CN114189620B

CN114189620B - Camera module and electronic equipment

Info

Publication number: CN114189620B
Application number: CN202210142020.7A
Authority: CN
Inventors: 张一凡; 原帅; 李琛; 余洋华
Original assignee: Honor Device Co Ltd
Current assignee: Honor Device Co Ltd
Priority date: 2022-02-16
Filing date: 2022-02-16
Publication date: 2022-07-08
Anticipated expiration: 2042-02-16
Also published as: CN114189620A

Abstract

The application provides a camera module and electronic equipment relates to optical imaging technology field, can realize the light ring switching of continuous gear. The camera module comprises a lens component; the lens assembly comprises a lens barrel, a lens group and a diaphragm; the lens barrel bears the lens group and the diaphragm; the aperture is a partitioned multi-state device; the partitioned multi-state device comprises a first transparent substrate provided with a first transparent electrode layer and a second transparent substrate provided with a second transparent electrode layer; the first transparent electrode layer comprises a plurality of first electrode blocks which are arranged at intervals and are not electrically connected with each other; a plurality of irregular conductive particles with gaps are deposited on the first electrode block; gel is arranged between the first transparent substrate and the second transparent substrate; metal salt is added into the gel; when the first electrode block receives the first voltage and the second voltage received by the second transparent electrode layer, the metal of the metal salt in the gel is replaced and deposited on the first electrode block applying the first voltage, so that the light transmission state of the first electrode block is changed.

Description

Camera module and electronic equipment

Technical Field

The application relates to the technical field of optical imaging, in particular to a camera module and electronic equipment.

Background

With the continuous popularization of electronic devices, electronic devices have become indispensable social and entertainment tools in people's daily life, and people have higher and higher requirements for electronic devices. In order to meet the requirements of people for taking pictures or taking pictures, camera modules have been combined with various electronic devices, such as mobile phones, tablet computers, notebook computers, and the like.

Generally, the aperture of the camera module includes a fixed aperture and an adjustable aperture.

In the camera module of the fixed aperture, the size of the aperture is fixed, so that the shooting requirements of a bright field and a dark field cannot be met simultaneously. For example, day and night shooting needs; the camera takes pictures, the larger the aperture is, the shallower the depth of field is, and the lower the sharpness is; the smaller the aperture, the deeper the depth of field, and the higher the sharpness, i.e., the fixed aperture size cannot take into account the depth of field requirements of the subject and the background.

In the camera module with an iris diaphragm, the iris diaphragm structure generally realizes the change of the aperture size by utilizing a blade structure and driving through an independent driving module. However, the camera module is limited in internal space, the number of blades capable of being assembled is small, and only aperture switching of limited gears can be achieved. If the blade structure and the corresponding driving module are added, the size and the mass of the whole camera module can be increased.

Disclosure of Invention

In order to solve the technical problem, the application provides a camera module and an electronic device. Can realize the light ring of the continuous gear of camera module and switch, and can not increase the size and the quality of camera module, be favorable to the miniaturized design of camera module.

In a first aspect, an embodiment of the present application provides a camera module, which includes: a lens assembly; the lens assembly comprises a lens barrel, a lens group and a diaphragm; the lens group comprises at least one lens; the lens cone is used for bearing the lens group and the diaphragm; wherein, the aperture is a partitioned multi-state device; the partitioned multi-state device includes opposing first and second transparent substrates; a first transparent electrode layer is arranged on the first transparent substrate; a second transparent electrode layer is arranged on the second transparent substrate; the first transparent electrode layer comprises a plurality of first electrode blocks which are arranged at intervals and are not electrically connected with each other; a plurality of irregular conductive particles with gaps are deposited on the first electrode block; gel is arranged between the first transparent substrate and the second transparent substrate; metal salt is added into the gel; the first electrode block is used for replacing metal of the metal salt in the gel when receiving the first voltage and the second voltage received by the second transparent electrode layer, and the metal is deposited on the first electrode block applying the first voltage, so that the light transmission state of the first electrode block is changed. For example from a light transmitting state to a light non-transmitting state.

Because the quantity of first electrode piece is a plurality of, and a plurality of first electrode piece can independent control, like this, realize the aperture size infinitely variable control, can realize the size of aperture and adjust through exerting voltage for first electrode piece and second transparent electrode layer simultaneously, need not to set up the changeable drive arrangement of drive aperture size, reduced the assembly degree of difficulty of camera module, and can not increase the size and the quality of camera module. In addition, since the size adjustment of the aperture can be completed only by applying the first voltage and the second voltage, the response speed is fast and the accuracy is high compared to adjusting the size of the aperture by a mechanical manner (i.e., using a blade structure).

In some possible implementations, at least one lens has an outer surface in an optical axis direction of the lens, wherein the outer surface is a surface through which external light first passes through the lens; along the optical axis direction, the multi-state device of subregion is next to the surface, makes things convenient for the setting of multi-state device of subregion, and can not influence other structures in the lens subassembly.

In some possible implementation manners, on the basis that the partition multi-state device is adjacent to the outer surface, the partition multi-state device is in contact with the outer surface, so that the structure of the lens assembly is more compact, and the miniaturization design of the camera module is facilitated.

In some possible implementations, the partitioned multi-state device has a predetermined distance from the outer surface in the direction of the optical axis based on the fact that the partitioned multi-state device is immediately adjacent to the outer surface. Damage to the lens when the partitioned multi-state device is arranged is prevented.

In some possible implementations, on the basis that the partitioned multi-state device is adjacent to the outer surface, the partitioned multi-state device is disposed in the lens assembly by using a dispensing process or an injection molding process. When the partitioned multi-state device is arranged on the lens component by adopting the dispensing process, the process is simple. When the partitioned multi-state device is arranged on the lens barrel through an injection molding process, the connection strength of the partitioned multi-state device and the lens barrel is improved.

In some possible implementations, the lens group includes a plurality of lenses; the optical axes of the plurality of lenses coincide; the partitioned multi-state device is positioned between two adjacent lenses along the optical axis. At this time, the divisional multi-state device can not only function to adjust the size of the aperture but also function as a diaphragm.

In some possible implementations, the partitioned multi-state device is disposed in the lens assembly using an injection molding process based on the partitioned multi-state device being located between two adjacent lenses.

In some possible implementation manners, the camera module further includes a driving chip; the driving chip is used for applying a first voltage to the first electrode block of the partitioned multi-state device and applying a second voltage to the second transparent electrode layer. A driving chip is independently arranged to apply a first voltage to the first electrode block and apply a second voltage to the second transparent electrode layer, so that the first electrode block and the second transparent conductive layer can be conveniently controlled.

In some possible implementation manners, on the basis that the camera module further includes a driving chip, the camera module further includes a circuit board assembly and a connection structure; the circuit board assembly includes a first flexible circuit board; the driving chip is arranged on the first flexible circuit board; one end of the connecting structure is electrically connected with the partitioned multi-state device, and the other end of the connecting structure is electrically connected with the driving chip; the driving chip is used for applying a first voltage to the first electrode block of the partitioned multi-state device and applying a second voltage to the second transparent electrode layer through the connecting structure. Therefore, the driving chip can be arranged on the first flexible circuit board of the circuit board assembly, and the arrangement of each structure is more reasonable.

In some possible implementation manners, on the basis that the camera module further comprises a connection structure, the connection structure comprises a second flexible circuit board. Namely, the connecting structure has simple structure and lower cost.

In some possible implementation manners, on the basis that the camera module further comprises a connecting structure, the connecting structure is formed by a laser direct structuring technology. Of course, the connection structure is not limited to the second flexible circuit board and the formation of the laser direct structuring technology, as long as the electrical connection between the driving chip and the partitioned multi-state device can be realized.

In a second aspect, an embodiment of the present application provides an electronic device, including the camera module of the first aspect. All the effects of the first aspect can be achieved.

Drawings

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure;

fig. 2 is a schematic structural diagram of a camera module according to an embodiment of the present disclosure;

FIG. 3 is a schematic view of a portion of the camera module shown in FIG. 2;

fig. 4 is a schematic structural diagram of a partitioned multi-state device provided in an embodiment of the present application;

fig. 5 is a schematic structural diagram of a first transparent electrode layer according to an embodiment of the present disclosure;

FIG. 6 is a diagram of an application scenario of aperture size provided in an embodiment of the present application;

fig. 7 is a diagram of another application scenario of the aperture size provided in the embodiment of the present application;

fig. 8 is a diagram of another application scenario of the aperture size provided in the embodiment of the present application;

fig. 9 is a schematic structural diagram of another partitioned multi-state device provided in an embodiment of the present application;

fig. 10 is a schematic partial structural view of another camera module according to an embodiment of the present disclosure;

fig. 11a is an application scene diagram of adjusting the size of an aperture of a camera module according to an embodiment of the present application;

FIG. 11b is a top view of FIG. 11 a;

fig. 12a is a diagram of another application scenario in which a camera module according to an embodiment of the present application adjusts the size of an aperture;

FIG. 12b is a top view of FIG. 12 a;

fig. 13a is a diagram of another application scenario in which the camera module according to the embodiment of the present application adjusts the size of an aperture;

FIG. 13b is a top view of FIG. 13 a;

fig. 14 is a schematic structural view of another camera module according to an embodiment of the present application;

fig. 15 is a schematic partial structural view of the camera module in fig. 14;

fig. 16a is an application scene diagram of adjusting the aperture size of the camera module according to the embodiment of the present application;

FIG. 16b is a top view of FIG. 16 a;

fig. 17a is a diagram of another application scenario in which a camera module according to an embodiment of the present application adjusts the size of an aperture;

FIG. 17b is a top view of FIG. 17 a;

fig. 18a is a diagram of another application scenario in which a camera module according to an embodiment of the present application adjusts the size of an aperture;

FIG. 18b is a top view of FIG. 18 a;

fig. 19 is a schematic structural diagram of another camera module according to an embodiment of the present application;

fig. 20 is a schematic structural diagram of another camera module according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The term "and/or" herein is merely an association relationship describing an associated object, and means that there may be three relationships, for example, a and/or B, which may mean: a exists alone, A and B exist simultaneously, and B exists alone.

The terms "first" and "second," and the like, in the description and in the claims of the embodiments of the present application are used for distinguishing between different objects and not for describing a particular order of the objects. For example, the first target object and the second target object, etc. are specific sequences for distinguishing different target objects, rather than describing target objects.

In the embodiments of the present application, words such as "exemplary" or "for example" are used to mean serving as an example, instance, or illustration. Any embodiment or design described herein as "exemplary" or "e.g.," is not necessarily to be construed as preferred or advantageous over other embodiments or designs. Rather, use of the word "exemplary" or "such as" is intended to present concepts related in a concrete fashion.

In the description of the embodiments of the present application, the meaning of "a plurality" means two or more unless otherwise specified. For example, a plurality of processing units refers to two or more processing units; the plurality of systems refers to two or more systems.

The embodiment of the present application provides an electronic device, which may be an electronic device including a camera module, such as a mobile phone, a tablet computer, a personal digital assistant (PDA for short), a vehicle-mounted computer, an intelligent wearable device, an intelligent home device, a digital camera, a single-lens reflex camera (also referred to as a single lens reflex camera), and the like. For convenience of description, the electronic device is a mobile phone.

For the convenience of clearly describing the following structural features and the positional relationship of the structural features, the positional relationship of the structures in the mobile phone is defined by the X-axis direction, the Y-axis direction and the Z-axis direction. The X-axis direction is the width direction of the mobile phone, the Y-axis direction is the length direction of the mobile phone, and the Z-axis direction is the thickness direction of the mobile phone.

As shown in fig. 1, the mobile phone 100 includes a display 10, a rear cover 20, and a middle frame 30 between the display 10 and the rear cover 20. The display screen 10, the middle frame 30 and the rear cover 20 may enclose an accommodation cavity. The accommodating cavity is internally provided with a mainboard 40, a camera module 50 and other structures.

The Display screen 10 includes, for example, a Liquid Crystal Display (LCD) panel, an Organic Light Emitting Diode (OLED) Display panel, an LED Display panel including, for example, a Micro-LED Display panel, a Mini-LED Display panel, and the like. The embodiment of the present application does not specifically limit the type of the display screen 10.

The material of the rear cover 20 may include, for example, opaque materials such as plastic, cellulose skin, fiberglass, etc.; and may also comprise a light transmissive material such as glass. The material of the rear cover 20 is not particularly limited in the embodiments of the present application.

The camera module 50 includes, for example, a front camera module (not shown in the drawings) and a rear camera module 51, wherein the number of the rear camera modules 51 may be one or more. When the number of the rear camera modules 51 is plural, the functions of the plural rear camera modules 51 may not be the same. For example, in a possible implementation manner, one of the rear camera modules 51 is responsible for main shooting, one of the rear camera modules 51 is responsible for zooming, one of the rear camera modules 51 is responsible for wide-angle, one of the rear camera modules 51 is responsible for macro, and the like.

Referring to fig. 2, the camera module 50 includes a lens assembly 52 and a circuit board assembly 53.

Referring to fig. 3, the circuit board assembly 53 includes a sensor 531, a digital signal processing chip (not shown), a first flexible circuit board 532, and the like. The photographed subject projects the generated optical image onto the sensor 531 through the lens assembly 52. The sensor 531 converts the optical image into an electrical signal. The digital signal processing chip processes the current signal input by the sensor and then transmits the processed current signal to a processor (not shown in the figure) on the main board 40 through the first flexible circuit board 532, and finally converts the processed current signal into an image which can be seen on the display screen 10 of the mobile phone 100, so as to realize the photographing or camera shooting function of the camera module 50.

The lens assembly 52 includes a lens barrel 521, a lens group 522, an aperture 523, and a color filter 524. The lens group 522 includes at least one lens 5221, wherein fig. 3 illustrates the lens group 522 including six lenses 5221. The lens 5221 in the lens group 522 may be a plastic lens or a glass lens. When the lens group 522 includes a plurality of lenses 5221, the plurality of lenses 5221 may be of the same type or different types, i.e., they may all be plastic lenses, they may all be glass lenses, or a combination of plastic lenses and glass lenses. The barrel 521 is used to carry the lens group 522. The aperture 523 is used to control the light flux through the lens group 522 to the sensor 531 and to control the depth of field. The color filter 524 is used to filter out infrared light and prevent color cast of the image. The color Filter 524 includes Blue Glass (BG), an infrared Cut Filter (IRCF), and the like.

Since the iris diaphragm structure in the related art generally uses a blade structure, the aperture size is changed by independent module driving. However, the camera module 52 has a limited internal space, and the number of blades that can be assembled is small, and only aperture switching of limited gears can be achieved. If the blade structure and the corresponding drive module are added, the size and the mass of the whole module are increased.

Based on this, the embodiments of the present application provide an aperture that is a partitioned multi-state device, and at least one electrode layer in the partitioned multi-state device includes a plurality of first electrode blocks, and each first electrode block can be independently controlled. And when the aperture needs to be adjusted, providing pulse voltage for the first electrode block to enable the corresponding area of the multi-state device to be transparent or black. I.e. by applying pulsed voltages to the first electrode blocks at different positions, thereby adjusting the light-transmissive area of the multi-state device. When the required aperture is large, a pulse voltage is applied to a small number of first electrode blocks. When the required aperture is small, a pulse voltage is applied to a large number of first electrode blocks. The actual size of the diaphragm of the camera module can be changed to form a variable diaphragm, and the requirement of scene photographing or video recording on the diaphragm is met. And can realize the light ring of the continuous gear of camera module and switch, and can not increase the size and the quality of camera module, be favorable to the miniaturized design of camera module.

The principle of realizing aperture size variation of the partitioned multi-state device in the embodiment of the present application is described below with reference to a camera module.

Referring to fig. 4, aperture 523 is a partitioned multi-state device. The partitioned multi-state device includes opposing first 5231 and second 5232 transparent substrates. The first transparent substrate 5231 and the second transparent substrate 5232 are made of glass, Polyimide (PI), polymethyl Methacrylate (PMMA), or the like, for example. The types of materials of the first transparent substrate 5231 and the second transparent substrate 5232 may be the same or different. A first transparent electrode layer 5233 is provided over the first transparent substrate 5231. Referring to fig. 5, the first transparent electrode layer 5233 includes a plurality of first electrode blocks 5234 disposed at intervals and not electrically connected to each other, and the plurality of first electrode blocks 5234 are arranged in an array, for example. Each of the first electrode blocks 5234 has a plurality of irregular and interstitial conductive particles 5235 deposited thereon. A second transparent electrode layer 5236 is provided over the second transparent substrate 5232. A gel 5237 is provided between the first transparent substrate 5231 and the second transparent substrate 5232, and a metal salt is added to the gel 5237. The material of the first transparent electrode layer 5233 and the second transparent electrode layer 5236 is, for example, Indium Tin Oxide (ITO). The gel 5237 may be liquid, solid, or semi-solid. The metal salt includes, for example, silver salts, which are a generic term for salts in which all cations are silver ions, such as silver halide, silver nitrate, silver sulfate, and the like.

Specifically, when the aperture needs to be adjusted, a first voltage is applied to some of the first electrode blocks 5234, and a second voltage is applied to the second transparent electrode layer 5236. The gel 5237 in the region corresponding to the first electrode block 5234 to which the first voltage is applied undergoes redox, which can replace the metal of the metal salt in the gel 5237. The displaced metal is deposited on the corresponding first electrode block 5234. Since the conductive particles on each of the first electrode blocks 5234 are irregular, the metal deposited on the irregular conductive particles absorbs the light entering the lens assembly 52, and the surface of the irregular conductive particles 5235 appears black, i.e., the light entering the lens assembly 52 cannot reach the sensor 531. The remaining first electrode block 5234 is not applied with the first voltage. The gel of the region corresponding to the first electrode block 5234 to which the first voltage is not applied does not undergo a redox reaction. The irregular conductive particles 5235, on which no metal is deposited, transmit light entering the lens assembly 52. That is, the first electrode block 5234 to which the first voltage is applied changes from a light-transmitting state to a black state (i.e., the metal absorbs light) due to deposition of the metal, so that the light-transmitting area of the partitioned multi-state device changes, and thus, adjustment of the aperture size can be achieved.

For example, referring to fig. 6 to 8, in fig. 6 to 8, the number of the first electrode blocks 5234 to which the first voltage is applied is increased, and the light-transmitting area of the divisional multi-state device is decreased, thereby achieving the effect of adjusting the size of the aperture. In addition, since the number of the first electrode blocks 5234 is plural, and the plural first electrode blocks 5234 can be independently controlled, thus realizing the stepless adjustment of the aperture size, and meanwhile realizing the adjustment of the aperture size by applying voltage to the first electrode blocks 5234 and the second transparent electrode layer 5236, without setting a driving device for driving the aperture size to be variable, the assembly difficulty of the camera module 50 is reduced, and the size and the quality of the camera module 50 are not increased. In addition, since the size adjustment of the aperture can be completed only by applying the first voltage and the second voltage, the response speed is fast and the accuracy is high compared to adjusting the size of the aperture by a mechanical manner (i.e., using a blade structure).

In fig. 4, the first transparent electrode layer 5233 is illustrated as being located below the second transparent electrode layer 5236 in the Z-axis direction, but the present invention is not limited thereto. In other alternative embodiments, the first transparent electrode layer 5233 can also be positioned above the second transparent electrode layer 5236. In fig. 4 and 5, the first transparent electrode layer 5233 is described as including a plurality of first electrode blocks 5234, but the present invention is not limited thereto. In other alternative embodiments, it is also possible that the first transparent electrode layer 5233 includes a plurality of first electrode blocks 5234 and the second transparent electrode layer 5236 includes a plurality of second electrode blocks. The plurality of first electrode blocks 5234 and the plurality of second electrode blocks are disposed in one-to-one correspondence. That is, a projection of one first electrode block 5234 in the plane formed by the X-axis and the Y-axis overlaps with a projection of one second electrode block in the plane formed by the X-axis and the Y-axis. When only the first transparent electrode layer 5233 includes the plurality of first electrode blocks 5234 and the second transparent electrode layer 5236 is entirely disposed, the second transparent electrode layer 5236 does not need to be patterned, thereby simplifying the process steps.

To avoid image abnormality caused by light leakage from the gap of the first electrode block 5234. Referring to fig. 9, the conductive particles 5235 may be disposed on the first electrode block 5234 by sputtering or the like, and the conductive particles 5235 are also positioned in the gaps of the adjacent first electrode blocks 5234. When a first voltage is applied to the first transparent electrode layer 5233 and a second voltage is applied to the second transparent electrode layer 5236, the metal displaced in the gel 5237 adheres to the gaps of the adjacent first electrode blocks 5234 to which the first voltage is applied. Thus, the metal on the conductive particles 5235 blocks light waves of corresponding frequencies, thereby preventing the first transparent electrode layer 5233 from leaking light.

Regarding the shape and area of the first electrode block 5234, the shape and area of the first electrode block 5234 are not limited in the embodiments of the present application and can be set by those skilled in the art according to the actual situation.

In one possible implementation, with continued reference to fig. 5, the plurality of first electrode blocks 5234 comprises a plurality of first type electrode blocks 5239 and second type electrode blocks 5240 along the X-axis. The first-type electrode block 5239 is a first electrode block located at the edge. The projection of the first-type electrode block 5239 on the plane formed by the X-axis and the Y-axis is shaped. The second type electrode block 5240 is a first electrode block other than the first type electrode block 5239. The projections of the plurality of second-type electrode blocks 5240 on the plane formed by the X-axis and the Y-axis have the same shape (e.g., square) and the same area, and the area is larger than the area of the projections of the first-type electrode blocks 5239 on the plane formed by the X-axis and the Y-axis. This arrangement facilitates the arrangement of the first electrode block 5234, simplifying the process steps.

As for the shape of the partitioned multi-state device, the shape of the partitioned multi-state device is not limited in the embodiments of the present application, and can be set by those skilled in the art according to actual situations.

In one possible implementation, with continued reference to fig. 5, the shape of the projection of the partitioned multi-state device onto the plane formed by the X-axis and the Y-axis comprises a circle.

Further, when the gel 5237 is liquid or semi-solid, in order to prevent the gel 5237 from flowing out. With continued reference to fig. 4, the partitioned multi-state device further includes an encapsulation structure 5238. One end of the encapsulation structure 5238 is in contact with the first transparent substrate 5231, the other end of the encapsulation structure 5238 is in contact with the second transparent substrate 5232, and the encapsulation structure 5238 is disposed around the gel 5237. That is, the encapsulation structure 5238, the first transparent substrate 5231 and the second transparent substrate 5232 enclose a receiving cavity in which the gel 5237 is located, so that the gel 5237 cannot flow out.

As for the type of the encapsulation structure 5238, the present embodiment does not limit the type of the encapsulation structure 5238 as long as the outflow of the gel 5237 can be limited. For example, the sealant can be used.

Along the Z-axis direction, for the thickness of the partitioned multi-state device, the thickness of the partitioned multi-state device is not limited in the embodiment of the present application, and those skilled in the art can set the thickness according to actual situations as long as the size of the aperture can be adjusted.

As for the setting position of the partitioned multi-state device, the setting position of the partitioned multi-state device is not limited in the embodiment of the present application as long as the actual size of the aperture of the camera module 50 can be changed. For example, may be integrated into lens assembly 52 and positioned outside of lens group 522; or between the lens 5221 and the lens 5221 of the lens group 522, etc., so that the design restrictions on the camera module 52 are small. The case where the divisional multi-state device is integrated in the lens assembly 52 and is located outside the lens group 522 and the divisional multi-state device is integrated between the lens 5221 and the lens 5221 of the lens group 522 will be described separately.

With continued reference to fig. 2 and 3, when the partitioned multi-state device is integrated into the lens assembly 52 and is located outside of the lens group 522, the lens group 522 includes at least one lens 5221. At least one lens 5221 has an outer surface in the direction of its optical axis, wherein the outer surface is the surface through which external light first passes through the lens 5221. The partitioned multi-state device is located on a side of the outer surface facing away from the color filter 524 along the Z-axis direction. As shown in fig. 3, the partitioned multi-state device can be placed against an outer surface. The partitioned multi-state device can also be spaced from the outer surface as shown in fig. 10.

Referring to fig. 11a to 13b, when the divisional multi-state device is integrated in the lens assembly 52 and is located outside the lens group 522, as the F-number of the aperture increases (from F4 to F16), the number of first electrode blocks 5234 to which the first voltage is applied increases, the area of light transmission of the divisional multi-state device becomes smaller, and the aperture gradually changes from large to small. Wherein the F-number is equal to the focal length of the lens assembly 52 divided by the diameter of the aperture of the lens assembly 52. The size adjustment of the aperture of the lens assembly 52 is achieved.

In this case, the partitioned multi-state device may be disposed on the lens barrel 521 by dispensing, for example, and on a side of the lens group 522 away from the color filter 524. The partitioned multi-state device is arranged on the lens barrel 521 in a dispensing mode, and the process is simple.

Of course, the manner of disposing the partitioned multi-state device on the lens barrel 521 is not limited to the dispensing manner, and the partitioned multi-state device may be disposed on the lens barrel 521 by injection molding, for example. When the multi-state device is arranged on the lens barrel 521 in an injection molding mode, the connection strength of the multi-state device and the lens barrel 521 is improved. For the processes of the dispensing process and the injection molding process, reference may be made to the technical solutions in the embodiments of the prior art, and the embodiments of the present application are not described in detail.

When the partitioned multi-state device is integrated in lens 5221 and lens 5221 of lens group 522, referring to fig. 14 and 15, lens group 522 includes a plurality of lenses 5221. The plurality of lenses 5221 are stacked in the Z-axis direction, and the optical axes of the plurality of lenses 5221 overlap. The partitioned multi-state device is located between two of the lenses 5221. At this time, the divisional multi-state device can not only function to adjust the size of the aperture but also function as a diaphragm.

Here, the number, type, and shape of the lenses 5221 are not limited in the embodiments of the present application. Fig. 15 illustrates an example in which the lens group 522 includes seven lenses 5221, and the seven lenses are different in shape from fig. 10.

It should be noted here that when the partitioned multi-state device is integrated in the lens 5221 and the lens 5221 of the lens group 522, the shape of the partitioned multi-state device is not limited in the embodiments of the present application. The shape of the partitioned multi-state device can be adjusted according to factors such as the shape of the lens 5221.

Referring to fig. 16a to 18b, when the divisional multi-state device is integrated in the lens 5221 and the lens 5221 of the lens group 522, as the F-number of the aperture increases (from F4 to F16), the number of the first electrode blocks 5234 to which the first voltage is applied increases, the area of light transmission of the divisional multi-state device becomes smaller, and the aperture gradually changes from large to small. Wherein the F-number is equal to the focal length of the lens assembly 52 divided by the diameter of the aperture of the lens assembly 52. The size adjustment of the aperture of the lens assembly 52 is achieved.

In this case, the partitioned multi-state device can be integrated between the lens 5221 and the lens 5221 of the lens group 522 by injection molding, for example. When the partitioned multi-state device is integrated between the lens 5221 and the lens 5221 of the lens group 522 by injection molding, the connection strength of the partitioned multi-state device and the lens barrel 521 is improved.

In addition, in order to apply a first voltage to the first electrode block 5234 and a second voltage to the second transparent electrode layer 5236. Optionally, with continued reference to fig. 19 and 20, the camera module 50 further includes a connection structure 525 and a driving chip 526, the driving chip 526 is disposed on the first flexible circuit board 532, and the driving chip 526 is electrically connected to the first transparent electrode layer 5233 and the second transparent electrode layer 5236 of the partitioned multi-state device through the connection structure 525.

Illustratively, each of the first electrode blocks 5234 of the first transparent electrode layer 5233 includes one pin, and the pin of each of the first electrode blocks 5234 is electrically connected to one end of the connection structure 525, and the other end of the connection structure 525 is electrically connected to the driving chip 526, so as to electrically connect the partitioned multi-state device to the driving chip 526. In this way, the driving chip 526 transmits the first voltage to the first electrode block 5234 and the second voltage to the second transparent electrode layer 5236, and the first electrode block 5234 to which the first voltage is applied changes from a light-transmitting state to a black state (i.e., the metal absorbs light) due to the deposition of the metal, so that the light-transmitting area of the partitioned multi-state device changes, and the adjustment of the aperture size is achieved.

As for the type of the connection structure 525, the embodiment of the present application does not limit the type of the connection structure 525. So long as the electrical connection of the driver chip 526 to the partitioned multi-state device can be achieved.

In one possible implementation, the connection structure 525 is a flexible circuit board, and the flexible circuit board is a second flexible circuit board for distinguishing from the first flexible circuit board 532, that is, the electrical connection between the partitioned multi-state device and the driving chip 526 is realized through the second flexible circuit board.

In yet another possible implementation, the connecting structure 525 is formed by a Laser Direct Structuring (LDS) technique.

It should be noted that the partitioned multi-state device can be applied to the camera module 50 with different functions. For example, it can be applied to the camera module 50 having an Auto Focus (AF) function. As another example, the present invention is applied to a camera module 50 having a Fixed Focus (FF) function. For example, the present invention is applied to a camera module 50 having an Optical Image Stabilization (OIS) function.

The above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A camera module, its characterized in that includes: a lens assembly;

the lens assembly comprises a lens barrel, a lens group and a diaphragm; the lens group comprises at least one lens;

the lens barrel is used for bearing the lens group and the diaphragm;

wherein, the aperture is a partitioned multi-state device; the partitioned multi-state device includes opposing first and second transparent substrates; a first transparent electrode layer is arranged on the first transparent substrate; a second transparent electrode layer is arranged on the second transparent substrate;

the first transparent electrode layer comprises a plurality of first electrode blocks which are arranged at intervals and are not electrically connected with each other; a plurality of irregular conductive particles with gaps are deposited on the first electrode block; a plurality of first electrode blocks are arranged in an array;

a gel is arranged between the first transparent substrate and the second transparent substrate; metal salt is added into the gel;

the first electrode block is used for replacing metal of metal salt in the gel when receiving a first voltage and a second voltage received by the second transparent electrode layer, and the metal is deposited on the first electrode block applying the first voltage, so that the light transmission state of the first electrode block is changed.

2. The camera module according to claim 1, wherein at least one of the lenses has an outer surface along an optical axis direction of the lens, wherein the outer surface is a surface through which external light first passes;

the partitioned multi-state device is adjacent to the outer surface along the optical axis.

3. The camera module of claim 2, wherein the partitioned multi-state device is in contact with the outer surface.

4. The camera module of claim 2, wherein the partitioned multi-state device has a predetermined distance from the outer surface in the direction of the optical axis.

5. The camera module according to claim 2, wherein the partitioned multi-state device is disposed in the lens assembly by a dispensing process or an injection molding process.

6. The camera module of claim 1, wherein the lens group comprises a plurality of lenses; the optical axes of a plurality of the lenses are coincident;

the partitioned multi-state device is located between two adjacent lenses along the optical axis direction.

7. The camera module of claim 6, wherein the partitioned multi-state device is disposed in the lens assembly using an injection molding process.

8. The camera module of claim 1, further comprising a driver chip;

the driving chip is used for applying the first voltage to the first electrode block of the partitioned multi-state device and applying the second voltage to the second transparent electrode layer.

9. The camera module of claim 8, further comprising a circuit board assembly and a connecting structure; the circuit board assembly includes a first flexible circuit board;

the driving chip is arranged on the first flexible circuit board;

one end of the connecting structure is electrically connected with the partitioned multi-state device, and the other end of the connecting structure is electrically connected with the driving chip;

the driving chip is used for applying the first voltage and the second voltage to the first electrode block and the second transparent electrode layer of the partitioned multi-state device through the connecting structure.

10. The camera module of claim 9, wherein the connecting structure comprises a second flexible circuit board.

11. The camera module of claim 9, wherein the connecting structure is formed by a laser direct structuring technique.

12. An electronic device, comprising the camera module according to any one of claims 1 to 11.