfide resin-based high-frequency low-loss composite material as defined in any one of claims 1 to 6 for manufacturing a 5G antenna element.
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