CN114181638A - High-permeability optical UV curing adhesive tape - Google Patents
High-permeability optical UV curing adhesive tape Download PDFInfo
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- CN114181638A CN114181638A CN202111399930.5A CN202111399930A CN114181638A CN 114181638 A CN114181638 A CN 114181638A CN 202111399930 A CN202111399930 A CN 202111399930A CN 114181638 A CN114181638 A CN 114181638A
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- adhesive tape
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- optical
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- 239000002390 adhesive tape Substances 0.000 title claims abstract description 31
- 230000003287 optical effect Effects 0.000 title claims abstract description 16
- 238000003848 UV Light-Curing Methods 0.000 title claims description 9
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 239000002131 composite material Substances 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims abstract description 4
- 239000010410 layer Substances 0.000 claims description 63
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 27
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 18
- 239000000853 adhesive Substances 0.000 claims description 15
- 230000001070 adhesive effect Effects 0.000 claims description 15
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 10
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 claims description 9
- 238000005452 bending Methods 0.000 claims description 9
- 238000005260 corrosion Methods 0.000 claims description 9
- 239000003431 cross linking reagent Substances 0.000 claims description 9
- ZTNJGMFHJYGMDR-UHFFFAOYSA-N 1,2-diisocyanatoethane Chemical compound O=C=NCCN=C=O ZTNJGMFHJYGMDR-UHFFFAOYSA-N 0.000 claims description 8
- 239000000084 colloidal system Substances 0.000 claims description 8
- 239000011241 protective layer Substances 0.000 claims description 7
- 238000002834 transmittance Methods 0.000 claims description 6
- 230000007797 corrosion Effects 0.000 claims description 5
- 239000002313 adhesive film Substances 0.000 claims description 4
- 238000001723 curing Methods 0.000 claims description 4
- 239000004698 Polyethylene Substances 0.000 claims description 3
- 230000003712 anti-aging effect Effects 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000010790 dilution Methods 0.000 claims description 3
- 239000012895 dilution Substances 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 229920006267 polyester film Polymers 0.000 claims description 3
- -1 polyethylene Polymers 0.000 claims description 3
- 229920000573 polyethylene Polymers 0.000 claims description 3
- 229920000098 polyolefin Polymers 0.000 claims description 3
- 230000005855 radiation Effects 0.000 claims description 3
- 230000003014 reinforcing effect Effects 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- 230000035515 penetration Effects 0.000 claims description 2
- 239000000428 dust Substances 0.000 abstract description 5
- 238000004026 adhesive bonding Methods 0.000 abstract description 4
- 238000010030 laminating Methods 0.000 description 7
- 239000012528 membrane Substances 0.000 description 4
- 238000003860 storage Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000008595 infiltration Effects 0.000 description 2
- 238000001764 infiltration Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005056 compaction Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000006303 photolysis reaction Methods 0.000 description 1
- 230000015843 photosynthesis, light reaction Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J135/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least another carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J135/02—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/006—Presence of polyolefin in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/04—Presence of homo or copolymers of ethene
- C09J2423/046—Presence of homo or copolymers of ethene in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Abstract
The invention relates to the field of adhesive tapes, and discloses a high-permeability optical UV (ultraviolet) curing adhesive tape. The method comprises the following steps: the substrate layer bears the enhancement composite bed in the substrate layer upper surface to and locate the substrate layer lower surface and the gluing portion of adherend adhesion. The adhesive tape has the functions of positioning, correcting the attaching position, firmly adhering after attaching, preventing edge breakage or flying and reducing dust.
Description
Technical Field
The invention relates to the field of adhesive tapes, in particular to a high-permeability optical UV (ultraviolet) curing adhesive tape.
Background
The pressure-sensitive adhesive capable of ultraviolet photolysis is also called UV debonding adhesive, and refers to a type of pressure-sensitive adhesive which can be excited by UV light to cause the reduction of bonding force. The UV debonding agent has the characteristics of convenience in construction, high initial adhesive force and easiness in removal after UV debonding. The UV debonding adhesive can be used for semiconductor processing as a temporary fixing and protecting adhesive tape for wafer dicing. It can also be used for temporary protection of the facade elements during the manufacturing process. It can also be applied to the manufacture of flexible circuit boards into transport tapes. The good adhesive force of the adhesive tape can ensure that the flexible circuit board can not fall off in the process of nickel melting and gold melting, and the flexible circuit board is easy to remove after debonding, so that the deformation of the flexible circuit board caused by overlarge adhesive force when the protective adhesive tape is removed is prevented.
When the existing adhesive tape is adhered to an adherend, the adhering position of the existing adhesive tape cannot be found accurately, the adhesive force is high during initial adhesion, the adhesive tape cannot be easily peeled off or the position cannot be corrected, a pressure-sensitive adhesive body is remained after peeling, so that the trace needs to be eliminated during re-adhesion, the operation is complex, and meanwhile, when the adhesive tape is not firmly adhered, a workpiece is easy to collapse or fly away in the processing process, and more dust is adhered.
Disclosure of Invention
In order to solve the technical problems, the invention provides the high-permeability optical UV curing adhesive tape which has the functions of positioning, correcting and adhering positions, firmly adhering after adhering, being not easy to break edges or scatter and reducing dust absorption.
In order to achieve the purpose, the technical scheme of the invention is as follows:
a high-transmittance optical UV-curable adhesive tape comprising:
the adhesive part is arranged on the lower surface of the substrate layer and is adhered to an adherend.
As a preferable scheme of the present invention, the reinforced composite layer includes a protective layer, a bending-resistant layer and an anti-corrosion layer which are sequentially arranged from top to bottom and bonded to each other.
As a preferred scheme of the invention, the protective layer is made of an anti-aging PET aluminized reflecting film material; the bending-resistant layer is made of a high-strength polyethylene net material used for connecting the layers; the corrosion-resistant layer is made of radiation cross-linked polyolefin materials which are used for generating larger internal stress and are integrally shrunk.
In a preferred embodiment of the present invention, the substrate layer is made of a polyester film.
As a preferred scheme of the present invention, the adhesive part is an adhesive storage film that is uniformly disposed on the substrate layer at intervals and includes an inner cavity, the adhesive storage film is provided with micropores communicated with the inner cavity, a connection layer disposed on the adhesive storage film, permeation holes disposed on the connection layer and corresponding to the micropores, and a pressure sensitive adhesive layer applied to the bottom of the connection layer.
In a preferred embodiment of the present invention, the connecting layer is provided with a projection portion to be fitted to an edge of an adherend.
In a preferred embodiment of the present invention, the pressure sensitive adhesive layer is made of ethyl acetate, toluene, trimethylolpropane triacrylate oligomer, 1173 photoinitiator and the dimethylene diisocyanate crosslinking agent.
As a preferred embodiment of the present invention, the preparation method is as follows:
(1) adding the trimethylolpropane triacrylate oligomer, the 1173 photoinitiator and the dimethylene diisocyanate crosslinking agent into ethyl acetate containing antistatic particles, adding the toluene for dilution, and mixing and stirring uniformly to obtain a pressure-sensitive colloid;
(2) and coating the pressure-sensitive colloid on the substrate layer, putting the substrate layer in a constant-temperature oven at 80 ℃ for 2min, taking out the substrate layer, attaching a release film, and putting the substrate layer in a constant-temperature oven at 40 ℃ for curing for 2d to obtain the adhesive tape.
As a preferable scheme of the invention, the composition comprises the following components in parts by weight: 95-105 parts of ethyl acetate, 15-25 parts of trimethylolpropane triacrylate oligomer, 2-6 parts of dimethylene diisocyanate crosslinking agent and 4-8 parts of 1173 photoinitiator.
In conclusion, the invention has the following beneficial effects: (1) through the setting of reinforcing the composite bed, make the multilayer structure of sticky tape connect inseparabler, breaking phenomenon takes place when having reduced the bending, and corrosion resisting property is strong, and the sealing performance of bonding mouth is good. (2) Through the setting of gluing portion, make the sticky tape before the laminating accurate alignment position, if the position is incorrect, when peeling off, also can not leave the cull on making the adherend because of adhesion strength is big, and the firmness after the laminating is high. (3) By adding the antistatic agent, no static electricity is generated during stripping or processing, dust adsorption is reduced, and the surface is kept clean. (4) The components added according to the mass fraction can always keep the stability of the performance after long-time UV light energy irradiation under the condition of high adhesive force, and have the advantages of reduced adhesive force, easy stripping and no pollution.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic view of the overall structure of the present invention.
The corresponding part names indicated by the numbers and letters in the drawings:
1. a substrate layer; 2. an anti-corrosion layer; 3. a bending-resistant layer; 4. a protective layer; 5. storing an adhesive film; 6. micropores; 7. a pressure sensitive adhesive layer; 8. a penetration hole; 9. an inner cavity; 10. a connecting layer; 11. a raised portion.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Examples
As shown in fig. 1, the present invention is a high-transmittance optical UV curing adhesive tape, comprising: the substrate layer 1 bears the reinforcing composite layer on 1 upper surface of substrate layer to and locate 1 lower surface of substrate layer and the gluing portion of adherend adhesion.
Wherein, the reinforced composite layer comprises a protective layer 4, a bending resistant layer 3 and an anti-corrosion layer 2 which are arranged from top to bottom in sequence and are bonded with each other. The protective layer 4 is made of an anti-aging PET aluminized reflecting film material; the bending-resistant layer 3 is made of a high-strength polyethylene net material for connecting the layers; the corrosion-resistant layer 2 is made of radiation cross-linked polyolefin material which is used for generating larger internal stress and is shrunk integrally; the substrate layer 1 is made of a polyester film material. Through the arrangement, the multilayer structure of the adhesive tape is connected more tightly, the phenomenon of fracture during bending is reduced, the corrosion resistance is high, and the sealing performance of the bonding port is good.
Above-mentioned gluing portion evenly locates on the substrate layer 1 and includes the glued membrane 5 of depositing of inner chamber 9 for the interval, deposit be equipped with on the glued membrane 5 with the micropore 6 of inner chamber 9 intercommunication, locate the articulamentum 10 on depositing glued membrane 5, set up on the articulamentum 10 and with the corresponding infiltration hole 8 of micropore 6, paint in the pressure sensitive adhesive layer 7 of articulamentum 10 bottom, be equipped with on the articulamentum 10 and inlay the bellying 11 of locating the adherend edge.
When the laminating, with the edge cooperation of bellying 11 and adherend in order to align laminating position, at this moment, only need laminate pressure sensitive adhesive layer 7 gently on the adherend, if the position is incorrect, tear the sticky tape, and can not leave the cull on the adherend, align the laminating again, if the position is correct, the compaction sticky tape, the colloid that makes in the deposit glued membrane 5 enters into pressure sensitive adhesive layer 7 from micropore 6 in and through infiltration hole 8 on, the extrusion makes its even distribution of colloid, the adhesion effect of sticky tape has been improved.
Through above-mentioned setting, make sticky tape can be accurate alignment position before the laminating, if the position is incorrect, when peeling off, also can not leave the cull on making the adherend because of adhesion strength is big, and the firmness after the laminating is high.
The pressure-sensitive adhesive layer 7 is prepared from ethyl acetate, toluene, trimethylolpropane triacrylate oligomer, 1173 photoinitiator and the dimethylene diisocyanate crosslinking agent, and the preparation method comprises the following steps:
(1) adding trimethylolpropane triacrylate oligomer, 1173 photoinitiator and the dimethylene diisocyanate crosslinking agent into ethyl acetate containing antistatic particles, adding toluene for dilution, and mixing and stirring uniformly to obtain pressure-sensitive colloid;
(2) and coating the pressure-sensitive colloid on the substrate layer 1, putting the substrate layer in a constant-temperature oven at 80 ℃ for 2min, taking out the substrate layer, sticking a release film, and putting the substrate layer in a constant-temperature oven at 40 ℃ for curing for 2d to obtain the adhesive tape.
The adhesive tape comprises the following components in parts by weight: 95-105 parts of ethyl acetate, 15-25 parts of trimethylolpropane triacrylate oligomer, 2-6 parts of dimethylene diisocyanate crosslinking agent and 4-8 parts of 1173 photoinitiator.
Through the arrangement, no static electricity is generated during stripping or processing, dust adsorption is reduced, the surface is kept clean, and meanwhile, under the condition of high adhesion, performance stability is always kept after long-time UV light energy irradiation, the adhesion is reduced, stripping is easy, and pollution is avoided.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (9)
1. A high-transparency optical UV-curable adhesive tape, comprising:
the adhesive part is arranged on the lower surface of the substrate layer and is adhered to an adherend.
2. The high-permeability optical UV curing adhesive tape according to claim 1, wherein the reinforcing composite layer comprises a protective layer, a bending-resistant layer and an anti-corrosion layer which are sequentially arranged from top to bottom and are bonded to each other.
3. The high-permeability optical UV curing adhesive tape according to claim 2, wherein the protective layer is made of an anti-aging PET aluminized reflective film material; the bending-resistant layer is made of a high-strength polyethylene net material used for connecting the layers; the corrosion-resistant layer is made of radiation cross-linked polyolefin materials which are used for generating larger internal stress and are integrally shrunk.
4. The high-transmittance optical UV curing adhesive tape according to claim 1, wherein the substrate layer is made of a polyester film.
5. The high-permeability optical UV curing adhesive tape according to claim 1, wherein the adhesive part is an adhesive film disposed on the substrate layer at regular intervals and including an inner cavity, the adhesive film is provided with a micropore communicating with the inner cavity, a connecting layer disposed on the adhesive film, a penetration hole disposed on the connecting layer and corresponding to the micropore, and a pressure sensitive adhesive layer coated on the bottom of the connecting layer.
6. The high-transmittance optical UV-curable adhesive tape according to claim 5, wherein the connecting layer is provided with a projection embedded in an edge of an adherend.
7. The high-transmittance optical UV-curable adhesive tape according to claim 5, wherein the pressure-sensitive adhesive layer is made of ethyl acetate, toluene, trimethylolpropane triacrylate oligomer, 1173 photoinitiator and a bismethylenediisocyanate crosslinking agent.
8. The high-transmittance optical UV-curable adhesive tape according to claim 7, characterized in that it is prepared by the following method:
(1) adding the trimethylolpropane triacrylate oligomer, the 1173 photoinitiator and the dimethylene diisocyanate crosslinking agent into ethyl acetate containing antistatic particles, adding the toluene for dilution, and mixing and stirring uniformly to obtain a pressure-sensitive colloid;
(2) and coating the pressure-sensitive colloid on the substrate layer, putting the substrate layer in a constant-temperature oven at 80 ℃ for 2min, taking out the substrate layer, attaching a release film, and putting the substrate layer in a constant-temperature oven at 40 ℃ for curing for 2d to obtain the adhesive tape.
9. The high-permeability optical UV curing adhesive tape according to claim 8, characterized by comprising the following components in parts by weight: 95-105 parts of ethyl acetate, 15-25 parts of trimethylolpropane triacrylate oligomer, 2-6 parts of dimethylene diisocyanate crosslinking agent and 4-8 parts of 1173 photoinitiator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111399930.5A CN114181638A (en) | 2021-11-24 | 2021-11-24 | High-permeability optical UV curing adhesive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111399930.5A CN114181638A (en) | 2021-11-24 | 2021-11-24 | High-permeability optical UV curing adhesive tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114181638A true CN114181638A (en) | 2022-03-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111399930.5A Pending CN114181638A (en) | 2021-11-24 | 2021-11-24 | High-permeability optical UV curing adhesive tape |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102585721A (en) * | 2011-01-14 | 2012-07-18 | 三星Led株式会社 | Adhesive film for light emitting device and method of manufacturing led package using the same |
| CN204529726U (en) * | 2015-02-06 | 2015-08-05 | 宁波亿隆包装材料有限公司 | A kind of high viscosity adhesive tape |
| CN109251696A (en) * | 2018-07-23 | 2019-01-22 | 苏州艾克森电子有限公司 | A kind of novel high reflection blocks water adhesive tape and preparation method thereof |
| CN212669600U (en) * | 2020-06-28 | 2021-03-09 | 惠州市新欣材料科技有限公司 | Sub-black single-side shading adhesive tape |
-
2021
- 2021-11-24 CN CN202111399930.5A patent/CN114181638A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102585721A (en) * | 2011-01-14 | 2012-07-18 | 三星Led株式会社 | Adhesive film for light emitting device and method of manufacturing led package using the same |
| CN204529726U (en) * | 2015-02-06 | 2015-08-05 | 宁波亿隆包装材料有限公司 | A kind of high viscosity adhesive tape |
| CN109251696A (en) * | 2018-07-23 | 2019-01-22 | 苏州艾克森电子有限公司 | A kind of novel high reflection blocks water adhesive tape and preparation method thereof |
| CN212669600U (en) * | 2020-06-28 | 2021-03-09 | 惠州市新欣材料科技有限公司 | Sub-black single-side shading adhesive tape |
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Application publication date: 20220315 |