CN114173483B - High-performance copper electroplating process - Google Patents
High-performance copper electroplating process Download PDFInfo
- Publication number
- CN114173483B CN114173483B CN202111485625.8A CN202111485625A CN114173483B CN 114173483 B CN114173483 B CN 114173483B CN 202111485625 A CN202111485625 A CN 202111485625A CN 114173483 B CN114173483 B CN 114173483B
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- Prior art keywords
- circuit board
- plate
- electroplating
- swing
- clamp
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- 238000009713 electroplating Methods 0.000 title claims abstract description 54
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 40
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 40
- 239000010949 copper Substances 0.000 title claims abstract description 40
- 238000000034 method Methods 0.000 title claims abstract description 26
- 230000008569 process Effects 0.000 title claims abstract description 24
- 239000007788 liquid Substances 0.000 claims abstract description 64
- 238000003860 storage Methods 0.000 claims abstract description 35
- 230000003213 activating effect Effects 0.000 claims abstract description 16
- 238000007747 plating Methods 0.000 claims abstract description 14
- 238000005553 drilling Methods 0.000 claims abstract description 13
- 230000008021 deposition Effects 0.000 claims abstract description 9
- 238000012545 processing Methods 0.000 claims abstract description 6
- 238000012805 post-processing Methods 0.000 claims abstract description 4
- 238000003825 pressing Methods 0.000 claims description 40
- 230000007246 mechanism Effects 0.000 claims description 29
- 238000007789 sealing Methods 0.000 claims description 27
- 238000002955 isolation Methods 0.000 claims description 23
- 238000002791 soaking Methods 0.000 claims description 13
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 12
- 239000003795 chemical substances by application Substances 0.000 claims description 12
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 9
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 9
- 238000005260 corrosion Methods 0.000 claims description 9
- 230000007797 corrosion Effects 0.000 claims description 9
- 238000001556 precipitation Methods 0.000 claims description 9
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 6
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 6
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 6
- 238000010023 transfer printing Methods 0.000 claims description 6
- 239000000080 wetting agent Substances 0.000 claims description 6
- 239000002390 adhesive tape Substances 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 3
- 230000035484 reaction time Effects 0.000 claims description 3
- 238000012546 transfer Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 11
- 238000004381 surface treatment Methods 0.000 abstract description 2
- 230000009471 action Effects 0.000 description 9
- 238000007599 discharging Methods 0.000 description 5
- 239000012535 impurity Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 2
- 238000007665 sagging Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention relates to the technical field of electroplating processing, in particular to a high-performance copper electroplating process, which comprises the following steps of: s1, drilling a circuit board; s2, presoaking a circuit board; s3, activating and accelerating a circuit board; s4, copper deposition is carried out on the circuit board; s5, electroplating a circuit board; s6, post-processing of the circuit board; the circuit board copper plating process is completed by adopting a presoaking swing clamp and a liquid storage barrel in a matching way. According to the invention, the presoaking swing clamp and the liquid storage barrel are matched to finish the presoaking, activating, accelerating and copper deposition treatment on the circuit board in sequence, so that the surface treatment effect of the circuit board is improved, the presoaking swing clamp can clamp the circuit board and drive the circuit board to circularly swing when the circuit board is treated, the treatment effect of the circuit board is improved, the liquid storage barrel can divide the treatment liquid into two layers, sundries generated by the circuit board can be accumulated on the lower layer of the liquid storage barrel, the sundries are separated from the treatment liquid on the upper layer, and the treatment effect of the circuit board is improved.
Description
Technical Field
The invention relates to the technical field of electroplating processing, in particular to a high-performance copper electroplating process.
Background
Along with the increase of portability and application functions of electronic products, the appearance of various circuit boards is smaller and smaller, and the layout of devices on the circuit boards is denser and denser, so that the design requirements on via circuits on the circuit boards are also improved; copper plating is required to be carried out on the through holes on the circuit board so that the bonding pads on the circuit board conduct electricity; the circuit board is required to be pretreated before copper plating treatment, and copper deposition and electroplating are carried out after pretreatment is finished.
The existing circuit board is generally placed in a solution for soaking when being pretreated, so that the circuit board can react with the solution to perform corresponding pretreatment actions, and the circuit board cannot effectively shake when being pretreated, so that the phenomena of poor pretreatment effect and incomplete treatment exist; sundries and scraps generated during pretreatment of the circuit board can be suspended in the treatment liquid, the sundries can influence the treatment effect of the treatment liquid on the circuit board, and the treatment liquid is high in replacement frequency, so that the production cost of the circuit board is increased.
Disclosure of Invention
The technical scheme adopted for solving the technical problems is as follows: a high-performance copper electroplating process specifically comprises the following steps:
s1, drilling a circuit board: drilling the designed position on the circuit board through a drilling machine after the circuit board completes thermal transfer printing plate making, and cleaning the drilling hole;
s2, presoaking a circuit board: the circuit board with the holes drilled is inserted into a presoaking swing clamp, three liquid storage barrels are taken, presoaking liquid, activating liquid and accelerating liquid are respectively added into the liquid storage barrels, and the presoaking swing clamp is placed into the liquid storage barrels of the presoaking liquid, so that sundries on the surface of the circuit board and the holes drilled can be cleaned and fall;
s3, activating and accelerating a circuit board: placing the presoaked swing clamp into a liquid storage barrel of an activating liquid, so that the circuit board can be subjected to activating treatment; then placing the activated pre-soaking swing clamp in a liquid storage barrel of accelerating liquid for accelerating treatment;
s4, copper deposition of the circuit board: after the circuit board is activated and accelerated, the circuit board is taken down from the presoaked swing clamp, a proper amount of formaldehyde is added into a container for storing copper precipitation liquid, copper precipitation treatment is carried out on the circuit board, and the copper precipitation reaction time is 10-15 minutes;
s5, electroplating a circuit board: placing the circuit board after copper deposition into an electroplating box for electroplating treatment;
s6, post-processing of the circuit board: after the electroplating of the circuit board is finished, carefully aligning each bonding pad on the top layer and the bottom layer of the printed circuit board graph with a corresponding through hole, fixing the bonding pads by using an adhesive tape, and transferring; tearing off the transfer paper after the transfer printing is finished; and finally, placing the circuit board into a corrosion machine for corrosion treatment, and finishing the processing of the circuit board after the corrosion treatment is finished.
The circuit board copper plating process is completed by adopting a presoaking swing clamp and a liquid storage barrel, wherein the liquid storage barrel comprises a barrel body with a square structure, positioning grooves are symmetrically formed in the middle of the side edge of the length direction of the barrel body, an isolation mechanism is arranged at the lower end of the barrel body, and a discharge port is formed in the side wall of the lower end of the barrel body and below the isolation mechanism; the barrel body is divided into an upper layer and a lower layer by the isolating mechanism.
The presoaking swing clamp comprises two positioning inserting blocks, the two positioning inserting blocks are respectively inserted in a positioning groove, the opposite side faces of the two positioning inserting blocks are respectively provided with rotating shafts, one rotating shaft is connected with a repeated motor, each rotating shaft is rotationally provided with a connecting support plate, the middle part of each connecting support plate is arranged on the side face of each positioning inserting block, clamping mechanisms are uniformly distributed between the two connecting support plates and along the length direction of each connecting support plate, swing shafts are respectively arranged at the front end and the rear end of each clamping mechanism, the swing shafts at the middle part are fixedly connected to the rotating shafts, the rest swing shafts are rotationally connected to the side faces of the connecting support plates, and the swing shafts are connected through belts.
Preferably, the electroplating solution in the electroplating tank comprises copper sulfate, sulfuric acid, chloride ions, a leveling agent, a gloss agent and a wetting agent, and the components are all provided with an automatic adder, so that the electroplating solution is automatically added in the electroplating process of the circuit board.
Preferably, the content of copper sulfate in the electroplating solution is 70-150g/L, the content of sulfuric acid in the electroplating solution is 50-200g/L, the content of chloride ions in the electroplating solution is 30-70mg/L, the content of leveling agent in the electroplating solution is 20-30ml/L, the content of gloss agent in the electroplating solution is 0.5-1.5ml/L, and the content of wetting agent in the electroplating solution is 10-20ml/L.
Preferably, the chloride ions are formulated with 0.135ml/L concentrated hydrochloric acid at 37% W/W HCL.
Preferably, the side edges of the barrel body in the length direction are provided with pressing grooves of T-shaped structures, the upper ends of the pressing grooves are vertical sections, and the upper ends of the vertical sections of the pressing grooves are communicated with the positioning grooves; the isolating mechanism comprises an isolating plate arranged inside the barrel body, square through holes are uniformly formed in the isolating plate along the length direction of the isolating plate, a sealing plate is arranged in each square through hole on the isolating plate through a rotating connecting rod, and two ends of the rotating connecting rod extend into the horizontal section of the pressing groove.
Preferably, the upper side of the sealing plate is gradually inclined from left to right, the part of the upper side of the isolating plate, which is positioned on the right side of each sealing plate, is an inclined surface structure which gradually inclines downwards from right to left, and the structure ensures that sundries generated by circuit board processing cannot be accumulated on the upper side of the isolating plate.
Preferably, the indent is provided with the clamp plate of T type structure, and the vertical section of clamp plate extends to the constant head tank in, and the horizontal segment of clamp plate passes through reset spring to be installed at the horizontal segment upper side wall of indent, the one end that the rotation connecting rod is located the indent all is provided with pacifies the flat board, pacifies the inclination of flat board and the inclination of closing plate the same, and the distance of clamp plate upper side to the constant head tank lower side wall equals the distance of clamp plate downside to closing plate upper side.
Preferably, a triangular notch is formed in the lower side wall of the positioning groove and located on one side of the inner wall of the barrel body, a triangular clamping block matched with the triangular notch is arranged on the positioning inserting block, a telescopic clamping block is arranged on the side wall of the positioning groove, and the telescopic clamping block is clamped on the upper side face of the positioning inserting block.
Preferably, the clamping mechanism comprises a clamping frame with a U-shaped structure, the opposite side surfaces of the vertical section of the clamping frame are connected to the swinging shaft, the opposite sides of the vertical section of the clamping frame are respectively provided with an upright plate, the bottoms of the upright plates are in sliding fit with the horizontal section of the clamping frame, the opposite side surfaces of the upright plates are respectively provided with a locking plate through a spring rod, and the upright plates are arranged on the clamping frame through an adjusting component; the adjusting component is used for adjusting the distance between the vertical plate and the clamping frame.
Preferably, the adjusting component comprises an adjusting bolt which is arranged on the vertical section of the clamping frame in the middle in a threaded fit manner, one end of the adjusting bolt is rotationally connected to the vertical plate, one side of the middle vertical plate far away from the middle of the clamping frame is fixedly connected with a pushing rod, two ends of the pushing rod are abutted against the side surfaces of the remaining vertical plates, and the remaining vertical plates are connected with the clamping frame through retraction elastic columns; the opposite side surfaces of the locking plate are provided with stepped clamping grooves.
The invention has the beneficial effects that:
1. according to the invention, the presoaking swing clamp and the liquid storage barrel are matched to finish the presoaking, activating and accelerating treatment of the circuit board in sequence, so that the surface treatment effect of the circuit board is improved, the presoaking swing clamp can clamp the circuit board and drive the circuit board to circularly swing when the circuit board is treated, the treatment effect of the circuit board is improved, the liquid storage barrel can divide the treatment liquid into two layers, sundries generated by the circuit board can be accumulated on the lower layer of the liquid storage barrel, the sundries are separated from the upper layer of the treatment liquid, and the treatment effect of the circuit board is improved.
2. The lower side wall of the barrel body is gradually and downwards inclined towards the discharge opening, and impurities accumulated at the bottom of the barrel body can slide to the position of the discharge opening, and the plugs of the discharge opening are pulled out manually, so that the impurities of the discharge opening can be discharged.
3. According to the invention, the adjusting assembly can synchronously move through the rotation of the adjusting bolts and adjust the upright plates on the same side, the upright plates cannot be separated from the pushing rod when the upright plates swing, and the stepped clamping grooves on the locking plates can lock circuit boards with different thicknesses.
4. The triangular notch is matched with the triangular clamping block to position the front and rear positions of the positioning inserting block, the telescopic clamping block is matched with the positioning groove to limit the upper and lower positions of the positioning inserting block, so that the positioning inserting block can be locked in all directions, at the moment, the upper end of the pressing plate can generate upward jacking force on the positioning inserting block under the action of the reset spring, the stability of the positioning inserting block is further improved, and the circuit board can swing stably.
Drawings
The invention will be further described with reference to the drawings and examples.
FIG. 1 is a process flow diagram of the present invention;
FIG. 2 is a schematic view of a first structure between a prepreg swing clamp and a liquid storage barrel according to the present invention;
FIG. 3 is a second schematic structural view between the prepreg swing clamp and the liquid storage barrel of the present invention;
FIG. 4 is a schematic view of a third configuration between the prepreg swing clamp and the liquid storage barrel of the present invention;
FIG. 5 is a cross-sectional view taken along line A-A of FIG. 4;
FIG. 6 is a cross-sectional view taken along B-B in FIG. 4;
FIG. 7 is a cross-sectional view of the present invention between the tub and the locating insert;
fig. 8 is a schematic structural view of the connecting support plate, the clamping mechanism and the swinging shaft.
In the figure: 1. a tub body; 11. a positioning groove; 12. a discharge port; 13. pressing a groove; 2. an isolation mechanism; 21. a partition plate; 22. rotating the connecting rod; 23. a closing plate; 24. a pressing plate; 25. a return spring; 26. a pacifying plate; 3. positioning the insert block; 31. triangular clamping blocks; 32. a telescopic clamping block; 4. a rotating shaft; 41. connecting a support plate; 5. a clamping mechanism; 51. a clamping frame; 52. erecting a plate; 53. a spring rod; 54. a locking plate; 55. an adjustment assembly; 56. an adjusting bolt; 57. a push rod; 58. retracting the spring column; 6. and a swinging shaft.
Detailed Description
Embodiments of the present invention are described in detail below. The following examples are illustrative only and are not to be construed as limiting the invention. The examples are not to be construed as limiting the specific techniques or conditions described in the literature in this field or as per the specifications of the product. The reagents or apparatus used were conventional products commercially available without the manufacturer's attention.
As shown in FIG. 1, the invention provides a high-performance copper electroplating process, which specifically comprises the following steps:
s1, drilling a circuit board: drilling the designed position on the circuit board through a drilling machine after the circuit board completes thermal transfer printing plate making, and cleaning the drilling hole;
s2, presoaking a circuit board: the circuit board with the holes drilled is inserted into a pre-soaking swing clamp, three liquid storage barrels are taken, pre-soaking liquid, activating liquid and accelerating liquid are respectively added into the liquid storage barrels, the pre-soaking swing clamp is placed into the liquid storage barrels of the pre-soaking liquid, sundries on the surface of the circuit board and the holes drilled can be cleaned and fall off, and the pre-soaking swing clamp can circularly swing in the liquid storage barrels, so that the treatment effect of the circuit board clamped on the pre-soaking swing clamp is improved;
s3, activating and accelerating a circuit board: placing the presoaked swing clamp into a liquid storage barrel of an activating liquid, so that the circuit board can be subjected to activating treatment; then placing the activated pre-soaking swing clamp in a liquid storage barrel of accelerating liquid for accelerating treatment;
s4, copper deposition of the circuit board: after the circuit board is activated and accelerated, the circuit board is taken down from the presoaked swing clamp, a proper amount of formaldehyde is added into a container for storing copper precipitation liquid, copper precipitation treatment is carried out on the circuit board, and the copper precipitation reaction time is 10-15 minutes;
s5, electroplating a circuit board: placing the circuit board after copper deposition into an electroplating box for electroplating treatment;
the electroplating solution in the electroplating box comprises copper sulfate, sulfuric acid, chloride ions, a leveling agent, a gloss agent and a wetting agent, and the components are all provided with automatic adders, so that the electroplating solution is automatically added in the electroplating process of the circuit board;
the content of copper sulfate in the electroplating solution is 70-150g/L, the content of sulfuric acid in the electroplating solution is 50-200g/L, the content of chloride ions in the electroplating solution is 30-70mg/L, the content of leveling agent in the electroplating solution is 20-30ml/L, the content of gloss agent in the electroplating solution is 0.5-1.5ml/L, and the content of wetting agent in the electroplating solution is 10-20ml/L;
the chloride ions are prepared by adopting concentrated hydrochloric acid with concentration of 0.135ml/L and HCL with concentration of 37% W/W;
s6, post-processing of the circuit board: after the electroplating of the circuit board is finished, carefully aligning each bonding pad on the top layer and the bottom layer of the printed circuit board graph with a corresponding through hole, fixing the bonding pads by using an adhesive tape, and transferring; tearing off the transfer paper after the transfer printing is finished; and finally, placing the circuit board into a corrosion machine for corrosion treatment, and finishing the processing of the circuit board after the corrosion treatment is finished.
Referring to fig. 2-4, in the copper plating process of the circuit board, a pre-soaking swing clamp is adopted to be matched with a liquid storage barrel, the liquid storage barrel comprises a barrel body 1 with a square structure, positioning grooves 11 are symmetrically formed in the middle of the side edges of the length direction of the barrel body 1, an isolation mechanism 2 is arranged at the lower end of the barrel body 1, a discharging opening 12 is formed in the lower side wall of the barrel body 1 and below the isolation mechanism 2, the lower side wall of the barrel body 1 is gradually and downwards inclined towards the discharging opening 12, impurities accumulated at the bottom of the barrel body 1 can slide to the position of the discharging opening 12, and plugs of the discharging opening 12 are pulled out manually to discharge impurities of the discharging opening 12; the isolation mechanism 2 divides the barrel body 1 into an upper layer and a lower layer, so that sundries stacked on the lower end of the barrel body 1 cannot turn over into the solution on the upper layer when the presoaking swing clamp swings, and therefore more sundries cannot exist in the solution on the upper layer, and the treatment effect of the invention on the circuit board is improved.
With continued reference to fig. 2-4, the pre-soaking swing fixture includes two positioning plugs 3, two positioning plugs 3 are respectively inserted in the positioning slots 11, opposite sides of the two positioning plugs 3 are respectively provided with a rotating shaft 4, one rotating shaft 4 is connected with a repeated motor, the repeated motor is circularly rotated forward and backward, each rotating shaft 4 is rotationally provided with a connecting support plate 41, the middle part of the connecting support plate 41 is mounted on the side of the positioning plug 3, two connecting support plates 41 are uniformly distributed with clamping mechanisms 5 along the length direction of the connecting support plates, swing shafts 6 are mounted at the front end and the rear end of each clamping mechanism 5, the swing shafts 6 at the middle part are fixedly connected to the rotating shafts 4, the rest swing shafts 6 are rotationally connected to the side of the connecting support plate 41, the swing shafts 6 are connected with each other through a belt, a circuit board to be processed is firstly inserted on the clamping mechanisms 5, the positioning plugs 3 are respectively placed in the positioning slots 11, and then the rotating shaft 4 can be driven to rotate through the rotation of the repeated motor, the rotating shafts 4 are enabled to be in contact with the belt through the swing shafts 6 at the middle part, the swing shafts 5, the swing shafts 6 can be in a state of being in which the independent circuit boards can be in contact with the belt, the solution can be further inclined with the swing shafts 6, and the solution can be in a state, and the solution can be further different from the solution state.
Referring to fig. 4-5, the sides of the barrel body 1 in the length direction are provided with a pressing groove 13 with a T-shaped structure, the upper end of the pressing groove 13 is a vertical section, and the upper end of the vertical section of the pressing groove 13 is communicated with a positioning groove 11; the isolation mechanism 2 comprises an isolation plate 21 arranged in the barrel body 1, square through holes are uniformly formed in the isolation plate 21 along the length direction of the isolation plate, a sealing plate 23 is arranged in each square through hole in the isolation plate 21 through a rotary connecting rod 22, two ends of the rotary connecting rod 22 extend into the horizontal section of the pressing groove 13, and the sealing plate 23 is in a sagging state under the action of gravity under the action of no external force.
With continued reference to fig. 4-5, the upper side of the closing plates 23 is gradually inclined from left to right, and the portion of the upper side of the separating plate 21 located on the right side of each closing plate 23 is an inclined surface structure gradually inclined downward from right to left, so that impurities generated by the circuit board treatment are not accumulated on the upper side of the separating plate 21.
Referring to fig. 4 and 6, a pressing plate 24 with a T-shaped structure is disposed in the pressing groove 13, a vertical section of the pressing plate 24 extends into the positioning groove 11, a horizontal section of the pressing plate 24 is mounted on an upper side wall of the horizontal section of the pressing groove 13 through a reset spring 25, one end of the rotating connecting rod 22 located in the pressing groove 13 is provided with a pacifying plate 26, the inclination angle of the pacifying plate 26 is the same as that of the sealing plate 23, the tail end of the pacifying plate 26 is provided with an inclined plate, the inclined plate can prevent the pressing plate 24 from being clamped at the upper end of the pacifying plate 26 to enable the sealing plate 23 to be overturned, the distance from the upper side surface of the pressing plate 24 to the lower side wall of the positioning groove 11 is equal to the distance from the lower side surface of the pressing plate 24 to the upper side surface of the sealing plate 23, in an initial state, the upper end of the pressing plate 24 extends out of the pressing groove 13, when the positioning insert 3 needs to be placed on the positioning groove 11, the positioning insert 3 can downwards press the pressing plate 24, at the moment, the reset spring 25 can generate a certain upward elasticity, the pressing plate 24 downwards moves the pacifying plate 26 to enable the sealing plate 26 to conduct downwards pressing action so that the pacifying plate 26 can drive the pressing plate 23, the pressing plate 23 to drop down, the upper side surface of the sealing plate 23 is enabled to be clamped to be equal to the lower side surface of the sealing plate 23, and the sealing plate 23 can be placed on the side of the side surface of the sealing plate 23, and the sealing plate is placed on the side of the sealing plate 23, and the side of the sealing insert 23 can be placed on the side of the sealing plate, and the sealing insert 23 can be placed on the side, and the side of the sealing plate is placed on the side of the sealing plate is placed on the side, and the side of the sealing plate 23 is placed on the side.
Referring to fig. 6-7, a triangular notch is disposed on a lower side wall of the positioning groove 11 and located on one side of an inner wall of the tub body 1, a triangular clamping block 31 matched with the triangular notch is disposed on the positioning insert block 3, a telescopic clamping block 32 is disposed on a side wall of the positioning groove 11, the telescopic clamping block 32 is clamped on an upper side surface of the positioning insert block 3, the triangular notch and the triangular clamping block 31 are matched to position the front and rear positions of the positioning insert block 3, the telescopic clamping block 32 and the positioning groove 11 are matched to limit the upper and lower positions of the positioning insert block 3, so that the positioning insert block 3 can be locked in all directions, at this time, the upper end of the pressing plate 24 can generate upward pushing force on the positioning insert block 3 under the action of the return spring 25, stability of the positioning insert block 3 is further increased, an unlocking rod is disposed on the outer side of the telescopic clamping block 32, and the unlocking rod is pulled to the right side so that the telescopic clamping block 32 can end locking of the positioning insert block 3, and the positioning insert block 3 is convenient to take out.
Referring to fig. 8, the clamping mechanism 5 includes a clamping frame 51 with a U-shaped structure, opposite sides of a vertical section of the clamping frame 51 are connected to the swinging shaft 6, opposite sides of the vertical section of the clamping frame 51 are respectively provided with an upright plate 52, the bottom of the upright plate 52 is in sliding fit with a horizontal section of the clamping frame 51, opposite sides of the upright plate 52 are respectively provided with a locking plate 54 through a spring rod 53, and the upright plate 52 is mounted on the clamping frame 51 through an adjusting component 55; the adjusting component 55 is used for adjusting the distance between the vertical plates 52 and the clamping frame 51, the clamping mechanism 5 can clamp the circuit boards, the phenomenon that the circuit boards fall down when being prevented from swinging is prevented, the clamping mechanism 5 can clamp the circuit boards of different models, the distance between the vertical plates 52 can be adjusted through the adjusting component 55, so that the spring rods 53 can shrink to a certain extent when the circuit boards are inserted between the locking plates 54, and the stability of clamping the circuit boards is improved.
With continued reference to fig. 8, the adjusting assembly 55 includes an adjusting bolt 56 mounted on the vertical section of the middle clamping frame 51 in a threaded fit manner, one end of the adjusting bolt 56 is rotatably connected to the vertical plate 52, one side of the middle vertical plate 52 far away from the middle of the clamping frame 51 is fixedly connected with a push rod 57, two ends of the push rod 57 are abutted against the side surfaces of the remaining vertical plate 52, the remaining vertical plate 52 is connected with the clamping frame 51 through a retraction spring 58, and the retraction spring 58 has a retraction force; the opposite side of the locking plate 54 is provided with a stepped clamping groove, the adjusting assembly 55 can adjust the upright plate 52 on the same side to synchronously move through the rotation of the adjusting bolt 56, the upright plate 52 cannot be separated from the pushing rod 57 when the upright plate 52 swings, and the stepped clamping groove on the locking plate 54 can lock circuit boards with different thicknesses.
The steps of the presoaking swing clamp and the liquid storage barrel are as follows:
when the circuit board is subjected to pre-soaking treatment, the distance between the vertical plate 52 and the clamping frame 51 is adjusted through the adjusting component 55, then the circuit board is inserted between the locking plates 54 corresponding to the front and rear positions, at the moment, the spring rod 53 can be contracted to a certain extent, so that the clamping stability of the circuit board is improved, and the stepped clamping grooves on the locking plates 54 can lock the circuit boards with different thicknesses;
adding pre-immersion liquid into a liquid storage barrel, in an initial state, the upper end of a pressing plate 24 extends out of a pressing groove 13, after a circuit board is locked by a clamping mechanism 5, a positioning insert 3 is placed in a positioning groove 11 on the liquid storage barrel, the pressing plate 24 can be pressed downwards, at the moment, a return spring 25 can generate a certain upward elastic force, a flat plate 26 can be pressed downwards by the downward movement of the pressing plate 24 so that the flat plate 26 drives a sealing plate 23 to seal a square through hole, and as the distance from the upper side surface of the pressing plate 24 to the lower side wall of the positioning groove 11 is equal to the distance from the lower side surface of the pressing plate 24 to the upper side surface of the sealing plate 23, the sealing plate 23 is in a horizontal state after the positioning insert 3 is installed in place, a triangular notch on the positioning groove 11 is matched with a triangular clamping block 31 to position the front and back of the positioning insert 3, the telescopic clamping block 32 is matched with the positioning groove 11 to limit the upper and lower positions of the positioning insert 3, so that the positioning insert 3 can be locked in all directions, and the upper end of the pressing plate 24 can generate a lifting stability of the positioning insert 3 under the action of the return spring 25;
the rotating shaft 4 can be driven to rotate through the rotation of the repeated motor, the clamping mechanism 5 can circularly swing under the linkage action of the swinging shaft 6 in the middle and the belt, so that the circuit board is contacted with solutions in different positions, the circuit board can be in an inclined state when swinging, the contact area between the inclined circuit board and the solutions can be increased, the treatment effect of the circuit board is further improved, sundries on the circuit board can fall on a structure formed by the closing plate 23 and the isolation plate 21, when the circuit board is completely removed, the pressing plate 24 returns to the initial position under the action of the reset spring 25, and accordingly the closing plate 23 can return to a sagging state, and sundries accumulated on the closing plate 23 and the isolation plate 21 can fall to the lower side of the isolation plate 21; and finally, activating and accelerating the circuit board in sequence.
In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "examples," "particular examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
While embodiments of the present invention have been shown and described above, it should be understood that the above embodiments are illustrative and not to be construed as limiting the invention, and that variations, modifications, alternatives, and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the invention, which is also intended to be covered by the present invention.
Claims (10)
1. A high-performance copper electroplating process is characterized in that: the method specifically comprises the following steps:
s1, drilling a circuit board: drilling the designed position on the circuit board through a drilling machine after the circuit board completes thermal transfer printing plate making, and cleaning the drilling hole;
s2, presoaking a circuit board: the circuit board with the holes drilled is inserted into a presoaking swing clamp, three liquid storage barrels are taken, presoaking liquid, activating liquid and accelerating liquid are respectively added into the liquid storage barrels, and the presoaking swing clamp is placed into the liquid storage barrels of the presoaking liquid, so that sundries on the surface of the circuit board and the holes drilled can be cleaned and fall;
s3, activating and accelerating a circuit board: placing the presoaked swing clamp into a liquid storage barrel of an activating liquid, so that the circuit board can be subjected to activating treatment; then placing the activated pre-soaking swing clamp in a liquid storage barrel of accelerating liquid for accelerating treatment;
s4, copper deposition of the circuit board: after the circuit board is activated and accelerated, the circuit board is taken down from the presoaked swing clamp, formaldehyde is added into a container for storing copper precipitation liquid, copper precipitation treatment is carried out on the circuit board, and the copper precipitation reaction time is 10-15 minutes;
s5, electroplating a circuit board: placing the circuit board after copper deposition into an electroplating box for electroplating treatment;
s6, post-processing of the circuit board: after the electroplating of the circuit board is finished, carefully aligning each bonding pad on the top layer and the bottom layer of the printed circuit board graph with a corresponding through hole, fixing the bonding pads by using an adhesive tape, and transferring; tearing off the transfer paper after the transfer printing is finished; finally, placing the circuit board into a corrosion machine for corrosion treatment, and finishing the processing of the circuit board after the corrosion treatment is finished;
the circuit board copper electroplating process is completed by adopting a presoaking swing clamp and a liquid storage barrel, wherein the liquid storage barrel comprises a barrel body (1) with a square structure, positioning grooves (11) are symmetrically formed in the middle of the side edge of the length direction of the barrel body (1), an isolation mechanism (2) is arranged at the lower end of the barrel body (1), and a discharge port (12) is formed in the side wall of the lower end of the barrel body (1) and located below the isolation mechanism (2); the barrel body (1) is divided into an upper layer and a lower layer by the isolation mechanism (2);
the prepreg swing clamp comprises two positioning inserting blocks (3), the two positioning inserting blocks (3) are respectively inserted into positioning grooves (11), rotating shafts (4) are respectively arranged on opposite sides of the two positioning inserting blocks (3), one rotating shaft (4) is connected with a repeated motor, each rotating shaft (4) is rotatably provided with a connecting support plate (41), the middle part of each connecting support plate (41) is mounted on the side face of each positioning inserting block (3), clamping mechanisms (5) are uniformly distributed between the two connecting support plates (41) along the length direction of each connecting support plate, swing shafts (6) are respectively mounted at the front end and the rear end of each clamping mechanism (5), the swing shafts (6) located in the middle are fixedly connected to the corresponding rotating shafts (4), the rest swing shafts (6) are rotatably connected to the side faces of the corresponding connecting support plates (41), and the swing shafts (6) are connected through belts.
2. A high performance electrolytic copper plating process according to claim 1, wherein: the electroplating solution in the electroplating box comprises copper sulfate, sulfuric acid, chloride ions, a leveling agent, a gloss agent and a wetting agent, and the components are all provided with automatic adders, so that the electroplating solution is automatically added in the electroplating process of the circuit board.
3. A high performance electrolytic copper plating process according to claim 2, wherein: the content of copper sulfate in the electroplating solution is 70-150g/L, the content of sulfuric acid in the electroplating solution is 50-200g/L, the content of chloride ions in the electroplating solution is 30-70mg/L, the content of leveling agent in the electroplating solution is 20-30ml/L, the content of gloss agent in the electroplating solution is 0.5-1.5ml/L, and the content of wetting agent in the electroplating solution is 10-20ml/L.
4. A high performance electrolytic copper plating process according to claim 2, wherein: the chloride ions were formulated with 37% W/W HCL using 0.135ml/L concentrated hydrochloric acid.
5. A high performance electrolytic copper plating process according to claim 1, wherein: the side edges of the barrel body (1) in the length direction are provided with pressing grooves (13) of T-shaped structures, the upper ends of the pressing grooves (13) are vertical sections, and the upper ends of the vertical sections of the pressing grooves (13) are communicated with the positioning grooves (11); the isolation mechanism (2) comprises an isolation plate (21) arranged inside the barrel body (1), square through holes are uniformly formed in the isolation plate (21) along the length direction of the isolation plate, a sealing plate (23) is arranged in each square through hole in the isolation plate (21) through a rotary connecting rod (22), and two ends of the rotary connecting rod (22) extend into the horizontal section of the pressing groove (13).
6. A high performance electrolytic copper plating process according to claim 5, wherein: the upper side surfaces of the sealing plates (23) are gradually inclined from left to right, and the parts of the upper side surfaces of the isolation plates (21) which are positioned on the right side of each sealing plate (23) are inclined surface structures which gradually incline downwards from right to left.
7. A high performance electrolytic copper plating process according to claim 5, wherein: be provided with clamp plate (24) of T type structure in indent (13), the vertical section of clamp plate (24) extends to in constant head tank (11), and the horizontal segment of clamp plate (24) is installed lateral wall on the horizontal segment of indent (13) through reset spring (25), one end that rotation connecting rod (22) are located indent (13) all is provided with and smooths dull and stereotyped (26), smooths the inclination of board (26) and is the same with the inclination of closure plate (23), and the distance of clamp plate (24) up side to constant head tank (11) lower lateral wall equals the distance of clamp plate (24) downside to closure plate (23) up side.
8. A high performance electrolytic copper plating process according to claim 1, wherein: the utility model discloses a barrel, including constant head tank (11), location inserting piece (3), constant head tank (11)'s lower lateral wall and be located one side of staving (1) inner wall and be provided with triangle-shaped breach, be provided with on the location inserting piece (3) with triangle-shaped breach matched with triangle-shaped fixture block (31), the lateral wall of constant head tank (11) is provided with flexible fixture block (32).
9. A high performance electrolytic copper plating process according to claim 1, wherein: the clamping mechanism (5) comprises a clamping frame (51) with a U-shaped structure, opposite sides of a vertical section of the clamping frame (51) are connected to the swinging shaft (6), opposite sides of the vertical section of the clamping frame (51) are respectively provided with an upright plate (52), the bottoms of the upright plates (52) are in sliding fit with the horizontal section of the clamping frame (51), the opposite sides of the upright plates (52) are respectively provided with a locking plate (54) through a spring rod (53), and the upright plates (52) are arranged on the clamping frame (51) through an adjusting component (55); the adjusting assembly (55) is used for adjusting the distance between the vertical plate (52) and the clamping frame (51).
10. A high performance electrolytic copper plating process according to claim 9, wherein: the adjusting assembly (55) comprises an adjusting bolt (56) which is arranged on the vertical section of the middle clamping frame (51) in a threaded fit mode, one end of the adjusting bolt (56) is rotatably connected to the vertical plate (52), one side, far away from the middle part of the clamping frame (51), of the middle vertical plate (52) is fixedly connected with a pushing rod (57), two ends of the pushing rod (57) are abutted against the side surfaces of the remaining vertical plate (52), and the remaining vertical plate (52) is connected with the clamping frame (51) through a retraction spring column (58); the opposite sides of the locking plate (54) are provided with stepped clamping grooves.
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