CN114188780B - Connection busbar and processing technology - Google Patents
Connection busbar and processing technology Download PDFInfo
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- CN114188780B CN114188780B CN202111473809.2A CN202111473809A CN114188780B CN 114188780 B CN114188780 B CN 114188780B CN 202111473809 A CN202111473809 A CN 202111473809A CN 114188780 B CN114188780 B CN 114188780B
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- plate
- connecting part
- polar plate
- motherboard
- mother
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- 238000005516 engineering process Methods 0.000 title description 7
- 239000000758 substrate Substances 0.000 claims abstract description 48
- 239000010410 layer Substances 0.000 claims abstract 24
- 239000011247 coating layer Substances 0.000 claims abstract 5
- 238000005253 cladding Methods 0.000 claims description 41
- 238000000034 method Methods 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 238000004080 punching Methods 0.000 claims description 13
- 238000005452 bending Methods 0.000 claims description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 238000004140 cleaning Methods 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 238000009434 installation Methods 0.000 claims description 6
- 238000003801 milling Methods 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 239000011810 insulating material Substances 0.000 claims description 5
- 230000000694 effects Effects 0.000 claims description 4
- 238000007731 hot pressing Methods 0.000 claims description 4
- 239000004744 fabric Substances 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 238000007781 pre-processing Methods 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 238000005096 rolling process Methods 0.000 claims description 3
- 238000004381 surface treatment Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 238000007789 sealing Methods 0.000 abstract description 3
- 238000009413 insulation Methods 0.000 abstract description 2
- 239000002131 composite material Substances 0.000 description 6
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R25/00—Coupling parts adapted for simultaneous co-operation with two or more identical counterparts, e.g. for distributing energy to two or more circuits
- H01R25/16—Rails or bus-bars provided with a plurality of discrete connecting locations for counterparts
- H01R25/161—Details
- H01R25/162—Electrical connections between or with rails or bus-bars
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/502—Bases; Cases composed of different pieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R25/00—Coupling parts adapted for simultaneous co-operation with two or more identical counterparts, e.g. for distributing energy to two or more circuits
- H01R25/16—Rails or bus-bars provided with a plurality of discrete connecting locations for counterparts
- H01R25/167—Connecting locations formed by staggering mounted apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Multi-Conductor Connections (AREA)
- Installation Of Bus-Bars (AREA)
Abstract
A connection busbar comprises a substrate, an upper electric connection part and a lower electric connection part. The upper electric connection part comprises an upper cavity, an upper polar plate, an upper fixing layer and an upper coating layer. The lower electric connection part comprises a lower cavity, a lower polar plate, a lower fixing layer and a lower coating layer. The upper polar plate is provided with two upper connecting parts. The lower polar plate is provided with two lower connecting parts. Each upper connecting part and each lower connecting part are arranged in a staggered mode. Compared with the prior art, the upper electric connecting part and the lower electric connecting part are respectively arranged on two sides of the substrate, so that the upper polar plate and the lower polar plate which are respectively arranged in the upper electric connecting part and the lower electric connecting part are mutually insulated, and the insulation requirement can be met under the conditions of narrow space and insufficient edge sealing distance. Meanwhile, the size of the connecting busbar can be made very small by the structure, and the use requirement is met.
Description
Technical Field
The invention relates to the composite busbar industry, in particular to a connecting busbar and a processing technology.
Background
The composite busbar is a multilayer composite structure and comprises a conductive layer and an insulating layer. The conductive layer and the insulating layer are assembled and bonded through a plurality of positioning pieces. The existing insulating layer is generally made of an insulating film, the insulating film is coated outside the conducting layer, and sealing is carried out by using a potting process, so that the conducting layer can be sealed and insulated by the insulating film. The insulating film needs to have a size as narrow as possible so as to match the size of the small-volume composite busbar. Meanwhile, the insulating film needs complex installation and coating steps and has high requirement on the dimensional accuracy of installation, so that the cost for producing the composite busbar is high, the production efficiency is low, and the composite busbar is not suitable for mass production.
Disclosure of Invention
In view of the above, the present invention provides a connection busbar and a processing technology for solving the above problems.
The utility model provides a connect busbar, includes a base plate, a setting is in the last electric connecting portion of base plate upper portion, and a setting is in the lower electric connecting portion of base plate lower part, go up electric connecting portion and be in including one set up the last die cavity of base plate one side, one set up the interior upper polar plate of last die cavity, one set up the last fixed layer of one side of upper polar plate, and one set up the last coating of one side department of upper die cavity, lower electric connecting portion include one set up the lower die cavity of base plate opposite side, one set up the lower polar plate of the inside of lower die cavity, one set up the lower fixed layer of one side of lower polar plate, and one set up the lower coating of one side of lower die cavity, the upper polar plate has two interval arrangement's lower connecting portion, every upper connecting portion is followed one side lateral wall of upper die cavity wears out, every lower connecting portion is followed one side lateral wall of lower side is worn out, every upper connecting portion is with every lower connecting portion dislocation setting.
Further, an upper mounting notch which is convenient for the upper connecting part to penetrate out is formed in the position of the upper cavity corresponding to the upper connecting part, and a lower mounting notch which is convenient for the lower connecting part to penetrate out is formed in the position of the lower cavity corresponding to the lower connecting part.
Further, each of the upper connection portions includes an upper mounting plate, an upper mounting hole formed in the upper mounting plate, and an upper clamping nut mounted in the upper mounting hole, and each of the lower connection portions includes a lower mounting plate, a lower mounting hole formed in the lower mounting plate, and a lower clamping nut mounted in the lower mounting hole.
Further, the extending ends of the upper connecting portion and the lower connecting portion are located on the same side of the connecting busbar, and the tail ends of the upper connecting portion and the lower connecting portion are respectively provided with a bending towards the same side of the substrate and bending by 90 degrees.
Further, the width of the substrate is 15mm.
Further, the substrate, the upper cladding layer and the lower cladding layer are respectively made of insulating materials, and the upper polar plate and the lower polar plate are copper plates.
The processing technology for connecting the busbar comprises the following steps:
A. Selecting materials, selecting proper mother boards to ensure the installation effect, selecting two copper boards as an upper polar plate mother board and a lower polar plate mother board respectively, selecting three insulating boards as a substrate mother board respectively, an upper cladding mother board and a lower cladding mother board, and selecting two prepreg mother boards as an upper fixed layer mother board and a lower fixed layer mother board respectively;
B. Blanking, namely, processing the upper polar plate motherboard through a plurality of punches to form at least two upper polar plates which are distributed at intervals on the upper polar plate motherboard, processing the lower polar plate motherboard through a plurality of punches to form at least two lower polar plates which are distributed at intervals on the lower polar plate motherboard, forming two upper connecting parts which are distributed at intervals on one side of each upper polar plate through a plurality of punches, forming two lower connecting parts which are distributed at intervals on one side of each lower polar plate through a plurality of punches, forming at least two upper cladding layers which are distributed at intervals on the upper cladding layer motherboard through a plurality of punches, forming at least two lower cladding layers which are distributed at intervals on the lower cladding layer motherboard through a plurality of punches, forming at least two upper die cavities which are distributed at intervals on one side of each substrate through a plurality of punches, forming at least two lower mounting notches which are distributed at intervals on the other side of each upper die cavity, forming at least two lower mounting notches which are distributed at intervals on the other side of each substrate through a plurality of punches, and forming two lower mounting notches which are distributed at intervals on the side of each lower die cavity through a plurality of dies, and forming two lower mounting notches which are distributed at intervals on the side of each die cavity;
C. pre-processing, namely punching the upper polar plate motherboard and the lower polar plate motherboard to enable the two upper connecting parts and the two lower connecting parts to be respectively bent towards the same side of the substrate motherboard;
D. surface treatment, namely performing nickel plating treatment on the surfaces of the upper polar plate mother plate and the lower polar plate mother plate;
E. Assembling, namely milling the upper polar plate mother plate into a plurality of upper polar plates, milling the lower polar plate mother plate into a plurality of lower polar plates, filling the upper polar plates into the upper die cavity on the substrate mother plate, filling the lower polar plates into the lower die cavity on the substrate mother plate, stacking the upper cladding layer mother plate, the upper fixed layer mother plate, the substrate mother plate, the lower fixed layer mother plate and the lower cladding layer mother plate in a preset template in sequence, coating glue between adjacent mother plates, and pressing all mother plates into a whole through high-temperature hot pressing;
F. Dividing the whole body into at least two connecting busbar with preset number;
G. And cleaning, namely cleaning stains on the surface of the connecting busbar by using flexible cloth or a rolling brush to manufacture the connecting busbar.
Drawings
Fig. 1 is a schematic diagram of a combined structure of a connection busbar according to the present invention.
Fig. 2 is an exploded view of the connection busbar of fig. 1.
Fig. 3 is a partial enlarged view of the connection busbar of fig. 2 at a.
Fig. 4 is a cross-sectional view of the connection busbar of fig. 1 at B.
Fig. 5 is an exploded view of the connection busbar of fig. 2 when assembled by the manufacturing process.
Detailed Description
Specific embodiments of the present invention are described in further detail below. It should be understood that the description herein of the embodiments of the invention is not intended to limit the scope of the invention.
Fig. 1 to fig. 4 are schematic structural views of a connection busbar according to the present invention. The connection busbar includes a substrate 10, an upper electrical connection portion 20 disposed at an upper portion of the substrate 10, and a lower electrical connection portion 30 disposed at a lower portion of the substrate 10. It is conceivable that the connection busbar of the present invention further includes some functional modules, such as electrical components connected to the outside of the connection busbar, which are known to those skilled in the art, and will not be described herein.
The substrate 10 is made of an insulating material. The substrate 10, the upper electrical connection portion 20, and the lower electrical connection portion 30 are welded into a whole after being thermally pressed, so as to ensure the structural strength of the whole connection busbar. The width of the substrate 10 may be 15mm, which is narrower than a general connection busbar, so that it can be applied to a small-sized space. Of course, the shape, size, etc. of the substrate 10 may be set according to actual needs.
The upper electrical connection part 20 includes an upper cavity 21 formed at one side of the substrate 10, an upper plate 22 filled in the upper cavity 21, and an upper cladding layer 23 covered on one side of the upper cavity 21. The base plate 10 and the upper cladding layer 23 are made of an insulating material, so that the upper electrode plate 22 is wrapped by the insulating base plate 10 and the upper cladding layer 23, thereby insulating the upper electrode plate 22 from the outside, and ensuring the insulating effect of the upper electrode plate 22 when a plurality of connecting bus bars of the same structure are overlapped with each other. An upper fixing layer 24 is also arranged in the cavity of the upper cavity 21. The upper fixing layer 24 is disposed on one side of the upper plate 22, so that the upper plate 22 is fixedly installed in the upper cavity 21, and the installation firmness of the upper plate 22 is further ensured. The upper cavity 21 can also function to define the position of the upper plate 22. Upper connecting portions 221 are symmetrically disposed at two ends of one side of the upper plate 22. An upper mounting notch 211 is formed in a side wall of the upper cavity 21 corresponding to each of the upper connection portions 221. Each of the upper connection parts 221 passes through the corresponding upper mounting notch 211 so as to protrude out of the upper cavity 21 to be electrically connected with an external part. The width of the upper mounting notch 211 is the same as the cavity wall thickness of the upper cavity 21. The upper coupling part 221 includes an upper mounting plate 222, an upper mounting hole 223 formed at the upper mounting plate 222, and an upper clamping nut 224 mounted in the upper mounting hole 223.
The lower electrical connection part 30 includes a lower cavity 31 provided at the other side of the substrate 10, a lower plate 32 installed inside the lower cavity 31, and a lower cladding 33 covered at one side of the lower cavity 31. The structure of the lower electrical connection portion 30 and the structure of the upper electrical connection portion 20 are symmetrically distributed along the substrate 10. The lower cladding layer 33 is made of an insulating material. The lower plate 32 is covered with the substrate 10 and the lower cover 33 to be insulated from the outside. Two lower connecting portions 321 are symmetrically installed at two ends of one side of the lower electrode plate 32. A lower mounting notch 311 is formed at a position corresponding to each of the lower connecting portions 321 on one side of the lower cavity 31. Each of the lower connecting portions 321 passes through the corresponding lower mounting notch 311 to protrude out of the cavity wall of the lower cavity 31. A lower fixing layer 34 for fixing the lower plate 32 to the other side of the substrate 10 is installed at one side of the lower plate 32. The lower connecting portion 321 includes a lower mounting plate 322, a lower mounting hole 324 formed in the lower mounting plate 322, and a lower clamping nut 325 installed in the lower mounting hole 324.
The upper mounting plate 222 and the lower mounting plate 323 are provided with a bending section. The bending angle of the bending section is 90 degrees. The bending direction of the bending section is the same, and the upper mounting hole 223 and the lower mounting hole 324 are both formed on the bending section, so as to facilitate external connection.
Compared with the prior art, the upper electric connecting part 20 and the lower electric connecting part 30 are respectively arranged on two sides of the substrate 10, so that the upper polar plate 22 and the lower polar plate 32 which are respectively arranged in the upper electric connecting part 20 and the lower electric connecting part 30 are mutually insulated, and the insulation requirement can be met under the conditions of narrow space and insufficient edge sealing distance. The upper electric connection part 20 and the lower electric connection part 30 have simple structures and low requirements on the precision of the production process flow, thereby improving the production efficiency of products. Meanwhile, the upper electrical connection portion 20 and the lower electrical connection portion 30 are respectively disposed on two sides of the substrate 10, so that the upper electrode plate 22 and the lower electrode plate 32 can be infinitely close to each other, and the volume of the connection busbar is further reduced.
The processing technology of the connecting busbar comprises the following steps:
A. the appropriate motherboard 40 is selected to ensure the installation effect. Two copper plates are selected as an upper plate motherboard 41 and a lower plate motherboard 42 respectively, three insulating plates are selected as a substrate motherboard 43 respectively, an upper cladding motherboard 44 and a lower cladding motherboard 45 respectively, and two prepreg motherboards are selected as an upper fixed layer motherboard 46 and a lower fixed layer motherboard 47 respectively;
B. Blanking, namely, performing a counter-punching process on the upper plate motherboard 41 to form at least two upper plates 22 which are distributed at intervals on the upper plate motherboard 41, performing a counter-punching process on the lower plate motherboard 42 to form at least two lower plates 32 which are distributed at intervals on the lower plate motherboard 42, forming two upper connecting parts which are distributed at intervals on one side of each upper plate 22 through a counter-punching process, forming two lower connecting parts 321 which are distributed at intervals on one side of each lower plate 32 through a counter-punching process, forming at least two upper cladding layers 23 which are distributed at intervals on the upper cladding layer motherboard 44 through a counter-punching process, forming at least two lower cladding layers 33 which are distributed at intervals on the lower cladding layer motherboard 45 through a counter-punching process, forming at least two upper cavities 21 which are distributed at intervals on one side of the substrate 10 through a counter-punching process, forming two upper mounting notches which are distributed at intervals on one side of each upper cavity 21 through a counter-punching process, forming two lower mounting notches which are distributed at intervals on the other side of each lower cavity 21 through a counter-punching process, forming at least two lower cavities 31 which are distributed at intervals on the other side of the substrate 10 through a counter-punching process, and forming two corresponding cavities 31 on the other side of each lower cavity 31;
C. Pre-processing, namely punching the upper polar plate mother plate 41 and the lower polar plate mother plate 42 so as to bend the two upper connecting parts 221 and the two lower connecting parts 321 towards the same side of the substrate mother plate respectively;
D. surface treatment, namely, nickel plating treatment is carried out on the surfaces of the upper polar plate mother plate 41 and the lower polar plate mother plate 42;
E. Assembling, namely milling the upper plate mother board 41 into a plurality of upper plate boards 22, milling the lower plate mother board 42 into a plurality of lower plate boards 32, filling the upper plate boards 22 into the upper cavity 21 on the substrate mother board 43, filling the lower plate boards 32 into the lower cavity 31 on the substrate mother board 43, stacking the upper cladding layer mother board 44, the upper fixed layer mother board 46, the substrate mother board 43, the lower fixed layer mother board 47 and the lower cladding layer mother board 45 in a preset template 50 in sequence, coating glue between adjacent mother boards, and pressing each mother board into a whole through high-temperature hot pressing;
F. Dividing the whole body into at least two connecting busbar with preset number;
G. cleaning, namely cleaning stains on the surface of the connecting busbar by using flexible cloth or a rolling brush to manufacture the connecting busbar;
The preset template 50 includes an upper cover 51, a lower cover 52 spaced apart from the upper cover 51, and at least three fixing members 53 installed between the upper cover 51 and the lower cover 52. The upper cover body 51, the upper cladding layer motherboard 44, the upper fixed layer motherboard 46, the upper electrode plate 22, the substrate motherboard 43, the lower electrode plate 32, the lower fixed layer motherboard 47, the lower cladding layer motherboard 45, and the lower cover body 52 are provided with positioning holes 54, and the fixing pieces 53 sequentially penetrate through the positioning holes 54 to clamp the motherboard 40 between the upper cover body 51 and the lower cover body 52.
The upper cladding mother board 44, the upper fixed mother board 46, the lower fixed mother board 47, the lower cladding mother board 45, and the upper cover 51 are provided with notches 48 corresponding to the upper connection portion and the lower connection portion, so that the upper connection portion and the lower connection portion can pass through conveniently.
Compared with the prior art, the processing technology of the connecting busbar provided by the invention can simultaneously produce and manufacture at least two connecting busbars, thereby greatly improving the production efficiency. At least two connecting busbar are produced and manufactured simultaneously, and the phenomenon that the product is bent and deformed due to the fact that the width of the single product is too small when the single product is subjected to hot pressing can be avoided, so that the yield is improved.
The above is only a preferred embodiment of the present invention and is not intended to limit the scope of the present invention, and any modifications, equivalent substitutions or improvements within the spirit of the present invention are intended to be covered by the claims of the present invention.
Claims (8)
1. The utility model provides a connect female row which characterized in that: the upper electric connecting part comprises an upper cavity, an upper polar plate, an upper fixing layer and an upper coating layer, wherein the upper electric connecting part is arranged on the upper part of the substrate, the lower electric connecting part is arranged on the lower part of the substrate, the upper electric connecting part comprises an upper cavity arranged on one side of the substrate, the upper polar plate is arranged in the upper cavity, the upper fixing layer is arranged on one side of the upper polar plate, the upper coating layer is arranged on one side of the upper cavity, the lower electric connecting part comprises a lower cavity arranged on the other side of the substrate, the lower polar plate is arranged in the lower cavity, the lower fixing layer is arranged on one side of the lower polar plate, the lower polar plate is arranged on the lower coating layer on one side of the lower cavity, the upper polar plate is provided with two upper connecting parts arranged at intervals, each upper connecting part penetrates out from one side wall of the upper cavity, each upper connecting part and each lower connecting part are arranged on one side wall of the lower cavity, the upper connecting part and each lower connecting part are arranged on the upper connecting part and the lower connecting part, the upper connecting part is arranged on the upper connecting part and the lower connecting part are arranged on the upper connecting part.
2. The connection busbar of claim 1, wherein: each upper connecting portion comprises an upper mounting plate, an upper mounting hole formed in the upper mounting plate, and an upper clamping nut mounted in the upper mounting hole, and each lower connecting portion comprises a lower mounting plate, a lower mounting hole formed in the lower mounting plate, and a lower clamping nut mounted in the lower mounting hole.
3. The connection busbar of claim 1, wherein: the upper connecting part and the extending end of the lower connecting part are positioned on the same side of the connecting busbar, and the tail ends of the upper connecting part and the lower connecting part are respectively provided with a bending which faces the same side of the substrate and bends by 90 degrees.
4. The connection busbar of claim 1, wherein: the width of the substrate is 15mm.
5. The connection busbar of claim 1, wherein: the substrate, the upper cladding layer and the lower cladding layer are respectively made of insulating materials, and the upper polar plate and the lower polar plate are copper plates.
6. The process for manufacturing the connection busbar according to any one of claims 1 to 5, comprising the steps of:
A. Selecting materials, selecting proper mother boards to ensure the installation effect, selecting two copper boards as an upper polar plate mother board and a lower polar plate mother board respectively, selecting three insulating boards as a substrate mother board respectively, an upper cladding mother board and a lower cladding mother board, and selecting two prepreg mother boards as an upper fixed layer mother board and a lower fixed layer mother board respectively;
B. Blanking, namely, processing the upper polar plate motherboard through a plurality of punches to form at least two upper polar plates which are distributed at intervals on the upper polar plate motherboard, processing the lower polar plate motherboard through a plurality of punches to form at least two lower polar plates which are distributed at intervals on the lower polar plate motherboard, forming two upper connecting parts which are distributed at intervals on one side of each upper polar plate through a plurality of punches, forming two lower connecting parts which are distributed at intervals on one side of each lower polar plate through a plurality of punches, forming at least two upper cladding layers which are distributed at intervals on the upper cladding layer motherboard through a plurality of punches, forming at least two lower cladding layers which are distributed at intervals on the lower cladding layer motherboard through a plurality of punches, forming at least two upper die cavities which are distributed at intervals on one side of each substrate through a plurality of punches, forming at least two lower mounting notches which are distributed at intervals on the other side of each upper die cavity, forming at least two lower mounting notches which are distributed at intervals on the other side of each substrate through a plurality of punches, and forming two lower mounting notches which are distributed at intervals on the side of each lower die cavity through a plurality of dies, and forming two lower mounting notches which are distributed at intervals on the side of each die cavity;
C. pre-processing, namely punching the upper polar plate motherboard and the lower polar plate motherboard to enable the two upper connecting parts and the two lower connecting parts to be respectively bent towards the same side of the substrate motherboard;
D. surface treatment, namely performing nickel plating treatment on the surfaces of the upper polar plate mother plate and the lower polar plate mother plate;
E. Assembling, namely milling the upper polar plate mother plate into a plurality of upper polar plates, milling the lower polar plate mother plate into a plurality of lower polar plates, filling the upper polar plates into the upper die cavity on the substrate mother plate, filling the lower polar plates into the lower die cavity on the substrate mother plate, stacking the upper cladding layer mother plate, the upper fixed layer mother plate, the substrate mother plate, the lower fixed layer mother plate and the lower cladding layer mother plate in a preset template in sequence, coating glue between adjacent mother plates, and pressing all mother plates into a whole through high-temperature hot pressing;
F. Dividing the whole body into at least two connecting busbar with preset number;
G. And cleaning, namely cleaning stains on the surface of the connecting busbar by using flexible cloth or a rolling brush to manufacture the connecting busbar.
7. The process for manufacturing the connection busbar of claim 6, wherein: the template comprises an upper cover body, a lower cover body and at least three fixing pieces, wherein the lower cover body is arranged at intervals with the upper cover body, the fixing pieces are arranged between the upper cover body and the lower cover body, the upper cover body is provided with an upper cladding layer motherboard, the upper fixing layer motherboard is provided with an upper polar plate, the base plate motherboard is provided with a lower polar plate, the lower fixing layer motherboard, the lower cladding layer motherboard and the lower cover body are respectively provided with a positioning hole, and the fixing pieces sequentially penetrate through the positioning holes to clamp each motherboard between the upper cover body and the lower cover body.
8. The process for manufacturing a connection busbar of claim 7, wherein: the upper cladding layer motherboard, the upper fixed layer motherboard, the lower cladding layer motherboard, and the upper cover body are provided with notches corresponding to the upper connecting part and the lower connecting part, so that the upper connecting part and the lower connecting part can pass through conveniently.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111473809.2A CN114188780B (en) | 2021-11-30 | 2021-11-30 | Connection busbar and processing technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111473809.2A CN114188780B (en) | 2021-11-30 | 2021-11-30 | Connection busbar and processing technology |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114188780A CN114188780A (en) | 2022-03-15 |
| CN114188780B true CN114188780B (en) | 2024-06-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111473809.2A Active CN114188780B (en) | 2021-11-30 | 2021-11-30 | Connection busbar and processing technology |
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| Country | Link |
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| CN (1) | CN114188780B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN210779356U (en) * | 2019-11-27 | 2020-06-16 | 青岛中加特电气股份有限公司 | Combined laminated busbar and frequency conversion all-in-one machine using same |
| CN112490800A (en) * | 2020-11-19 | 2021-03-12 | 南京鲁贝斯控制技术有限公司 | One-way frequency conversion module for frequency conversion control device |
-
2021
- 2021-11-30 CN CN202111473809.2A patent/CN114188780B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN210779356U (en) * | 2019-11-27 | 2020-06-16 | 青岛中加特电气股份有限公司 | Combined laminated busbar and frequency conversion all-in-one machine using same |
| CN112490800A (en) * | 2020-11-19 | 2021-03-12 | 南京鲁贝斯控制技术有限公司 | One-way frequency conversion module for frequency conversion control device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114188780A (en) | 2022-03-15 |
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