CN114167916A - Circuit board temperature adjusting method and device, electronic equipment and storage medium - Google Patents
Circuit board temperature adjusting method and device, electronic equipment and storage medium Download PDFInfo
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- CN114167916A CN114167916A CN202210127011.0A CN202210127011A CN114167916A CN 114167916 A CN114167916 A CN 114167916A CN 202210127011 A CN202210127011 A CN 202210127011A CN 114167916 A CN114167916 A CN 114167916A
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- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
Abstract
The disclosure relates to the technical field of temperature control, and provides a circuit board temperature adjusting method and device, electronic equipment and a storage medium. The method comprises the following steps: monitoring the working frequency of a radio frequency module in the process of starting a wireless measuring instrument to perform wireless testing, when the working frequency is changed, acquiring the current temperature corresponding to the changed current working frequency, and taking the current temperature as the initial temperature under the current working frequency; determining a rate of temperature change over a preset continuous time interval based on the starting temperature; and controlling a temperature control element preset on the circuit board corresponding to the radio frequency module to regulate the temperature of the circuit board based on the temperature change rate, so that the temperature of the circuit board is kept in a preset range. The method and the device can enable the circuit board to work at the preset working temperature, avoid the influence of the temperature change of the circuit board on the accuracy of the wireless test result, and improve the accuracy of the wireless test.
Description
Technical Field
The present disclosure relates to the field of temperature control technologies, and in particular, to a method and an apparatus for adjusting a temperature of a circuit board, an electronic device, and a storage medium.
Background
When a wireless measurement instrument (e.g., an integrated tester) is used for wireless testing, wireless signals of different frequency bands are generated in the instrument in a simulated manner, and a radio frequency module generating the wireless signals generates a large amount of heat, so that the temperature of a circuit board where the radio frequency module is located or the ambient temperature inside the instrument rises, and the temperature rise of the circuit board affects the accuracy of the wireless testing. Therefore, in the prior art, the result of the wireless test is usually corrected or compensated, so as to overcome the influence of the temperature change on the accuracy of the test result as much as possible. However, such a method of correcting or compensating the test result is a post-remedy, and a large error may still exist. Therefore, how to overcome the influence of the temperature change of the circuit board on the accuracy of the measurement result in the wireless test process is a technical problem in the field.
Disclosure of Invention
In view of this, embodiments of the present disclosure provide a method and an apparatus for adjusting a temperature of a circuit board, an electronic device, and a storage medium, so as to solve a problem in the prior art that how to overcome a problem that a measurement result precision is affected by a change in a temperature of the circuit board during a wireless test process.
In a first aspect of the embodiments of the present disclosure, a method for adjusting a temperature of a circuit board is provided, where the method is applied to a wireless measurement instrument provided with a radio frequency module, and the method for adjusting a temperature of a circuit board includes: monitoring the working frequency of a radio frequency module in the process of starting a wireless measuring instrument to perform wireless testing, when the working frequency is changed, acquiring the current temperature corresponding to the changed current working frequency, and taking the current temperature as the initial temperature under the current working frequency; determining a rate of temperature change over a preset continuous time interval based on the starting temperature; and controlling a temperature control element preset on a circuit board corresponding to the radio frequency module to regulate the temperature of the circuit board based on the temperature change rate, so that the temperature of the circuit board is kept in a preset range.
In a second aspect of the embodiments of the present disclosure, there is provided a circuit board temperature adjusting apparatus applied to a wireless measurement instrument provided with a radio frequency module, the circuit board temperature adjusting apparatus including: the temperature acquisition module is configured to monitor the working frequency of the radio frequency module in the process of starting the wireless measurement instrument to perform wireless test, acquire the current temperature corresponding to the changed current working frequency when the working frequency is changed, and take the current temperature as the initial temperature under the current working frequency; a change determination module configured to determine a rate of change of temperature over a preset continuous time interval based on the starting temperature; and the temperature control module is configured to control a temperature control element which is preset on a circuit board corresponding to the radio frequency module to regulate the temperature of the circuit board based on the temperature change rate, so that the temperature of the circuit board is kept in a preset range.
In a third aspect of the embodiments of the present disclosure, an electronic device is provided, which includes a memory, a processor, and a computer program stored in the memory and executable on the processor, and the processor implements the steps of the above method when executing the computer program.
In a fourth aspect of the embodiments of the present disclosure, a computer-readable storage medium is provided, which stores a computer program, which when executed by a processor, implements the steps of the above-mentioned method.
Compared with the prior art, the embodiment of the disclosure has the following beneficial effects: monitoring the working frequency of a radio frequency module in the process of starting a wireless measuring instrument to perform wireless testing, when the working frequency is changed, obtaining the current temperature corresponding to the changed current working frequency, and taking the current temperature as the initial temperature under the current working frequency; determining a rate of temperature change over a preset continuous time interval based on the starting temperature; and based on the temperature change rate, controlling a temperature control element which is preset on a circuit board corresponding to the radio frequency module to regulate the temperature of the circuit board, so that the temperature of the circuit board is kept within a preset range, the circuit board works at a preset working temperature, the influence of the temperature change of the circuit board on the accuracy of a wireless test result is avoided, and the accuracy of the wireless test is improved.
Drawings
To more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings needed for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present disclosure, and other drawings can be obtained by those skilled in the art without inventive efforts.
FIG. 1 is a scenario diagram of an application scenario of an embodiment of the present disclosure;
fig. 2 is a schematic plan view of a circuit board in fig. 1 according to an embodiment of the present disclosure;
fig. 3 is a schematic flow chart of a method for adjusting the temperature of a circuit board according to an embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of a circuit board temperature adjustment device provided in an embodiment of the present disclosure;
fig. 5 is a schematic structural diagram of an electronic device provided in an embodiment of the present disclosure.
Detailed Description
In the following description, for purposes of explanation and not limitation, specific details are set forth, such as particular system structures, techniques, etc. in order to provide a thorough understanding of the disclosed embodiments. However, it will be apparent to one skilled in the art that the present disclosure may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present disclosure with unnecessary detail.
A circuit board temperature adjusting method and apparatus according to an embodiment of the present disclosure will be described in detail below with reference to the accompanying drawings.
Fig. 1 is a scene schematic diagram of an application scenario of an embodiment of the present disclosure. The application scenario may include a circuit board 1, temperature sensors 2 and 3, temperature control elements 4 and 5, a controller 6 and a power supply 7.
The circuit board 1 may be a PCB (printed circuit board), on which various electronic devices including but not limited to resistors, capacitors, sensors, and chip modules are mounted. For example, the PCB is mounted with the rf module, the rf module can work at different operating frequencies to generate wireless signals of different frequency bands, and the rf module generates a large amount of heat in the process of generating the wireless signals, so that the temperature of the PCB corresponding to the rf module changes, that is, the temperature of the PCB rises.
The temperature sensors 2 and 3 may be disposed on the circuit board for measuring the temperature of the circuit board 1. In some embodiments, holes may be drilled at different points on the circuit board 1, and then the temperature sensors 2 and 3 may be mounted at the drilled positions to facilitate more accurate circuit board temperature acquisition. For example, a hole may be formed at an edge position of the circuit board 1, and then the temperature sensor 2 may be mounted at the edge position, or a hole may be formed at a center position of the circuit board, and then the temperature sensor 3 may be mounted at the center position, so that temperatures of different positions on the circuit board 1 may be collected by a plurality of temperature sensors, thereby obtaining a more accurate temperature of the circuit board.
The temperature control elements 4 and 5 are intended to be arranged on the entire circuit board 1 or on a plurality of different areas of the circuit board 1 for cooling or heating in order to control the temperature of the circuit board. Specifically, a first temperature control element (e.g., temperature control element 4 in fig. 1) for cooling and a second temperature control element (e.g., temperature control element 5 in fig. 1) for heating are provided on the circuit board 1. For example, in the case that the operating temperature of the circuit board 1 is too high, the temperature control element 4 may be controlled to perform cooling so as to reduce the operating temperature of the circuit board 1; in the case that the operating temperature of the circuit board 1 is not high enough, the temperature control element 5 may be controlled to perform heating so as to increase the operating temperature of the circuit board 1.
The controller 6 is connected to the temperature sensors 2 and 3 and the temperature control elements 4 and 5 on the circuit board, respectively, and specifically, the controller 6 may be disposed on the circuit board 1 or may be disposed separately from the circuit board 1. If the controller 6 is disposed on the circuit board 1, the temperature sensors 2 and 3 and the temperature control elements 4 and 5 can be controlled by using a processor existing on the circuit board 1 as a controller, for example, the control function of the circuit board temperature adjusting method can be realized by running a computer program by using the processor on the circuit board 1. If the controller 6 is provided separately from the circuit board 1, the controller 6 may also be a customized functional module, for example, the controller 6 is an integrated circuit module implemented based on an editable gate array, and interacting the temperature control element and the temperature sensor, or the controller 6 may also be a microcomputer system such as a single chip microcomputer, which is not limited in the embodiment of the present disclosure.
A power supply 7 is connected to the controller 6 at least for supplying power to the temperature control elements 5 and 6. Specifically, the power supply 7 may be a power management module or a power interface, or may also be a power supply battery or a power converter, and the like, which is not limited in the embodiment of the present disclosure.
Fig. 2 is a schematic plan view of the circuit board 1 in fig. 1 according to an embodiment of the present disclosure. As shown in fig. 2, the circuit board is rectangular, the circuit board 1 is divided into four areas Q1, Q2, Q3 and Q4, each area is provided with a temperature control element 4 (the other side of the circuit board 1 is provided with a temperature control element 5), that is, the area Q1 is provided with a temperature control element 41, the area Q2 is provided with a temperature control element 42, the area Q3 is provided with a temperature control element 43, and the area Q4 is provided with a temperature control element 44; in addition, the temperature sensors 2 are disposed at edge position points 11 of the circuit board 1 (i.e., four corner positions of the circuit board 1 in fig. 1), and the temperature sensor 3 is disposed at a center point position 12 of the circuit board 1. In practical applications, the temperature of each area of the circuit board 1 can be determined by calculation from the temperature values acquired by the temperature sensors 2 and 3 in the area. For example, taking the area Q1 on the circuit board 1 in fig. 1 as an example, the average temperature may be calculated from the temperature values collected by the temperature sensor 2 at the upper left corner of the area Q1 and the temperature sensor 3 at the lower right corner of the area Q1 as the temperature of the area Q1, or weighted temperature values of the temperature sensors 2 and 3 in the area Q1 may be preset, then weighted sums of the temperature values collected by the temperature sensors 2 and 3 and the corresponding weighted temperature values may be calculated, and the calculated weighted temperature sum may be used as the temperature of the area Q1. In the embodiment of the present disclosure, the partition temperature control is performed by dividing the circuit board 1 into a plurality of areas, so that the accurate control of the operating temperatures of different areas of the circuit board can be realized. Of course, in practice, the circuit board 1 may not be partitioned, and the temperature control elements 41, 42, 43, and 44 may be combined into a whole to control the temperature of the circuit board 1.
It should be noted that the specific type, number and combination of the circuit board 1, the temperature sensors 2 and 3, the temperature control elements 4 and 5, the controller 6 and the power supply 7 can be adjusted according to the actual requirements of the application scenario, and the embodiment of the present disclosure is not limited thereto. In practical applications, the application scenario shown in fig. 1 may be temperature control of a circuit board in a wireless measurement instrument.
Fig. 3 is a flowchart of a method for adjusting a temperature of a circuit board according to an embodiment of the present disclosure. The circuit board temperature adjusting method of fig. 3 may be applied to a wireless measurement instrument provided with a radio frequency module, for example, the wireless measurement instrument includes the application scenario shown in fig. 1, and the circuit board temperature adjusting method of fig. 3 is executed by the controller of fig. 1. As shown in fig. 3, the circuit board temperature adjusting method includes:
s301, monitoring the working frequency of a radio frequency module in the process of starting a wireless measuring instrument to perform wireless testing, when the working frequency is changed, obtaining the current temperature corresponding to the changed current working frequency, and taking the current temperature as the initial temperature under the current working frequency;
s302, determining a temperature change rate in a preset continuous time interval based on the initial temperature;
and S303, controlling a temperature control element preset on the circuit board corresponding to the radio frequency module to regulate the temperature of the circuit board based on the temperature change rate, so that the temperature of the circuit board is kept in a preset range.
Specifically, the radio frequency module may be a radio frequency chip or a wireless signal transmitting module in a wireless signal measuring instrument. The radio frequency modules can transmit wireless signals of different frequency bands, the working frequencies of the radio frequency modules corresponding to the wireless signals of different frequency bands are different, and the heating values of the radio frequency modules of different working frequencies in unit time are also different. That is, the operating frequency of the rf module for transmitting the wireless signal of one frequency band is different from the operating frequency of the rf module for transmitting the wireless signal of another frequency band. Generally, the greater the power of the radio frequency module to transmit the wireless signal, the greater the corresponding heat generated. Specifically, in the wireless test process, the radio frequency module changes the operating frequency to transmit the wireless signals of different frequency bands, so that the sequence of transmitting the wireless signals by the radio frequency module may be uncertain, the temperature of the circuit board corresponding to the radio frequency module also dynamically changes, and the initial temperatures of the circuit boards at the beginning of transmitting the wireless signals of each frequency band may be different.
Specifically, in the test process, the degree of influence of the temperature of the circuit board on the test result corresponding to the wireless signal of each frequency band may be different, and in practice, the ideal operating temperature of the circuit board corresponding to the wireless signal test of each frequency band may be determined in an experimental manner, that is, when the radio frequency module transmits the wireless signal of a certain frequency band, the temperature of the circuit board is kept at the ideal operating temperature, so that the accuracy of the result of the wireless test is not influenced by the temperature change of the circuit board. Then, the ideal operating temperature can be used as the preset operating temperature of the rf module at the corresponding operating frequency.
Specifically, if the rf module operates at a fixed operating frequency, which is equivalent to transmitting only one frequency band of wireless signals, and the initial temperature of the circuit board at the time when the rf module starts to operate is known, the time-varying functional relationship of the temperature of the circuit board can be obtained through a plurality of test measurements. Then, the radio frequency module can keep the working frequency unchanged, and the initial temperature of the circuit board is changed, so as to obtain the temperature change rule of the circuit board corresponding to the radio frequency module transmitting a radio signal of one frequency band under the condition of emitting at different initial temperatures, namely the corresponding relation of the temperature change along with time. In the embodiment of the present disclosure, for the condition that the radio frequency module transmits the wireless signals of different frequency bands, the rule that the temperature of the corresponding circuit board changes with time when the radio frequency module starts to work at different initial temperatures at each working frequency can be obtained in advance. Therefore, when the working frequency of the radio frequency module and the initial temperature of the circuit board are determined, the corresponding relation of the temperature of the circuit board changing along with time can be obtained, the corresponding relation is generally a linear relation, and the temperature change rate of the circuit board can be determined according to the corresponding relation.
According to the technical scheme provided by the embodiment of the disclosure, the working frequency of the radio frequency module is monitored in the process of starting the wireless measuring instrument to perform wireless test, when the working frequency is changed, the current temperature corresponding to the changed current working frequency is obtained, and the current temperature is used as the initial temperature under the current working frequency; determining a rate of temperature change over a preset continuous time interval based on the starting temperature; based on the temperature change rate, the temperature control element which is preset on the circuit board corresponding to the radio frequency module is controlled to regulate the temperature of the circuit board, so that the temperature of the circuit board is kept in a preset range, the accurate control of the temperature of the circuit board is realized, the influence of the temperature change of the circuit board corresponding to the radio frequency module on the wireless test precision in the wireless test process is avoided, and the test precision is improved.
In some embodiments, monitoring the operating frequency of the radio frequency module, acquiring a current temperature corresponding to the changed current operating frequency when the operating frequency is changed, and taking the current temperature as an initial temperature at the current operating frequency includes: acquiring the working frequency of a radio frequency module, wherein the working frequency comprises the frequency band of a radio frequency module for transmitting a wireless signal; monitoring the frequency band of the radio frequency module for transmitting the radio signals, when the frequency band of the radio signals currently transmitted by the radio frequency module changes, acquiring temperature values of all position points based on temperature sensors preset on different position points of a circuit board where the radio frequency module is located, calculating the weighted sum of each temperature value and the corresponding preset temperature weight based on the preset temperature weight of the temperature sensor on each position point, and using the weighted sum as the initial temperature of the changed radio signals for transmitting the current frequency band.
Here, the operating frequency of the rf module refers to the power of the rf module transmitting a wireless signal in a certain frequency band. Specifically, the initial temperature of the circuit board on which the radio frequency module is located may be the temperature of the whole circuit board on which the radio frequency module is located, or the temperature at the corresponding position of the radio frequency module on the circuit board, or the temperature at different circuit board areas on the circuit board on which the radio frequency module is located. Referring to fig. 2, when the radio frequency module starts to operate at the current operating frequency, different preset temperature weights may be set for the temperature values acquired by the temperature sensors at the center position point 12 and the edge position point 11 of the circuit board 1, and then a weighted sum is calculated according to the temperature value acquired by each temperature sensor and the corresponding preset temperature weight, where the calculated weighted sum is the initial temperature of the circuit board where the radio frequency module is located at the current operating frequency. In practical application, the initial temperature of the circuit board corresponding to the current working frequency can be obtained in the manner described above under the condition that the radio frequency module changes or switches the working frequency, so that the temperature of the circuit board can be accurately obtained, and meanwhile, continuous temperature calculation is avoided, and calculation resources are occupied.
According to the embodiment of the disclosure, the weighted sum is calculated by collecting the temperature values of different position points on the circuit board through the temperature sensor so as to determine the initial temperature of the circuit board, so that the problem that the accurate temperature of the target position on the circuit board cannot be obtained by detecting through a single temperature sensor is avoided, and the accurate control of the temperature of the circuit board is realized.
Further, in some embodiments, acquiring temperature values of the respective location points based on temperature sensors preset at different location points of the circuit board where the radio frequency module is located includes: acquiring a first temperature value of a central position point based on a first temperature sensor preset on the central position point of the circuit board; and acquiring a second temperature value of each edge position point based on second temperature sensors preset on a plurality of edge position points of the circuit board, wherein the distances between the first temperature sensors and the second temperature sensors are equal.
Specifically, referring to fig. 2, a temperature sensor 3 (i.e., a first temperature sensor) may be disposed at a central position of the circuit board where the rf module is located, so as to obtain a first temperature value X1; and at the same time 4 temperature sensors 2 (i.e. second temperature sensors) are arranged at the edge location points of the circuit board, resulting in 4 second temperature values X2, X3, X4 and X5. Further, since the distances between the first temperature sensor and the second temperature sensor are equal, the temperature distribution of the circuit board where the whole rf module is located can be obtained, and if the preset temperature weight of the first temperature sensor is m1 and the preset temperature weights of the 4 second temperature sensors are all m2, the temperature of the circuit board may be equal to the weighted sum of the first temperature value and the second temperature value, that is, X1 × m1+ X2 × m2+ X3 × m2+ X4 × m2+ X5 × m 2.
In some embodiments, determining a rate of temperature change over a preset continuous time interval based on the starting temperature comprises: the method comprises the steps that wireless signals of the same frequency band are transmitted from circuit boards with different temperatures based on a radio frequency module, temperature change data of the circuit boards in the same transmission time are obtained, and the temperature change data comprise temperature values of the circuit boards in the transmission time at each time; determining a function relation of the temperature of the circuit board changing along with time when the radio frequency module transmits a wireless signal of any frequency band based on the temperature change data, wherein the function relation comprises the temperature change rate of the circuit board in a preset continuous time interval; and determining the temperature change rate of the circuit board corresponding to the initial temperature based on the frequency band and the corresponding relation of the wireless signal currently transmitted by the radio frequency module.
Specifically, when the rf module starts to operate, if the rf module starts to operate at the operating frequency N1, the initial temperature of the corresponding circuit board is T1; then, the radio frequency module switches the operating frequency to N2 (N2 > N1), and since the radio frequency module has been operated for a period of time at the operating frequency N1, the temperature of the circuit board is T2, and T2 > T1. Therefore, when the radio frequency module continuously works at a plurality of different working frequencies, the initial temperature of the corresponding circuit board at each working frequency is different. Further, since the rf module generates heat during operation, even if the rf module operates at the same operating frequency, if the initial temperature of the circuit board is different during the operation, the temperature change of the circuit board may be different (i.e., the temperature change rate of the circuit board is also different). Therefore, for each working frequency, the radio frequency module starts to work at different initial temperatures, data of the temperature of the circuit board where the radio frequency module is located along with the time change can be obtained, and the data can be used for summarizing the corresponding relation of the temperature of the circuit board of the radio frequency module starting from the initial temperature along with the time change at any working frequency. For example, the data may be used as a training sample, and a machine learning algorithm (e.g., a regression-type algorithm) is trained by using the training sample, so as to learn a corresponding relationship between the current operating frequency of the radio frequency module and the temperature of the corresponding circuit board at the initial temperature, which is a linear regression relationship. When the radio frequency module switches or changes the operating frequency, the target corresponding relationship of the temperature of the circuit board changing with time can be determined according to the changed current operating frequency and the initial temperature of the circuit board, and the temperature of the circuit board at different times and the rate of the temperature of the circuit board changing with time (namely the temperature change rate) can be predicted based on the target corresponding relationship.
According to the embodiment of the disclosure, the corresponding relation between the temperature of the circuit board and the time is obtained through the historical data, so that the temperature change rule of the circuit board is obtained, the temperature control strategy of the circuit board can be better determined, and the temperature control of the circuit board can be accurately and efficiently realized.
In some embodiments, controlling, based on the temperature change rate, a temperature control element preset on a circuit board corresponding to the radio frequency module to perform temperature adjustment on the circuit board, so that the temperature of the circuit board is kept within a preset range, includes: acquiring a preset working temperature of the current working frequency of the radio frequency module; determining an energy compensation strategy for the circuit board to reach a preset working temperature from an initial temperature based on the temperature change rate; based on the energy compensation strategy, the temperature control element preset on the circuit board is controlled to generate corresponding compensation energy, so that the working temperature of the circuit board is kept in a preset range, and the preset range comprises the preset working temperature.
In particular, since there is a limit to the operation of the rf module affected by temperature variation, that is, only when the temperature variation reaches a certain degree, the wireless test result may be affected, and thus, in practice, the requirements for temperature control of the rf module at different operating frequencies may be different, and certainly the same. In the application scenario of fig. 1, the preset operating temperatures of the radio frequency module at different operating frequencies can be determined in advance through an experiment, and according to the temperature change rate of the circuit board from the initial temperature at the current operating frequency of the radio frequency module, the energy compensation strategy from the initial temperature to the preset operating temperature of the circuit board at the current operating frequency can be determined, so that the intelligent adjustment and control of the temperature of the circuit board can be realized.
Further, referring to the application scenario of fig. 1, the temperature control element for performing temperature adjustment control on the circuit board includes a cooling temperature control element 4 and a heating temperature control element 5, that is, the temperature control element may both heat and cool. According to the temperature change rate of the circuit board where the radio frequency module is located, an energy compensation strategy of the temperature control element for the radio frequency module from the initial temperature to the preset working temperature under the current working frequency can be determined. For example, if the initial temperature is not lower than the preset working temperature, the temperature control element can be controlled to heat to increase the temperature of the circuit board; if the initial temperature exceeds the preset working temperature, the temperature control element can be controlled to refrigerate to reduce the temperature of the circuit board.
In some embodiments, determining an energy compensation strategy for the circuit board to reach a preset operating temperature from a starting temperature based on the rate of temperature change comprises: comparing the difference value between the initial temperature of the circuit board of the current working frequency of the radio frequency module and the preset working temperature; under the condition that the difference value is positive, generating an energy compensation strategy for reducing the temperature of the circuit board; and under the condition that the difference value is negative, determining the waiting time of the circuit board reaching the preset working temperature based on the temperature change rate, if the waiting time is greater than or equal to a preset time threshold, generating an energy compensation strategy for increasing the temperature of the circuit board, and if the waiting time is less than the preset time threshold, generating an energy compensation strategy for prolonging the working time of the current working frequency of the radio frequency module, wherein the prolonged time is equal to the waiting time.
Specifically, a difference value between an initial temperature corresponding to the circuit board of the radio frequency module at the current working frequency and a preset working temperature of the current working frequency is calculated, and according to a calculation result, under the condition that the difference value is positive, the initial temperature of the circuit board is larger than the preset working temperature, and at the moment, a temperature control element is required to refrigerate to reduce the temperature of the circuit board; and under the condition that the difference value is negative, the starting temperature is lower than the preset working temperature, and at the moment, the heating of the temperature control element is required to be determined to quickly enable the circuit board to reach the preset working temperature. In addition, considering that the radio frequency module generates heat during operation, when the initial temperature is lower than the preset operating temperature, the waiting time of the circuit board from the initial temperature to the preset operating temperature can be determined according to the temperature change rate of the circuit board at the initial temperature of the current operating frequency of the radio frequency module. Further, if the waiting time for the circuit board to reach the preset working temperature from the starting temperature is short (namely the waiting time is less than the preset time threshold), the working time of the radio frequency module only needs to be prolonged, the temperature of the circuit board is increased by utilizing the heat generated by the radio frequency module, and the temperature control element does not need to be started for temperature adjustment; on the contrary, if the waiting time of the circuit board from the starting temperature to the preset working temperature is long (i.e. the waiting time is greater than or equal to the preset time threshold), an energy compensation strategy for increasing the temperature of the circuit board is generated for the temperature control element, so that the circuit board quickly reaches the preset working temperature.
Specifically, the time threshold in the embodiment of the present disclosure may be a time value set by the user according to experience data, or may be a new time value obtained by adjusting the set time value according to the application scenario of the radio frequency module by the user, which is not limited in the embodiment of the present disclosure.
According to the embodiment of the disclosure, the temperature change rate of the circuit board is determined through the corresponding relation of the temperature of the circuit board changing along with the time under the set working frequency of the radio frequency module, so that the energy compensation strategy of the temperature control element for controlling the temperature of the circuit board is generated according to the temperature change rate.
In some embodiments, based on the energy compensation strategy, controlling a temperature control element preset on the circuit board to generate corresponding compensation energy so that the operating temperature of the circuit board is kept within a preset range includes: responding to an energy compensation strategy for reducing the temperature of the circuit board, controlling a first temperature control element preset on the circuit board to refrigerate to obtain first compensation energy, and controlling the refrigerating power of the first temperature control element to change in a direct proportion relation with the temperature change rate; and responding to an energy compensation strategy for increasing the temperature of the circuit board, controlling a second temperature control element preset on the circuit board to heat to obtain second compensation energy, and controlling the heating power of the second temperature control element to change in inverse relation with the temperature change rate.
In particular, in connection with the application scenario of fig. 1, the first temperature control element here may be the temperature control element 4 in fig. 1, for cooling; the second temperature control element may be the temperature control element 5 of fig. 1 for heating. Under the condition of responding to an energy compensation strategy for reducing the temperature of the circuit board, the refrigerating power of the first temperature control element is controlled to change in direct proportion to the temperature change rate of the circuit board where the radio frequency module is located, so that the synchronous control on the temperature change of the circuit board can be realized; in addition, under the condition of responding to an energy compensation strategy for improving the temperature of the circuit board, the heating power of the second temperature control element is controlled to change in inverse proportion to the temperature change rate of the circuit board where the radio frequency module is located, so that the heating process is a process of continuously accumulating heat, and the synchronous control on the temperature change of the circuit board can be realized through the change control of the inverse proportion relation.
Further, the preset operating temperature of the radio frequency module at each operating frequency may be a temperature value or a temperature range, which is not limited in the embodiment of the present disclosure. In the embodiment of the present disclosure, the preset operating temperature is preferably within a temperature range, and therefore, the temperature control element needs to precisely control the temperature of the circuit board, so that the operating power of the temperature control element is controlled to change along with the temperature change rate in a corresponding direct proportion or inverse proportion relationship by using the temperature change rate of the circuit board, and the problem that too much computing resources are occupied by frequent data computation is avoided.
The embodiment of the disclosure correspondingly controls the change of the direct proportion relation and the inverse proportion relation of the refrigeration power and the heating power of the temperature control element based on the temperature change rate of the circuit board, so that the controller does not need to frequently calculate data, the occupation of calculation resources is effectively reduced, the temperature control element can be controlled by directly utilizing a simple processor or a processor in a wireless signal measuring instrument in practical application, and the temperature of the circuit board can be quickly controlled.
All the above optional technical solutions may be combined arbitrarily to form optional embodiments of the present application, and are not described herein again.
The following are embodiments of the disclosed apparatus that may be used to perform embodiments of the disclosed methods. For details not disclosed in the embodiments of the apparatus of the present disclosure, refer to the embodiments of the method of the present disclosure.
Fig. 4 is a schematic diagram of a circuit board temperature adjustment device provided in an embodiment of the present disclosure. The circuit board temperature adjusting apparatus in fig. 4 may be applied to a wireless measuring instrument provided with a radio frequency module, as shown in fig. 4, and includes:
the temperature acquisition module 401 is configured to monitor the working frequency of the radio frequency module during the process of starting the wireless measurement instrument to perform wireless test, acquire the current temperature corresponding to the changed current working frequency when the working frequency is changed, and use the current temperature as the initial temperature at the current working frequency;
a change determination module 402 configured to determine a rate of change of temperature over a preset continuous time interval based on the starting temperature;
and the temperature control module 403 is configured to control a temperature control element preset on the circuit board corresponding to the radio frequency module to perform temperature adjustment on the circuit board based on the temperature change rate, so that the temperature of the circuit board is kept within a preset range.
According to the technical scheme provided by the embodiment of the disclosure, the working frequency of the radio frequency module is monitored in the process of starting the wireless measuring instrument to perform wireless test, when the working frequency is changed, the current temperature corresponding to the changed current working frequency is obtained, and the current temperature is used as the initial temperature under the current working frequency; determining a rate of temperature change over a preset continuous time interval based on the starting temperature; based on the temperature change rate, the temperature control element which is preset on the circuit board corresponding to the radio frequency module is controlled to regulate the temperature of the circuit board, so that the temperature of the circuit board is kept within a preset range, the circuit board works at a preset working temperature, the influence of the temperature change of the circuit board on the accuracy of a wireless test result is avoided, and the accuracy of wireless test is improved.
In some embodiments, the temperature obtaining module 401 in fig. 4 obtains an operating frequency of the rf module, where the operating frequency includes a frequency band in which the rf module transmits a wireless signal; monitoring the frequency band of the wireless signal transmitted by the radio frequency module, and acquiring the temperature value of each position point based on temperature sensors preset on different position points of a circuit board where the radio frequency module is positioned when the frequency band of the wireless signal currently transmitted by the radio frequency module is changed; and calculating the weighted sum of each temperature value and the corresponding preset temperature weight based on the preset temperature weight of the temperature sensor at each position point, and taking the weighted sum as the changed initial temperature for transmitting the wireless signal of the current frequency band.
In some embodiments, the temperature obtaining module 401 in fig. 4 obtains a first temperature value of a center position point based on a first temperature sensor preset on the center position point of the circuit board; and acquiring a second temperature value of each edge position point based on second temperature sensors preset on a plurality of edge position points of the circuit board, wherein the distances between the first temperature sensors and the second temperature sensors are equal.
In some embodiments, the change determining module 402 in fig. 4 obtains temperature change data of the circuit boards within the same transmission time based on the radio frequency module starting to transmit the wireless signals of the same frequency band from the circuit boards with different temperatures, where the temperature change data includes a temperature value of the circuit board at each time within the transmission time; determining a function relation of the temperature of the circuit board changing along with time when the radio frequency module transmits a wireless signal of any frequency band based on the temperature change data, wherein the function relation comprises the temperature change rate of the circuit board in a preset continuous time interval; and determining the temperature change rate of the circuit board corresponding to the initial temperature based on the frequency band and the corresponding relation of the wireless signal currently transmitted by the radio frequency module.
In some embodiments, the temperature control module 403 in fig. 4 obtains a preset operating temperature of the current operating frequency of the radio frequency module; determining an energy compensation strategy for the circuit board to reach a preset working temperature from an initial temperature based on the temperature change rate; based on the energy compensation strategy, the temperature control element preset on the circuit board is controlled to generate corresponding compensation energy, so that the working temperature of the circuit board is kept in a preset range, and the preset range comprises the preset working temperature.
In some embodiments, the circuit board temperature regulating device in fig. 4 includes: a policy generation module 404 configured to compare a difference between an initial temperature of the circuit board at the current operating frequency of the radio frequency module and a preset operating temperature; under the condition that the difference value is positive, generating an energy compensation strategy for reducing the temperature of the circuit board; and under the condition that the difference value is negative, determining the waiting time of the circuit board reaching the preset working temperature based on the temperature change rate, if the waiting time is greater than or equal to a preset time threshold, generating an energy compensation strategy for increasing the temperature of the circuit board, and if the waiting time is less than the preset time threshold, generating an energy compensation strategy for prolonging the working time of the current working frequency of the radio frequency module, wherein the prolonged time is equal to the waiting time.
In some embodiments, the circuit board temperature regulating device in fig. 4 includes: the temperature adjusting module 405 is configured to respond to an energy compensation strategy for reducing the temperature of the circuit board, control a first temperature control element preset on the circuit board to refrigerate to obtain first compensation energy, and control the refrigerating power of the first temperature control element to change in a direct proportion relation with the temperature change rate; and responding to an energy compensation strategy for increasing the temperature of the circuit board, controlling a second temperature control element preset on the circuit board to heat to obtain second compensation energy, and controlling the heating power of the second temperature control element to change in inverse relation with the temperature change rate.
It should be understood that, the sequence numbers of the steps in the foregoing embodiments do not imply an execution sequence, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation on the implementation process of the embodiments of the present disclosure.
Fig. 5 is a schematic diagram of an electronic device 500 provided by an embodiment of the disclosure. As shown in fig. 5, the electronic apparatus 500 of this embodiment may include the temperature sensors 2 and 3, the temperature control elements 4 and 5, the power supply 7 in fig. 1, and further include: a processor 501, a memory 502 and a computer program 503 stored in the memory 502 and operable on the processor 501. The steps in the various method embodiments described above are implemented when the processor 501 executes the computer program 503. Alternatively, the processor 501 implements the functions of the respective modules/units in the above-described respective apparatus embodiments when executing the computer program 503.
Illustratively, the computer program 503 may be partitioned into one or more modules/units, which are stored in the memory 502 and executed by the processor 501 to accomplish the present disclosure. One or more modules/units may be a series of computer program instruction segments capable of performing specific functions, which are used to describe the execution of the computer program 503 in the electronic device 500.
The electronic device 500 may be a desktop computer, a notebook, a palm computer, a cloud server, or other electronic devices. The electronic device 500 may include, but is not limited to, a processor 501 and a memory 502. Those skilled in the art will appreciate that fig. 5 is merely an example of an electronic device 500 and does not constitute a limitation of electronic device 500 and may include more or fewer components than shown, or some components may be combined, or different components, e.g., an electronic device may also include input-output devices, network access devices, buses, etc.
The Processor 501 may be a Central Processing Unit (CPU), other general purpose Processor, a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), a Field Programmable Gate Array (FPGA) or other Programmable logic device, discrete Gate or transistor logic device, discrete hardware component, or the like. A general purpose processor may be a microprocessor or the processor may be any conventional processor or the like.
The storage 502 may be an internal storage unit of the electronic device 500, such as a hard disk or a memory of the electronic device 500. The memory 502 may also be an external storage device of the electronic device 500, such as a plug-in hard disk, a Smart Media Card (SMC), a Secure Digital (SD) Card, a Flash memory Card (Flash Card), and the like provided on the electronic device 500. Further, the memory 502 may also include both internal storage units and external storage devices of the electronic device 500. The memory 502 is used for storing computer programs and other programs and data required by the electronic device. The memory 502 may also be used to temporarily store data that has been output or is to be output.
It will be apparent to those skilled in the art that, for convenience and brevity of description, only the above-mentioned division of the functional units and modules is illustrated, and in practical applications, the above-mentioned function distribution may be performed by different functional units and modules according to needs, that is, the internal structure of the apparatus is divided into different functional units or modules, so as to perform all or part of the functions described above. Each functional unit and module in the embodiments may be integrated in one processing unit, or each unit may exist alone physically, or two or more units are integrated in one unit, and the integrated unit may be implemented in a form of hardware, or in a form of software functional unit. In addition, specific names of the functional units and modules are only for convenience of distinguishing from each other, and are not used for limiting the protection scope of the present application. The specific working processes of the units and modules in the system may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again.
In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and reference may be made to the related descriptions of other embodiments for parts that are not described or illustrated in a certain embodiment.
Those of ordinary skill in the art will appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present disclosure.
In the embodiments provided in the present disclosure, it should be understood that the disclosed apparatus/electronic device and method may be implemented in other ways. For example, the above-described apparatus/electronic device embodiments are merely illustrative, and for example, a module or a unit may be divided into only one logical function, and may be implemented in other ways, and multiple units or components may be combined or integrated into another system, or some features may be omitted or not implemented. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may be in an electrical, mechanical or other form.
Units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
In addition, functional units in the embodiments of the present disclosure may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit. The integrated unit can be realized in a form of hardware, and can also be realized in a form of a software functional unit.
The integrated modules/units, if implemented in the form of software functional units and sold or used as separate products, may be stored in a computer readable storage medium. Based on such understanding, the present disclosure may implement all or part of the flow of the method in the above embodiments, and may also be implemented by a computer program to instruct related hardware, where the computer program may be stored in a computer readable storage medium, and when the computer program is executed by a processor, the computer program may implement the steps of the above methods and embodiments. The computer program may comprise computer program code, which may be in the form of source code, object code, an executable file or some intermediate form, etc. The computer readable medium may include: any entity or device capable of carrying computer program code, recording medium, usb disk, removable hard disk, magnetic disk, optical disk, computer Memory, Read-Only Memory (ROM), Random Access Memory (RAM), electrical carrier wave signals, telecommunications signals, software distribution medium, and the like. It should be noted that the computer readable medium may contain suitable additions or additions that may be required in accordance with legislative and patent practices within the jurisdiction, for example, in some jurisdictions, computer readable media may not include electrical carrier signals or telecommunications signals in accordance with legislative and patent practices.
The above examples are only intended to illustrate the technical solutions of the present disclosure, not to limit them; although the present disclosure has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present disclosure, and are intended to be included within the scope of the present disclosure.
Claims (10)
1. A circuit board temperature adjusting method is applied to a wireless measuring instrument provided with a radio frequency module, and is characterized by comprising the following steps:
monitoring the working frequency of a radio frequency module in the process of starting a wireless measuring instrument to perform wireless testing, when the working frequency is changed, acquiring the current temperature corresponding to the changed current working frequency, and taking the current temperature as the initial temperature under the current working frequency;
determining a rate of temperature change over a preset continuous time interval based on the starting temperature;
and controlling a temperature control element preset on a circuit board corresponding to the radio frequency module to regulate the temperature of the circuit board based on the temperature change rate, so that the temperature of the circuit board is kept in a preset range.
2. The method according to claim 1, wherein the monitoring the operating frequency of the rf module, and when the operating frequency is changed, acquiring a current temperature corresponding to the changed current operating frequency, and taking the current temperature as an initial temperature at the current operating frequency comprises:
acquiring the working frequency of a radio frequency module, wherein the working frequency comprises the frequency band of a radio frequency module for transmitting a wireless signal;
monitoring the frequency band of the wireless signal transmitted by the radio frequency module, and acquiring the temperature value of each position point based on temperature sensors preset on different position points of a circuit board where the radio frequency module is positioned when the frequency band of the wireless signal currently transmitted by the radio frequency module is changed;
and calculating the weighted sum of each temperature value and the corresponding preset temperature weight based on the preset temperature weight of the temperature sensor at each position point, and taking the weighted sum as the changed initial temperature for transmitting the wireless signal of the current frequency band.
3. The method according to claim 2, wherein the obtaining the temperature value of each position point based on temperature sensors preset at different position points of a circuit board where the radio frequency module is located comprises:
acquiring a first temperature value of a central position point of the circuit board based on a first temperature sensor preset on the central position point;
and acquiring a second temperature value of each edge position point based on second temperature sensors preset on a plurality of edge position points of the circuit board, wherein the distances between the first temperature sensors and the second temperature sensors are equal.
4. The method of claim 1, wherein determining a rate of temperature change over a preset continuous time interval based on the starting temperature comprises:
the method comprises the steps that wireless signals of the same frequency band are transmitted from circuit boards with different temperatures based on a radio frequency module, temperature change data of the circuit boards in the same transmission time are obtained, and the temperature change data comprise temperature values of the circuit boards in the transmission time at each time;
determining a functional relation of the temperature of the circuit board changing along with time when the radio frequency module transmits a wireless signal of any frequency band based on the temperature change data, wherein the functional relation comprises the temperature change rate of the circuit board in a preset continuous time interval;
and determining the temperature change rate of the circuit board corresponding to the starting temperature based on the frequency band of the wireless signal currently transmitted by the radio frequency module and the corresponding relation.
5. The method of claim 1, wherein the controlling a temperature control element preset on a circuit board corresponding to the rf module to adjust the temperature of the circuit board based on the temperature change rate to keep the temperature of the circuit board within a preset range comprises:
acquiring a preset working temperature of the current working frequency of the radio frequency module;
determining an energy compensation strategy for the circuit board to reach the preset working temperature from the starting temperature based on the temperature change rate;
and controlling a temperature control element preset on the circuit board to generate corresponding compensation energy based on the energy compensation strategy, so that the working temperature of the circuit board is kept in a preset range, and the preset range comprises the preset working temperature.
6. The method of claim 5, wherein determining an energy compensation strategy for the circuit board to reach the preset operating temperature from the starting temperature based on the rate of temperature change comprises:
comparing the difference value between the initial temperature of the circuit board of the current working frequency of the radio frequency module and the preset working temperature;
generating an energy compensation strategy for reducing the temperature of the circuit board under the condition that the difference value is positive;
and under the condition that the difference value is negative, determining the waiting time of the circuit board reaching the preset working temperature based on the temperature change rate, if the waiting time is greater than or equal to a preset time threshold, generating an energy compensation strategy for increasing the temperature of the circuit board, and if the waiting time is less than the preset time threshold, generating an energy compensation strategy for prolonging the working time of the current working frequency of the radio frequency module, wherein the prolonged time is equal to the waiting time.
7. The method of claim 6, wherein the controlling a temperature control element preset on the circuit board to generate corresponding compensation energy based on the energy compensation strategy so that the operating temperature of the circuit board is kept within a preset range comprises:
responding to an energy compensation strategy for reducing the temperature of the circuit board, controlling a first temperature control element preset on the circuit board to refrigerate to obtain first compensation energy, and controlling the refrigerating power of the first temperature control element to change in a direct proportion relation with the temperature change rate;
and responding to an energy compensation strategy for improving the temperature of the circuit board, controlling a second temperature control element preset on the circuit board to heat to obtain second compensation energy, and controlling the heating power of the second temperature control element to change in an inverse relation with the temperature change rate.
8. The utility model provides a circuit board temperature regulation apparatus, is applied to in the wireless measuring instrument that is equipped with the radio frequency module, its characterized in that, circuit board temperature regulation apparatus includes:
the temperature acquisition module is configured to monitor the working frequency of the radio frequency module in the process of starting the wireless measurement instrument to perform wireless test, acquire the current temperature corresponding to the changed current working frequency when the working frequency is changed, and take the current temperature as the initial temperature under the current working frequency;
a change determination module configured to determine a rate of change of temperature over a preset continuous time interval based on the starting temperature;
and the temperature control module is configured to control a temperature control element which is preset on a circuit board corresponding to the radio frequency module to regulate the temperature of the circuit board based on the temperature change rate, so that the temperature of the circuit board is kept in a preset range.
9. An electronic device comprising a memory, a processor and a computer program stored in the memory and executable on the processor, characterized in that the processor implements the steps of the method according to any of claims 1 to 7 when executing the computer program.
10. A computer-readable storage medium, in which a computer program is stored which, when being executed by a processor, carries out the steps of the method according to any one of claims 1 to 7.
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