CN114189777A - TOP type high-performance microphone - Google Patents
TOP type high-performance microphone Download PDFInfo
- Publication number
- CN114189777A CN114189777A CN202111602398.2A CN202111602398A CN114189777A CN 114189777 A CN114189777 A CN 114189777A CN 202111602398 A CN202111602398 A CN 202111602398A CN 114189777 A CN114189777 A CN 114189777A
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- type high
- substrate assembly
- top type
- resistor
- capacitor
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- 239000000758 substrate Substances 0.000 claims abstract description 61
- 238000004806 packaging method and process Methods 0.000 claims abstract description 10
- 238000001914 filtration Methods 0.000 claims abstract description 8
- 239000003990 capacitor Substances 0.000 claims description 43
- 239000011324 bead Substances 0.000 claims description 22
- 239000002184 metal Substances 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 238000000465 moulding Methods 0.000 claims description 6
- 239000003985 ceramic capacitor Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/08—Mouthpieces; Microphones; Attachments therefor
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/08—Mouthpieces; Microphones; Attachments therefor
- H04R1/083—Special constructions of mouthpieces
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The invention provides a TOP type high-performance microphone, which comprises a substrate assembly and a shell, wherein the shell is arranged on the substrate assembly and forms a packaging structure with the substrate assembly; the shell is provided with a sound hole, the inner part of the substrate assembly is provided with a back cavity, and one side, far away from the sound hole, of the vibrating diaphragm of the microphone assembly is communicated with the back cavity; and, still be provided with the filtering subassembly on the base plate subassembly. The TOP type high-performance microphone provided by the invention can solve the problem of low RF resistance of the existing TOP type high-performance packaging structure microphone.
Description
Technical Field
The invention relates to the technical field of acoustic equipment, in particular to a TOP type high-performance microphone.
Background
In the field of microphone equipment manufacturing, in order to improve the acoustic performance of a microphone, a microphone with a TOP-type high-performance packaging structure is produced, the existing microphone structure with the TOP-type high-performance packaging structure is shown in fig. 1, and is TOP-type high-performance packaging realized by a flip-chip structure of three layers of boards, and comprises a shell formed by a BASE board 1 ' (a BASE board) and a WALL board 2 ' (a WALL board) and a LID board 3 ' (a cover board), wherein a microphone assembly is attached to the LID board, and a microphone diaphragm of the microphone assembly corresponds to an acoustic hole in an up-and-down position.
However, although the existing TOP-type high-performance packaging structure for a microphone can significantly improve the acoustic performance of the microphone, a three-layer flip structure (i.e., a microphone assembly is disposed on a cover plate) is adopted, and a metal shell is not used; therefore, its RF (radio frequency interference) resistance is much lower than that of the conventional packaged microphone product.
In view of the above technical requirements, a method for effectively improving the RF resistance of the existing TOP type high performance package microphone is needed.
Disclosure of Invention
In view of the above problems, an object of the present invention is to provide a TOP type high performance microphone to solve the problem of low RF resistance of the existing TOP type high performance microphone.
The TOP type high-performance microphone comprises a substrate assembly and a shell which is arranged on the substrate assembly and forms a packaging structure with the substrate assembly, wherein the substrate assembly is provided with a microphone assembly contained in the packaging structure; wherein,
the shell is provided with a sound hole, the inner part of the substrate assembly is provided with a back cavity, and one side of the vibrating diaphragm of the microphone assembly, which is far away from the sound hole, is communicated with the back cavity; and,
and a filtering component is arranged on the substrate component.
Further, it is preferable that the microphone assembly includes a MEMS chip and an ASIC chip provided on the substrate assembly; and one side of the diaphragm of the MEMS chip, which is far away from the sound hole, is communicated with the back cavity.
In addition, preferably, the ASIC chip is electrically connected to the MEMS chip and the substrate assembly through wires.
In addition, it is preferable that the filter component includes an RC filter circuit component;
the RC filter circuit component comprises a first resistor, a second resistor, a first capacitor and a second capacitor; the first resistor is electrically connected between the ASIC chip and an external output end, the second resistor is electrically connected between the ASIC chip and an external power supply end, the first capacitor is electrically connected between the external power supply end and a grounding end, and the second capacitor is electrically connected between the external output end and the grounding end.
In addition, preferably, the first resistor and the second resistor are disposed in the substrate assembly in a manner of buried resistance, and the first capacitor and the second capacitor are disposed in the substrate assembly in a manner of buried capacitance.
In addition, preferably, the first resistor and the second resistor are both chip resistors mounted on the substrate assembly, and the first capacitor and the second capacitor are both ceramic capacitors mounted on the substrate assembly.
In addition, it is preferable that the first resistor and the second resistor are both built-in resistors provided inside the substrate assembly by a molding method, and the first capacitor and the second capacitor are both built-in capacitors provided inside the substrate assembly by a molding method.
In addition, it is preferable that the filter component includes a magnetic bead filter component;
the magnetic bead filtering component comprises a first magnetic bead and a second magnetic bead; the first magnetic bead is electrically connected between the ASIC chip and an external power supply end, and the second magnetic bead is electrically connected between the SIC chip and an external output end.
In addition, preferably, the housing is a metal housing, and the metal housing is grounded.
In addition, the preferable scheme is that the substrate component comprises three layers of PCB boards which are overlapped with each other, wherein the back cavity is formed in the middle layer of the PCB board, a via hole is formed in an upper board of the substrate component, and one side of the diaphragm of the microphone component, which is far away from the sound hole, is communicated with the back cavity through the via hole.
Compared with the prior art, the TOP type high-performance microphone provided by the invention has the following beneficial effects:
according to the TOP type high-performance microphone provided by the invention, the back cavity of the microphone is arranged in the substrate assembly, and the corresponding filter circuit assembly is arranged on the substrate assembly, so that the RF resistance of the TOP type high-performance microphone can be effectively improved by the filter circuit assembly on the premise of ensuring the TOP type high performance of the microphone; in addition, the metal shell is grounded, so that the RF resistance of the microphone can be further improved by using a large-area metal grounding mode.
To the accomplishment of the foregoing and related ends, one or more aspects of the invention comprise the features hereinafter fully described and particularly pointed out in the claims. The following description and the annexed drawings set forth in detail certain illustrative aspects of the invention. These aspects are indicative, however, of but a few of the various ways in which the principles of the invention may be employed. Further, the present invention is intended to include all such aspects and their equivalents.
Drawings
Other objects and results of the present invention will become more apparent and more readily appreciated as the same becomes better understood by reference to the following description and appended claims, taken in conjunction with the accompanying drawings. In the drawings:
fig. 1 is a front sectional view of a TOP type high performance microphone of a conventional three-layer plate flip structure;
fig. 2 is a front sectional view of a TOP type high performance microphone according to a first embodiment of the present invention;
fig. 3 is a bottom sectional view of a TOP type high performance microphone according to a first embodiment of the present invention;
fig. 4 is a front sectional view of a TOP type high performance microphone according to a second embodiment of the present invention;
fig. 5 is a bottom sectional view of a TOP type high performance microphone according to a second embodiment of the present invention;
fig. 6 is a front sectional view of a TOP type high performance microphone according to a third embodiment of the present invention;
fig. 7 is a bottom sectional view of a TOP type high performance microphone according to a third embodiment of the present invention;
fig. 8 is an internal circuit diagram of a TOP type high performance microphone according to a first embodiment of the present invention;
fig. 9 is an internal circuit diagram of a TOP type high performance microphone according to a fourth embodiment of the present invention;
reference numerals: the chip comprises a shell 1, a substrate assembly 2, a back cavity 3, a buried capacitor 4, an MEMS chip 5, a via 6, an ASIC chip 7, a wire 8, a chip resistor 9, a built-in resistor 10, a buried resistor 11, a chip capacitor 12, a built-in capacitor 14, a first resistor R1, a second resistor R2, a first capacitor C1, a second capacitor C2, a first magnetic bead L1 and a second magnetic bead L2.
The same reference numbers in all figures indicate similar or corresponding features or functions.
Detailed Description
In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of one or more embodiments. It may be evident, however, that such embodiment(s) may be practiced without these specific details. In other instances, well-known structures and devices are shown in block diagram form in order to facilitate describing one or more embodiments.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Fig. 2 shows a front cross-sectional view of a TOP type high performance microphone according to a first embodiment of the present invention, fig. 3 shows a bottom cross-sectional view of the TOP type high performance microphone according to the first embodiment of the present invention, and fig. 8 is an internal circuit diagram of the TOP type high performance microphone according to the first embodiment of the present invention.
As shown in fig. 2, fig. 3 and fig. 8, the TOP type high performance microphone provided by the present invention includes a substrate assembly 2 for carrying a chip, and a housing 1 disposed on the substrate assembly 2 and forming a package structure with the substrate assembly 2 for protecting internal devices, wherein the substrate assembly 2 is provided with a microphone assembly accommodated in the package structure; wherein, the shell 1 is provided with a sound hole (mainly used for sound entering), the inside of the substrate component 2 is provided with a back cavity 3 with larger volume, and one side of the vibrating diaphragm of the microphone component far away from the sound hole is communicated with the back cavity 3; the substrate assembly 2 is provided with a filter assembly.
The back cavity 3 communicated with one side of the vibrating diaphragm of the microphone component far away from the sound hole is arranged in the substrate component 2, so that the acoustic performance of the microphone can be obviously improved (namely TOP type high performance is realized); in addition, by arranging the filtering component on the substrate component 2, the radio frequency information around the microphone can be effectively absorbed, so that the RF resistance of the microphone is obviously improved.
In one embodiment of the present invention, to realize the acoustic performance of the microphone, the microphone assembly includes a MEMS chip 5(Micro Electro Mechanical system we) and an ASIC chip 7(Application Specific Integrated Circuit) disposed on the substrate assembly 2; the MEMS chip 5 in the microphone component is a functional chip of the microphone component, and one side, far away from the sound hole, of a vibrating diaphragm of the MEMS chip 5 is communicated with the back cavity 3; the ASIC chip 7 is mainly used for processing signals generated by the MEMS chip 5 and exchanging information with other external devices.
Specifically, to realize signal transmission between the ASIC chip and the MEMS chip 5 and between the ASIC chip and the external device, the ASIC chip may be electrically connected to the MEMS chip 5 and the substrate assembly 2 through the wires 8, respectively, and the substrate assembly 2 is electrically connected to the external device through the wires 8 and the like.
In addition, in the first embodiment of the present invention, the filter component may include an RC filter circuit component, and the RC filter circuit component may include a first resistor R1, a second resistor R2, a first capacitor C1, and a second capacitor C2; the first resistor R1 is electrically connected between the ASIC chip 7 and the external output terminal, the second resistor R2 is electrically connected between the ASIC chip 7 and the external power terminal, the first capacitor C1 is electrically connected between the external power terminal and the ground terminal, and the second capacitor C2 is electrically connected between the external output terminal and the ground terminal.
By the circuit connection mode, an RC filter circuit can be formed at the bottom of the whole microphone, and the RF resistance of each chip in the microphone can be obviously improved by the RC filter circuit.
Furthermore, as can be seen from fig. 2 and 3, the first resistor R1 and the second resistor R2 may be disposed in the substrate assembly 2 in the form of the buried resistor 11, and the first capacitor C1 and the second capacitor C2 may be disposed in the form of the buried capacitor 4 in the substrate assembly 2. Specifically, the embedded resistor 11 (including the first resistor R1 and the second resistor R2) is formed between copper foils of the substrate assembly 2 by using a resistive material, then materials with different dielectric constants are added in the copper foils of the substrate assembly 2 to form the embedded capacitor 4 (including the first capacitor C1 and the second capacitor C2), and then the connection of the RC filter circuit is completed according to the circuit connection relationship.
In addition, fig. 4 shows a front cross-sectional structure of a TOP type high performance microphone according to a second embodiment of the present invention, and fig. 5 shows a bottom cross-sectional structure of a TOP type high performance microphone according to a second embodiment of the present invention. As can be seen from fig. 4 and 5, in the second embodiment of the present invention, the first resistor R1 and the second resistor R2 may be mounted on the substrate assembly 2 in the form of chip resistor patches (i.e., the patch resistor 9), and the first capacitor C1 and the second capacitor C2 may be mounted on the substrate assembly 2 in the form of ceramic capacitor patches (i.e., the patch capacitor 12).
In addition, fig. 6 shows a front cross-sectional structure of a TOP type high performance microphone according to a third embodiment of the present invention, fig. 7 shows a bottom cross-sectional structure of a TOP type high performance microphone according to the third embodiment of the present invention, and as can be seen from fig. 6 and 7, in the third embodiment of the present invention, both the first resistor R1 and the second resistor R2 are built-in resistors 10 that can be disposed inside the substrate assembly 2 by molding, and both the first capacitor C1 and the second capacitor C2 are built-in capacitors 14 that can be disposed inside the substrate assembly 2 by molding.
In addition, fig. 9 is an internal circuit diagram of a TOP-type high-performance microphone according to a fourth embodiment of the present invention, and it can be seen from fig. 9 that, in the fourth embodiment of the present invention, the filter component may further include a bead filter component; specifically, the bead filter assembly comprises a first bead L1 and a second bead L2; the first magnetic bead L1 is electrically connected between the ASIC chip 7 and an external power source, and the second magnetic bead L2 is electrically connected between the SIC chip and an external output terminal. Through the arrangement, a magnetic bead filter circuit can be formed at the bottom of the whole microphone, and the anti-RF performance of each chip in the microphone can be obviously improved through the magnetic bead filter circuit.
In a preferred embodiment of the present invention, the housing 1 may be a metal housing 1, and the metal housing 1 needs to be grounded; by using the metal shell 1 and grounding the metal shell 1, the anti-RF performance of the microphone can be further improved by using a large-area metal ground.
In addition, in a specific embodiment of the present invention, to realize the arrangement of the back cavity 3 on the substrate component 2, the substrate component 2 may include three layers of PCB boards stacked on each other, wherein the back cavity 3 is formed on the middle layer of PCB board, the via hole 6 is formed on the upper layer of PCB board of the substrate component, and one side of the diaphragm of the microphone component, which is far away from the sound hole, is communicated with the back cavity 3 through the via hole 6.
As can be seen from the above embodiments, the TOP type high performance microphone provided by the present invention has at least the following advantages:
1. the microphone back cavity with larger volume is arranged in the substrate assembly, so that the acoustic performance (namely TOP type high performance) of the microphone can be obviously improved;
2. the RF resistance of the microphone can be effectively improved by the filter circuit component on the premise of ensuring TOP type high performance of the microphone by arranging the filter circuit component on the substrate component;
3. by using the metal shell and grounding the metal shell, the RF resistance of the microphone can be further improved by using a large-area metal grounding mode.
The TOP type high performance microphone according to the present invention is described above by way of example with reference to fig. 1 to 9. However, it will be appreciated by those skilled in the art that various modifications may be made to the TOP type high performance microphone of the present invention described above without departing from the scope of the invention. Therefore, the scope of the present invention should be determined by the contents of the appended claims.
Claims (10)
1. A TOP type high-performance microphone is characterized by comprising a substrate assembly and a shell which is arranged on the substrate assembly and forms a packaging structure with the substrate assembly, wherein the substrate assembly is provided with a microphone assembly which is accommodated in the packaging structure; wherein,
the shell is provided with a sound hole, the inner part of the substrate assembly is provided with a back cavity, and one side of the vibrating diaphragm of the microphone assembly, which is far away from the sound hole, is communicated with the back cavity; and,
and a filtering component is also arranged on the substrate component.
2. A TOP type high performance microphone according to claim 1,
the microphone assembly includes a MEMS chip and an ASIC chip disposed on the substrate assembly; and one side of the diaphragm of the MEMS chip, which is far away from the sound hole, is communicated with the back cavity.
3. A TOP type high performance microphone according to claim 2,
the ASIC chip is electrically connected with the MEMS chip and the substrate assembly through wires respectively.
4. A TOP type high performance microphone according to claim 2,
the filter assembly comprises an RC filter circuit assembly;
the RC filter circuit component comprises a first resistor, a second resistor, a first capacitor and a second capacitor; the first resistor is electrically connected between the ASIC chip and an external output end, the second resistor is electrically connected between the ASIC chip and an external power supply end, the first capacitor is electrically connected between the external power supply end and a grounding end, and the second capacitor is electrically connected between the external output end and the grounding end.
5. A TOP type high performance microphone according to claim 4,
the first resistor and the second resistor are arranged in the substrate assembly in a resistance embedding mode, and the first capacitor and the second capacitor are arranged in the substrate assembly in a capacitance embedding mode.
6. A TOP type high performance microphone according to claim 4,
the first resistor and the second resistor are both sheet resistors attached to the substrate assembly, and the first capacitor and the second capacitor are both ceramic capacitors attached to the substrate assembly.
7. A TOP type high performance microphone according to claim 4,
the first resistor and the second resistor are both built-in resistors arranged inside the substrate assembly in a molding manner, and the first capacitor and the second capacitor are both built-in capacitors arranged inside the substrate assembly in a molding manner.
8. A TOP type high performance microphone according to claim 2,
the filtering component comprises a magnetic bead filtering component;
the magnetic bead filtering component comprises a first magnetic bead and a second magnetic bead; the first magnetic bead is electrically connected between the ASIC chip and an external power supply end, and the second magnetic bead is electrically connected between the SIC chip and an external output end.
9. A TOP type high performance microphone according to any of claims 1 to 8,
the shell is a metal shell, and the metal shell is grounded.
10. A TOP type high performance microphone according to claim 1,
the base plate component comprises three layers of PCB boards which are mutually overlapped, wherein the back cavity is arranged on the middle layer of PCB board, a via hole is arranged on the upper layer of PCB board of the base plate component, and one side of the vibrating diaphragm of the microphone component, which is far away from the sound hole, is communicated with the back cavity through the via hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111602398.2A CN114189777A (en) | 2021-12-24 | 2021-12-24 | TOP type high-performance microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111602398.2A CN114189777A (en) | 2021-12-24 | 2021-12-24 | TOP type high-performance microphone |
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| Publication Number | Publication Date |
|---|---|
| CN114189777A true CN114189777A (en) | 2022-03-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111602398.2A Pending CN114189777A (en) | 2021-12-24 | 2021-12-24 | TOP type high-performance microphone |
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| Country | Link |
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| CN (1) | CN114189777A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106604189A (en) * | 2016-11-30 | 2017-04-26 | 歌尔股份有限公司 | MEMS microphone |
| CN112470492A (en) * | 2018-07-23 | 2021-03-09 | 美商楼氏电子有限公司 | Microphone device with inductive filtering |
| CN112492492A (en) * | 2020-12-24 | 2021-03-12 | 华景科技无锡有限公司 | Microphone packaging structure and microphone system |
| CN217486638U (en) * | 2021-12-24 | 2022-09-23 | 荣成歌尔微电子有限公司 | TOP type high-performance microphone |
-
2021
- 2021-12-24 CN CN202111602398.2A patent/CN114189777A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106604189A (en) * | 2016-11-30 | 2017-04-26 | 歌尔股份有限公司 | MEMS microphone |
| CN112470492A (en) * | 2018-07-23 | 2021-03-09 | 美商楼氏电子有限公司 | Microphone device with inductive filtering |
| CN112492492A (en) * | 2020-12-24 | 2021-03-12 | 华景科技无锡有限公司 | Microphone packaging structure and microphone system |
| CN217486638U (en) * | 2021-12-24 | 2022-09-23 | 荣成歌尔微电子有限公司 | TOP type high-performance microphone |
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