CN114161327A - Diamond particles and method for producing same - Google Patents
Diamond particles and method for producing same Download PDFInfo
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- CN114161327A CN114161327A CN202010947707.9A CN202010947707A CN114161327A CN 114161327 A CN114161327 A CN 114161327A CN 202010947707 A CN202010947707 A CN 202010947707A CN 114161327 A CN114161327 A CN 114161327A
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- diamond
- cutting
- diamond particles
- particles
- powder mixture
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
Abstract
The present invention provides a diamond particle and a method for manufacturing the same, and more particularly, to a method for manufacturing a diamond particle for polishing having at least four surfaces with different directions. The method comprises the following steps: (A) preparing a cylindrical mold having a cylindrical mold hole; (B) placing a diamond powder mixture into the die hole; (C) clamping the cylindrical die by using a press machine, and pressing the diamond powder mixture in the die hole of the die at high temperature and high pressure for sintering to synthesize a cylindrical diamond composite sheet corresponding to the shape of the cylindrical die hole; (D) and cutting the diamond composite sheet by laser to obtain tetrahedral diamond particles with uniform size, shape and thickness. During cutting, the diamond particles are cut by 120-degree cutting with 120-degree laser, and rotating 120 degrees to cut another surface every time one surface is cut, preferably based on the desired tetrahedral profile of the diamond particles.
Description
Technical Field
The present invention relates to a diamond particle for polishing that can be applied to a tool such as a grinding wheel and a method for producing the diamond particle, and more particularly to a diamond particle having a surface with at least four different directions and a method for producing the diamond particle.
Background
As shown in the photograph of FIG. 1, the prior art artificial diamond particles, which do not have a specific shape, mostly have problems of insufficient gripping force or insufficient cutting force when they are adhered to the body of the grinding wheel. The main reasons for these problems are: diamond particles are self-rounded and their surfaces do not provide multiple cutting directions, when adhered to a grinding wheel matrix, they only expose rounded corners, lack sharp corners that can be cut, and can face poor machinability when forced in one direction.
The current solution to the problem of holding the artificial diamond particles in the grinding wheel matrix is to coat the outer layer of the diamond with metal, as shown in the photograph of fig. 2. This added metal layer increases the surface area available for anchoring the diamond to the matrix, thereby increasing grip. However, with the increasing awareness of environmental protection, the cost of wastewater treatment for electroplating is increased, and with the technological progress, some processes, such as parts of 5G mobile phones, cannot have metal residues. Therefore, the use of a metal layer on synthetic diamond should be avoided. In order to provide the artificial diamond with enough grip to be fixed on the grinding wheel matrix, other fixing structures are necessary.
Fig. 3 is a photograph showing a structure for providing an improved cutting force with respect to the prior art artificial diamond. In order to increase the exposure opportunity of the diamond cutting tip and provide a good cutting force, the prior art uses a predetermined arrangement of diamonds to improve the cutting force. However, this method is time consuming and laborious and there is a certain chance that the diamond tip angle is not facing upwards.
In addition, there is a method for increasing the cutting force by using Chemical Vapor Deposition (CVD) to fabricate the cutting tip, but this method is very expensive and time-consuming.
Based on the above-mentioned bottleneck of the prior art, there is a need for an artificial diamond grain structure for fixing to the body of a grinding wheel and a method for manufacturing the same, which has better gripping power without the need of a metal layer, and which is inexpensive to manufacture and provides better cutting power than the prior art without the high cost of the cvd process.
Disclosure of Invention
To solve the above problems, the present invention provides a method according to which diamond particles having a specific shape and structure can be easily manufactured. These diamond particles provide an artificial diamond structure with more cutting points (cusps). More particularly, the method of the present invention produces artificial diamond particles having at least four differently oriented surfaces defining a plurality of cutting tips.
In one aspect of the present invention, there is provided a method of producing abrasive diamond particles having at least four surfaces with different orientations, the method comprising the steps of:
(1) preparing a cylindrical die with a cylindrical die hole;
(2) placing a diamond powder mixture into the die hole;
(3) clamping the cylindrical die by using a press machine, and pressing the diamond powder mixture in the die hole of the die at high temperature and high pressure for sintering to synthesize a cylindrical diamond compact corresponding to the shape of the cylindrical die hole;
(4) and cutting the diamond composite sheet by laser to obtain tetrahedral diamond particles with uniform size, shape and thickness.
Preferably, the cutting step of step (4) is completed by the following steps: based on the tetrahedral outline of the diamond particles, 120-degree cutting with three-time co-rotation is completed in a mode of cutting one surface by 120 degrees and then cutting the other surface by 120 degrees after each cutting is completed, so as to cut out the tetrahedral diamond particles with uniform size, shape and thickness.
The invention also provides diamond particles having at least four surfaces of different orientations produced according to the above method.
Further, the present invention provides a method for producing abrasive diamond particles having at least four surfaces with different directions, the method comprising the steps of:
(1) preparing a mould, wherein the mould is provided with a plurality of mould holes, the shape of the mould holes corresponds to the shape of the diamond particles and is a pyramid;
(2) filling a diamond powder mixture into the die hole;
(3) and clamping the die by using a press machine, and pressing the diamond powder mixture in the die hole of the die at high temperature and high pressure to sinter the diamond powder mixture so as to synthesize diamond particles with the shape of the die hole.
Wherein step (2) further comprises placing a single crystal diamond particle in the center of the diamond powder mixture.
The invention also provides diamond particles having at least four surfaces of different orientations produced according to the above method.
In another aspect, the present invention provides a diamond particle having at least four surfaces oriented in different directions, comprising: a cutting portion body in the form of a pyramid having four differently oriented surfaces, each surface having a plurality of edges and a cutting tip formed by the intersection of adjacent edges of the differently oriented surfaces; a single crystal diamond centered on said diamond particle.
In a further aspect, the present invention provides a diamond particle having at least four surfaces with different orientations, comprising: a core portion having a plurality of core surfaces, the core portion being substantially polyhedral; and a plurality of cutting portions, wherein each cutting portion of the plurality of cutting portions extends from one of a plurality of core surfaces of the core portion, wherein each cutting portion has at least four surfaces in different directions, and wherein each surface of the at least four surfaces in different directions has edges and cutting tips formed by intersections of adjacent edges of the surfaces.
Preferably, a base of at least one of the cutting portions is smaller than a corresponding surface of the core portion to expose a circumferential band.
Preferably, wherein the core is a cube.
In yet another aspect, the present invention provides a method of making an abrasive diamond particle having at least four surfaces with different orientations, the diamond particle comprising: a core portion having a plurality of core surfaces and being substantially polygonal; and a plurality of cutting portions, wherein each cutting portion of the plurality of cutting portions extends from one of a plurality of core surfaces of the core portion, wherein each cutting portion has at least four surfaces with different directions. The method comprises the following steps:
(1) preparing a die, wherein the die comprises an upper die with an upper die hole and a lower die with a lower die hole, and the shapes of the upper die hole and the lower die hole respectively correspond to the upper half shape and the lower half shape of the diamond particles;
(2) filling a diamond powder mixture into the die hole;
(3) the mold is held by a press to sinter the diamond powder mixture in the pores of the mold by high-temperature and high-pressure pressing to synthesize diamond particles.
Preferably, step (2) further comprises placing a single crystal diamond in the center of the diamond powder mixture.
Preferably, a bottom of at least one cutting portion is smaller than a corresponding surface of the core portion to expose a perimeter band, and wherein the core portion is cubic.
The preferred choice of synthetic Diamond material for the cutting abrasive of the present invention is Polycrystalline Diamond (PCD). Polycrystalline diamond has the advantages of good thermal conductivity, high hardness, good wear resistance, and high machining precision and efficiency during cutting, so that polycrystalline diamond can be used as diamond particles on a grinding wheel to obtain good efficiency. When the artificial diamond is manufactured, the required powder material is placed in a mould and pressed at high temperature and high pressure to form the artificial diamond. A composite material of Polycrystalline Diamond (or "PCD") is prepared through mixing Silicon powder with Diamond micropowder, loading it in mould, and high-temp and-pressure pressing.
According to a first embodiment of the present invention, the diamond particles are structured to have at least four surfaces with different orientations to form a pyramid, frustum, or other polyhedral shaped segment with more surfaces, wherein each surface of the diamond particle has edges and a cutting tip formed by the intersection of adjacent edges of the differently oriented surfaces.
According to another embodiment of the present invention, the diamond particles comprise: the cutting device comprises a polygonal core part with a plurality of surfaces and a plurality of cutting parts extending from at least one surface of the surfaces of the core part, wherein each cutting part is provided with at least four surfaces with different directions to form a pyramid, a truncated cone or other polyhedral shapes with more surfaces, each surface of each cutting part is provided with a plurality of edges, and a cutting tip is formed by the intersection of the adjacent edges of the surfaces with different directions. According to a preferred embodiment, the core of the diamond particle with the above structure is a polyhedron, such as a cube, so that the overall shape of the diamond particle has an extended profile similar to a wave-absorbing block.
According to a preferred embodiment of the present invention, the diamond particles used as the cutting abrasive are centered on a component of a diamond anvil (reverse anvil) that provides a counter force, preferably a single crystal diamond particle. The diamond anvil is placed into the diamond grains prior to pressing the diamond grains.
The invention has the following advantages: generally crystalline bonding has directionality problems, but diamond particles of the present invention can be grown on the wheel at any location.
The invention has another excellent technical effect that: in the manufacture of diamond particles according to the method of the present invention, diamond can be implanted into a shaped mold by a technique of pressing a diamond sheet, and the resulting diamond particles are obtained under high temperature and high pressure.
The diamond particles provided according to the present invention also have the following advantages: the increase in cutting surface area, the ease of securing the point (cutting tip) on the diamond to the wheel, and the lower cost.
The foregoing and other advantages of the invention will be further understood from the following description of embodiments.
Drawings
FIG. 1 is a photograph of a prior art example of a diamond particle.
FIG. 2 is a photograph of another prior art example of diamond particles, showing diamond coated with a metal layer to increase the surface area of the diamond.
FIG. 3 is a photograph of yet another prior art example of diamond particles showing a plurality of diamonds having a predetermined arrangement to improve the cutting force of the diamonds on the grinding wheel.
FIG. 4A is a schematic view of a first embodiment of the diamond particle of the present invention.
FIG. 4B shows a preferred embodiment of the diamond particle of FIG. 4A, wherein a single crystal diamond particle is placed in the center of the diamond particle as the anvil.
Fig. 5A and 5B are schematic views of a mold for producing diamond particles by pressing.
Fig. 6A and 6B are schematic diagrams of diamond compacts used in the manufacture of diamond particles by laser cutting.
FIG. 7 is a schematic view of another embodiment of the diamond particle of the present invention.
Fig. 8A to 8E are graphs comparing diamond particles having a pyramidal (tetrahedral) shape (fig. 8A) with other diamond particles having other shapes (fig. 8B to 8E) according to the present invention.
Detailed Description
Diamond particle shape structure in pyramoid:
according to one embodiment of the present invention, a diamond particle (10) for use in a cutting tool, such as a grinding wheel, to provide grinding functionality includes a cutting portion body having an angled cone shape with at least four differently oriented surfaces 12, wherein each surface 12 has edges 14 and a cutting tip 16 formed by the intersection of adjacent edges of the differently oriented surfaces. Fig. 4A discloses an embodiment of a pyramidal diamond particle 10 as a triangular abrasive having a tetrahedron-shaped appearance, however, the diamond particle 10 may also be a truncated pyramid having a cross-section according to the spirit of the present invention. According to the preferred embodiment as shown in FIG. 4B, a single crystal diamond particle may be placed in the center of diamond particle 10 of FIG. 4A as a diamond anvil 18. The diamond anvil 18 is placed into the diamond particle 10 prior to pressing.
The diamond particles 10 are directly pressed by a pressing method:
the pressing method of the present invention is not shown in the drawings, and diamond is preferably synthesized using a hexahedron press, in which a diamond powder mixture is mainly filled in the holes of a mold, and the mold is pressed by the hexahedron press. The diamond powder mixture may be, for example, a silicon polycrystalline diamond composite micropowder comprising a mixture of silicon powder and diamond powder. When the powder is filled (namely, the mixed powder is filled), the large particles are in the middle, the small particles are filled beside the large particles, and the mixed powder is subjected to synthetic pressing, so that the pressed diamond has good density. The mold is preferably circular. A gasket/washer is added outside the die for conducting electricity and transmitting pressure. The mold is placed in a hexahedral press, two of which can be energized, and the other four directions are responsible only for pressurization. When energized, the diamond powder mixture was synthesized in six directions of pressurization using electrical temperature rise. After the high-temperature high-pressure synthesis is finished, the diamond particles synthesized at high temperature and high pressure are obtained. Based on the above, the method of the present invention for producing diamond particles for polishing having at least four surfaces with different directions generally comprises: (1) providing a diamond powder mixture of diamond composite micropowder; (2) providing a mold, preferably circular/cylindrical, having a die hole of a specific shape; (3) placing a diamond powder mixture in the die hole; (4) the diamond powder mixture is sintered at high temperature and high pressure to form a diamond particle. Preferably, step (3) further includes placing a single crystal diamond in the center of the cavity during the loading step as a diamond anvil 18 that provides opposing forces to the pressing force.
Fig. 5A and 5B are schematic diagrams of a mold for producing diamond particles 10 by pressing. The diamond particles 10 of fig. 4A and the diamond particles 10 of fig. 4B having diamond anvils 18 can be produced through the mold and by pressing.
The steps for producing the diamond particle 10 of fig. 4A according to the aforementioned pressing method of the present invention include: (A) preparing a preferably circular mold 100 having a plurality of cavities 102, each cavity 102 having a shape corresponding to the shape of the diamond particle 10 and being pyramid/tetrahedron; (B) filling the diamond powder mixture into the die holes 102; (C) the mold 100 is held using a press to sinter the diamond powder mixture in the cavities 102 of the mold 100 by high pressure and high temperature pressing to synthesize diamond particles 10 of fig. 4A. Because the section is triangular, the grinding material is triangular in appearance.
In order to form the diamond particle 10 having an inverted diamond anvil 18 as shown in fig. 4B, the single crystal diamond particle as the diamond anvil 18 is put into the center of the diamond powder mixture before the pressing step (C) in the powder filling step of (B), and then the high temperature and high pressure pressing of step (C) is performed to sinter the diamond particle 10 having the triangular abrasive of the diamond anvil 18 as shown in fig. 4B. In detail, the method comprises the following steps: (A) preparing a preferably circular mold 100 having a plurality of cavities 102, the cavities 102 having a shape corresponding to the shape of the diamond particles 10 and being pyramid/tetrahedron; (B) filling a diamond powder mixture into the plurality of die holes 102, wherein the single crystal diamond particles as the diamond anvil 18 are placed in the center of the diamond powder mixture; (C) the mold 100 is held using a press to sinter the diamond powder mixture in the cavities 102 of the mold 100 by high pressure and high temperature pressing to synthesize (synthesize) the diamond particles 10 of fig. 4B.
The present invention is directed to providing another diamond particle (i.e., a "diamond anvil 18") in the middle of the diamond particle 10 to improve the structural density of the diamond particle 10 resulting from the pressing process to obtain a diamond particle 10 with a higher density. In detail, if a single crystal diamond is placed as the diamond anvil 18 in the middle of the diamond particle 10, when the outer press starts to press the diamond powder mixture in the pressing step, the diamond anvil 18 in the center provides a reaction force to the pressure applied by the press and presses back in the opposite direction; furthermore, the contacting portion of the opposing diamond anvil 18 is also uniformly compressed, thereby producing diamond particles 10 with a better structural density. In contrast, in the absence of a reverse diamond anvil, when the press starts to press the diamond powder mixture, the center of the diamond powder mixture is balanced by the upper and lower pressures, the middle pressure is zero, and the force is relatively poor, so that the density of the center structure of the formed diamond particles is poor. Therefore, due to the present invention of placing a single crystal diamond as a diamond anvil (reverse anvil) providing a reverse force in the center of the diamond powder mixture, the structure of the formed diamond particle 10 greatly improves the center of the diamond powder mixture from being poorly pressed, resulting in a better structural density of the diamond particle 10. In FIG. 4B, it can be seen that the single crystal diamond is a whole diamond, which has a larger volume than the diamond powder particles.
Diamond compacts (PCD) are manufactured by a pressing method, and then diamond particles 10 are cut out by a laser:
fig. 6A and 6B are a photograph and a schematic view, respectively, of a diamond compact (PCD)60 for producing diamond particles 10 by laser cutting, which is cylindrical.
According to the pressing method disclosed in the present invention, in order to manufacture the diamond compact (PCD)60, the pressing method comprises the steps of: (A) preparing a cylindrical die with a cylindrical die hole; (B) placing a diamond powder mixture into the die hole; (C) the cylindrical mold is held by a press to sinter the diamond powder mixture in the cavity of the mold by high pressure and high temperature pressing, so as to synthesize a cylindrical diamond compact 60 corresponding to the shape of the cylindrical cavity. Then, cutting is carried out, including: (D) the diamond composite sheet (60) is laser cut to cut tetrahedral diamond particles (in the form of triangular particles) 10 having a uniform size, shape and thickness as an abrasive. In order to surely cut the tetrahedral diamond particles 10 with uniform size, shape and thickness, a preferred cutting manner in step (D) is to perform laser cutting at 120 degrees based on the desired tetrahedral profile of the diamond particles 10; that is, after each cutting, the diamond grains are cut by 120-degree rotation and three-time 120-degree rotation. Thus, the diamond particle grinding material with triangular particle tetrahedron with uniform size, shape and thickness can be obtained.
The diamond powder mixture used in the above process may include a large particle diamond (e.g., nitrogen-containing diamond) and a small particle diamond (e.g., boron-containing diamond) in a fine powder form. When the diamond powder mixture is filled into the die hole of the cylindrical die, large diamond particles are filled in the middle, and small diamond particles (fine diamond particles) are filled beside, so that the diamonds are tightly packed together to sinter a better diamond structure.
Diamond particles having a pyramid-shaped cutting part and a method for producing the same:
as shown in FIG. 7, according to another embodiment of the present invention, diamond particle 20 comprises: a core portion 21, the core portion 21 being substantially polygonal and having a plurality of core surfaces; and a plurality of cutting portions, wherein each cutting portion of the plurality of cutting portions extends from one of the plurality of core surfaces of the core portion 21, wherein each cutting portion has at least four surfaces 22 with different directions to form a pyramid, a truncated cone, or other polygonal shapes with more surfaces. Wherein each surface 22 has edges 27 and cutting tips 28 formed by the intersection of adjacent edges of the differently oriented surfaces. FIGS. 4A and 4B show diamond particle 10 as a single segment; the embodiment of fig. 7 is mainly configured with the core 21 to accommodate more cutting portions for better performance, and the principle of each cutting portion is substantially the same as that of fig. 4A and 4B. In the embodiment of fig. 7, the base of the cutting portion is smaller than a corresponding surface 22 of the core 21, exposing a circumferential band. In the preferred embodiment of fig. 7, the core 21 of the diamond particle 20 with the above-mentioned structure is a polyhedron, such as a cube, so that the overall shape of the diamond particle has an extended profile similar to that of a wave-absorbing block. Each cutting portion may be a truncated cone having a cross-sectional plane.
The diamond particles 10, 20 having the shape of the present invention may be sintered or electroplated (nickel-plated) to secure the diamond particles to the grinding wheel. Because of the particular shape of the diamond particles 10, 20 themselves, they have a relatively good anchoring force. Because the fixed shapes with different directions are more complex, and compared with the prior art, the diamond particles have larger fixed surface area to be attached to the grinding wheel matrix, and have better fixing force compared with the prior art.
Fig. 8A to 8E are diagrams comparing diamond particles of the pyramid (tetrahedron) configuration described above (fig. 8A) with diamond particles of other shapes (fig. 8B to 8E) according to the present invention. It will be appreciated that the pyramids of the present invention have the fewest sharp corners and edges among the different shapes, and are the sharpest abrasive in physical configuration. In addition, the diamond particles produced by the method of the present invention have the advantage of controllable tip design, and when the diamond particles are placed on the grinding wheel, the sharp corners (i.e., cutting tips) of the diamond particles are always facing upwards, so that the grinding wheel has excellent cutting force.
The foregoing description of the preferred embodiments of the present invention is merely exemplary in nature and is in no way intended to limit the invention. All such modifications and variations are intended to be included herein within the scope of this disclosure and the present invention.
Claims (3)
1. A method of making abrasive diamond particles having at least four surfaces with different orientations, comprising the steps of:
(1) preparing a cylindrical die with a cylindrical die hole;
(2) placing a diamond powder mixture into the die hole;
(3) clamping the cylindrical die by using a press machine, and pressing the diamond powder mixture in the die hole of the die at high temperature and high pressure for sintering to synthesize a cylindrical diamond compact corresponding to the shape of the cylindrical die hole;
(4) and cutting the diamond composite sheet by laser to obtain tetrahedral diamond particles with uniform size, shape and thickness.
2. The method of claim 1, wherein the step of cutting in step (4) is performed by: based on the tetrahedral outline of the diamond particles, 120-degree cutting with three-time co-rotation is completed in a mode of cutting one surface by 120 degrees and then cutting the other surface by 120 degrees after each cutting is completed, so as to cut out the tetrahedral diamond particles with uniform size, shape and thickness.
3. A diamond particle having at least four surfaces of different orientations made according to the method of claim 1 or 2.
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| CN202010947707.9A CN114161327A (en) | 2020-09-10 | 2020-09-10 | Diamond particles and method for producing same |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010947707.9A CN114161327A (en) | 2020-09-10 | 2020-09-10 | Diamond particles and method for producing same |
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| JPH10183204A (en) * | 1996-12-25 | 1998-07-14 | Hiroshi Nakazawa | Rp with powdery material applying sintering and manufacturing device therefor |
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| CN102586641A (en) * | 2012-03-30 | 2012-07-18 | 北京科技大学 | Method for preparing high-heat-conductivity diamond copper-base composite material through super-high-pressure sintering |
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Application publication date: 20220311 |