CN114197239A - Manufacturing method of high-heat-resistance mica plate - Google Patents
Manufacturing method of high-heat-resistance mica plate Download PDFInfo
- Publication number
- CN114197239A CN114197239A CN202111462849.7A CN202111462849A CN114197239A CN 114197239 A CN114197239 A CN 114197239A CN 202111462849 A CN202111462849 A CN 202111462849A CN 114197239 A CN114197239 A CN 114197239A
- Authority
- CN
- China
- Prior art keywords
- mica
- heat
- paper
- heat resistance
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010445 mica Substances 0.000 title claims abstract description 146
- 229910052618 mica group Inorganic materials 0.000 title claims abstract description 146
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 239000000463 material Substances 0.000 claims abstract description 34
- 238000011282 treatment Methods 0.000 claims abstract description 22
- 238000001035 drying Methods 0.000 claims abstract description 20
- 238000000034 method Methods 0.000 claims abstract description 20
- 238000010438 heat treatment Methods 0.000 claims abstract description 14
- 238000001816 cooling Methods 0.000 claims abstract description 10
- 238000003490 calendering Methods 0.000 claims abstract description 9
- 230000008569 process Effects 0.000 claims abstract description 9
- 238000001179 sorption measurement Methods 0.000 claims abstract description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000000853 adhesive Substances 0.000 claims abstract description 6
- 230000001070 adhesive effect Effects 0.000 claims abstract description 6
- 239000011248 coating agent Substances 0.000 claims abstract description 6
- 238000000576 coating method Methods 0.000 claims abstract description 6
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 6
- 239000010703 silicon Substances 0.000 claims abstract description 6
- 238000004513 sizing Methods 0.000 claims abstract description 6
- 238000002156 mixing Methods 0.000 claims abstract description 3
- 239000002994 raw material Substances 0.000 claims abstract description 3
- 238000003825 pressing Methods 0.000 claims description 9
- 239000002002 slurry Substances 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 4
- 239000004594 Masterbatch (MB) Substances 0.000 claims description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 2
- 238000007731 hot pressing Methods 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- 239000013464 silicone adhesive Substances 0.000 claims description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 2
- 230000008859 change Effects 0.000 abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 238000005452 bending Methods 0.000 description 6
- 230000009286 beneficial effect Effects 0.000 description 5
- 239000003292 glue Substances 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 230000003213 activating effect Effects 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 230000005389 magnetism Effects 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- -1 methyl titanate Chemical compound 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052627 muscovite Inorganic materials 0.000 description 2
- JTJMJGYZQZDUJJ-UHFFFAOYSA-N phencyclidine Chemical class C1CCCCN1C1(C=2C=CC=CC=2)CCCCC1 JTJMJGYZQZDUJJ-UHFFFAOYSA-N 0.000 description 2
- 238000012216 screening Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000005272 metallurgy Methods 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 230000000391 smoking effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21F—PAPER-MAKING MACHINES; METHODS OF PRODUCING PAPER THEREON
- D21F11/00—Processes for making continuous lengths of paper, or of cardboard, or of wet web for fibre board production, on paper-making machines
- D21F11/06—Processes for making continuous lengths of paper, or of cardboard, or of wet web for fibre board production, on paper-making machines of the cylinder type
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21F—PAPER-MAKING MACHINES; METHODS OF PRODUCING PAPER THEREON
- D21F3/00—Press section of machines for making continuous webs of paper
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21F—PAPER-MAKING MACHINES; METHODS OF PRODUCING PAPER THEREON
- D21F5/00—Dryer section of machines for making continuous webs of paper
- D21F5/02—Drying on cylinders
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21G—CALENDERS; ACCESSORIES FOR PAPER-MAKING MACHINES
- D21G1/00—Calenders; Smoothing apparatus
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H23/00—Processes or apparatus for adding material to the pulp or to the paper
- D21H23/02—Processes or apparatus for adding material to the pulp or to the paper characterised by the manner in which substances are added
- D21H23/22—Addition to the formed paper
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H25/00—After-treatment of paper not provided for in groups D21H17/00 - D21H23/00
- D21H25/005—Mechanical treatment
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H25/00—After-treatment of paper not provided for in groups D21H17/00 - D21H23/00
- D21H25/04—Physical treatment, e.g. heating, irradiating
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H25/00—After-treatment of paper not provided for in groups D21H17/00 - D21H23/00
- D21H25/04—Physical treatment, e.g. heating, irradiating
- D21H25/06—Physical treatment, e.g. heating, irradiating of impregnated or coated paper
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Paper (AREA)
- Inorganic Insulating Materials (AREA)
Abstract
The invention discloses a manufacturing method of a high-heat-resistance mica plate, which comprises the following steps: carrying out heat treatment and crushing treatment on a mica raw material to obtain mica pulp sheets; treating mica pulp sheets by a swirler and a classifying screen and then performing high magnetic adsorption treatment; uniformly mixing the mica pulp sheet after adsorption treatment with a high-heat-resistance material to obtain mica pulp, making and forming the mica pulp by a cylinder paper machine, drying and cooling the mica pulp, then performing calendaring treatment, and uniformly distributing and coating an organic silicon adhesive with a certain concentration on mica paper through a sizing line. According to the invention, the heat resistance of the mica paper prepared by the special papermaking process is greatly improved by adding the high-heat-resistance material in the papermaking process, so that the heat resistance of the mica plate prepared by using the mica paper as a base material is greatly improved, and the change of the electrical property caused by the change of the mica content due to the addition of the high-heat-resistance material is avoided.
Description
Technical Field
The invention belongs to the technical field of mica plate manufacturing, and particularly relates to a manufacturing method of a high-heat-resistance mica plate.
Background
The mica plate is formed by bonding, heating and pressing mica paper and an organic silicon adhesive, and has good electrical property, bending strength and processing property, particularly good insulating property and high temperature resistance which are not possessed by other materials, so the mica plate is widely applied to the industrial fields of household appliances, chemical industry, metallurgy and the like.
At present, many household and industrial equipment work in a high-temperature environment, so that an insulating material is required to volatilize at a high temperature without failure, and further, the normal operation of a circuit or instrument equipment in the high-temperature environment is ensured. Although mica materials are high-temperature resistant, mica materials do not have the capacity of blocking heat transfer, so that the heat resistance of the mica plate becomes a bottleneck restricting the application and the development of the mica plate, and the development of the mica plate with high heat resistance has very important significance.
Disclosure of Invention
The invention aims to provide a manufacturing method of a high heat resistance mica plate, which not only maintains the excellent characteristics of a common mica plate, but also has high heat resistance.
In order to achieve the purpose, the invention provides the following technical scheme: a manufacturing method of a high-heat-resistance mica plate comprises the following steps:
1) carrying out heat treatment on a mica raw material, and crushing to obtain mica slurry sheets;
2) treating mica pulp sheets by a cyclone and a classifying screen, and then performing high magnetic adsorption treatment;
3) uniformly mixing the mica pulp sheet subjected to adsorption treatment with a high-heat-resistance material to obtain mica pulp;
4) the mica slurry is made and molded by a cylinder paper machine, and then is dehydrated by a squeezing part and dried by a drying cylinder;
5) then cooling (preferably 20 +/-10 ℃) and then calendering by calendering equipment to obtain the required mica paper;
6) uniformly distributing and coating the organic silicon adhesive with certain concentration on the mica paper through a sizing line;
7) baking the sized mica paper through a drying tunnel with a certain temperature to obtain sized mica paper;
8) cutting the sized mica paper into mica paper with a certain specification and size, and stacking the cut mica paper according to the required thickness to form a mica embryonic plate;
9) and pressing the mother blank plate in a press with certain pressure and temperature, and performing strong cooling (preferably at the temperature of 60-80 ℃) after pressing for certain time to obtain the high-heat-resistance mica plate.
Preferably, the heat treatment is performed twice in the step 1), and the process comprises the steps of keeping the mica master batch at the temperature of 750-850 ℃ for 2 hours, then cooling the mica material to the temperature of 260-300 ℃ and keeping the temperature for 1 hour.
Preferably, the step 1) is subjected to two crushing treatments, and the crushing pressures of the two crushing treatments are respectively 4.2MPa-6MPa and 2.5-4 MPa.
Preferably, the swirling pressure of the swirler in the step 2) is 2-3MPa, and the grading mesh number is 120-200 meshes.
Preferably, the high heat resistant material in step 3) is whisker of titanium oxide.
Preferably, the mass ratio of the high heat resistance material to the mica pulp sheet is 10-12: 1-3.
Preferably, the silicone adhesive in the step 6) is a silicone pressure-sensitive adhesive.
Preferably, in the step 7), the temperature of the inlet section of the drying tunnel is 40-80 ℃, the temperature of the middle section of the drying tunnel is 80-140 ℃, and the temperature of the outlet section of the drying tunnel is 60-100 ℃.
Preferably, in the step 9), the pressure maintaining pressure in the pressing process is 12Mpa, the exhaust pressure is 2Mpa, the hot pressing temperature is 260 ℃, and the exhaust is carried out while the temperature is increased.
The invention also provides a high-heat-resistance mica plate prepared by any one of the manufacturing methods.
Compared with the prior art, the invention has the beneficial effects that: according to the manufacturing method of the high-heat-resistance mica plate, the titanate whiskers are added in the paper making process, so that the heat resistance of the mica paper prepared by the process is greatly improved, the heat resistance of the mica plate prepared by taking the mica paper as a base material is greatly improved, the change of electrical properties caused by the change of mica content due to the addition of a high-heat-resistance material is avoided, and the mica plate manufactured by the method not only keeps the excellent insulation and high-temperature resistance of a common mica plate, but also has a high heat resistance effect. The heat-resistant layer can be applied to heat-resistant layers of hydroelectric power generation equipment, metallurgical equipment and household appliances, the service life of the motor is effectively prolonged, and the heat-resistant layer has a very great application prospect in the aviation industry. Compared with the conventional mica paper making process, the mica paper making process has the advantages that the application of the cold cylinder is improved, the temperature of the paper surface is cooled by adding a group of cold cylinders at the tail of the drying part, if the temperature of the paper roll without the cold cylinder is higher, the temperature in the paper roll is reduced slowly, the flatness of the mica paper is greatly influenced, the uniformity of surface glue of the glued mica paper is further influenced, and finally the bending strength and the moisture absorption performance of the mica plate are influenced.
Detailed Description
The technical solutions in the embodiments of the present invention are clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
(1) The mica material is subjected to two heat treatments, on one hand, non-mica impurity components can be treated through the two heat treatments, and on the other hand, crystal water among the mica materials is activated through the heat treatments so as to improve the diameter-thickness ratio of the mica pulp sheet. Specifically, the mica material is firstly treated at 800 ℃ for 2 hours, and then cooled to 280 ℃ and kept for 1 hour.
(2) Crushing the mica material subjected to heat treatment twice to obtain mica slurry sheets; the two-time crushing treatment is beneficial to improving the diameter-thickness ratio of the scales, increasing the combination area between the scales and increasing the electrostatic attraction effect between the scales. Specifically, the first crushing pressure is 5MPa, and the second crushing pressure is 3 MPa.
(3) The crushed mica pulp sheet is subjected to classification treatment by three cyclones and three classifying screens, fine scales are removed by screening, and large scales are reserved to improve the void ratio, so that the subsequent combination of the mica pulp sheet and a high-heat-resistance material is facilitated. Specifically, the cyclone pressure of the cyclone is 3MPa, and the grading screen mesh number is 120 meshes.
(4) And adsorbing the screened mica pulp sheet by high magnetism, treating metal ions in the mica pulp sheet, and simultaneously cultivating and activating static electricity among the scales so as to be beneficial to the combination of the subsequent mica pulp sheet and a high-heat-resistance material.
(5) And (3) introducing the mica pulp sheet subjected to adsorption treatment into a fine pulp tank, adding a certain amount of high-heat-resistance material into the fine pulp tank, and uniformly stirring to obtain mica pulp. The high-heat-resistance material adopts the methyl titanate whisker, and the mass ratio of the high-heat-resistance material to the mica pulp sheet is 12: 1.
(6) And extracting the mica pulp into a cylinder mould machine for papermaking.
(7) And (4) drying the mica paper manufactured in the step (6) to keep the water content of the paper below 0.3%, cooling the paper by a set of cold cylinders, and then performing calendaring treatment by calendaring equipment.
(8) Uniformly distributing and coating the organic silicon adhesive with certain concentration on the mica paper through a sizing line; the vehicle speed, the glue content and the weight of the glued paper are different according to the thickness of the board.
(9) The mica paper after glue application is baked by a drying tunnel with a certain temperature, wherein the temperature of the inlet section of the drying tunnel is 40 ℃, the temperature of the middle section of the drying tunnel is 120 ℃, and the temperature of the outlet section of the drying tunnel is 80 ℃.
(10) And cutting the baked gummed mica paper into the mica paper with the required blanking size.
(11) And (3) stacking the cut mica paper according to the required thickness to form a mica embryonic plate, wherein the required number of the mica paper is different when the mica embryonic plate is stacked according to different thicknesses for weighting.
(12) And pressing the mica embryonic plate in a press with certain pressure and temperature, and carrying out strong cooling to obtain the mica plate with high heat resistance after pressing for certain time.
The mica plate with high heat resistance manufactured by the method has the heat conductivity coefficient of 0.52-0.73W/mK, has excellent heat insulation performance, and the insulativity is more than or equal to 22 kv/m; the coating does not generate smoke/foam after being burnt at 1000 ℃ for 60 seconds, and has good temperature resistance; the prepared high heat resistance mica plate is soaked in water with the temperature of 20 ℃ for 24 hours, the water absorption rate is less than 0.5 percent, and the bending strength of the prepared high heat resistance mica plate under the normal state is 210-230N/mm2The bending strength of the high-heat-resistance mica plate after being boiled in water for 30min is 105-115N/mm2。
Comparative example 1
Comparative example 1 the same procedure as in example 1, except that step (7) was not carried out with the cold cylinder treatment, specifically:
(1) the mica material is subjected to two heat treatments, on one hand, non-mica impurity components can be treated through the two heat treatments, and on the other hand, crystal water among the mica materials is activated through the heat treatments so as to improve the diameter-thickness ratio of the mica pulp sheet. Specifically, the mica material is firstly treated at 800 ℃ for 2 hours, and then cooled to 280 ℃ and kept for 1 hour.
(2) Crushing the mica material subjected to heat treatment twice to obtain mica slurry sheets; the two-time crushing treatment is beneficial to improving the diameter-thickness ratio of the scales, increasing the combination area between the scales and increasing the electrostatic attraction effect between the scales. Specifically, the first crushing pressure is 5MPa, and the second crushing pressure is 3 MPa.
(3) The crushed mica pulp sheet is subjected to classification treatment by three cyclones and three classifying screens, fine scales are removed by screening, and large scales are reserved to improve the void ratio, so that the subsequent combination of the mica pulp sheet and a high-heat-resistance material is facilitated. Specifically, the cyclone pressure of the cyclone is 3MPa, and the grading screen mesh number is 120 meshes.
(4) And adsorbing the screened mica pulp sheet by high magnetism, treating metal ions in the mica pulp sheet, and simultaneously cultivating and activating static electricity among the scales so as to be beneficial to the combination of the subsequent mica pulp sheet and a high-heat-resistance material.
(5) And (3) introducing the mica pulp sheet subjected to adsorption treatment into a fine pulp tank, adding a certain amount of high-heat-resistance material into the fine pulp tank, and uniformly stirring to obtain mica pulp. The high-heat-resistance material adopts the methyl titanate whisker, and the mass ratio of the high-heat-resistance material to the mica pulp sheet is 12: 1.
(6) And extracting the mica pulp into a cylinder mould machine for papermaking.
(7) And (4) drying the mica paper manufactured in the step (6) to keep the water content of the paper below 0.3%, and then performing calendaring treatment through calendaring equipment.
(8) Uniformly distributing and coating the organic silicon adhesive with certain concentration on the mica paper through a sizing line;
the vehicle speed, the glue content and the weight of the glued paper are different according to the thickness of the board.
(9) The mica paper after glue application is baked by a drying tunnel with a certain temperature, wherein the temperature of the inlet section of the drying tunnel is 40 ℃, the temperature of the middle section of the drying tunnel is 120 ℃, and the temperature of the outlet section of the drying tunnel is 80 ℃.
(10) And cutting the baked gummed mica paper into the mica paper with the required blanking size.
(11) And (3) stacking the cut mica paper according to the required thickness to form a mica embryonic plate, wherein the required number of the mica paper is different when the mica embryonic plate is stacked according to different thicknesses for weighting.
(12) And pressing the mica embryonic plate in a press with certain pressure and temperature, and carrying out strong cooling to obtain the mica plate with high heat resistance after pressing for certain time.
The mica plate with high heat resistance manufactured by the method has the heat conductivity coefficient of 0.6-0.8W/mK, excellent heat insulation performance and the insulativity of more than or equal to 22 kv/m; slightly bubbling within 60 seconds of ignition at 1000 ℃ without smoking; the prepared high heat resistance mica plate is soaked in water with the temperature of 20 ℃ for 24 hours, the water absorption rate is 0.5-1.5 percent, and the bending strength of the prepared high heat resistance mica plate under the normal state is 160-one-180N/mm2The bending strength of the high-heat-resistance mica plate after being boiled in water for 30min is 65-75N/mm2。
The performance is compared as follows:
the present invention is not limited to the above-described embodiments, and it will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the principle of the present invention, and such modifications and improvements are also considered to be within the scope of the present invention. Those not described in detail in this specification are within the skill of the art.
Claims (10)
1. A manufacturing method of a high-heat-resistance mica plate is characterized by comprising the following steps:
1) carrying out heat treatment on a mica raw material, and crushing to obtain mica slurry sheets;
2) treating mica pulp sheets by a cyclone and a classifying screen, and then performing high magnetic adsorption treatment;
3) uniformly mixing the mica pulp sheet subjected to adsorption treatment with a high-heat-resistance material to obtain mica pulp;
4) the mica slurry is made and molded by a cylinder paper machine, and then is dehydrated by a squeezing part and dried by a drying cylinder;
5) cooling, and performing calendaring treatment by calendaring equipment to obtain the required mica paper;
6) uniformly distributing and coating the organic silicon adhesive with certain concentration on the mica paper through a sizing line;
7) baking the mica paper after sizing through a drying tunnel to obtain sized mica paper;
8) cutting the sized mica paper, and stacking the cut mica paper according to the required thickness to form a mica blank plate;
9) and pressing the mother blank plate in a press, and carrying out forced cooling to obtain the high-heat-resistance mica plate.
2. The method for manufacturing a high heat resistance mica plate according to claim 1, wherein the heat treatment is performed twice in the step 1), and the process comprises the steps of maintaining the mica master batch at a temperature of 750-850 ℃ for 2 hours, and then cooling the mica material to a temperature of 260-300 ℃ for 1 hour.
3. The method for manufacturing a high heat resistance mica plate according to claim 1, wherein the two crushing treatments are performed in the step 1), and the crushing pressures of the two crushing treatments are 4.2MPa to 6MPa and 2.5 MPa to 4MPa respectively.
4. The method for manufacturing a high heat resistance mica plate according to claim 1, wherein the swirling pressure of the swirler in the step 2) is 2-3MPa, and the grading mesh number is 120-200 meshes.
5. The method for manufacturing a high heat resistance mica plate according to claim 1, wherein the high heat resistance material in the step 3) is whisker of titanium oxide.
6. The manufacturing method of the high heat resistance mica plate according to claim 5, wherein the mass ratio of the high heat resistance material to the mica pulp sheet is 10-12: 1-3.
7. The method for manufacturing a high heat resistance mica plate according to claim 1, wherein the silicone adhesive in the step 6) is a silicone pressure-sensitive adhesive.
8. The method for manufacturing the high heat resistance mica plate according to claim 1, wherein the temperature of the inlet section of the drying tunnel in the step 7) is 40-80 ℃, the temperature of the middle section is 80-140 ℃, and the temperature of the outlet section is 60-100 ℃.
9. The method for manufacturing a high heat resistance mica plate according to claim 1, wherein in the step 9), the pressure maintaining pressure is 12Mpa, the exhaust pressure is 2Mpa, the hot pressing temperature is 260 ℃, and the exhaust is performed while raising the temperature.
10. A high heat resistance mica plate produced by the production method according to any one of claims 1 to 9.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111462849.7A CN114197239A (en) | 2021-12-01 | 2021-12-01 | Manufacturing method of high-heat-resistance mica plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111462849.7A CN114197239A (en) | 2021-12-01 | 2021-12-01 | Manufacturing method of high-heat-resistance mica plate |
Publications (1)
Publication Number | Publication Date |
---|---|
CN114197239A true CN114197239A (en) | 2022-03-18 |
Family
ID=80650277
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202111462849.7A Pending CN114197239A (en) | 2021-12-01 | 2021-12-01 | Manufacturing method of high-heat-resistance mica plate |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN114197239A (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111778765A (en) * | 2020-06-19 | 2020-10-16 | 通城县云水云母科技有限公司 | High-heat-resistance mica paper and manufacturing method thereof |
CN112712947A (en) * | 2020-12-29 | 2021-04-27 | 湖北平安电工股份有限公司 | Method for improving appearance chromaticity of synthetic mica plate |
-
2021
- 2021-12-01 CN CN202111462849.7A patent/CN114197239A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111778765A (en) * | 2020-06-19 | 2020-10-16 | 通城县云水云母科技有限公司 | High-heat-resistance mica paper and manufacturing method thereof |
CN112712947A (en) * | 2020-12-29 | 2021-04-27 | 湖北平安电工股份有限公司 | Method for improving appearance chromaticity of synthetic mica plate |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103805144B (en) | A kind of Graphene heat conducting film and preparation method thereof | |
CN101024249B (en) | Fine nickel powder and process for producing the same | |
CN112940416A (en) | Microwave composite dielectric substrate for high-frequency and high-speed environment and preparation method thereof | |
CN111732743A (en) | Preparation method of carbon nanotube/graphene flexible film | |
CN113462357A (en) | Wave-absorbing particles and preparation method and application of composite material thereof | |
CN106996053A (en) | A kind of high heat conduction mica paper manufacture method | |
CN114197239A (en) | Manufacturing method of high-heat-resistance mica plate | |
CN111395032A (en) | Preparation method of mica paper pulp | |
KR100415491B1 (en) | Nickel fine powder and process for producing the same | |
CN111778765A (en) | High-heat-resistance mica paper and manufacturing method thereof | |
CN107030802A (en) | The method that plasma modification improves composite and flexible decorative veneer and surface finish interface glue performance | |
CN109181391B (en) | Inorganic composite conductive powder and preparation method and application thereof | |
CN116377756B (en) | Method for improving interfacial bonding performance of mica and reinforced fiber | |
CN115011927B (en) | Vacuum evaporation coating material and preparation method and application thereof | |
CN115233197B (en) | Titanium nitride plating diamond and production process thereof | |
CN116693965A (en) | Reusable PE (polyethylene) isolation preservative film | |
CN116002696A (en) | Recycling treatment method for waste mica paper, mica tape and mica plate | |
CN102619137A (en) | Coating conductive paperboard and production method thereof | |
CN112111995B (en) | Preparation method of montmorillonite modified transformer insulation paper | |
CN113858721A (en) | Antifouling heat dissipation composite board and preparation method thereof | |
CN114030170A (en) | Preparation method of multilayer-structure high-shielding-efficiency reinforced polypropylene composite material | |
CN111098372B (en) | Preparation method of wood-based graphene conductive composite material | |
CN105883839A (en) | Method for preparing ultrathin dickite by intercalating potassium acetate in splinters | |
CN105565304B (en) | A kind of method that utilization starch prepares graphene | |
CN110845874A (en) | Preparation method of aqueous micro-nano flaky graphite material |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20220318 |
|
RJ01 | Rejection of invention patent application after publication |